Mold device and method of operation of a mold device

Abstract

This invention provides a die device for trimming within the blanking surface using a precision blanking process. The die device includes: an upper die; a lower die; a backing plate connected to the upper die at its upper part; a punch placed on the lower die, with its upper surface facing the lower surface of the backing plate; a first buffer ring, with its upper surface facing the lower surface of the upper die; and a second buffer ring, with its upper surface facing the lower surface of the backing plate. The second buffer ring is in contact with the first buffer ring during the deep drawing process and is in contact with the lower die upon completion of the deep drawing process.

Description

Technical Field

[0001] This invention relates to a mold device and a method for operating the mold device. Background Technology

[0002] In recent years, trimming or bending processes of materials using die devices have been carried out. Patent Document 1 describes a blanking processing device, characterized in that, in a blanking processing device for metal plates composed of a combination of a punch die, a die cavity, and a blanking die, a pressure mechanism for a blanking die is provided that is linked to the movement of the punch die.

[0003] Patent Document 1: Japanese Patent Application Publication No. 2004-283875 Summary of the Invention

[0004] Figure 3 It is a structural example of a die device with a related precision stamping structure, especially in Figure 3 In the example shown, the dashed line represents the position where the pressure PF was originally intended to be set.

[0005] Specifically, the mold device includes: an upper mold 101 having an upper mold extension 101a extending downward and having a trimming blade at its lower end; a lower mold 102; a backing plate 103; a punch 104; a backing plate pressure source 105; and a buffer ring 106, the upper surface of which faces the lower surface of the upper mold 101.

[0006] In this related die assembly, a buffer ring and a blank holder surface on the upper die constrain the material, and a punch and a backing plate are used for deep drawing. After the deep drawing is completed, the upper die, while constraining the material together with the buffer ring, descends further downward in the stamping direction. At this time, in this die assembly, the backing plate contacts the punch through the material and therefore does not descend; the force applied to the backing plate is absorbed by the contraction of the backing plate pressure source. Furthermore, in this die assembly, during the deep drawing process, the heights of the boundaries between the upper die and the backing plate, and between the punch and the buffer ring, are the same. However, through the descent after the deep drawing is completed, the trimming edge of the upper die protrudes from the backing plate, and the trimming edge of the punch protrudes from the buffer ring, thereby enabling trimming to begin.

[0007] However, in this related die apparatus, since the blank holder PF equals the trimming line, if it is desired to set the trimming line further out than the blank holder PF, the trimming line is set within the blank holder surface. Here, the blank holder surface is the surface where the material is punched during the initial stage of the deep drawing process. If the trimming line is set within the blank holder surface, trimming will begin during material punching, causing the deep drawing process to fail. Therefore, in this related die apparatus, there is a problem that the trimming line cannot be set further out than the blank holder PF, i.e., within the blank holder surface.

[0008] This invention provides a mold device and a method for operating the mold device to achieve trimming processing in the blanking surface based on a precision blanking process.

[0009] The mold apparatus of the present invention comprises: an upper mold; a lower mold; a backing plate, the upper part of which is connected to the upper mold; a punch, which is placed on the lower mold and whose upper surface faces the lower surface of the backing plate; a first buffer ring, whose upper surface faces the lower surface of the upper mold; and a second buffer ring, whose upper surface faces the lower surface of the backing plate. The second buffer ring is in contact with the first buffer ring during the deep drawing process and is in contact with the lower mold at the same time as the deep drawing process is completed.

[0010] Therefore, the first buffer ring continues to decrease the biting amount of the trimming process while holding the material, thereby exposing the trimming edge of the dividing buffer ring and performing trimming with the trimming edge.

[0011] The present invention relates to a method for operating a mold device, the mold device comprising: an upper mold; a lower mold; a backing plate, the upper part of which is connected to the upper mold; a punch, which is placed on the lower mold and whose upper surface faces the lower surface of the backing plate; a first buffer ring, the upper surface of which faces the lower surface of the upper mold; and a second buffer ring, the upper surface of which faces the lower surface of the backing plate. During deep drawing, the second buffer ring is in contact with the first buffer ring, and simultaneously with the completion of the deep drawing, the second buffer ring is in contact with the lower mold.

[0012] Therefore, the first buffer ring continues to decrease the biting amount of the trimming process while holding the material, thereby exposing the trimming edge of the dividing buffer ring and performing trimming with the trimming edge.

[0013] Invention Effects

[0014] According to the present invention, a mold device and a method for operating the mold device are provided for achieving trimming processing in the blanking surface based on a precision blanking process. Attached Figure Description

[0015] Figure 1 This is a cross-sectional view of the die assembly when the deep drawing process is completed, according to Embodiment 1.

[0016] Figure 2 This is a cross-sectional view of the mold device when the trimming process is completed according to Embodiment 1.

[0017] Figure 3 This is a cross-sectional view of the relevant mold assembly. Detailed Implementation

[0018] Implementation Method 1

[0019] Hereinafter, the mold apparatus 1 according to this embodiment will be described with reference to the accompanying drawings.

[0020] Figure 1 This diagram shows an example of a cross-section of the die assembly 1 viewed from the side, representing the state at the instant before the trimming process begins after the deep drawing process is completed. The die assembly 1 includes: an upper die 11; a lower die 12; a backing plate 13 connected to the upper die 11; a punch 14 placed on the lower die 12; a pressure source 15 disposed between the upper die 11 and the backing plate 13, with its upper end connected to the upper die 11 and its lower end connected to the backing plate 13; a first buffer ring 16, with its lower end connected to the lower die 12; and a second buffer ring 17.

[0021] In addition, the first buffer ring 16 and the second buffer ring 17 are a single buffer ring. The first buffer ring 16 is used as the main body of the buffer ring, and the second buffer ring 17 is used as a segmented buffer ring.

[0022] In the following description, for ease of explanation, according to Figure 1 The description is presented with the pad 13 and punch 14 on the left side and the first buffer ring 16 or upper die 11 on the right side, with the upper die extension 22 located below the upper die template 21.

[0023] The upper mold 11 has: an upper template-shaped portion 21, which is located on the left side and is thin in the vertical direction; and an upper mold extension portion 22, which is located on the right side and extends further downward than the upper template-shaped portion 21. The upper mold 11 is fixed to a device (not shown). Although described in detail later, the upper mold 11 can be lowered by power from the device.

[0024] A pad 13 is connected to the lower surface of the upper template-shaped portion 21 via a telescopic portion 18 that can extend and retract freely in the vertical direction. Furthermore, a pressure source 15 is provided between the upper template-shaped portion 21 and the pad 13 to apply pressure to the pad 13 to cause it to move.

[0025] The lower surface 22a of the upper die extension 22 faces the upper surface 16a of the first buffer ring 16. The lower surface 22a of the upper die extension 22 and the upper surface 16a of the first buffer ring 16 form a pressing surface for pressing material. In addition, a downwardly protruding protrusion 22b is formed on a portion of the lower surface 22a of the upper die extension 22 and is inserted into a recess 16b provided on the upper surface of the first buffer ring 16.

[0026] Furthermore, on the surface of the upper mold extension 22 that faces the pad 13, i.e. Figure 1On the left side of the middle part, a trimming portion 22c is formed at the lower end periphery, protruding slightly upward from the lower left corner and to the left, close to the pad 13 and the second buffer ring 17 disposed below the pad 13. A trimming blade is provided on the trimming portion 22c.

[0027] The lower mold 12 is typically mounted on and fixed on a device. The lower mold 12 has: a lower mold plate-shaped portion 31, which is formed as a thin plate in the vertical direction; a lower mold extension portion 32, which has a shape that extends further upward than the lower mold plate-shaped portion 31; and a lower mold protrusion 33, which protrudes upward from the lower mold plate-shaped portion 31 at a position separate from the lower mold extension portion 32.

[0028] The lower template-shaped part 31 is set in Figure 1 It is located on the right side of the first buffer ring 16 and the second buffer ring 17, and is positioned below them. The lower end of the first buffer ring 16 is connected to the lower template-shaped portion 31.

[0029] Here, the first buffer ring 16 will be described. The first buffer ring 16 has: an extension 41 that extends vertically; and a plate-like portion 42 that is thin in the vertical direction. Figure 1 As shown on the right side, the extension 41 extends vertically below the upper mold extension 22 of the upper mold 11. Figure 1 As shown in the central part, the plate-shaped part 42 is disposed below the second buffer ring 17.

[0030] Furthermore, when the first buffer ring 16 is pressed downward by the upper mold extension 22, it is connected to the lower mold plate-shaped portion 31 of the lower mold 12 in a state that allows it to move downward. Specifically, the first buffer ring 16 is connected to the lower mold plate-shaped portion 31 of the lower mold 12 at the lower part of the extension 41 and the lower part of the plate-shaped portion 42, respectively.

[0031] Therefore, when the upper die extension 22 moves downward, the first buffer ring 16 becomes a state in which the lower surface 22a of the upper die extension 22 and the pressure surface formed by the upper surface 16a of the first buffer ring 16 move downward.

[0032] In addition, such as Figure 1 As shown, the first buffer ring 16 can be configured to protrude slightly downward and to the left from the upper left corner near the pad 13 or punch 14.

[0033] Return to the instructions for lower mold 12. (For example...) Figure 1 As shown on the left, a punch 14 is mounted above the lower die extension 32. That is, the lower surface of the punch 14 is in contact with the upper surface of the lower die extension 32.

[0034] Furthermore, the lower mold protrusion 33 is a protrusion that protrudes upward from the lower mold template-shaped portion 31 at a position separate from the lower mold extension portion 32. Here, as... Figure 1 As shown, at the moment before the trimming process begins after the deep drawing process is completed, the height of the upper end of the lower die protrusion 33 is set to be approximately the same as the height of the upper surface of the plate-shaped portion 42 of the first buffer ring.

[0035] on the other hand, Figure 2 It means from and Figure 1 The cross-section viewed from the same direction represents the state when the trimming process is completed and the upper die 11 or the first buffer ring 16 has moved to the bottom dead center. In this case, the height of the upper end of the lower die protrusion 33 is higher than the height of the upper surface of the plate-shaped portion 42 of the first buffer ring.

[0036] The pad 13 is used for deep drawing of material by combining with the punch 14 or with the second buffer ring 17. Here, the first lower surface 13a of the lower surface of the pad 13, which is located above the punch 14, is shaped to be higher than the second lower surface 13b, which is located above the second buffer ring 17.

[0037] The first lower surface 13a of the pad 13 faces the upper surface 14a of the punch 14. With material between these two surfaces, the pad can be lowered to perform deep drawing. Furthermore, the second lower surface 13b of the pad 13 faces the upper surface 17a of the second buffer ring 17. With material between these two surfaces, the pad can be lowered to perform deep drawing.

[0038] Here, as Figure 1 As shown, the boundary between the first lower surface 13a of the pad 13 and the upper surface 14a of the punch 14 is designed to be continuous with the boundary between the second lower surface 13b of the pad 13 and the upper surface 17a of the second buffer ring 17, and is higher on the left side away from the upper die extension 22, and lower on the right side near the upper die extension 22.

[0039] In addition, such as Figure 1 As shown, the pad 13 can be configured to protrude slightly upward and to the right from the lower right corner near the upper mold extension 22 or the first buffer ring 16.

[0040] The punch 14 is located below the first lower surface 13a of the pad 13 and performs deep drawing of the material by combining with the pad 13.

[0041] The pressure source 15 is a device capable of generating a force that causes the pad 13 to move downward. Thus, in the mold assembly 1, a deep drawing process can be performed by moving the pad 13 downward while the upper mold 11 and the lower mold 12 are fixed.

[0042] In addition, the pressure source 15 is capable of extending and retracting in the vertical direction. Typically, the extension or retraction of the pressure source 15 is synchronized with the telescopic portion 18 connected to the upper template-shaped portion 21 and the pad 13.

[0043] The second buffer ring 17 is disposed above the plate-shaped portion 42 of the first buffer ring 16. Furthermore, the second buffer ring 17 is disposed below the second lower surface 13b of the pad 13, and the upper surface 17a of the second buffer ring 17 is opposite to the second lower surface 13b of the pad 13.

[0044] The height of the upper surface 17a of the second buffer ring 17 is approximately the same as the height of the upper surface 16a of the extension 41 of the first buffer ring 16. More specifically, as Figure 1 As shown, when the deep drawing process is completed, the height of the upper surface 16a of the first buffer ring 16 and the height of the upper surface 17a of the second buffer ring 17 are approximately the same, as... Figure 2 As shown, when the trimming process is completed, the height of the upper surface 16a of the first buffer ring 16 becomes lower than the height of the upper surface 17a of the second buffer ring 17.

[0045] A first mating portion 17b and a second mating portion 17c are formed at the lower part of the second buffer ring 17. The first mating portion 17b is the part that abuts against the upper surface of the plate-shaped portion 42 of the first buffer ring 16 during the deep drawing process. On the other hand, during the trimming process, the first buffer ring 16 is pressed downward by the upper die 11, thereby the first mating portion 17b is in a state away from the upper surface of the plate-shaped portion 42 of the first buffer ring 16.

[0046] On the other hand, the second mating part 17c, upon completion of the deep drawing process, becomes mated with the upper part of the lower die protrusion 33 of the lower die 12. Additionally, as... Figure 2 As shown, during the trimming process, the second bonding part 17c is supported by the lower mold protrusion 33.

[0047] Therefore, the second buffer ring 17 is in contact with the first buffer ring 16 during the deep drawing process, and can be set to be in contact with the lower die 12 at the same time as the deep drawing process is completed.

[0048] Then, during the trimming process after the deep drawing is completed, the second buffer ring 17 is separated from the first buffer ring 16. That is, the second buffer ring 17 and the first buffer ring 16 are in a state of being unattached.

[0049] Additionally, in the second buffer ring 17, a trimming portion 17d is formed that protrudes slightly downward and to the right from the upper right corner near the upper mold extension 22 or the first buffer ring 16. A trimming blade is provided on this trimming portion 17d.

[0050] Next, the actions of deep drawing of the material through the mold device 1 and the trimming process after deep drawing will be explained.

[0051] First, the operation during the deep drawing process of the material will be explained. The die device 1 constrains the material between the lower surface 22a of the upper die extension 22 of the upper die 11 and the upper surface 16a of the first buffer ring 16 by lowering the upper die 11.

[0052] Then, the pressure source 15 generates force to cause the pad 13 to descend. At this time, the boundary between the second lower surface 13b of the pad 13 and the upper surface 17a of the second buffer ring 17 also functions as a pressing surface for the material.

[0053] A deep drawing process is performed between the first lower surface 13a of the pad 13 and the upper surface 14a of the punch 14. Then, the process is further refined to a state where a deep drawing process is performed between the second lower surface 13b of the pad 13 and the upper surface 17a of the second buffer ring 17.

[0054] In addition, such as Figure 1 As shown, at this time, the right end of the boundary between the second lower surface 13b of the pad 13 and the upper surface 17a of the second buffer ring 17, and the left end of the boundary between the lower surface 22a of the upper die extension 22 and the upper surface 16a of the first buffer ring 16, are at the same height. In other words, at the end of the deep drawing process, the parts of these two boundary portions that are close to each other are at the same height.

[0055] Next, the trimming process after the deep drawing process will be explained.

[0056] After the deep drawing process is completed, the upper die 11 performs a lowering operation while holding the material between the lower surface 13a and the upper surface 14a of the punch 14 and constraining the material between the lower surface 22a of the upper die extension 22 of the upper die 11 and the upper surface 16a of the first buffer ring 16.

[0057] Here, the upper die 11 descends, and the upper die plate 21 descends as well, but the pad 13 cannot descend because it comes into contact with the punch 14 via the material. Therefore, the downward force applied to the pad 13 by the descending action of the upper die 11 is absorbed by the contraction of the pressure source 15 and the telescopic part 18. As a result, the downward force applied to the second buffer ring 17 from the pad 13 is limited to a predetermined intensity.

[0058] On the other hand, the upper mold extension 22 is in a state where it presses the first buffer ring 16 downwards. That is, the first buffer ring 16 can descend according to the downward direction of the upper mold 11, so that the boundary between the lower surface 22a of the upper mold extension 22 and the upper surface 16a of the first buffer ring 16 is lowered.

[0059] On the other hand, the second buffer ring 17 is supported by the second fitting portion 17c, so it does not descend. Therefore, the position of the boundary between the lower surface 22a of the upper mold extension 22 and the upper surface 16a of the first buffer ring 16 moves to a position lower than the position of the boundary between the lower surface 13a of the pad 13 and the upper surface 17a of the second buffer ring 17.

[0060] At this time, the trimming portion 22c of the upper mold extension 22 is exposed, and the trimming blade of the trimming portion 17d of the second buffer ring 17 is exposed, and the material trimming process is performed.

[0061] As can be seen from the above, in the mold device 1, the buffer ring that serves as both a dividing and trimming cutting edge can fit together with the first buffer ring 16, which is the main body of the buffer ring, during the deep drawing process. Then, the second buffer ring 17 can fit together with the lower die 12 as the deep drawing process is completed.

[0062] Therefore, the first buffer ring 16 can descend while holding the material. At this time, the second buffer ring 17 is supported by the lower die 12, so that the trimming blade of the trimming portion 17d provided on the second buffer ring 17 is exposed, and precision punching can be performed with the trimming blade of the trimming portion 22c provided on the upper die extension 22 to perform trimming processing.

[0063] Therefore, in the mold device 1, deep drawing can be performed in the same process, and trimming can be carried out in the blank holder surface.

[0064] Furthermore, the present invention is not limited to the above-described embodiments, and appropriate modifications can be made without departing from the spirit of the invention. That is, for the sake of clarity, the above description has been appropriately omitted and simplified, and those skilled in the art can easily modify, add to, or transform the various elements of the embodiments within the scope of the present invention.

[0065] Symbol Explanation

[0066] 1-Mold assembly, 11-Upper mold, 12-Lower mold, 13-Backing plate, 13a-First lower surface, 13b-Second lower surface, 14-Punch, 14a-Upper surface, 15-Pressure source, 16-First buffer ring, 16a-Upper surface, 16b-Recess, 17-Second buffer ring, 17a-Upper surface, 17b-First fitting part, 17c-Second fitting part, 17d-Trimming part, 18-Extension part, 21-Upper template-shaped part, 22-Upper mold extension part, 22a-Lower surface, 22b-Protrusion, 22c-Trimming part, 31-Lower template-shaped part, 32-Lower mold extension part, 33-Lower mold protrusion, 41-Extension part, 42-Plate-shaped part.

Claims

1. A mold-making device, characterized in that, have: upper mold; Lower mold; A pad, the upper part of which is connected to the upper mold; A punch is placed on the lower die, with its upper surface facing the lower surface of the pad. The first buffer ring, the upper surface of which is opposite the lower surface of the upper mold; and The second buffer ring has its upper surface opposite the lower surface of the pad. The second buffer ring is in contact with the first buffer ring during the deep drawing process, and is in contact with the lower die at the same time as the deep drawing process is completed.

2. The mold device according to claim 1, characterized in that, When the second buffer ring is trimmed after the deep drawing process is completed, it is released from its contact with the first buffer ring.

3. The mold apparatus according to claim 1 or 2, characterized in that, The second buffer ring is supported by the lower mold when the upper mold and the first buffer ring are descending. Trimming is performed using trimming blades located on the upper mold and the second buffer ring.

4. The mold apparatus according to claim 1 or 2, characterized in that, The lower mold includes: Lower template-like part; The lower mold extension extends upward from the lower mold-shaped portion; and The lower mold protrusion, located separately from the lower mold extension, protrudes upward from the lower mold template-shaped portion. The first buffer ring is connected to the lower template-shaped part. The punch is mounted on the lower die extension. The second buffer ring is attached to the protrusion of the lower mold.

5. A method for operating a mold assembly, the mold assembly comprising: upper mold; Lower mold; A pad, the upper part of which is connected to the upper mold; A punch is placed on the lower die, with its upper surface facing the lower surface of the pad. The first buffer ring, the upper surface of which is opposite the lower surface of the upper mold; and The second buffer ring, the upper surface of which faces the lower surface of the pad, is characterized in that the method of operating the mold device is as follows: During the deep drawing process, the second buffer ring is in contact with the first buffer ring. At the same time as the deep drawing process is completed, the second buffer ring is attached to the lower die.

Images