Thermal management system

Abstract

A thermal management system is provided which can efficiently cool a heat generating component by a heat medium when a second switching device is stuck. A thermal management system includes a thermal management circuit, a PCU which exchanges heat with a heat medium of a unit flow path, an LT radiator which is arranged in a radiator flow path, a cooler which is arranged in a cooler flow path, two six-way valves which can switch a flow path of the heat medium in the thermal management circuit, and an ECU which controls each of the two six-way valves. In a case where one of the two six-way valves is stuck, the ECU controls the other of the two six-way valves so that a flow rate of the heat medium flowing in the unit flow path becomes maximum.

Description

Technical Field

[0001] This invention relates to a thermal management system. Background Technology

[0002] Japanese Patent Application Publication No. 2024-127729 (Patent Document 1) discloses a thermal management system (thermal management circuit) equipped with two five-way valves. The thermal management circuit includes a unit circuit. Heat-generating components such as the PCU are cooled by a heat transfer medium flowing through the unit circuit.

[0003] Patent Document 1: Japanese Patent Application Publication No. 2024-127729 Summary of the Invention

[0004] In the thermal management system described in Patent Document 1 above, sometimes one of the two five-way valves (the first switching device and the second switching device) (the second switching device) becomes stuck. In this case, it is believed that the cooling efficiency of heat-generating components such as the PCU, which are based on the heat medium, will decrease depending on the state (switching state) of the stuck five-way valve. In contrast, although it is possible to reduce the heat generation of the heat-generating components by reducing their output, there is a possibility that the output (driving force) of the device equipped with the thermal management circuit will decrease due to the reduced output of the heat-generating components.

[0005] The present invention was made to solve the above-mentioned problems, and its purpose is to provide a thermal management system that can efficiently cool the heat-generating components through a heat medium when the second switching device is stuck.

[0006] A thermal management system according to one aspect of the present invention includes: a thermal management circuit including a first flow path and a second flow path through which a heat medium can flow; a heating element for heat exchange with the heat medium in the first flow path; a cooling element disposed in the second flow path; a first switching device and a second switching device capable of switching the flow path of the heat medium in the thermal management circuit; and a control device for controlling each of the first switching device and the second switching device. When the second switching device is stuck, the first switching device can switch the state of the flow path to the first state and the second state. The flow rate of the heat medium flowing through the first flow path is greater in the second state than in the first state. When the second switching device is stuck, the control device sets the state of the flow path to the second state.

[0007] In a thermal management system according to one aspect of the present invention, as described above, when the second switching device is stuck, the flow path is set to a second state. Therefore, compared to the case where the flow path is in a first state, the flow rate of the heat medium flowing through the first flow path can be increased, while simultaneously improving the cooling efficiency of the heat-generating component based on the heat medium. Thus, when the second switching device is stuck, the heat-generating component can be cooled efficiently by the heat medium.

[0008] In the thermal management system described above, it is preferable that after the control device sets the flow path to the second state, a connection circuit connecting the first flow path and the second flow path is formed. With this structure, even if the heat medium flowing through the first flow path heats up after the flow path is set to the second state, the heat medium flowing through the first flow path can be cooled by the cooling component through the connection circuit.

[0009] In this case, preferably, after the control device sets the flow path to the second state, the connection circuit is formed when the temperature of the heat medium flowing through the first flow path is higher than a predetermined threshold. With this structure, when the temperature of the heat medium flowing through the first flow path exceeds the predetermined threshold, the temperature of the heat medium flowing through the first flow path can be easily reduced to below the predetermined threshold.

[0010] In a thermal management system where the temperature of the heat medium exceeds a predetermined threshold, it is preferable that the inter-flow rate index, representing the flow rate of the heat medium flowing from the first flow path to the second flow path, is greater in the state where the connection circuit is formed than in the second state. After the control device sets the flow path to the second state, the connection circuit is formed when the temperature of the heat medium flowing through the first flow path exceeds the predetermined threshold. With this structure, by forming the connection circuit, the flow rate of the heat medium flowing from the first flow path to the second flow path can be greater than in the second state, thus enabling more efficient cooling of the heat medium flowing through the first flow path by the cooling components.

[0011] In the thermal management system described above, it is preferable that the cooling components include a radiator and a cooler. The second flow path includes a radiator configuration flow path with a radiator and a cooler configuration flow path with a cooler. The flow rate index value between the flow paths is the sum of the flow rate of the heat medium flowing from the first flow path to the radiator configuration flow path and the flow rate of the heat medium flowing from the first flow path to the cooler configuration flow path. With this structure, compared to the case where the connection circuit is formed based solely on either the flow rate of the heat medium flowing from the first flow path to the radiator configuration flow path or the flow rate of the heat medium flowing from the first flow path to the cooler configuration flow path, it is easier to form a connection circuit with higher cooling efficiency based on the heat medium of the cooling components.

[0012] Invention Effects

[0013] According to the present invention, when the second switching device is stuck, the heat-generating component can be cooled efficiently by a heat medium. Attached Figure Description

[0014] Figure 1 This is a diagram showing the structure of the thermal management system based on this embodiment.

[0015] Figure 2 This is a perspective view showing the structure of the six-way valve of the thermal management system based on this embodiment.

[0016] Figure 3 This is a diagram showing the mapping table stored in the memory of the ECU of the thermal management system based on this embodiment.

[0017] Figure 4 This is a diagram showing an example of a connectivity pattern of a thermal management circuit based on this embodiment.

[0018] Figure 5 This is a diagram illustrating the control flow of the ECU based on the thermal management circuit of this embodiment.

[0019] Figure 6 This is a diagram showing the control flow of the ECU of the thermal management circuit based on a modified example of this embodiment. Detailed Implementation

[0020] The thermal management system according to the present invention will now be described. The thermal management system is, for example, installed in an electric vehicle (not shown). The electric vehicle equipped with the thermal management system is preferably a vehicle equipped with a driving battery, such as a battery electric vehicle (BEV), a hybrid electric vehicle (HEV), a plug-in hybrid electric vehicle (PHEV), and a fuel cell electric vehicle (FCEV). However, the application of the thermal management system according to the present invention is not limited to vehicles.

[0021] Figure 1 This diagram illustrates an example of the overall structure of the thermal management system 1 according to an embodiment of the present invention. The thermal management system 1 includes a thermal management circuit 100, an electronic control unit (ECU) 500, and a human machine interface (HMI) 600. Furthermore, the ECU 500 is an example of the "control device" of the present invention.

[0022] The thermal management circuit 100 is configured to allow the flow of a heat transfer medium. The thermal management circuit 100 includes, for example, a high-temperature circuit 110, a heat sink 120, a unit flow path 130, a capacitor 140, a refrigeration cycle 150, a cooler 160, a battery flow path 170, a six-way valve 180, and a six-way valve 190. The six-way valve 180 and six-way valve 190 are examples of the "first switching device" and "second switching device" of the present invention, respectively. Furthermore, the unit flow path 130 is an example of the "first flow path" of the present invention.

[0023] The high-temperature circuit 110 includes, for example, a water pump (W / P) 111, an electric heater 112, a three-way valve 113, a heater core 114, and a liquid storage tank (R / T) 115.

[0024] Radiator 120 includes a high-temperature (HT) radiator 121 and a low-temperature (LT) radiator 122. In the low-temperature radiator 122, the heat medium exchanges heat with the outside air. The LT radiator 122 is disposed in radiator flow path 122a. The LT radiator 122 exchanges heat with the heat medium flowing through the radiator flow path 122a. The radiator flow path 122a is a flow path connecting port P2 (described later) and port P3 (described later) of the six-way valve 180. Furthermore, the LT radiator 122 is an example of the "cooling component" and "radiator" of the present invention. The radiator flow path 122a is an example of the "second flow path" and "radiator configuration flow path" of the present invention.

[0025] The unit flow path 130 includes, for example, a water pump 131, a smart power unit (SPU) 132, a power control unit (PCU) 133, an oil cooler (O / C) 134, a step-up / step-down converter 135, a liquid storage tank 136, and a temperature sensor 137. Furthermore, the unit flow path 130 and PCU 133 are examples of the "first flow path" and "heat-generating component" of the present invention, respectively.

[0026] exist Figure 1 In the example shown, temperature sensor 137 measures the temperature of the heat medium flowing between boost / buck converter 135 and six-way valve 190. Furthermore, the location of temperature sensor 137 is not limited to the aforementioned location, as long as it is within the unit flow path 130.

[0027] Capacitor 140 is connected to both high-temperature circuit 110 and refrigeration cycle 150. Refrigeration cycle 150 includes, for example, compressor 151, expansion valve 152, evaporator 153, evaporative pressure regulator (EPR) 154, and expansion valve 155.

[0028] Cooler 160 is disposed in cooler flow path 161a. Specifically, cooler 160 is connected to both refrigeration cycle 150 and cooler flow path 161a. In cooler 160, the hot medium flowing in cooler flow path 161a exchanges heat with the medium circulating in refrigeration cycle 150. Cooler flow path 161a is a flow path connecting port P1 of six-way valve 180 (described later) and port P13 of six-way valve 190 (described later). A water pump (W / P) 161 is provided in cooler flow path 161a. Cooler 160 is an example of a "cooling component" of the present invention. Cooler flow path 161a is an example of a "second flow path" and a "cooler configuration flow path" of the present invention.

[0029] Battery flow path 170 includes, for example, an electric heater 171 and a battery 172. The electric heater 171 heats the heat medium of battery flow path 170.

[0030] ECU500 controls thermal management circuit 100. ECU500 includes processor 501, memory 502, storage device 503, and interface 504.

[0031] The ECU 500 generates control commands based on sensor values ​​obtained from various sensors included in the thermal management circuit 100 (e.g., temperature sensor 137), user operations received from the HMI 600, etc., and outputs the generated control commands to the thermal management circuit 100. Thus, the ECU 500, for example, switches the state of each of the three-way valve 113, the six-way valve 180, and the six-way valve 190.

[0032] The HMI600 is a display, operation panel, and control console with a touch panel. The HMI600 receives user input for controlling the thermal management system 1. The HMI600 outputs signals representing user input to the ECU500.

[0033] The six-way valve 180 has six ports P1 to P6. Port P1 is the inlet port for the hot medium to flow into the cooler 160 (cooler flow path 161a). Port P2 is the outlet port for the hot medium to flow out towards the low-temperature radiator 122 (radiator flow path 122a). Port P3 is the inlet port for the hot medium to flow into the low-temperature radiator 122 (radiator flow path 122a). Port P4 is the outlet port for the hot medium to flow out towards PCU133, etc. (unit flow path 130). Port P5 is the inlet port for the hot medium to flow into the six-way valve 190 through flow path 6. Port P6 is the outlet port for the hot medium to flow out towards the six-way valve 190 through flow path 5. Flow paths 5 and 6 are connected to the six-way valve 180 and the six-way valve 190, respectively.

[0034] The six-way valve 190 has six ports P11 to P16. Port P11 is the inlet port for the hot medium to flow in from PCU133, etc. (unit flow path 130). Port P12 is the outlet port for the hot medium to flow out towards the battery flow path 170. Port P13 is the inlet port for the hot medium to flow in from the battery flow path 170. Port P14 is the outlet port for the hot medium to flow out towards the cooler 160 (cooler flow path 161a). Port P15 is the inlet port for the hot medium to flow in from the six-way valve 180 through flow path 5. Port P16 is the outlet port for the hot medium to flow out towards the six-way valve 180 through flow path 6.

[0035] ECU 500 controls the state of each of the six-way valves 180 and 190. This switches the flow path of the heat medium in each of the six-way valves 180 and 190. Consequently, it switches the flow path of the heat medium in the thermal management circuit 100. Furthermore, the six-way valves 180 and 190 have identical structures.

[0036] Figure 2 This is an exploded perspective view showing the structure of each of the six-way valves 180 and 190. The six-way valve 180 includes a circular upper body 181, a circular drive plate 182, and a circular lower body 183. The upper body 181, drive plate 182, and lower body 183 are stacked sequentially from the Z1 side. Furthermore, the Z direction is the direction extending from the rotation center line α.

[0037] The lower body 183 is fixed and does not rotate. The upper body 181 and the drive plate 182 rotate integrally around the rotation center line α on the Z1 side of the lower body 183. As a result, the relative position (rotation angle in the circumferential direction) of the lower body 183 with each of the upper body 181 and the drive plate 182 changes. Alternatively, the upper body 181 and the drive plate 182 can be fixed, allowing the lower body 183 to rotate.

[0038] The upper body 181 has an annular shape. Grooves 181a to 181e are provided on the upper body 181. Grooves 181a to 181e are each formed into a fan shape extending circumferentially around the rotation center line α. Grooves 181a to 181e open on the lower body 183 side (Z2 side).

[0039] The grooves 181a to 181c are arranged side by side in the circumferential direction in the outer peripheral region of the upper body 181. The grooves 181d and 181e are respectively arranged in the inner peripheral region of the upper body 181, which is closer to the inner peripheral region than the grooves 181a to 181c.

[0040] Through holes 182a to 182j are provided on the drive plate 182. The through holes 182a to 182j are each formed to penetrate the drive plate 182 along the Z direction. The through holes 182a to 182j are each formed as a fan shape extending circumferentially around the rotation center line α. The through holes 182a to 182j are staggered in the circumferential direction so that they do not overlap radially.

[0041] Through holes 182a to 182f are arranged in a circumferential parallel configuration in the outer peripheral region of the drive plate 182. Through holes 182a and 182b are respectively located at positions overlapping with groove 181a in the Z direction. Through holes 182c and 182d are respectively located at positions overlapping with groove 181b in the Z direction. Through holes 182e and 182f are respectively located at positions overlapping with groove 181c in the Z direction.

[0042] Through holes 182g to 182j are arranged side-by-side in the circumferential direction in the region of the drive plate 182 that is further inward than through holes 182a to 182f. Through holes 182g and 182j are respectively located at positions that overlap with groove 181d in the Z direction. Through holes 182h and 182i are respectively located at positions that overlap with groove 181e in the Z direction.

[0043] The lower body 183 includes an outer peripheral wall 184, an inner peripheral wall 185, and six partition walls 186. The outer peripheral wall 184 is arranged to extend in a ring shape with the rotation center line α as the center. The inner peripheral wall 185 extends in a ring shape with the rotation center line α as the center and is formed on the side closer to the rotation center line α than the outer peripheral wall 184.

[0044] Six partition walls 186 are formed to connect the inner peripheral wall 185 and the outer peripheral wall 184. The six partition walls 186 are arranged side by side at equal intervals in the circumferential direction with the rotation center line α as the center.

[0045] The lower main body 183 is provided with six fan-shaped grooves 187 formed by six partition walls 186 between the outer peripheral wall 184 and the inner peripheral wall 185.

[0046] Each of the six grooves 187 has an opening 187a on the upper main body 181 side (Z1 side) and an opening 187b formed on the outer peripheral wall 184. The openings 187b of the six grooves 187 correspond to ports P1 to P6 respectively (and are connected to ports P1 to P6).

[0047] The six-way valve 190 has the same structure as the six-way valve 180. The six-way valve 190 includes an upper body 191 with the same structure as the upper body 181, a drive plate 192 with the same structure as the drive plate 182, and a lower body 193 with the same structure as the lower body 183. The upper body 191 and the drive plate 192 rotate about the rotation center line β.

[0048] The upper main body 191 has grooves 191a to 191e corresponding to the grooves 181a to 181e of the upper main body 181. The drive plate 192 has through holes 192a to 192j corresponding to the through holes 182a to 182j of the drive plate 182. The lower main body 193 has an outer peripheral wall 194, an inner peripheral wall 195, a partition wall 186, and a groove 197 corresponding to the outer peripheral wall 184, inner peripheral wall 185, partition wall 186, and groove 187 of the lower main body 183, respectively.

[0049] Each of the six grooves 197 has an opening 197a on the upper main body 191 side (Z1 side) and an opening 197b formed on the outer peripheral wall 194. The openings 197b of the six grooves 197 correspond to ports P11 to P16 respectively (and are connected to ports P11 to P16).

[0050] ECU500 (Processor 501) Figure 1 The ECU 500 (processor 501) can change the rotational position of the upper body 181 (drive plate 182) by 30 degrees each time around the rotation center line α. Furthermore, the ECU 500 (processor 501) can change the rotational position of the upper body 191 (drive plate 192) by 30 degrees each time around the rotation center line β. Hereinafter, the rotation angle of the upper body 181 (drive plate 182) relative to the reference rotational position is defined as angle θ1, and the rotation angle of the upper body 191 (drive plate 192) relative to the reference rotational position is defined as angle θ2.

[0051] In the memory 502 of ECU500 ( Figure 1 The system pre-stores information corresponding to 144 patterns, each with 12 combinations of angles θ1 (0, 30, 60, ..., 330) and angle θ2 (0, 30, 60, ..., 330). This information stores the flow rates of the heat medium flowing through unit flow path 130 (hereinafter referred to as unit flow rate), the heat medium flowing through radiator flow path 122a (hereinafter referred to as radiator flow rate), the heat medium flowing through cooler flow path 161a (hereinafter referred to as cooler flow rate), and the connection status between each flow path. Furthermore, the flow rate information is a value pre-measured (calculated) through experiments or simulations. Additionally, the flow rate information can be the values ​​when pumps 131 and 161 are respectively driven.

[0052] Figure 3 An example of a mapping table representing the aforementioned information stored in memory 502 is shown. Additionally, in... Figure 3 For simplicity, only the unit flow rate corresponding to the cases where angle θ2 is 120° and angle θ1 is 0°–330° is illustrated. Figure 3 The value to the right of U is in the middle), and the heatsink flow rate (in Figure 3 The value to the right of R is in the middle, and the cooler flow rate is in the middle. Figure 3 (The value to the right of C is in the middle). Additionally... Figure 3 The values ​​shown are randomly assigned for ease of explanation and may differ from the actual values.

[0053] The processor 501 is configured to determine whether each of the six-way valves 180 and 190 is stuck. Stuck refers to a state where the aforementioned angles θ1 and θ2 cannot be changed. Furthermore, any method can be used to determine whether stuck is in operation. For example, it can be determined based on the change in the flow rate of the heat medium when switching between the six-way valves 180 and 190, or by the detection value of a position sensor installed on the upper main body 181 (191).

[0054] Figure 4 Indicates thermal management circuit 100 ( Figure 1 This is an example of a portion of a plurality of acceptable connected patterns. The thermal management circuit 100 can form connection circuits 100a to 100c. In connection circuit 100a, unit flow path 130 is connected to radiator flow path 122a and cooler flow path 161a. In connection circuit 100b, unit flow path 130 is connected to radiator flow path 122a but not to cooler flow path 161a. In connection circuit 100c, unit flow path 130 is connected to cooler flow path 161a but not to radiator flow path 122a. Furthermore, in... Figure 4 In the lower right state, unit flow path 130 is not connected to either radiator flow path 122a or cooler flow path 161a.

[0055] In conventional thermal management systems, sometimes one of the two switching devices becomes stuck. In this case, it is assumed that the cooling efficiency of heat-generating components such as the PCU, which rely on the heat transfer medium, will decrease depending on the state (switching state) of the stuck switching device. While it is possible to reduce the heat generation of the heat-generating components by decreasing their output, there is a possibility that the output (driving force) of the equipment equipped with the thermal management circuitry will decrease due to the reduced output of the heat-generating components.

[0056] In this embodiment, it is assumed that the six-way valve 190 is stuck and the six-way valve 180 is not stuck. In this embodiment, when the six-way valve 190 is stuck, the six-way valve 180 causes the flow path of the thermal management circuit 100 to change to a state where the unit flow rate is greater than the current value. In this case, the current state of the flow path of the thermal management circuit 100 is an example of the "first state" of the present invention. Furthermore, the state of the flow path of the thermal management circuit 100, which changes due to the six-way valve 180, is an example of the "second state" of the present invention.

[0057] For example, suppose the current angle θ1 is 90° and the angle θ2 is 120°. In this state, with the six-way valve 190 stuck, the ECU 500 controls the six-way valve 180 to make the unit flow rate more than the current value (in the case of...). Figure 3 The value is increased to 9.4). Specifically, the ECU500 controls the six-way valve 180 to maximize the unit flow rate when the angle θ2 is 120. That is, in Figure 3 In the example shown, ECU500 maximizes the unit flow rate by changing the angle θ1 to 240° (12.2).

[0058] (Flowchart of a thermal management system)

[0059] The following is for reference. Figure 5 An example of the control flow of ECU500 (processor 501) based on thermal management system 1 will be explained. Figure 5 The control flow shown can be executed, for example, according to each prescribed control cycle, or when prescribed conditions are met (e.g., the start of vehicle operation, the start of charging / discharging, and IG-ON). The following explanation assumes that the six-way valve 190 is stuck when angle θ2 is 120 degrees. The same applies when the six-way valve 180 is stuck.

[0060] In step S1, ECU500 determines whether one of the six-way valves 180 and 190 is stuck. If one of the six-way valves 180 and 190 is stuck ("Yes" in S1), the process proceeds to step S2. If neither the six-way valves 180 nor 190 is stuck (or both are stuck) ("No" in S1), the process ends.

[0061] In step S2, ECU 500 adjusts the angle θ1 of the six-way valve 180 to maximize the unit flow rate. Specifically, ECU 500 selects the angle θ1 that corresponds to the maximum unit flow rate among the combinations of the angle θ2 of the stuck six-way valve 190 and various angles θ1, and controls the six-way valve 180 so that its rotation angle is the selected angle θ1. For example, if angle θ2 is 120°, ECU 500 sets angle θ1 to 240°. Alternatively, if the unit flow rate is already maximum at the time of step S1, ECU 500 maintains the current angle θ1.

[0062] In step S3, the ECU 500 determines whether the detection value of the temperature sensor 137 (the temperature of the heat medium in the unit flow path 130) is higher than the threshold T1. If the detection value of the temperature sensor 137 is higher than the threshold T1 ("Yes" in S3), the process proceeds to step S4. If the detection value of the temperature sensor 137 is lower than the threshold T1 ("No" in S3), the process of step S3 is repeated. Furthermore, the threshold T1 is set to a temperature capable of cooling the PCU 133 and other components heated by the heat medium flowing through the unit flow path 130, for example, it can be 30 degrees Celsius. Moreover, the threshold T1 is an example of the "prescribed threshold" of this invention.

[0063] In step S4, ECU500 adjusts the angle θ1 of the six-way valve 180 to connect unit flow path 130 to at least one of radiator flow path 122a and cooler flow path 161a, and the sum of the flow rates of the flow paths connected to unit flow path 130 in radiator flow path 122a and cooler flow path 161a increases. Furthermore, the above sum is an example of the "inter-flow path flow rate index value" and "total value" of the present invention.

[0064] The above summation applies when both the unit flow path 130 and the radiator flow path 122a and the cooler flow path 161a are connected (for example, when a system is formed with...). Figure 4 In the case of connection circuit 100a, it becomes Figure 3 The sum of the radiator flow rate (R) and the cooler flow rate (L). This sum is calculated when the unit flow path 130 is connected only to the radiator flow path 122a in both the radiator flow path 122a and the cooler flow path 161a (for example, in the case where a...). Figure 4 In the case of connection circuit 100b, it becomes Figure 3 The value of the radiator flow rate. The above sum is in the case where the unit flow path 130 is only connected to the radiator flow path 122a and the cooler flow path 161a (for example, in the case where a heat sink flow path 122a and a cooler flow path 161a are formed). Figure 4 In the case of connection circuit 100c, it becomes Figure 3The value of the cooler flow rate. The above sum is in the case where the unit flow path 130 is not connected to either the radiator flow path 122a or the cooler flow path 161a (for example, in the case where a cooler flow path 161a is formed). Figure 4 In the case of the lower right circuit, it becomes 0.

[0065] Specifically, in step S4, ECU 500 adjusts the angle θ1 of the six-way valve 180 to maximize the sum mentioned above. That is, ECU 500 selects the angle θ1 that is the largest among the sums of the angles θ2 of the stuck six-way valve 190 and the combinations of various angles θ1, and controls the six-way valve 180 so that the rotation angle of the six-way valve 180 becomes the selected angle θ1.

[0066] Furthermore, when the unit flow path 130 is connected to the radiator flow path 122a, the flow rate of the heat medium flowing in the radiator flow path 122a is an example of the "flow rate of the heat medium flowing from the first flow path to the radiator configuration flow path" of the present invention. Also, when the unit flow path 130 is connected to the cooler flow path 161a, the flow rate of the heat medium flowing in the cooler flow path 161a is an example of the "flow rate of the heat medium flowing from the first flow path to the cooler configuration flow path" of the present invention.

[0067] In step S5, it is determined whether the detected value of the temperature sensor 137 is less than the threshold T2. The threshold T2 is less than the threshold T1. For example, the threshold T2 can be 10°C less than the threshold T1. If the detected value of the temperature sensor 137 is less than the threshold T2 (yes in S5), the process returns to step S1. If the detected value of the temperature sensor 137 is greater than or equal to the threshold T2 (no in S5), the process of step S5 is repeated. Alternatively, step S5 may not be performed.

[0068] As described above, in this embodiment, if one of the six-way valves 180 and 190 is stuck, the ECU 500 controls the other of the six-way valves 180 and 190 to maximize the flow rate of the heat medium flowing through the unit flow path 130. This improves the cooling efficiency based on the heat medium flowing through the unit flow path 130, thus suppressing insufficient cooling of the PCU 133 based on the heat medium. Consequently, even if the output of the PCU 133 is not reduced when one of the six-way valves 180 and 190 is stuck, the PCU 133 can be cooled efficiently.

[0069] <Variation Example>

[0070] In the above embodiment, an example is shown of controlling one of the six-way valves 180 and 190 based on the detection value of the temperature sensor 137, but the invention is not limited thereto. The detection value of the temperature sensor 137 may also be disregarded.

[0071] For example, such as Figure 6 As shown, if "Yes" is selected in step S1, the process in step S12 is executed. In step S12, the ECU 500 adjusts the rotation angle of the unstuck one of the six-way valves 180 and 190 so that the unit flow path 130 is connected to at least one of the radiator flow path 122a and the cooler flow path 161a, and the unit flow rate increases simultaneously with the increase of the sum of the flow rates of the flow paths connected to the unit flow path 130 in the radiator flow path 122a and the cooler flow path 161a. Then, the process ends.

[0072] Furthermore, when multiple rotation angles corresponding to the conditions in step S12 exist, for example, the rotation angle of the unit flow rate with the largest total value and the aforementioned sum can be selected. Also, when calculating the aforementioned total value, the weighting between the unit flow rate and the aforementioned sum can be set to be distinct. Furthermore, the rotation angle where the unit flow rate is the largest can be selected as the rotation angle among the rotation angles added to the aforementioned sum, or the rotation angle where the aforementioned sum is the largest can be selected as the rotation angle among the rotation angles added to the unit flow rate.

[0073] In the above embodiments, Figure 5 In step S4, an example of selecting the angle θ1 with the largest sum is shown, but the present invention is not limited thereto. For example, the angle θ1 with the largest sum among the angles θ1 in which the unit flow rate increases compared to the point in step S1 can be selected.

[0074] In the above embodiment, step S2 shows an example of maximizing the unit flow rate, but the invention is not limited thereto. The unit flow rate does not need to be set to maximum as long as it is greater than the value at step S1. In this case, in step S4, the angle θ1 that represents the largest sum of the angles θ1 from which the unit flow rate increases compared to the value at step S2 can be selected.

[0075] In the above embodiments, an example of multiple six-way valves of the rotary type is shown, but the present invention is not limited thereto. For example, multiple stem valves may be used instead of six-way valves. Furthermore, multi-way valves (e.g., 5-way valves and 8-way valves) different from six-way valves may also be used.

[0076] In the above embodiment, an example is shown where the sum is the total flow rate of the flow paths connected to unit flow path 130 in radiator flow path 122a and cooler flow path 161a, but the present invention is not limited thereto. The weighting between the flow rate flowing into radiator flow path 122a and the flow rate flowing into cooler flow path 161a can be different. For example, an unblocked six-way valve can also be controlled based on the sum of the value obtained by multiplying 0.8 by the flow rate flowing into radiator flow path 122a and the value obtained by multiplying 0.2 by the flow rate flowing into cooler flow path 161a.

[0077] Specifically, refer to Figure 3 When angle θ1 is 90° and angle θ2 is 120°, if radiator flow path 122a and cooler flow path 161a are connected to unit flow path 130, the sum of the above is 8.8 × 0.8 and 8.6 × 0.2, which is 8.76. Furthermore, when angle θ1 is 180° and angle θ2 is 120°, if only radiator flow path 122a is connected to unit flow path 130, the sum of the above is 9.2 × 0.8 and 0 × 0.2, which is 7.36. Furthermore, when angle θ1 is 300° and angle θ2 is 120°, if only cooler flow path 161a is connected to unit flow path 130, the sum of the above is 0 × 0.8 and 7.6 × 0.2, which is 1.52.

[0078] In the above embodiment, an example is shown where step S4 is performed after step S2 if the detected value of temperature sensor 137 exceeds threshold T1, but the present invention is not limited thereto. For example, step S4 may also be performed after a predetermined time (e.g., 30 minutes) has elapsed since the time of performing step S2.

[0079] In the above embodiments, an example is shown where the flow path of the heat medium is switched based on the total flow rate of the heat medium flowing through the radiator flow path 122a and the flow rate of the heat medium flowing through the cooler flow path 161a; however, the present invention is not limited thereto. The flow path of the heat medium may also be switched based on either the flow rate of the heat medium flowing through the radiator flow path 122a or the flow rate of the heat medium flowing through the cooler flow path 161a. For example, the flow path of the heat medium may be switched based on a predetermined value of either the flow rate of the heat medium flowing through the radiator flow path 122a or the flow rate of the heat medium flowing through the cooler flow path 161a. Furthermore, for example, when the outdoor temperature is higher than a predetermined value (e.g., 30°C) or the temperature sensor 137 detects a value higher than the specified value, the flow path of the heat medium may be switched based on the flow rate of the heat medium flowing through the cooler flow path 161a. Furthermore, for example, when the compressor 151 stops (e.g., when there is no heating requirement), the flow path of the heat medium may be switched based on the flow rate of the heat medium flowing through the radiator flow path 122a.

[0080] In the above embodiments, an example is shown in which a high-temperature circuit 110 is provided in the thermal management circuit, but the present invention is not limited thereto. The high-temperature circuit 110 may not be provided in the thermal management circuit.

[0081] In the above embodiment, an example is shown where the number of switching valves determined to be stuck is two, but the present invention is not limited thereto. The number of switching valves determined to be stuck can be three or more.

[0082] In the above embodiment, an example is shown in which, in the case of a stuck six-way valve in the ECU 500, the flow rate of the hot medium flowing in the unit flow path 130 is greater than currently, but the present invention is not limited thereto. For example, in the case of a stuck six-way valve in the ECU, the flow rate of the hot medium flowing in the unit circuit can be greater than the flow rate of the hot medium flowing in the unit flow path under a predetermined state. In this case, the predetermined state is an example of the "first state" of the present invention.

[0083] Similarly, when the detection value of temperature sensor 137 is below the threshold T1 ("yes" in S3), the sum of the above can be greater than the sum of the above under the specified conditions of the flow path of the heat medium.

[0084] The embodiments disclosed herein are considered illustrative in all respects and not restrictive. The scope of the invention is defined not by the description of the above embodiments but by the claims, and is intended to include all modifications within the meaning and scope equivalent to the claims.

[0085] Symbol Explanation

[0086] 1- Thermal management system; 100- Thermal management circuit; 100a, 100b, 100c- Connection circuit; 122- LT radiator (cooling component); 122a- Radiator flow path (second flow path); 130- Unit circuit (first flow path); 133- PCU (heat-generating component); 160- Cooler (cooling component); 161a- Cooler flow path (second flow path); 180- Six-way valve (first switching device); 190- Six-way valve (second switching device); 500- ECU (control device); T1- Threshold (specified threshold).

Claims

1. A thermal management system, characterized in that, have: A thermal management circuit, comprising a first flow path and a second flow path capable of carrying a heat medium; The heating element exchanges heat with the heat medium in the first flow path; A cooling component, which is disposed in the second flow path; The first switching device and the second switching device are capable of switching the flow path of the heat medium in the thermal management circuit; and A control device that controls each of the first switching device and the second switching device. When the second switching device is stuck, the first switching device can switch the state of the flow path to state 1 and state 2. The flow rate of the heat medium flowing through the first flow path is greater in the second state than in the first state. When the second switching device malfunctions, the control device sets the state of the flow path to the second state.

2. The thermal management system according to claim 1, characterized in that, After the state of the flow path is set to the second state, the control device forms a connection circuit connecting the first flow path and the second flow path.

3. The thermal management system according to claim 2, characterized in that, After the state of the flow path is set to the second state, the control device forms the connection circuit when the temperature of the heat medium flowing in the first flow path is higher than a predetermined threshold.

4. The thermal management system according to claim 3, characterized in that, The inter-flow-path flow rate index, which represents the flow rate of the heat medium flowing from the first flow path to the second flow path, is greater in the state where the connection circuit is formed than in the second state. After the state of the flow path is set to the second state, the control device forms the connection circuit when the temperature of the heat medium flowing in the first flow path is higher than the predetermined threshold.

5. The thermal management system according to claim 4, characterized in that, The cooling components include a radiator and a cooler. The second flow path includes: A heat sink is configured with a flow path, wherein the heat sink is configured; and The cooler is configured with a flow path, and the cooler is configured thereon. The flow rate index value between the flow paths is the sum of the flow rate of the heat medium flowing from the first flow path to the heat sink configuration flow path and the flow rate of the heat medium flowing from the first flow path to the cooler configuration flow path.

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