A control system and method for a placement machine for water pump motor control boards

Abstract

The application relates to a control system and method of a chip mounter for a water pump motor control board, the method comprising determining identity code information of the control board according to received identity information; acquiring a chip electronic device queue associated with the identity code information; verifying the acquired chip electronic device queue associated with the identity code information; grabbing electronic devices in the chip electronic device queue in sequence; determining accurate position coordinates of the electronic devices on a grabbing unit and correcting end position coordinates of the grabbing unit using the accurate position coordinates; and fixing the electronic devices corresponding to the end position coordinates to the control board according to the corrected end position coordinates. The control system and method of the chip mounter for the water pump motor control board disclosed by the application determine accurate position coordinates of the electronic devices by correcting mechanical positioning in a bidirectional visual positioning manner, so that more accurate position coordinates are provided for the chip mounting position of the electronic devices.

Description

Technical Field

[0001] This application relates to the field of automation control technology, and in particular to a control system and method for a chip mounter for a water pump motor control board. Background Technology

[0002] The pick-and-place machine control system for water pump motor control boards is a precise, multi-module collaborative real-time motion and logic control system. Its core objective is to mount components such as resistors, capacitors, ICs, MOSFETs, and connectors onto designated pads on the PCB at high speed and with high precision.

[0003] The pick-and-place machine control system mainly consists of an industrial main control computer, motion controller, vision positioning system, and detection system. The vision positioning system is an important component of the pick-and-place machine control system because precise positioning is required to ensure the accuracy of the placement position during the high-speed gripping and placement of electronic components. In terms of mechanical structure, the current main methods for determining the position are servo closed-loop control and high-precision position sensors. However, during use, motion errors accumulate, and individual errors between electronic components also directly affect the positioning accuracy.

[0004] Specifically, relying solely on high-precision mechanical positioning cannot meet the positioning requirements of electronic devices in high-speed and high-precision scenarios. Further research is needed on how to compensate for the impact of individual errors between electronic devices on high-precision mechanical positioning. Summary of the Invention

[0005] This application provides a control system and method for a chip mounter for a water pump motor control board. The system determines the accurate position coordinates of electronic components by correcting the mechanical positioning through bidirectional visual positioning, thereby providing more accurate position coordinates for the chip mount position of the electronic components.

[0006] The above-mentioned objective of this application is achieved through the following technical solution: In a first aspect, this application provides a control method for a chip mounter for a water pump motor control board, comprising: The identity code information of the control panel is determined based on the received identity information; Retrieve the queue of patch electronic devices associated with identity coding information; Communicate with the transport unit to verify the queue of patch electronic devices associated with the acquired identification code information; Grab the electronic components from the surface mount electronic component queue according to their sequential order; Determine the precise position coordinates of the electronic devices on the gripping unit and use these precise position coordinates to correct the endpoint position coordinates of the gripping unit; The drive gripping unit fixes the electronic components corresponding to the endpoint position coordinates onto the control board according to the corrected endpoint position coordinates.

[0007] In one possible implementation of the first aspect, determining the precise position coordinates of the electronic device on the gripping unit includes determining the precise position coordinates of the electronic device on the gripping unit laterally and determining the precise position coordinates of the electronic device on the gripping unit longitudinally. The method for determining the precise position coordinates of electronic devices on the gripping unit horizontally is the same as the method for determining the precise position coordinates of electronic devices on the gripping unit vertically.

[0008] In one possible implementation of the first aspect, determining the precise position coordinates of the electronic devices on the grasping unit laterally includes: Determine the relative position of the electronic components on the gripping unit; The theoretical display content image of the electronic devices on the grasping unit is determined based on their relative positions; Extract the edge contours of electronic devices from the theoretically displayed content image to obtain the reference edge contours; Acquire the actual display image of the electronic devices on the grasping unit; Use edge extraction operators to extract the actual edge contours of electronic devices from the actual displayed image; Calculate the residual between the reference edge profile and the actual edge profile, and determine the position adjustment amount of the gripping unit based on the residual; The difference between the current position coordinates of the electronic device on the gripping unit and the position adjustment amount is used as the precise position coordinates of the electronic device on the gripping unit.

[0009] In one possible implementation of the first aspect, calculating the residual between the reference edge profile and the actual edge profile includes: The location of a first feature point is determined on a reference edge profile. The location of the first feature point includes the confluence of at least two lines, including straight lines and curves. The location of the second feature point is determined on the actual edge contour, and the location of the first feature point includes the confluence of at least two lines, including straight lines and curves; Calculate the floating-point coordinates of the merging point at the location of the first feature point; Calculate the floating-point coordinates of the merging point at the location of the second feature point; Calculate the difference between the floating-point coordinates belonging to the first feature point position and the floating-point coordinates belonging to the second feature point position, and use the difference as the residual between the reference edge contour and the actual edge contour; Among them, the number of the first feature point positions and the second feature point positions are the same and correspond one-to-one; When there are multiple differences, the mean of the differences is used as the residual between the reference edge profile and the actual edge profile.

[0010] In one possible implementation of the first aspect, calculating the floating-point coordinates of the merging point at the location of the first feature point includes: Select a feature point region on the reference edge contour. The feature point region includes NxN pixels, where N is a natural number greater than zero. Determine the edge segments on the contour that correspond to the feature point region. The edge segments include straight lines and curves. Identify the overlapping pixels of the edge line segments; the number of overlapping pixels can be one or more. Calculate the floating-point coordinates of the merging point using overlapping pixels.

[0011] In one possible implementation of the first aspect, when the number of overlapping pixels is one, when calculating the floating-point coordinates of the merging point using the overlapping pixels, the coordinates of the center position of the overlapping pixels are used as the floating-point coordinates of the merging point; When there are multiple overlapping pixels, calculate the coordinates of the center position of the region composed of multiple overlapping pixels and use the coordinates of the center position as the floating-point coordinates of the merging point.

[0012] In one possible implementation of the first aspect, determining the overlapping pixels of the edge segments further includes: Determine multiple centerline position points of the edge line segment and use these multiple centerline position points to fit and generate the edge line segment, thus obtaining the fitted edge line segment; Determine the endpoint of the fitted edge line segment; The pixel at the end point of the fitted edge line segment is taken as the overlapping pixel of the edge line segment.

[0013] Secondly, this application provides a control device for a chip mounter for a water pump motor control board, comprising: The first information processing unit is used to determine the identity code information of the control board based on the received identity information. The second information processing unit is used to acquire the queue of patch electronic devices associated with the identity coding information; The information verification unit is used to communicate with the transportation unit to verify the queue of patch electronic devices associated with the acquired identity code information; The grabbing unit is used to grab electronic devices from the queue of surface-mount electronic devices in a sequential order. The position unit is used to determine the precise position coordinates of the electronic components on the gripping unit and to correct the end position coordinates of the gripping unit using the precise position coordinates; The placement unit is used to drive the gripping unit to fix the electronic device corresponding to the endpoint position coordinates onto the control board according to the modified endpoint position coordinates.

[0014] Thirdly, this application provides a control system for a chip mounter for a water pump motor control board, the system comprising: One or more memories for storing instructions; and One or more processors are configured to call and execute the instructions from the memory to perform the methods described in the first aspect and any possible implementation thereof.

[0015] Fourthly, this application provides a computer-readable storage medium, the computer-readable storage medium comprising: The program, when run by a processor, is executed as described in the first aspect and any possible implementation thereof.

[0016] Fifthly, this application provides a computer program product, including program instructions that, when run by a computing device, execute the method described in the first aspect and any possible implementation thereof.

[0017] Sixthly, this application provides a chip system including a processor for implementing the functions involved in the foregoing aspects, such as generating, receiving, transmitting, or processing the data and / or information involved in the foregoing methods.

[0018] This chip system can consist of chips or include chips and other discrete components.

[0019] In one possible design, the chip system also includes a memory for storing necessary program instructions and data. The processor and the memory can be decoupled and located on different devices, connected via wired or wireless means, or the processor and the memory can be coupled to the same device. Attached Figure Description

[0020] Figure 1 This is a structural schematic diagram of a chip mounter provided in this application.

[0021] Figure 2 This is a flowchart illustrating the steps of a chip mounter control method for a water pump motor control board provided in this application.

[0022] Figure 3 This is a schematic diagram of a surface-mount electronic device being moved onto a circuit board, as provided in this application.

[0023] Figure 4 This is a schematic diagram of a residual provided in this application. Detailed Implementation

[0024] The technical solutions in this application will be further described in detail below with reference to the accompanying drawings.

[0025] To better understand the technical solutions in this application, a brief introduction to the pick-and-place machine is given first, such as... Figure 1 The pick-and-place machine shown mainly consists of three parts: a worktable 101, an electronic component transport module 102, and a robot arm 103. The circuit board is placed on the worktable 101. The electronic component transport module 102 is responsible for providing the electronic components to the robot arm 103. The robot arm 103 sequentially picks up the electronic components from the electronic component transport module 102 and places them at the designated positions on the circuit board on the worktable 101.

[0026] It should be noted that this is a simple introduction for ease of understanding and does not constitute an explanation or limitation of the pick-and-place machine.

[0027] This application discloses a control method for a chip mounter used in a water pump motor control board. Please refer to [link to relevant documentation]. Figure 2 In some examples, the control method for a chip mounter for a water pump motor control board disclosed in this application includes the following steps: S101, determine the identity code information of the control board based on the received identity information; S102, Obtain the queue of patch electronic devices associated with the identity coding information; S103, communicate with the transport unit to verify the queue of patch electronic devices associated with the identity coding information; S104: Grab electronic devices from the surface mount electronic device queue according to their sequential order; S105, determine the precise position coordinates of the electronic device on the gripping unit and use the precise position coordinates to correct the end position coordinates of the gripping unit; S106, the drive gripping unit fixes the electronic device corresponding to the endpoint position coordinates onto the control board according to the corrected endpoint position coordinates.

[0028] In one possible implementation of the first aspect, determining the precise position coordinates of the electronic device on the gripping unit includes determining the precise position coordinates of the electronic device on the gripping unit laterally and determining the precise position coordinates of the electronic device on the gripping unit longitudinally. The method for determining the precise position coordinates of electronic devices on the gripping unit horizontally is the same as the method for determining the precise position coordinates of electronic devices on the gripping unit vertically.

[0029] In one possible implementation of the first aspect, determining the precise position coordinates of the electronic devices on the grasping unit laterally includes: Determine the relative position of the electronic components on the gripping unit; The theoretical display content image of the electronic devices on the grasping unit is determined based on their relative positions; Extract the edge contours of electronic devices from the theoretically displayed content image to obtain the reference edge contours; Acquire the actual display image of the electronic devices on the grasping unit; Use edge extraction operators to extract the actual edge contours of electronic devices from the actual displayed image; Calculate the residual between the reference edge profile and the actual edge profile, and determine the position adjustment amount of the gripping unit based on the residual; The difference between the current position coordinates of the electronic device on the gripping unit and the position adjustment amount is used as the precise position coordinates of the electronic device on the gripping unit.

[0030] In one possible implementation of the first aspect, calculating the residual between the reference edge profile and the actual edge profile includes: The location of a first feature point is determined on a reference edge profile. The location of the first feature point includes the confluence of at least two lines, including straight lines and curves. The location of the second feature point is determined on the actual edge contour, and the location of the first feature point includes the confluence of at least two lines, including straight lines and curves; Calculate the floating-point coordinates of the merging point at the location of the first feature point; Calculate the floating-point coordinates of the merging point at the location of the second feature point; Calculate the difference between the floating-point coordinates belonging to the first feature point position and the floating-point coordinates belonging to the second feature point position, and use the difference as the residual between the reference edge contour and the actual edge contour; Among them, the number of the first feature point positions and the second feature point positions are the same and correspond one-to-one; When there are multiple differences, the mean of the differences is used as the residual between the reference edge profile and the actual edge profile.

[0031] In one possible implementation of the first aspect, calculating the floating-point coordinates of the merging point at the location of the first feature point includes: Select a feature point region on the reference edge contour. The feature point region includes NxN pixels, where N is a natural number greater than zero. Determine the edge segments on the contour that correspond to the feature point region. The edge segments include straight lines and curves. Identify the overlapping pixels of the edge line segments; the number of overlapping pixels can be one or more. Calculate the floating-point coordinates of the merging point using overlapping pixels.

[0032] In one possible implementation of the first aspect, when the number of overlapping pixels is one, when calculating the floating-point coordinates of the merging point using the overlapping pixels, the coordinates of the center position of the overlapping pixels are used as the floating-point coordinates of the merging point; When there are multiple overlapping pixels, calculate the coordinates of the center position of the region composed of multiple overlapping pixels and use the coordinates of the center position as the floating-point coordinates of the merging point.

[0033] In one possible implementation of the first aspect, determining the overlapping pixels of the edge segments further includes: Determine multiple centerline position points of the edge line segment and use these multiple centerline position points to fit and generate the edge line segment, thus obtaining the fitted edge line segment; Determine the endpoint of the fitted edge line segment; The pixel at the end point of the fitted edge line segment is taken as the overlapping pixel of the edge line segment.

[0034] This application also provides a control device for a chip mounter for a water pump motor control board, comprising: The first information processing unit is used to determine the identity code information of the control board based on the received identity information. The second information processing unit is used to acquire the queue of patch electronic devices associated with the identity coding information; The information verification unit is used to communicate with the transportation unit to verify the queue of patch electronic devices associated with the acquired identity code information; The grabbing unit is used to grab electronic devices from the queue of surface-mount electronic devices in a sequential order. The position unit is used to determine the precise position coordinates of the electronic components on the gripping unit and to correct the end position coordinates of the gripping unit using the precise position coordinates; The placement unit is used to drive the gripping unit to fix the electronic device corresponding to the endpoint position coordinates onto the control board according to the modified endpoint position coordinates.

[0035] Furthermore, determining the precise position coordinates of the electronic devices on the gripping unit includes determining the precise position coordinates of the electronic devices on the gripping unit laterally and determining the precise position coordinates of the electronic devices on the gripping unit longitudinally. The method for determining the precise position coordinates of electronic devices on the gripping unit horizontally is the same as the method for determining the precise position coordinates of electronic devices on the gripping unit vertically.

[0036] Furthermore, determining the precise position coordinates of the electronic devices on the grasping unit laterally includes: Determine the relative position of the electronic components on the gripping unit; The theoretical display content image of the electronic devices on the grasping unit is determined based on their relative positions; Extract the edge contours of electronic devices from the theoretically displayed content image to obtain the reference edge contours; Acquire the actual display image of the electronic devices on the grasping unit; Use edge extraction operators to extract the actual edge contours of electronic devices from the actual displayed image; Calculate the residual between the reference edge profile and the actual edge profile, and determine the position adjustment amount of the gripping unit based on the residual; The difference between the current position coordinates of the electronic device on the gripping unit and the position adjustment amount is used as the precise position coordinates of the electronic device on the gripping unit.

[0037] Furthermore, calculating the residual between the reference edge profile and the actual edge profile includes: The location of a first feature point is determined on a reference edge profile. The location of the first feature point includes the confluence of at least two lines, including straight lines and curves. The location of the second feature point is determined on the actual edge contour, and the location of the first feature point includes the confluence of at least two lines, including straight lines and curves; Calculate the floating-point coordinates of the merging point at the location of the first feature point; Calculate the floating-point coordinates of the merging point at the location of the second feature point; Calculate the difference between the floating-point coordinates belonging to the first feature point position and the floating-point coordinates belonging to the second feature point position, and use the difference as the residual between the reference edge contour and the actual edge contour; Among them, the number of the first feature point positions and the second feature point positions are the same and correspond one-to-one; When there are multiple differences, the mean of the differences is used as the residual between the reference edge profile and the actual edge profile.

[0038] Furthermore, calculating the floating-point coordinates of the merging point at the location of the first feature point includes: Select a feature point region on the reference edge contour. The feature point region includes NxN pixels, where N is a natural number greater than zero. Determine the edge segments on the contour that correspond to the feature point region. The edge segments include straight lines and curves. Identify the overlapping pixels of the edge line segments; the number of overlapping pixels can be one or more. Calculate the floating-point coordinates of the merging point using overlapping pixels.

[0039] Furthermore, when there is only one overlapping pixel, when calculating the floating-point coordinates of the merging point using the overlapping pixel, the coordinates of the center position of the overlapping pixel are used as the floating-point coordinates of the merging point. When there are multiple overlapping pixels, calculate the coordinates of the center position of the region composed of multiple overlapping pixels and use the coordinates of the center position as the floating-point coordinates of the merging point.

[0040] Furthermore, determining the overlapping pixels of edge line segments also includes: Determine multiple centerline position points of the edge line segment and use these multiple centerline position points to fit and generate the edge line segment, thus obtaining the fitted edge line segment; Determine the endpoint of the fitted edge line segment; The pixel at the end point of the fitted edge line segment is taken as the overlapping pixel of the edge line segment.

[0041] In one example, the unit in any of the above devices may be one or more integrated circuits configured to implement the above methods, such as one or more application-specific integrated circuits (ASICs), or one or more digital signal processors (DSPs), or one or more field-programmable gate arrays (FPGAs), or a combination of at least two of these integrated circuit forms.

[0042] For example, when the units in the device can be implemented through a processing element scheduler, the processing element can be a general-purpose processor, such as a central processing unit (CPU) or other processor capable of calling programs. Alternatively, these units can be integrated together to form a system-on-a-chip (SOC).

[0043] In this application, various objects such as messages / information / devices / network elements / systems / apparatus / actions / operations / processes / concepts may be named. It is understood that these specific names do not constitute a limitation on the relevant objects. The names may be changed depending on the scenario, context, or usage habits. The understanding of the technical meaning of the technical terms in this application should be mainly determined from their functions and technical effects embodied / performed in the technical solution.

[0044] Those skilled in the art will understand that, for the sake of convenience and brevity, the specific working processes of the systems, devices, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here.

[0045] In the several embodiments provided in this application, it should be understood that the disclosed systems, apparatuses, and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between apparatuses or units may be electrical, mechanical, or other forms.

[0046] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0047] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0048] It should also be understood that in the various embodiments of this application, the terms "first," "second," etc., are merely to indicate that multiple objects are different. For example, a first time window and a second time window are only to indicate different time windows. They should not have any effect on the time windows themselves, and the aforementioned terms "first," "second," etc., should not impose any limitations on the embodiments of this application.

[0049] It should also be understood that, in the various embodiments of this application, unless otherwise specified or in case of logical conflict, the terms and / or descriptions between different embodiments are consistent and can be referenced by each other, and the technical features in different embodiments can be combined to form new embodiments according to their inherent logical relationships.

[0050] If the aforementioned functions are implemented as software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or a portion of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a computer-readable storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of this application. The aforementioned computer-readable storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0051] This application also provides a control system for a chip mounter for a water pump motor control board, the system comprising: One or more memories for storing instructions; and One or more processors are configured to retrieve and execute the instructions from the memory, performing the methods described above.

[0052] This application also provides a computer program product including instructions that, when executed, cause the terminal device and the network device to perform operations corresponding to the methods described above.

[0053] This application also provides a chip system including a processor for implementing the functions involved in the above description, such as generating, receiving, transmitting, or processing the data and / or information involved in the above methods.

[0054] This chip system can consist of chips or include chips and other discrete components.

[0055] The processor mentioned above can be a CPU, a microprocessor, an ASIC, or one or more integrated circuits that execute a program to control the method of transmitting the feedback information described above.

[0056] In one possible design, the chip system also includes a memory for storing necessary program instructions and data. The processor and the memory can be decoupled and located on different devices, connected via wired or wireless means to support the chip system in implementing the various functions described in the above embodiments. Alternatively, the processor and the memory can also be coupled to the same device.

[0057] Optionally, the computer instructions are stored in memory.

[0058] Optionally, the memory can be a storage unit within the chip, such as a register or cache. Alternatively, the memory can be a storage unit located outside the chip within the terminal, such as a ROM or other types of static storage devices that can store static information and instructions, such as RAM.

[0059] It is understood that the memory in this application may be volatile memory or non-volatile memory, or may include both volatile and non-volatile memory.

[0060] Non-volatile memory can be ROM, programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM), or flash memory.

[0061] Volatile memory can be RAM, which is used as an external cache. There are many different types of RAM, such as static random access memory (SRAM), dynamic random access memory (DRAM), synchronous dynamic random access memory (SDRAM), double data rate synchronous dynamic random access memory (DDR SDRAM), enhanced synchronous dynamic random access memory (ESDRAM), synchronous link dynamic random access memory (SLDRAM), and direct memory bus random access memory.

[0062] The embodiments described in this specific implementation are preferred embodiments of this application and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A control method for a chip mounter used in a water pump motor control board, characterized in that, include: The identity code information of the control panel is determined based on the received identity information; Retrieve the queue of patch electronic devices associated with identity coding information; Communicate with the transport unit to verify the queue of patch electronic devices associated with the acquired identification code information; Grab the electronic components from the surface mount electronic component queue according to their sequential order; Determine the precise position coordinates of the electronic devices on the gripping unit and use these precise position coordinates to correct the endpoint position coordinates of the gripping unit; The drive gripping unit fixes the electronic components corresponding to the endpoint position coordinates onto the control board according to the corrected endpoint position coordinates.

2. The control method for a chip mounter for a water pump motor control board according to claim 1, characterized in that, Determining the precise position coordinates of the electronic devices on the gripping unit includes determining the precise position coordinates of the electronic devices on the gripping unit laterally and determining the precise position coordinates of the electronic devices on the gripping unit longitudinally. The method for determining the precise position coordinates of electronic devices on the gripping unit horizontally is the same as the method for determining the precise position coordinates of electronic devices on the gripping unit vertically.

3. The control method for a chip mounter for a water pump motor control board according to claim 2, characterized in that, Determining the precise position coordinates of the electronic devices on the grasping unit laterally includes: Determine the relative position of the electronic components on the gripping unit; The theoretical display content image of the electronic devices on the grasping unit is determined based on their relative positions; Extract the edge contours of electronic devices from the theoretically displayed content image to obtain the reference edge contours; Acquire the actual display image of the electronic devices on the grasping unit; Use edge extraction operators to extract the actual edge contours of electronic devices from the actual displayed image; Calculate the residual between the reference edge profile and the actual edge profile, and determine the position adjustment amount of the gripping unit based on the residual; The difference between the current position coordinates of the electronic device on the gripping unit and the position adjustment amount is used as the precise position coordinates of the electronic device on the gripping unit.

4. The control method for a chip mounter for a water pump motor control board according to claim 3, characterized in that, Calculating the residual between the reference edge profile and the actual edge profile includes: The location of a first feature point is determined on a reference edge profile. The location of the first feature point includes the confluence of at least two lines, including straight lines and curves. The location of the second feature point is determined on the actual edge contour, and the location of the first feature point includes the confluence of at least two lines, including straight lines and curves; Calculate the floating-point coordinates of the merging point at the location of the first feature point; Calculate the floating-point coordinates of the merging point at the location of the second feature point; Calculate the difference between the floating-point coordinates belonging to the first feature point position and the floating-point coordinates belonging to the second feature point position, and use the difference as the residual between the reference edge contour and the actual edge contour; Among them, the number of the first feature point positions and the second feature point positions are the same and correspond one-to-one; When there are multiple differences, the mean of the differences is used as the residual between the reference edge profile and the actual edge profile.

5. The control method for a chip mounter for a water pump motor control board according to claim 4, characterized in that, Calculating the floating-point coordinates of the merging point at the location of the first feature point includes: Select a feature point region on the reference edge contour. The feature point region includes NxN pixels, where N is a natural number greater than zero. Determine the edge segments on the contour that correspond to the feature point region. The edge segments include straight lines and curves. Identify the overlapping pixels of the edge line segments; the number of overlapping pixels can be one or more. Calculate the floating-point coordinates of the merging point using overlapping pixels.

6. The control method for a chip mounter for a water pump motor control board according to claim 5, characterized in that, When there is only one overlapping pixel, when calculating the floating-point coordinates of the merging point using the overlapping pixel, the coordinates of the center position of the overlapping pixel are used as the floating-point coordinates of the merging point. When there are multiple overlapping pixels, calculate the coordinates of the center position of the region composed of multiple overlapping pixels and use the coordinates of the center position as the floating-point coordinates of the merging point.

7. The control method for a chip mounter for a water pump motor control board according to claim 5, characterized in that, Determining the overlapping pixels of edge line segments also includes: Determine multiple centerline position points of the edge line segment and use these multiple centerline position points to fit and generate the edge line segment, thus obtaining the fitted edge line segment; Determine the endpoint of the fitted edge line segment; The pixel at the end point of the fitted edge line segment is taken as the overlapping pixel of the edge line segment.

8. A control device for a chip mounter for a water pump motor control board, characterized in that, include: The first information processing unit is used to determine the identity code information of the control board based on the received identity information. The second information processing unit is used to acquire the queue of patch electronic devices associated with the identity coding information; The information verification unit is used to communicate with the transportation unit to verify the queue of patch electronic devices associated with the acquired identity code information; The grabbing unit is used to grab electronic devices from the queue of surface-mount electronic devices in a sequential order. The position unit is used to determine the precise position coordinates of the electronic components on the gripping unit and to correct the end position coordinates of the gripping unit using the precise position coordinates; The placement unit is used to drive the gripping unit to fix the electronic device corresponding to the endpoint position coordinates onto the control board according to the modified endpoint position coordinates.

9. A control system for a chip mounter for a water pump motor control board, characterized in that, The system includes: One or more memories for storing instructions; and One or more processors are configured to retrieve and execute the instructions from the memory to perform the method as described in any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that, The computer-readable storage medium includes: The program, when run by the processor, executes the method as described in any one of claims 1 to 7.

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