Circuit board processing apparatus and circuit board inspection method

Abstract

The application discloses a kind of circuit board processing equipment, comprising: workbench, including the first workbench and the second workbench along the first direction arrangement;Crossbeam, is erected in the upper workbench;Main shaft assembly, sliding connection is in crossbeam, can along the first direction movement;Base, below the workbench, for supporting workbench;Pedestal, set up on base, for carrying workbench;First detection part, set up in the upper workbench;Second detection part, set up below the workbench, and can reciprocate along the first direction between below the first workbench and below the second workbench;First detection part and second detection part can move to the position of mutual alignment, to transmit detection target position of circuit board carried on the first workbench or the second workbench, and main shaft assembly processes circuit board based on detection result.The application also discloses a kind of circuit board detection method.This kind of circuit board processing equipment and detection method can reduce cost, improve processing, detection efficiency and precision.

Description

Technical Field

[0001] This application relates to the technical field of equipment and methods for processing circuit boards, and more precisely, this application relates to a circuit board processing equipment and testing method. Background Technology

[0002] Currently, with the development of the PCB industry, the demand for multilayer PCBs is gradually increasing. Before drilling holes in multilayer boards, an X-ray drilling machine is generally needed to inspect the inner layers and then drill holes according to the target markings. Currently, mainstream products are divided into dual-axis simultaneous processing and single-axis processing. However, dual-axis processing has poor accuracy and high cost, while single-axis processing has low efficiency. Therefore, how to design a circuit board processing equipment with high efficiency, high accuracy, and low cost has become a technical problem that X-ray drilling machines need to solve. Summary of the Invention

[0003] This application aims to address the problems existing in the prior art by providing a circuit board processing equipment and a testing method.

[0004] According to a first aspect of this application, a circuit board processing apparatus is provided, comprising: a worktable, including a first worktable and a second worktable arranged along a first direction; a crossbeam mounted above the worktable; a spindle assembly slidably connected to the crossbeam and movable along the first direction; a base located below the worktable for supporting the worktable; a pedestal disposed on the base for supporting the worktable; a first detection unit disposed above the worktable; and a second detection unit disposed below the worktable and movable reciprocating between the first and second worktables along the first direction; the first and second detection units can be moved to mutually aligned positions to transmissively detect the target position of a circuit board carried on the first or second worktable, and the spindle assembly processes the circuit board based on the detection results.

[0005] In some embodiments of this application, the base includes a first base, a second base, and a third base spaced apart along a first direction; a first worktable is slidably supported on the first base and the second base along a second direction; and a second worktable is slidably supported on the second base and the third base along a second direction.

[0006] In some embodiments of this application, a guide rail extending along a first direction is provided on the base, and a hole extending along the first direction is provided on the second base. The guide rail extends from below the first worktable through the hole to below the second worktable.

[0007] In some embodiments of this application, the second detection unit is slidably disposed on the guide rail and can pass through the hole under the drive of a drive mechanism, and reciprocate between the bottom of the first worktable and the bottom of the second worktable.

[0008] In some embodiments of this application, the vertical projection of the motion trajectory of the second detection unit onto the base overlaps at least partially with the vertical projection of the motion trajectory of the first detection unit onto the base.

[0009] In some embodiments of this application, the height of the hole in the vertical direction is greater than or equal to one-half of the height of the second base, and less than or equal to two-thirds of the height of the second base.

[0010] In some embodiments of this application, there is one first detection unit, which can reciprocate between the first workbench and the second workbench along a first direction; or, there are two first detection units, which are fixedly or slidably disposed on the crossbeam and respectively correspond to the first workbench and the second workbench.

[0011] In some embodiments of this application, the first detection unit is disposed on the spindle assembly and moves synchronously with the spindle assembly; or, the first detection unit is connected to the crossbeam through an independent sliding mechanism.

[0012] In some embodiments of this application, when the first detection unit and the second detection unit are aligned with each other, the detection light emitted by the first detection unit or the second detection unit passes through the worktable and the circuit board and is received by the other detection unit.

[0013] A second aspect of this application provides a circuit board inspection method, comprising: controlling a second inspection unit to move below a first worktable and align it with a first inspection unit above the first worktable to perform transmissive inspection of a target position of a circuit board on the first worktable; controlling the second inspection unit to pass through a hole and move from below the first worktable to below a second worktable and align it with a first inspection unit above the second worktable to perform transmissive inspection of a target position of a circuit board on the second worktable; controlling the second inspection unit to pass through the hole and return from below the second worktable to below the first worktable, and repeating the above steps to alternately perform transmissive inspection of circuit boards on the first and second worktables.

[0014] In some embodiments of this application, there is one first detection unit, which can reciprocate between the first worktable and the second worktable along a first direction to align with the second detection unit in sequence; or, there are two first detection units, which are respectively disposed on the first spindle assembly and the second spindle assembly or independently disposed on the crossbeam, and respectively correspond to the first worktable and the second worktable to align with the second detection unit in sequence.

[0015] In some embodiments of this application, the first detection unit and the second detection unit are aligned to form a transmission light path to detect at least one of the pin holes, anti-fool holes, positioning holes, and processing holes on the circuit board, so as to determine the positioning deviation, expansion and contraction deviation, or actual position of the hole to be processed on the circuit board.

[0016] In some embodiments of this application, while the circuit board on the first workbench is being inspected and processed, the loading and unloading device is controlled to perform loading and unloading operations on the second workbench.

[0017] This circuit board processing equipment and testing method, in which the second testing unit reciprocates between the first and second processing positions, can reduce costs and improve processing and testing efficiency and accuracy.

[0018] Other features and advantages of this application will become clear from the following detailed description of exemplary embodiments with reference to the accompanying drawings. Attached Figure Description

[0019] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments of the present application and, together with their description, serve to explain the principles of the present application.

[0020] Figure 1 This is a schematic diagram of a partial structure of a circuit board processing equipment provided in an embodiment of this application;

[0021] Figure 2 This is a schematic diagram of a partial structure of a circuit board processing equipment provided in an embodiment of this application;

[0022] Figure 3 This is a schematic diagram of a partial structure of a circuit board processing equipment provided in an embodiment of this application;

[0023] Figure 4 This is a schematic diagram of a partial structure of a circuit board processing equipment provided in an embodiment of this application;

[0024] Figure 5 This is a schematic diagram of a partial structure of a circuit board processing equipment provided in an embodiment of this application;

[0025] Figure 6 This is a schematic diagram of a circuit board portion structure provided in an embodiment of this application;

[0026] Figure 7 This is a schematic diagram of a circuit board portion structure provided in an embodiment of this application;

[0027] Figure 8 This is a schematic diagram of a circuit board portion structure provided in an embodiment of this application.

[0028] Figures 1 to 8The one-to-one correspondence between the component names and the reference numerals in the attached drawings is as follows: 10, Spindle assembly; 20, Worktable; 30, Crossbeam; 40, Base; 11, First spindle assembly; 12, Second spindle assembly; 21, First worktable; 22, Second worktable; 23, Circuit board; 31, Slide rail; 41, First base; 42, Second base; 43, Third base; 421, Guide rail; 422, Hole; 51, First inspection unit; 52, Second inspection unit; 60, Loading / unloading device; 61, Robotic arm; 62, First gripper; 63, Second gripper; 71, Pin hole; 72, Anti-foolproof hole; 73, Positioning hole; 74, Machining hole. Detailed Implementation

[0029] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the present application.

[0030] The following description of at least one exemplary embodiment is for illustrative purposes only and is not intended to limit the scope, application, or use of this application. Techniques, methods, and devices known to those skilled in the art should be considered part of the specification where appropriate and will not be discussed further here. The same or similar reference numerals in the drawings represent the same or similar elements, and therefore, once an element is defined in one drawing, it need not be repeated in subsequent drawings.

[0031] In this document, directional terms such as "upper," "lower," "front," "rear," "left," and "right" are used only to describe the relative positional relationships between the components shown in the accompanying drawings, and not to define their absolute positions. Terms such as "first" and "second" are used only to distinguish different components and do not indicate importance, order, or interdependence. Furthermore, expressions such as "equal," "same," "aligned," "aligned," "flush," "axial direction," "horizontal direction," "above," "below," "consistent," "synchronous," "simultaneously," "in sequence," "axis," and "center" are not strict mathematical or geometric definitions, but rather allow for a reasonable range of error acceptable to those skilled in the art during manufacturing or use.

[0032] This embodiment provides a circuit board processing device comprising: a base, a crossbeam, a spindle assembly, and a worktable. The worktable is mounted on the base and is movable along a second direction. The crossbeam is mounted above the worktable, and at least one spindle assembly movable along a first direction is slidably connected to it. A cutting tool is held at the bottom of the spindle assembly and is driven by a drive mechanism to move along a third direction, thereby processing the circuit board carried on the worktable. The first, second, and third directions are mutually perpendicular, forming a spatial rectangular coordinate system.

[0033] For ease of description, a spatial rectangular coordinate system is defined: the first direction is the X-axis, the second direction is the Y-axis, and the third direction is the Z-axis, with each direction perpendicular to the others. During operation, the circuit board is magnetically fixed to the worktable, which moves the circuit board along the second direction (Y-axis). Simultaneously, the spindle assembly slides along the first direction (X-axis) on the crossbeam. The coordinated movement of these two components establishes a positioning coordinate system in the XY plane, thereby accurately determining the machining position on the circuit board. The spindle assembly includes a spindle section that holds the cutting tool and feeds it along the third direction (Z-axis) to achieve precision machining of the target position on the circuit board.

[0034] In the context of this application, the circuit board processing equipment can be drilling equipment, forming equipment, milling machine equipment, drilling and milling integrated equipment, etc., and this application does not limit this. The number of spindle assemblies can be configured as needed to be one, two, three, four, five, six, eight, ten, twelve, etc. Correspondingly, the number of processing areas on the worktable can also be configured to be the same, and each spindle assembly and its corresponding processing area have basically the same structure and function.

[0035] To achieve transmission detection before drilling, the circuit board processing equipment of this application includes a worktable, comprising a first worktable and a second worktable arranged along a first direction; a crossbeam mounted above the worktable; a spindle assembly slidably connected to the crossbeam and movable along the first direction; a base located below the worktable for supporting the worktable; a pedestal disposed on the base for supporting the worktable; a first detection unit disposed above the worktable; and a second detection unit disposed below the worktable and movable back and forth between the first and second worktables along the first direction. The first and second detection units can be moved to mutually aligned positions to perform transmission detection on the target position of the circuit board carried on the first or second worktable, and the spindle assembly processes the circuit board based on the detection results.

[0036] The circuit board processing equipment includes a base, which serves as the load-bearing foundation for the entire equipment, supporting the base, beams, and other mechanisms. The base is preferably made of marble to ensure the equipment is stably and reliably fixed to the ground, reducing the impact of vibrations generated during the high-speed, high-frequency movement of the spindle assembly on processing accuracy and stability.

[0037] The circuit board processing equipment has a base, preferably made of marble. The base includes a first base, a second base, and a third base spaced apart along a first direction (X-axis). Using three bases, with the first and second worktables sharing the second base, saves costs and improves overall stability and reliability. Simultaneously, this layout creates space directly beneath the first and second worktables to accommodate the second inspection unit and guide rails.

[0038] The circuit board processing equipment also includes worktables, comprising a first worktable and a second worktable arranged along a first direction. The first worktable is supported by a first base and a second base. A drive mechanism drives the first worktable to move along a second direction (Y-axis direction) on slide rails on the top surfaces of the first and second bases, forming a first processing area for carrying the first circuit board. The second worktable is supported by a second base and a third base. A drive mechanism drives the second worktable to move along a second direction on slide rails on the top surfaces of the second and third bases, forming a second processing area for carrying the second circuit board. A first accommodating space is formed between the first and second bases and below the first worktable; a second accommodating space is formed between the second and third bases and below the second worktable. These spaces are used to accommodate a second detection unit and related motion mechanisms.

[0039] The circuit board processing equipment also includes a crossbeam spanning above the first and second worktables, with both ends supported on a base by marble blocks. The crossbeam itself is preferably made of marble. A slide rail and drive mechanism extending along a first direction are provided on the crossbeam for driving the spindle assembly to move along the first direction.

[0040] The circuit board processing equipment also includes a spindle assembly, which is slidably connected to a slide rail on a crossbeam and driven by a drive mechanism to move along a first direction. Simultaneously, a first or second worktable moves along a second direction, thereby achieving precise alignment between the tool held by the spindle assembly and the target position on the circuit board in both the first and second directions. Subsequently, the spindle assembly drives the tool to reciprocate along a third direction (Z-axis) to perform high-precision processing on the circuit board. The spindle assembly may include a first spindle assembly and a second spindle assembly. In practical applications, a reasonable number of spindle assemblies can be configured according to the architecture of the circuit board processing equipment. The number of spindle assemblies can be one or more, and the number of spindle assemblies may differ from the number of worktables. In the context of this application, the first, second, and third directions are mutually perpendicular.

[0041] To achieve precise positioning before drilling, the circuit board processing equipment also includes an inspection unit. The inspection unit includes a first inspection unit and a second inspection unit. The first inspection unit is positioned above either the first or second worktable. There can be one first inspection unit, reciprocating along a first direction on a crossbeam between the first and second worktables, allowing two processing areas to share a single first inspection unit; or there can be two, corresponding to the first and second worktables respectively, moving independently along the first direction on the crossbeam. When two first inspection units are used, a safety distance is maintained between them to prevent collisions. The first inspection unit can be mounted on the spindle assembly and move synchronously with it; or it can be independent of the spindle assembly, slidably connected to the crossbeam via a separate base plate and drive mechanism, and driven by the drive mechanism to move along the first direction. The second inspection unit is positioned below either the first or second worktable and is used in conjunction with the first inspection unit. The second inspection unit is configured to reciprocate along the first direction between the area below the first and second worktables.

[0042] To enable the reciprocating motion of the second inspection unit, a guide rail extending along a first direction is provided on the base. The guide rail is fixed to the base and serves to guide and position the second inspection unit. A through-hole extending along the first direction is provided on the second base, through which the guide rail extends from below the first worktable to below the second worktable. The second inspection unit is slidably mounted on the guide rail and, driven by a drive mechanism, can pass through the hole, reciprocating between below the first and second worktables. When the first inspection unit moves from above the first worktable to above the second worktable, the second inspection unit simultaneously moves from below the first worktable along the guide rail through the hole on the second base to below the second worktable, and vice versa. By using the guide rail and hole, the first and second worktables share a single second inspection unit, which saves costs and allows for alternating processing and inspection between the two processing areas, improving processing efficiency.

[0043] To ensure the smooth passage of the second detection unit, the hole has a predetermined size. Simultaneously, to guarantee the strength and stability of the second base, the vertical height of the hole is configured to be greater than or equal to half the height of the second base, and less than or equal to two-thirds. This size range is an optimal range derived from structural mechanics analysis and experimental verification: if the hole height is too small (less than half), the second detection unit will have difficulty passing through smoothly or the guide rail height will need to be increased, affecting stability; if the hole height is too large (greater than two-thirds), it will weaken the load-bearing capacity and structural rigidity of the second base, affecting the support stability of the worktable. Therefore, the above range provides sufficient space for the movement of the second detection unit while ensuring the load-bearing capacity of the second base.

[0044] In the embodiments of this application, the vertical projection of the movement trajectory of the second detection unit onto the base at least partially overlaps with the vertical projection of the movement trajectory of the first detection unit onto the base. This overlap ensures that the first and second detection units are aligned in the second direction. When both the first and second detection units are aligned in the first and second directions, they form a precise alignment in the third direction. Specifically, the movement trajectory of the first detection unit in the first direction is a straight line extending along the first direction, and the movement trajectory of the second detection unit in the first direction is also a straight line extending along the first direction; the projections of the two straight lines onto the base overlap. This positional relationship ensures precise alignment of the first and second detection units in the second direction, thereby directly improving the accuracy of the detection units in detecting the inner layer position of the circuit board.

[0045] When the first and second detection units move to align with each other along a third direction, a transmission light path is formed between them. Specifically, the detection light (such as X-ray) emitted by the first or second detection unit passes through the first or second worktable and the circuit board it carries, and is received by another detection unit. The detection light can pass through the worktable and the circuit board, thereby detecting the target position on the circuit board. Based on the received detection light or image, the target position in the inner layer of the circuit board (such as a target to be drilled) can be determined, providing precise coordinate position information for subsequent processing. The control system precisely controls the spindle assembly to process the target position on the circuit board based on the detection results of the first and second detection units.

[0046] In embodiments of this application, a first detection unit and a second detection unit are aligned to form a transmission optical path for detecting at least one of pin holes, foolproof holes, positioning holes, and machining holes on a circuit board. For circuit boards with multi-layer structures, in some manufacturing processes, the surface layer may partially or completely cover the surface wiring, thereby obscuring various positioning marks and positioning holes on the circuit board surface. In this case, using the first and second detection units for transmission detection can effectively identify at least one of the obscured pin holes, foolproof holes, positioning holes, and machining holes, ensuring accurate acquisition of positioning information.

[0047] In a preferred embodiment, such as Figure 6As shown, the circuit board 23 includes two pin holes 71 and one foolproof hole 72. The pneumatic clamp assembly positions and fixes the circuit board 23 onto the worktable 20 by clamping the pins inserted into the two pin holes 71; the foolproof hole 72 is used to identify the front and back of the circuit board 23 to prevent incorrect installation. During inspection, based on the alignment of the first detection unit 51 and the second detection unit 52, the actual target positions of the two pin holes 71 and the foolproof hole 72 are identified by transmissive imaging. The spindle assembly 10 processes the pin holes 71 and the foolproof hole 72 based on these actual target positions, thereby enabling the circuit board 23 to be precisely fixed onto the worktable 20 by the pneumatic clamp assembly and the pins.

[0048] In another embodiment, such as Figure 7 As shown, the circuit board 23 includes four positioning holes 73 located at its corners. On one hand, these four positioning holes 73 allow for the determination of the positioning deviation of the circuit board 23 on the worktable 20; on the other hand, by analyzing their relative positional relationships, the expansion / contraction deviation of the circuit board 23 can be determined. During inspection, based on the alignment of the first detection unit 51 and the second detection unit 52, the actual target positions of the four positioning holes 73 are identified by transmission. The control system determines the positioning deviation or expansion / contraction deviation based on these actual target positions, and performs compensation before machining the positioning holes 73, thereby improving the positioning accuracy or machining accuracy of the circuit board 23.

[0049] In yet another embodiment, such as Figure 8 As shown, the circuit board 23 includes several holes 74 to be processed. To improve processing accuracy, especially for high-density, high-precision circuit boards, a "hole-to-hole" processing mode is adopted: before processing each hole 74, the first detection unit 51 and the second detection unit 52 are aligned and the actual position of the hole 74 is detected by transmission. Then, based on the detection results, the hole 74 is processed at the target position on the circuit board 23. This real-time detection and real-time processing method can effectively compensate for hole position offsets caused by board expansion and contraction or positioning errors, significantly improving processing accuracy.

[0050] In embodiments of this application, the first detection unit may be a camera (such as an X-ray camera), and the second detection unit may be a light source (such as an X-ray light source); or, the first detection unit may be a light source, and the second detection unit may be a camera. This application does not limit the specific type and location of the first and second detection units.

[0051] The circuit board processing equipment of this application employs a circuit board inspection method, which specifically includes the following steps: controlling a second inspection unit to move below a first worktable and aligning it with a first inspection unit above the first worktable, and performing transmissive inspection on the circuit board on the first worktable; controlling the second inspection unit to pass through a hole and move from below the first worktable to below the second worktable, and aligning it with a first inspection unit above the second worktable, and performing transmissive inspection on the circuit board on the second worktable; controlling the second inspection unit to pass through the hole and return from below the second worktable to below the first worktable, and repeating the above inspection steps to alternately perform transmissive inspection on the circuit boards on the first and second worktables.

[0052] In the circuit board processing equipment of this application, embodiments of this application also provide a circuit board inspection method. This method fully utilizes the cooperation between a movable second inspection unit and a first inspection unit to achieve efficient transmission detection of circuit boards on dual worktables. The following is in conjunction with the appendix... Figure 1 This method will be explained in detail. For example... Figure 1 As shown, this method includes the following steps:

[0053] First, the second detection unit is moved below the first worktable and aligned with the first detection unit above it to perform transmission detection of the target position on the circuit board on the first worktable. Specifically, the drive mechanism drives the second detection unit to move along the guide rail, positioning it directly below the first worktable. Simultaneously, the first detection unit is positioned directly above the first worktable. When the two are aligned along the Z-axis, a transmission light path is formed. At this time, the detection light (such as X-rays) emitted by either the first or second detection unit transmits through the first worktable and the circuit board it supports, and is received by the other detection unit, thereby obtaining the actual coordinates of the target position (such as pin holes, anti-fool holes, positioning holes, or holes to be processed) on the inner layer of the circuit board.

[0054] Next, the second detection unit is controlled to pass through the hole and move from under the first worktable to under the second worktable, aligning with the first detection unit above the second worktable to perform transmission detection on the target position of the circuit board on the second worktable. After the first worktable completes its detection, the drive mechanism continues to drive the second detection unit to move along the guide rail. During the movement, the second detection unit passes through the hole opened in the second base and enters the area below the second worktable. Upon reaching the predetermined position, the second detection unit stops and aligns with the first detection unit, which is now above the second worktable, to perform transmission detection on the circuit board on the second worktable in the same manner.

[0055] Finally, the second inspection unit passes through the hole and returns from under the second worktable to under the first worktable, repeating the above steps to alternately perform transmission inspection on the circuit boards on the first and second worktables. After the second worktable completes its inspection, the second inspection unit again passes through the hole and returns to under the first worktable, ready for the next round of inspection. This cycle repeats, with the second inspection unit moving alternately under the two worktables, cooperating with the first inspection unit to achieve continuous transmission inspection of the circuit boards on both worktables.

[0056] In some embodiments of this application, the first detection unit may adopt two different configurations to adapt to different equipment structures and process requirements, but its cooperation principle with the second detection unit is the same.

[0057] Method 1: Single detection head reciprocating motion, such as Figure 1 and Figure 2 As shown, in this embodiment, there is one first detection unit, which can reciprocate between above the first worktable and above the second worktable along a first direction. When the second detection unit moves to below the first worktable, the first detection unit also moves synchronously to above the first worktable, and the two are aligned for detection. After the detection is completed, the first detection unit moves along the crossbeam to above the second worktable, while the second detection unit moves through the hole to below the second worktable, and the two are aligned again for detection. Through the synchronous reciprocating movement of the first and second detection units, alternating detection of the two worktables is achieved.

[0058] Method 2: Dual detection heads are fixed or set independently, such as... Figure 3 and Figure 5 As shown, in another embodiment, there are two first detection units, respectively disposed on the first spindle assembly and the second spindle assembly (moving with the spindle), or respectively disposed on the crossbeam and corresponding to the first and second worktables via independent sliding mechanisms. In this configuration, the two first detection units are fixed or move independently above their respective worktables. When the second detection unit moves below the first worktable, it aligns with the first detection unit corresponding to the first worktable for detection; when the second detection unit moves through the hole to below the second worktable, it aligns with the first detection unit corresponding to the second worktable for detection. This method eliminates the need for reciprocating motion of the first detection units, further improving detection efficiency and facilitating coordination with the machining actions of the spindle assembly.

[0059] In the parallel working mode of the above-described detection method, while the first worktable is performing detection and processing in cooperation with the spindle assembly and the second detection unit, the loading and unloading device can simultaneously perform loading and unloading operations on the second worktable. Similarly, when the second worktable is performing detection and processing, the loading and unloading device performs loading and unloading operations on the first worktable. This parallel working mode of detection, processing, and loading and unloading can minimize equipment downtime and significantly improve production efficiency.

[0060] This circuit board processing equipment and circuit board inspection method achieves alternating processing and inspection between the two processing positions by having the first and second processing positions share a second inspection unit and making the second inspection unit reciprocate between the two processing positions. This effectively reduces costs while improving processing and inspection efficiency and accuracy.

[0061] Example 1

[0062] This embodiment uses a single-axis drilling machine as an example to describe in detail the structure and workflow of circuit board processing equipment.

[0063] like Figure 1 As shown, the circuit board processing equipment of this embodiment includes: a worktable 20, which includes a first worktable 21 and a second worktable 22 arranged along a first direction (X-axis direction) for alternately carrying circuit boards 23 to be processed; a crossbeam 30, mounted above the worktable 20, providing support and guidance for each moving part; a spindle assembly 10, slidably connected to the slide rail 31 of the crossbeam 30, movable along the first direction, for performing drilling processing on the circuit boards on the worktable; and a base 40, located below the worktable 20, serving as the support for the entire equipment. The base includes a first base 41, a second base 42, and a third base 43 spaced apart on a base 40 along a first direction, for supporting and guiding the worktable 20 to slide along a second direction (Y-axis); a first detection unit 51, disposed on the spindle assembly 10, which can move along the first direction with the spindle assembly 10, for receiving detection light; and a second detection unit 52, disposed below the worktable 20, which can reciprocate between below the first worktable 21 and below the second worktable 22 along the first direction, for emitting detection light.

[0064] In this embodiment, the second base 42 has a through hole 422 extending along the first direction, and the base 40 is provided with a guide rail 421 extending along the first direction. The guide rail extends from under the first worktable 21 through the through hole 422 to under the second worktable 22. The second detection unit 52 is slidably disposed on the guide rail 421 and driven by a drive mechanism, and can pass through the through hole 422 to achieve reciprocating movement under the two worktables. Through this structural design, the first worktable 21 and the second worktable 22 share the same under-worktable detection system (second detection unit 52), which not only ensures the transmission detection function, but also significantly reduces the equipment cost.

[0065] like Figure 4As shown, the circuit board processing equipment is equipped with a loading and unloading device 60, whose robotic arm 61 includes an independently operating first gripper 62 and a second gripper 63. The robotic arm can move along the first, second, and third directions to achieve parallel loading and unloading at two workstations. Taking the first worktable 21 as an example: the first gripper 62 picks up the board to be processed from the loading bin, while the second gripper 63 simultaneously removes the processed board; after the first gripper 62 places the circuit board to be processed, the second gripper 63 transfers the processed circuit board to the unloading bin. This design allows for simultaneous loading and unloading. The robotic arm 61 includes a first gripper 62 and a second gripper 63, both of which can operate independently to achieve parallel handling of circuit boards on the two worktables. Taking the first worktable 21 as an example, when the robotic arm 61 moves between the loading bin and the first worktable 21, the first gripper 62 picks up the circuit board to be processed from the loading bin; the second gripper 63 picks up the circuit board that has been processed on the first worktable 21; the first gripper 62 places the circuit board to be processed onto the first worktable 21; and the second gripper 63 transfers the processed circuit board to the unloading bin. This dual-gripper design realizes the synchronous operation of picking up and unloading materials, greatly shortening the loading and unloading time.

[0066] In the aforementioned circuit board processing equipment, this embodiment implements a circuit board inspection method. The core of this method lies in utilizing the cooperation of a movable second inspection unit 52 and a first inspection unit 51 to perform alternating transmission inspection on circuit boards on dual worktables. The specific inspection steps are as follows:

[0067] Step 1: Inspection of the first workbench. For example... Figure 1 As shown, the spindle assembly 10 is first moved along the slide rail 31 of the crossbeam 30 to above the first worktable 21, while the second detection unit 52 is moved along the guide rail 421 to below the first worktable 21. When the first detection unit 51 and the second detection unit 52 on the spindle assembly 10 are aligned with each other in the third direction (Z-axis), they form a transmission light path. At this time, the second detection unit 52 emits detection light (e.g., X-ray), which is transmitted through the first worktable 21 and the circuit board 23 supported on it, and is received by the first detection unit 51. By analyzing the received transmission image, the control system can accurately obtain the actual coordinates of the target positions (such as targets to be drilled, pin holes, anti-fool holes, or positioning holes) in the inner layer of the circuit board 23. These target positions are usually blocked by the circuit layer on the surface of the circuit board, but the transmission detection method can effectively penetrate the surface layer and obtain the inner layer information. Based on the detection results, the control system calculates the expansion and contraction parameters and positional deviation of the circuit board, and accurately controls the spindle assembly 10 to perform drilling on the circuit board 23 on the first worktable 21.

[0068] Step Two: Workstation Switching and Inspection of the Second Workbench. For example... Figure 2As shown, after the inspection and processing on the first worktable is completed, the equipment automatically switches to the second worktable 22: the spindle assembly 10 is controlled to move along the crossbeam 30, moving from above the first worktable 21 to above the second worktable 22. Simultaneously, the second inspection unit 52 is controlled to move along the guide rail 421, passing under the first worktable 21 through the hole 422 on the second base 42, and moving to below the second worktable 22. When the first inspection unit 51 and the second inspection unit 52 are aligned again at the second worktable, the above inspection process is repeated: the second inspection unit 52 emits X-rays that penetrate the second worktable 22 and the circuit board 23 on it; the first inspection unit 51 receives the transmitted light and analyzes the target position; and the control system controls the spindle assembly 10 to process the circuit board 23 on the second worktable 22 based on the inspection results.

[0069] Step 3: Inspection Cycle. After the second worktable completes processing, the second inspection unit 52 passes through the hole 422 again and returns from under the second worktable 22 to under the first worktable 21, ready for the next round of inspection. This cycle repeats, with the second inspection unit 52 moving alternately under the two worktables, working in conjunction with the first inspection unit 51 on the spindle assembly 10 to achieve continuous transmission inspection and processing of the circuit boards on the two worktables.

[0070] The coordinated operation of inspection and processing involves the simultaneous operation of the aforementioned inspection methods and the loading / unloading device 60 (e.g., ...). Figure 4 (As shown) Working in conjunction with the inspection and processing unit, parallel operations are achieved: When the first worktable 21 is performing inspection and processing in cooperation with the spindle assembly 10 and the second inspection unit 52, the loading and unloading device 60 simultaneously performs loading and unloading operations on the second worktable 22. Once the first worktable 21 has completed processing, the spindle assembly 10 and the second inspection unit 52 immediately switch to the second worktable 22 to begin inspection and processing, while the loading and unloading device 60 switches back to the first worktable 21 to perform loading and unloading operations. This fully parallel mode of inspection, processing, and loading / unloading minimizes equipment downtime and significantly improves production efficiency.

[0071] The circuit board processing equipment and its testing method provided in this embodiment achieve an optimized balance between cost and efficiency through the following key designs. First, the structural design supports the testing method. The holes 422 on the second base 42 and the extended arrangement of the guide rails 421 allow the second testing unit 52 to move back and forth under the two worktables, providing a structural basis for the alternating testing method. This also avoids configuring a separate testing system for each worktable, reducing costs. Second, the testing method is clear and concise. Based on the above structure, a standardized testing process of "first worktable testing → station switching → second worktable testing → return loop" is formed, making the equipment's operating logic clear and easy to control. Third, the testing method is flexible and adjustable. Different configurations of the first testing unit (single-head reciprocating or double-head fixed) allow the testing method to adapt to different equipment structures and process requirements, improving the method's versatility. Fourth, collaborative operation improves efficiency. The testing method and loading / unloading operations are highly coordinated, achieving full parallel operation under dual-station alternating operation, significantly improving the equipment's production efficiency.

[0072] This embodiment is suitable for small to medium batch production scenarios where cost is sensitive and the requirements for single-station processing efficiency are not extreme. By configuring a single spindle and a single set of inspection systems, dual-station alternating operation is achieved while controlling costs.

[0073] Example 2

[0074] This embodiment uses a two-axis drilling device as an example to describe its structure and workflow in detail. The main difference from Embodiment 1 lies in the configuration of the spindle assembly.

[0075] like Figure 3 As shown, the circuit board processing equipment in this embodiment includes: a worktable 20, including a first worktable 21 and a second worktable 22; a crossbeam 30, mounted above the worktable 20; a spindle assembly 10, slidably connected to the slide rail 31 of the crossbeam 30, including a first spindle assembly 11 and a second spindle assembly 12, respectively corresponding to the first worktable 21 and the second worktable 22; a base 40, located below the worktable; a base, including a first base 41, a second base 42, and a third base 43; a first detection unit 51, disposed on the first spindle assembly 11 and the second spindle assembly 12, one of each spindle assembly; and a second detection unit 52, disposed below the worktable 20, capable of reciprocating along a first direction below the two worktables.

[0076] This embodiment also has the same structural features as Embodiment 1: a hole 422 on the second base 42, a guide rail 421 extending along the first direction, and a second detection part 52 slidably disposed on the guide rail 421.

[0077] Compared to Embodiment 1, this embodiment achieves parallel processing of two workstations by adding a spindle. To balance cost and efficiency, the two workstations still share a second inspection unit 52 located below, meaning that transmission inspection of the circuit boards at both workstations still needs to be performed alternately. Since processing time is typically longer than inspection time, this alternating inspection mode can highly overlap with parallel processing, thereby achieving higher overall output than in Embodiment 1.

[0078] In this embodiment of the circuit board processing equipment, a circuit board inspection method with a dual-spindle configuration is implemented. The specific steps are as follows: Step 1: First station inspection. The second inspection unit 52 is controlled to move below the first worktable 21 and align with the first inspection unit 51 above the first worktable 21 to perform X-ray inspection of the target position of the circuit board 23 on the first worktable 21. Specifically, the first spindle assembly 11 moves above the first worktable 21, while the second inspection unit 52 moves along the guide rail 421 to below the first worktable 21 until the first inspection unit 51 on the first spindle assembly 11 is aligned with the second inspection unit 52. The X-rays emitted by the second inspection unit 52 penetrate the first worktable 21 and the circuit board 23 on it. The first inspection unit 51 receives the signal and analyzes the target position. The control system controls the first spindle assembly 11 to perform drilling on the first worktable 21 accordingly.

[0079] Step two, second-station inspection: The second inspection unit 52 is controlled to pass through the hole 422 and move from under the first worktable 21 to under the second worktable 22, aligning with the first inspection unit 51 above the second worktable 22 to perform transmission detection of the target position of the circuit board 23 on the second worktable 22. During or after processing at the first station, the drive mechanism moves the second inspection unit 52 along the guide rail 421 through the hole 422 to under the second worktable 22. The second spindle assembly 12 moves above the second worktable 22, aligning the first inspection unit 51 with the second inspection unit 52, completing the inspection of the circuit board on the second worktable 22. Subsequently, the control system controls the second spindle assembly 12 to perform processing.

[0080] Step three, the alternating detection mechanism, controls the second detection unit 52 to pass through the hole 422, return from under the second worktable 22 to under the first worktable 21, and repeats the above steps to alternately perform transmission detection on the circuit boards on the first worktable 21 and the second worktable 22. When the first worktable 21 is in the processing state, the second detection unit 52 moves to the second station to complete the detection; and vice versa. The two spindle assemblies (first spindle assembly 11 and second spindle assembly 12) are each equipped with a first detection unit 51 and share a set of second detection units 52, realizing alternating detection and independent processing at two stations.

[0081] The structure and operation of the loading and unloading device 60 are the same as in Embodiment 1 (e.g. Figure 4As shown in the figure, parallel loading and unloading of materials at two workstations can be achieved.

[0082] This embodiment is suitable for high-volume production scenarios with high processing efficiency requirements. The dual-spindle configuration allows the first worktable 21 and the second worktable 22 to process simultaneously. Although the second inspection unit 52 needs to move back and forth between the two workstations to complete the inspection, the inspection time partially overlaps with the processing time, achieving a high degree of parallelism between inspection and processing. This design increases the number of spindles to improve processing capacity while controlling costs by sharing the lower inspection unit (second inspection unit 52). Combined with dual-gripper loading and unloading, the overall production efficiency is further improved compared to the single-spindle solution, and space utilization is high, achieving a good balance between efficiency and cost.

[0083] Example 3

[0084] This embodiment uses a biaxial drilling device as an example to describe its structure and workflow in detail. The main difference from Embodiments 1 and 2 lies in the configuration and operating mode of the detection system.

[0085] Both this embodiment and Embodiment Two employ dual spindles, but their operating modes are drastically different. Embodiment Two aims for parallel independent processing on two worktables; while this embodiment prioritizes high-efficiency processing on a single worktable—by synchronously executing the same processing program on both spindles, the processing efficiency of a single station is nearly doubled. To this end, this embodiment equips each spindle with a complete set of inspection systems (i.e., the first inspection unit 51 and the second inspection unit 52 appear in pairs). When the two spindles switch to either worktable, both inspection systems can work simultaneously, quickly completing multi-point inspection of the circuit board and providing accurate data for subsequent efficient synchronous processing. The two worktables still operate in an alternating mode, working in conjunction with the loading and unloading device 60 to maximize efficiency.

[0086] like Figure 5 As shown, the circuit board processing equipment of this embodiment includes: a worktable 20, comprising a first worktable 21 and a second worktable 22 arranged along a first direction (X-axis direction); a crossbeam 30, mounted above the worktable 20; a spindle assembly 10, slidably connected to the slide rail 31 of the crossbeam 30, movable along the first direction, the spindle assembly 10 comprising a first spindle assembly 11 and a second spindle assembly 12, which can move synchronously; a base 40, located below the worktable 20; a base, including a first base 41, a second base 42, and a third base 43, spaced apart along the first direction on the base 40, used to support the worktable 20; a first detection unit 51, disposed on the first spindle assembly 11 and the second spindle assembly 12, one for each spindle assembly; and two second detection units 52, disposed below the worktable 20, corresponding one-to-one with the first detection units 51, both second detection units 52 can reciprocate between below the first worktable 21 and below the second worktable 22 along the first direction.

[0087] In this embodiment, the second base 42 has a through hole 422 extending along the first direction. The guide rail 421 is disposed on the base 40 and extends along the first direction, passing through the through hole 422 from under the first worktable 21 to under the second worktable 22. Both second detection units 52 are slidably disposed on the guide rail 421 and can be independently or in conjunction with the drive mechanism, passing through the through hole 422 to achieve switching between the two workstations.

[0088] In the circuit board processing equipment of this embodiment, such as Figure 5 As shown, a circuit board testing method is applied, which specifically includes the following steps:

[0089] Step 1: First-station inspection and processing. The first spindle assembly 11 and the second spindle assembly 12 move along the crossbeam 30 to above the first worktable 21. Simultaneously, two second detection units 52 move along the guide rail 421 to below the first worktable 21 until the two first detection units 51 are vertically aligned with their corresponding two second detection units 52. X-rays emitted by the two second detection units 52 penetrate the first worktable 21 and the circuit board 23 on it. The two first detection units 51 receive the signals and collaboratively analyze the target position inside the circuit board to obtain more comprehensive positional information (such as multi-point positioning). The control system calculates the expansion and contraction parameters and positional deviation based on the detection results. During the processing stage, based on the data obtained from the detection, the control system precisely controls the first spindle assembly 11 and the second spindle assembly 12 to synchronously replicate the processing of the circuit board 23 on the first worktable 21. Here, "synchronous replication" means that the two spindles execute the same processing program (such as drilling holes of the same pattern simultaneously), which can significantly improve the processing efficiency of a single station.

[0090] Step 2: Station switching and second station inspection and processing. After the first station processing is completed, the first spindle assembly 11 and the second spindle assembly 12 move along the crossbeam 30 to above the second worktable 22. At the same time, the two second inspection units 52 move along the guide rail 421 through the hole 422 to below the second worktable 22, and repeat the above inspection and processing process.

[0091] Step 3: The structure and operation of the loading and unloading device 60 are the same as in Embodiments 1 and 2 (e.g., ...). Figure 4 As shown, the device is equipped with a dual-gripper robot 61, enabling parallel loading and unloading of materials at the first worktable 21 and the second worktable 22. When one workstation is in the detection / processing state, the loading and unloading device 60 transports materials to the other workstation, minimizing waiting time.

[0092] This embodiment is suitable for high-end mass production scenarios with extremely high single-station processing efficiency requirements. By configuring dual spindles and dual inspection systems, synchronous dual-axis processing of a single worktable is achieved, significantly improving single-station output efficiency. The two second inspection units 52 share the same guide rail 421 and move synchronously during workstation switching, ensuring parallelism and speed of inspection. Simultaneously, the dual-station alternating operation mode and the coordinated loading and unloading of the dual grippers optimize the overall efficiency of the equipment. Compared to Embodiment Two, this solution is more suitable for high-volume production scenarios with higher processing speed requirements, maximizing equipment output.

[0093] Example 4

[0094] This embodiment takes a single-axis drilling equipment as an example. Based on the structure of Embodiment 1, it further details the optimal workflow to achieve the ultimate parallelism of inspection, processing and loading / unloading.

[0095] Compared to Embodiment 1, this embodiment adds an additional loading and unloading device, enabling the alternating transport of circuit boards by the two loading and unloading devices on both sides of the crossbeam. Since the inspection and processing time is typically longer than the loading and unloading transport time, this alternating transport mode can highly overlap with the alternating inspection and processing, thereby achieving a higher overall output than Embodiment 1 and improving processing efficiency.

[0096] The device in this embodiment includes a first worktable 21, a second worktable 22, a spindle assembly 10, and two sets of loading and unloading devices (front loading and rear unloading) respectively located on the front and rear sides of the crossbeam 30. Two supports are provided on the front and rear sides of the crossbeam, each support slidably fitted with a set of loading and unloading devices. One set of devices is used to sequentially transport circuit boards to be processed from the loading box to the two worktables, while the other set is used to sequentially transport processed circuit boards from the two worktables to the unloading box. One set of devices is dedicated to loading: sequentially transporting boards to be processed from the loading box to the first and second worktables. The other set is dedicated to unloading: sequentially transporting processed boards from the first and second worktables to the unloading box. By placing the loading and unloading devices on both sides of the crossbeam, the loading and unloading paths are physically separated, avoiding interference between the robotic arms and providing a spatial basis for subsequent timing optimization.

[0097] The circuit board processing equipment's worktable includes a first worktable and a second worktable, arranged along a first direction. Two sets of loading and unloading devices are installed on the front and rear sides of the crossbeam, arranged along a second direction. The loading, unloading, inspection, and processing processes of the circuit board processing equipment include the following steps:

[0098] Step 1: Initial loading. A set of loading and unloading devices on the front side transports two circuit boards from the loading box and places them sequentially on the first workbench 21 and the second workbench 22.

[0099] Step 2: Processing the first worktable. Control the spindle assembly 10 to move above the first worktable 21, and the second detection unit 52 to move below it. After alignment, the circuit board on the first worktable 21 is inspected and processed.

[0100] Step 3: Process the second workbench while the first workbench performs loading and unloading.

[0101] After the first workbench 21 has completed processing, the second detection unit 52 is controlled to move from below the first workbench 21 through the hole 422 to below the second workbench 22. Simultaneously, the spindle assembly 10 moves above the second workbench 22, aligns, and performs detection processing on the circuit board on the second workbench 22. While the second workbench 22 is performing detection processing, the following parallel operations are performed: The first workbench 21 is controlled to move from a processing position (e.g., the front side of the crossbeam) to a unloading position (e.g., the rear side of the crossbeam). The unloading / loading device (unloading robot) located at the rear side is controlled to pick up the processed circuit board from the first workbench 21 and transport it to the unloading bin. The first workbench 21 is controlled to move from the unloading position to the loading position (e.g., the front side of the crossbeam). The unloading / loading device (loading robot) located at the front side is controlled to transport the circuit board to be processed from the loading bin and place it on the first workbench 21.

[0102] Step 4: Process the first workbench while the second workbench performs loading and unloading.

[0103] After the second worktable 22 has completed its processing, the spindle assembly 10 and the second detection unit 52 are moved to the first worktable 21 for alignment and inspection of the circuit board on the first worktable 21. Similarly, while the first worktable 21 is being inspected, the following parallel operations are performed: the second worktable 22 is moved to the rear unloading position, where the rear unloading robot unloads the processed circuit board; the second worktable 22 is moved to the front loading position, where the front loading robot places the circuit board to be processed.

[0104] Step 5: Cyclic Operation. Repeat steps 3 and 4 above to achieve the reciprocating motion of the spindle assembly 10 between the first worktable 21 and the second worktable 22, alternating between inspection and processing. While the spindle assembly is inspecting and processing, the two sets of loading and unloading devices alternately perform loading and unloading operations for the other worktable. Since the inspection and processing time is usually much longer than the time required for the loading and unloading devices to transport the circuit board, this precise parallel timing design allows the loading and unloading operations to be completely hidden within the processing time, avoiding waiting of the spindle assembly and greatly improving the equipment's production efficiency.

[0105] In summary, this invention achieves low-cost, high-precision transmission detection through the cooperation of a dual worktable and a movable lower detection unit; and meets the production efficiency requirements of different scenarios through different levels of loading and unloading configurations such as single robot with dual grippers and dual robot with division of labor, as well as highly parallel timing control.

[0106] The various embodiments of this application have been described above. These descriptions are exemplary and not exhaustive, nor are they limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is chosen to best explain the principles, practical applications, or technological improvements to the embodiments in the market, or to enable others skilled in the art to understand the embodiments disclosed herein. The scope of this application is defined by the appended claims.

Claims

1. A circuit board processing equipment, characterized in that, include: The worktable includes a first worktable and a second worktable arranged along a first direction; A crossbeam is erected above the workbench; The spindle assembly is slidably connected to the crossbeam and can move along the first direction; A base, located below the workbench, is used to support the workbench; A base, disposed on the base, is used to support the worktable; The first detection unit is located above the workbench; The second detection unit is disposed below the worktable and can reciprocate between the first worktable and the second worktable along the first direction; the first detection unit and the second detection unit can move to a mutually aligned position to conduct transmissive detection on the target position of the circuit board carried on the first worktable or the second worktable, and the spindle assembly processes the circuit board based on the detection result.

2. The circuit board processing equipment according to claim 1, characterized in that, The base includes a first base, a second base, and a third base spaced apart along the first direction; the first worktable is slidably supported on the first base and the second base along the second direction; the second worktable is slidably supported on the second base and the third base along the second direction.

3. The circuit board processing equipment according to claim 2, characterized in that, The base is provided with a guide rail extending along the first direction, and the second base is provided with a hole extending along the first direction. The guide rail extends from below the first worktable through the hole to below the second worktable.

4. The circuit board processing equipment according to claim 3, characterized in that, The second detection unit is slidably disposed on the guide rail and can pass through the hole under the drive of a drive mechanism, reciprocating between the bottom of the first worktable and the bottom of the second worktable.

5. The circuit board processing equipment according to claim 3, characterized in that, The height of the hole in the vertical direction is greater than or equal to one-half of the height of the second base, and less than or equal to two-thirds of the height of the second base.

6. The circuit board processing equipment according to claim 1, characterized in that, The vertical projection of the motion trajectory of the second detection unit onto the base overlaps at least partially with the vertical projection of the motion trajectory of the first detection unit onto the base.

7. The circuit board processing equipment according to claim 1, characterized in that, The first detection unit is one, and can reciprocate between the first workbench and the second workbench along the first direction; or, the first detection unit is two, which are fixedly or slidably mounted on the crossbeam and respectively correspond to the first workbench and the second workbench.

8. The circuit board processing equipment according to claim 1, characterized in that, The first detection unit is disposed on the spindle assembly and moves synchronously with the spindle assembly; or, the first detection unit is connected to the crossbeam through an independent sliding mechanism.

9. The circuit board processing equipment according to any one of claims 1 to 8, characterized in that, When the first detection unit and the second detection unit are aligned with each other, the detection light emitted by the first detection unit or the second detection unit passes through the worktable and the circuit board and is received by the other detection unit.

10. A circuit board testing method, characterized in that, include: The second detection unit is controlled to move below the first worktable and align with the first detection unit above the first worktable to conduct transmissive detection of the target position of the circuit board on the first worktable. The second detection unit is controlled to pass through the hole, move from under the first workbench to under the second workbench, and align with the first detection unit above the second workbench to transmit and detect the target position of the circuit board on the second workbench. The second detection unit is controlled to pass through the hole and return from under the second worktable to under the first worktable, and the above steps are repeated to alternately perform transmission detection on the circuit boards on the first worktable and the second worktable.

11. The circuit board testing method according to claim 10, characterized in that, The first detection unit is one, and it can reciprocate between the first worktable and the second worktable along the first direction to align with the second detection unit in sequence; or, the first detection unit is two, respectively disposed on the first spindle assembly and the second spindle assembly or independently disposed on the crossbeam, and respectively corresponding to the first worktable and the second worktable to align with the second detection unit in sequence.

12. The circuit board testing method according to claim 10, characterized in that, The first detection unit and the second detection unit are aligned to form a transmission light path to detect at least one of the pin holes, anti-fool holes, positioning holes, and machining holes on the circuit board, so as to determine the positioning deviation, expansion and contraction deviation, or actual position of the hole to be machined on the circuit board.

13. The circuit board testing method according to claim 10, characterized in that, While inspecting and processing the circuit boards on the first workbench, the loading and unloading device is controlled to perform loading and unloading operations on the second workbench.

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