A drawing die grinding paste and a preparation process thereof

Abstract

This invention discloses a wire drawing die polishing paste and its preparation process. The polishing paste comprises the following components: 25-40% composite abrasive, 3-8% modified dispersant, 5-12% elastic binder, 2-6% lubricant, 1-4% polishing aid, and the balance being deionized water. The composite abrasive is composed of nano-diamond powder and boron carbide powder in a mass ratio of (1-3):1. This invention utilizes a composite abrasive of nano-diamond and boron carbide, which improves polishing efficiency and precision. The use of the modified dispersant significantly enhances the dispersion stability of the composite abrasive, reduces abrasive agglomeration, and ensures polishing uniformity. The use of the elastic binder reduces surface damage to the wire drawing die, extending its service life. The preparation process of this invention ensures full fusion of the components, thereby allowing precise control of the particle size distribution of the polishing paste, removing air bubbles and impurities, and significantly improving the stability and service life of the polishing paste.

Description

Technical Field

[0001] This invention belongs to the technical field of wire drawing die polishing paste, specifically relating to a wire drawing die polishing paste and its preparation process. Background Technology

[0002] Wire drawing dies are crucial molds in the metal wire drawing process, and the precision and smoothness of their inner surface directly determine the quality and performance of the wire. To ensure the machining accuracy of the wire drawing die, it is necessary to use polishing paste to finely grind the inner hole of the die. Polishing paste is a paste-like abrasive material composed of abrasives, dispersants, binders, lubricants, and other components. Its performance directly affects polishing efficiency, polishing accuracy, and the service life of the wire drawing die.

[0003] Existing wire drawing die grinding pastes have the following problems: First, they use a single abrasive, making it difficult to balance grinding efficiency and precision; second, the dispersant effect is poor, causing the abrasive to easily agglomerate and affecting grinding uniformity; third, they mostly use simple mixing methods, resulting in insufficient integration of components and uneven particle size distribution, further affecting the grinding effect. In addition, existing grinding pastes have poor storage stability, are prone to stratification and oxidation, and have a short service life; during the grinding process, due to poor lubrication and cooling, a large amount of heat is easily generated, causing changes in the properties of the wire drawing die material, while also resulting in high grinding resistance and low grinding efficiency.

[0004] Therefore, in order to address the above-mentioned technical problems, it is necessary to provide a wire drawing die grinding paste and its preparation process.

[0005] The information disclosed in this background section is intended only to enhance the understanding of the overall background of the invention and should not be construed as an admission or in any way implying that the information constitutes prior art known to those skilled in the art. Summary of the Invention

[0006] The purpose of this invention is to provide a wire drawing die polishing paste and its preparation process, which can solve the core problems of existing wire drawing die polishing pastes, such as difficulty in balancing polishing efficiency and precision, poor dispersion stability, crude preparation process, and short service life.

[0007] To achieve the above objectives, a specific embodiment of the present invention provides the following technical solution:

[0008] A wire drawing die polishing paste, by mass percentage, comprises the following components: 25-40% composite abrasive, 3-8% modified dispersant, 5-12% elastic binder, 2-6% lubricant, 1-4% grinding aid, and the balance being deionized water; wherein the composite abrasive is composed of nano-diamond powder and boron carbide powder in a mass ratio of (1-3):1, wherein the particle size of the nano-diamond powder is 50-200 nm, and the particle size of the boron carbide powder is 300-800 nm.

[0009] In one or more embodiments of the present invention, the modified dispersant is sodium lignosulfonate modified with silane coupling agent KH-570. The modification process is as follows: sodium lignosulfonate is dissolved in deionized water, silane coupling agent KH-570 is added, the mixture is stirred and reacted at 60-80°C for 2-4 hours, and then pulverized after vacuum drying.

[0010] In one or more embodiments of the present invention, the elastic adhesive is a polyurethane-modified acrylate emulsion, wherein the mass percentage of polyurethane is 20-35%.

[0011] In one or more embodiments of the present invention, the lubricant is a compound of polyethylene glycol and lanolin in a mass ratio of (2-5):1, and the molecular weight of polyethylene glycol is 400-1000.

[0012] In one or more embodiments of the present invention, the grinding aid is a compound of triethanolamine and boric acid in a mass ratio of 1:(0.5-2).

[0013] A process for preparing a wire drawing die polishing paste includes the following steps:

[0014] S1. Mix nano-diamond powder and boron carbide powder in a certain proportion, add 5-10% ethanol solution of the mixed abrasive, ultrasonically disperse for 30-60 min, and then dry at 80-100℃ to constant weight for later use.

[0015] S2. Add deionized water to the reactor, heat to 40-50℃, and add modified dispersant, lubricant and grinding aid in sequence. Stir at a stirring speed of 300-500r / min for 60-90min to obtain a homogeneous basic system.

[0016] S3. Slowly add the pretreated composite abrasive to the base system, control the stirring speed to 600-800 r / min, and stir for 30-45 min to obtain the initial mixed slurry.

[0017] S4. Add elastic binder to the initial mixed slurry, adjust the stirring speed to 400-600 r / min, continue stirring for 90-120 min, then mature at 30-40℃ for 2-4 h, and grind with a grinder until the particle size is less than 5 μm to obtain wire drawing die grinding paste.

[0018] In one or more embodiments of the present invention, in S1, the ultrasonic dispersion power is 150-250W and the ultrasonic frequency is 20-40kHz.

[0019] In one or more embodiments of the present invention, in S4, the grinding mill is a three-roll mill, the grinding pressure is 0.3-0.6 MPa, and the grinding times are 2-4 times.

[0020] In one or more embodiments of the present invention, in S4, the curing process employs vacuum curing with a vacuum degree of -0.06 to -0.09 MPa.

[0021] In one or more embodiments of the present invention, a post-processing step is further included, in which the ground wire drawing die grinding paste is filtered with a filtration accuracy of 1-3 μm, and then packaged under nitrogen protection.

[0022] Compared with existing technologies, the present invention provides a wire drawing die polishing paste and its preparation process, which uses a composite abrasive of nano-diamond and boron carbide to improve polishing efficiency and precision. The use of a modified dispersant significantly improves the dispersion stability of the composite abrasive, reduces abrasive agglomeration, and ensures polishing uniformity. The use of an elastic binder reduces surface damage to the wire drawing die and extends its service life. The preparation process of the present invention ensures full fusion of the components, thereby enabling precise control of the particle size distribution of the polishing paste, removal of air bubbles and impurities, and significantly improving the stability and service life of the polishing paste. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a flowchart illustrating the preparation process of a wire drawing die polishing paste according to one embodiment of the present invention;

[0025] Figure 2 This is an experimental result diagram of a wire drawing die polishing paste according to an embodiment of the present invention. Detailed Implementation

[0026] To enable those skilled in the art to better understand the technical solutions in this disclosure, the technical solutions in the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. Based on the embodiments in this disclosure, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of this disclosure.

[0027] Example 1

[0028] A wire drawing die polishing paste, by weight percentage, comprises the following components: 25% composite abrasive, 3% modified dispersant, 5% elastic binder, 2% lubricant, 1% polishing aid, and the balance being deionized water. The composite abrasive is composed of nano-diamond powder and boron carbide powder in a 1:1 weight ratio. The nano-diamond powder has a particle size of 50 nm, and the boron carbide powder has a particle size of 300 nm. The modified dispersant is sodium lignosulfonate modified with silane coupling agent KH-570. The elastic binder is a polyurethane-modified acrylate emulsion, with polyurethane accounting for 20% of the mass. The lubricant is composed of polyethylene glycol and lanolin in a 2:1 weight ratio, with polyethylene glycol having a molecular weight of 400. The polishing aid is composed of triethanolamine and boric acid in a 1:0.5 weight ratio.

[0029] A process for preparing a wire drawing die polishing paste includes the following steps:

[0030] S1. Mix nano-diamond powder and boron carbide powder in a certain proportion, add ethanol solution accounting for 5% of the mass of the mixed abrasive, ultrasonically disperse at 150W power and 20kHz frequency for 30min, and then dry at 80℃ to constant weight for later use.

[0031] S2. Add deionized water to the reactor, heat to 40°C, and add modified dispersant, lubricant and grinding aid in sequence. Stir at 300 r / min for 60 min to obtain a homogeneous basic system.

[0032] S3. Slowly add the pretreated composite abrasive to the base system, control the stirring speed to 600 r / min, and stir for 30 min to obtain the initial mixed slurry.

[0033] S4. Add elastic binder to the initial mixed slurry, adjust the stirring speed to 400 r / min, continue stirring for 90 min, and then mature for 2 h at 30℃ and vacuum degree -0.06 MPa. Grind the slurry with a three-roll mill until the particle size is less than 5 μm, with a grinding pressure of 0.3 MPa and a grinding number of times.

[0034] Example 2

[0035] A wire drawing die polishing paste, by weight percentage, comprises the following components: 32% composite abrasive, 5% modified dispersant, 8% elastic binder, 4% lubricant, 2% grinding aid, and the balance being deionized water. The composite abrasive is composed of nano-diamond powder and boron carbide powder in a 2:1 weight ratio. The nano-diamond powder has a particle size of 120 nm, and the boron carbide powder has a particle size of 500 nm. The modified dispersant is sodium lignosulfonate modified with silane coupling agent KH-570. The elastic binder is a polyurethane-modified acrylate emulsion, with polyurethane accounting for 28% of the mass. The lubricant is composed of polyethylene glycol and lanolin in a 3:1 weight ratio, with polyethylene glycol having a molecular weight of 600. The grinding aid is composed of triethanolamine and boric acid in a 1:1 weight ratio.

[0036] A process for preparing a wire drawing die polishing paste includes the following steps:

[0037] S1. Mix nano-diamond powder and boron carbide powder in a certain proportion, add ethanol solution accounting for 8% of the mass of the mixed abrasive, ultrasonically disperse at 200W power and 30kHz frequency for 45min, and then dry at 90℃ to constant weight for later use.

[0038] S2. Add deionized water to the reactor, heat to 45°C, and add modified dispersant, lubricant and grinding aid in sequence. Stir at 400 r / min for 75 min to obtain a homogeneous basic system.

[0039] S3. Slowly add the pretreated composite abrasive to the base system, control the stirring speed to 700 r / min, and stir for 38 min to obtain the initial mixed slurry.

[0040] S4. Add elastic binder to the initial mixed slurry, adjust the stirring speed to 500 r / min, continue stirring for 105 min, and then mature at 35℃ and vacuum degree -0.07 MPa for 3 h. Grind it with a three-roll mill until the particle size is less than 5 μm, the grinding pressure is 0.45 MPa, and the grinding is repeated 3 times.

[0041] Example 3

[0042] A wire drawing die polishing paste, by weight percentage, comprises the following components: 40% composite abrasive, 8% modified dispersant, 12% elastic binder, 6% lubricant, 4% polishing aid, and the balance being deionized water. The composite abrasive is composed of nano-diamond powder and boron carbide powder in a 3:1 weight ratio. The nano-diamond powder has a particle size of 200 nm, and the boron carbide powder has a particle size of 800 nm. The modified dispersant is sodium lignosulfonate modified with silane coupling agent KH-570. The elastic binder is a polyurethane-modified acrylate emulsion, with polyurethane comprising 35% of the total weight. The lubricant is composed of polyethylene glycol and lanolin in a 5:1 weight ratio, with polyethylene glycol having a molecular weight of 1000. The polishing aid is composed of triethanolamine and boric acid in a 1:2 weight ratio.

[0043] A process for preparing a wire drawing die polishing paste includes the following steps:

[0044] S1. Mix nano-diamond powder and boron carbide powder in a certain proportion, add ethanol solution accounting for 10% of the mass of the mixed abrasive, ultrasonically disperse at 250W power and 40kHz frequency for 60min, and then dry at 100℃ to constant weight for later use.

[0045] S2. Add deionized water to the reactor, heat to 50°C, and add modified dispersant, lubricant and grinding aid in sequence. Stir at 500 r / min for 90 min to obtain a homogeneous basic system.

[0046] S3. Slowly add the pretreated composite abrasive to the base system, control the stirring speed to 800 r / min, and stir for 45 min to obtain the initial mixed slurry.

[0047] S4. Add elastic binder to the initial mixed slurry, adjust the stirring speed to 600 r / min, continue stirring for 120 min, and then mature at 40℃ and vacuum degree -0.09MPa for 4 h. Grind it with a three-roll mill until the particle size is less than 5μm, the grinding pressure is 0.6MPa, and the grinding is repeated 4 times.

[0048] Comparative Example 1

[0049] A wire drawing die abrasive paste, with the same composition and preparation process as in Example 2, except that the composite abrasive is a single nano-diamond powder with a particle size of 120 nm, and no boron carbide powder is added.

[0050] Comparative Example 2

[0051] A wire drawing die grinding paste, with the same components and preparation process as in Example 2, except that the dispersant is unmodified sodium lignosulfonate and it has not been modified with silane coupling agent KH-570.

[0052] Comparative Example 3

[0053] A wire drawing die polishing paste, with the same components and preparation process as in Example 2, except that the binder is a single acrylic emulsion and has not been modified with polyurethane.

[0054] Comparative Example 4

[0055] A wire drawing die grinding paste, with the same components and preparation process as in Example 2, except that ultrasonic dispersion pretreatment was not performed in the preparation process.

[0056] Comparative Example 5

[0057] A wire drawing die grinding paste, with the same components and preparation process as in Example 2, except that the curing process is at normal pressure and no vacuum treatment is performed.

[0058] Performance testing

[0059] The performance of the wire drawing die polishing pastes prepared in Examples 1-3 and Comparative Examples 1-5 was tested, including polishing efficiency, polishing accuracy, storage stability, and wire drawing die lifespan. The test results are as follows: Figure 2 As shown, from Figure 2The test results show that, compared with comparative examples 1-5, the wire drawing die polishing pastes prepared in Examples 1-3 of this invention have shorter polishing times, lower surface roughness, better storage stability, and longer wire drawing die lifespan. Among them, Example 2 has the best overall performance.

[0060] Comparative Example 1, using a single nanodiamond abrasive, achieved high grinding efficiency but poor grinding precision and a short lifespan for the wire drawing die. Comparative Example 2, using an unmodified dispersant, suffered from poor abrasive dispersion instability, leading to decreased grinding efficiency and precision. Comparative Example 3, using a single acrylate binder, lacked elasticity, resulting in easy damage to the wire drawing die surface and a shortened lifespan. Comparative Example 4, lacking ultrasonic dispersion pretreatment, caused abrasive agglomeration, affecting grinding efficiency and reducing precision. Comparative Example 5, without vacuum curing, resulted in air bubbles during atmospheric pressure curing, negatively impacting grinding precision and storage stability.

[0061] It will be apparent to those skilled in the art that this disclosure is not limited to the details of the exemplary embodiments described above, and that this disclosure can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of this disclosure is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within this disclosure. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0062] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A wire drawing die polishing paste, characterized in that, The composite abrasive comprises the following components by mass percentage: 25-40% composite abrasive, 3-8% modified dispersant, 5-12% elastic binder, 2-6% lubricant, 1-4% grinding aid, and the balance being deionized water; the composite abrasive is composed of nano-diamond powder and boron carbide powder in a mass ratio of (1-3):1, wherein the particle size of the nano-diamond powder is 50-200nm and the particle size of the boron carbide powder is 300-800nm.

2. The wire drawing die grinding paste according to claim 1, characterized in that, The modified dispersant is sodium lignosulfonate modified with silane coupling agent KH-570. The modification process is as follows: sodium lignosulfonate is dissolved in deionized water, silane coupling agent KH-570 is added, and the mixture is stirred and reacted at 60-80℃ for 2-4 hours. After being dried under reduced pressure, it is pulverized to obtain the final product.

3. The wire drawing die grinding paste according to claim 1, characterized in that, The elastic adhesive is a polyurethane-modified acrylate emulsion, wherein the mass percentage of polyurethane is 20-35%.

4. The wire drawing die grinding paste according to claim 1, characterized in that, The lubricant is a compound of polyethylene glycol and lanolin in a mass ratio of (2-5):1, and the molecular weight of polyethylene glycol is 400-1000.

5. The wire drawing die polishing paste according to claim 1, characterized in that, The grinding aid is a compound of triethanolamine and boric acid in a mass ratio of 1:(0.5-2).

6. A preparation process for the wire drawing die polishing paste as described in any one of claims 1-5, characterized in that, Includes the following steps: S1. Mix nano-diamond powder and boron carbide powder in a certain proportion, add 5-10% ethanol solution of the mixed abrasive, ultrasonically disperse for 30-60 min, and then dry at 80-100℃ to constant weight for later use. S2. Add deionized water to the reactor, heat to 40-50℃, and add modified dispersant, lubricant and grinding aid in sequence. Stir at a stirring speed of 300-500r / min for 60-90min to obtain a homogeneous basic system. S3. Slowly add the pretreated composite abrasive to the base system, control the stirring speed to 600-800 r / min, and stir for 30-45 min to obtain the initial mixed slurry. S4. Add elastic binder to the initial mixed slurry, adjust the stirring speed to 400-600 r / min, continue stirring for 90-120 min, then mature at 30-40℃ for 2-4 h, and grind with a grinder until the particle size is less than 5 μm to obtain wire drawing die grinding paste.

7. The preparation process of the wire drawing die polishing paste according to claim 6, characterized in that, In S1, the ultrasonic dispersion power is 150-250W and the ultrasonic frequency is 20-40kHz.

8. The preparation process of the wire drawing die polishing paste according to claim 6, characterized in that, In S4, the grinding mill is a three-roll mill, the grinding pressure is 0.3-0.6MPa, and the grinding times are 2-4 times.

9. The preparation process of the wire drawing die polishing paste according to claim 6, characterized in that, In S4, the curing process is carried out under vacuum with a vacuum level of -0.06 to -0.09 MPa.

10. The preparation process of a wire drawing die polishing paste according to claim 6, characterized in that, It also includes a post-processing step, in which the ground wire drawing die grinding paste is filtered with a filtration accuracy of 1-3μm, and then packaged under nitrogen protection.

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