A precision bending and splicing forming device for a sheet metal shell of a semiconductor device

Abstract

This invention discloses a precision bending and splicing forming device for sheet metal housings of semiconductor equipment, belonging to the field of semiconductor equipment processing technology. The device includes a housing, a flattening mechanism, a scribing mechanism, a fixing mechanism, and a bending mechanism. The flattening mechanism uses a lifting assembly to drive a rotating roller to flatten wrinkles in the workpiece. The scribing mechanism uses a milling cutter in conjunction with a gear ring and a guide frame to achieve precise scribing in multiple directions. The fixing mechanism is linked with the bending mechanism to achieve synchronous fixing of the workpiece during bending, eliminating the need for multiple clamping operations. The bending mechanism completes synchronous bending in multiple directions through the cooperation of multiple components. This invention balances processing accuracy and efficiency, effectively solves the defects of existing equipment, ensures the forming quality of the sheet metal housing, meets the precision assembly requirements of semiconductor equipment, is easy to operate, and has high practical value.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor equipment processing technology, and specifically relates to a precision bending and splicing forming equipment for semiconductor equipment sheet metal shells. Background Technology

[0002] As a core protective component of semiconductor equipment, the sheet metal housing directly affects the equipment's sealing performance, electromagnetic shielding capabilities, and overall assembly accuracy. Therefore, extremely high requirements are placed on the bending and splicing quality of the sheet metal housing. Currently, the bending and forming of semiconductor equipment sheet metal housings mostly utilizes traditional bending equipment, requiring multiple steps in the process, resulting in low processing efficiency and poor forming accuracy.

[0003] Existing bending equipment generally lacks an effective pre-processing mechanism. The surface of sheet metal raw materials is prone to wrinkles generated during production and transportation. Direct bending will result in an uneven surface of the formed shell, which cannot meet the precision assembly requirements of semiconductor equipment. At the same time, without precise marking and positioning before bending, bending offset and torsion are prone to occur during bending, resulting in bending angle deviation, affecting splicing accuracy, and even causing the workpiece to be scrapped.

[0004] Furthermore, the existing equipment's fixing mechanism is poorly designed, failing to stably and accurately fix the sheet metal parts during bending, making the workpiece prone to displacement and further reducing bending accuracy. Moreover, most equipment requires multiple clamping and positioning of the sheet metal parts, which not only increases the operational process but also easily introduces positioning errors due to repeated clamping, affecting the final forming quality. Summary of the Invention

[0005] In view of the shortcomings of the prior art, the purpose of this invention is to provide a precision bending and splicing forming equipment for semiconductor equipment sheet metal shells, which can solve the technical problems of low forming accuracy and low processing efficiency of the bending equipment in the prior art.

[0006] This invention provides a precision bending and splicing forming device for semiconductor equipment sheet metal housings. The forming device includes a housing, a flattening mechanism, a scribing mechanism, a fixing mechanism, and a bending mechanism. The flattening mechanism includes a lifting assembly and four rotating rollers. The lifting assembly is used to control the lifting and lowering of the rotating rollers so that the rotating rollers can flatten the wrinkles on the surface of the workpiece. The scribing mechanism includes a milling cutter and a power assembly, which are connected. The milling cutter is used to scribble lines on the surface of the workpiece, so that when the workpiece is bent, it bends along the scribing lines. The fixing mechanism is used to fix the workpiece so that the position of the workpiece remains unchanged when it is bent; The bending mechanism includes two first folding plates and two second folding plates arranged opposite to each other, and the workpiece is bent by the first folding plates and the second folding plates.

[0007] The beneficial effects of the technical solutions provided in the embodiments of the present invention include at least the following: In the embodiments of the present invention, the lifting assembly drives the rotating roller to flatten the wrinkles on the surface of the workpiece, solving the problems of lack of pretreatment and uneven surface of the shell after forming in existing equipment, meeting the surface smoothness requirements of precision assembly of semiconductor equipment, and thus ensuring the forming quality. At the same time, the scribing mechanism uses a milling cutter to accurately scribble on the workpiece, and works with a gear ring and guide frame to achieve multi-directional scribing, so that the workpiece bends along the scribing trajectory when bending, avoiding bending offset and torsion, effectively improving bending positioning accuracy and reducing workpiece scrap. In addition, the fixing mechanism is driven by the bending mechanism to achieve synchronous fixing of the workpiece during bending, eliminating the need for multiple clamping, simplifying the operation process, avoiding positioning errors caused by multiple clamping, and solving the defects of unstable fixing and large positioning deviation in existing equipment. Finally, the bending mechanism achieves multi-directional synchronous bending through the cooperation of multiple components, with a reasonable structure and convenient operation, solving the problems of low bending efficiency and difficulty in adapting to complex sheet metal shell processing of traditional equipment. Attached Figure Description

[0008] The accompanying drawings are for illustrative purposes only and are not intended to limit the invention. Throughout the drawings, the same reference numerals denote the same parts. Obviously, the drawings described below are merely some embodiments of the present invention, and those skilled in the art can obtain other drawings based on these drawings without any creative effort.

[0009] Figure 1 This is a front view of the overall structure of a precision bending and splicing forming equipment for semiconductor equipment sheet metal housings provided in an embodiment of the present invention.

[0010] Figure 2 The left view shows the overall structure of a precision bending and splicing forming equipment for semiconductor equipment sheet metal housings provided in an embodiment of the present invention.

[0011] Figure 3 This is a top view of the overall structure of a precision bending and splicing forming equipment for semiconductor equipment sheet metal housings provided in an embodiment of the present invention.

[0012] Figure 4 For along Figure 3 A sectional view along the XX direction.

[0013] Figure 5 This is a schematic diagram of the remaining structure of a semiconductor device sheet metal shell precision bending and splicing forming equipment after removing the shell, as provided in an embodiment of the present invention.

[0014] Figure 6 for Figure 5 A magnified schematic diagram of the structure at point A in the middle.

[0015] Figure 7 This is a schematic diagram of the flattening mechanism of a precision bending and splicing forming equipment for semiconductor equipment sheet metal shells, provided as an embodiment of the present invention.

[0016] Figure 8 for Figure 7 A magnified schematic diagram of the structure at point B in the middle.

[0017] Figure 9 for Figure 7 A magnified schematic diagram of the structure at point C.

[0018] Figure 10 This is a schematic diagram of the fixing mechanism and bending mechanism of a precision bending and splicing forming equipment for semiconductor equipment sheet metal shells, provided as an embodiment of the present invention.

[0019] Figure 11 This is a schematic diagram of the fixing mechanism and bending mechanism of a precision bending and splicing forming equipment for semiconductor equipment sheet metal shells provided in an embodiment of the present invention.

[0020] Figure 12 A partial structural diagram of a precision bending and splicing forming device for semiconductor equipment sheet metal housings provided in an embodiment of the present invention. Figure 1 .

[0021] Figure 13 for Figure 12 A magnified schematic diagram of the structure at point D.

[0022] Figure 14 A partial structural diagram of a precision bending and splicing forming device for semiconductor equipment sheet metal housings provided in an embodiment of the present invention. Figure 2 .

[0023] Explanation of reference numerals in the attached drawings: 1-Housing; 2-Cylinder; 3-Lifting frame; 4-Gear ring; 5-First motor; 6-Spiral gear set; 7-Belt assembly; 8-Milling cutter; 9-Bearing; 10-Guide frame; 11-Guide groove; 12-Rotating frame; 13-Rotating roller; 14-Reset spring; 15-Upper mounting block; 16-Lower mounting block; 17-Platform; 18-First folding plate; 19-Support frame; 20-Second motor; 21-First gear; 22-Second gear; 23-Third gear; 24-Fourth gear; 25-Center cylinder; 26-First threaded rod; 27-Threaded block; 28-Rotating arm; 29-Sliding frame; 30-L-shaped rod; 31-Sliding groove; 32-Second folding plate; 33-Rotating head; 34-Processed part; 35-Warning light; 36-Control panel; 37-Door; 38-Second threaded rod. Detailed Implementation

[0024] To enable those skilled in the art to better understand the technical solutions in the embodiments of the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. It should be understood that these descriptions are merely exemplary and are not intended to limit the scope of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0025] Furthermore, descriptions of well-known structures and techniques are omitted in the following description to avoid unnecessarily obscuring the concepts disclosed in this invention.

[0026] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention.

[0027] Reference manual attached Figures 1 to 14 This invention provides a precision bending and splicing forming device for semiconductor equipment sheet metal housings. The forming device includes a housing 1, a flattening mechanism, a scribing mechanism, a fixing mechanism, and a bending mechanism. The flattening mechanism includes a lifting assembly and four rotating rollers 13. The lifting assembly is used to control the lifting of the rotating rollers 13 so that the rotating rollers 13 can flatten the wrinkles on the surface of the workpiece 34. The scribing mechanism includes a milling cutter 8 and a power assembly. The milling cutter 8 and the power assembly are connected. The milling cutter 8 is used to scribble lines on the surface of the workpiece 34, so that when the workpiece 34 is bent, the workpiece 34 bends along the scribing lines. The fixing mechanism is used to fix the workpiece 34 so that the position of the workpiece 34 remains unchanged when it is bent; The bending mechanism includes two first folding plates 18 and two second folding plates 32 arranged opposite to each other, and the workpiece 34 is bent by the first folding plates 18 and the second folding plates 32.

[0028] In this embodiment, the processed part 34 is the raw material for the sheet metal shell of the semiconductor device. The sheet metal shell of the semiconductor device is produced by bending and forming the processed part 34.

[0029] During the bending process of the workpiece 34, the workpiece 34 is flattened by the flattening mechanism to remove uneven areas on the surface of the workpiece 34 and ensure a smooth surface. Then, the milling cutter 8 in the scribing mechanism scribing lines on the surface of the workpiece 34, so that the workpiece 34 can be bent along the scribing lines during the bending process of the bending mechanism.

[0030] In embodiments of the present invention, the flattening mechanism flattens the surface of the workpiece 34, improving the flatness of the surface and the quality after forming, ensuring a smooth surface to meet usage requirements. Furthermore, fixing the workpiece 34 with the fixing mechanism ensures its position remains unchanged during bending, improving bending accuracy and resulting in a more precise bent shell. Only one clamping and positioning of the workpiece 34 is required, significantly enhancing forming accuracy. The scribing mechanism scribing lines on the surface of the workpiece 34 ensures that it bends along the pre-scribed lines when subjected to bending force, preventing twisting during bending and further improving accuracy.

[0031] In the embodiments of the present invention, the lifting assembly drives the rotating roller to flatten the wrinkles on the surface of the workpiece, solving the problems of lack of pretreatment and uneven surface of the shell after forming in existing equipment, meeting the surface smoothness requirements of precision assembly of semiconductor equipment, and thus ensuring the forming quality. At the same time, the scribing mechanism uses a milling cutter to accurately scribble on the workpiece, and works with a gear ring and guide frame to achieve multi-directional scribing, so that the workpiece bends along the scribing trajectory when bending, avoiding bending offset and torsion, effectively improving bending positioning accuracy and reducing workpiece scrap. In addition, the fixing mechanism is driven by the bending mechanism to achieve synchronous fixing of the workpiece during bending, eliminating the need for multiple clamping, simplifying the operation process, avoiding positioning errors caused by multiple clamping, and solving the defects of unstable fixing and large positioning deviation in existing equipment. Finally, the bending mechanism achieves multi-directional synchronous bending through the cooperation of multiple components, with a reasonable structure and convenient operation, solving the problems of low bending efficiency and difficulty in adapting to complex sheet metal shell processing of traditional equipment.

[0032] In one possible implementation, the flattening mechanism further includes a lifting frame 3, a rotating frame 12, a return spring 14, an upper mounting block 15, and a lower mounting block 16. Four rotating rollers 13 are rotatably connected to one end of the four rotating frames 12, and the other end of the rotating frame 12 is rotatably connected to the lifting frame 3. The lower mounting block 16 is rotatably mounted on the rotating frame 12, and the upper mounting block 15 is rotatably mounted on the lifting frame 3. An upper return spring 14 is installed between the lower mounting block 16 and the upper mounting block 15. The lifting frame 3 is connected to the lifting assembly.

[0033] During the flattening process, the lifting frame 3 is driven to slide downwards by the lifting assembly. At this time, the rotating frame 12 and the rotating roller 13 below the lifting frame 3 will move downwards. First, the rotating roller 13 will contact the workpiece 34 fixed on the platform 17. Since the height of the workpiece 34 does not change, after the rotating roller 13 contacts the surface of the workpiece 34, as the lifting frame 3 continues to descend, the rotating roller 13 will roll along the surface of the workpiece 34 and move in a direction away from each other. The rolling rotating roller 13 can flatten the surface of the workpiece 34. During this process, the rotating frame 12 will rotate relative to the lifting frame 3, and the return spring 14 will deform. The function of the return spring 14 is to assist the return of the rotating frame 12 and the rotating roller 13.

[0034] In an embodiment of the present invention, by setting four rotating rollers 13, the surface of the workpiece 34 can be flattened simultaneously in four directions, ensuring the flatness of the surface of the workpiece 34 and improving the accuracy after forming.

[0035] In one possible implementation, the lifting assembly includes two cylinders 2, which are fixedly mounted on the housing 1. The extended ends of the cylinders 2 are fixedly connected to the lifting frame 3, and the lifting frame 3 is slidably engaged with the housing 1.

[0036] In an embodiment of the present invention, the lifting assembly consists of two cylinders 2. By activating the cylinders 2, the lifting frame 3 can be controlled to rise or fall.

[0037] In one possible implementation, the power assembly includes a first motor 5, a cylindrical gear set 6, and a belt assembly 7. The first motor 5 is fixedly mounted on the lifting frame 3. The output shaft of the first motor 5 is connected to one end of the belt assembly 7 through the cylindrical gear set 6. The other end of the belt assembly 7 is connected to a milling cutter 8. The cylindrical gear set 6 and the belt assembly 7 are mounted on the lifting frame 3.

[0038] During the scribing process, the first motor 5 is started, and the output shaft of the first motor 5 drives the cylindrical gear set 6 to rotate, so that the cylindrical gear set 6 drives the belt assembly 7 to rotate, thereby causing the milling cutter 8 to rotate; during the rotation of the milling cutter 8, the surface of the workpiece 34 can be milled, leaving a bending trajectory.

[0039] In this embodiment, after the surface of the workpiece 34 is milled by the milling cutter 8, a bending trajectory will be left on the surface of the workpiece 34. After the four sides of the workpiece 34 are subjected to bending force, the bending can be completed accurately along the bending trajectory.

[0040] In one possible implementation, the scribing mechanism further includes a gear ring 4, a bearing 9, and a guide frame 10. The gear ring 4 is fixedly mounted on the lifting frame 3. The bearing 9 is fixedly connected to the milling cutter 8, and the bearing 9 slides in cooperation with the guide groove 11 provided on the guide frame 10. The guide frame 10 is fixedly mounted on the lifting frame 3. A scribing gear is fixedly mounted on the milling cutter 8, and the scribing gear meshes with the gear ring 4.

[0041] During the bending process of workpiece 34, bending needs to be completed in four directions. Therefore, milling cutter 8 is required to mill in all four directions to leave the bending trajectory. As milling cutter 8 rotates, the engraved gear on milling cutter 8 rotates along gear ring 4, thereby changing the position of milling cutter 8. Bearing 9 mounted on milling cutter 8 rolls along guide groove 11, and guide groove 11 and bearing 9 serve a guiding function. Additionally, one end of belt assembly 7 connected to cylindrical gear set 6 is rotatably connected to lifting frame 3. Therefore, when milling cutter 8 moves around gear ring 4, belt assembly 7 does not restrict the movement of milling cutter 8. Belt assembly 7 includes a belt and two pulleys connected by the belt. One pulley is fixedly connected to milling cutter 8, and the other pulley is coaxially connected to cylindrical gear set 6 and rotatably connected to lifting frame 3. Cylindrical gear set 6 may include two drive gears: one active drive gear is fixedly connected to the output shaft of first motor 5, and the other is a driven drive gear connected to the pulley.

[0042] In this embodiment, by changing the position of the milling cutter 8, a complete milling path, i.e. a bending path, is reserved on the surface of the workpiece 34. This can prevent the workpiece 34 from shifting when it is bent, thus preventing a decrease in the bending accuracy.

[0043] In one possible implementation, the fixing mechanism includes a platform 17, a support frame 19, a central cylinder 25, a rotating head 33, and a second threaded rod 38. The support frame 19 is fixedly mounted on the housing 1, the platform 17 is fixedly connected to the support frame 19, the central cylinder 25 is fixedly mounted on the support frame 19, the second threaded rod 38 is rotatably mounted inside the central cylinder 25, the rotating head 33 and the second threaded rod 38 form a threaded engagement, and the rotating head 33 and the central cylinder 25 form a sliding engagement.

[0044] In one possible implementation, the fixing mechanism further includes a third gear 23, which is fixedly connected to the second threaded rod 38 and connected to a bending mechanism. The bending mechanism drives the third gear 23 to rotate so that the rotating head 33 fixes the workpiece 34 when bending it.

[0045] During the bending process of workpiece 34, workpiece 34 is first placed on the stage 17, and then the third gear 23 is rotated, causing the third gear 23 to drive the second threaded rod 38 to rotate. During the rotation of the second threaded rod 38, the rotating head 33 slides down along the inner wall of the central cylinder 25. After workpiece 34 is placed on the stage 17, the opening above the central cylinder 25 is blocked. During the descent of the rotating head 33, the atmospheric pressure difference inside and outside the central cylinder 25 will firmly attract workpiece 34 to the stage 17, thus completing the fixation.

[0046] In this embodiment, by fixing the workpiece 34 with the rotating head 33 and the central cylinder 25, it can be ensured that the workpiece 34 will not shift during the bending process, thereby improving the forming accuracy.

[0047] In one possible implementation, the bending mechanism includes a first threaded rod 26, a threaded block 27, a rotating arm 28, a sliding frame 29, and an L-shaped rod 30. There are two first threaded rods 26, which are rotatably mounted on the support frame 19. Each first threaded rod 26 is threadedly fitted with a threaded block 27. One end of the rotating arm 28 is rotatably connected to two oppositely arranged surfaces of the threaded block 27. The other end of the rotating arm 28 is rotatably connected to the sliding frame 29. The sliding frame 29 is slidably mounted on the platform 17. The sliding frame 29 is provided with a sliding groove 31, and a rotating block is slidably mounted on the sliding groove 31. The rotating block is rotatably connected to one end of the L-shaped rod 30. Two adjacent L-shaped rods 30 are rotatably connected to the second folding plate 32 and the first folding plate 18, respectively. The first folding plate 18 and the second folding plate 32 are connected to the platform 17 via hinges.

[0048] When bending the workpiece 34, the two first threaded rods 26 rotate, and the threaded block 27, which is threaded with the first threaded rods 26, moves upward. During this upward movement, the threaded block 27 pushes the rotating arm 28, causing the rotating arm 28 to push the sliding frame 29 to slide below the platform 17. As the sliding frame 29 slides, it pushes the L-shaped rod 30, causing the L-shaped rod 30 to push the second folding plate 32 and the first folding plate 18 to rotate relative to the platform 17, thereby completing the bending of the portion of the workpiece 34 that falls on the first folding plate 18 and the second folding plate 32. During the rotation of the second folding plate 32 driven by the L-shaped rod 30, the rotating block connected to the L-shaped rod 30 slides along the sliding groove 31.

[0049] In this embodiment, each threaded block 27 is connected to two rotating arms 28. One rotating arm 28 is used to drive the L-shaped rod 30 connected to the second folding plate 32, and the other rotating arm 28 is used to drive the L-shaped rod 30 connected to the first folding plate 18. Since the two first folding plates 18 are arranged opposite to each other, the rotating arms 28 on the two threaded blocks 27 can be used to drive one first folding plate 18 respectively, or they can drive one first folding plate 18 simultaneously. That is, the L-shaped rods 30 connected to the first folding plates 18 are all connected to the threaded blocks 27, which can improve the stability of the first folding plate 18 during rotation.

[0050] In this embodiment, the bending of the workpiece 34 is completed during the process of the second folding plate 32 and the first folding plate 18 changing from a horizontal state to an upright state relative to the platform 17; at the same time, the bending of the four sides of the workpiece 34 is completed, which can improve the bending efficiency and the bending accuracy.

[0051] In one possible implementation, the bending mechanism further includes a second motor 20, a first gear 21, a second gear 22, and a fourth gear 24. The second motor 20 is fixedly mounted on the housing 1. The first gear 21 is fixedly mounted on the output shaft of the second motor 20. The first gear 21 meshes with the second gear 22, the second gear 22 meshes with the third gear 23, and the third gear 23 meshes with the fourth gear 24. The second gear 22 and the fourth gear 24 are respectively fixedly connected to two first threaded rods 26.

[0052] In this embodiment, when bending the workpiece 34, the second motor 20 is activated, causing its output shaft to drive the first gear 21 to rotate. During the rotation of the first gear 21, the second gear 22, which meshes with it, also rotates, as do the third gear 23 and the fourth gear 24. Therefore, both first threaded rods 26 and one second threaded rod 38 rotate simultaneously. Throughout the bending process, the workpiece 34 remains fixed and does not shift under bending force, greatly improving bending accuracy.

[0053] In one possible implementation, the molding equipment further includes a warning light 35, a control panel 36, and a door 37. The warning light 35 and the control panel 36 are fixedly mounted on the housing 1, and there are two doors 37, which are rotatably mounted on the housing 1.

[0054] In this embodiment, the bending process of the workpiece 34 can be completed by operating the control panel 36. During the bending process, the operating status of the entire equipment can be displayed by the warning light 35. When the entire equipment malfunctions, the warning light 35 will flash rapidly to alert the operator. After the bending is completed, the bent shell can be removed from the shell 1 by opening the door 37.

[0055] This invention encompasses any substitutions, modifications, equivalent methods, and solutions made within the spirit and scope of this invention. To provide the public with a thorough understanding of this invention, specific details are described in detail in the preferred embodiments, while those skilled in the art will fully understand the invention even without these details. Furthermore, to avoid unnecessary misunderstanding of the essence of this invention, well-known methods, processes, procedures, components, and circuits are not described in detail.

[0056] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of the present invention, and are not intended to limit them. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention. Any changes or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in the present invention should be included within the protection scope of the present invention.

Claims

1. A precision bending and splicing forming equipment for semiconductor equipment sheet metal housings, characterized in that, The forming equipment includes a housing, a flattening mechanism, a scribing mechanism, a fixing mechanism, and a bending mechanism; The flattening mechanism includes a lifting assembly and four rotating rollers. The lifting assembly is used to control the lifting and lowering of the rotating rollers so that the rotating rollers can flatten the wrinkles on the surface of the workpiece. The scribing mechanism includes a milling cutter and a power assembly, which are connected. The milling cutter is used to scribble lines on the surface of the workpiece, so that when the workpiece is bent, it bends along the scribing lines. The fixing mechanism is used to fix the workpiece so that the position of the workpiece remains unchanged when it is bent; The fixing mechanism includes a platform, a support frame, a central cylinder, a rotating head, and a second threaded rod. The support frame is fixedly installed on the housing, the platform is fixedly connected to the support frame, the central cylinder is fixedly installed on the support frame, the second threaded rod is rotatably installed inside the central cylinder, the rotating head and the second threaded rod form a threaded engagement, and the rotating head and the central cylinder form a sliding engagement. The bending mechanism includes two first folding plates and two second folding plates arranged opposite to each other, and the workpiece is bent by the first folding plates and the second folding plates. The bending mechanism includes a first threaded rod, a threaded block, a rotating arm, a sliding frame, and an L-shaped rod. There are two first threaded rods, which are rotatably mounted on a support frame. Each first threaded rod has a threaded block threadedly fitted onto it. One end of the rotating arm is rotatably connected to two opposite surfaces of the threaded block. The other end of the rotating arm is rotatably connected to the sliding frame. The sliding frame is slidably mounted on a platform and has a sliding groove. A rotating block is slidably mounted on the sliding groove and is rotatably connected to one end of the L-shaped rod. Two adjacent L-shaped rods are rotatably connected to a second folding plate and a first folding plate, respectively. The first folding plate and the second folding plate are connected to the platform via hinges.

2. The precision bending and splicing forming equipment for semiconductor equipment sheet metal housing as described in claim 1, characterized in that, The flattening mechanism further includes a lifting frame, a rotating frame, a return spring, an upper mounting block, and a lower mounting block. The four rotating rollers are rotatably connected to one end of the four rotating frames, and the other end of the rotating frame is rotatably connected to the lifting frame. A lower mounting block is rotatably mounted on the rotating frame, and an upper mounting block is rotatably mounted on the lifting frame. An upper return spring is installed between the lower mounting block and the upper mounting block. The lifting frame is connected to the lifting assembly.

3. The precision bending and splicing forming equipment for semiconductor equipment sheet metal housing as described in claim 2, characterized in that, The lifting assembly includes two cylinders, which are fixedly mounted on the housing. The extended ends of the cylinders are fixedly connected to the lifting frame, and the lifting frame is slidably engaged with the housing.

4. The precision bending and splicing forming equipment for semiconductor equipment sheet metal housing as described in claim 3, characterized in that, The power assembly includes a first motor, a cylindrical gear set, and a belt assembly. The first motor is fixedly mounted on the lifting frame. The output shaft of the first motor is connected to one end of the belt assembly through the cylindrical gear set. The other end of the belt assembly is connected to a milling cutter. The cylindrical gear set and the belt assembly are mounted on the lifting frame.

5. The precision bending and splicing forming equipment for semiconductor equipment sheet metal housing as described in claim 4, characterized in that, The engraving mechanism also includes a gear ring, a bearing, and a guide frame. The gear ring is fixedly mounted on the lifting frame. The bearing is fixedly connected to the milling cutter, and the bearing slides in cooperation with the guide groove provided on the guide frame. The guide frame is fixedly mounted on the lifting frame. An engraving gear is fixedly mounted on the milling cutter, and the engraving gear meshes with the gear ring.

6. The precision bending and splicing forming equipment for semiconductor equipment sheet metal housing as described in claim 5, characterized in that, The fixing mechanism also includes a third gear, which is fixedly connected to the second threaded rod and connected to the bending mechanism. The bending mechanism drives the third gear to rotate so that the rotating head fixes the workpiece when bending it.

7. The precision bending and splicing forming equipment for semiconductor equipment sheet metal housing as described in claim 6, characterized in that, The bending mechanism further includes a second motor, a first gear, a second gear, and a fourth gear. The second motor is fixedly mounted on the housing, and the first gear is fixedly mounted on the output shaft of the second motor. The first gear meshes with the second gear, the second gear meshes with the third gear, and the third gear meshes with the fourth gear. The second gear and the fourth gear are respectively fixedly connected to two first threaded rods.

8. The precision bending and splicing forming equipment for semiconductor equipment sheet metal housings as described in any one of claims 1 to 7, characterized in that, The molding equipment also includes a warning light, a control panel, and doors. The warning light and control panel are fixedly installed on the housing, and there are two doors that are rotatably installed on the housing.

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