An aluminum-based copper-clad plate substrate surface polishing device and a method of using the same

Abstract

This invention relates to the technical field of copper substrate polishing, and discloses a polishing device and its method for using an aluminum-based copper clad laminate substrate. The device includes conveyor racks installed on both sides and a dust collection device fixedly connected to the top of the polishing device. Inside the polishing device are a dust collection box and polishing components. The dust collection box surrounds the polishing components, and the dust collection box is fixedly connected to and in communication with the dust collection device. This invention, through a double-sealed structure of a "U-shaped dust collection box + door-shaped enclosed cover," achieves all-around enclosure of the polishing components. Combined with the interconnected design of the dust collection device and dust collection box, it effectively confines the dust generated during polishing to a designated area, preventing dust from spreading to the external environment, reducing dust pollution to the workshop environment and health hazards to operators, and preventing dust from adhering to the surface of the aluminum-based copper clad laminate substrate and causing secondary damage.

Description

Technical Field

[0001] This invention belongs to the technical field of copper substrate polishing, and more specifically, it relates to a polishing device for the surface of aluminum-based copper clad laminate substrate and its usage method. Background Technology

[0002] As a commonly used basic component in electronic devices, the surface finish of aluminum-based copper clad laminates directly affects the subsequent assembly accuracy and performance. Therefore, during the production and processing, the surface of the aluminum-based copper clad laminate substrate needs to be polished to remove surface burrs, oxide layers and impurities, and improve surface flatness and smoothness.

[0003] Currently, existing aluminum-based copper clad laminate (CCL) substrate surface polishing equipment suffers from several technical defects in practical use: First, the polishing process generates a large amount of dust. Existing equipment often employs a single enclosed structure or a simple dust collection device, making it difficult to achieve efficient dust collection. Dust easily spreads into the workshop environment, polluting the working environment, harming the health of operators, and adhering to the polished substrate surface, causing secondary damage and affecting polishing quality. Second, existing dust collection devices are mostly single dust collection structures, lacking auxiliary dust collection and cooling functions. On the one hand, the dust collection load is large, resulting in high maintenance costs and short service life for external vacuum cleaners. On the other hand, the heat generated during polishing can easily cause irreversible deformation of the aluminum-based CCL substrate, reducing product qualification rate. Third, the dust collection structure of existing equipment often requires regular manual cleaning, resulting in low automation and cumbersome cleaning processes. This not only increases the workload of operators but also affects the continuous operating efficiency of the equipment, making it difficult to meet the needs of large-scale production.

[0004] Therefore, in view of this, we have studied and improved the existing structure and its shortcomings, and provided a polishing device for the surface of aluminum-based copper clad laminate substrate and its usage method, in order to achieve a more practical and valuable purpose. Summary of the Invention

[0005] This invention provides a polishing device for the surface of an aluminum-based copper-clad laminate substrate and a method for using it, which overcomes the above-mentioned defects in the prior art.

[0006] The purpose and effectiveness of the aluminum-based copper-clad laminate substrate surface polishing device and its usage method of the present invention are achieved by the following specific technical means:

[0007] A polishing device for the surface of an aluminum-based copper clad laminate and its method of use, comprising a polishing device, conveyor racks installed on both sides of the polishing device, and a dust collection device fixedly connected above the polishing device;

[0008] The polishing device is equipped with a dust collection box and a polishing assembly. The dust collection box surrounds the polishing assembly and is fixedly connected to and in communication with the dust collection device.

[0009] The polishing assembly polishes and grinds the copper substrate, the dust collection box surrounds the polishing and grinding area, and the dust collection device above the dust collection box humidifies, adsorbs, and removes dust.

[0010] A further technical solution is provided, wherein the polishing device includes a mounting base, a square bracket is provided above the mounting base, a transmission table assembly is fixedly mounted above the square bracket, the transmission table assembly includes two side mounting plates, a first transmission shaft and a second transmission shaft are respectively mounted at both ends of the two side mounting plates, a drive motor is fixedly mounted above the first transmission shaft, and a conveyor belt is rotatably connected between the first transmission shaft and the second transmission shaft.

[0011] A further technical solution involves two polishing components fixedly mounted on the outer side of the side mounting plate. Each polishing component includes a fixed bracket, which is fixedly connected to the side mounting plate. A lower moving wheel is rotatably mounted on the fixed bracket. A telescopic adjustment component is fixedly mounted on the upper end of the fixed bracket, and an upper moving wheel is rotatably mounted on the end of the telescopic adjustment component. A polishing abrasive belt is provided between the upper moving wheel and the lower moving wheel. A gap is provided between the mounting base and the transmission platform assembly, and two sets of transmission motors are fixedly mounted within the gap. The positions of the two sets of transmission motors correspond to those of the lower moving wheel, and the transmission motors are driven by a belt pulley.

[0012] A further technical solution is that the two sets of polishing components are wrapped with a dust collection box. The dust collection box has a U-shaped cover structure, with a hollow structure inside the top and side walls. The bottom of the side walls has an opening facing the polishing components. The dust collection box has a door-shaped closed cover on the outside, and a dust collection device is fixedly installed on the top of the door-shaped closed cover.

[0013] A further technical solution includes a central collection bucket assembly, with an upper cover fixedly connected to the upper end of the central collection bucket assembly, and a rhomboid dust collection assembly fixedly connected to the lower end of the central collection bucket assembly. A water inlet connection pipe is fixedly connected to the outer side of the rhomboid dust collection assembly, and an exhaust connection pipe is fixedly connected to the upper end of the upper cover. The exhaust connection pipe includes a second exhaust pipe and a first exhaust pipe. The upper opening of the second exhaust pipe is closed, while the upper opening of the first exhaust pipe is open. The rhomboid dust collection assembly includes a rhomboid dust collection chamber, and an atomizer assembly is fixedly installed inside the rhomboid dust collection chamber. The atomizer assembly is installed at a ring-shaped portion in the center, and an isolation baffle is fixedly connected to the outer edge of the atomizer assembly. The isolation baffle divides the internal cavity of the rhomboid dust collection chamber into an upper cavity and a humidification cavity. An adsorption isolation pipe is fixedly connected to the lower end of the isolation baffle.

[0014] A further technical solution is that the middle collection bucket assembly includes a collection bucket outer bucket, and an annular sealing plate is provided at the connection between the collection bucket outer bucket and the diamond-shaped dust collection assembly. An opening is provided on the annular sealing plate, and an inner drain pipe is fixedly connected to the opening. An inner isolation plate is provided between the inner drain pipe and the collection bucket outer bucket, and a drain pipe channel is provided inside the inner drain pipe, which communicates with the interior of the upper cavity.

[0015] A further technical solution is provided, in which an isolation base plate is fixedly installed inside the upper cover, and a through hole opening is provided in the middle of the isolation base plate. The size of the through hole opening is the same as the diameter of the middle collection bucket assembly. An annular plate is fixedly installed above the connection between the through hole and the middle collection bucket assembly. The edge of the annular plate forms a sealed connection with the inner isolation plate. The inner drain pipe passes through the annular plate, and six sets of L-shaped outer drain pipes are provided on the outside of the inner drain pipe. The L-shaped outer drain pipes are located above the annular plate.

[0016] A further technical solution is provided, wherein a rotating connecting frame is rotatably installed on the outer side of the inner drain pipe, and a number of collection rollers are arranged in an array on the outer side of the rotating connecting frame. A rotating blade is fixedly installed above the rotating connecting frame. One end of the L-shaped outer drain pipe is connected to the inside of the inner drain pipe, and the other end of the L-shaped outer drain pipe faces the rotating blade. A sealing plate is provided below the rotating blade, and the sealing plate is fixedly connected to the inner wall of the rotating connecting frame.

[0017] A further technical solution includes a fixed plate with a through hole on the fixed plate. A middle barrel is rotatably installed in the through hole. An inner partition is fixedly installed on the inner side of the middle barrel. The middle barrel has multiple sets of rectangular openings, and inner partitions are installed on the outer sides of each set of rectangular openings. An outer barrel is fixedly connected to the outer side of the inner partition. The middle barrel has an opening at one end facing the fixed plate, and an end connector is installed in the opening. The end connector communicates with the outer barrel and the inner partition of the collection barrel. A rubber column is installed inside the middle barrel.

[0018] Further technical solutions and usage methods include the following steps:

[0019] S1: Seal the exhaust pipe to the suction fan pipe, and after powering on, adjust the distance between the upper and lower moving wheels through the telescopic adjustment component, and install the polishing sand belt;

[0020] S2: Start the drive motor and transmission motor to drive the polishing sander belt and conveyor belt respectively;

[0021] S3: The substrate is fed from the conveyor frame device and transported by the conveyor belt to the polishing sand belt for polishing;

[0022] S4: Activate the external centralized vacuum cleaner and atomizer components to achieve dust interception and substrate drip cooling;

[0023] S5: Adjust the vacuum cleaner's suction power according to the amount of dust, driving the rotating blades, rotating connecting frame and collection drum to rotate, complete the cleaning, clumping and separation of dust and discharge.

[0024] Compared with the prior art, the present invention has the following beneficial effects:

[0025] This invention discloses an aluminum-based copper clad laminate substrate surface polishing device and its usage method. Through a double-enclosed structure of "U-shaped dust collection box + door-shaped closed cover", the polishing components are fully surrounded. With the connection design between the dust collection device and the dust collection box, the dust generated during polishing can be effectively confined to a designated area, preventing dust from spreading to the external environment, reducing dust pollution to the workshop environment and health hazards to operators, and preventing dust from adhering to the surface of the aluminum-based copper clad laminate substrate and causing secondary damage, thus initially ensuring the polishing quality of the substrate.

[0026] This invention discloses an aluminum-based copper-clad laminate substrate surface polishing device and its usage method. Through the synergistic design of a diamond-shaped dust collection component and an atomizer component, the smooth flow guiding effect of the diamond-shaped dust collection chamber is used to improve dust collection efficiency. At the same time, the atomizer component has a dual function: on the one hand, it atomizes and intercepts the dust sucked in by the adsorption isolation tube, reducing the load on the external centralized vacuum cleaner, reducing its later maintenance costs, and extending the service life of the equipment; on the other hand, it uses atomized condensed water droplets to achieve drip cooling of the substrate during polishing, effectively preventing irreversible deformation of the substrate due to polishing heat, and further improving the surface smoothness and product qualification rate of the substrate after polishing.

[0027] This invention discloses an aluminum-based copper-clad laminate substrate surface polishing device and its usage method. Through the linkage structure of an L-shaped external exhaust pipe, rotating blades, a rotating connecting frame, and a collection drum, the device utilizes the suction power of an external vacuum cleaner to achieve adaptive rotation of the rotating blades and the collection drum. It can automatically clean and collect dust inside the upper cover without additional power, reducing manual cleaning workload, improving the automation level and ease of use of the device, and achieving efficient separation and emission of dust and gas. It takes into account both environmental protection and practicality, and solves the technical pain points of traditional polishing equipment such as poor dust removal effect, easy deformation of the substrate, and cumbersome cleaning, thus improving the overall performance of the device. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of the invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0029] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0030] Figure 1 This is a schematic diagram of the overall appearance and structure of the present invention;

[0031] Figure 2 This is a partial external structural diagram of the present invention;

[0032] Figure 3 This is a partial front view schematic diagram of the structure of the present invention;

[0033] Figure 4 This is a partial front view schematic diagram of the polishing device of the present invention;

[0034] Figure 5 This is a schematic diagram of the internal structure of the polishing device of the present invention;

[0035] Figure 6 This is a schematic diagram of the overall appearance and structure of the dust collection device of the present invention;

[0036] Figure 7 This is a schematic side view of the overall structure of the dust collection device of the present invention;

[0037] Figure 8 This is a schematic diagram of the internal structure of the dust collection device of the present invention;

[0038] Figure 9 This is a schematic diagram of the overall appearance structure of the collecting drum of the present invention;

[0039] Figure 10 This is a schematic diagram of the exploded structure of the collecting drum of the present invention;

[0040] Figure 11 This is a schematic diagram of the overall side cross-sectional structure of the collecting drum of the present invention;

[0041] Figure 12 For the present invention Figure 11 Enlarged structural diagram at point A;

[0042] Figure 13 For the present invention Figure 11 Enlarged structural diagram at point B;

[0043] Figure 14 For the present invention Figure 11 A magnified structural diagram at point C.

[0044] Explanation of reference numerals in the attached figures:

[0045] 1. Conveyor frame device;

[0046] 2. Polishing device; 21. Dust collection box; 22. Polishing assembly; 221. Upper moving wheel; 222. Polishing sanding belt; 223. Telescopic adjustment assembly; 224. Fixed bracket; 225. Lower moving wheel; 226. Drive motor; 23. Mounting base; 24. Drive table assembly; 241. Drive motor; 242. First drive shaft; 243. Side mounting plate; 244. Conveyor belt; 245. Second drive shaft;

[0047] 3. Dust collection device; 31. Upper cover; 32. Exhaust connection pipe; 321. First exhaust pipe; 322. Second exhaust pipe;

[0048] 33. Diamond-shaped dust collection assembly; 331. Diamond-shaped dust collection chamber; 332. Atomizer assembly; 333. Upper cavity; 334. Isolation baffle; 335. Humidification chamber; 336. Adsorption isolation tube;

[0049] 34. Water inlet connection pipe; 35. Middle collection tank assembly; 351. Outer tank of collection tank; 352. Inner drain pipe; 353. Inner partition plate; 354. Drain pipe channel;

[0050] 36. Rotating blade; 37. Rotating connecting frame; 38. Collecting drum; 381. Outer drum; 382. Fixing plate; 383. Inner partition; 384. Rubber column; 385. Middle drum; 386. End connector; 39. Isolation base plate. Detailed Implementation

[0051] The embodiments of the present invention will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and should not be construed as limiting the scope of the invention.

[0052] In the description of this invention, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," "front end," "rear end," "head," "tail," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first," "second," "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0053] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0054] As attached Figure 1 To be continued Figure 14 As shown:

[0055] The present invention provides a polishing device for the surface of an aluminum-based copper clad laminate substrate, comprising a polishing device 2, a conveyor frame device 1 installed on both sides of the polishing device 2, and a dust collection device 3 fixedly connected to the top of the polishing device 2.

[0056] The polishing device 2 is equipped with a dust collection box 21 and a polishing component 22. The dust collection box 21 surrounds the polishing component 22. The dust collection box 21 is fixedly connected to and in communication with the dust collection device 3. This structure can realize the rapid collection of dust during the polishing process, prevent dust from spreading to the outside of the device, reduce pollution to the working environment, and prevent dust from adhering to the surface of the copper plate substrate and causing secondary damage, thus ensuring the polishing quality.

[0057] The polishing component 22 polishes the copper substrate, the dust collection box 21 surrounds the polishing area, and the dust collection device 3 above the dust collection box 21 humidifies and adsorbs dust. Through the surrounding design of the dust collection box 21, the dust generated during polishing can be confined to a specific area. Combined with the humidifying and adsorbing function of the dust collection device 3, dust can be removed efficiently while preventing dry dust from flying around. At the same time, the copper substrate is cooled and protected, improving the surface smoothness of the substrate and the product qualification rate after polishing.

[0058] Preferred options are shown in the appendix. Figure 4 To be continued Figure 5 The polishing device 2 includes a mounting base 23, with a square bracket on top of the mounting base 23. A transmission table assembly 24 is fixedly mounted on the square bracket. The transmission table assembly 24 includes two side mounting plates 243, with a first transmission shaft 242 and a second transmission shaft 245 respectively mounted at both ends of the two side mounting plates 243. A drive motor 241 is fixedly mounted on top of the first transmission shaft 242. A conveyor belt 244 is rotatably connected between the drive motor 241, the first transmission shaft 242, and the second transmission shaft 245. The transmission table assembly 24 has a stable structure, and the drive motor 241 drives the conveyor belt 244 to operate smoothly, which can realize continuous and uniform speed conveying of copper substrate, ensure uniform polishing of the substrate surface, avoid problems such as uneven polishing depth and surface scratches caused by uneven conveying speed, and improve polishing efficiency and product consistency.

[0059] Preferred options are shown in the appendix. Figure 4 To be continued Figure 5 Two polishing assemblies 22 are fixedly installed on the outer side of the side mounting plate. Each polishing assembly 22 includes a fixed bracket 224, which is fixedly connected to the side mounting plate. A lower moving wheel 225 is rotatably mounted on the fixed bracket 224. A telescopic adjustment assembly 223 is fixedly mounted on the upper end of the fixed bracket 224. An upper moving wheel 221 is rotatably mounted on the end of the telescopic adjustment assembly 223. A polishing abrasive belt 222 is provided between the upper moving wheel 221 and the lower moving wheel 225. A gap is provided between the mounting base 23 and the transmission platform assembly 24, and two polishing assemblies are fixedly installed in the gap. Two sets of drive motors 226 are positioned corresponding to the lower drive wheel 225, and the drive motors 226 and the lower drive wheel 225 are connected by a belt pulley drive. The telescopic adjustment component 223 can flexibly adjust the distance between the upper drive wheel 221 and the lower drive wheel 225 to adapt to the polishing requirements of aluminum-based copper-clad laminate substrates of different thicknesses, and has strong versatility. The belt pulley drive method provides smooth transmission and low noise, which can ensure the uniform speed operation of the polishing sand belt 222 and improve polishing stability. At the same time, the two sets of polishing components 22 work together to achieve efficient polishing of the substrate surface, shorten processing time, and improve production efficiency.

[0060] Preferred options are shown in the appendix. Figure 1 To be continued Figure 5 The two sets of polishing components 22 are surrounded by dust collection boxes 21. The dust collection box 21 has a U-shaped cover structure with a hollow structure at the top and inside of the side walls. The bottom of the side walls has openings facing the polishing components 22. The dust collection box 21 has a door-shaped closed cover on the outside, and a dust collection device 3 is fixedly installed on the top of the door-shaped closed cover. The U-shaped dust collection box 21 can completely surround the polishing components 22. With the openings at the bottom of the side walls, it can accurately collect the dust generated during polishing and reduce dust escape. The door-shaped closed cover further improves the sealing and protection effect, prevents dust from spreading to the workshop environment, and provides a stable installation foundation for the dust collection device 3, ensuring the stable operation of the dust removal function and taking into account both protection and operability.

[0061] Preferred options are shown in the appendix. Figure 6 To be continued Figure 14 The dust collection device 3 includes a central collection bucket assembly 35. An upper cover 31 is fixedly connected to the upper end of the central collection bucket assembly 35, and a rhomboid dust collection assembly 33 is fixedly connected to the lower end of the central collection bucket assembly 35. A water inlet connection pipe 34 is fixedly connected to the outer side of the rhomboid dust collection assembly 33. An exhaust connection pipe 32 is fixedly connected to the upper end of the upper cover 31. The exhaust connection pipe 32 includes a second exhaust pipe 322 and a first exhaust pipe 321. The upper opening of the second exhaust pipe 322 is closed, while the upper opening of the first exhaust pipe 321 is open. The rhomboid dust collection assembly 33 includes a rhomboid dust collection chamber 331. An atomizer assembly 332 is fixedly installed inside the rhomboid dust collection chamber 331. The atomizer assembly 332 is installed at the annular portion in the center. An isolation baffle 334 is fixedly connected to the outer edge of the atomizer assembly 332. The isolation baffle 334 divides the internal cavity of the rhomboid dust collection chamber 331 into an upper cavity 333 and a humidification cavity 335. An adsorption isolation tube 336 is fixedly connected to the lower end of the isolation baffle 334. The rhomboid structure of the rhomboid dust collection chamber 331 can smoothly guide the dust-laden airflow, avoid the generation of airflow eddies, reduce dust accumulation, and improve dust removal efficiency. The dual-function design of the atomizer assembly 332 not only achieves the initial interception of dust, reducing the load on the external vacuum cleaner and reducing its later maintenance costs, but also prevents the deformation of the copper plate substrate by cooling with water droplets, achieving two goals at once. The isolation baffle 334 divides the cavity to prevent the atomized water vapor from mixing with dust and affecting the exhaust effect, ensuring that the dust removal and cooling functions do not interfere with each other.

[0062] Preferred options are shown in the appendix. Figure 6 To be continued Figure 14The central collection bucket assembly 35 includes an outer collection bucket 351. An annular sealing plate is provided at the connection between the outer collection bucket 351 and the diamond-shaped dust collection assembly 33. An opening is provided on the annular sealing plate, and an inner exhaust pipe 352 is fixedly connected to the opening. An inner isolation plate 353 is provided between the inner exhaust pipe 352 and the outer collection bucket 351. An exhaust pipe channel 354 is provided inside the inner exhaust pipe 352, and the exhaust pipe channel 354 communicates with the interior of the upper cavity 333. The annular sealing plate ensures the sealing of the connection, preventing leakage of dust-laden gas and improving the dust removal effect. The inner isolation plate 353 separates the outer collection bucket 351 from the inner exhaust pipe 352, achieving initial separation of dust and gas, facilitating centralized collection and treatment of dust. Simultaneously, the exhaust pipe channel 354 can accurately deliver the atomized dust-laden gas to the subsequent filtration structure, improving the overall dust removal efficiency.

[0063] Preferred options are shown in the appendix. Figure 6 To be continued Figure 14 An isolation base plate 39 is fixedly installed inside the upper cover 31. The isolation base plate 39 has a through hole in the middle, the size of which is the same as the diameter of the middle collection bucket assembly 35. An annular plate is fixedly installed above the connection between the through hole and the middle collection bucket assembly 35. The edge of the annular plate forms a sealed connection with the inner isolation plate 353. The inner exhaust pipe 352 passes through the annular plate. Six sets of L-shaped outer exhaust pipes are provided on the outside of the inner exhaust pipe 352. The L-shaped outer exhaust pipes are located above the annular plate. The sealed connection design between the isolation base plate 39 and the annular plate can prevent dust-laden gas from leaking inside the upper cover 31 and ensure that all gas is filtered and intercepted. The six sets of L-shaped outer exhaust pipes can evenly disperse the dust-laden gas to the rotating blades 36, causing the rotating blades 36 to rotate smoothly, while achieving preliminary filtration of the gas and improving the subsequent dust collection effect.

[0064] Preferred options are shown in the appendix. Figure 6 To be continued Figure 14 A rotating connecting frame 37 is rotatably mounted on the outer side of the inner drain pipe 352. Several sets of collecting drums 38 are arrayed on the outer side of the rotating connecting frame 37. A rotating blade 36 is fixedly mounted on the top of the rotating connecting frame 37. One end of the L-shaped outer drain pipe is connected to the inside of the inner drain pipe 352, and the other end of the L-shaped outer drain pipe faces the rotating blade 36. A sealing plate is provided below the rotating blade 36, and the sealing plate is fixedly connected to the inner wall of the rotating connecting frame 37. The rotating blade 36 can achieve adaptive rotation using the suction power of an external vacuum cleaner, without the need for additional power, thus saving energy. The rotating connecting frame 37 drives the collecting drums 38 to rotate synchronously, realizing automatic cleaning of dust inside the upper cover 31, reducing the amount of manual cleaning work, and improving the automation level and ease of use of the device. The sealing plate can ensure the sealing of the rotating connecting frame 37 when it rotates, preventing dust-laden gas from leaking from the connection.

[0065] Preferred options are shown in the appendix. Figure 9 To be continued Figure 10 The collecting drum 38 includes a fixing plate 382 with a through hole. A middle drum 385 is rotatably installed in the through hole. An inner partition 383 is fixedly installed inside the middle drum 385. The middle drum 385 has multiple sets of rectangular openings, and the inner partitions 383 are installed on the outer sides of each set of rectangular openings. An outer drum 381 is fixedly connected to the outer side of the inner partitions 383. One end of the middle drum 385 facing the fixing plate 382 has an opening, and an end connector 386 is installed in the opening. The middle barrel 385 is connected to the outer barrel 351 and the inner partition plate 353 of the collection barrel. A rubber column 384 is installed inside the middle barrel 385. The rolling and squeezing design of the collection roller 38 can squeeze the condensed dust on the isolation bottom plate 39 into clumps, which facilitates the centralized discharge and treatment of dust and prevents dust from flying again. The rubber column 384 can assist the dust to collide and clump together, improving the dust collection effect. At the same time, the inner partition plate 383 can prevent the dust after clumping from flowing back, ensuring that the dust is stably discharged between the outer barrel 351 and the inner partition plate 353 of the collection barrel, further improving the thoroughness of dust removal.

[0066] Preferred options are shown in the appendix. Figure 1 To be continued Figure 14 The method of use includes the following steps:

[0067] S1: Seal the exhaust connection pipe 32 to the suction fan pipe, and after powering on, adjust the distance between the upper and lower moving wheels through the telescopic adjustment component 223, and install the polishing sand belt 222;

[0068] S2: Start the transmission motor 226 and drive motor 241, which will drive the polishing sand belt 222 and the conveyor belt 244 to operate respectively;

[0069] S3: The substrate is fed from the conveyor frame device 1 and conveyed to the polishing sand belt 222 via the conveyor belt 244 for polishing;

[0070] S4: Activate the external centralized vacuum cleaner and atomizer assembly 332 to achieve dust interception and substrate drip cooling;

[0071] S5: Adjust the suction power of the vacuum cleaner according to the amount of dust, drive the rotating blades 36, rotating connecting frame 37 and collection drum 38 to rotate, and complete the cleaning, clumping and separation of dust.

[0072] Specific usage of this invention:

[0073] When using this device, first connect the exhaust connection pipe 32 of this device to the suction fan pipe of the production line to ensure a sealed connection and prevent leakage of dusty gas, laying the foundation for subsequent dust removal work; then the device can start normal operation. Traditional polishing equipment generates a lot of dust during use. A large amount of dust will not only cause secondary damage to the copper plate substrate, but also cause serious pollution to the factory working environment, and will also increase the health risks of operators. This device can effectively solve the above-mentioned drawbacks of traditional equipment through an integrated dust removal and cooling structure.

[0074] When this device is in use, it is first powered on to ensure a stable power supply to all electrical components. Then, the distance between the lower moving wheel 225 and the upper moving wheel 221 is adjusted via the telescopic adjustment component 223. This adjustment process can precisely adapt to aluminum-based copper-clad laminate substrates of different thicknesses, ensuring that the polishing belt 222 is tightly attached to the substrate surface with appropriate pressure, thereby achieving stable installation of the polishing belt 222. Next, the drive motor 226 is started. Once started, the drive motor 226 drives the lower moving wheel 225 to rotate via a pulley. The pulley drive method provides smooth transmission and low noise, ensuring stable power transmission and preventing speed fluctuations from affecting the polishing effect. The rotation of the lower moving wheel 225 drives the upper moving wheel 221 and the polishing belt 222 to rotate synchronously, ensuring the polishing belt 222 operates at a uniform speed, guaranteeing uniform polishing. Subsequently, while the polishing belt 222 rotates, the drive table component 24, equipped with a drive motor 241, drives the first drive shaft 24. 2. The second drive shaft 245 and the conveyor belt 244 rotate. The transmission table assembly 24 has a stable structure and can realize continuous and uniform conveying of the copper plate substrate. After rotation, the copper plate can be fed from the conveyor frame device 1. The conveyor frame device 1 can realize the smooth transition of the substrate and avoid the offset and collision during the substrate feeding. After feeding, the copper plate is moved onto the conveyor belt 244. The surface of the conveyor belt 244 is flat and the operation is stable, which can ensure the stability of the substrate position during the conveying process. After the copper plate enters the conveyor belt 244, the polishing sand belt 222 begins to polish the copper plate. The two polishing components 22 work together to improve the polishing efficiency and ensure that the substrate surface is polished evenly. A lot of dust will be generated after polishing. At this time, the dust collection device 3 in this device will be passively engaged in dust collection. The operator will turn on the external centralized vacuum cleaner and the atomizer assembly 332 inside the dust collection device 3 for humidification assistance to achieve efficient dust collection and substrate cooling protection.

[0075] Subsequently, when the external centralized vacuum cleaner is in use, the atomizer assembly 332 inside this device can achieve initial physical interception for the external centralized vacuum cleaner, reducing the later maintenance cost of the centralized vacuum cleaner and extending the service life of the external vacuum cleaner. Later, when the dust collection device 3 of this device is in use, the atomizer assembly 332 inside the dust collection device 3 will be in atomization operation. The atomizer assembly 332 is installed at the annular part in the middle of the diamond-shaped dust collection chamber 331, and its side near the outer barrel 351 and the side near the humidification chamber 335 achieves external atomization. The atomization on the side near the outer barrel 351 can increase the interception and collection of dust sucked in from the adsorption isolation tube 336, utilizing... Water vapor condenses dust particles, facilitating subsequent filtration. The atomizer near the humidification chamber 335 begins atomization, and the atomized water vapor condenses into water droplets outside the isolation baffle 334. The isolation baffle 334 divides the internal cavity of the diamond-shaped dust collection chamber 331 into an upper cavity 333 and a humidification chamber 335, preventing the atomized water vapor from mixing with dust and affecting the exhaust effect. This ensures that dust removal and cooling functions do not interfere with each other. Subsequently, the water droplets drip onto the copper substrate to achieve cooling, effectively preventing deformation of the copper substrate due to heat generated during polishing, avoiding irreversible damage. Simultaneously, it improves the polishing quality of the substrate surface, preventing oxidation, scratches, and other problems caused by high temperatures.

[0076] Subsequently, when the operator observes that a significant amount of dust has been generated during polishing, the suction power of the external centralized vacuum cleaner will be adjusted. The suction power can be flexibly adjusted according to the amount of dust generated. As the suction power changes, the atomization power also increases, and the atomization effect is enhanced. Then, by using different suction powers, the rotating blades 36 rotate at different intensities. Above the rotating blades 36 is the outlet of the L-shaped external exhaust pipe. When the dust-laden gas is ejected through the L-shaped external exhaust pipe, it can assist in driving the rotating blades 36 to rotate. No additional power is required, saving energy consumption. This allows the rotating connecting frame 37 to drive the collection drum 38 to achieve adaptive cleaning. When the external suction is stronger, the rotating connecting frame 37 rotates faster, and the cleaning rate also increases. This achieves adaptive adjustment of dust collection and improves cleaning efficiency.

[0077] Furthermore, when the rotating blade 36 drives the rotating connecting frame 37 to rotate, the inside of the discharge pipe channel 354 contains atomized gas and dust particles. The discharge pipe channel 354 is connected to the upper cavity 333 of the diamond-shaped dust collection chamber 331, which can accurately deliver the atomized dust-laden gas to the inner discharge pipe 352. Subsequently, the dust particles will enter the upper cover 31 through the six sets of L-shaped outer discharge pipes provided on the outside of the inner discharge pipe 352 to achieve filtration and interception. The six sets of L-shaped outer discharge pipes can evenly disperse the dust-laden gas, ensuring that the gas is in full contact with the subsequent cleaning components and improving the filtration and interception effect.

[0078] When condensed dust particles and gas enter the upper cover 31, the isolation base plate 39 inside the upper cover 31 forms a sealed connection with the annular plate to prevent the leakage of dust-laden gas. The lower end of the first exhaust pipe 321 has an opening that communicates with the interior of the exhaust connecting pipe 32. The accumulated dust will accumulate inside the exhaust connecting pipe 32, and the remaining gas will be discharged to the outside through the opening of the exhaust connecting pipe 32. The upper opening of the second exhaust pipe 322 is closed to prevent gas from being discharged from non-designated outlets, ensuring that all gas is filtered. Subsequently, the dust accumulated inside the upper cover 31 will be circulated through a vortex. The rotation of the blade 36 causes the rotating connecting frame 37 to rotate. The rotating connecting frame 37 is equipped with a cross connecting shaft. An oblique rubber brush is provided on the side of the cross connecting shaft of the rotating connecting frame 37 near the sealing plate. The sealing plate can ensure the sealing of the rotating connecting frame 37 when it rotates, preventing dust-laden gas from leaking from the connection. Then, when the rotating connecting frame 37 rotates, the rubber brush of the rotating connecting frame 37 will drive the dust to slide onto the isolation base plate 39. At the same time, the rotation of the rotating connecting frame 37 will drive the collection drum 38 to roll, realizing the comprehensive cleaning of dust inside the upper cover 31 and reducing the amount of manual cleaning work.

[0079] Subsequently, as the collecting drum 38 rotates, it will compress and collect the condensed dust accumulated on the isolation base plate 39. The rolling compression will enter the middle drum 385 through several sets of slots on the surface of the outer drum 381. Rubber columns 384 are installed inside the middle drum 385. The dust will collide and clump inside the rubber columns 384, which facilitates the centralized discharge and treatment of the dust and prevents the dust from flying again. After colliding and clumping, the dust will be discharged between the outer drum 351 and the inner isolation plate 353 by tilting the middle drum 385 towards the fixed plate 382. The inner isolation plate 353 separates the outer drum 351 and the inner discharge pipe 352, realizing the initial separation of dust and gas. When the gas is discharged into the inner isolation plate 353, the gas will also enter between the outer drum 351 and the inner isolation plate 353 at the same time. Then, it will be discharged to the outside through the opening at the lower end of the first exhaust pipe 321, ensuring that the gas emission meets the standards and realizing the centralized collection of dust, improving the environmental protection and practicality of the device.

[0080] The present invention discloses an aluminum-based copper clad laminate substrate surface polishing device and its usage method. Through the double-enclosed structure of "U-shaped dust collection box 21 + door-shaped closed cover", the polishing component 22 is fully surrounded. With the connection design between the dust collection device 3 and the dust collection box 21, the dust generated during polishing can be effectively confined to a designated area, preventing dust from spreading to the external environment, reducing dust pollution to the workshop environment and health hazards to operators, and preventing dust from adhering to the surface of the aluminum-based copper clad laminate substrate and causing secondary damage, thus initially ensuring the polishing quality of the substrate.

[0081] This invention discloses an aluminum-based copper-clad laminate substrate surface polishing device and its usage method. Through the synergistic design of the rhomboid dust collection component 33 and the atomizer component 332, the smooth flow guiding effect of the rhomboid dust collection chamber 331 is used to improve dust collection efficiency. At the same time, with the dual function of the atomizer component 332, on the one hand, the dust sucked in by the adsorption isolation tube 336 is atomized and intercepted, reducing the load on the external centralized vacuum cleaner, reducing its later maintenance costs, and extending the service life of the equipment. On the other hand, the atomized condensation of water droplets achieves drip cooling of the substrate during polishing, effectively preventing irreversible deformation of the substrate due to polishing heat, and further improving the surface smoothness and product qualification rate of the substrate after polishing.

[0082] This invention discloses an aluminum-based copper-clad laminate substrate surface polishing device and its usage method. Through the linkage structure of an L-shaped external exhaust pipe, a rotating blade 36, a rotating connecting frame 37, and a collection drum 38, the device utilizes the suction power of an external vacuum cleaner to achieve adaptive rotation of the rotating blade 36 and the collection drum 38. This allows for automatic cleaning and agglomerated collection of dust inside the upper cover 31 without additional power, reducing manual cleaning workload and improving the automation level and ease of use of the device. At the same time, it achieves efficient separation and emission of dust and gas, taking into account both environmental protection and practicality. This invention solves the technical pain points of traditional polishing equipment, such as poor dust removal effect, easy deformation of the substrate, and cumbersome cleaning, thus improving the overall performance of the device.

[0083] The embodiments of the present invention are given for illustrative and descriptive purposes only, and are not intended to be exhaustive or to limit the invention to the forms disclosed. Many modifications and variations will be apparent to those skilled in the art. The embodiments were chosen and described in order to better illustrate the principles and practical application of the invention, and to enable those skilled in the art to understand the invention and to design various embodiments with various modifications suitable for a particular purpose.

Claims

1. A polishing apparatus for the surface of an aluminum-based copper-clad laminate substrate, comprising a polishing device (2), wherein a conveyor frame device (1) is installed on both sides of the polishing device (2), characterized in that: A dust collection device (3) is fixedly connected above the polishing device (2); The polishing device (2) is equipped with a dust collection box (21) and a polishing assembly (22). The dust collection box (21) surrounds the polishing assembly (22) and is connected to the dust collection device (3). The polishing component (22) is used to polish and grind the copper plate substrate, and the dust collection device (3) removes dust by humidification and adsorption.

2. The aluminum-based copper-clad laminate substrate surface polishing device according to claim 1, characterized in that: The polishing device (2) includes a mounting base (23), a square bracket is provided above the mounting base (23), and a transmission table assembly (24) is fixedly mounted on the square bracket; the transmission table assembly (24) includes two side mounting plates (243), a first transmission shaft (242) and a second transmission shaft (245) are respectively mounted at both ends of the two side mounting plates (243), a drive motor (241) is fixed above the first transmission shaft (242), and a conveyor belt (244) is rotatably connected between the first transmission shaft (242) and the second transmission shaft (245).

3. The aluminum-based copper-clad laminate substrate surface polishing device according to claim 2, characterized in that: Two polishing components (22) are fixed on the outside of the side mounting plate (243); the polishing component (22) includes a fixed bracket (224) fixed to the side mounting plate, a lower moving wheel (225) is rotatably mounted on the fixed bracket (224), a telescopic adjustment component (223) is fixed at the upper end of the fixed bracket (224), an upper moving wheel (221) is rotatably mounted at the end of the telescopic adjustment component (223), and a polishing sand belt (222) is provided between the upper moving wheel (221) and the lower moving wheel (225); two sets of transmission motors (226) are fixed in the gap between the mounting base (23) and the transmission platform assembly (24), the transmission motors (226) correspond to the lower moving wheel (225) and are driven by a belt pulley.

4. The aluminum-based copper-clad laminate substrate surface polishing device according to claim 3, characterized in that: Two sets of polishing components (22) are wrapped with dust collection boxes (21). The dust collection box (21) is a U-shaped cover with a hollow structure at the top and on both sides. The bottom of the two sides is provided with an opening facing the polishing components (22). The dust collection box (21) is provided with a door-shaped closed cover on the outside. A dust collection device (3) is fixed on the top of the door-shaped closed cover.

5. The surface polishing device for aluminum-based copper-clad laminate substrates according to claim 4, characterized in that: The dust collection device (3) includes a central collection bucket assembly (35), with an upper cover (31) fixed at the upper end and a rhomboid dust collection assembly (33) fixed at the lower end. A water inlet connection pipe (34) is fixed on the outside of the rhomboid dust collection assembly (33), and an exhaust connection pipe (32) is fixed at the upper end of the upper cover (31). The exhaust connection pipe (32) includes a second exhaust pipe (322) with a closed upper opening and a first exhaust pipe (321) with a connected upper opening. The rhomboid dust collection assembly (33) includes a rhomboid dust collection chamber (331), with an atomizer assembly (332) installed at the central annular position fixed inside. An isolation baffle (334) is fixed on the outer edge of the atomizer assembly (332), and the isolation baffle (334) divides the rhomboid dust collection chamber (331) into an upper cavity (333) and a humidification cavity (335). An adsorption isolation pipe (336) is fixed at the lower end of the isolation baffle (334).

6. The aluminum-based copper-clad laminate substrate surface polishing device according to claim 5, characterized in that: The middle collection bucket assembly (35) includes an outer collection bucket (351), and an annular sealing plate is provided at the connection between the outer collection bucket (351) and the diamond-shaped dust collection assembly (33). An inner drain pipe (352) is fixed in the opening on the annular sealing plate. An inner isolation plate (353) is provided between the inner drain pipe (352) and the outer collection bucket (351), and a drain pipe channel (354) communicating with the upper cavity (333) is provided inside the inner drain pipe (352).

7. The aluminum-based copper-clad laminate substrate surface polishing device according to claim 6, characterized in that: An isolation base plate (39) is fixed inside the upper cover (31). The middle part of the isolation base plate (39) is provided with a through hole that matches the diameter of the middle collection bucket assembly (35). An annular plate is fixed above the connection between the through hole and the middle collection bucket assembly (35). The edge of the annular plate is sealed to the inner isolation plate (353). The inner drain pipe (352) passes through the annular plate, and six sets of L-shaped outer drain pipes located above the annular plate are provided on its outer side.

8. The aluminum-based copper-clad laminate substrate surface polishing device according to claim 7, characterized in that: A rotating connecting frame (37) is rotatably installed on the outside of the inner drain pipe (352). Several collection rollers (38) are arranged on the outside of the rotating connecting frame (37), and a rotating blade (36) is fixed above them. One end of the L-shaped outer drain pipe is connected to the inner drain pipe (352), and the other end faces the rotating blade (36). A sealing plate is provided below the rotating blade (36) and fixed to the inner wall of the rotating connecting frame (37).

9. The aluminum-based copper-clad laminate substrate surface polishing device according to claim 8, characterized in that: The collecting drum (38) includes a fixed plate (382), and a middle drum (385) is rotatably installed in the through hole on the fixed plate (382); an inner partition plate (383) is fixed inside the middle drum (385), and multiple sets of rectangular openings are provided on its surface. An inner partition plate (383) is installed on the outside of each rectangular opening, and an outer drum (381) is fixed on the outside of the inner partition plate (383); an opening is provided at one end of the middle drum (385) facing the fixed plate (382), and an end connector (386) communicating with the outer drum (351) and the inner partition plate (353) is installed in the opening. A rubber column (384) is installed inside the middle drum (385).

10. A method of using the aluminum-based copper-clad laminate substrate surface polishing apparatus according to any one of claims 1-9, characterized in that, Includes the following steps: S1: Seal the connection between the exhaust pipe (32) and the suction fan pipe. After powering on, adjust the distance between the upper and lower moving wheels through the telescopic adjustment component (223) and install the polishing sand belt (222). S2: Start the drive motor (226) and drive motor (241) to drive the polishing sand belt (222) and conveyor belt (244) to run respectively; S3: The substrate is fed from the conveyor frame device (1) and conveyed to the polishing sand belt (222) via the conveyor belt (244) for polishing; S4: Activate the external centralized vacuum cleaner and atomizer assembly (332) to achieve dust interception and substrate drip cooling; S5: Adjust the suction power of the vacuum cleaner according to the amount of dust, drive the rotating blades (36), rotating connecting frame (37) and collection drum (38) to rotate, and complete the cleaning, clumping and separation of dust.

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