A TO tube cap package integrated laser module

Abstract

The application relates to the technical field of optical devices, in particular to a TO tube cap packaging integrated linear laser module, which comprises a light source base, an electrode pin arranged on the light source base and used for external electrical connection, a light source chip fixed on the light source base and electrically connected with the electrode pin through a gold wire lead, a TO tube cap which is arranged outside the light source chip and is sealingly connected with the light source base at the bottom to form a packaging cavity, and an integrated linear laser lens which is fixedly arranged at the top of the TO tube cap and is used for collimating and linearly shaping the light beam emitted by the light source chip, wherein the optical axis of the integrated linear laser lens is arranged in alignment with the center of the light source chip. The single-piece free-form surface lens is adopted to simultaneously realize the collimation and shaping functions, two independent lenses in the traditional scheme are combined into one, and the complex assembling and adjusting link between the collimation lens and the light path shaping mirror is eliminated.

Description

Technical Field

[0001] This application relates to the field of optical device technology, and in particular to a TO cap-packaged integrated line laser module. Background Technology

[0002] Line laser modules, as core components for outputting linear structured light, play an irreplaceable role in fields such as 3D scanning, industrial measurement and positioning, machine vision, LiDAR, and consumer electronics. Their performance directly affects the measurement accuracy, response speed, and automation level of downstream equipment. With the increasing demand from related industries for miniaturized, high-precision, and low-cost equipment, the structural defects of traditional line laser modules are becoming increasingly apparent.

[0003] Traditional line laser modules generally employ a three-section structure: a light source / light source array, a collimating lens, and an optical path shaping mirror (such as a cylindrical mirror or microlens array). Discrete optical components are sequentially assembled and fixed onto a metal or ceramic substrate. The light source / light source array is fixed to the substrate via die-bonding wires, and the collimating lens and optical path shaping mirror are sequentially coupled to the light source using adhesive. However, this type of structure often suffers from the following key problems: First, the assembly process is complex, requiring the coaxiality and relative tilt angle of the laser chip, collimating lens, and shaping lens to be guaranteed. The assembly and adjustment process is cumbersome, demanding high skill from process engineers and resulting in low production efficiency. Second, optical losses are high, with the cumulative transmittance of multiple lenses being low, typically only around 80% in theory, affecting the output power and system energy efficiency. Third, dimensional accuracy and consistency are poor. Since optical lenses are mostly injection molded, the dimensional tolerances are large due to the influence of the thermal expansion coefficient of plastics. This makes it difficult to coordinate with other components when multiple positioning is required, leading to difficulties in installation and debugging for downstream customers, resulting in high costs. Furthermore, the combined cost of processing dual-lens components and the multi-step assembly process makes it difficult to reduce the price of the finished product. Summary of the Invention

[0004] This application provides a TO cap-encapsulated integrated line laser module to solve the problems of traditional line laser modules, such as complex structure, difficult assembly and adjustment, low light efficiency, insufficient assembly precision and high cost.

[0005] This application provides a TO cap-encapsulated integrated line laser module, including: A light source base, on which electrode pins are provided for external electrical connection; The light source chip is fixed on the light source base and electrically connected to the electrode pins via gold wire leads; A TO cap is placed over the outside of the light source chip, and its bottom is sealed to the light source base to form an encapsulation cavity; An integrated line laser lens is fixedly mounted on the top of the TO tube cap and is used to collimate and shape the beam emitted by the light source chip. The optical axis of the integrated line laser lens is aligned with the center of the light source chip.

[0006] Preferably, the TO cap is a standard packaged cap of TO38, TO46, TO56 or TO9, with a light-transmitting window on its top and a mounting groove at the light-transmitting window.

[0007] Preferably, the integrated line laser lens is made of optical plastic or optical glass material, and the surface of the integrated line laser lens is provided with an anti-reflection film so that the laser transmittance is not less than 90%.

[0008] Preferably, the integrated line laser lens is a monolithic freeform surface lens, including a collimating surface type and a shaping surface type, wherein: The collimation plane is the YZ plane of the integrated line laser lens, which is used to collimate the diverging beam emitted by the light source chip in the XZ plane. The shaping surface is the XZ plane of the integrated line laser lens, used to diffuse and shape the divergent beam emitted by the light source chip according to a preset divergence angle to form a line laser.

[0009] Preferably, the integrated line laser lens is fixed to the top window position of the TO cap by adhesive bonding, ultrasonic welding, or a snap-fit ​​structure. When the integrated line laser lens is fixed to the top of the TO cap by adhesive bonding, the adhesive layer thickness is not greater than 0.1 mm and the bonding strength is not less than 3 N.

[0010] Preferably, the light source chip is a plurality of VCSEL chips or EEL edge-emitting laser chips, and the plurality of VCSEL chips or EEL edge-emitting laser chips are arranged in a linear array in the central region of the light source base.

[0011] Preferably, the line laser has a preset divergence angle of 10-120° in the XZ plane and a collimation angle of less than 2° in the YZ plane.

[0012] Preferably, the freeform surface shape of the integrated line laser lens can be characterized by one or more of the following: XY polynomial, double cone Zernike expression, or aspherical equation.

[0013] Preferably, the light source base is provided with a metal heat sink or thermally conductive through hole, and forms an airtight encapsulation structure with the TO tube cap. The airtight encapsulation structure is filled with inert gas or kept in a vacuum.

[0014] Preferably, the outer surface of the integrated line laser lens is coated with a waterproof and anti-fouling coating and / or a wear-resistant coating, and the outer surface of the TO tube cap is anodized or sprayed with an insulating coating.

[0015] The beneficial effects of this application are as follows: The TO cap-packaged integrated line laser module of this application achieves both collimation and shaping functions by using a single freeform surface lens. It combines two independent lenses in the traditional solution into one, eliminating the complex assembly and adjustment process between the collimating lens and the optical path shaping lens. By combining the TO cap, a mature high-precision standard component in the semiconductor industry, and utilizing its high dimensional accuracy, it ensures the natural coaxiality between the lens optical axis and the light-emitting center of the light source chip, greatly simplifying the assembly process and improving product consistency and reliability.

[0016] Furthermore, by reducing one lens and two light-transmitting interfaces, the loss during beam transmission is significantly reduced. Combined with the anti-reflective coating design, its transmittance is improved and its optical loss is reduced, enabling it to obtain higher output energy under the same light source power. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the specific embodiments of this application or the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the overall structure of the TO cap-encapsulated integrated line laser module provided in the embodiments of this application; Figure 2 This is a cross-sectional view of the TO cap encapsulated integrated line laser module in this application; Figure 3 This is a schematic diagram of the collimated optical path principle in this application; Figure 4 This is a schematic diagram of the optical path principle of the shaped surface in this application; Figure 5 This is a schematic diagram of the three-dimensional structure of the integrated line laser lens in this application. Figure 1 ; Figure 6 This is a schematic diagram of the three-dimensional structure of the integrated line laser lens in this application. Figure 2 .

[0019] Figure label: 1. Light source base; 11. Electrode pins; 2. TO tube cap; 3. Integrated line laser lens; 4. Light source chip. Detailed Implementation

[0020] The technical solutions of this application will be clearly and completely described below with reference to the embodiments. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0021] The following is combined with Figure 1-5 This describes the TO cap-encapsulated integrated line laser module provided in the embodiments of this application.

[0022] TO stands for "Transistor Outline," a standard for transistor outline packaging widely used in semiconductor device packaging. The TO cap is a metal or ceramic cap-like structure in the TO package used to protect the internal chip and optical components, and it usually has a light-transmitting window.

[0023] Reference Figure 1 and Figure 2 As shown in the embodiment of this application, the TO cap-packaged integrated line laser module mainly includes a light source base 1, a light source chip 4, a TO cap 2, and an integrated line laser lens 3. The light source base 1 serves as the module's mounting substrate and heat sink, and is provided with electrode pins 11 for electrical connection to an external power supply and control circuit. In this embodiment, the light source base 1 also integrates a metal heat sink or thermally conductive vias to enhance heat dissipation performance and ensure that the light source chip 4 operates at a stable temperature.

[0024] In some specific embodiments, the light source chip 4 is fixed to the central region of the light source base 1 and electrically connected to the electrode pins 11 via gold wire leads. The light source chip 4 can be multiple VCSEL chips or EEL edge-emitting laser chips. When using VCSEL chips, multiple chips are arranged in a linear array along the X-axis on the surface of the light source base 1, making its light-emitting area form a line; when using EEL chips, the chips are arranged in a vertical array, with its light-emitting edge facing the TO cap 2. The emission wavelength of the light source chip 4 can be selected according to application requirements, such as 650nm, 850nm, or 940nm, and the output power range is 1-20W.

[0025] In some specific embodiments, the TO cap 2 is fitted over the light source chip 4, and its bottom is sealed to the light source base 1 by resistance welding or laser welding to form an airtight encapsulation cavity with an IP54 sealing rating. The TO cap 2 is preferably a standard package cap such as TO38, TO46, TO56, or TO9, and its material is usually Kovar alloy or ceramic to ensure good airtightness and mechanical strength. The top of the TO cap 2 has a light-transmitting window for beam emission. The window is circular or rectangular in shape, and the edge of the window has a positioning step or annular groove as a mounting groove for positioning the integrated line laser lens 3. The inner surface of the TO cap 2 or the mounting surface of the integrated line laser lens 3 has corresponding annular bosses, snaps, or threaded engagement structures as corresponding mechanical positioning structures to achieve rapid positioning and fixation of the integrated line laser lens.

[0026] Furthermore, since the TO cap is made of metal or ceramic, its coefficient of thermal expansion is much lower than that of plastic injection molded parts, resulting in excellent thermal stability. The spot offset is minimal under wide temperature operating conditions. Its standardized shape and high-precision dimensions facilitate downstream customers to perform automated and high-precision system integration and assembly, effectively solving the assembly and adjustment problems caused by large tolerances and thermal deformation of traditional plastic modules.

[0027] like Figure 3 and Figure 4 As shown, in some specific embodiments, the integrated line laser lens 3 is fixedly mounted at the top light-transmitting window of the TO cap 2. Its core feature is that it is a single freeform surface lens integrating collimation and shaping functions. Its optical surface is specially designed such that in the YZ plane, the lens surface is a collimating surface, used to collimate the diverging beam emitted by the light source chip 4 in the YZ plane, keeping the emitted beam parallel in this plane; in the XZ plane, the lens surface is a shaping surface, used to diffuse and shape the beam according to a preset divergence angle, ultimately forming a line laser beam. The Z-axis direction is the axial direction of the TO cap 2, and the X-axis direction is the vertical direction perpendicular to the TO cap axis. Through optimized design, the divergence angle of the line laser in the XZ plane can be adjusted within the range of 10-120°, while the collimation angle in the YZ plane is less than 2°.

[0028] Specifically, such as Figure 5 and Figure 6As shown, the end of the integrated line laser lens 3 furthest from the light source chip 4 is a cylindrical surface extending along the Z-axis, and its top end has a cylindrical groove along the Y-axis, forming an arc-shaped concave surface that is recessed inward along the Z-axis on its outer surface in the XZ plane, and a straight line along the Y-axis in its middle region in the YZ plane; the end of the integrated line laser lens 3 closest to the light source chip 4 has inclined surfaces on both the upper and lower sides in the X-axis direction, and a convex curved surface protruding towards the light source chip 4 in its middle part, forming a convex lens that convexes outward along the Z-axis in the XZ plane, and a straight line along the Y-axis in its middle region in the YZ plane. Although the central region is also a convex curved surface, its arc range in the Y-axis direction is smaller than that in the X-axis direction. This makes its contact range with the optical path in the XZ plane greater than its contact range with the optical path in the YZ plane. This expands its shaping range in the linear arrangement direction of the light source chip 4, while reducing the passable range of the optical path in the width direction of the light source chip 4. This reduces the amount of laser light that can be output through the integrated linear laser lens 3 in the YZ plane, thereby reducing the width of the linear light spot after diffusion by the integrated linear laser lens 3, thus obtaining a thin and long linear laser.

[0029] In some specific embodiments, the integrated line laser lens 3 can be made of optical plastics such as PMMA, PC, and COC, or optical glass such as BK7, B270, and fused silica. Its surface is coated with an anti-reflective film specific to the laser wavelength, ensuring a laser transmittance of no less than 90%. Simultaneously, its outer surface can be coated with a waterproof and anti-fouling coating and / or a wear-resistant coating, depending on environmental requirements. The integrated line laser lens 3 can be fixed to the mounting groove of the TO cap 2 using various methods, including adhesive bonding, ultrasonic welding, or a snap-fit ​​structure. When adhesive bonding is used, UV-curable adhesive, epoxy adhesive, or silicone adhesive is preferred. The adhesive layer is evenly applied to the annular area where the lens contacts the cap, and the adhesive layer thickness is controlled within 0.1 mm, ensuring a bonding strength of no less than 3 N to guarantee its adhesion.

[0030] In some specific embodiments, the surface shape of the freeform surface can be precisely characterized and processed by one or more of the XY polynomial, the double cone Zernike expression, or the aspherical equation to achieve optimal optical performance.

[0031] By employing a single freeform surface lens to simultaneously achieve collimation and shaping functions, the two independent lenses in the traditional solution are combined into one, eliminating the complex assembly and adjustment steps between the collimating lens and the optical path shaping lens. By combining the TO cap, a mature high-precision standard component in the semiconductor industry, and utilizing its high dimensional accuracy, the natural coaxiality of the lens optical axis and the light-emitting center of the light source chip is ensured, which greatly simplifies the assembly process and improves product consistency and reliability.

[0032] By reducing one lens and two light-transmitting interfaces, the loss during beam transmission is significantly reduced. Combined with the anti-reflective coating design, its transmittance is improved and its optical loss is reduced, enabling it to obtain higher output energy under the same light source power.

[0033] The assembly process of the TO cap-encapsulated integrated line laser module provided in this application is as follows: First, the light source chip 4 is die-bonded to the center of the light source base 1 and electrically connected via gold wire leads. Then, the integrated line laser lens 3 is fixed to the mounting groove of the TO cap 2 using adhesive or other methods. Finally, the TO cap 2 and the light source base 1 are aligned and welded together to seal, completing the encapsulation of the entire module. After encapsulation, the outer surface of the TO cap 2 can be anodized or coated with an insulating coating to enhance environmental adaptability. During operation, the light source chip 4 emits light, and the emitted divergent beam enters the integrated line laser lens 3. The beam is first collimated in the YZ plane, then diffused and shaped in the XZ plane, and finally emitted as a shaped line laser beam from the window of the TO cap 2.

[0034] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0035] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0036] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between components; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0037] In this application, the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0038] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.

Claims

1. A TO-cap encapsulated integrated line laser module, characterized in that, include: A light source base, on which electrode pins are provided for external electrical connection; The light source chip is fixed on the light source base and electrically connected to the electrode pins via gold wire leads; A TO cap is placed over the outside of the light source chip, and its bottom is sealed to the light source base to form an encapsulation cavity; An integrated line laser lens is fixedly mounted on the top of the TO tube cap and is used to collimate and shape the beam emitted by the light source chip. The optical axis of the integrated line laser lens is aligned with the center of the light source chip.

2. The TO cap encapsulated integrated line laser module according to claim 1, characterized in that, The TO cap is a standard packaged cap of TO38, TO46, TO56 or TO9, with a light-transmitting window on the top and a mounting slot at the light-transmitting window.

3. The TO cap encapsulated integrated line laser module according to claim 2, characterized in that, The integrated line laser lens is made of optical plastic or optical glass, and the surface of the integrated line laser lens is provided with an anti-reflection film so that the laser transmittance is not less than 90%.

4. The TO cap-encapsulated integrated line laser module according to claim 3, characterized in that, The integrated line laser lens is a monolithic freeform surface lens, including collimating surface type and shaping surface type, wherein: The collimation plane is the YZ plane of the integrated line laser lens, which is used to collimate the diverging beam emitted by the light source chip in the XZ plane. The shaping surface is the XZ plane of the integrated line laser lens, used to diffuse and shape the divergent beam emitted by the light source chip according to a preset divergence angle to form a line laser.

5. The TO cap encapsulated integrated line laser module according to claim 4, characterized in that, The integrated line laser lens is fixed to the top window position of the TO cap by adhesive, ultrasonic welding or snap-fit ​​structure. When the integrated line laser lens is fixed to the top of the TO cap by adhesive, the adhesive layer thickness is not greater than 0.1mm and the bonding strength is not less than 3N.

6. The TO cap encapsulated integrated line laser module according to claim 5, characterized in that, The light source chip is a plurality of VCSEL chips or EEL edge-emitting laser chips, and the plurality of VCSEL chips or EEL edge-emitting laser chips are arranged in a linear array in the central region of the light source base.

7. The TO cap encapsulated integrated line laser module according to claim 4, characterized in that, The line laser has a preset divergence angle of 10-120° in the XZ plane and a collimation angle of less than 2° in the YZ plane.

8. The TO cap encapsulated integrated line laser module according to claim 4, characterized in that, The freeform surface shape of the integrated line laser lens can be characterized by one or more of the following: XY polynomial, double cone Zernike expression, or aspherical equation.

9. The TO cap encapsulated integrated line laser module according to claim 1, characterized in that, The light source base is provided with a metal heat sink or heat conduction holes, and forms an airtight encapsulation structure with the TO tube cap. The airtight encapsulation structure is filled with inert gas or kept in a vacuum.

10. The TO cap encapsulated integrated line laser module according to claim 1, characterized in that, The outer surface of the integrated line laser lens is coated with a waterproof and anti-fouling coating and / or a wear-resistant coating, and the outer surface of the TO tube cap is anodized or sprayed with an insulating coating.

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