An electrostatic discharge protection circuit, a power amplifier and a power amplification module

By setting up protection components for different sub-amplifier circuits and sharing diodes in a multi-mode multi-frequency power amplifier, the problem of large area occupied by electrostatic discharge protection circuits is solved, achieving chip area saving and reliability improvement.

CN122159806APending Publication Date: 2026-06-05ZHEJIANG STARSHINE SEMICON CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
ZHEJIANG STARSHINE SEMICON CO LTD
Filing Date
2026-03-04
Publication Date
2026-06-05

AI Technical Summary

Technical Problem

In the existing technology, the electrostatic discharge protection circuit of multimode multifrequency power amplifiers occupies a large area, which affects the chip layout and reliability.

Method used

By setting a first protection component and a second protection component for different sub-amplifier circuits, and connecting their tail ends together to a first common component, a common diode is used for charge discharge, reducing the number of diodes, ensuring independent forward conduction of current and avoiding reverse current.

Benefits of technology

It significantly saves chip area, improves circuit reliability, adapts to different conduction voltages and layout requirements, and flexibly adjusts the protection range.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application relates to the technical field of amplifiers, and discloses an electrostatic discharge protection circuit, a power amplifier and a power amplification module, the electrostatic discharge protection circuit is applied to the power amplifier, and comprises: a first protection component, a plurality of forward series-connected diodes, a positive electrode of a diode at a head end is connected with a power supply port of a first sub-amplification circuit; a second protection component, a plurality of forward series-connected diodes, a positive electrode of a diode at a head end is connected with a power supply port of a second sub-amplification circuit, and a negative electrode of a diode at a tail end is connected with a negative electrode of a diode at a tail end in the first protection component; and a first common component, a plurality of forward series-connected diodes, a positive electrode of a diode at a head end is respectively connected with a negative electrode of a diode at a tail end in the first protection component and a negative electrode of a diode at a tail end in the second protection component, and a negative electrode of a diode at a tail end is grounded. The application can greatly reduce the number of diodes used and save the chip area.
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Description

Technical Field

[0001] This invention relates to the field of amplifier technology, and in particular to an electrostatic discharge protection circuit, a power amplifier, and a power amplification module. Background Technology

[0002] Electrostatic discharge (ESD) protection circuits are crucial for protecting against charge discharge and are also the final stage power protection circuits in power amplifiers. In power amplifiers, ESD protection circuits primarily consist of multiple diodes, each with a forward voltage of 1.2V.

[0003] Multi-Mode Multi-Band (MMMB) power amplifiers consist of amplifier circuits for multiple frequency bands. Each frequency band amplifier circuit includes at least one sub-amplifier circuit. For example, if each frequency band uses a two-stage amplifier circuit, then each frequency band amplifier circuit includes two sub-amplifier circuits. The number of sub-amplifier circuits is relatively large, and each sub-amplifier circuit's power supply port needs to be protected by an electrostatic discharge (ESD) protection circuit. The first stage typically requires 5 forward diodes, and the second stage typically requires 9 forward diodes. Therefore, the ESD protection circuit in current power amplifiers currently occupies a large area in the die. Summary of the Invention

[0004] In view of this, the present invention provides an electrostatic discharge protection circuit, a power amplifier, and a power amplification module to solve or partially solve the technical problem of how to reduce the area occupied by the electrostatic discharge protection circuit in related solutions.

[0005] The technical solution proposed in this invention is as follows:

[0006] In a first aspect, the present invention provides an electrostatic discharge protection circuit applied to a power amplifier, the power amplifier including several sub-amplifier circuits, the electrostatic discharge protection circuit including: a first protection component including several diodes connected in series in forward direction, the anode of the first diode being connected to the power supply port of the first sub-amplifier circuit; a second protection component including several diodes connected in series in forward direction, the anode of the first diode being connected to the power supply port of the second sub-amplifier circuit, the cathode of the last diode being connected to the cathode of the last diode in the first protection component; a first common component including several diodes connected in series in forward direction, the anode of the first diode being connected to the cathode of the last diode in the first protection component and the cathode of the last diode in the second protection component respectively, the cathode of the last diode being grounded.

[0007] The electrostatic discharge protection circuit of the present invention provides a first protection component and a second protection component for different sub-amplifier circuits, and connects the tail ends of the two components to a first common component. At least two sub-amplifier circuits can share the diode in the first common component for charge discharge, which greatly reduces the number of diodes used and significantly saves chip area.

[0008] In addition, each power supply port maintains independent forward conduction of current through the forward-biased diodes in the first and second protection components, ensuring that each power supply port has an appropriate conduction voltage and discharge capability, and can avoid the occurrence of current reverse flow between different power supply ports, thereby protecting the circuit and ensuring high reliability.

[0009] Optionally, the electrostatic discharge protection circuit further includes: a third protection component, comprising several diodes connected in forward series, wherein the positive terminal of the first diode is connected to the power supply port of the third sub-amplifier circuit, and the negative terminal of the last diode is connected to the positive terminal of any one of the diodes in the first common component.

[0010] In this approach, a third protection component is added, and its tail is connected to the positive terminal of any diode in the first common component. This supports electrostatic discharge protection for the power supply port of the third sub-amplifier circuit, expands the protection range, and allows for flexible adjustment of the node where the third protection component is connected to the first common component. This adapts to different conduction voltage requirements and layout requirements, thereby improving circuit adaptability.

[0011] Secondly, the present invention provides a power amplifier, comprising: a plurality of sub-amplifier circuits; and an electrostatic discharge protection circuit, comprising: a first protection component, comprising a plurality of diodes connected in forward series, wherein the anode of the first diode is connected to the power supply port of the first sub-amplifier circuit; a second protection component, comprising a plurality of diodes connected in forward series, wherein the anode of the first diode is connected to the power supply port of the second sub-amplifier circuit, and the cathode of the last diode is connected to the cathode of the last diode in the first protection component; and a first common component, comprising a plurality of diodes connected in forward series, wherein the anode of the first diode is connected to the cathode of the last diode in the first protection component and the cathode of the last diode in the second protection component, respectively, and the cathode of the last diode is grounded.

[0012] The power amplifier of the present invention provides a first protection component and a second protection component for different sub-amplifier circuits, and connects the tail ends of the two components to a first common component. At least two sub-amplifier circuits can share the diode in the first common component for charge discharge, which greatly reduces the number of diodes used and significantly saves chip area.

[0013] In addition, each power supply port maintains independent forward conduction of current through the forward-biased diodes in the first and second protection components, ensuring that each power supply port has an appropriate conduction voltage and discharge capability, and can avoid the occurrence of current reverse flow between different power supply ports, thereby protecting the circuit and ensuring high reliability.

[0014] Optionally, the power amplifier includes a first frequency band amplifier circuit, which includes a first stage sub-amplifier circuit and a first stage sub-amplifier circuit connected in sequence. The plurality of sub-amplifier circuits include a first stage sub-amplifier circuit and a first stage sub-amplifier circuit. The positive terminal of the diode at the beginning of the first protection component is connected to the power supply port of the first stage sub-amplifier circuit, and the positive terminal of the diode at the beginning of the second protection component is connected to the power supply port of the first stage sub-amplifier circuit.

[0015] In this approach, by providing a first protection component and a second protection component for the first stage sub-amplifier circuit and the first stage sub-amplifier circuit in the first frequency band amplifier circuit, and sharing the diode in the first shared component, the number of electrostatic discharge diodes required for amplifier circuits in the same frequency band is significantly reduced.

[0016] Optionally, the power amplifier includes a first frequency band amplifier circuit and a second frequency band amplifier circuit. The first frequency band amplifier circuit includes a first-stage sub-amplifier circuit and a first-stage sub-amplifier circuit connected in sequence. The second frequency band amplifier circuit includes a second-stage sub-amplifier circuit and a second-stage sub-amplifier circuit connected in sequence. The plurality of sub-amplifier circuits include a first-stage sub-amplifier circuit, a first-stage sub-amplifier circuit, a second-stage sub-amplifier circuit, and a second-stage sub-amplifier circuit. The power supply ports of any two circuits in the first-stage sub-amplifier circuit, the first-stage sub-amplifier circuit, the second-stage sub-amplifier circuit, and the second-stage sub-amplifier circuit are respectively connected to the positive terminal of the diode at the beginning of the first protection component and the positive terminal of the diode at the beginning of the second protection component.

[0017] In this approach, by connecting the power supply ports of any two sub-amplifier circuits in a dual-band, two-stage power amplifier to the first protection component and the second protection component, and sharing the diode in the first common component, the number of electrostatic discharge diodes required for the dual-band, two-stage power amplifier can be reduced, and the shared power supply ports can be selected according to the actual circuit layout, thereby improving layout flexibility.

[0018] Optionally, the electrostatic discharge protection circuit further includes: a third protection component, comprising several diodes connected in forward series, wherein the positive terminal of the first diode is connected to the power supply port of the third sub-amplifier circuit, and the negative terminal of the last diode is connected to the positive terminal of any one of the diodes in the first common component.

[0019] In this approach, a third protection component is added, and its tail is connected to the positive terminal of any diode in the first common component. This supports electrostatic discharge protection for the power supply port of the third sub-amplifier circuit, expands the protection range, and allows for flexible adjustment of the node where the third protection component is connected to the first common component. This adapts to different conduction voltage requirements and layout requirements, thereby improving circuit adaptability.

[0020] Optionally, the power amplifier includes a first frequency band amplifier circuit, a second frequency band amplifier circuit, and a third frequency band amplifier circuit. The first frequency band amplifier circuit includes a first-stage sub-amplifier circuit and a first-stage sub-amplifier circuit connected in sequence. The second frequency band amplifier circuit includes a second-stage sub-amplifier circuit and a second-stage sub-amplifier circuit connected in sequence. The third frequency band amplifier circuit includes a third-stage sub-amplifier circuit and a third-stage sub-amplifier circuit connected in sequence. The plurality of sub-amplifier circuits include the first-stage sub-amplifier circuit, the first-stage sub-amplifier circuit, the second-stage sub-amplifier circuit, the second-stage sub-amplifier circuit, the third-stage sub-amplifier circuit, and the third-stage sub-amplifier circuit. The power supply ports of any three circuits among the first-stage sub-amplifier circuit, the first-stage sub-amplifier circuit, the second-stage sub-amplifier circuit, the third-stage sub-amplifier circuit, and the third-stage sub-amplifier circuit are respectively connected to the positive terminal of the diode at the beginning of the first protection component, the positive terminal of the diode at the beginning of the second protection component, and the positive terminal of the diode at the beginning of the third protection component.

[0021] In this approach, the diodes of at least three power supply ports can be shared through the first protection component, the second protection component, the third protection component, and the first shared component, further reducing the number of diodes required.

[0022] Optionally, the power supply ports of the first secondary sub-amplifier circuit, the second secondary sub-amplifier circuit, and the third secondary sub-amplifier circuit are respectively connected to the positive terminal of the diode at the beginning of the first protection component, the positive terminal of the diode at the beginning of the second protection component, and the positive terminal of the diode at the beginning of the third protection component. The electrostatic discharge protection circuit also includes: The fourth protection component includes several diodes connected in forward series, with the positive terminal of the first diode connected to the power supply port of the first stage sub-amplifier circuit; The fifth protection component includes several diodes connected in forward series. The positive terminal of the first diode is connected to the power supply port of the second stage sub-amplifier circuit, and the negative terminal of the last diode is connected to the negative terminal of the last diode in the fourth protection component. The second common component includes several diodes connected in forward series. The positive terminal of the first diode is connected to the negative terminal of the second diode in the fourth protection component and the negative terminal of the second diode in the fifth protection component, respectively. The negative terminal of the second diode is grounded. The sixth protection component includes several diodes connected in forward series. The positive terminal of the first diode is connected to the power supply port of the third stage sub-amplifier circuit, and the negative terminal of the last diode is connected to the positive terminal of any one of the diodes in the second common component.

[0023] In this approach, a fourth, fifth, and sixth protection component are added to connect to the corresponding power supply ports. Furthermore, the fourth, fifth, and sixth protection components share the diodes in the second common component, achieving different common combinations, further reducing the number of diodes required, and facilitating layout.

[0024] Optionally, the power amplifier includes a first frequency band amplifier circuit and a second frequency band amplifier circuit. The first frequency band amplifier circuit includes a first sub-amplifier circuit, and the second frequency band amplifier circuit includes a second sub-amplifier circuit. Several sub-amplifier circuits include the first sub-amplifier circuit and the second sub-amplifier circuit. The anode of the diode at the beginning of the first protection component is connected to the power supply port of the first sub-amplifier circuit, and the anode of the diode at the beginning of the second protection component is connected to the power supply port of the second sub-amplifier circuit.

[0025] This approach reduces the number of diodes required for electrostatic discharge protection in dual-band, single-stage subamplifier power amplifiers.

[0026] Optionally, the power amplifier includes a first frequency band amplifier circuit, a second frequency band amplifier circuit, and a third frequency band amplifier circuit. The first frequency band amplifier circuit includes a first sub-amplifier circuit, the second frequency band amplifier circuit includes a second sub-amplifier circuit, and the third frequency band amplifier circuit includes a third sub-amplifier circuit. The plurality of sub-amplifier circuits include the first sub-amplifier circuit, the second sub-amplifier circuit, and the third sub-amplifier circuit. The anode of the diode at the beginning of the first protection component is connected to the power supply port of the first sub-amplifier circuit. The anode of the diode at the beginning of the second protection component is connected to the power supply port of the second sub-amplifier circuit. The anode of the diode at the beginning of the third protection component is connected to the power supply port of the third sub-amplifier circuit.

[0027] This approach reduces the number of diodes required for electrostatic discharge protection in a three-band, single-stage power amplifier.

[0028] Thirdly, the present invention provides a power amplifier module, including the power amplifier as described in the second aspect of the present invention. Attached Figure Description

[0029] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] Figure 1 This is a schematic diagram of the electrostatic discharge protection circuit in related technologies; Figure 2 This is a schematic diagram of the structure of a power amplifier in related technologies; Figure 3 This is a schematic diagram of the structure of the first electrostatic discharge protection circuit in an embodiment of the present invention; Figure 4 This is a schematic diagram of the structure of the second electrostatic discharge protection circuit in an embodiment of the present invention; Figure 5 This is a schematic diagram of the third electrostatic discharge protection circuit in an embodiment of the present invention; Figure 6 This is a schematic diagram of the structure of the first power amplifier in an embodiment of the present invention; Figure 7 This is a schematic diagram of the structure of the second type of power amplifier in an embodiment of the present invention; Figure 8 This is a schematic diagram of the structure of the third power amplifier in an embodiment of the present invention; Figure 9 This is a schematic diagram of the structure of the fourth power amplifier in this embodiment of the invention; Figure 10 This is a schematic diagram of the structure of the fifth power amplifier in this embodiment of the invention; Figure 11 This is a schematic diagram of the sixth power amplifier in an embodiment of the present invention; Explanation of reference numerals in the attached figures: 1. First protection component; 2. Second protection component; 3. First common component; 4. Third protection component; 5. Sub-amplifier circuit; 51. First stage sub-amplifier circuit; 52. First stage sub-amplifier circuit; 53. Second stage sub-amplifier circuit; 54. Second stage sub-amplifier circuit; 55. Third stage sub-amplifier circuit; 56. Third stage sub-amplifier circuit; 57. First sub-amplifier circuit; 58. Second sub-amplifier circuit; 59. Third sub-amplifier circuit; 6. Fourth protection component; 7. Fifth protection component; 8. Second common component; 9. Sixth protection component. Detailed Implementation

[0031] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0032] In the description of this invention, it should be noted that the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The term "several" is used to refer to one or more.

[0033] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can also refer to the internal connection of two components; and they can refer to a wireless connection or a wired connection. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0034] Furthermore, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0035] Currently, the electrostatic discharge protection circuit of a two-stage multimode multiband power amplifier based on a heterojunction bipolar transistor is typically as follows: Figure 1 As shown, VCC1 and VCC2 are the power supply ports of the first-stage amplifier circuit and the second-stage amplifier circuit, respectively. The two stages of electrostatic discharge protection are independent of each other (the number of diodes in each stage of electrostatic discharge protection varies depending on the design; usually, there are 5 forward diodes in the first stage and 9 forward diodes in the second stage. This embodiment of the invention only discusses the forward stage, and the reverse electrostatic discharge is not discussed here).

[0036] Figure 2 This is a schematic diagram of a multi-mode multi-band power amplifier in related technologies, which includes three frequency bands: high frequency (HB), intermediate frequency (MB), and low frequency (LB). The high frequency input is HB. in 1. Intermediate frequency input MB in and low-frequency input LB in After being amplified by two corresponding stages, it is converted into a high-frequency output HB. out Intermediate frequency output MB out and low-frequency output LB out The first-stage power supply ports for high frequency, intermediate frequency, and low frequency are HB-VCC1, MB-VCC1, and LB-VCC1, respectively, and the second-stage power supply ports are HB-VCC2, MB-VCC2, and LB-VCC2, respectively. The second-stage electrostatic discharge (ESD) protection circuit for each frequency band is connected to the corresponding power supply port, and each circuit contains nine diodes. Each stage of the ESD protection circuit is independent of the others (the first-stage ESD protection circuit is not shown in the diagram). Because multi-mode multi-band power amplifiers in related technologies require multiple diodes connected in forward series at each power supply port to discharge charge, the ESD protection circuit not only occupies a large area but also affects the layout.

[0037] In view of this, embodiments of the present invention provide an electrostatic discharge protection circuit applied to a power amplifier, the power amplifier including several sub-amplifier circuits 5. For example... Figure 3 As shown, the electrostatic discharge protection circuit includes: The first protection component 1 includes several diodes connected in forward series, with the positive terminal of the first diode connected to the power supply port of the first sub-amplifier circuit 5. The second protection component 2 includes several diodes connected in forward series. The positive terminal of the first diode is connected to the power supply port of the second sub-amplifier circuit 5, and the negative terminal of the last diode is connected to the negative terminal of the last diode in the first protection component 1. The first common component 3 includes several diodes connected in forward series. The positive terminal of the diode at the beginning is connected to the negative terminal of the diode at the end of the first protection component 1 and the negative terminal of the diode at the end of the second protection component 2, respectively. The negative terminal of the diode at the end is grounded.

[0038] Specifically, the power amplifier includes multiple frequency bands, each of which includes several stages of sub-amplifier circuits 5. The shared sub-amplifier circuits 5 can be any stage of sub-amplifier circuits 5 in any frequency band. In one example, the power amplifier includes three frequency bands: high frequency HB, intermediate frequency MB, and low frequency LB. Each frequency band adopts a two-stage amplification structure, that is, each frequency band includes a first-stage sub-amplifier circuit 5 and a second-stage sub-amplifier circuit 5.

[0039] Utilizing the reverse non-conducting characteristic of diodes, the power supply ports VCCA of the first sub-amplifier circuit 5 and VCCB of the second sub-amplifier circuit 5 share a diode in the first shared component 3. This saves on the required number of diodes, optimizes the layout, and reduces the number of diodes by the same amount as the number of diodes in the first shared component 3. The power supply port of the shared diode can be a power supply port of a sub-amplifier circuit 5 in the same frequency band of the power amplifier, or it can be a power supply port of a sub-amplifier circuit 5 in a different frequency band. It should be noted that the power supply ports participating in the sharing are kept independently forward-conducting by several forward-biased diodes in the first protection component 1 and the second protection component 2, ensuring that at least one forward-biased diode in each power supply port cannot be shared, thereby preventing current from flowing between different power supply ports and causing damage to the devices.

[0040] Generally, the forward voltage of the diodes connected in series in the first protection component 1, the second protection component 2, and the first common component 3 is about 1.2V. The number of power supply ports participating in the sharing and the number of common diodes can be flexibly configured in combination with the chip layout, such as the location of the diodes and the routing, so as to achieve the optimal layout.

[0041] For example, the power supply ports VCCA and VCCB of the first sub-amplifier circuit 5 are both power supply ports of the second-stage sub-amplifier circuit 5, and their input voltages are the same. In this case, the power supply ports VCCA and VCCB of the first and second sub-amplifier circuits 5 need to be connected in forward series with 9 diodes respectively. Therefore, the diodes in the first protection component 1 and the second protection component 2 can both be set to 3, and the number of diodes in the first common component 3 can be set to 6, which can reduce the number of diodes by 6. Alternatively, the diodes in the first protection component 1 and the second protection component 2 can both be set to 2, and the number of diodes in the first common component 3 can be set to 7. Alternatively, the diodes in the first protection component 1 and the second protection component 2 can both be set to 1, and the number of diodes in the first common component 3 can be set to 8, etc.

[0042] When the power supply ports VCCA and VCCB of the first and second sub-amplifier circuits 5 are respectively the power supply ports of the first-stage and second-stage sub-amplifier circuits 5, their input voltages are different. Generally, the first-stage sub-amplifier circuit 5 requires 5 diodes in series, and the second-stage sub-amplifier circuit 5 requires 9 diodes in series. Therefore, the number of diodes in the first protection component 1 can be set to 1, the number of diodes in the second protection component 2 can be set to 5, and the number of diodes in the first common component 3 can be set to 4, or the number of diodes in the first protection component 1 can be set to 2, the number of diodes in the second protection component 2 can be set to 6, and the number of diodes in the first common component 3 can be set to 3, etc.

[0043] The electrostatic discharge protection circuit of this invention provides a first protection component 1 and a second protection component 2 for different sub-amplifier circuits 5, and connects their tail ends to a first common component 3. At least two sub-amplifier circuits 5 can share the diode in the first common component 3 for charge discharge, which greatly reduces the number of diodes used and significantly saves chip area.

[0044] In addition, each power supply port maintains independent forward conduction of current through the forward-biased diodes in the first protection component 1 and the second protection component 2, ensuring that each power supply port has an appropriate conduction voltage and discharge capability, and can avoid the occurrence of current reverse flow between different power supply ports, thereby protecting the circuit and ensuring high reliability.

[0045] In some embodiments, the electrostatic discharge protection circuit further includes: a third protection component 4, comprising a plurality of diodes connected in forward series, wherein the positive terminal of the first diode is connected to the power supply port of the third sub-amplifier circuit 5, and the negative terminal of the last diode is connected to the positive terminal of any one of the diodes in the first common component 3.

[0046] Specifically, the number of diodes shared among the first sub-amplifier circuit 5, the second sub-amplifier circuit 5, and the third sub-amplifier circuit 5 can be the same or different. For example... Figure 4 As shown, the power supply ports VCCA, VCCB, and VCCC of the first sub-amplifier circuit 5 share six diodes; or, as... Figure 5 As shown, the power supply ports VCCA and VCCB of the first and second sub-amplifier circuits 5 share 6 diodes, and the power supply port VCCC of the third sub-amplifier circuit 5 shares 5 diodes with the power supply ports VCCA and VCCB of the first and second sub-amplifier circuits 5.

[0047] It should be understood that the number of shared sub-amplifier circuits 5 includes, but is not limited to, 2 or 3, and may also include, for example, 4 or 5, and the number of protection components increases accordingly.

[0048] In this embodiment, a third protection component 4 is added, and its tail end is connected to the positive terminal of any diode in the first common component 3. This supports electrostatic discharge protection of the power supply port of the third sub-amplifier circuit 5, expands the protection range, and allows for flexible adjustment of the node where the third protection component 4 is connected to the first common component 3. This adapts to different conduction voltage requirements and layout requirements, thereby improving circuit adaptability.

[0049] This invention also provides a power amplifier, such as... Figure 6 As shown, the power amplifier includes: Several sub-amplifier circuits 5; Electrostatic discharge protection circuit, including: The first protection component 1 includes several diodes connected in forward series, with the positive terminal of the first diode connected to the power supply port of the first sub-amplifier circuit 5. The second protection component 2 includes several diodes connected in forward series. The positive terminal of the first diode is connected to the power supply port of the second sub-amplifier circuit 5, and the negative terminal of the last diode is connected to the negative terminal of the last diode in the first protection component 1. The first common component 3 includes several diodes connected in forward series. The positive terminal of the diode at the beginning is connected to the negative terminal of the diode at the end of the first protection component 1 and the negative terminal of the diode at the end of the second protection component 2, respectively. The negative terminal of the diode at the end is grounded.

[0050] Specifically, the power amplifier includes multiple frequency bands, each of which includes several stages of sub-amplifier circuits 5. The shared sub-amplifier circuits 5 can be any stage of sub-amplifier circuits 5 in any frequency band. In one example, the power amplifier includes three frequency bands: high frequency HB, intermediate frequency MB, and low frequency LB, with the high frequency input HB...in 1. Intermediate frequency input MB in and low-frequency input LB in After being amplified by two corresponding stages, it is converted into a high-frequency output HB. out Intermediate frequency output MB out and low-frequency output LB out The power supply ports of the first-stage sub-amplifier circuit 5 for high frequency, intermediate frequency and low frequency are HB-VCC1, MB-VCC1 and LB-VCC1 respectively, and the power supply ports of the second-stage sub-amplifier circuit 5 are HB-VCC2, MB-VCC2 and LB-VCC2 respectively. The two sub-amplifier circuits 5 that participate in the sharing can be the second-stage sub-amplifier circuits 5 for high frequency and intermediate frequency, or any two sub-amplifier circuits 5.

[0051] Utilizing the reverse non-conducting characteristic of diodes, the power supply ports of the first sub-amplifier circuit 5 and the second sub-amplifier circuit 5 share a diode in the first shared component 3. This saves on the required number of diodes, optimizes the layout, and reduces the number of diodes by the same amount as the number of diodes in the first shared component 3. The power supply port of the shared diode can be a power supply port of a sub-amplifier circuit 5 in the same frequency band of the power amplifier, or it can be a power supply port of a sub-amplifier circuit 5 in a different frequency band. It should be noted that the power supply ports participating in the sharing are kept independently forward-conducting by several forward-biased diodes in the first protection component 1 and the second protection component 2, ensuring that at least one forward-biased diode in each power supply port cannot be shared, thereby preventing current from flowing between different power supply ports and causing damage to the devices.

[0052] Generally, the forward voltage of the diodes connected in series in the first protection component 1, the second protection component 2, and the first common component 3 is about 1.2V. The number of power supply ports participating in the sharing and the number of common diodes can be flexibly configured in combination with the chip layout, such as the location of the diodes and the routing, so as to achieve the optimal layout.

[0053] The power amplifier of this invention provides a first protection component 1 and a second protection component 2 for different sub-amplifier circuits 5, and connects their tail ends to a first common component 3. At least two sub-amplifier circuits 5 can share the diodes in the first common component 3 for charge discharge, which greatly reduces the number of diodes used and significantly saves chip area.

[0054] In addition, each power supply port maintains independent forward conduction of current through the forward-biased diodes in the first protection component 1 and the second protection component 2, ensuring that each power supply port has an appropriate conduction voltage and discharge capability, and can avoid the occurrence of current reverse flow between different power supply ports, thereby protecting the circuit and ensuring high reliability.

[0055] In some embodiments, such as Figure 7 As shown, the power amplifier includes a first frequency band amplifier circuit, which includes a first stage sub-amplifier circuit 51 and a first stage sub-amplifier circuit 52 connected in sequence. Several sub-amplifier circuits 5 include the first stage sub-amplifier circuit 51 and the first stage sub-amplifier circuit 52. The positive terminal of the diode at the beginning of the first protection component 1 is connected to the power supply port of the first stage sub-amplifier circuit 51. The positive terminal of the diode at the beginning of the second protection component 2 is connected to the power supply port of the first stage sub-amplifier circuit 52.

[0056] Specifically, the first frequency band amplifier circuit is an amplifier circuit for the target frequency band, such as a high-frequency amplifier circuit, an intermediate-frequency amplifier circuit, and a low-frequency amplifier circuit, etc., and adopts a two-stage amplification structure, including a first-stage sub-amplifier circuit 51 and a first-stage sub-amplifier circuit 52.

[0057] In one example, the first frequency band amplifier circuit is a high-frequency amplifier circuit. The power supply port HB-VCC1 of the first stage sub-amplifier circuit 51 needs to be connected to 5 diodes, and the power supply port HB-VCC2 of the first stage sub-amplifier circuit 52 needs to be connected to 9 diodes. Therefore, the number of diodes in the first protection component 1 can be set to 2, the number of diodes in the second protection component 2 can be set to 6, and the number of diodes in the first shared component 3 can be set to 3, so that the first stage sub-amplifier circuit 51 and the first stage sub-amplifier circuit 52 share 3 diodes, thereby reducing the number of diodes.

[0058] In this embodiment, by providing a first protection component 1 and a second protection component 2 for the first stage sub-amplifier circuit 51 and the first stage sub-amplifier circuit 52 in the first frequency band amplifier circuit, and sharing the diode in the first common component 3, the electrostatic discharge diodes required for the amplifier circuit in the same frequency band are significantly reduced.

[0059] In some embodiments, such as Figure 8 As shown, the electrostatic discharge protection circuit also includes: a third protection component 4, which includes several diodes connected in forward series. The positive terminal of the first diode is connected to the power supply port of the third sub-amplifier circuit 5, and the negative terminal of the last diode is connected to the positive terminal of any one of the diodes in the first common component 3.

[0060] Specifically, the number of diodes shared among the first sub-amplifier circuit 5, the second sub-amplifier circuit 5, and the third sub-amplifier circuit 5 can be the same or different. For example, the power supply port of the first sub-amplifier circuit 5 is HB-VCC2, the power supply port of the second sub-amplifier circuit 5 is MB-VCC2, and the power supply port of the third sub-amplifier circuit 5 is LB-VCC2. HB-VCC2, MB-VCC2, and LB-VCC2 share 6 diodes together; or, HB-VCC2 and MB-VCC2 share 6 diodes, and LB-VCC2 shares 5 diodes with HB-VCC2 / MB-VCC2.

[0061] In this embodiment, a third protection component 4 is added, and its tail end is connected to the positive terminal of any diode in the first common component 3. This supports electrostatic discharge protection of the power supply port of the third sub-amplifier circuit 5, expands the protection range, and allows for flexible adjustment of the node where the third protection component 4 is connected to the first common component 3. This adapts to different conduction voltage requirements and layout requirements, thereby improving circuit adaptability.

[0062] Furthermore, the power amplifier includes a first-band amplifier circuit, a second-band amplifier circuit, and a third-band amplifier circuit. The first-band amplifier circuit includes a first-stage sub-amplifier circuit 51 and a first-stage sub-amplifier circuit 52 connected in sequence. The second-band amplifier circuit includes a second-stage sub-amplifier circuit 53 and a second-stage sub-amplifier circuit 54 connected in sequence. The third-band amplifier circuit includes a third-stage sub-amplifier circuit 55 and a third-stage sub-amplifier circuit 56 connected in sequence. The plurality of sub-amplifier circuits 5 include the first-stage sub-amplifier circuit 51, the first-stage sub-amplifier circuit 52, the second-stage sub-amplifier circuit 53, the third-stage sub-amplifier circuit 54, the fourth-stage sub-amplifier circuit 55, the fifth-stage sub-amplifier circuit 56, and the sixth-stage sub-amplifier circuit 56. The power supply ports of any three of the following circuits—the first-stage sub-amplifier circuit 53, the second-stage sub-amplifier circuit 54, the third-stage sub-amplifier circuit 55, and the third-stage sub-amplifier circuit 56—are respectively connected to the positive terminals of the diodes at the beginning of the first protection component 1, the second protection component 2, and the third protection component 4.

[0063] Specifically, the power supply ports of the first secondary sub-amplifier circuit 52, the second secondary sub-amplifier circuit 54, and the third secondary sub-amplifier circuit 56 can be connected to the positive terminals of the diodes at the beginning of the first protection component 1, the second protection component 2, and the third protection component 4, respectively. There are 3 diodes in each of the first protection component 1, the second protection component 2, and the third protection component 4, and 6 diodes in the first shared component 3. By sharing, 12 diodes can be reduced.

[0064] Alternatively, the power supply ports of the first stage sub-amplifier circuit 51, the second stage sub-amplifier circuit 53, and the third stage sub-amplifier circuit 55 can be connected to the positive terminals of the diodes at the beginning of the first protection component 1, the second protection component 2, and the third protection component 4, respectively. Each of the first protection component 1, the second protection component 2, and the third protection component 4 has three diodes, while the first shared component 3 has two diodes. By sharing, four diodes can be reduced.

[0065] In this embodiment, the first protection component 1, the second protection component 2, the third protection component 4 and the first shared component 3 can realize the sharing of diodes at at least three power supply ports, further reducing the number of diodes required.

[0066] In some embodiments, the power supply ports of the first secondary sub-amplifier circuit 52, the second secondary sub-amplifier circuit 54, and the third secondary sub-amplifier circuit 56 are respectively connected to the positive terminal of the diode at the beginning of the first protection component 1, the positive terminal of the diode at the beginning of the second protection component 2, and the positive terminal of the diode at the beginning of the third protection component 4. The electrostatic discharge protection circuit also includes: The fourth protection component 6 includes several diodes connected in forward series, with the positive terminal of the first diode connected to the power supply port of the first stage sub-amplifier circuit 51. The fifth protection component 7 includes several diodes connected in forward series. The positive terminal of the first diode is connected to the power supply port of the second stage sub-amplifier circuit 53, and the negative terminal of the last diode is connected to the negative terminal of the last diode in the fourth protection component 6. The second common component 8 includes several diodes connected in forward series. The positive terminal of the first diode is connected to the negative terminal of the second diode in the fourth protection component 6 and the negative terminal of the second diode in the fifth protection component 7, respectively. The negative terminal of the second diode is grounded. The sixth protection component 9 includes several diodes connected in forward series. The positive terminal of the first diode is connected to the power supply port of the third stage sub-amplifier circuit 55, and the negative terminal of the last diode is connected to the positive terminal of any one of the diodes in the second common component 8.

[0067] Specifically, such as Figure 9As shown, the power supply port HB-VCC2 of the first secondary sub-amplifier circuit 52, the power supply port MB-VCC2 of the second secondary sub-amplifier circuit 54, and the power supply port LB-VCC2 of the third secondary sub-amplifier circuit 56 are respectively connected to the anode of the diode at the beginning of the first protection component 1, the anode of the diode at the beginning of the second protection component 2, and the anode of the diode at the beginning of the third protection component 4. The first protection component 1, the second protection component 2, and the third protection component 4 each contain 3 diodes, while the first common component 3 contains 6 diodes. By sharing the diodes in the first common component 3, 12 diodes can be reduced. The power supply ports HB-VCC1 of the first stage sub-amplifier circuit 51, MB-VCC1 of the second stage sub-amplifier circuit 53, and LB-VCC1 of the third stage sub-amplifier circuit 55 are respectively connected to the positive terminals of the diodes at the beginning of the fourth protection component 6, the fifth protection component 7, and the sixth protection component 9. There are 3 diodes in each of the fourth protection component 6, the fifth protection component 7, and the sixth protection component 9, and 2 diodes in the first common component 3. The number of diodes can be reduced by 4 by sharing the diodes through the second common component 8.

[0068] In this embodiment, a fourth protection component 6, a fifth protection component 7, and a sixth protection component 9 are added to connect to the corresponding power supply ports. The fourth protection component 6, the fifth protection component 7, and the sixth protection component 9 share the diode in the second common component 8 to achieve different common combinations, further reducing the number of diodes required and facilitating layout.

[0069] In some embodiments, the power amplifier includes amplification circuits for multiple frequency bands, each frequency band employing a single-stage amplification structure. Sub-amplifier circuits 5 for different frequency bands can share diodes through a first common component 3, thereby reducing the required number of diodes.

[0070] like Figure 10 As shown, the power amplifier includes a first frequency band amplifier circuit and a second frequency band amplifier circuit. The first frequency band amplifier circuit includes a first sub-amplifier circuit 57, and the second frequency band amplifier circuit includes a second sub-amplifier circuit 58. Several sub-amplifier circuits 5 include the first sub-amplifier circuit 57 and the second sub-amplifier circuit 58. The positive terminal of the diode at the beginning of the first protection component 1 is connected to the power supply port of the first sub-amplifier circuit 57, and the positive terminal of the diode at the beginning of the second protection component 2 is connected to the power supply port of the second sub-amplifier circuit 58.

[0071] In this embodiment, the power amplifier has only one amplification circuit in each frequency band. Through the first protection component 1, the second protection component 2, and the first common component 3, the number of diodes required for electrostatic discharge protection of the dual-band, single-stage sub-amplifier power amplifier can be reduced.

[0072] like Figure 11 As shown, the power amplifier includes a first frequency band amplifier circuit, a second frequency band amplifier circuit, and a third frequency band amplifier circuit. The first frequency band amplifier circuit includes a first sub-amplifier circuit 57, the second frequency band amplifier circuit includes a second sub-amplifier circuit 58, and the third frequency band amplifier circuit includes a third sub-amplifier circuit 59. Several sub-amplifier circuits 5 include the first sub-amplifier circuit 57, the second sub-amplifier circuit 58, and the third sub-amplifier circuit 59. The anode of the diode at the beginning of the first protection component 1 is connected to the power supply port of the first sub-amplifier circuit 57. The anode of the diode at the beginning of the second protection component 2 is connected to the power supply port of the second sub-amplifier circuit 58. The anode of the diode at the beginning of the third protection component 4 is connected to the power supply port of the third sub-amplifier circuit 59.

[0073] By using the first protection component 1, the second protection component 2, the third protection component 4, and the first common component 3, the number of diodes required for electrostatic discharge protection of a power amplifier with a three-band, single-stage sub-amplifier structure can be reduced.

[0074] In some embodiments, the power amplifier includes a first frequency band amplifier circuit and a second frequency band amplifier circuit. The first frequency band amplifier circuit includes a first-stage sub-amplifier circuit 51 and a first-stage sub-amplifier circuit 52 connected in sequence. The second frequency band amplifier circuit includes a second-stage sub-amplifier circuit 53 and a second-stage sub-amplifier circuit 54 connected in sequence. The plurality of sub-amplifier circuits 5 include the first-stage sub-amplifier circuit 51, the first-stage sub-amplifier circuit 52, the second-stage sub-amplifier circuit 53, and the second-stage sub-amplifier circuit 54. The power supply ports of any two circuits among the first-stage sub-amplifier circuit 51, the first-stage sub-amplifier circuit 52, the second-stage sub-amplifier circuit 53, and the second-stage sub-amplifier circuit 54 are respectively connected to the positive terminal of the diode at the beginning of the first protection component 1 and the positive terminal of the diode at the beginning of the second protection component 2.

[0075] Specifically, the power amplifier adopts a dual-frequency amplification structure, supporting signal amplification in two frequency bands. Each frequency band includes a first-stage sub-amplifier circuit 5 and a second-stage amplifier circuit. In this structure, the two shared sub-amplifier circuits 5 can be any two of the following: a first-stage sub-amplifier circuit 51, a first-stage sub-amplifier circuit 52, a second-stage sub-amplifier circuit 53, and a second-stage sub-amplifier circuit 54. For example, the first-stage sub-amplifier circuit 51 and the second-stage sub-amplifier circuit 53 can be shared, or the first-stage sub-amplifier circuit 52 and the second-stage sub-amplifier circuit 54 can be shared.

[0076] In this embodiment, by connecting the power supply ports of any two sub-amplifier circuits 5 in the dual-band, two-stage amplification power amplifier to the first protection component 1 and the second protection component 2, and sharing the diode in the first common component 3, the electrostatic discharge diodes required for the dual-band, two-stage amplification power amplifier can be reduced, and the shared power supply ports can be selected according to the actual circuit layout, thereby improving layout flexibility.

[0077] The present invention also provides a power amplifier module, including the power amplifier as described in the above embodiments of the present invention.

[0078] While exemplary embodiments and their advantages have been described in detail, those skilled in the art can make various changes, substitutions and modifications to these embodiments without departing from the spirit and scope of the invention, and such modifications and variations all fall within the scope defined herein.

Claims

1. An electrostatic discharge protection circuit, applied to a power amplifier, the power amplifier comprising a plurality of sub-amplifier circuits, characterized in that, The electrostatic discharge protection circuit includes: The first protection component includes several diodes connected in forward series, with the positive terminal of the first diode connected to the power supply port of the first sub-amplifier circuit; The second protection component includes several diodes connected in forward series. The positive terminal of the first diode is connected to the power supply port of the second sub-amplifier circuit, and the negative terminal of the last diode is connected to the negative terminal of the last diode in the first protection component. The first common component includes several diodes connected in forward series. The positive terminals of the diodes at the beginning are connected to the negative terminals of the diodes at the end of the first protection component and the diodes at the end of the second protection component, respectively. The negative terminals of the diodes at the end are grounded.

2. The electrostatic discharge protection circuit according to claim 1, characterized in that, Also includes: The third protection component includes several diodes connected in forward series. The positive terminal of the first diode is connected to the power supply port of the third sub-amplifier circuit, and the negative terminal of the last diode is connected to the positive terminal of any one of the diodes in the first common component.

3. A power amplifier, characterized in that, include: Several sub-amplifier circuits; Electrostatic discharge protection circuit, including: The first protection component includes several diodes connected in forward series, with the positive terminal of the first diode connected to the power supply port of the first sub-amplifier circuit; The second protection component includes several diodes connected in forward series. The positive terminal of the first diode is connected to the power supply port of the second sub-amplifier circuit, and the negative terminal of the last diode is connected to the negative terminal of the last diode in the first protection component. The first common component includes several diodes connected in forward series. The positive terminals of the diodes at the beginning are connected to the negative terminals of the diodes at the end of the first protection component and the diodes at the end of the second protection component, respectively. The negative terminals of the diodes at the end are grounded.

4. The power amplifier according to claim 3, characterized in that, The power amplifier includes a first frequency band amplifier circuit, which includes a first stage sub-amplifier circuit and a first stage sub-amplifier circuit connected in sequence. The plurality of sub-amplifier circuits include the first stage sub-amplifier circuit and the first stage sub-amplifier circuit. The anode of the diode at the beginning of the first protection component is connected to the power supply port of the first stage sub-amplifier circuit, and the anode of the diode at the beginning of the second protection component is connected to the power supply port of the first stage sub-amplifier circuit.

5. The power amplifier according to claim 3, characterized in that, The power amplifier includes a first frequency band amplifier circuit and a second frequency band amplifier circuit. The first frequency band amplifier circuit includes a first-stage sub-amplifier circuit and a first-stage sub-amplifier circuit connected in sequence. The second frequency band amplifier circuit includes a second-stage sub-amplifier circuit and a second-stage sub-amplifier circuit connected in sequence. The plurality of sub-amplifier circuits include the first-stage sub-amplifier circuit, the first-stage sub-amplifier circuit, the second-stage sub-amplifier circuit, and the second-stage sub-amplifier circuit. The power supply ports of any two circuits in the first-stage sub-amplifier circuit, the first-stage sub-amplifier circuit, the second-stage sub-amplifier circuit, and the second-stage sub-amplifier circuit are respectively connected to the positive terminal of the diode at the beginning of the first protection component and the positive terminal of the diode at the beginning of the second protection component.

6. The power amplifier according to claim 3, characterized in that, The electrostatic discharge protection circuit also includes: The third protection component includes several diodes connected in forward series. The positive terminal of the first diode is connected to the power supply port of the third sub-amplifier circuit, and the negative terminal of the last diode is connected to the positive terminal of any one of the diodes in the first common component.

7. The power amplifier according to claim 6, characterized in that, The power amplifier includes a first frequency band amplifier circuit, a second frequency band amplifier circuit, and a third frequency band amplifier circuit. The first frequency band amplifier circuit includes a first-stage sub-amplifier circuit and a first-stage sub-amplifier circuit connected in sequence. The second frequency band amplifier circuit includes a second-stage sub-amplifier circuit and a second-stage sub-amplifier circuit connected in sequence. The third frequency band amplifier circuit includes a third-stage sub-amplifier circuit and a third-stage sub-amplifier circuit connected in sequence. The plurality of sub-amplifier circuits include the first-stage sub-amplifier circuit, the first-stage sub-amplifier circuit, the second-stage sub-amplifier circuit, the second-stage sub-amplifier circuit, the third-stage sub-amplifier circuit, and the third-stage sub-amplifier circuit. The power supply ports of any three circuits among the first-stage sub-amplifier circuit, the first-stage sub-amplifier circuit, the second-stage sub-amplifier circuit, the third-stage sub-amplifier circuit, and the third-stage sub-amplifier circuit are respectively connected to the positive terminal of the diode at the beginning of the first protection component, the positive terminal of the diode at the beginning of the second protection component, and the positive terminal of the diode at the beginning of the third protection component.

8. The power amplifier according to claim 7, characterized in that, The power supply ports of the first secondary sub-amplifier circuit, the second secondary sub-amplifier circuit, and the third secondary sub-amplifier circuit are respectively connected to the positive terminal of the diode at the beginning of the first protection component, the positive terminal of the diode at the beginning of the second protection component, and the positive terminal of the diode at the beginning of the third protection component. The electrostatic discharge protection circuit also includes: The fourth protection component includes several diodes connected in forward series, with the positive terminal of the first diode connected to the power supply port of the first stage sub-amplifier circuit. The fifth protection component includes several diodes connected in forward series. The positive terminal of the first diode is connected to the power supply port of the second stage sub-amplifier circuit, and the negative terminal of the last diode is connected to the negative terminal of the last diode in the fourth protection component. The second common component includes several diodes connected in forward series. The positive terminal of the first diode is connected to the negative terminal of the second diode in the fourth protection component and the negative terminal of the second diode in the fifth protection component, respectively. The negative terminal of the second diode is grounded. The sixth protection component includes several diodes connected in forward series. The positive terminal of the first diode is connected to the power supply port of the third stage sub-amplifier circuit, and the negative terminal of the last diode is connected to the positive terminal of any one of the diodes in the second common component.

9. The power amplifier according to claim 3, characterized in that, The power amplifier includes a first frequency band amplifier circuit and a second frequency band amplifier circuit. The first frequency band amplifier circuit includes a first sub-amplifier circuit, and the second frequency band amplifier circuit includes a second sub-amplifier circuit. The plurality of sub-amplifier circuits include the first sub-amplifier circuit and the second sub-amplifier circuit. The anode of the diode at the beginning of the first protection component is connected to the power supply port of the first sub-amplifier circuit, and the anode of the diode at the beginning of the second protection component is connected to the power supply port of the second sub-amplifier circuit.

10. The power amplifier according to claim 6, characterized in that, The power amplifier includes a first frequency band amplifier circuit, a second frequency band amplifier circuit, and a third frequency band amplifier circuit. The first frequency band amplifier circuit includes a first sub-amplifier circuit, the second frequency band amplifier circuit includes a second sub-amplifier circuit, and the third frequency band amplifier circuit includes a third sub-amplifier circuit. A plurality of the sub-amplifier circuits include the first sub-amplifier circuit, the second sub-amplifier circuit, and the third sub-amplifier circuit. The anode of the diode at the beginning of the first protection component is connected to the power supply port of the first sub-amplifier circuit. The anode of the diode at the beginning of the second protection component is connected to the power supply port of the second sub-amplifier circuit. The anode of the diode at the beginning of the third protection component is connected to the power supply port of the third sub-amplifier circuit.

11. A power amplifier module, characterized in that, Includes the power amplifier as described in any one of claims 3 to 10.