A method for laser spin cutting of a ceramic substrate
By using a multi-layer spiral cutting method and designing laser spiral cutting path drawings, the problems of slag and cracks in long-wavelength laser single-path cutting and the edge gradient and low efficiency in short-wavelength laser multi-path cutting are solved, achieving more efficient and precise ceramic substrate cutting.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- CHINA ELECTRONIC TECH GRP CORP NO 38 RES INST
- Filing Date
- 2026-03-05
- Publication Date
- 2026-06-09
AI Technical Summary
In existing technologies, long-wavelength laser single-path cutting processes produce excessive slag and cracks, while short-wavelength laser multi-path cutting results in edge gradients and low efficiency.
A multi-layer spiral cutting method is adopted. A laser spiral cutting path drawing is designed, and the ceramic substrate is cut by laser equipment. The spiral units are arranged in an equidistant array along the cutting outline to form a closed curve. The laser energy distribution is precisely controlled to avoid thermal stress concentration and slag generation.
It improves cutting efficiency, produces more vertical and flatter cutting edges, reduces the heat-affected zone and slag, and enhances the dimensional accuracy and quality of the cut parts.
Smart Images
Figure CN122165057A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of laser cutting, and more specifically, to a method for laser rotary cutting of ceramic substrates. Background Art
[0002] Ceramics have excellent mechanical and physical properties such as high heat resistance, high hardness, and good chemical stability, and are widely used in many fields. Common ceramic substrates such as alumina, aluminum nitride, and glass-ceramics are brittle and hard. When using conventional mechanical processing methods, it is easy to cause powder splash and the generation of microcracks, and the cutting of special-shaped structures is limited.
[0003] In view of the above situation, laser processing methods have quickly occupied the market due to their advantages such as high efficiency and no limitation by the shape structure. However, during laser cutting, the material rapidly absorbs laser energy, heats up, vaporizes or melts, and is removed to form a cutting seam. During the cutting process, large thermal stress in local areas of the material will cause cracks. At the same time, the molten material is easily adhered and solidified on the lower surface of the substrate to form slag. The slag problem in laser cutting is a common problem in laser processing.
[0004] To improve the cutting effect, various wavelength lasers have emerged in the market, including short wavelengths: such as ultraviolet, green lasers, etc.; long wavelengths: carbon dioxide lasers, etc. The long-wavelength laser can complete cutting with a single-path scan, and the mass production speed is fast. However, this method has a large heat-affected zone, is prone to cracks and charred edges, has a large amount of slag and is viscous, and is prone to substrate damage during post-processing, reducing the qualification rate. The cutting method of short-wavelength lasers has less slag, is easy to clean, has a very small heat-affected zone, and there are no phenomena such as ceramic blackening and oxidation diffusion of metal pastes, and it is increasingly widely used in high-end precision LTCC substrates such as microwave components. However, short-wavelength laser cutting requires multi-path and multiple scans, with low cutting efficiency, and the cutting edge has an obvious edge gradient as the thickness of the ceramic substrate increases, which is very不利 for controlling the dimensional accuracy of the substrate shape. Summary of the Invention
[0005] The problem to be solved by the present invention is the excessive slag, cracks generated by the existing long-wavelength laser single-path cutting process, and the edge gradient and low efficiency brought by the short-wavelength laser multi-path cutting.
[0006] To solve the above problems, the present invention provides a method for laser rotary cutting of ceramic substrates, including: Design a laser rotary cutting path drawing in path design software according to the thickness of the ceramic substrate and the cutting profile dimensions; Use the drawing processing software supporting the laser device to convert the laser rotary cutting path drawing; Download the converted laser rotary cutting path drawing to the laser device and adjust the parameters of the laser device; The laser equipment is activated to cut the ceramic substrate.
[0007] Optionally, the laser spin cutting path includes multiple layers, each layer including a spiral unit. The spiral units are arranged in an equidistant array along the cutting outline to obtain multiple replicated spiral units. The spiral units and the multiple replicated spiral units are connected end to end to form a closed curve.
[0008] Optionally, the equidistant distance between the spiral units arranged in an array is equal to the distance between the beginning and end of the spiral.
[0009] Optionally, the spiral units in multiple layers are arranged sequentially along one direction on the cut outline, and the spiral units in two adjacent layers partially overlap, with the overlap range being 1 / 3 to 1 / 4 of the outer diameter of the spiral unit.
[0010] Optionally, the outer diameter of the spiral unit is 70%–80% of the width of a conventional multipath design, and the width of a conventional multipath design is 0.2 times the thickness of the ceramic substrate.
[0011] Optionally, the spacing between the spiral lines of the spiral unit is less than or equal to the size of the laser spot.
[0012] Optionally, the spacing within the spiral can range from 0.01 mm to 0.015 mm.
[0013] Optionally, the distance between the beginning and end of the spiral unit is the sum of the outer diameter of the spiral and the inner distance of the spiral.
[0014] Optionally, the laser device is one of an ultraviolet nanosecond cutting machine and an ultraviolet picosecond cutting machine.
[0015] Optionally, in each layer, the laser equipment parameters include: average laser energy of 5W-10W, frequency of 35kHz-45kHz, and cutting speed of 400mm / s-600mm / s.
[0016] This invention provides a method for laser spin cutting of ceramic substrates. Compared with the prior art, it has the following advantages: Employing a multi-layer spiral cutting method, the laser energy is distributed more evenly across the material through a more refined energy application, thereby reducing the risk of localized overheating and minimizing the heat-affected zone and slag formation. Pre-designing the laser spiral cutting path ensures cutting quality while improving efficiency and helps achieve more perpendicular and flatter cutting edges, ultimately enhancing the dimensional accuracy of the cut parts. Attached Figure Description
[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0018] Figure 1 This is a schematic diagram of the laser cutting path provided in an embodiment of the present invention; Figure 2 This is a schematic diagram of a closed curve formed by connecting spiral lines in a single layer, provided in an embodiment of the present invention. Figure 3 This is a schematic diagram of a spiral design provided for an embodiment of the present invention; Figure 4 This is a physical image obtained by cutting using a conventional multipath cutting method, as provided in an embodiment of the present invention. Figure 5 The image shows a physical object obtained by laser rotary cutting, as provided in an embodiment of the present invention. Detailed Implementation
[0019] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions in the embodiments of this application are described clearly and completely. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0020] To better understand the above technical solutions, the following will provide a detailed explanation of the technical solutions in conjunction with the accompanying drawings and specific implementation methods.
[0021] like Figure 1 As shown in the embodiment of this application, a method for laser spin cutting of a ceramic substrate includes: S1: Based on the thickness of the ceramic substrate and the dimensions of the cut outline, design the laser rotary cutting path drawing in path design software (such as CAD software).
[0022] Specifically, such as Figure 1As shown, operators can manually input the thickness value of the ceramic substrate and the required cutting outline data, and then use the drawing tools provided by the path design software to draw the laser cutting path segment by segment. Alternatively, pre-prepared two-dimensional graphic files can be imported, and the cutting path can be generated manually or semi-automatically based on these files using the software functions. During the design process, the starting point, ending point, and overall path direction of the cut need to be considered to ensure that the entire cutting area is covered. Laser rotary cutting involves the laser beam scanning along a preset spiral or rotating path during the cutting process, rather than a simple straight line. By optimizing energy distribution and contact time, thermal damage and stress concentration in the material are reduced, thereby improving cutting quality and efficiency.
[0023] like Figure 1 The magnified view shows that the laser cutting path comprises multiple layers, each layer containing helical units. These helical units are arranged in an equidistant array along the cutting outline to obtain multiple replicated helical units. The helical units and the replicated helical units are then connected end-to-end to form a closed curve. The equidistant distance between the arrayed helical units is equal to the distance between the beginning and end of the helix. Figure 1 The magnified view contains three layers: Layer 1, Layer 2, and Layer 3. Multiple spirals within each layer are connected end-to-end, as shown... Figure 2 As shown, a curve is formed to facilitate continuous operation of the laser equipment, avoiding the time and energy waste caused by frequent laser start-stop, and improving overall cutting efficiency. The number of layers includes, but is not limited to, three layers, and can be adjusted according to actual conditions. During the cutting process, the laser equipment removes material from the ceramic substrate layer by layer or region by region according to these layered and continuous spiral paths. The multi-layer design allows for more precise control of laser energy, avoiding thermal stress concentration and material splashing that may occur when penetrating a thick substrate in one go, achieving gradual and uniform material removal. The use of spiral units ensures uniform scanning of the laser spot in local areas, effectively reducing the roughness of the cutting edge and the heat-affected zone. By equidistant array arrangement and connecting the beginning and end to form a closed curve, the continuity and integrity of the entire cutting outline are guaranteed, avoiding efficiency loss and quality problems caused by cutting interruption or repeated start-up. This refined path design enables the laser to perform rotary cutting on the ceramic substrate in a more stable and efficient manner, significantly improving cutting quality and efficiency, especially suitable for processing ceramic substrates with large thickness or high precision requirements.
[0024] For example, the ceramic substrate material is calcium oxide-boron oxide-silicon oxide microcrystalline glass with a thickness of 1 mm and a cut outline size of 13 × 13 mm. The cutting path is as follows: Figure 1 As shown, a certain ultraviolet nanosecond laser device was selected. Figure 3As shown, according to the thickness of the cut ceramic substrate and the laser parameters, the outer diameter of the spiral of a single spiral unit, the inner pitch of the spiral, and the distance between the head and tail ends of the spiral are determined. Among them, the outer diameter of the spiral of the spiral unit is 70%-80% of the width of the conventional multi-path design. The width of the conventional multi-path design is 0.2 times the thickness of the ceramic substrate. For example, if the path width calculated by referring to the multi-path cutting method is 0.2 mm, then the spiral diameter D is only taken as 0.16 mm. To better adjust the laser cutting quality, the inner pitch of the spiral of the spiral unit is less than or equal to the laser spot size, which can ensure that when the laser performs spiral cutting on the ceramic substrate, the material removal inside each spiral unit is continuous and thorough, avoiding problems such as incomplete cutting, rough surface or residue generation caused by too large spacing of the laser scanning path. Thus, the cutting quality and surface finish of the ceramic substrate are significantly improved, unnecessary repeated scanning and heat accumulation are reduced, and the risk of thermal damage to the ceramic substrate during cutting is lowered. The range of the inner pitch of the spiral is 0.01 mm - 0.015 mm, and the inner pitch d of the spiral can be taken as 0.01 mm according to the laser spot size of the equipment. To better adjust the laser cutting quality and ensure partial overlap of the laser light paths at the edges of two spirals, the distance between the head and tail ends of the spiral of the spiral unit is the sum of the outer diameter of the spiral and the inner pitch of the spiral, and the distance L between the head and tail ends of the spiral = D + d = 0.17 mm.
[0025] Define a single determined spiral unit as a block, and determine the center points of different blocks according to the overlapping area of the spirals and the different layers they are in. Equally divide the cutting outline at a fixed distance (the fixed distance is the same as the distance between the head and tail ends of the spiral), and determine the center points of the blocks in layer 1 respectively to generate multiple partially overlapping spiral cutting lines. The spiral units in multiple layers are arranged in sequence along one direction on the cutting outline, and the spiral units in adjacent two layers partially overlap, and the overlapping range is 1 / 3 - 1 / 4 of the outer diameter of the spiral of the spiral unit. Correspondingly determine the center points of each block in layer 2 and layer 3, process to generate blocks with different center points, and after equally dividing the outline at a fixed distance, form three polylines distributed in different layers. Setting a suitable overlapping range is crucial. Too small an overlap may not completely eliminate the interlayer gap, resulting in incomplete cutting; while too large an overlap will cause energy waste, increased cutting time, and may affect the cutting quality due to excessive local heat accumulation. The setting of this range aims to optimize the balance between cutting efficiency and cutting quality, ensuring that while effectively removing materials, unnecessary repeated processing is minimized to the greatest extent.
[0026] S2: Use the drawing processing software supporting the laser equipment to convert the drawing of the laser spiral cutting path. The laser equipment is one of an ultraviolet nanosecond cutting machine and an ultraviolet picosecond cutting machine.
[0027] Specifically, the designed path drawings are converted into instructions executable by the laser equipment. For example, the path design software may output graphic files in common formats such as DXF or DWG. In this case, the operator needs to import these files into the laser equipment's dedicated drawing processing software. This software will parse the graphic data and, according to preset conversion rules, convert it into G-code or other specialized instruction formats that the laser equipment controller can recognize.
[0028] S3: Download the converted laser rotary cutting path drawing to the laser equipment and adjust the laser equipment parameters.
[0029] Specifically, after all parameters are set and confirmed to be correct, the operator issues a start command through the control panel or software interface. The laser equipment will precisely control the laser beam to scan and cut the ceramic substrate according to the downloaded path drawing and set parameters. During the cutting process, the high energy of the laser beam will cause the material to locally vaporize or melt, thereby forming a kerf and achieving separation of the ceramic substrate. Laser parameter settings: For each layer, the laser average energy is set to 5W-10W, the frequency to 35kHz-45kHz, and the cutting speed to 400mm / s-600mm / s. For example, the cutting parameters for three layers are: average cutting power energy of 7W, frequency of 35kHz, cutting speed of 500mm / s, and 80 cuts. S4: Start the laser equipment to cut the ceramic substrate.
[0030] Specifically, such as Figure 4 and Figure 5 The images shown are of the actual object obtained using the conventional multipath cutting method and the laser rotary cutting method, respectively. The images obtained using both methods are placed in the same coordinate reference system. Figure 4 and Figure 5 The horizontal and vertical coordinate systems shown in the image indicate that... Figure 4 The slope of edge 1 is more obvious. Figure 5 Edge 2 in the middle has no obvious tilt and is basically parallel to the vertical axis. Cutting using laser rotary cutting took 20 minutes, while cutting using conventional multi-path cutting took 24 minutes. Compared with conventional cutting methods, laser rotary cutting results in a smaller edge gradient, higher efficiency, less edge slag, and easier control of the final dimensions.
[0031] This application employs a multi-layer spiral cutting method, which, through a more refined energy application, results in a more uniform distribution of laser energy on the material, thereby reducing the risk of localized overheating and minimizing the heat-affected zone and slag formation. Pre-designed laser spiral cutting paths ensure cutting quality while improving cutting efficiency and contributing to more perpendicular and flatter cutting edges, thus enhancing the dimensional accuracy of the cut parts. The narrower laser path width avoids defects such as slag, burnt edges, and cracks associated with long-wavelength single-path laser cutting, and solves the problems of edge gradient and slow efficiency in short-wavelength multi-path laser cutting. The cut substrate exhibits precise dimensional control, minimal edge gradient, and less slag, with higher cutting efficiency compared to other multi-path cutting methods. This invention is not limited by the type of green ceramic sheet and has a wide range of applications.
[0032] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.
[0033] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.
Claims
1. A method for laser rotary cutting of ceramic substrates, characterized in that, Including: Design a laser spiral cutting path drawing in path design software according to the thickness of the ceramic substrate and the cutting contour dimensions. Use the drawing processing software supporting the laser equipment to convert the laser spiral cutting path drawing. Download the converted laser spiral cutting path drawing to the laser equipment and adjust the parameters of the laser equipment. Start the laser equipment to cut the ceramic substrate.
2. The laser rotary cutting method for ceramic substrates as described in claim 1, characterized in that, The laser spiral cutting path includes multiple layers, and each layer includes spiral line units. The spiral line units are arranged in an equidistant array along the cutting contour to obtain multiple replicated spiral line units. The spiral line units and the multiple replicated spiral line units are connected end to end to form a closed curve.
3. The laser rotary cutting method for ceramic substrates as described in claim 2, characterized in that, The equidistant distance for the array arrangement of the spiral line units is equal to the distance between the head and tail ends of the spiral line.
4. The laser rotary cutting method for ceramic substrates as described in claim 2, characterized in that, The spiral line units in multiple layers are arranged in sequence along one direction on the cutting contour, and the spiral line units in adjacent two layers partially overlap. The overlapping range is 1 / 3 - 1 / 4 of the outer diameter of the spiral of the spiral line unit.
5. The laser rotary cutting method for ceramic substrates as described in claim 2, characterized in that, The outer diameter of the spiral of the spiral line unit is 70% - 80% of the width of the conventional multi-path design, and the width of the conventional multi-path design is 0.2 times the thickness of the ceramic substrate.
6. The laser rotary cutting method for ceramic substrates as described in claim 2, characterized in that, The inner spacing of the spiral of the spiral line unit is less than or equal to the laser spot size.
7. The laser rotary cutting method for ceramic substrates as described in claim 6, characterized in that, The range of the inner spacing of the spiral is 0.01 mm - 0.015 mm.
8. The laser rotary cutting method for ceramic substrates as described in claim 2, characterized in that, The distance between the head and tail ends of the spiral of the spiral line unit is the sum of the outer diameter of the spiral and the inner spacing of the spiral.
9. The laser rotary cutting method for ceramic substrates as described in claim 1, characterized in that, The laser equipment is one of an ultraviolet nanosecond cutting machine and an ultraviolet picosecond cutting machine.
10. The laser rotary cutting method for ceramic substrates as described in claim 1, characterized in that, In each layer, the parameters of the laser equipment include: the average laser energy is 5W - 10W, the frequency is 35 kHz - 45 kHz, and the cutting speed is 400 mm / s - 600 mm / s.