Circuit board over-temperature protection method, circuit board, electronic device, and medium

Abstract

The application discloses a circuit board over-temperature protection method, a circuit board, an electronic device and a medium, relates to the technical field of packaging circuit boards, and the circuit board comprises a copper bar, a first temperature sensor, and a circuit substrate etched with circuit traces. The first temperature sensor is arranged on the circuit substrate close to a position of the copper bar. The copper bar is connected with the circuit traces through a copper bar lap joint point on the circuit substrate. The circuit traces are also used for conducting heat generated at the copper bar lap joint point to the first temperature sensor. The circuit board over-temperature protection method comprises the following steps: obtaining a target temperature value at the copper bar lap joint point based on the first temperature sensor; and performing an over-temperature protection operation on the circuit board based on the target temperature value. The application can perform over-temperature protection on the circuit board.

Description

Technical Field

[0001] This application relates to the field of PCB (Printed Circuit Board) technology, and in particular to over-temperature protection methods for circuit boards, circuit boards, electronic devices, and media. Background Technology

[0002] With the rapid development of information technology, the demand for data processing and computing power in server products is constantly increasing, especially for GPU (Graphics Processing Unit) servers, which are widely used in high-performance computing, artificial intelligence, and other fields due to their powerful parallel processing capabilities. However, the high performance of GPU servers also brings the problem of high power consumption, with power consumption reaching over 10,000 watts. To meet such high power supply requirements, the power supply current in the circuit reaches over 1000A.

[0003] Traditional PCBs (Printed Circuit Boards) have limitations in transmitting high currents and cannot meet the demands of high-current transmission. Therefore, copper busbars are widely used in the industry as a solution for high-current transmission. The copper busbars are fixed to the PCB using screws or soldering to achieve stable high-current transmission. However, in practical applications, poor contact at the interface between the copper busbar and the PCB is prone to occur. Poor contact leads to increased contact resistance, which in turn causes overheating at the interface. Over time, this overheating accumulates and may eventually cause the PCB to catch fire, seriously threatening the safe operation of the equipment.

[0004] Currently, the industry mainly addresses these issues by increasing the lap strength. This is achieved by improving screw fixing methods and increasing contact area (e.g., increasing welding area or bolt fixing area) to reduce contact resistance and thus minimize overheating. However, these methods still pose certain safety hazards due to insufficient copper busbar lap or poor contact caused by vibration, and do not fundamentally solve the overheating problem caused by poor lap. Summary of the Invention

[0005] The main purpose of this application is to provide a circuit board over-temperature protection method, circuit board, electronic device and medium, which aims to solve the technical problem of PCB board over-temperature or fire caused by poor overlap in related technologies.

[0006] To achieve the above objectives, this application provides a method for over-temperature protection of a circuit board. The circuit board includes a copper busbar, a first temperature sensor, and a circuit board with etched circuit traces. The first temperature sensor is disposed on the circuit board near the copper busbar. The copper busbar is connected to the circuit traces through a copper busbar overlap point on the circuit board. The circuit traces are also used to conduct heat generated at the copper busbar overlap point to the first temperature sensor. The method includes:

[0007] The target temperature value at the copper busbar overlap point is obtained based on the first temperature sensor;

[0008] Based on the target temperature value, an over-temperature protection operation is performed on the circuit board.

[0009] In addition, to achieve the above objectives, this application also provides a circuit board, including: a copper busbar, a first temperature sensor, a circuit board with etched circuit traces, and a control unit;

[0010] The first temperature sensor is located on the circuit board near the copper busbar;

[0011] The copper busbar is connected to the circuit traces through the copper busbar overlap points on the circuit board. The circuit traces are also used to conduct the heat generated at the copper busbar overlap points to the first temperature sensor.

[0012] The control unit is configured to acquire a target temperature value at the copper busbar connection point based on the first temperature sensor; and to perform over-temperature protection operation on the circuit board based on the target temperature value.

[0013] In addition, to achieve the above objectives, this application also provides an electronic device, which includes a circuit board, a memory, a processor, and a circuit board over-temperature protection program stored in the memory and executable on the processor, wherein the circuit board over-temperature protection program implements the circuit board over-temperature protection method as described above when executed by the processor.

[0014] In addition, to achieve the above objectives, this application also provides a computer-readable storage medium storing a circuit board over-temperature protection program, which, when executed by a processor, implements the circuit board over-temperature protection method as described above.

[0015] In addition, to achieve the above objectives, this application also provides a computer program product, which includes a circuit board over-temperature protection program. When the circuit board over-temperature protection program is executed by a processor, it implements the steps of the circuit board over-temperature protection method as described above.

[0016] This application provides a circuit board over-temperature protection method, circuit board, electronic device, and medium. The circuit board includes a copper busbar, a first temperature sensor, and a circuit board with etched circuit traces. The first temperature sensor is located on the circuit board near the copper busbar. The copper busbar is connected to the circuit traces through a copper busbar overlap point on the circuit board. The circuit traces also conduct heat generated at the copper busbar overlap point to the first temperature sensor. The circuit board over-temperature protection method of this application obtains a target temperature value at the copper busbar overlap point based on the first temperature sensor and performs over-temperature protection operations on the circuit board based on the target temperature value. This allows the application to continuously monitor the overlap status between the copper busbar and the PCB by arranging a temperature sensing network at key connection points. Once an abnormal temperature rise is detected, the system will immediately take action, such as outputting a preset alarm message or automatically cutting off the power supply to the relevant circuits, to prevent potential problems and improve the safety of equipment operation. This effectively solves the technical problem of PCB over-temperature or fire caused by poor overlap in related technologies. Attached Figure Description

[0017] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0018] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0019] Figure 1 This is a flowchart illustrating the circuit board over-temperature protection method in the embodiments of this application;

[0020] Figure 2 This is a schematic diagram of the structure of the first embodiment of the circuit board in this application;

[0021] Figure 3 This is a schematic diagram of the structure of the second embodiment of the circuit board in this application;

[0022] Figure 4 This is a schematic diagram of the structure of the third embodiment of the circuit board in this application;

[0023] Figure 5 This is a schematic diagram of the structure of the fourth embodiment of the circuit board in this application;

[0024] Figure 6 This is a schematic diagram of the hardware circuit in a specific embodiment of this application;

[0025] Figure 7 This is a schematic diagram showing the position of the first temperature sensor in a specific embodiment of this application;

[0026] Figure 8 This is a flowchart illustrating a circuit board over-temperature protection method in a specific embodiment of this application;

[0027] Figure 9 This is a schematic diagram of the device structure of the hardware operating environment involved in the circuit board over-temperature protection method in this application embodiment.

[0028] Explanation of icon numbers:

[0029] label name label name 100 circuit board 9 Second circuit network layer 1 copper busbar 11 Power busbar 2 First temperature sensor 12 grounding copper busbar 3 Circuit board 21 Third temperature sensor 4 Control Unit 22 Fourth temperature sensor 5 Copper busbar joint 51 Power connection point 6 power supply 52 Grounding connection point 7 Second temperature sensor A1 Power supply backplate 8 First circuit network layer

[0030] The purpose, features, and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0031] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0032] It should be understood that the specific embodiments described herein are merely illustrative of the technical solutions of this application and are not intended to limit this application.

[0033] Currently, the industry mainly adopts the method of improving the lap joint strength by improving the screw fixing method and increasing the contact area (such as increasing the welding area or increasing the bolt fixing area) to reduce the contact resistance and reduce the occurrence of overheating.

[0034] However, due to the difference in thermal expansion coefficients between the copper busbar and the PCB board, the heat generated during equipment operation causes the temperature to rise. The thermal expansion of the different materials can lead to gaps at the originally tightly contacted interface. In addition, external factors such as vibration or impact during equipment operation can cause the connection between the copper busbar and the PCB to loosen. Even with more robust fixing methods, it is impossible to completely avoid poor contact between the copper busbar and the PCB. Furthermore, with long-term use, the connection between the copper busbar and the PCB will gradually deteriorate due to oxidation and corrosion, further increasing the contact resistance. Ultimately, overheating at the copper busbar contact point can cause the PCB to catch fire.

[0035] The main solution of this application embodiment is a circuit board over-temperature protection method. The circuit board includes a copper busbar, a first temperature sensor, and a circuit board with etched circuit traces. The first temperature sensor is disposed on the circuit board near the copper busbar. The copper busbar is connected to the circuit traces through a copper busbar overlap point on the circuit board. The circuit traces are also used to conduct heat generated at the copper busbar overlap point to the first temperature sensor. The method includes: obtaining a target temperature value at the copper busbar overlap point based on the first temperature sensor; and performing an over-temperature protection operation on the circuit board based on the target temperature value.

[0036] This application embodiment achieves continuous monitoring of the overlap between the copper busbar and the PCB by arranging a temperature sensing network at key connection points. Once an abnormal temperature rise is detected, the system will immediately take action to automatically cut off the power supply to the relevant circuits to prevent potential hazards, thereby improving the safety of equipment operation and effectively solving the technical problem of overheating or fire caused by poor PCB overlap in related technologies.

[0037] To better understand the technical solution of this application, a detailed description will be provided below in conjunction with the accompanying drawings and specific implementation methods.

[0038] Please refer to Figure 1 , Figure 1 This is a flowchart illustrating the circuit board over-temperature protection method in the embodiments of this application.

[0039] In this embodiment, the circuit board includes a copper busbar, a first temperature sensor, and a circuit board with etched circuit traces. The first temperature sensor is disposed on the circuit board near the copper busbar. The copper busbar is connected to the circuit traces through a copper busbar overlap point on the circuit board. The circuit traces are also used to conduct heat generated at the copper busbar overlap point to the first temperature sensor. The circuit board over-temperature protection method includes steps S100 to S200:

[0040] Step S100: Obtain the target temperature value at the copper busbar joint based on the first temperature sensor.

[0041] Step S200: Based on the target temperature value, perform over-temperature protection operation on the circuit board.

[0042] Those skilled in the art will know that a copper busbar connection point refers to the connection area between the copper busbar and the circuit board. The current supplied by the power supply flows through the copper busbar connection point, from the copper busbar into the circuit trace, forming a current loop to power the circuit components on the circuit board.

[0043] It should be noted that, in this embodiment, the target temperature value refers to the temperature at the copper busbar overlap point, and the first temperature sensor is a temperature sensor used to detect the target temperature value.

[0044] It is understandable that, since the copper busbar overlap point is tightly connected to the copper busbar, when the first temperature sensor, which is positioned close to the copper busbar, is also close to the copper busbar overlap point, the temperature at the copper busbar overlap point can be directly detected by the first temperature sensor, thereby obtaining the target temperature value. In this embodiment, by placing the first temperature sensor on the circuit board close to the copper busbar, the distance between the copper busbar overlap point and the first temperature sensor is prevented from being too far. This avoids excessively long circuit traces connecting the copper busbar overlap point and the first temperature sensor, effectively preventing significant heat loss during the process of heat being conducted from the copper busbar overlap point to the first temperature sensor.

[0045] It is easy to understand that, in order to ensure the accuracy of the target temperature value detected by the first temperature sensor, the distance between the first temperature sensor and the copper busbar should be less than a certain distance threshold. This distance threshold can be flexibly set according to factors such as the performance of the first temperature sensor, the structure of the copper busbar and the copper busbar connection point on the circuit board, the medium between the first temperature sensor and the copper busbar, and user requirements. This embodiment does not impose specific limitations on it.

[0046] It should be noted that the circuit traces can be made of copper; that is, the circuit traces are generally made of copper. Those skilled in the art will understand that since the circuit trace material is a good thermal conductor, and one end of the circuit trace connects to the copper busbar junction, it can effectively conduct the heat generated at the copper busbar junction. Therefore, in this embodiment, the first temperature sensor can be placed near the circuit trace, and the heat generated at the copper busbar junction can be conducted to the first temperature sensor through the circuit trace, thereby ensuring the accurate detection of the target temperature value. Furthermore, by additionally providing a dedicated thermal conductor between the first temperature sensor and the copper busbar or the copper busbar junction, the accuracy of the target temperature value detection can be further ensured.

[0047] In this embodiment, the over-temperature protection operation is a protective operation used to prevent the circuit board from overheating, which could lead to circuit board failure, damage, or fire.

[0048] For example, in one feasible implementation, step S200, which involves performing over-temperature protection on the circuit board based on the target temperature value, may include steps S210 to S220:

[0049] Step S210: If the target temperature value is greater than the first preset temperature threshold, perform the power-off operation in the over-temperature protection operation on the circuit board.

[0050] It should be noted that in this embodiment, the over-temperature protection operation includes a power-off operation, which is a protection operation that prevents the copper busbar connection point from overheating and causing the circuit board to catch fire by power-off. The first preset temperature threshold is an upper temperature limit value used to determine whether a power-off operation needs to be performed on the circuit board.

[0051] In this embodiment, when the target temperature value is greater than the first preset temperature threshold, the circuit board is at risk of catching fire due to overheating of the copper busbar connection. It is necessary to perform a power-off operation in time to cut off the current circuit of the circuit board, prevent the copper busbar connection from continuing to overheat and causing the circuit board to catch fire, and ensure the safety and reliability of the equipment.

[0052] In this embodiment, the first temperature sensor continuously monitors the target temperature value at the copper busbar connection point and transmits the collected target temperature value to the control unit. After receiving the target temperature value, the control unit compares it with the first preset temperature threshold. If the target temperature value is greater than the first preset temperature threshold, the current circuit is cut off by a relay or other power-off device to perform a power-off operation.

[0053] Before performing a power-off operation, this implementation can also send power-off protection information to the user via indicator lights, a display screen, or a network interface, prompting the user that a power-off protection mechanism for the circuit board is about to be activated. This assists the user in taking additional safety measures, such as immediately saving files being edited or closing important applications, to reduce losses caused by a sudden power outage. Simultaneously, this intuitive notification method informs the user of changes in the circuit board's status, allowing them to better understand the board's operational status, thereby improving the user experience and making the device feel more intelligent and reliable.

[0054] It is worth mentioning that after a power outage, the first temperature sensor can maintain the detection of the target temperature value, and automatically reset to restore power to the circuit board after the target temperature value drops to a safe range, or prompt the user to manually reset by sending a power outage protection message to the user.

[0055] This implementation method effectively avoids circuit board fires caused by poor copper busbar connections by monitoring the temperature changes of key parts of the circuit board in real time and automatically cutting off power when necessary. It also reduces component damage caused by high temperatures, extends the service life of the circuit board, and greatly improves the safety performance of the equipment. Thus, it can significantly improve the safety and reliability of electronic devices in high-current applications without drastically changing the original design.

[0056] This embodiment acquires the target temperature value at the copper busbar overlap point detected by a first temperature sensor. If the target temperature value exceeds a first preset temperature threshold, a power-off operation is performed on the circuit board. This allows for continuous monitoring of the overlap between the copper busbar and the PCB by arranging a temperature sensing network at critical connection points. Upon detecting any abnormal temperature rise, the system immediately takes action, automatically cutting off the power supply to the relevant circuits to prevent potential hazards. This improves the safety of equipment operation and effectively solves the technical problem of PCB overheating or fire caused by poor overlap in related technologies.

[0057] It should be noted that the first preset temperature threshold in this embodiment can be a fixed value set in advance, or it can be a threshold that can be changed continuously according to the actual situation.

[0058] Step S220: When the target temperature value is greater than the second preset temperature threshold and less than the first preset temperature threshold, output alarm information in the over-temperature protection operation, wherein the second preset temperature threshold is less than the first preset temperature threshold.

[0059] It should be noted that in this embodiment, the over-temperature protection operation also includes outputting an alarm message. This alarm message is used to alert the user that the copper busbar temperature is too high, posing a risk of circuit board damage. A second preset temperature threshold is used to determine whether an alarm message needs to be generated. This second preset temperature threshold is lower than the first preset temperature threshold.

[0060] In this embodiment, the alarm message indicates a risk of circuit board damage due to excessively high copper busbar temperature. The alarm message may also include specific operational suggestions for addressing the excessively high copper busbar temperature, such as reducing equipment load, increasing heat dissipation measures, or performing inspection and maintenance, thereby assisting the user in taking quick action to prevent circuit board damage.

[0061] It is understood that this implementation method can convey the generated alarm information to the user in various ways (such as indicator light flashing, display screen, voice broadcast, SMS email, etc.) to ensure that the user can intuitively understand the status of the circuit board and take corresponding measures to reduce the possible losses caused by excessive copper busbar temperature.

[0062] In this embodiment, the control unit compares the target temperature value with a second preset temperature threshold and a first preset temperature value. When the target temperature value is less than or equal to the second preset temperature threshold, it indicates that the copper busbar temperature is within a safe range and will not cause damage to the circuit board, let alone cause it to catch fire. In this case, no action is required. When the target temperature value is greater than the second preset temperature threshold but less than the first preset temperature threshold, it indicates that the copper busbar temperature may cause damage to the circuit board, but has not yet reached the point of causing it to catch fire. At this time, a warning message is generated to inform the user of the risk, and the user decides whether to take appropriate cooling measures. If the user does not take effective measures to reduce the copper busbar temperature, causing the target temperature value to further increase and eventually exceed the first preset temperature threshold, then there is a risk of the circuit board catching fire. In this case, the control unit generates a power-off signal and automatically performs a power-off operation on the circuit board to prevent it from catching fire.

[0063] This embodiment introduces a second preset temperature threshold and generates alarm prompts, reasonably sets the second preset temperature threshold, reduces false alarms caused by temperature fluctuations, improves the stability and reliability of the circuit board over-temperature protection, and further improves the circuit board over-temperature protection mechanism.

[0064] This implementation method forms a dual protection mechanism through a second preset temperature threshold and a first preset temperature threshold, ensuring that corresponding protective measures can be taken in a timely manner at different temperature levels. This allows the system to generate alarm messages when the temperature approaches a dangerous level, reminding users to pay attention to the condition of the circuit board and take timely measures to resolve the overheating of the circuit board. This prevents the target temperature value from rising further and causing the circuit board to catch fire and burn, reducing losses caused by overheating. It ensures that the circuit board operates stably and safely under various environmental conditions, providing more comprehensive protection for the safe operation of high-performance electronic devices in high-current applications.

[0065] Furthermore, in one feasible embodiment, the circuit board further includes a second temperature sensor, and the circuit board over-temperature protection method further includes steps A10 to A20:

[0066] Step A10: Obtain the current ambient temperature value based on the second temperature sensor.

[0067] Step A20: Based on the current ambient temperature value and the preset first copper busbar temperature threshold and the preset second copper busbar temperature threshold, determine the first preset temperature threshold and the second preset temperature threshold, wherein the first preset temperature threshold and the second preset temperature threshold are both positively correlated with the current ambient temperature value, and the second copper busbar temperature threshold is less than the first copper busbar temperature threshold.

[0068] In this embodiment, the current ambient temperature value represents the temperature of the environment surrounding the circuit board under the current operating conditions, and the second temperature sensor is a temperature sensor used to detect the current ambient temperature value.

[0069] It should be noted that in this embodiment, a standard ambient temperature value is pre-defined, which represents the temperature of the environment surrounding the circuit board under standard operating conditions. The first copper busbar temperature threshold refers to the highest temperature that the copper busbar can reach without causing the circuit board to overheat and burn out when the ambient temperature (i.e., the temperature of the environment surrounding the circuit board) is the current ambient temperature value. The second copper busbar temperature threshold refers to the highest temperature that the copper busbar can reach without causing the circuit board to malfunction or be damaged due to overheating when the ambient temperature is the current ambient temperature value.

[0070] In this embodiment, the first copper busbar temperature threshold is positively correlated with the current ambient temperature; that is, the higher the current ambient temperature, the higher the calculated first copper busbar temperature threshold. Furthermore, the second copper busbar temperature threshold is also positively correlated with the current ambient temperature; that is, the higher the current ambient temperature, the higher the calculated second copper busbar temperature threshold.

[0071] It is worth mentioning that, in one feasible implementation, step A20, which involves determining the first preset temperature threshold and the second preset temperature threshold based on the current ambient temperature value and the preset first copper busbar temperature threshold and the preset second copper busbar temperature threshold, may include steps A21 to A22:

[0072] Step A21: Calculate the first preset temperature threshold based on the current ambient temperature value and the preset first copper busbar temperature threshold;

[0073] In one embodiment, when the current ambient temperature is a standard ambient temperature value, if the temperature of the copper busbar exceeds the first copper busbar temperature threshold, it indicates that the circuit board is at risk of catching fire due to overheating of the copper busbar connection points, requiring immediate power-off protection. Therefore, when the ambient temperature is a standard ambient temperature value, the first copper busbar temperature threshold can be directly used as the first preset temperature threshold to determine whether a power-off operation is necessary. When the current ambient temperature is not a standard ambient temperature value, the first preset temperature threshold under the current operating conditions can be calculated using a preset formula for calculating the first preset temperature threshold, combined with the current ambient temperature value and the first copper busbar temperature threshold.

[0074] For example, the formula for calculating the first preset temperature threshold can be: First preset temperature threshold = Current ambient temperature value / Standard ambient temperature value * First copper busbar temperature threshold.

[0075] It should be noted that, in this embodiment, multiple experiments can be conducted to measure the temperature of the copper busbar that would cause the circuit board to catch fire when the ambient temperature is at the standard ambient temperature, thereby calibrating the first copper busbar temperature threshold. Correspondingly, multiple experiments can also be conducted to measure the temperature of the copper busbar at other ambient temperatures that would cause the circuit board to catch fire, thereby fitting a formula for calculating the first preset temperature threshold. This embodiment does not impose specific limitations.

[0076] It is easy to understand that, in addition to determining the first preset temperature threshold by fitting the calculation formula of the first preset temperature threshold, the first preset temperature threshold can also be determined by constructing a mapping table between the ambient temperature and the first preset temperature threshold, or by training a model that can predict the first preset temperature threshold based on the ambient temperature.

[0077] Step A22: Based on the current ambient temperature value and the preset second copper busbar temperature threshold, calculate the second preset temperature threshold, wherein the second copper busbar temperature threshold is less than the first copper busbar temperature threshold.

[0078] In one embodiment, when the current ambient temperature is the standard ambient temperature value, if the temperature of the copper busbar exceeds the second copper busbar temperature threshold, it indicates that the circuit board is at risk of failure and damage due to overheating of the copper busbar connection point. An alarm message needs to be generated to prompt the user to take timely cooling measures to prevent the circuit board from failing due to overheating. Therefore, when the ambient temperature is the standard ambient temperature value, the second copper busbar temperature threshold can be directly used as the second preset temperature threshold to determine whether an alarm message needs to be generated. When the current ambient temperature is not the standard ambient temperature value, the second preset temperature threshold under the current operating conditions can be calculated using a preset formula for calculating the second preset temperature threshold, combined with the current ambient temperature value and the second copper busbar temperature threshold.

[0079] For example, the formula for calculating the second preset temperature threshold can be: Second preset temperature threshold = Current ambient temperature value / Standard ambient temperature value * Second copper busbar temperature threshold.

[0080] It should be noted that in this embodiment, multiple experiments can be conducted to measure the temperature of the copper busbar that would cause circuit board failure and damage when the ambient temperature is at the standard ambient temperature value, thereby calibrating the second copper busbar temperature threshold. Correspondingly, multiple experiments can also be conducted to measure the temperature of the copper busbar at other ambient temperatures that would cause circuit board failure and damage, thereby fitting a calculation formula for the second preset temperature threshold. This embodiment does not impose specific limitations.

[0081] It is easy to understand that, in addition to determining the second preset temperature threshold by fitting the calculation formula of the second preset temperature threshold, the second preset temperature threshold can also be determined by constructing a mapping table between the ambient temperature and the second preset temperature threshold, or by training a model that can predict the second preset temperature threshold based on the ambient temperature.

[0082] This implementation takes into account that the thermal behavior and heat dissipation capacity of copper busbars vary under different ambient temperatures, resulting in different temperatures at which circuit board failures and fires occur. By introducing a second temperature sensor, the system dynamically calculates the first and second preset temperature thresholds. This allows the system to flexibly adjust the first and second preset temperature thresholds according to changes in the current ambient temperature, avoiding the failure of fixed thresholds due to ambient temperature changes, which could lead to false alarms or missed alarms. This more accurately identifies the risk of circuit board failure or even fire due to overheating at the copper busbar connection points. When there is a risk of failure, the system outputs an alarm message during overheat protection, prompting the user to take timely cooling measures to effectively prevent failures caused by overheating and extend the lifespan of the circuit board. When there is a risk of fire, the system performs a power-off operation during overheat protection, providing timely power protection and effectively preventing fire risks caused by overheating. This ensures the safety of equipment and operators, significantly improving the system's adaptability and reliability, and providing strong protection for the safe operation of high-performance electronic equipment in high-current applications.

[0083] In addition, this application also provides a circuit board 100, please refer to Figure 2 , Figure 2 This is a schematic diagram of the structure of the circuit board 100 in the first embodiment of this application.

[0084] In this embodiment, the circuit board 100 includes: a copper busbar 1, a first temperature sensor 2, a circuit board 3 with etched circuit traces, and a control unit 4; the first temperature sensor 2 is disposed on the circuit board 3 near the copper busbar 1; the copper busbar 1 is connected to the circuit traces through a copper busbar overlap point 5 on the circuit board 3, and the circuit traces are also used to conduct the heat generated at the copper busbar overlap point 5 to the first temperature sensor 2; the control unit 4 is configured to obtain the target temperature value at the copper busbar overlap point 5 based on the first temperature sensor 2; and to perform over-temperature protection operation on the circuit board 100 based on the target temperature value.

[0085] The circuit board 100 provided in this embodiment employs the circuit board over-temperature protection method described in the above embodiments, which can solve the technical problem of PCB boards overheating or catching fire due to poor overlap in related technologies. Compared with the prior art, the beneficial effects of the circuit board 100 provided in this application are the same as those of the circuit board over-temperature protection method provided in the above embodiments, and other technical features of the circuit board 100 are the same as those disclosed in the circuit board over-temperature protection method provided in the above embodiments, and will not be repeated here.

[0086] Based on the circuit board 100 of the first embodiment described above, a circuit board 100 of the second embodiment of this application is proposed.

[0087] Please refer to Figure 3 , Figure 3 This is a schematic diagram of the structure of the second embodiment of the circuit board 100 in this application.

[0088] In this embodiment, the circuit board 100 further includes a second temperature sensor 7; the control unit 4 is further configured to: perform a power-off operation in the over-temperature protection operation on the circuit board 100 when the target temperature value is greater than the first preset temperature threshold; and output alarm information in the over-temperature protection operation when the target temperature value is greater than the second preset temperature threshold and less than the first preset temperature threshold, wherein the second preset temperature threshold is less than the first preset temperature threshold; wherein the current ambient temperature value is obtained based on the second temperature sensor 7; and the first preset temperature threshold and the second preset temperature threshold are determined based on the current ambient temperature value and the preset first copper busbar temperature threshold and the preset second copper busbar temperature threshold, respectively, wherein both the first preset temperature threshold and the second preset temperature threshold are positively correlated with the current ambient temperature value, and the second copper busbar temperature threshold is less than the first copper busbar temperature threshold.

[0089] The circuit board 100 provided in this embodiment employs the circuit board over-temperature protection method described in the above embodiments, which can solve the technical problem of PCB boards overheating or catching fire due to poor overlap in related technologies. Compared with the prior art, the beneficial effects of the circuit board 100 provided in this application are the same as those of the circuit board over-temperature protection method provided in the above embodiments, and other technical features of the circuit board 100 are the same as those disclosed in the circuit board over-temperature protection method provided in the above embodiments, and will not be repeated here.

[0090] Based on the circuit board 100 of the first embodiment described above, a circuit board 100 of the third embodiment of this application is proposed.

[0091] Please refer to Figure 4 , Figure 4 This is a schematic diagram of the structure of the circuit board 100 in the third embodiment of this application.

[0092] In this embodiment, the circuit board 100 includes at least two copper busbars 1, wherein at least one temperature sensor is disposed on the circuit board 3 near each copper busbar 1.

[0093] In this embodiment, the circuit board 100 includes at least two copper busbars 1. Considering that each copper busbar 1 may experience overheating, this embodiment specifically provides at least one temperature sensor on the circuit board 3 near each copper busbar 1 to detect the target temperature value at the copper busbar overlap point 5 corresponding to each copper busbar 1, so as to prevent the target temperature value at a certain copper busbar overlap point 5 from being too high, which could cause the circuit board 100 to malfunction, be damaged, or even catch fire and burn.

[0094] In this embodiment, at least one temperature sensor is provided on the circuit board 3 near each copper busbar 1 to ensure that the temperature of all copper busbar joints 5 in the circuit board 100 can be monitored in real time, avoiding missed detection of temperature anomalies due to insufficient monitoring at a single point, and improving the monitoring coverage of the over-temperature protection of the circuit board 100.

[0095] Furthermore, in one feasible embodiment, the copper busbar 1 includes a power copper busbar 11 and a ground copper busbar 12, and at least two copper busbars 1 include at least one power copper busbar 11 and at least one ground copper busbar 12; the first temperature sensor 2 includes a third temperature sensor 21 disposed on the circuit board 3 near the power copper busbar 11, and a fourth temperature sensor 22 disposed on the circuit board 3 near the ground copper busbar 12.

[0096] It should be noted that the power busbar 11 is a copper busbar 1 used to transmit current from the power supply. Typically, one end is connected to the positive terminal of the power supply 6, and the other end is connected to the power contact point 51 on the circuit board 100, thereby providing a stable power supply to the circuit board 100 and ensuring efficient and stable current transmission to the circuit components on the circuit board 3. The grounding busbar 12 is a copper busbar 1 used for grounding. Typically, one end is connected to the negative terminal of the power supply 6, and the other end is connected to the grounding contact point 52 on the circuit board 100, thereby ensuring a low-impedance path between the negative terminal of the power supply 6 and the circuit board 100, forming a closed current loop, and providing a stable ground reference point for the circuit board 100, reducing electromagnetic interference, improving circuit reliability and safety, and preventing electric shock accidents. Specifically, the power contact point 51 is the copper busbar contact point 5 on the circuit board 3 used to connect to the power busbar 11, and the grounding contact point 52 is the copper busbar contact point 5 on the circuit board 3 used to connect to the grounding busbar 12.

[0097] It should also be noted that the third temperature sensor 21 is a temperature sensor used to detect the target temperature value at the power connection point 51, while the fourth temperature sensor 22 is a temperature sensor used to detect the target temperature value at the ground connection point 52.

[0098] In this embodiment, at least two copper busbars 1 of the circuit board 100 include at least one power copper busbar 11 and at least one ground copper busbar 12, so that current flows out from the power supply 6, flows through the power copper busbar 11 into the circuit traces etched on the circuit substrate 3, conducts to the circuit elements on the circuit substrate 3, and achieves ground protection through the ground copper busbar 12, thereby providing the circuit board 100 with stable and efficient current and a reliable ground reference point.

[0099] Accordingly, in this embodiment, in order to ensure that the temperature of all power connection points 51 and ground connection points 52 in the circuit board 100 can be monitored in real time, at least one third temperature sensor 21 is provided near each power copper busbar 11 on the circuit board 3, and at least one fourth temperature sensor 22 is provided near each ground copper busbar 12 on the circuit board 3, in order to detect the target temperature value at each power connection point 51 and ground connection point 52, so as to prevent the target temperature value at a certain power connection point 51 or ground connection point 52 from being too high, which would cause the circuit board 100 to malfunction, be damaged, or even catch fire and burn.

[0100] Based on the circuit board 100 of the third embodiment described above, a circuit board 100 of the fourth embodiment of this application is proposed.

[0101] Please refer to Figure 5 , Figure 5 This is a schematic diagram of the structure of the circuit board 100 in the fourth embodiment of this application.

[0102] In this embodiment, the circuit board 100 includes at least a first circuit network layer 8 and a second circuit network layer 9 stacked together. The first circuit network layer 8 is the circuit network layer corresponding to the power plane, and the second circuit network layer 9 is the circuit network layer corresponding to the ground plane. The power copper busbar 11 is disposed on the first circuit network layer 8. The distance between the third temperature sensor 21 and the power copper busbar 11 is less than a first distance, and the distance between the third temperature sensor 21 and the second circuit network layer 9 is greater than a second distance. The ground copper busbar 12 is disposed on the second circuit network layer 9. The distance between the fourth temperature sensor 22 and the ground copper busbar 12 is less than a third distance, and the distance between the fourth temperature sensor 22 and the first circuit network layer 8 is greater than a fourth distance.

[0103] As those skilled in the art will know, the power plane layer is a plane layer in a PCB specifically used to provide power. It is usually a large area of ​​copper foil used to efficiently transmit the current conducted from the power supply 6 through the power copper busbar 11, and to distribute the current to various circuit components on the circuit board 3 through circuit traces. The ground plane layer is a plane layer in a PCB used for grounding. It is usually a large area of ​​copper foil used to provide a stable ground reference point, reduce electromagnetic interference, and improve the safety and reliability of the circuit.

[0104] It is understood that a circuit network layer refers to a layer in a multi-layer PCB used for routing circuit traces and connecting various circuit components. Each circuit network layer can have different functions, such as a power plane layer, a ground plane layer, a signal layer, etc. In this embodiment, the PCB is a multi-layer design, including at least a first circuit network layer 8 and a second circuit network layer 9 stacked together, wherein the first circuit network layer 8 is the circuit network layer corresponding to the power plane layer, and the second circuit network layer 9 is the circuit network layer corresponding to the ground plane layer.

[0105] It is understood that the first circuit network layer 8 and the second circuit network layer 9 can be located on the same side of the circuit substrate 3 or on different sides of the circuit substrate 3.

[0106] In this embodiment, the power connection point 51 is located in the first circuit network layer 8. The power bus 11 is connected to the first circuit network layer 8 through the power connection point 51, thereby guiding the current provided by the power supply 6 into the first circuit network layer 8. The first circuit network layer 8 then distributes the current to each circuit element through circuit traces. Correspondingly, the ground connection point 52 is located in the second circuit network layer 9. The ground bus 12 is connected to the second circuit network layer 9 through the ground connection point 52, thereby providing a stable ground reference point for the circuit board 100.

[0107] It should also be noted that, in this embodiment, the first distance is the maximum allowable distance between the third temperature sensor 21 and the power bus 11. When the distance between the third temperature sensor 21 and the power bus 11 is greater than this first distance, the third temperature sensor 21 is too far from the power bus 11 and will not be able to accurately detect the target temperature value at the power connection point 51. The second distance is the minimum allowable distance between the third temperature sensor 21 and the second circuit network layer 9. When the distance between the third temperature sensor 21 and the second circuit network layer 9 is less than this second distance, the third temperature sensor 21 is too close to the second circuit network layer 9 and is easily affected by the heat from the second circuit network layer 9, causing the third temperature sensor 21 to be unable to accurately detect the target temperature value at the power connection point 51.

[0108] Correspondingly, the third distance is the maximum allowable distance between the fourth temperature sensor 22 and the grounding copper busbar 12. When the distance between the fourth temperature sensor 22 and the grounding copper busbar 12 is greater than this third distance, the fourth temperature sensor 22 is too far from the grounding copper busbar 12 and will not be able to accurately detect the target temperature value at the grounding connection point 52. The fourth distance is the minimum allowable distance between the fourth temperature sensor 22 and the first circuit network layer 8. When the distance between the fourth temperature sensor 22 and the first circuit network layer 8 is less than this fourth distance, the fourth temperature sensor 22 is too close to the first circuit network layer 8 and is easily affected by the heat from the first circuit network layer 8, causing the fourth temperature sensor 22 to be unable to accurately detect the target temperature value at the grounding connection point 52.

[0109] In this embodiment, the first distance is used to ensure that the third temperature sensor 21 can accurately monitor the change of the target temperature value at the power connection point 51, the second distance is used to prevent the third temperature sensor 21 from being affected by the second circuit network layer 9, and to ensure the accuracy of the target temperature value measurement at the power connection point 51, the third distance is used to ensure that the fourth temperature sensor 22 can accurately monitor the change of the target temperature value at the ground connection point 52, and the fourth distance is used to prevent the fourth temperature sensor 22 from being affected by the first circuit network layer 8, and to ensure the accuracy of the target temperature value measurement at the ground connection point 52.

[0110] For example, the first distance ranges from 15mm to 25mm. The second distance ranges from 1mm to 3mm. The third distance ranges from 15mm to 25mm. The fourth distance ranges from 1mm to 3mm.

[0111] This embodiment is designed for multi-layer PCBs. The first circuit network layer 8 corresponding to the power plane layer ensures uniform distribution of power current, reduces voltage drop and electromagnetic interference, and improves the stability and reliability of the power supply 6. The second circuit network layer 9 corresponding to the ground plane layer provides a stable ground reference point, reduces electromagnetic interference, improves the signal integrity and reliability of the circuit, and prevents electric shock accidents. Meanwhile, by setting the distance between the third temperature sensor 21 and the power copper busbar 11 to be less than the first distance, and the distance between it and the second circuit network layer 9 to be greater than the second distance, the third temperature sensor 21 is prevented from being affected by the second circuit network layer 9, ensuring that the third temperature sensor 21 can accurately monitor the change of the target temperature value at the power connection point 51. Similarly, by setting the distance between the fourth temperature sensor 22 and the grounding copper busbar 12 to be less than the third distance, and the distance between it and the first circuit network layer 8 to be greater than the fourth distance, the fourth temperature sensor 22 is prevented from being affected by the first circuit network layer 8, ensuring that the fourth temperature sensor 22 can accurately monitor the change of the target temperature value at the grounding connection point 52. This ensures that the temperature at all copper busbar connection points 5 can be monitored in real time, avoiding missed detection of temperature anomalies due to insufficient monitoring at a single point, improving the monitoring coverage of the over-temperature protection of the circuit board 100. Furthermore, when the target temperature value at a copper busbar connection point 5 is detected to exceed the first preset temperature threshold, a power-off operation is immediately performed to prevent damage or burnout of the circuit board 100 due to overheating, ensuring the safety of the equipment and operators.

[0112] To facilitate understanding of the technical concept or principle of the circuit board over-temperature protection method of this application as described in the above embodiments, a specific embodiment is given below:

[0113] This specific embodiment mainly uses a temperature sensor to detect the temperature (i.e., the target temperature value) at the copper busbar and PCB overlap point (i.e., the copper busbar overlap point), and compares it with the temperature at the location of the temperature sensor when the copper busbar 1 is normally connected (i.e., compare the target temperature value with the first preset temperature threshold and the second preset temperature threshold), and determines whether to alarm or power off (i.e. output alarm prompt information or perform power off operation).

[0114] In this specific embodiment, two copper busbars are provided: one power copper busbar and one GND copper busbar (Ground copper busbar, i.e., grounding copper busbar), and a temperature sensor is provided next to each copper busbar. Among them, the power copper busbar corresponds to the power temperature sensor (i.e., the third temperature sensor), and the GND copper busbar corresponds to the GND temperature sensor (i.e., the fourth temperature sensor).

[0115] In this specific embodiment, when the copper busbar and PCB are not properly connected, an overheating phenomenon will occur. After the heat is transferred to the nearby temperature sensor (i.e., the first temperature sensor), the temperature of the copper busbar 1 (i.e., the target temperature value) can be detected.

[0116] In a multi-layer PCB design, there is at least one power network layer (i.e., the first circuit network layer, the circuit network layer corresponding to the power plane layer) and one GND network layer (i.e., the second circuit network layer, the circuit network layer corresponding to the ground plane layer). The GND network layer is typically located on the second layer, and the power network layer is typically located on the Nth layer (N≥3). The power temperature sensor and the power busbar are located on the power network layer, and the distance between them is ≤L1 (i.e., the first distance). The GND temperature sensor and the GND busbar are located on the GND network layer, and the distance between them is ≤L3 (i.e., the third distance). To ensure that the temperature sensor can effectively detect the temperature of the busbar and that the detection does not overlap, the distance between the power temperature sensor and the GND network layer should be ≥L2 (i.e., the second distance), and the distance between the GND temperature sensor and the power network layer should be ≥L4 (i.e., the fourth distance). Here, L1, L2, L3, and L4 are pre-defined distance values.

[0117] That is, the circuit board includes at least a first circuit network layer and a second circuit network layer stacked together, wherein the first circuit network layer is the circuit network layer corresponding to the power plane, the second circuit network layer is the circuit network layer corresponding to the ground plane, the power copper busbar is disposed on the first circuit network layer, the distance between the third temperature sensor and the power copper busbar is less than the first distance, and the distance between the third temperature sensor and the second circuit network layer is greater than the second distance; the ground copper busbar is disposed on the second circuit network layer, the distance between the fourth temperature sensor and the ground copper busbar is less than the third distance, and the distance between the fourth temperature sensor and the first circuit network layer is greater than the fourth distance.

[0118] It should be noted that when the PCB has multiple GND network layers, all GND network layers below the power supply temperature sensor can be removed to prevent the temperature of the GND network layer from affecting the power supply temperature sensor's ability to detect the temperature of the power supply copper busbar 11 in the power network layer.

[0119] Accordingly, when the PCB has multiple power network layers, all power network layers above the GND temperature sensor can be removed to prevent the temperature of the power network layer from affecting the temperature sensing of the GND copper busbar in the GND network layer.

[0120] In this specific embodiment, the GND temperature sensor and power supply temperature sensor transmit the detected temperature to the host control chip (i.e., the control unit). When the host control chip detects that the temperature detected by the GND temperature sensor or power supply temperature sensor is greater than the alarm temperature (i.e., greater than the second preset temperature threshold), it will issue an alarm. When it detects that the temperature detected by the GND temperature sensor or power supply temperature sensor is greater than the ignition temperature (i.e., greater than the first preset temperature threshold), the host control chip will shut off the power output to prevent fire. In other words, when the target temperature value is greater than the first preset temperature threshold, the power-off operation in the over-temperature protection operation is performed on the circuit board 100; when the target temperature value is greater than the second preset temperature threshold but less than the first preset temperature threshold, the output alarm message in the over-temperature protection operation is performed.

[0121] Furthermore, to accurately calculate the alarm temperature and ignition temperature, this specific embodiment installs a temperature sensor (i.e., a second temperature sensor) at the air inlet of the unit to detect the current ambient temperature, thereby calculating the specific values ​​of the alarm temperature and ignition temperature when the copper busbar connection is normal. In other words, the current ambient temperature value is obtained based on the second temperature sensor; based on the current ambient temperature value and preset first and second copper busbar temperature thresholds, respectively, a first preset temperature threshold and a second preset temperature threshold are determined.

[0122] like Figure 6 As shown, Figure 6 The diagram shows a hardware circuit in a specific embodiment of this application. In the internal hardware circuit of the device, the power supply 6 supplies power to the power supply backplane A1. The power supply backplane A1 is connected to the second circuit network layer 9 through the grounding copper busbar 12 and to the first circuit network layer 8 through the power supply copper busbar 11, thereby supplying power to the circuit board 100.

[0123] Since the copper busbar 1, the power backplane A1, and the circuit board 3 are generally connected by screws, there may be cases of poor connection, which will cause the connection point to heat up. The temperature rise will further lead to oxidation of the connection point. Over time, the PCB may catch fire at the connection point, which may then cause the single board to catch fire. Therefore, it is necessary to monitor the temperature rise at the connection point and promptly issue an alarm or shut down the power supply 6 if abnormal temperature is detected.

[0124] In this specific embodiment, in the second circuit network layer 9, a fourth temperature sensor 22 is disposed on the circuit board 3 near the grounding copper busbar 12 to monitor the temperature at the grounding copper busbar 12. In the first circuit network layer 8 of the circuit board 100, a third temperature sensor 21 is disposed on the circuit board 3 near the power copper busbar 11 to monitor the temperature at the power copper busbar 11. A second temperature sensor 7 is disposed at a ventilation opening away from the copper busbar 1 inside the device to monitor the temperature of the environment around the circuit board 100 under the current operating conditions (i.e., the current ambient temperature). The power supply 6, the fourth temperature sensor 22, the third temperature sensor 21, and the second temperature sensor 7 are connected to the control unit 4 of the circuit board 100. The control unit 4 determines whether to generate an alarm or cut off the power supply 6 based on the temperature detected by each temperature sensor chip.

[0125] It is worth mentioning that, such as Figure 7 As shown, Figure 7 This is a schematic diagram showing the location of the first temperature sensor in a specific embodiment of this application. In this embodiment, the temperature sensing chip on the circuit board 3 does not necessarily need to be placed in the current flow area; it only needs to be placed around the copper busbar 1, within a certain distance from the copper busbar 1. Additionally, a thermally conductive medium can be added between the temperature sensor and the copper busbar 1 to facilitate better temperature measurement. This thermally conductive medium can be indirectly implemented through circuit traces, achieving a similar heat conduction effect. That is, the circuit traces also serve to conduct the heat generated at the copper busbar connection point to the first temperature sensor 2.

[0126] For example, in this specific embodiment, the temperature sensing chip used on the PCB has its sensing component integrated inside the chip. The temperature is transmitted to the inside of the chip through the various pins and package of the temperature sensor, and then captured by the temperature sensing component inside the chip. Therefore, the temperature captured by the temperature sensor is not the temperature transmitted from a single pin, but rather the result of the combined effect of the PCB and the surrounding air temperature. Therefore, to capture the temperature at the junction of copper busbar 1 and the PCB, the temperature sensor needs to be placed next to copper busbar 1, and the copper plane needs to transfer heat to the temperature sensor.

[0127] like Figure 8 As shown, Figure 8 This is a flowchart illustrating a circuit board over-temperature protection method in a specific embodiment of this application. In this specific embodiment, it includes:

[0128] Step S1: Detect the temperature T1 of the copper busbar lap joint;

[0129] Step S2, calculate the copper busbar temperature sensing temperature T2 = T1 - ΔT;

[0130] Step S3: Determine whether T2 is greater than TA;

[0131] Step S4: If T2 is less than or equal to TA, no action is taken;

[0132] Step S5: If T2 is greater than TA, then continue to determine whether T2 is greater than TF;

[0133] Step S6: If T2 is less than or equal to TF, then trigger an alarm;

[0134] Step S7: If T2 is greater than TF, then the entire machine is powered off.

[0135] In this embodiment, the temperature at the copper busbar connection point is T1 when the circuit board is protected from overheating by the temperature sensing control circuit. The temperature detected by the temperature sensing is the temperature T2 of the copper busbar (i.e., the target temperature value). Since there is a certain temperature loss ΔT in the process of the temperature at the copper busbar connection point being transferred to the temperature sensing, that is, T2 = T1 - ΔT.

[0136] In this specific embodiment, TA = TH + ΔT1 - ΔT, where TA is the alarm temperature (i.e., the second preset temperature threshold), TH is the current ambient temperature, and ΔT1 is the allowable temperature rise T1 of the copper busbar connection point when no alarm is triggered at the current ambient temperature TH. That is, when the PCB is not powered on at the current ambient temperature TH, T1 = TH. When the PCB is powered on, if T1 - TH > ΔT1, an alarm needs to be triggered.

[0137] In this specific embodiment, TF = TH + ΔT2 - ΔT, TA is the power-off temperature (i.e., the first preset temperature threshold), and ΔT2 is the allowable temperature rise of the copper busbar connection point T1 under the current ambient temperature TH without triggering a power-off. That is, under the current ambient temperature TH, when the PCB is powered on, if T1 - TH > ΔT2, then a power-off is required.

[0138] It is easy to understand that TA and TF in the above are both dynamic values, and their specific values ​​are affected by the current ambient temperature TH. The values ​​of TA and TF can be different under different ambient temperatures.

[0139] This specific embodiment first determines whether T2 is greater than TA after obtaining T2. If T2 is less than or equal to TA, no action is taken. If T2 is greater than TA, it then determines whether T2 is greater than TF. If T2 is less than or equal to TF, an alarm is triggered. If T2 is greater than TF, the entire machine is powered off. Through these two rounds of determination, it is possible to effectively identify whether the temperature T1 at the copper busbar connection point is abnormal, and select an appropriate handling method based on the determination result to prevent the PCB from being damaged or even burned due to abnormal T1.

[0140] It should be noted that the above examples are only for the purpose of assisting in understanding this application and do not constitute a limitation on the circuit board over-temperature protection method of this application. Any simple modifications based on this technical concept are within the scope of protection of this application.

[0141] In addition, please refer to Figure 9 , Figure 9 This is a schematic diagram of the device structure of the hardware operating environment involved in the circuit board over-temperature protection method in this application embodiment.

[0142] This application also provides an electronic device, which includes: a circuit board as described in the above embodiments; at least one processor; and a memory communicatively connected to the at least one processor; wherein the memory stores instructions executable by the at least one processor, which are executed by the at least one processor to enable the at least one processor to perform the steps of the circuit board over-temperature protection method described in the above embodiments.

[0143] The following is for reference. Figure 9 The diagram illustrates a structural schematic of an electronic device suitable for implementing the embodiments of this application. The electronic device in the embodiments of this application may include, but is not limited to, mobile terminals such as mobile phones, laptops, digital broadcast receivers, PDAs (Personal Digital Assistants), PADs (Portable Application Descriptions), PMPs (Portable Media Players), in-vehicle terminals (e.g., in-vehicle navigation terminals), and fixed terminals such as digital TVs (Televisions), desktop computers, or any electronic device capable of performing the above functions. Figure 9 The electronic device shown is merely an example and should not impose any limitation on the functionality and scope of use of the embodiments of this application.

[0144] like Figure 9As shown, the electronic device may include a processing unit 1001 (e.g., a central processing unit, a graphics processing unit, etc.), which can perform various appropriate actions and processes according to a program stored in a read-only memory (ROM) 1002 or a program loaded from a storage device 1003 into a random access memory (RAM) 1004. The RAM 1004 also stores various programs and data required for the operation of the electronic device. The processing unit 1001, ROM 1002, and RAM 1004 are interconnected via a bus 1005. An input / output (I / O) interface 1006 is also connected to the bus. Typically, the following systems can be connected to the I / O interface 1006: input devices 1007 including, for example, touchscreens, touchpads, keyboards, mice, image sensors, microphones, accelerometers, gyroscopes, etc.; output devices 1008 including, for example, liquid crystal displays (LCDs), speakers, vibrators, etc.; storage devices 1003 including, for example, magnetic tapes, hard disks, etc.; and communication devices 1009. Communication device 1009 allows electronic devices to communicate wirelessly or wiredly with other devices to exchange data. While electronic devices with various systems are shown in the figures, it should be understood that implementation or possession of all the systems shown is not required. More or fewer systems may be implemented alternatively.

[0145] Specifically, according to the embodiments disclosed in this application, the processes described above with reference to the flowcharts can be implemented as computer software programs. For example, embodiments disclosed in this application include a computer program product comprising a computer program carried on a computer-readable medium, the computer program containing program code for performing the methods shown in the flowcharts. In such embodiments, the computer program can be downloaded and installed from a network via a communication device, or installed from storage device 1003, or installed from ROM 1002. When the computer program is executed by processing device 1001, it performs the functions defined in the methods of the embodiments disclosed in this application.

[0146] The electronic device provided in this application, employing the circuit board over-temperature protection method described in the above embodiments, can solve the technical problem of PCB boards overheating or catching fire due to poor overlap in related technologies. Compared with the prior art, the beneficial effects of the electronic device provided in this application are the same as those of the circuit board over-temperature protection method provided in the above embodiments, and other technical features of this electronic device are the same as those disclosed in the circuit board over-temperature protection method provided in the above embodiments, and will not be repeated here.

[0147] It should be understood that the various parts disclosed in this application can be implemented using hardware, software, firmware, or a combination thereof. In the description of the above embodiments, specific features, structures, materials, or characteristics can be combined in any suitable manner in one or more embodiments or examples.

[0148] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of protection of the above claims.

[0149] In addition, this application also provides a computer-readable storage medium having computer-readable program instructions (i.e., a computer program) stored thereon, the computer-readable program instructions being used to perform the steps of the circuit board over-temperature protection method in the above embodiments.

[0150] The computer-readable storage medium provided in this application may be, for example, a USB flash drive, but is not limited to, electrical, magnetic, optical, electromagnetic, infrared, or semiconductor systems, devices, or any combination thereof. More specific examples of computer-readable storage media may include, but are not limited to: electrical connections with one or more wires, portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination thereof. In this embodiment, the computer-readable storage medium may be any tangible medium containing or storing a program that can be used by or in conjunction with an instruction execution system, system, or device. The program code contained on the computer-readable storage medium may be transmitted using any suitable medium, including but not limited to: wires, optical cables, RF (Radio Frequency), etc., or any suitable combination thereof.

[0151] The aforementioned computer-readable storage medium may be included in an electronic device or may exist independently without being assembled into an electronic device.

[0152] The aforementioned computer-readable storage medium carries one or more programs, which, when executed by an electronic device, cause the electronic device to: acquire a target temperature value at the copper busbar overlap point detected by a first temperature sensor; and, if the target temperature value is greater than a first preset temperature threshold, perform a power-off operation on the circuit board.

[0153] Computer program code for performing the operations of this application can be written in one or more programming languages ​​or a combination thereof, including object-oriented programming languages ​​such as Java, Smalltalk, and C++, as well as conventional procedural programming languages ​​such as "C" or similar programming languages. The program code can be executed entirely on the user's computer, partially on the user's computer, as a standalone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In cases involving remote computers, the remote computer can be connected to the user's computer via any type of network—including a Local Area Network (LAN) or a Wide Area Network (WAN)—or can be connected to an external computer (e.g., via the Internet using an Internet service provider).

[0154] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of this application. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions indicated in the blocks may occur in a different order than those indicated in the drawings. For example, two consecutively indicated blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each block in the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, can be implemented using a dedicated hardware-based system that performs the specified function or operation, or using a combination of dedicated hardware and computer instructions.

[0155] The modules described in the embodiments of this application can be implemented in software or hardware. The names of the modules do not necessarily limit the functionality of the unit itself.

[0156] The computer-readable storage medium provided in this application stores computer-readable program instructions (i.e., a computer program) for performing the steps of the above-described circuit board over-temperature protection method, which can solve the technical problem in the related art of PCB boards overheating or catching fire due to poor overlap. Compared with the prior art, the beneficial effects of the computer-readable storage medium provided in this application are the same as the beneficial effects of the circuit board over-temperature protection method provided in the above embodiments, and will not be repeated here.

[0157] Furthermore, this application also provides a computer program product, including a computer program that, when executed by a processor, implements the steps of the circuit board over-temperature protection method as described in the above embodiments.

[0158] The computer program product provided in this application can solve the technical problem of PCB boards overheating or catching fire due to poor overlap in related technologies. Compared with the prior art, the beneficial effects of the computer program product provided in this application are the same as the beneficial effects of the circuit board overheat protection method provided in the above embodiments, and will not be repeated here.

[0159] The above description is only a part of the embodiments of this application and does not limit the patent scope of this application. All equivalent structural transformations made under the technical concept of this application and using the contents of the specification and drawings of this application, or direct / indirect applications in other related technical fields, are included in the patent protection scope of this application.

Claims

1. A method for over-temperature protection of a circuit board, the circuit board comprising a copper busbar, a first temperature sensor, and a circuit board with etched circuit traces, the first temperature sensor being disposed on the circuit board near the copper busbar, the copper busbar being connected to the circuit traces via a copper busbar overlap point on the circuit board, the circuit traces further being used to conduct heat generated at the copper busbar overlap point to the first temperature sensor, the method comprising: The target temperature value at the copper busbar overlap point is obtained based on the first temperature sensor; Based on the target temperature value, an over-temperature protection operation is performed on the circuit board.

2. The circuit board over-temperature protection method as described in claim 1, characterized in that, The step of performing over-temperature protection on the circuit board based on the target temperature value includes: If the target temperature value is greater than the first preset temperature threshold, the power-off operation in the over-temperature protection operation is performed on the circuit board; If the target temperature value is greater than the second preset temperature threshold and less than the first preset temperature threshold, the over-temperature protection operation outputs an alarm message, wherein the second preset temperature threshold is less than the first preset temperature threshold.

3. The circuit board over-temperature protection method as described in claim 2, characterized in that, The circuit board also includes a second temperature sensor, and the method further includes: The current ambient temperature value is obtained based on the second temperature sensor; Based on the current ambient temperature value and the preset first copper busbar temperature threshold and the preset second copper busbar temperature threshold, the first preset temperature threshold and the second preset temperature threshold are determined, wherein the first preset temperature threshold and the second preset temperature threshold are both positively correlated with the current ambient temperature value, and the second copper busbar temperature threshold is less than the first copper busbar temperature threshold.

4. A circuit board, characterized in that, include: The components include a copper busbar, a first temperature sensor, a circuit board with etched circuit traces, and a control unit. The first temperature sensor is located on the circuit board near the copper busbar; The copper busbar is connected to the circuit trace through the copper busbar overlap point on the circuit board. The circuit trace is also used to conduct the heat generated at the copper busbar overlap point to the first temperature sensor. The control unit is configured to acquire the target temperature value at the copper busbar splice point based on the first temperature sensor. Based on the target temperature value, an over-temperature protection operation is performed on the circuit board.

5. The circuit board as described in claim 4, characterized in that, The circuit board also includes a second temperature sensor; The control unit is further configured to: when the target temperature value is greater than the first preset temperature threshold, perform a power-off operation in the over-temperature protection operation on the circuit board; when the target temperature value is greater than the second preset temperature threshold and less than the first preset temperature threshold, perform an output alarm message in the over-temperature protection operation, wherein the second preset temperature threshold is less than the first preset temperature threshold. Specifically, the current ambient temperature value is obtained based on the second temperature sensor; the first preset temperature threshold and the second preset temperature threshold are determined based on the current ambient temperature value and the preset first copper busbar temperature threshold and the preset second copper busbar temperature threshold, respectively, wherein the first preset temperature threshold and the second preset temperature threshold are both positively correlated with the current ambient temperature value, and the second copper busbar temperature threshold is less than the first copper busbar temperature threshold.

6. The circuit board as described in claim 4, characterized in that, The circuit board includes at least two copper busbars, wherein at least one temperature sensor is disposed on the circuit board near each copper busbar.

7. The circuit board as described in claim 6, characterized in that, The copper busbars include power copper busbars and grounding copper busbars, and the at least two copper busbars include at least one power copper busbar and at least one grounding copper busbar. The first temperature sensor includes a third temperature sensor disposed on the circuit board near the power supply copper busbar, and a fourth temperature sensor disposed on the circuit board near the grounding copper busbar.

8. The circuit board as described in claim 7, characterized in that, The circuit board comprises at least a first circuit network layer and a second circuit network layer stacked together, wherein the first circuit network layer is the circuit network layer corresponding to the power plane, and the second circuit network layer is the circuit network layer corresponding to the ground plane. The power supply copper busbar is disposed on the first circuit network layer, the distance between the third temperature sensor and the power supply copper busbar is less than the first distance, and the distance between the third temperature sensor and the second circuit network layer is greater than the second distance; The grounding copper busbar is located in the second circuit network layer. The distance between the fourth temperature sensor and the grounding copper busbar is less than the third distance, and the distance between the fourth temperature sensor and the first circuit network layer is greater than the fourth distance.

9. An electronic device, characterized in that, The circuit board includes a circuit board, a memory, a processor, and a circuit board over-temperature protection program stored in the memory and executable on the processor, wherein the circuit board over-temperature protection program, when executed by the processor, implements the circuit board over-temperature protection method as described in any one of claims 1 to 3.

10. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a circuit board over-temperature protection program, which, when executed by a processor, implements the circuit board over-temperature protection method as described in any one of claims 1 to 3.

11. A computer program product, characterized in that, The computer program product includes a circuit board over-temperature protection program, which, when executed by a processor, implements the steps of the circuit board over-temperature protection method as described in any one of claims 1 to 3.

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