Temperature measuring device and method for super-deep vertical shaft freezing construction

Abstract

The application discloses a kind of temperature measuring device and temperature measuring method of super-deep vertical shaft freezing construction, device includes main control chip, power management module, sensor data acquisition module, display module, keyboard interface module, communication interface module;The power management module is respectively powered for main control chip, display module, keyboard interface module, communication interface module, sensor data acquisition module;Main control chip is respectively communicated with sensor data acquisition module, display module, keyboard interface module and communication interface module connection;Sensor data acquisition module is collected temperature data transmission to main control chip, and the data after main control chip is analyzed, processed, temperature value is shown by display module, data is transmitted to PC or other centralized control system by communication interface module, and acquisition parameter and inquiry information are set by keyboard module. By improving strong drive circuit, signal conditioning and protection isolation etc. mode greatly improve the temperature detection performance and reliability of device.

Description

Technical Field

[0001] This invention relates to the field of temperature measurement technology during vertical shaft freezing construction. Specifically, it relates to a temperature measurement device and method for ultra-deep vertical shaft freezing construction. Background Technology

[0002] The core of the freezing method for ultra-deep vertical shaft construction is to form a closed, uniform, and sufficiently thick frozen wall to withstand enormous water and soil pressure.

[0003] Temperature measurement devices for freezing construction in ultra-deep vertical shafts are an important component of intelligent and precise monitoring in deep earth engineering construction. They are mainly used for temperature measurement at freezing construction sites and freezing stations to achieve real-time, online, and precise monitoring of the temperature field of the frozen wall, improve the accuracy and timeliness of judging the development status of the frozen wall, and provide a more reliable basis for construction decisions.

[0004] Temperature measuring devices serve as the "eyes" for monitoring the development of frozen walls and assessing their safety. Their technical characteristics are mainly reflected in the following aspects:

[0005] (1) Sensor technology: The sensor adopts the DS18B20 one-wire digital temperature sensor. Each sensor has a globally unique 64-bit code and communicates and supplies power through a single data line to form a sensor network. The controller reads data one by one by address access.

[0006] (2) Temperature acquisition accuracy: The typical accuracy can reach ±0.5°C, and the resolution is 0.0625°C, which meets the engineering requirements.

[0007] (3) Device driving capability and anti-interference capability: It is usually composed of "high-performance microcontroller (such as STM32 series) + level comparison / driving circuit + sensor network". The signal attenuation problem caused by ultra-deep vertical shaft is solved by impedance matching, signal enhancement and other technologies. At the same time, the sensor directly outputs digital signal, which has strong anti-attenuation and interference capabilities in analog signal transmission and is suitable for long-distance transmission.

[0008] (4) Measurement stability of the device: It has been widely used in construction sites, the technology is relatively mature, and the performance is stable.

[0009] However, most of the aforementioned temperature measuring devices are used in construction sites of vertical shafts less than 800m deep. In recent years, the demand for deep ore bodies (generally referring to burial depths greater than 800m to 1000m, or even 1500m or more) in the coal, metal mining, and other fields has been increasing, leading to an increase in the number of ultra-deep vertical shafts (shaft depth > 1000m). Especially in the development of mine shafts, shafts over 1000m have become key channels for deep resource extraction. However, ultra-deep vertical shafts greater than 800m suffer from large variations in cable reactance parameters (including resistance, parasitic capacitance, and inductance), facing problems such as insufficient signal drive, changes in signal waveform rise / fall time slots (including waveform distortion and phase shift), timing errors, signal attenuation and distortion, and communication failures. Summary of the Invention

[0010] Therefore, the technical problem to be solved by the present invention is to provide a temperature measurement device for freezing construction of ultra-deep vertical shafts, thereby solving the problems of large variation in the reactance parameters (including resistance, parasitic capacitance, and inductance) of cables in ultra-deep vertical shafts (>800m), insufficient signal drive, changes in the rise / fall time slots of signal waveforms (including waveform deformation and phase shift), timing disorder, signal attenuation and distortion, and communication failure.

[0011] To solve the above-mentioned technical problems, the present invention provides the following technical solution:

[0012] A temperature measurement device for freezing operations in ultra-deep vertical shafts includes a main control chip, a power management module, a sensor data acquisition module, a display module, a keyboard interface module, and a communication interface module. The power management module converts externally input 12VDC into 5V and 3.3V voltages, with the 3.3V supplying power to the main control chip, display module, keyboard interface module, and communication interface module, and the 5V supplying power to the sensor data acquisition module. The main control chip communicates with the sensor data acquisition module, display module, keyboard interface module, and communication interface module. The sensor data acquisition module transmits the acquired temperature data to the main control chip, which analyzes and processes the temperature data. The processed temperature data is displayed on the display module, transmitted to a PC or other centralized control system via the communication interface module, and the acquisition parameters and information are set and queried via the keyboard module.

[0013] The aforementioned ultra-deep vertical shaft freezing construction temperature measurement device uses an STM32F103 main control chip, which has a 32-bit ARM architecture and a main frequency of 72MHz. The main control chip embeds signal conditioning software and has an adaptive optimization drive function.

[0014] The power management module includes a low-dropout voltage regulator circuit, a linear voltage regulator circuit, and a power filter circuit. An external 12VDC voltage is connected to the low-dropout voltage regulator circuit via interface P2. In the low-dropout voltage regulator circuit: pin 2 of interface P2 is connected to pins 1 and 5 of the adjustable low-dropout voltage regulator TPS73801 via diode D4, and pin 2 of the adjustable low-dropout voltage regulator TPS73801 outputs a 5V voltage. Pins 3 and 6 of the adjustable low-dropout voltage regulator TPS73801 are grounded. Pin 2 of the adjustable low-dropout voltage regulator TPS73801 is connected to ground via resistors R17 and R29, and also to ground via capacitors C19 and C31. Pin 4 of the adjustable low-dropout voltage regulator TPS73801 is connected to ground via resistor R29.

[0015] In the linear voltage regulator circuit: the 5V output voltage of the low dropout voltage regulator circuit is connected to the input terminal of the voltage regulator chip AMS1117, and the output terminal of the voltage regulator chip AMS1117 outputs a 3.3V voltage; the 5V output voltage of the low dropout voltage regulator circuit is grounded through capacitors C35 and C37 respectively; the ground terminal of the voltage regulator chip AMS1117 is grounded; the output terminal of the voltage regulator chip AMS1117 is grounded through capacitors C38 and C36 respectively, and the output terminal of the voltage regulator chip AMS1117 is also connected to resistor R30 and light-emitting diode D3 before being grounded;

[0016] The power supply filtering circuit includes a two-stage LC power supply filter circuit and a parallel capacitor filter circuit. The 3.3V output from the linear regulator circuit is first connected to the two-stage LC power supply filter circuit, and then to the parallel capacitor filter circuit. In the two-stage LC power supply filter circuit: the 3.3V output from the linear regulator circuit is connected to one end of inductor L1, and the GND ground terminal is connected to one end of inductor L3; the other end of inductor L1 is connected to node VDDA; the other end of inductor L3 is connected to node VSSA; a capacitor C is connected in parallel between node VDDA and node VSSA. 5. Connect capacitor C6; one end of node VDDA is connected to one end of inductor L2, and the other end of inductor L2 is connected to node VREF+; one end of node VSSA is connected to one end of inductor L4, and the other end of inductor L4 is connected to node VREF-; capacitors C7, C8, and C9 are connected in parallel, with one end connected to node VREF+ and the other end connected to node VREF-; in the parallel capacitor filter circuit, the 3.3V voltage is grounded after passing through the parallel capacitors C10, C11, C12, C13, and C14.

[0017] The aforementioned ultra-deep vertical shaft freezing construction temperature measurement device includes a sensor data acquisition module comprising two or more DS18B20 temperature sensors connected in series and a high-power drive circuit; the DS18B20 temperature sensors are connected to the high-power drive circuit through sensor interface P5.

[0018] In the strong drive circuit, 5V voltage is connected to pin 2 of transistors Q5 and Q6 respectively, and pin 2 of transistor Q7 is grounded. Pin 2 of transistor Q7 is also connected to pin 2 of sensor interface P5. Pin 1 of transistor Q5 is connected to one end of resistor R37 via resistor R36. Pin 1 of transistor Q7 is connected to one end of resistor R37 via resistor R38. The other end of resistor R37 is connected to pin 1 of sensor interface P5. Pin 1 of transistor Q6 is directly connected to pin 1 of sensor interface P5. The SENSOR_D signal terminal of pin 46 of the main control chip is connected to pin 3 of sensor interface P5. Resistor R33 is connected between pin 1 of transistor Q7 and resistor 38. One end of resistor R33 is connected to a 5V voltage; the cathode of diode D9 is connected to a 5V voltage, and the anode of diode D9 is connected to one end of resistor R37; the anode of diode D10 is grounded, and the cathode of diode D10 is connected to one end of resistor R37; the C_DOWN signal terminal of pin 41 of the main control chip is connected to pin 3 of transistor Q7 through resistor R39; the 1820_DATA signal terminal of pin 42 of the main control chip is connected to pin 1 of sensor interface P5 through resistor R37; the C_UP signal terminal of pin 43 of the main control chip is connected to pin 3 of transistor Q5 through resistor R32; the P_UP signal terminal of pin 44 of the main control chip is connected to pin 3 of transistor Q6 through resistor R34.

[0019] The signal conditioning software embedded in the main control chip achieves adaptive optimization driving by polling, searching, and testing the DS18B20 temperature sensor; the adaptive optimization driving algorithm of the signal conditioning software includes the following:

[0020] The parameters of the DS18B20 temperature sensor are: voltage range V min ~V max and timing range T min ~T max Through polling, searching, and testing, record all successful communication records with "(voltage, timing)," i.e., (V) i ,T j The point set S of “)” is shown in equation (3).

[0021] V i =V min + A*i (V min ≤V i ≤V max (1);

[0022] T j =T min +B*j (T min ≤T j ≤T max (2);

[0023] S={ (V i ,T j ) | Communication successful} (3);

[0024] In equations (1) and (2), A is the driving voltage adjustment increment, and B is the communication timing adjustment increment; i and j are variables; After obtaining the set S of all successfully communicating (voltage, timing) points corresponding to a certain temperature sensor DS18B20, an optimal driving point P (V) is selected from the set S. op T op The optimal driving parameters are stored in the EEPROM of the main control chip and used as the optimal driving parameters for future readings of the sensor temperature; the optimal driving point P(V) op T op The optimal point search algorithm is as follows: Assuming the point set S has n boundary points and m interior points, select one interior point (V... j ,T j ), calculate the interior points (V) respectively. j ,T j Find the distances between each of the m interior points and all n boundary points, and record the minimum value. Repeat this process to find the minimum distances between all m interior points and the n boundary points, and form a set R(V). j ,T j Then, determine the maximum distance value D and its corresponding interior point (V) from this set. op ,T op ), that is, the optimal driving point P(V) op ,T op ).

[0025] Traditional temperature sensors are single-wire digital sensors. Signal reading, writing, and transmission require strict time slots. Different cable lengths, numbers of sensor nodes, and spacing between sensor nodes all necessitate different time slots, potentially leading to data acquisition errors or failures. By embedding signal conditioning software within the main control chip, the embedded software system polls, searches, and tests temperature sensors, recording the time slots of all successfully communicated temperature sensors to form a set of points. This set serves as the optimal driving time slot for future temperature readings from that sensor, enabling comprehensive sensor sensing, accurate temperature measurement, and ensuring no sensor loss and accurate measurements.

[0026] The aforementioned ultra-deep vertical shaft freezing construction temperature measurement device includes a display module comprising a display screen and a display interface P3. The display screen is connected to the display interface P3. Pin 1 of the display interface P3 is grounded, pin 2 of the display interface P3 is connected to a 3.3V voltage, pin 3 of the display interface P3 is connected to the LED_SCK signal terminal of pin 17 of the main control chip, pin 4 of the display interface P3 is connected to the LED_SDA signal terminal of pin 16 of the main control chip, and pin 5 of the display interface P3 is connected to the LED_RES signal terminal of pin 15 of the main control chip.

[0027] The aforementioned ultra-deep vertical shaft freezing construction temperature measurement device includes a keyboard interface module comprising an operation keyboard and a keyboard interface P7. The operation keyboard is connected to the keyboard interface P7. Pin 1 of the keyboard interface P7 is grounded. Pins 2, 3, 4, 5, 6, 7, and 8 of the keyboard interface P7 are connected to resistors R42, R41, R40, R31, R23, R22, and R21 respectively, and then connected to a 3.3V voltage. Pin 2 of the keyboard interface P7 is connected to the OK signal terminal of pin 61 of the main control chip. Pin 3 of keyboard interface P7 is connected to the LEFT signal terminal of pin 60 of the main control chip; pin 4 of keyboard interface P7 is connected to the RIGHT signal terminal of pin 59 of the main control chip; pin 5 of keyboard interface P7 is connected to the UP signal terminal of pin 58 of the main control chip; pin 6 of keyboard interface P7 is connected to the DOWN signal terminal of pin 57 of the main control chip; pin 7 of keyboard interface P7 is connected to the BACK signal terminal of pin 56 of the main control chip; and pin 8 of keyboard interface P7 is connected to the MENU signal terminal of pin 55 of the main control chip.

[0028] The aforementioned ultra-deep vertical shaft freezing construction temperature measurement device includes a communication interface module comprising an RS485 transceiver chip U1 and a communication line interface P1. The 485_RX signal terminal of pin 93 of the main control chip is connected to pin 1 of the RS485 transceiver chip U1; the 485_TX signal terminal of pin 92 of the main control chip is connected to pin 1 of transistor Q3 via resistor R5; pin 3 of transistor Q3 is connected to pins 2 and 3 of the RS485 transceiver chip U1; pin 2 of transistor Q3 is grounded; pins 4 and 5 of the RS485 transceiver chip U1 are grounded; pins 2 and 3 of the RS485 transceiver chip U1 are connected to a 5V voltage via resistor R4; pin 8 of the RS485 transceiver chip U1 is connected to a 5V voltage; and the 485_TX signal terminal of pin 92 of the main control chip is grounded via resistor R7.

[0029] Pin 6 of RS485 transceiver chip U1 is grounded through resistor R3 and capacitor C1. Pin A of pin 6 of RS485 transceiver chip U1 is grounded through capacitor C2 and TVS diode T2. Pin A of pin 6 of RS485 transceiver chip U1 is connected to pin 1 of communication line interface P1 through variable resistor Res6. Pin B of pin 7 of RS485 transceiver chip U1 is grounded through resistor R8, capacitor C18, and TVS diode T3. Pin B of pin 7 of RS485 transceiver chip U1 is connected to pin 2 of communication line interface P1 through variable resistor Res10. TVS diode T1, resistor R1, and switch S1 are connected between pin A and pin B.

[0030] The aforementioned ultra-deep vertical shaft freezing construction temperature measurement device further includes a reset monitoring chip U8, which is an SP706 used for embedded systems, power supply voltage monitoring, and watchdog functions. Pin 2 of the reset monitoring chip U8 is connected to a 3.3V voltage, and pins 3 and 4 of the reset monitoring chip U8 are grounded. Pin 2 of the reset monitoring chip U8 is connected to the reset button S2 and then grounded. Pin 8 of the reset monitoring chip U8 is connected to the reset display LED J1 and, together with pin 7 of the reset monitoring chip U8, is connected to the nRST signal terminal of pin 14 of the main control chip. Pin 6 of the reset monitoring chip U8 is connected to the WDI signal terminal of pin 67 of the main control chip.

[0031] The aforementioned ultra-deep vertical shaft freezing construction temperature measuring device further includes an EEPROM chip U6, which stores device information and configuration information. The SDA signal terminal of pin 51 of the main control chip is connected to pin 5 of the EEPROM chip U6, and the SCL signal terminal of pin 52 of the main control chip is connected to pin 6 of the EEPROM chip U6. Pins 5 and 6 of the EEPROM chip U6 are connected to a 3.3V voltage through resistors R28 and R19, respectively. Pins 4 and 7 of the EEPROM chip U6 are grounded, and pin 8 of the EEPROM chip U6 is grounded through capacitor C33.

[0032] The temperature measurement method using the aforementioned ultra-deep vertical shaft freezing construction temperature measurement device includes the following steps:

[0033] (1) Installation: Connect the acquisition line of the temperature sensor DS18B20, connect the external 12VDC power supply line of the power management module, and connect the RS485 A and B lines of the communication interface module.

[0034] (2) Start the device: After the device is started, it displays the temperature measuring device information, and then performs a self-test to connect the temperature sensor DS18B20. It stores the detected temperature sensor DS18B20 information. If the temperature sensor DS18B20 information is not detected, the temperature measuring device will cycle through the detection until a temperature sensor is detected. The temperature sensor DS18B20 information includes the number of sensors, ID number and address.

[0035] (3) Temperature measurement: The device measures the temperature based on the detected temperature sensor ID number, obtains the temperature data, and then transmits the temperature data to the main control chip for analysis and processing through the strong drive circuit. The temperature value is displayed through the display module, and the main control chip monitors in real time whether the communication interface model receives the request command. If so, the collected data is sent to the PC or other centralized control system.

[0036] The above-mentioned method for temperature measurement during freezing operations in ultra-deep vertical shafts allows for viewing and configuring machine information via a keyboard interface module; manual reset control, watchdog monitoring, and power supply voltage monitoring are achieved through a reset monitoring chip; and machine information and configuration information are stored via an EEPROM chip.

[0037] The technical solution of the present invention achieves the following beneficial technical effects:

[0038] The ultra-deep vertical shaft freezing construction temperature measurement device of this application forms a complete data acquisition, processing, display and communication link through the connection between the main control chip, power management module, sensor data acquisition module, display module, keyboard interface module and communication interface module.

[0039] 1. In the power management module, 5V and 3.3V voltages are obtained through low dropout voltage regulator circuit and linear voltage regulator circuit, and then power is supplied after noise reduction by power filter circuit; two-stage LC power filter circuit is used to reduce noise and stabilize the 3V3 input power supply, and a capacitor parallel filter circuit is used to achieve noise filtering and voltage stabilization of VDD power supply.

[0040] 2. In the sensor data acquisition module, multiple DS18B20 sensors are connected in series to the “DS18B20 interface” (Header5 interface) and share the “1820_DATA” data line; the temperature sensor series link is first connected to the “strong drive circuit” (to enhance signal driving capability), and then connected to the main control chip through a dedicated pin to realize temperature signal transmission.

[0041] Due to the ultra-deep vertical shaft (shaft depth > 1000m), the cable between the DS18B20 sensor located at the far end of the shaft and the main control chip located on the ground is long, resulting in large variations in the cable reactance parameters (including resistance, parasitic capacitance, and inductance) and insufficient signal drive.

[0042] This patent incorporates a powerful driving circuit, which, compared to traditional circuits (see appendix), provides a significant advantage. Figure 16 It is equipped with three transistors Q5, Q6 and Q7.

[0043] When reading bus data, Q5, Q6, and Q7 are all off. The bus level depends on the sensor's transmission level. The bus is pulled up to 5V through a 1K resistor (R33 + R38 ≈ 1K). The DS18B20 datasheet states that this resistor is 4.7K, but the design uses 1K to increase the signal current and enhance signal integrity. When writing data to the bus, if a 1 is written, Q5 is on, and Q6 and Q7 are off. In this case, 5V is connected to the bus through R36 (82 ohms) to increase the bus current and make the rising edge steeper. When writing a 0, Q7 is on, and Q5 and Q6 are off. In this case, the bus is directly pulled to ground to reduce the falling edge time. When the sensor performs data conversion, Q6 is on, and Q5 and Q7 are off. In this case, 5V is directly connected to the bus, which greatly improves the bus driving capability and meets the requirement of a maximum 1.5mA / unit for sensor conversion.

[0044] A strong drive circuit (amplifying current through a MOSFET) enhances the signal's "drive strength," ensuring data signal integrity over long distances (ordinary I / O ports have weak drive current, and signals are easily distorted due to cable resistance and distributed capacitance). It also supports the series connection of more sensors, increasing the number of temperature measurement points in the system (ordinary I / O ports cannot meet the power supply and communication requirements of multiple sensors). Furthermore, the output signal has a "steeper level swing and greater current margin," reducing the impact of external interference on the data signal and decreasing the communication error rate (in industrial settings such as underground mines, electromagnetic interference is strong, and the weak signals from ordinary I / O ports are easily interfered with). The strong drive circuit (with the MOSFET as an intermediate stage) isolates the main control chip from the sensor link, preventing abnormal current from directly impacting the I / O pins of the main control chip, thus improving system reliability (if overcurrent or short circuits occur on the sensor side, direct connection to ordinary I / O interfaces will burn out). The DS18B20 temperature sensor requires bidirectional interaction between the main control output control signal and the sensor return data signal on a single bus. The MOSFET of the strong drive circuit has a fast switching speed, which can accurately match the timing requirements of the single bus and ensure communication stability (the drive / receive switching speed of ordinary I / O ports is slow).

[0045] 3. Communication Module: The 485_TX (transmit) and 485_RX (receive) pins of the communication chip are directly connected to the corresponding pins of the main control chip to realize bidirectional data transmission; the communication circuit establishes a physical connection with the PC or other centralized control system through the "RS485 A, B" communication line interface; the built-in ModBus protocol realizes the conversion between the main control chip signal and the RS485 bus signal through the communication chip.

[0046] 4. Display and Keyboard Modules: The 128*64 OLED display screen is connected to the main control chip through the "display interface" to receive and display temperature values, device self-test information, parameter configuration interface, etc.; 7 operation buttons (MENU / BACK, etc.) are connected to the main control chip through independent pins, and the button signals are directly transmitted to the main control chip to trigger the corresponding operation logic.

[0047] 5. Auxiliary protection circuit: Reset monitoring circuit (SP706 chip): It interacts with the main control chip through the WDI (watchdog input) and WD (watchdog output) pins to monitor the program running status; the PFI pin monitors the power supply voltage, and triggers the nRST pin to output a reset signal when an abnormality occurs;

[0048] EEPROM chip: It communicates bidirectionally with the main control chip via the I2C bus (SDA, SCL) to store or read key information such as device ID, sensor configuration, and parameter settings in real time.

[0049] 6. Signal conditioning software is embedded within the main control chip. This embedded software system polls, searches, and tests temperature sensors, recording the time slots of all successfully communicated temperature sensors to form a set of data points. This set serves as the optimal driving time slot for future temperature readings from that sensor, enabling full-line sensor sensing and accurate temperature measurement, ensuring no sensor loss and accurate measurements. (Traditional temperature sensors are single-wire bus digital sensors. Signal reading, writing, and transmission require strict time slots. Different cable lengths, numbers of sensor nodes, and spacing between sensor nodes all necessitate different time slots, potentially leading to data acquisition errors or failures.)

[0050] 7. This invention significantly improves the temperature detection performance and reliability of the device through the synergistic effect of improved power management module (noise reduction filtering and voltage stabilization), improved signal drive (enhancing signal drive capability through a strong drive circuit to minimize signal attenuation and distortion), signal conditioning (using embedded adaptive optimization drive software to filter signals and correct timing to ensure signal integrity), and protective isolation (the device casing adopts anti-interference measures to isolate external electromagnetic signal coupling). It solves the problems faced by ultra-deep vertical shafts (>800m) in terms of large variations in cable reactance parameters (including resistance, parasitic capacitance, and inductance), insufficient signal drive, changes in signal waveform rise / fall time slots (including waveform distortion and phase shift), timing disorder, signal attenuation and distortion, and communication failure.

[0051] The widespread application of this invention can promote the advancement of temperature measurement technology during ultra-deep vertical shaft freezing construction, improve the safety of the construction process, and ensure construction quality. Attached Figure Description

[0052] Figure 1Structural block diagram of the ultra-deep vertical shaft freezing construction temperature measurement device of the present invention;

[0053] Figure 2 Low dropout voltage regulator circuit diagram;

[0054] Figure 3 Linear voltage regulator circuit diagram;

[0055] Figure 4 Two-stage LC power supply filter circuit diagram;

[0056] Figure 5 Diagram of a capacitor parallel filter circuit;

[0057] Figure 6 Strong drive circuit diagram;

[0058] Figure 7 Main control chip circuit connection diagram;

[0059] Figure 8 Display module circuit connection diagram;

[0060] Figure 9 Keyboard interface module circuit connection diagram;

[0061] Figure 10 Communication interface module circuit connection diagram;

[0062] Figure 11 Reset monitoring chip circuit connection diagram;

[0063] Figure 12 EPROM chip circuit connection diagram;

[0064] Figure 13 LED circuit diagram;

[0065] Figure 14a The impact of long cables on signals before improvement;

[0066] Figure 14b Improve the effect of preload on the signal;

[0067] Figure 14c Interference with signals from high-frequency equipment before improvement;

[0068] Figure 15 Waveform changes after circuit improvement;

[0069] Figure 16 Traditional temperature measuring device connection circuit diagram (without drive circuit). Detailed Implementation

[0070] Example 1

[0071] The ultra-deep vertical shaft freezing construction temperature measurement device includes a main control chip, a power management module, a sensor data acquisition module, a display module, a keyboard interface module, and a communication interface module; such as Figure 1 As shown, the power management module converts the externally input 12VDC into 5V and 3.3V voltages. The 3.3V voltage powers the main control chip, display module, keyboard interface module, and communication interface module, respectively, while the 5V voltage powers the sensor data acquisition module. The main control chip is communicatively connected to the sensor data acquisition module, display module, keyboard interface module, and communication interface module.

[0072] The sensor data acquisition module transmits the collected temperature data to the main control chip. After analysis and processing, the main control chip displays the temperature value via the display module and transmits the data to a PC or other centralized control system via the communication interface module. The keyboard module allows for setting acquisition parameters and querying information. The device also includes a reset monitoring chip for embedded system, power supply voltage monitoring, and watchdog functionality, as well as an EEPROM chip for storing device information and configuration details. The power management module supplies power to the reset monitoring chip and the EEPROM chip, and the main control chip communicates with both.

[0073] The main control chip is an STM32F103, which has a 32-bit ARM processor and a main frequency of 72MHz. The main control chip has embedded signal conditioning software with adaptive optimization drive function. It is resource-rich, powerful, low power consumption, wide voltage range, easy to use and simple to develop.

[0074] The power management module includes a low-dropout regulator circuit, a linear regulator circuit, and a power filter circuit; such as Figure 2 As shown, the external 12VDC voltage is reduced to 5V through a low-dropout voltage regulator circuit to power the DS18B20 temperature sensor and the high-power drive circuit. The external 12VDC voltage is connected to the low-dropout voltage regulator circuit through interface P2. Pin 2 of interface P2 is connected to pins 1 and 5 of the adjustable low-dropout voltage regulator TPS73801 through diode D4. Pin 2 of the adjustable low-dropout voltage regulator TPS73801 outputs 5V. Pins 3 and 6 of the adjustable low-dropout voltage regulator TPS73801 are grounded. Pin 2 of the adjustable low-dropout voltage regulator TPS73801 is connected to ground through resistors R17 and R29, and also to ground through capacitors C19 and C31. Pin 4 of the adjustable low-dropout voltage regulator TPS73801 is connected to ground through resistor R29.

[0075] like Figure 3As shown, in the linear voltage regulator circuit, the voltage is converted to 3.3V by the AMS1117 (LDO regulator) to power the main control chip, display screen, RS485 transceiver chip, reset monitoring chip, and EEPROM chip. The 5V output of the low dropout voltage regulator circuit is connected to the input terminal of the AMS1117 regulator chip, and the output terminal of the AMS1117 regulator chip outputs 3.3V. The 5V output of the low dropout voltage regulator circuit is grounded through capacitors C35 and C37 respectively. The ground terminal of the AMS1117 regulator chip is grounded. The output terminal of the AMS1117 regulator chip is grounded through capacitors C38 and C36 respectively. The output terminal of the AMS1117 regulator chip is also connected to resistor R30 and LED D3 before being grounded.

[0076] The power supply filtering circuit includes a two-stage LC power supply filtering circuit and a parallel capacitor filtering circuit. The 3.3V output from the linear regulator circuit is first connected to the two-stage LC power supply filtering circuit, and then connected to the parallel capacitor filtering circuit. The two-stage LC power supply filtering circuit is used to reduce noise and stabilize the 3V3 input power supply, and the parallel capacitor filtering circuit is used to achieve noise filtering and voltage stabilization of the VDD power supply.

[0077] like Figure 4 As shown, in the two-stage LC power supply filter circuit: the 3.3V output from the linear regulator circuit is connected to one end of inductor L1, and the GND ground terminal is connected to one end of inductor L3; the other end of inductor L1 is connected to node VDDA; the other end of inductor L3 is connected to node VSSA; capacitors C5 and C6 are connected in parallel between nodes VDDA and VSSA; one end of node VDDA is connected to one end of inductor L2, and the other end of inductor L2 is connected to node VREF+; one end of node VSSA is connected to one end of inductor L4, and the other end of inductor L4 is connected to node VREF-; capacitors C7, C8, and C9 are connected in parallel, with one end connected to node VREF+ and the other end connected to node VREF-.

[0078] The signal / current flow of the entire circuit is: 3V3→L1→VDDA→L2→VREF+, VREF-→L4→VSSA→L3→GND; through the combination of two-stage inductors and parallel capacitors, power supply noise is filtered out step by step, and a stable VREF+ / VREF- power supply is output.

[0079] like Figure 5 As shown, in the parallel capacitor filter circuit, the 3.3V voltage is grounded after passing through capacitors C10, C11, C12, C13, and C14 connected in parallel. By connecting multiple capacitors in parallel between the power supply and ground, noise filtering and voltage stabilization of the 3.3V power supply are achieved.

[0080] The sensor data acquisition module includes two or more DS18B20 temperature sensors connected in series and a high-power drive circuit; the DS18B20 temperature sensors are connected to the high-power drive circuit via sensor interface P5. For example... Figure 6 As shown, a strong drive circuit is set up to enhance the signal driving capability and minimize signal attenuation and distortion.

[0081] exist Figure 6 In the high-power drive circuit, 5V voltage is connected to pin 2 of transistors Q5 and Q6 respectively, and pin 2 of transistor Q7 is grounded. Pin 2 of transistor Q7 is also connected to pin 2 of sensor interface P5. Pin 1 of transistor Q5 is connected to one end of resistor R37 via resistor R36. Pin 1 of transistor Q7 is connected to one end of resistor R37 via resistor R38. The other end of resistor R37 is connected to pin 1 of sensor interface P5. Pin 1 of transistor Q6 is directly connected to pin 1 of sensor interface P5. The SENSOR_D signal terminal of pin 46 of the main control chip is connected to pin 3 of sensor interface P5. Resistor R3 is connected between pin 1 of transistor Q7 and resistor 38. One end of resistor R33 is connected to a 5V voltage; the cathode of diode D9 is connected to a 5V voltage, and the anode of diode D9 is connected to one end of resistor R37; the anode of diode D10 is grounded, and the cathode of diode D9 is connected to one end of resistor R37; the C_DOWN signal terminal of pin 41 of the main control chip is connected to pin 3 of transistor Q7 through resistor R39; the 1820_DATA signal terminal of pin 42 of the main control chip is connected to pin 1 of sensor interface P5 through resistor R37; the C_UP signal terminal of pin 43 of the main control chip is connected to pin 3 of transistor Q5 through resistor R32; the P_UP signal terminal of pin 44 of the main control chip is connected to pin 3 of transistor Q6 through resistor R34.

[0082] Due to the ultra-deep vertical shaft (shaft depth > 1000m), the cable between the DS18B20 sensor located at the far end of the shaft and the main control chip located on the ground is long, resulting in large variations in the cable reactance parameters (including resistance, parasitic capacitance, and inductance) and insufficient signal drive.

[0083] This patent incorporates a powerful driving circuit, which, compared to traditional circuits (see appendix), provides a significant advantage. Figure 16 It is equipped with three transistors Q5, Q6 and Q7.

[0084] When reading bus data, Q5, Q6, and Q7 are not conducting. The bus level depends on the sensor's transmission level. The bus is pulled up to 5V through a 1K resistor (R33+R38≈1K). The DS18B20 datasheet states that this resistor is 4.7K. Using 1K in the design can increase the signal current and enhance signal integrity.

[0085] When writing data to the bus, if writing 1, Q5 is turned on, while Q6 and Q7 are not turned on. At this time, R36 (82 ohms) is used to connect 5V to the bus to increase the bus current and make the rising edge steeper. When writing 0, Q7 is turned on, while Q5 and Q6 are not turned on. At this time, the bus is pulled directly to ground to reduce the falling edge time.

[0086] When the sensor is converting data, Q6 is turned on, while Q5 and Q7 are not turned on. At this time, 5V is directly connected to the bus, which greatly improves the bus driving capability and meets the requirement of a maximum conversion of 1.5mA / sensor.

[0087] The signal conditioning software embedded in the main control chip achieves adaptive optimization drive by polling, searching and testing the DS18B20 temperature sensor.

[0088] The adaptive optimization-driven algorithms of signal conditioning software include the following:

[0089] The parameters of the DS18B20 temperature sensor are: voltage range V min ~V max and timing range T min ~T max Therefore, it is necessary to adjust the voltage and timing of each DS18B20 temperature sensor connected to the bus, as shown in equations (1) and (2). Through polling, searching, and testing, record the "(voltage, timing)" of all successfully communicated signals, i.e., (V i ,T j The point set S of “)” is shown in equation (3).

[0090] V i =V min + A*i (V min ≤V i ≤V max (1);

[0091] T j =T min + B*j (T min ≤T j ≤T max (2);

[0092] S={ (V i ,T j ) | Communication successful} (3);

[0093] In equations (1) and (2), A is the driving voltage adjustment increment, and B is the communication timing adjustment increment; i and j are variables; after obtaining the set S of all (voltage, timing) points that can successfully communicate for a certain temperature sensor DS18B20, an optimal driving point P (V) is selected from the set S. op Top The data is stored in the EEPROM of the main control chip as the optimal driving parameters to be used when reading the temperature of the sensor in the future.

[0094] Adaptive optimization-driven algorithm. Since the boundary points in the point set S are the dividing points between successful and unsuccessful communication, the inner point that is farthest from each boundary point is the optimal driving point. Therefore, the optimal driving point in the point set S graph is the inner point that satisfies the following conditions: (1) it is a point inside the boundary; (2) the minimum distance between the inner point and all boundary points is the largest relative to the minimum distance between other inner points and each boundary point.

[0095] Therefore, the optimal driving point P(V) op T op The optimal point search algorithm is as follows: Assuming the point set S has n boundary points and m interior points, select one interior point (V... j ,T j ), calculate the interior points (V) respectively. j ,T j Find the distances between each of the m interior points and all n boundary points, and record the minimum value. Repeat this process to find the minimum distances between all m interior points and the n boundary points, and form a set R(V). j ,T j Then, determine the maximum distance value D and its corresponding interior point (V) from this set. op ,T op ), that is, the optimal driving point P (V op ,T op (Using an adaptive optimization-driven implementation method, the embedded software system polls, searches, and tests the temperature sensor, recording all successful communication drive time slots to form a set of points. This set serves as the optimal drive time slot for future temperature readings of the sensor, enabling full-line sensor sensing and accurate temperature measurement, ensuring no sensor loss and accurate measurements.) This prevents signal waveform rises / falls from changing with time slots and causing timing discrepancies (e.g., Figure 15 (As shown).

[0096] The enhanced drive circuit (amplifying current through MOSFETs) strengthens the signal's "drive strength," ensuring data signal integrity over long distances. It also supports the cascading of more sensors, increasing the number of temperature measurement points in the system. Furthermore, the output signal has a steeper level swing and a larger current margin, reducing the impact of external interference on the data signal and lowering the communication error rate. The enhanced drive circuit (with MOSFETs as an intermediate stage) isolates the main control and sensor links, preventing abnormal current from directly impacting the main control chip's I / O pins, thus improving system reliability. The DS18B20 temperature sensor's single-bus requires bidirectional interaction between the main control output control signal and the sensor's returned data signal. The enhanced drive circuit's fast MOSFET switching speed accurately matches the timing requirements of the single-bus, ensuring communication stability.

[0097] like Figure 8 As shown, the display module includes a display screen and a display interface P3. The display screen is a 128*64 OLED, used for local display of temperature measurement values. The display screen is connected to the display interface P3. Pin 1 of the display interface P3 is grounded, pin 2 is connected to 3.3V, pin 3 is connected to the LED_SCK signal terminal of pin 17 of the main control chip, pin 4 is connected to the LED_SDA signal terminal of pin 16 of the main control chip, and pin 5 is connected to the LED_RES signal terminal of pin 15 of the main control chip.

[0098] like Figure 9 As shown, the keyboard interface module includes an operation keyboard and a keyboard interface P7, with seven keys: MENU, BACK, DOWN, UP, RIGHT, LEFT, and OK. These keys are used for viewing, configuring, and operating. The operation keyboard is connected to the keyboard interface P7. Pin 1 of the keyboard interface P7 is grounded. Pins 2, 3, 4, 5, 6, 7, and 8 of the keyboard interface P7 are connected to resistors R42, R41, R40, R31, R23, R22, and R21 respectively, and then connected to a 3.3V voltage. Pin 2 of the keyboard interface P7 is connected to the OK signal terminal of pin 61 of the main control chip, and pin 3 of the keyboard interface P7 is connected to pin 61 of the main control chip. Connect the LEFT signal terminal of P7 to the RIGHT signal terminal of the main control chip, connect the 4th pin of P7 to the RIGHT signal terminal of the main control chip, connect the 5th pin of P7 to the UP signal terminal of the main control chip, connect the 6th pin of P7 to the DOWN signal terminal of the main control chip, connect the 7th pin of P7 to the BACK signal terminal of the main control chip, and connect the 8th pin of P7 to the MENU signal terminal of the main control chip.

[0099] like Figure 10As shown, the communication interface module includes an RS485 transceiver chip U1 and a communication line interface P1. It adopts an RS485 interface and ModBus protocol for data transmission with a PC or other centralized control system. The communication line interface P1 is connected to RS485 A line and B line respectively. The 485_RX signal terminal of pin 93 of the main control chip is connected to pin 1 of RS485 transceiver chip U1; the 485_TX signal terminal of pin 92 of the main control chip is connected to pin 1 of transistor Q3 through resistor R5; pin 3 of transistor Q3 is connected to pins 2 and 3 of RS485 transceiver chip U1 respectively; pin 2 of transistor Q3 is grounded; pins 4 and 5 of RS485 transceiver chip U1 are grounded; pins 2 and 3 of RS485 transceiver chip U1 are connected to 5V through resistor R4; pin 8 of RS485 transceiver chip U1 is connected to 5V; the 485_TX signal terminal of pin 92 of the main control chip is grounded through resistor R7.

[0100] Pin 6 of RS485 transceiver chip U1 is grounded through resistor R3 and capacitor C1. Pin A of pin 6 of RS485 transceiver chip U1 is grounded through capacitor C2 and TVS diode T2. Pin A of pin 6 of RS485 transceiver chip U1 is connected to pin 1 of communication line interface P1 through variable resistor Res6. Pin B of pin 7 of RS485 transceiver chip U1 is grounded through resistor R8, capacitor C18, and TVS diode T3. Pin B of pin 7 of RS485 transceiver chip U1 is connected to pin 2 of communication line interface P1 through variable resistor Res10. TVS diode T1, resistor R1, and switch S1 are connected between pin A and pin B.

[0101] like Figure 11 As shown, the reset monitoring chip U8 is an SP706, used for embedded systems, power supply voltage monitoring, and watchdog functions. Pin 2 of the reset monitoring chip U8 is connected to 3.3V, and pins 3 and 4 of the reset monitoring chip U8 are grounded. Pin 2 of the reset monitoring chip U8 is connected to the reset button S2 and then grounded. Pin 8 of the reset monitoring chip U8 is connected to the reset display LED J1, and together with pin 7 of the reset monitoring chip U8, it is connected to the nRST signal terminal of pin 14 of the main control chip. Pin 6 of the reset monitoring chip U8 is connected to the WDI signal terminal of pin 67 of the main control chip.

[0102] like Figure 12As shown, EPROM chip U6 is used to store device local information and configuration information; the SDA signal terminal of pin 51 of the main control chip is connected to pin 5 of EEPROM chip U6, and the SCL signal terminal of pin 52 of the main control chip is connected to pin 6 of EEPROM chip U6; pins 5 and 6 of EEPROM chip U6 are connected to 3.3V voltage through resistors R28 and R19 respectively; pins 4 and 7 of EEPROM chip U6 are grounded; pin 8 of EEPROM chip U6 is grounded through capacitor C33.

[0103] The device also includes an LED circuit. Pin 40 of the main control chip is connected to LED D2 through resistor R49 to display the working status of the temperature sensor DS18B20. Pin 26 of the main control chip is connected to LED D1 through resistor R15 to display the working status of the communication interface P1. Pin 25 of the main control chip is connected to LED D5 through resistor R16 to display the working status of the reset monitoring chip.

[0104] Before adopting the ultra-deep vertical shaft freezing construction temperature measurement device of this application, from Figures 14a-14c It can be seen that this has a significant impact on the signal. Figure 14a In the case of long cables, the peak voltage is reduced, which shows the impact of the cable on the signal. Figure 14b The load affects the signal, causing the signal level to be consistently less than 2V or consistently greater than 1.4V, making it impossible for the controller to distinguish between high and low levels. Figure 14c This is interference with signals from high-frequency equipment.

[0105] After adopting the ultra-deep vertical shaft freezing construction temperature measurement device of this application, Figure 15 To improve the waveform after the design, the temperature detection performance and reliability of the device were greatly improved by improving signal driving (enhancing the signal driving capability through a strong driving circuit to minimize signal attenuation and distortion), signal conditioning (using embedded adaptive optimization driving software to filter signals and correct timing to ensure signal integrity), and protection and isolation (taking anti-interference measures on the device casing to isolate external electromagnetic signal coupling). This solved the problems faced by ultra-deep vertical shafts (>800m) with large variations in cable reactance parameters (including resistance, parasitic capacitance, and inductance), insufficient signal driving, changes in signal waveform rise / fall time slots (including waveform distortion and phase shift), timing disorder, signal attenuation and distortion, and communication failure.

[0106] Example 2

[0107] A method for measuring temperature using the ultra-deep vertical shaft freezing construction temperature measuring device of Example 1.

[0108] (1) Installation: Connect the acquisition line of the temperature sensor DS18B20, connect the external 12VDC power supply line of the power management module, and connect the RS485 A and B lines of the communication interface module.

[0109] (2) Start the device: After the device is started, it displays the temperature measuring device information, and then performs a self-test to connect the temperature sensor DS18B20. It stores the detected temperature sensor DS18B20 information. If the temperature sensor DS18B20 information is not detected, the temperature measuring device will cycle through the detection until a temperature sensor is detected. The temperature sensor DS18B20 information includes the number of sensors, ID number, and address.

[0110] (3) Temperature measurement: The device measures the temperature based on the detected temperature sensor ID number, obtains the temperature data, and then transmits the temperature data to the main control chip for analysis and processing through the strong drive circuit. The temperature value is displayed through the display module, and the main control chip monitors in real time whether the communication interface model receives the request command. If so, the collected data is sent to the PC or other centralized control system.

[0111] The device can be viewed and configured via the keyboard interface module; manual reset control, watchdog monitoring, and power supply voltage monitoring can be achieved via the reset monitoring chip; and the device's information and configuration information can be stored via the EEPROM chip.

[0112] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the scope of protection of the claims of this patent application.

Claims

1. A temperature measuring device for freezing construction of ultra-deep vertical shafts, characterized in that, The system includes a main control chip, a power management module, a sensor data acquisition module, a display module, a keyboard interface module, and a communication interface module. The power management module converts the externally input 12VDC to 5V and 3.3V, with the 3.3V supplying power to the main control chip, display module, keyboard interface module, and communication interface module, and the 5V supplying power to the sensor data acquisition module. The main control chip communicates with the sensor data acquisition module, display module, keyboard interface module, and communication interface module. The sensor data acquisition module transmits the acquired temperature data to the main control chip, which analyzes and processes the temperature data. The processed temperature data is displayed on the display module, transmitted to a PC or other centralized control system via the communication interface module, and the acquisition parameters and information are set and queried via the keyboard module.

2. The ultra-deep vertical shaft freezing construction temperature measuring device according to claim 1, characterized in that, The main control chip is an STM32F103, which has a 32-bit ARM architecture and a main frequency of 72MHz. The main control chip has embedded signal conditioning software with adaptive optimization drive function. The power management module includes a low-dropout voltage regulator circuit, a linear voltage regulator circuit, and a power filter circuit. An external 12VDC voltage is connected to the low-dropout voltage regulator circuit via interface P2. In the low-dropout voltage regulator circuit: pin 2 of interface P2 is connected to pins 1 and 5 of the adjustable low-dropout voltage regulator TPS73801 via diode D4, and pin 2 of the adjustable low-dropout voltage regulator TPS73801 outputs a 5V voltage. Pins 3 and 6 of the adjustable low-dropout voltage regulator TPS73801 are grounded. Pin 2 of the adjustable low-dropout voltage regulator TPS73801 is connected to ground via resistors R17 and R29, and also to ground via capacitors C19 and C31. Pin 4 of the adjustable low-dropout voltage regulator TPS73801 is connected to ground via resistor R29. In the linear voltage regulator circuit: the 5V output voltage of the low dropout voltage regulator circuit is connected to the input terminal of the voltage regulator chip AMS1117, and the output terminal of the voltage regulator chip AMS1117 outputs a 3.3V voltage; the 5V output voltage of the low dropout voltage regulator circuit is grounded through capacitors C35 and C37 respectively; the ground terminal of the voltage regulator chip AMS1117 is grounded; the output terminal of the voltage regulator chip AMS1117 is grounded through capacitors C38 and C36 respectively, and the output terminal of the voltage regulator chip AMS1117 is also connected to resistor R30 and light-emitting diode D3 before being grounded; The power supply filtering circuit includes a two-stage LC power supply filter circuit and a parallel capacitor filter circuit. The 3.3V output from the linear regulator circuit is first connected to the two-stage LC power supply filter circuit, and then to the parallel capacitor filter circuit. In the two-stage LC power supply filter circuit: the 3.3V output from the linear regulator circuit is connected to one end of inductor L1, and the GND ground terminal is connected to one end of inductor L3; the other end of inductor L1 is connected to node VDDA; the other end of inductor L3 is connected to node VSSA; a capacitor C is connected in parallel between node VDDA and node VSSA.

5. Connect capacitor C6; one end of node VDDA is connected to one end of inductor L2, and the other end of inductor L2 is connected to node VREF+; one end of node VSSA is connected to one end of inductor L4, and the other end of inductor L4 is connected to node VREF-; capacitors C7, C8, and C9 are connected in parallel, with one end connected to node VREF+ and the other end connected to node VREF-; in the parallel capacitor filter circuit, the 3.3V voltage is grounded after passing through the parallel capacitors C10, C11, C12, C13, and C14.

3. The temperature measuring device for freezing construction of ultra-deep vertical shafts according to claim 2, characterized in that, The sensor data acquisition module includes two or more DS18B20 temperature sensors connected in series and a strong drive circuit; the DS18B20 temperature sensors are connected to the strong drive circuit through sensor interface P5. In the strong drive circuit, 5V voltage is connected to pin 2 of transistors Q5 and Q6 respectively, and pin 2 of transistor Q7 is grounded. Pin 2 of transistor Q7 is also connected to pin 2 of sensor interface P5. Pin 1 of transistor Q5 is connected to one end of resistor R37 via resistor R36. Pin 1 of transistor Q7 is connected to one end of resistor R37 via resistor R38. The other end of resistor R37 is connected to pin 1 of sensor interface P5. Pin 1 of transistor Q6 is directly connected to pin 1 of sensor interface P5. The SENSOR_D signal terminal of pin 46 of the main control chip is connected to pin 3 of sensor interface P5. Resistor R33 is connected between pin 1 of transistor Q7 and resistor 38. One end of resistor R33 is connected to a 5V voltage; the cathode of diode D9 is connected to a 5V voltage, and the anode of diode D9 is connected to one end of resistor R37; the anode of diode D10 is grounded, and the cathode of diode D10 is connected to one end of resistor R37; the C_DOWN signal terminal of pin 41 of the main control chip is connected to pin 3 of transistor Q7 through resistor R39; the 1820_DATA signal terminal of pin 42 of the main control chip is connected to pin 1 of sensor interface P5 through resistor R37; the C_UP signal terminal of pin 43 of the main control chip is connected to pin 3 of transistor Q5 through resistor R32; the P_UP signal terminal of pin 44 of the main control chip is connected to pin 3 of transistor Q6 through resistor R34. The signal conditioning software embedded in the main control chip achieves adaptive optimization driving by polling, searching, and testing the DS18B20 temperature sensor; the adaptive optimization driving algorithm of the signal conditioning software includes the following: The parameters of the DS18B20 temperature sensor are: voltage range V min ~V max and timing range T min ~T max Through polling, searching, and testing, all successfully communicated "(voltage, timing)," i.e., (V) i ,T j The point set S of “)” is shown in equation (3); V i =V min + A*i (V min ≤V i ≤V max ) (1); T j =T min +B*j (T min ≤T j ≤T max ) (2); S={ (V i ,T j ) | Communication successful} (3); In equations (1) and (2), A is the driving voltage adjustment increment and B is the communication timing adjustment increment; i and j are variables; After obtaining the set S of all successfully communicating (voltage, timing) points corresponding to a certain temperature sensor DS18B20, an optimal driving point P (V) is selected from the set S. op T op The optimal driving parameters are stored in the EEPROM of the main control chip and used as the optimal driving parameters for future readings of the sensor temperature; the optimal driving point P(V) op T op The optimal point search algorithm is as follows: Assuming the point set S has n boundary points and m interior points, select one interior point (V... j ,T j ), calculate the interior points (V) respectively. j ,T j ) and the distance between it and all n boundary points, and then record the minimum value among them; This process is repeated to find the minimum distances between all m interior points and the n boundary points, and these minimum distances are then combined to form a set R(V). j ,T j Then, determine the maximum distance value D and its corresponding interior point (V) from this set. op ,T op ), that is, the optimal driving point P(V) op ,T op ).

4. The temperature measuring device for freezing construction of ultra-deep vertical shafts according to claim 1, characterized in that, The display module includes a display screen and a display interface P3. The display screen is connected to the display interface P3. Pin 1 of the display interface P3 is grounded, pin 2 of the display interface P3 is connected to a 3.3V voltage, pin 3 of the display interface P3 is connected to the LED_SCK signal terminal of pin 17 of the main control chip, pin 4 of the display interface P3 is connected to the LED_SDA signal terminal of pin 16 of the main control chip, and pin 5 of the display interface P3 is connected to the LED_RES signal terminal of pin 15 of the main control chip.

5. The ultra-deep vertical shaft freezing construction temperature measuring device according to claim 1, characterized in that, The keyboard interface module includes an operation keyboard and a keyboard interface P7. The operation keyboard is connected to the keyboard interface P7. Pin 1 of the keyboard interface P7 is grounded. Pins 2, 3, 4, 5, 6, 7, and 8 of the keyboard interface P7 are connected to resistors R42, R41, R40, R31, R23, R22, and R21 respectively, and then connected to a 3.3V voltage. Pin 2 of the keyboard interface P7 is connected to the OK signal terminal of pin 61 of the main control chip. Pin 3 is connected to the LEFT signal terminal of pin 60 of the main control chip; pin 4 of keyboard interface P7 is connected to the RIGHT signal terminal of pin 59 of the main control chip; pin 5 of keyboard interface P7 is connected to the UP signal terminal of pin 58 of the main control chip; pin 6 of keyboard interface P7 is connected to the DOWN signal terminal of pin 57 of the main control chip; pin 7 of keyboard interface P7 is connected to the BACK signal terminal of pin 56 of the main control chip; and pin 8 of keyboard interface P7 is connected to the MENU signal terminal of pin 55 of the main control chip.

6. The temperature measuring device for freezing construction of ultra-deep vertical shafts according to claim 1, characterized in that, The communication interface module includes an RS485 transceiver chip U1 and a communication line interface P1. The 485_RX signal terminal of pin 93 of the main control chip is connected to pin 1 of the RS485 transceiver chip U1. The 485_TX signal terminal of pin 92 of the main control chip is connected to pin 1 of transistor Q3 through resistor R5. Pin 3 of transistor Q3 is connected to pins 2 and 3 of the RS485 transceiver chip U1. Pin 2 of transistor Q3 is grounded. Pins 4 and 5 of the RS485 transceiver chip U1 are grounded. Pins 2 and 3 of the RS485 transceiver chip U1 are connected to a 5V voltage through resistor R4. Pin 8 of the RS485 transceiver chip U1 is connected to a 5V voltage. The 485_TX signal terminal of pin 92 of the main control chip is grounded through resistor R7. Pin 6 of RS485 transceiver chip U1 is grounded through resistor R3 and capacitor C1. Pin A of pin 6 of RS485 transceiver chip U1 is grounded through capacitor C2 and TVS diode T2. Pin A of pin 6 of RS485 transceiver chip U1 is connected to pin 1 of communication line interface P1 through variable resistor Res6. Pin B of pin 7 of RS485 transceiver chip U1 is grounded through resistor R8, capacitor C18, and TVS diode T3. Pin B of pin 7 of RS485 transceiver chip U1 is connected to pin 2 of communication line interface P1 through variable resistor Res10. TVS diode T1, resistor R1, and switch S1 are connected between pin A and pin B.

7. The ultra-deep vertical shaft freezing construction temperature measuring device according to claim 1, characterized in that, The temperature measuring device also includes a reset monitoring chip U8, which is an SP706 used for embedded systems, power supply voltage monitoring, and watchdog functions. Pin 2 of the reset monitoring chip U8 is connected to 3.3V, and pins 3 and 4 of the reset monitoring chip U8 are grounded. Pin 2 of the reset monitoring chip U8 is connected to the reset button S2 and then grounded. Pin 8 of the reset monitoring chip U8 is connected to the reset display LED J1 and, together with pin 7 of the reset monitoring chip U8, is connected to the nRST signal terminal of pin 14 of the main control chip. Pin 6 of the reset monitoring chip U8 is connected to the WDI signal terminal of pin 67 of the main control chip.

8. The ultra-deep vertical shaft freezing construction temperature measuring device according to claim 1, characterized in that, The temperature measuring device also includes an EEPROM chip U6, which stores the device's local information and configuration information. The SDA signal terminal of pin 51 of the main control chip is connected to pin 5 of the EEPROM chip U6, and the SCL signal terminal of pin 52 of the main control chip is connected to pin 6 of the EEPROM chip U6. Pins 5 and 6 of the EEPROM chip U6 are connected to a 3.3V voltage through resistors R28 and R19, respectively. Pins 4 and 7 of the EEPROM chip U6 are grounded. Pin 8 of the EEPROM chip U6 is grounded through capacitor C33.

9. A temperature measurement method using the temperature measurement device for freezing construction of ultra-deep vertical shafts as described in claims 1-8, characterized in that, Includes the following steps: (1) Installation: Connect the acquisition line of the temperature sensor DS18B20, connect the external 12VDC power supply line of the power management module, and connect the RS485 A and B lines of the communication interface module. (2) Start the device: After the device is started, it displays the temperature measuring device information, and then performs a self-test to connect the temperature sensor DS18B20. It stores the detected temperature sensor DS18B20 information. If the temperature sensor DS18B20 information is not detected, the temperature measuring device will cycle through the detection until a temperature sensor is detected. The temperature sensor DS18B20 information includes the number of sensors, ID number and address. (3) Temperature measurement: The device measures the temperature based on the detected temperature sensor ID number, obtains the temperature data, and then transmits the temperature data to the main control chip for analysis and processing through the strong drive circuit. The temperature value is displayed through the display module, and the main control chip monitors in real time whether the communication interface model receives the request command. If so, the collected data is sent to the PC or other centralized control system.

10. A method for temperature measurement during freezing construction of an ultra-deep vertical shaft according to claim 9, characterized in that, The device can be viewed and configured via the keyboard interface module; manual reset control, watchdog monitoring, and power supply voltage monitoring can be achieved via the reset monitoring chip; and the device's information and configuration information can be stored via the EEPROM chip.

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