Terminal cassette device temperature uniformity evaluation method, device, equipment and medium

Abstract

The application is suitable for the technical field of electronic equipment heat dissipation, and discloses a terminal box type equipment temperature uniformity evaluation method, device, equipment and medium, which comprises the following steps: determining a temperature uniformity evaluation area of a terminal box type equipment based on the structure and heat dissipation mode of the terminal box type equipment, including a first evaluation area and a second evaluation area; obtaining the average temperature of the first evaluation area and a plurality of corresponding subareas, and calculating a temperature uniformity factor of the first evaluation area; obtaining the highest temperature, the lowest temperature and the average temperature of the second evaluation area, and calculating a temperature uniformity factor of the second evaluation area; and determining an equipment temperature uniformity evaluation result based on the temperature uniformity factor of the first evaluation area and the temperature uniformity factor of the second evaluation area. The scheme of the application can determine the degree of excellence of the equipment heat dissipation scheme, and thus help to improve the heat dissipation utilization rate of the equipment shell and the PCB.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation technology for electronic devices, and in particular to a method, apparatus, device, and medium for evaluating the temperature uniformity of terminal box-type devices. Background Technology

[0002] Currently, terminal box-type devices are trending towards miniaturization and closed-top shells, resulting in continuously increasing power consumption density. This makes heat exchange between terminal box-type devices and the outside world difficult. To evaluate the heat dissipation performance of terminal box-type devices, the usual method is to measure whether the temperature of the internal components exceeds the limit. However, this method is simplistic and cannot effectively assess the quality of the device's own heat dissipation solution. Summary of the Invention

[0003] To address the aforementioned issues, this invention provides a method, apparatus, device, and medium for evaluating the temperature uniformity of terminal box-type devices. By evaluating the temperature uniformity index of terminal box-type devices, the quality of the device's heat dissipation scheme can be determined, thereby helping to improve the heat dissipation utilization rate of the device casing and PCB.

[0004] To achieve the above objectives, the present invention adopts the following technical solution:

[0005] In a first aspect, the present invention provides a method for evaluating the temperature uniformity of a terminal box-type device, comprising:

[0006] Based on the structure and heat dissipation method of the terminal box device, the temperature uniformity evaluation area of ​​the terminal box device is determined. The temperature uniformity evaluation area includes a first evaluation area and a second evaluation area.

[0007] The first evaluation region is divided into multiple sub-regions, and the average temperature of the first evaluation region and the average temperature of the corresponding multiple sub-regions are obtained. The temperature uniformity factor of the first evaluation region is then calculated.

[0008] Obtain the highest temperature, lowest temperature, and average temperature of the second evaluation area, and calculate the temperature uniformity factor of the second evaluation area.

[0009] Based on the temperature uniformity factor of the first evaluation area and the temperature uniformity factor of the second evaluation area, the temperature uniformity evaluation result of the terminal box device is determined.

[0010] Furthermore, the first evaluation area is the PCB area of ​​the terminal box device; the second evaluation area is the housing area of ​​the terminal box device.

[0011] Furthermore, the shell region includes: the upper shell region and the lower shell region.

[0012] Furthermore, the upper housing area is the area on the housing surface covered by the PCB and without openings; the lower housing area is the area on the lower housing surface of the terminal box device other than the opening area and / or the fiber coil area, and the opening area and / or the fiber coil area divides the lower housing area into multiple lower housing sub-areas.

[0013] Further, the average temperature of the lower shell region is obtained, including:

[0014] The average temperature of the lower shell region is determined based on the average temperature and area information of multiple lower shell sub-regions.

[0015] Furthermore, the formula for calculating the temperature uniformity factor of the first evaluation region is as follows:

[0016]

[0017] Where F is the temperature uniformity factor of the first evaluation area, n is the number of sub-regions corresponding to the first evaluation area, Tn is the average temperature of each sub-region, and Tb is the average temperature of the first evaluation area.

[0018] Furthermore, the formula for calculating the temperature uniformity factor of the second evaluation region is as follows:

[0019]

[0020] Where Fcase is the temperature uniformity factor of the second evaluation area, Tmax is the highest temperature of the second evaluation area, Tmin is the lowest temperature of the second evaluation area, and Ta is the average temperature of the second evaluation area.

[0021] Further, based on the temperature uniformity factor of the first evaluation region and the temperature uniformity factor of the second evaluation region, the temperature uniformity evaluation result of the terminal box-type device is determined, including:

[0022] The temperature uniformity factors of the first and second evaluation areas of multiple terminal box-type devices are analyzed to determine the temperature uniformity evaluation index.

[0023] Based on the temperature uniformity evaluation index, determine the temperature uniformity evaluation result of the terminal box-type equipment.

[0024] Secondly, the present invention also provides a device for evaluating the temperature uniformity of a terminal box-type device, comprising:

[0025] The first determining module is used to determine the temperature uniformity evaluation area of ​​the terminal box device based on the structure and heat dissipation method of the terminal box device. The temperature uniformity evaluation area includes a first evaluation area and a second evaluation area.

[0026] The first calculation module is used to divide the first evaluation area into multiple sub-regions, obtain the average temperature of the first evaluation area and the average temperature of the corresponding multiple sub-regions, and calculate the temperature uniformity factor of the first evaluation area.

[0027] The second calculation module is used to obtain the highest temperature, lowest temperature, and average temperature of the second evaluation area, and to calculate the temperature uniformity factor of the second evaluation area.

[0028] The second determining module is used to determine the temperature uniformity evaluation result of the terminal box device based on the temperature uniformity factor of the first evaluation area and the temperature uniformity factor of the second evaluation area.

[0029] Thirdly, the present invention also provides an electronic device, comprising: a processor and a memory;

[0030] The processor is coupled with the memory;

[0031] The processor is used to read and execute programs or instructions stored in the memory, causing the device to perform the method as described in the first aspect.

[0032] Fourthly, the present invention also provides a computer-readable storage medium storing a computer program that, when executed by a processor, implements the method as described in the first aspect.

[0033] The technical solution provided by this invention has at least the following technical effects or advantages:

[0034] 1. To intuitively evaluate the heat dissipation scheme of terminal box-type devices from the perspective of temperature uniformity, and to provide a basis for optimizing the selection of heat dissipation schemes for terminal box-type devices;

[0035] 2. Based on the temperature uniformity evaluation index of the terminal box-type equipment, the quality of the equipment heat dissipation scheme can be determined. The lower the temperature uniformity factor value, the higher the heat dissipation utilization rate of the equipment PCB and casing.

[0036] 3. By analyzing the temperature uniformity evaluation index of terminal box equipment, the baseline of the temperature uniformity evaluation index is determined, thereby determining the product qualification rate and improving product competitiveness.

[0037] Other features and advantages of the invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of the invention may be realized and obtained by means of the structures pointed out in the description, claims and drawings. Attached Figure Description

[0038] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0039] Figure 1 This is a flowchart illustrating a method for evaluating the temperature uniformity of a terminal box-type device according to an embodiment of the present invention.

[0040] Figure 2 This is a schematic diagram of the heat dissipation method of the terminal box device in an embodiment of the present invention;

[0041] Figure 3 This is a thermal simulation temperature cloud map showing the PCB area divided into 9 regions in this embodiment of the invention.

[0042] Figure 4 This is a thermal simulation temperature cloud diagram of the upper shell of the device in an embodiment of the present invention;

[0043] Figure 5 This is a schematic thermal simulation temperature cloud diagram of the lower shell of the device in an embodiment of the present invention;

[0044] Figure 6 This is a schematic diagram of a terminal box-type device temperature uniformity evaluation device provided in an embodiment of the present invention;

[0045] Figure 7 This is a schematic diagram of the structure of an electronic device provided in an embodiment of the present invention. Detailed Implementation

[0046] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0047] Figure 1 As shown in the figure, a method for evaluating the temperature uniformity of a terminal box-type device is provided in an embodiment of the present invention. The method includes:

[0048] S101. Based on the structure and heat dissipation method of the terminal box device, determine the temperature uniformity evaluation area of ​​the terminal box device. The temperature uniformity evaluation area includes a first evaluation area and a second evaluation area.

[0049] The terminal box-type device structure includes a housing and a PCB. During actual operation, the heat generated by the device is dissipated through various methods, including: PCB heat conduction to diffuse the temperature of each component, thermal radiation, heat convection between the device and the air inside the housing, and heat exchange between the housing surface and the external air (e.g., heat transfer through convection). Figure 2 Multiple heat dissipation methods can lead to inconsistent temperatures in different areas of the terminal box device. To evaluate the temperature uniformity of the terminal box device, an evaluation area needs to be selected. From an overall perspective, the PCB can also be considered as a heat source for the terminal box device; therefore, the PCB area of ​​the terminal box device is designated as the primary evaluation area.

[0050] The shell wall thickness region at the edge of the shell has a certain distance. This region does not cover the PCB area and does not participate in heat dissipation on the shell surface. Therefore, the shell wall thickness region at the edge of the shell is not considered as the evaluation area.

[0051] The housing of the terminal box device includes an upper shell and a lower shell. If there are no openings on the upper shell, the area of ​​the upper shell surface covering the PCB is determined as the upper shell area to be evaluated.

[0052] The primary heat exchange mechanism in the perforated area of ​​the shell is thermal convection, which is greatly affected by air convection. The proportion of heat dissipation through conduction is small, and the shell temperature uniformity calculation does not consider the perforated area. The fiber coil area of ​​the shell is a non-accessible region, and its temperature uniformity calculation also does not consider this area.

[0053] If the lower shell has openings and / or fiber coils, then the area on the lower shell surface other than the area with openings and / or fiber coils will be defined as the lower shell area to be evaluated. Because the lower shell has openings and / or fiber coils, the opening areas and / or fiber coil areas will divide the lower shell area into multiple lower shell sub-regions.

[0054] The upper and lower casing areas of the terminal box device are designated as the second evaluation area.

[0055] S102. Divide the first evaluation area into multiple sub-regions, obtain the average temperature of the first evaluation area and the average temperature of the corresponding multiple sub-regions, and calculate the temperature uniformity factor of the first evaluation area.

[0056] Finite element modeling software was used to establish a corresponding thermal simulation finite element model based on the terminal box device. The first evaluation region was divided into multiple sub-regions. The average temperature of the first evaluation region and the average temperatures of the corresponding multiple sub-regions were obtained from the thermal simulation finite element model using the finite element modeling software. The temperature uniformity factor of the first evaluation region was calculated using the following formula:

[0057]

[0058] Where F is the temperature uniformity factor of the first evaluation area, n is the number of sub-regions corresponding to the first evaluation area, Tn is the average temperature of each sub-region, and Tb is the average temperature of the first evaluation area.

[0059] S103. Obtain the highest temperature, lowest temperature, and average temperature of the second evaluation area, and calculate the temperature uniformity factor of the second evaluation area.

[0060] From the thermal simulation temperature cloud map of the thermal simulation finite element model, obtain the highest temperature, lowest temperature, and average temperature of the upper shell region;

[0061] From the thermal simulation temperature cloud map of the finite element model, the highest and lowest temperatures of the lower shell region are obtained. The average temperature and area information of multiple corresponding sub-regions of the lower shell region are also obtained. The average temperature of the lower shell region is then calculated using the following formula:

[0062] The average temperature of the lower shell region = area of ​​sub-region * sum of average temperatures of sub-regions / sum of areas of sub-regions.

[0063] Based on the highest, lowest, and average temperatures of the upper and lower shell regions, the corresponding temperature uniformity factors are calculated using the following formulas:

[0064]

[0065] Where Fcase is the temperature uniformity factor of the second evaluation area, Tmax is the highest temperature of the second evaluation area, Tmin is the lowest temperature of the second evaluation area, and Ta is the average temperature of the second evaluation area.

[0066] S104. Based on the temperature uniformity factor of the first evaluation area and the temperature uniformity factor of the second evaluation area, determine the temperature uniformity evaluation result of the terminal box device.

[0067] The temperature uniformity factor of the first evaluation area and the temperature uniformity factor of the second evaluation area. The smaller the value, the more uniform the temperature of the terminal box device. Based on the value, it can be determined whether the heat dissipation scheme of the terminal box device is good and whether the heat dissipation scheme of the device needs to be further optimized.

[0068] The temperature uniformity factors of the first and second evaluation areas of multiple terminal box-type devices are analyzed to determine the corresponding temperature uniformity baseline for each terminal box-type device, i.e., the temperature uniformity evaluation index for the terminal box-type devices. Based on this index, the heat dissipation utilization rate of the PCB and casing in the terminal box-type devices, as well as the product qualification rate, can be further determined, thereby improving product competitiveness.

[0069] The technical solutions in the embodiments of the present invention have at least the following technical effects or advantages:

[0070] 1. Evaluating the heat dissipation scheme of terminal box-type equipment from the perspective of temperature uniformity can help to further optimize the heat dissipation scheme of the equipment.

[0071] 2. Based on the temperature uniformity evaluation index of the terminal box-type equipment, the quality of the equipment heat dissipation scheme can be determined. The lower the temperature uniformity factor value, the higher the heat dissipation utilization rate of the equipment PCB and casing.

[0072] 3. By analyzing the temperature uniformity evaluation index of terminal box equipment, the baseline of the temperature uniformity evaluation index is determined, thereby determining the product qualification rate and improving product competitiveness.

[0073] The technical solution of the present invention is further illustrated below with reference to an illustrative terminal box device, which can also be simply referred to as an illustrative device, as follows:

[0074] 1. Establish a finite element model of the schematic device, determine the temperature uniformity evaluation area of ​​the terminal box device, and obtain the temperature value of each area;

[0075] The PCB area of ​​the terminal box device was designated as the temperature uniformity evaluation area. The PCB was divided into N regions, which could be nine equally divided regions. A finite element model was numerically solved using thermal simulation software to obtain the average temperature of the nine equally divided regions and the average temperature of the entire PCB. Table 1 shows the average temperature of the nine equally divided regions of the PCB. Figure 3 This is a thermal simulation temperature cloud map of the PCB area divided into 9 regions in this embodiment of the invention. The PCB is divided into 9 regions in the map, and the average temperature in each region can be read from the thermal simulation software.

[0076] Table 1

[0077]

[0078] The illustrated device's casing edge 4mm represents the casing wall thickness area. This area does not cover the PCB area and contributes minimally to casing surface heat dissipation. Casing uniformity calculations do not consider the casing temperature within this 4mm edge area.

[0079] The primary heat exchange mechanism in the perforated area of ​​the shell is thermal convection, which is greatly influenced by air convection, while the proportion of heat dissipation through shell conduction is small. Shell temperature in the perforated area is not considered in the shell uniformity calculation.

[0080] The fiber coil area in the shell is a non-accessible area, and the shell temperature uniformity calculation does not consider the fiber coil area.

[0081] The illustrated device's outer shell has no openings or fiber coil areas. The overall average temperature of the inner and outer shells is directly read from the thermal simulation evaluation results as 56℃. The inner shell temperature is generally 5℃ higher than the outer shell temperature. The average temperature of the outer shell is calibrated by subtracting 3℃ from the overall average temperature, resulting in an average outer shell temperature of 53℃. The highest and lowest temperatures on the outer shell are directly read from the temperature cloud map of the outer shell in the device's thermal simulation analysis, which are 64.8℃ and 49.4℃, respectively. Figure 4 This is a thermal simulation temperature cloud diagram of the upper shell of the device in an embodiment of the present invention.

[0082] The illustration shows that the lower shell of the equipment has openings and fiber optic coils. The highest and lowest temperatures in the non-opening and non-fiber optic coil areas are obtained from the temperature cloud map of the lower shell in the thermal simulation analysis; these are 68.4℃ and 56.4℃, respectively. Temperature uniformity in the shell is not considered for the opening and fiber optic coil areas. These areas divide the non-opening areas into several blocks, and the average temperature and area information of each block can be read from the thermal simulation software results. Figure 5 This is a temperature cloud map of the lower shell of the schematic device in the embodiment of the present invention. Table 2 shows the average temperature and area information of several blocks of the lower shell obtained from the thermal simulation. The average temperature of the non-perforated and non-fiber coiled area of ​​the lower shell = block area * sum of average block temperatures / sum of block areas = 270556 / 4355.968 = 62.1℃.

[0083] Table 2

[0084]

[0085]

[0086] 2. Calculate the PCB temperature uniformity factor and case temperature uniformity factor of the illustrated device;

[0087] (1) Based on the standard deviation principle and combined with the average temperature of the 9 regions evenly divided by the PCB of the schematic equipment and the average temperature of the entire PCB, the PCB temperature uniformity factor is calculated. The calculation formula is as follows:

[0088]

[0089] Where F is the PCB uniformity factor, the PCB is divided into nine zones, Tn is the average temperature of each zone, and Tb is the average temperature of the entire PCB.

[0090] The overall average temperature of the PCB in the illustrated device is 74.7℃. The average temperatures in the nine zones are 67℃, 70.7℃, 71.7℃, 74.6℃, 83.7℃, 79.5℃, 76.1℃, 76.8℃, and 71.6℃, respectively. Based on the above data, the PCB uniformity is calculated as follows:

[0091]

[0092] (2) Based on the highest temperature, lowest temperature, and average temperature of the schematic equipment casing, calculate the casing temperature uniformity factor. The calculation formula is as follows:

[0093]

[0094] Where Fcase is the shell temperature uniformity factor, the shell temperature is divided into upper and lower shells, Tmax is the highest temperature of the upper / lower shell, Tmin is the lowest temperature of the upper / lower shell, and Ta is the average temperature of the upper / lower shell. The above Tmax, Tmin, and Ta do not consider the temperature of the shell opening area, and Fcase is calculated separately for the upper and lower shells.

[0095] The average temperature of the upper shell of the schematic device is 53℃, the minimum temperature is 49.4℃, and the maximum temperature is 64.8℃. The uniformity factor of the upper shell is calculated as follows:

[0096]

[0097] The example device has an average lower shell temperature of 62.1℃, a minimum temperature of 56.4℃, and a maximum temperature of 68.4℃. The lower shell uniformity factor is calculated as follows:

[0098]

[0099] 3. Five terminal box-type devices with varying heat dissipation performance were selected, and the uniformity values ​​of the casing and PCB temperatures were calculated, as shown in Table 3. The table shows that the heat dissipation gradually worsens from low to high values ​​for PCB and casing temperature uniformity. Device 1 in the actual thermal test had a certain temperature margin, while device 5 posed a risk of casing temperature overheating. Based on the experimental data, it can be determined that the lower the values ​​for casing and PCB temperature uniformity, the more uniform the temperature. Furthermore, cumulative experimental analysis can be conducted on more terminal box-type devices to determine the baseline requirements: casing temperature uniformity <30°C and PCB temperature uniformity <10°C. These baseline requirements are established as the evaluation index for temperature uniformity, and the heat dissipation utilization rate of the PCB and casing in the terminal box-type devices can be further determined based on this index.

[0100] Figure 6 This is a schematic diagram of a temperature uniformity evaluation device for a terminal box-type device provided in an embodiment of the present invention. As shown in the figure, the device includes:

[0101] The first determining module is used to determine the temperature uniformity evaluation area of ​​the terminal box device based on the structure and heat dissipation method of the terminal box device. The temperature uniformity evaluation area includes a first evaluation area and a second evaluation area.

[0102] The first calculation module is used to divide the first evaluation area into multiple sub-regions, obtain the average temperature of the first evaluation area and the average temperature of the corresponding multiple sub-regions, and calculate the temperature uniformity factor of the first evaluation area.

[0103] The second calculation module is used to obtain the highest temperature, lowest temperature, and average temperature of the second evaluation area, and to calculate the temperature uniformity factor of the second evaluation area.

[0104] The second determining module is used to determine the temperature uniformity evaluation result of the terminal box device based on the temperature uniformity factor of the first evaluation area and the temperature uniformity factor of the second evaluation area.

[0105] It should be noted that, for ease of explanation, Figure 6 For example, only the main modules of the terminal box-type device temperature uniformity evaluation device structure are shown. In practical applications, the system may also include modules or components not shown in the figure; the system is not limited to the above-described module structure, and may also be other module structures that implement the above method embodiments.

[0106] Figure 7 The present invention provides a schematic diagram of the structure of an electronic device, as shown in the figure. The electronic device includes a processor and a memory.

[0107] The processor is used to read and execute programs and instructions stored in the memory, causing the electronic device to perform the above-described method embodiments.

[0108] It should be noted that, for ease of explanation, Figure 7 For illustrative purposes only, the main components of the electronic device are shown. In practical applications, the electronic device may also include components or parts not shown in the figures.

[0109] The present invention also provides a computer-readable storage medium storing a program or instructions, which, when read and executed by a computer, causes the computer to perform the above-described method embodiments.

[0110] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for evaluating the temperature uniformity of a terminal box-type device, characterized in that, include: Based on the structure and heat dissipation method of the terminal box device, a temperature uniformity evaluation area for the terminal box device is determined. The temperature uniformity evaluation area includes a first evaluation area and a second evaluation area. The first evaluation region is divided into multiple sub-regions, and the average temperature of the first evaluation region and the average temperature of the corresponding multiple sub-regions are obtained. The temperature uniformity factor of the first evaluation region is calculated. Obtain the highest temperature, lowest temperature, and average temperature of the second evaluation area, and calculate the temperature uniformity factor of the second evaluation area. Based on the temperature uniformity factor of the first evaluation area and the temperature uniformity factor of the second evaluation area, the temperature uniformity evaluation result of the terminal box device is determined.

2. The method for evaluating the temperature uniformity of terminal box-type equipment according to claim 1, characterized in that, The first evaluation area is the PCB area of ​​the terminal box device; the second evaluation area is the housing area of ​​the terminal box device.

3. The method for evaluating the temperature uniformity of terminal box-type devices according to claim 2, characterized in that, The shell region includes: an upper shell region and a lower shell region.

4. The method for evaluating the temperature uniformity of a terminal box-type device according to claim 3, characterized in that, The upper housing area is the area on the housing surface covered by the PCB and without openings; the lower housing area is the area on the housing surface covered by the PCB and other than the area with openings and / or the area with coiled fiber, and the area with openings and the area with coiled fiber divide the lower housing area into multiple lower housing sub-regions.

5. The method for evaluating the temperature uniformity of a terminal box-type device according to claim 4, characterized in that, Obtaining the average temperature of the lower housing region includes: The average temperature of the lower shell region is determined based on the average temperature and area information of multiple lower shell sub-regions.

6. The method for evaluating the temperature uniformity of a terminal box-type device according to claim 1, characterized in that, The formula for calculating the temperature uniformity factor of the first evaluation region is: Where F is the temperature uniformity factor of the first evaluation area, n is the number of sub-regions corresponding to the first evaluation area, Tn is the average temperature of each sub-region, and Tb is the average temperature of the first evaluation area.

7. The method for evaluating the temperature uniformity of a terminal box-type device according to claim 1, characterized in that, The formula for calculating the temperature uniformity factor of the second evaluation region is as follows: Where Fcase is the temperature uniformity factor of the second evaluation area, Tmax is the highest temperature of the second evaluation area, Tmin is the lowest temperature of the second evaluation area, and Ta is the average temperature of the second evaluation area.

8. The method for evaluating the temperature uniformity of a terminal box-type device according to any one of claims 1-7, characterized in that, The step of determining the temperature uniformity evaluation result of the terminal box-type device based on the temperature uniformity factor of the first evaluation region and the temperature uniformity factor of the second evaluation region includes: The temperature uniformity factors of the first and second evaluation areas of multiple terminal box-type devices are analyzed to determine the temperature uniformity evaluation index. The temperature uniformity evaluation results of the terminal box-type equipment are determined based on the temperature uniformity evaluation index.

9. A device for evaluating the temperature uniformity of a terminal box-type equipment, characterized in that, include: The first determining module is used to determine the temperature uniformity evaluation area of ​​the terminal box device based on the structure and heat dissipation method of the terminal box device. The temperature uniformity evaluation area includes a first evaluation area and a second evaluation area. The first calculation module is used to divide the first evaluation area into multiple sub-regions, obtain the average temperature of the first evaluation area and the average temperature of the corresponding multiple sub-regions, and calculate the temperature uniformity factor of the first evaluation area. The second calculation module is used to obtain the highest temperature, lowest temperature, and average temperature of the second evaluation area, and to calculate the temperature uniformity factor of the second evaluation area. The second determining module is used to determine the temperature uniformity evaluation result of the terminal box device based on the temperature uniformity factor of the first evaluation area and the temperature uniformity factor of the second evaluation area.

10. An electronic device, characterized in that, include: Processor and memory; The processor is coupled to the memory; The processor is configured to read and execute the program or instructions stored in the memory, causing the device to perform the method as described in any one of claims 1-8.

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