A three-dimensional chiplet stacking system-on-chip based on independent three-dimensional interconnect structures and methods of manufacture

Abstract

The application discloses a three-dimensional core particle stacking system chip based on independent three-dimensional interconnection touch structure and a manufacturing method. The system chip comprises a bottom motherboard, a bonding area and an I / O pad array located at the periphery of the bonding area on the surface of the bottom motherboard, and the I / O pad array comprises at least N columns of pads, namely a first column of pads, a second column of pads to an Nth column of pads, and N is greater than or equal to 2. By transferring a TSV array for vertical interconnection to a medium layer at the periphery of a storage core particle, a TSV-free design of the storage core particle is realized, the manufacturing process of the storage core particle is simplified, the storage density is improved, the signal integrity of vertical interconnection is ensured through a TSV penetrating design, a chemical plating / electroplating self-growth metal interconnection process between pads is improved, the reliability and yield of stacking interconnection are improved, the process sequence of multi-layer stacking is compatible with an existing semiconductor production line, and the system chip has good industrial application prospects and industrialization value.

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