IPM chip, automation production line and production process

Abstract

The application relates to an IPM chip, an automatic production line and a production process, and belongs to the technical field of intelligent power module manufacturing, and comprises a DCB plate, a PCB plate, a chip, a thermistor and a lead frame, the DCB plate and the PCB plate are welded in the lead frame, and the pins of the DCB plate and the PCB plate are in communication connection with the pins of the lead frame, and the chip and the thermistor are welded on the DCB plate. The application has the effect of improving the production efficiency of the intelligent power module.

Description

Technical Field

[0001] This application relates to the field of intelligent power module manufacturing technology, and in particular to an IPM chip, an automated production line, and a manufacturing process. Background Technology

[0002] The current production process of intelligent power modules (IPMs) involves multiple complex steps, including solder paste printing, chip mounting, soldering, cleaning, bonding, and testing. Traditional production methods are mostly semi-automated or manual, which are inefficient and susceptible to human error. With the increasing demand for high-precision and high-reliability products in the electronics industry, the introduction of automated production lines has become a trend. However, existing technologies still suffer from problems such as poor process integration and poor equipment compatibility. Summary of the Invention

[0003] To improve the production efficiency of intelligent power modules, this application provides an IPM chip, an automated production line, and a production process.

[0004] Firstly, the IPM chip provided in this application adopts the following technical solution: An IPM chip includes a DCB board, a PCB board, a chip, a thermistor, and a lead frame. The DCB board and the PCB board are soldered within the lead frame, and the pins of the DCB board and the PCB board are communicatively connected to the pins of the lead frame. The chip and the thermistor are soldered onto the DCB board.

[0005] Secondly, this application provides an automated production line for IPM chips, which adopts the following technical solution: Optionally, an automated production line for producing IPM chips includes a solder paste printer, a basket feeder, a DCB board + PCB board feeder, a DCB board + PCB board stacker, a chip feeder, and a vacuum soldering furnace. The solder paste printer, DCB board + PCB board feeder, DCB board + PCB board stacker, chip feeder, and vacuum soldering furnace are arranged sequentially. The line also includes a reflow tray, a printing tray, and a soldering tray. The reflow tray is used to place DCB boards and PCB boards to be printed with solder paste. The printing tray is used to place DCB boards and PCB boards after solder paste printing. The soldering tray is used to receive the printing tray. The DCB board + PCB board loading machine is used to load DCB boards and PCB boards onto the return tray; The return tray is conveyed to the solder paste printer for solder paste printing on the DCB board and PCB board; After solder paste is printed on the DCB board and PCB board, they are conveyed to the basket loading machine via a reflow tray. The basket feeder is used to feed the printing pallet and transport the printing pallet to the DCB board + PCB board feeder. The DCB board + PCB board loading machine transfers the DCB board and PCB board after solder paste printing in the return tray to the printing tray, and then transfers the printing tray to the DCB board + PCB board stacker. The DCB board + PCB board stacker is used to receive the printing pallet and transfer it to the welding pallet, and to load the lead frame into the welding pallet to fit the DCB board and PCB board on the printing pallet. Then, the welding pallet is transferred to the chip loading machine to install the chip and thermistor onto the DCB board. The welding tray is then transferred to a vacuum welding oven for welding of the DCB board, PCB board, chip, thermistor and lead frame.

[0006] Optionally, a cover plate is also included, which is fed into the DCB board + PCB board stacker and then placed on the printing tray to press the edge of the lead frame onto the printing tray.

[0007] Optionally, the basket loading machine includes a printing pallet loading machine and a printing pallet basket. The printing pallet loading machine is located between the solder paste printer and the printing pallet loading machine. The printing pallets are vertically stacked in the printing pallet basket. The printing pallet loading machine is used to transport the printing pallets in the printing pallet basket to the DCB board + PCB board loading machine.

[0008] Optionally, the printing pallet basket is box-shaped and hollow, with openings on two opposite side walls that communicate with the interior. The interior of the printing pallet basket has multiple snap-fit ​​grooves arranged vertically, and the edge of the printing pallet snaps into the snap-fit ​​grooves.

[0009] Optionally, it also includes a cap removal machine, which is located behind the vacuum welding furnace and receives the welding tray after it has passed through the vacuum welding furnace. After receiving the welding tray, the cap removal machine separates the IPM chip, the printed tray and the cover plate on the welding tray.

[0010] Optionally, the return tray is divided into a DCB board placement area and a PCB board placement area. Both the DCB board placement area and the PCB board placement area are provided with multiple placement notches. The shape of the placement notches is adapted to the shape of the DCB board and the PCB board. The sidewalls of the placement notches are stepped to engage the corresponding DCB board and PCB board.

[0011] Optionally, the printing tray has a first receiving slot and a plurality of second receiving slots. The second receiving slots are formed on the bottom wall of the first receiving slot. The second receiving slots are used to place the DCB board and the PCB board. The lead frame is placed in the first receiving slot. The cover plate is snapped into the first receiving slot to fix the lead frame in the printing tray.

[0012] Optionally, the welding tray has multiple storage slots, and the printed tray is stored in the storage slots.

[0013] Thirdly, this application provides an IPM chip manufacturing process, which adopts the following technical solution: Optionally, a manufacturing process for producing IPM chips using an automated IPM chip production line includes: S1: At the DCB board + PCB board loading machine, place the DCB board and PCB board to be printed with solder paste on the reflow tray, and then transport the reflow tray to the solder paste printing machine through the reflow conveyor. S2: The solder paste printer applies solder paste to the DCB board and PCB board, and then the return tray conveys the DCB board and PCB board to the DCB board + PCB board loading machine. S3: While the return pallet is being conveyed to the DCB board + PCB board loading machine, the printing pallet loading machine loads the printing pallet from the printing pallet basket to the DCB board + PCB board loading machine. S4: The DCB board + PCB board loading machine loads the DCB board + PCB board after solder paste printing in the reflow tray into the printing tray; after the DCB board + PCB board in the reflow tray is loaded, the DCB board + PCB board to be printed is placed into the reflow tray. S5: After the DCB board and PCB board are transferred to the printing pallet, the printing pallet carries the DCB board and PCB board to the DCB board and PCB board stacker. The welding pallet is loaded at the DCB board and PCB board stacker. The welding pallet enters the DCB board and PCB board stacker. Then the DCB board and PCB board stacker transfers the printing pallet to the welding pallet. Then the lead frame and cover plate are loaded into the DCB board and PCB board stacker in sequence. The DCB board and PCB board stacker transfers the lead frame and cover plate into the welding pallet in sequence and presses down the cover plate to snap it into the welding pallet. S6: After the printing tray is installed on the welding tray, it is conveyed to the chip loading machine, which installs the chip and thermistor on the DCB board. S7: The soldering tray enters the vacuum soldering furnace, where the DCB board, PCB board, chip, thermistor and lead frame are soldered into a whole by heating the solder paste inside the vacuum soldering furnace; S8: The welding tray is then removed from the vacuum welding furnace and enters the cap removal machine. The cap removal machine removes the welding tray, IPM chip, printing tray and cap in sequence to obtain the finished IPM chip.

[0014] In summary, this application includes at least one of the following beneficial technical effects: The IPM automated production line process flow is as follows: reflow tray loading DCB + PCB → solder paste printing → SPI → printing tray loading DCB + PCB (reflow tray returns to the front end) → placement of cathode frame + cover plate → chip mounting + NTC on DCB → soldering vacuum furnace → cover plate removal → cleaning → chip mounting on PCB → curing → X-ray → aluminum wire bonding → gold wire bonding → AOI → adhesive spraying → molding. The above process flow realizes full automation of IPM production, reduces manual intervention, and improves efficiency. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of an IPM chip according to an embodiment of this application; Figure 2 This is a schematic diagram of the overall structure of an automated production line for IPM chips according to an embodiment of this application; Figure 3 This is a process flow diagram of an IPM chip automated production line according to an embodiment of the present application, showing the process of DCB board + PCB board being loaded onto a reflow tray, solder paste printing, and the DCB board + PCB board entering the printing tray after solder paste printing. Figure 4 This is a schematic diagram of the structure of an automated IPM chip production line according to an embodiment of this application, showing the DCB board and PCB board entering the soldering tray, chip installation, and finished product disassembly. Figure 5 This is a schematic diagram of the connection between the printed tray, lead frame, cover plate and DCB board + PCB board in an automated production line for IPM chips according to an embodiment of this application. Figure 6 This is a schematic diagram of the structure of a printing tray basket in an automated IPM chip production line according to an embodiment of this application; Figure 7 This is a schematic diagram of the structure of a return tray in an automated production line for IPM chips according to an embodiment of this application; Figure 8 This is a schematic diagram of the structure of a printing tray in an automated production line for IPM chips according to an embodiment of this application; Figure 9 This is a schematic diagram of the structure of a welding tray in an automated IPM chip production line according to an embodiment of this application.

[0016] Explanation of reference numerals in the attached diagram: 1. IPM chip; 111. DCB board; 112. PCB board; 113. Chip; 114. Thermistor; 115. Lead frame; 2. Solder paste printer; 3. Basket feeder; 4. DCB board + PCB board feeder; 5. DCB board + PCB board stacker; 6. Chip feeder; 7. Vacuum soldering furnace; 8. Reflow tray; 9. Printing tray; 10. Soldering tray; 11. Reflow conveyor; 12. Cover plate; 13. Printing tray feeder; 14. Printing tray basket; 15. Snap-on slot; 16. Cover removal machine; 17. DCB board placement area; 18. PCB board placement area; 19. Placement notch; 20. First receiving slot; 21. Second receiving slot; 22. Storage slot. Detailed Implementation

[0017] The following is in conjunction with the appendix Figure 1 -Appendix Figure 9 This application will be described in further detail.

[0018] This application discloses an IPM chip. (Refer to...) Figure 1 The IPM chip includes a DCB board 111, a PCB board 112, a chip 113, a thermistor 114, and a lead frame 115. The DCB board 111 and the PCB board 112 are soldered inside the lead frame 115, and the pins of the DCB board 111 and the PCB board 112 are communicatively connected to the pins of the lead frame 115. The chip 113 and the thermistor 114 are soldered onto the DCB board 111.

[0019] The implementation principle of an IPM chip in this application embodiment is as follows: During the assembly of IPM chip 1, the leads of DCB board 111 and PCB board 112 are soldered to the leads of lead frame 115. Then, chip 113 and thermistor 114 are soldered onto DCB board 111 to complete the assembly of IPM chip 1.

[0020] This application discloses an automated production line for IPM chips, referring to... Figure 2 , Figure 3 and Figure 4 The automated production line includes a solder paste printer 2, a basket feeder 3, a DCB board + PCB board feeder 4, a DCB board + PCB board stacker 5, a chip feeder 6, and a vacuum soldering furnace 7. The solder paste printer 2, DCB board + PCB board feeder 4, DCB board + PCB board stacker 5, chip feeder 6, and vacuum soldering furnace 7 are arranged in sequence. It also includes a reflow tray 8, a printing tray 9, and a soldering tray 10. The reflow tray 8 is used to place the DCB board 111 and PCB board 112 to be printed with solder paste. The printing tray 9 is used to place the DCB board 111 and PCB board 112 after the solder paste has been printed. The soldering tray 10 is used to receive the printing tray 9. Reference Figure 2 , Figure 3 and Figure 4The DCB board + PCB board loading machine 4 is used to load the DCB board 111 and PCB board 112 onto the return tray 8. Reference Figure 2 , Figure 3 and Figure 4 The return tray 8 is conveyed to the solder paste printer 2 for solder paste printing on the DCB board 111 and PCB board 112; Reference Figure 2 , Figure 3 and Figure 4 After solder paste is printed on DCB board 111 and PCB board 112, they are conveyed to basket feeder 3 via reflow tray 8; Reference Figure 2 , Figure 3 and Figure 4 Basket feeder 3 is used to feed printing pallets 9 and transport printing pallets 9 to DCB board + PCB board feeder 4; Reference Figure 2 , Figure 3 and Figure 4 The DCB board + PCB board loading machine 4 transfers the DCB board 111 and PCB board 112 after solder paste printing in the return tray 8 to the printing tray 9, and then transfers the printing tray 9 to the DCB board + PCB board stacker 5. Reference Figure 2 , Figure 3 and Figure 4 The DCB board + PCB board stacker 5 is used to receive the printing tray 9 and transfer the printing tray 9 to the soldering tray 10, and to load the lead frame 115 into the soldering tray 10 to fit the DCB board 111 and PCB board 112 on the printing tray 9. Then, the soldering tray 10 is transferred to the chip loading machine 6 to install the chip 113 and the thermistor 114 onto the DCB board 111. Reference Figure 2 , Figure 3 and Figure 4 Then, the welding tray 10 is transferred to the vacuum welding furnace 7 for welding of the DCB board 111, PCB board 112, chip 113, thermistor 114 and lead frame 115.

[0021] During IPM chip 1 assembly, the DCB board 111 and PCB board 112 are first placed into the reflow tray 8 by the DCB board + PCB board loading machine 4. The reflow tray 8 carries the DCB board 111 + PCB board 112 into the solder paste printing machine 2, where solder paste is applied onto the DCB board 111 + PCB board 112. Then, the reflow tray 8 is transported to the DCB board + PCB board loading machine 4. At this time, the printing tray loading machine 13 loads the printing tray 9 into the DCB board + PCB board loading machine 4, where solder paste is applied. The DCB board 111 and PCB board 112 are then transferred to the printing tray 9. The printing tray 9 carries the DCB board 111 and PCB board 112 to the DCB board + PCB board stacker 5, and then to the chip loading machine 6 for the assembly of chip 113 and thermistor 114. The DCB board + PCB board stacker 5 transfers the printing tray 9 to the welding tray 10, and the welding tray 10 is transferred to the vacuum welding furnace 7 for welding of DCB board 111, PCB board 112, chip 113, thermistor 114 and lead frame 115.

[0022] Reference Figure 2 , Figure 3 and Figure 4 In this embodiment, a return conveyor 11 is also included. The return conveyor 11 is a conveyor belt and is used to connect the output end of the DCB board + PCB board loading machine 4 and the inlet end of the solder paste printer 2. After the DCB board 111 + PCB board 112 in the return tray 8 is transferred to the printing tray 9, the printing tray 9 carries the DCB board 111 + PCB board 112 through the return conveyor 11 to the solder paste printer 2, and solder paste is printed on the blank DCB board 111 + PCB board 112.

[0023] Reference Figure 4 and Figure 5 When the lead frame 115 enters the printing tray 9 and is fitted onto the DCB board 111 and PCB board 112, in order to improve the stability of the DCB board 111, PCB board 112 and lead frame 115, in this embodiment of the application, a cover plate 12 is also included. The cover plate 12 is fed into the DCB board + PCB board stacker 5 and covers the printing tray 9, pressing the edge of the lead frame 115 onto the printing tray 9, thereby reducing the possibility of positional deviation of the lead frame 115, DCB board 111 and PCB board 112, and improving the stability of the lead frame 115, DCB board 111 and PCB board 112.

[0024] Reference Figure 2 , Figure 3 and Figure 4To facilitate the transfer of the printed tray 9 to the DCB board + PCB board loading machine 4, in this embodiment, the basket loading machine 3 includes a printed tray loading machine 13 and a printed tray basket 14. The printed tray loading machine 13 is located between the solder paste printer 2 and the printed tray loading machine 14. The printed tray 9 is vertically stacked in the printed tray basket 14. The printed tray loading machine 13 is used to transport the printed tray 9 in the printed tray basket 14 to the DCB board + PCB board loading machine 4. The printed tray 9 are stacked in the printed tray basket 14 in sequence, and then the printed tray basket 14 is placed in the printed tray loading machine 13. The printed tray loading machine 13 removes the printed tray 9 in the printed tray basket 14 in sequence to place the DCB board 111 + PCB board 112, which facilitates the transfer of the DCB board 111 + PCB board 112.

[0025] Reference Figure 3 , Figure 4 and Figure 6 In this embodiment, the printing pallet basket 14 is a box-shaped and hollow box. The two side walls of the printing pallet basket 14 facing each other have openings that communicate with the interior. The printing pallet basket 14 has multiple snap-fit ​​grooves 15 inside, which are arranged vertically. The edges of the printing pallets 9 are snapped into the snap-fit ​​grooves 15. When the printing pallets 9 are stacked in the printing pallet basket 14, the printing pallets 9 are snapped into the snap-fit ​​grooves 15 in sequence along the vertical direction, thus completing the loading of the printing pallets 9.

[0026] Reference Figure 2 and Figure 4 To facilitate the separation of the finished IPM chip 1, cover plate 12 and welding tray 10, this embodiment of the application also includes a cap removal machine 16. The cap removal machine 16 is located behind the vacuum welding furnace 7 and receives the welding tray 10 after passing through the vacuum welding furnace 7. After receiving the welding tray 10, the cap removal machine 16 separates the IPM chip 1, the printed tray 9 and the cover plate 12 on the welding tray 10.

[0027] Reference Figure 7 In this embodiment, the return tray 8 is divided into a DCB board placement area 17 and a PCB board placement area 18. Both the DCB board placement area 17 and the PCB board placement area 18 are provided with multiple placement notches 19. The placement notches 19 are arranged in a rectangular array on the return tray 8. The shape of the placement notches 19 is adapted to the shape of the DCB board 111 and the PCB board 112. The sidewalls of the placement notches 19 are stepped and engage with the corresponding DCB board 111 and PCB board 112.

[0028] Reference Figure 8In this embodiment of the application, the printing tray 9 is provided with a first receiving groove 20 and a plurality of second receiving grooves 21. The second receiving grooves 21 are formed on the bottom wall of the first receiving groove 20. The second receiving grooves 21 are used to place the DCB board 111 and the PCB board 112. The lead frame 115 is placed in the first receiving groove 20. The cover plate 12 is snapped into the first receiving groove 20 to fix the lead frame 115 in the printing tray 9.

[0029] Reference Figure 9 In this embodiment of the application, the welding tray 10 is provided with a plurality of storage slots 22, and the printing tray 9 is received and stored in the storage slots 22.

[0030] The implementation principle of an automated production line for IPM chips according to an embodiment of this application is as follows: During IPM chip 1 assembly, the DCB board 111 and PCB board 112 are first placed into the reflow tray 8 by the DCB board + PCB board loading machine 4. The reflow tray 8 carries the DCB board 111 + PCB board 112 into the solder paste printing machine 2, where solder paste is applied onto the DCB board 111 + PCB board 112. Then, the reflow tray 8 is transported to the DCB board + PCB board loading machine 4. At this time, the printing tray loading machine 13 loads the printing tray 9 into the DCB board + PCB board loading machine 4, where solder paste is applied. The DCB board 111 and PCB board 112 are then transferred to the printing tray 9. The printing tray 9 carries the DCB board 111 and PCB board 112 to the DCB board + PCB board stacker 5, and then to the chip loading machine 6 for the assembly of chip 113 and thermistor 114. The DCB board + PCB board stacker 5 transfers the printing tray 9 to the welding tray 10, and the welding tray 10 is transferred to the vacuum welding furnace 7 for welding of DCB board 111, PCB board 112, chip 113, thermistor 114 and lead frame 115.

[0031] This application discloses a manufacturing process for producing IPM chips using an automated IPM chip production line, including: S1: At the DCB board + PCB board loading machine 4, place the DCB board 111 and PCB board 112 to be printed with solder paste on the reflow tray 8, and then transport the reflow tray 8 to the solder paste printing machine 2 through the reflow conveyor 11. S2: Solder paste printer 2 applies solder paste to DCB board 111 and PCB board 112, and then return tray 8 conveys DCB board 111 and PCB board 112 to DCB board + PCB board loading machine 4. S3: While the return tray 8 is being conveyed to the DCB board + PCB board loading machine 4, the printing tray loading machine 13 loads the printing tray 9 from the printing tray basket 14 to the DCB board + PCB board loading machine 4. S4: DCB board + PCB board loading machine 4 loads the DCB board 111 + PCB board 112 after solder paste printing in the reflow tray 8 into the printing tray 9; after the DCB board 111 + PCB board 112 in the reflow tray 8 is loaded, the DCB board 111 + PCB board 112 to be printed is placed into the reflow tray 8. S5: After the DCB board 111 and PCB board 112 are transferred to the printing tray 9, the printing tray 9 carries the DCB board 111 and PCB board 112 to the DCB board + PCB board stacker 5. The welding tray 10 is loaded at the DCB board + PCB board stacker 5. The welding tray 10 enters the DCB board + PCB board stacker 5. Then the DCB board + PCB board stacker 5 transfers the printing tray 9 to the welding tray 10. Then the lead frame 115 and cover plate 12 are loaded into the DCB board + PCB board stacker 5 in sequence. The DCB board + PCB board stacker 5 transfers the lead frame 115 and cover plate 12 into the welding tray 10 in sequence and presses down the cover plate 12 to snap into the welding tray 10. S6: After the printing tray 9 is installed on the welding tray 10, it is conveyed to the chip loading machine 6, and the chip loading machine 6 installs the chip 113 and the thermistor 114 on the DCB board 111. S7: The soldering tray 10 enters the vacuum soldering furnace 7, where the DCB board 111, PCB board 112, chip 113, thermistor 114 and lead frame 115 are soldered into a whole by heating solder paste inside the vacuum soldering furnace 7. S8: Subsequently, the welding tray 10 is removed from the vacuum welding furnace 7 and enters the cap removal machine 16. The cap removal machine 16 removes the welding tray 10, IPM chip 1, printing tray 9 and cover plate 12 in sequence to obtain the finished IPM chip 1.

[0032] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. An IPM chip, characterized in that: The device includes a DCB board (111), a PCB board (112), a chip (113), a thermistor (114), and a lead frame (115). The DCB board (111) and the PCB board (112) are soldered inside the lead frame (115), and the pins of the DCB board (111) and the PCB board (112) are communicatively connected to the pins of the lead frame (115). The chip (113) and the thermistor (114) are soldered onto the DCB board (111).

2. An automated production line for producing the IPM chip as described in claim 1, characterized in that: The system includes a solder paste printer (2), a basket feeder (3), a DCB board + PCB board feeder (4), a DCB board + PCB board stacker (5), a chip feeder (6), and a vacuum soldering furnace (7). The solder paste printer (2), DCB board + PCB board feeder (4), DCB board + PCB board stacker (5), chip feeder (6), and vacuum soldering furnace (7) are arranged in sequence. The system also includes a reflow tray (8), a printing tray (9), and a soldering tray (10). The reflow tray (8) is used to place the DCB board (111) and PCB board (112) to be printed with solder paste. The printing tray (9) is used to place the DCB board (111) and PCB board (112) after solder paste printing. The soldering tray (10) is used to receive the printing tray (9). The DCB board + PCB board loading machine (4) is used to load the DCB board (111) and PCB board (112) onto the return tray (8); The return tray (8) is conveyed to the solder paste printer (2) for solder paste printing on the DCB board (111) and PCB board (112); After solder paste is printed on the DCB board (111) and PCB board (112), they are conveyed to the basket feeder (3) via the reflow tray (8); The basket feeder (3) is used to feed the printing tray (9) and transport the printing tray (9) to the DCB board + PCB board feeder (4); The DCB board + PCB board loading machine (4) transfers the DCB board (111) and PCB board (112) after solder paste printing in the return tray (8) to the printing tray (9), and then transfers the printing tray (9) to the DCB board + PCB board stacking machine (5); The DCB board + PCB board stacker (5) is used to receive the printing tray (9) and transfer the printing tray (9) to the soldering tray (10), and to load the lead frame (115) into the soldering tray (10) to fit the DCB board (111) and PCB board (112) on the printing tray (9), and then transfer the soldering tray (10) to the chip loading machine (6) to install the chip (113) and thermistor (114) onto the DCB board (111); The welding tray (10) is then transferred to the vacuum welding oven (7) for welding of the DCB board (111), PCB board (112), chip (113), thermistor (114) and lead frame (115).

3. The automated production line for IPM chips according to claim 2, characterized in that: It also includes a cover plate (12), which is fed into the DCB board + PCB board stacker (5) and covers the printing tray (9) to press the edge of the lead frame (115) onto the printing tray (9).

4. The automated production line for IPM chips according to claim 2, characterized in that: The basket loading machine (3) includes a printing pallet loading machine (13) and a printing pallet basket (14). The printing pallet loading machine (13) is located between the solder paste printer (2) and the printing pallet loading machine (13). The printing pallets (9) are vertically stacked in the printing pallet basket (14). The printing pallet loading machine (13) is used to transport the printing pallets (9) in the printing pallet basket (14) to the DCB board + PCB board loading machine (4).

5. An automated production line for IPM chips according to claim 4, characterized in that: The printing tray basket (14) is box-shaped and hollow. The two side walls of the printing tray basket (14) facing each other have openings that communicate with the interior. The printing tray basket (14) has multiple snap-fit ​​grooves (15) inside. The multiple snap-fit ​​grooves (15) are arranged vertically. The edge of the printing tray (9) is snapped into the snap-fit ​​groove (15).

6. An automated production line for IPM chips according to claim 2, characterized in that: It also includes a cap removal machine (16), which is located behind the vacuum welding furnace (7) and receives the welding tray (10) after passing through the vacuum welding furnace (7). After receiving the welding tray (10), the cap removal machine (16) separates the IPM chip (1), the printed tray (9) and the cover plate (12) on the welding tray (10).

7. An automated production line for IPM chips according to claim 2, characterized in that: The return tray (8) is divided into a DCB board placement area (17) and a PCB board placement area (18). Both the DCB board placement area (17) and the PCB board placement area (18) are provided with multiple placement notches (19). The shape of the placement notches (19) is adapted to the shape of the DCB board (111) and the PCB board (112). The sidewalls of the placement notches (19) are stepped and engage with the corresponding DCB board (111) and PCB board (112).

8. An automated production line for IPM chips according to claim 2, characterized in that: The printing tray (9) has a first receiving groove (20) and a plurality of second receiving grooves (21). The second receiving grooves (21) are formed on the bottom wall of the first receiving groove (20). The second receiving grooves (21) are used to place the DCB board (111) and the PCB board (112). The lead frame (115) is placed in the first receiving groove (20). The cover plate (12) is snapped into the first receiving groove (20) to fix the lead frame (115) in the printing tray (9).

9. An automated production line for IPM chips according to claim 2, characterized in that: The welding tray (10) has multiple storage slots (22), and the printing tray (9) is received and stored in the storage slots (22).

10. A manufacturing process for producing IPM chips using an automated IPM chip production line as described in any one of claims 2-9, characterized in that: include; S1: Place the DCB board (111) and PCB board (112) to be printed with solder paste on the reflow tray (8) at the DCB board + PCB board loading machine (4), and then transport the reflow tray (8) to the solder paste printing machine (2) through the reflow conveyor (11); S2: Solder paste printer (2) applies solder paste to DCB board (111) and PCB board (112), and then return tray (8) conveys DCB board (111) and PCB board (112) to DCB board + PCB board loading machine (4); S3: While the return tray (8) is being transported to the DCB board + PCB board loading machine (4), the printing tray loading machine (13) loads the printing tray (9) in the printing tray basket (14) to the DCB board + PCB board loading machine (4); S4: The DCB board + PCB board loading machine (4) loads the DCB board (111) + PCB board (112) after solder paste printing in the reflow tray (8) into the printing tray (9); after the DCB board (111) + PCB board (112) in the reflow tray (8) is loaded, the DCB board (111) + PCB board (112) to be printed is placed into the reflow tray (8); S5: After the DCB board (111) + PCB board (112) is transferred to the printing tray (9), the printing tray (9) carries the DCB board (111) + PCB board (112) to the DCB board + PCB board stacker (5). The welding tray (10) is loaded at the DCB board + PCB board stacker (5). The welding tray (10) enters the DCB board + PCB board stacker (5). Then the DCB board + PCB board stacker (5) transfers the printing tray (9) to the welding tray (10). Then the lead frame (115) and cover plate (12) are loaded into the DCB board + PCB board stacker (5) in sequence. The DCB board + PCB board stacker (5) transfers the lead frame (115) and cover plate (12) into the welding tray (10) in sequence and presses down the cover plate (12) to snap into the welding tray (10). S6: After the welding tray (10) is equipped with the printing tray (9), it is transported to the chip loading machine (6). The chip loading machine (6) installs the chip (113) and the thermistor (114) on the DCB board (111). S7: The soldering tray (10) enters the vacuum soldering oven (7), where the DCB board (111), PCB board (112), chip (113), thermistor (114) and lead frame (115) are soldered into a whole by heating solder paste inside the vacuum soldering oven (7); S8: Then the welding tray (10) is removed from the vacuum welding furnace (7) and enters the cap removal machine (16). The cap removal machine (16) takes out the welding tray (10), IPM chip (1), printing tray (9) and cover plate (12) in sequence to obtain the finished IPM chip (1).

Images