Method for vertical calibration of a lithography system, storage medium and lithography system

By employing high-precision vertical calibration methods and automated processes, the calibration accuracy and anti-interference issues of the focusing and leveling system of the lithography machine were resolved, achieving high-precision imaging and long-term stability of the lithography machine and improving the yield of finished wafers.

CN122151452BActive Publication Date: 2026-07-10BEIJING IC-EAST SEMICONDUCTOR TECHNOLOGY CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
BEIJING IC-EAST SEMICONDUCTOR TECHNOLOGY CO LTD
Filing Date
2026-05-09
Publication Date
2026-07-10

AI Technical Summary

Technical Problem

The existing focusing and leveling systems of lithography machines are inadequate in terms of calibration accuracy, repeatability, and anti-interference capabilities, resulting in low imaging accuracy and affecting the yield of finished wafers.

Method used

A high-precision, automated vertical calibration method is adopted. Through a closed-loop process of zero-position alignment, precise origin positioning, calibration relationship establishment, and iterative compensation verification, combined with ultra-flat wafers and symmetrical point differential calculation, the precise positioning and error isolation of the workpiece stage motion state are achieved.

Benefits of technology

This improves the imaging accuracy and long-term stability of the lithography machine, ensures the quality of the exposed pattern, enhances the automation and anti-interference capabilities of the calibration process, and reduces the uncertainty caused by human intervention.

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Abstract

This application discloses a vertical calibration method for a lithography machine system, a storage medium, and the lithography machine system itself. The method includes: initializing the focusing and leveling subsystem; controlling the workpiece stage to move in opposite horizontal directions to make the central peak of the central measurement spot essentially disappear, thereby determining two critical positions, and then calculating and accurately locating the calibration origin. At the calibration origin, controlling the workpiece stage to perform movement and recording changes in the spot measurement value establishes a calibration relationship between the spot measurement value and the vertical displacement of the workpiece stage. Starting from the calibration origin, controlling the workpiece stage to move along a preset path to multiple symmetrically distributed measurement points, and collecting the spot measurement value at each point. Based on these measurement values, calculating the measurement change of the wafer in two orthogonal directions, and using the aforementioned calibration relationship to convert it into a change in the workpiece stage height, thereby calculating the tilt of the workpiece stage and driving the adjustment motor for compensation, thus achieving high-precision calibration of the workpiece stage.
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