Method for manufacturing display panel, display panel and display device

Abstract

The application discloses a display panel preparation method, a display panel and a display device, and mainly relates to the technical field of display. The display panel preparation method comprises the following steps: providing an array substrate and a counter substrate; a first support structure and a micro-cup barrier wall are arranged on the front surface of the array substrate; the micro-cup barrier wall forms a plurality of micro-cups, and the micro-cups are filled with light-adjusting material; an encapsulating adhesive layer is coated on the front surface of the counter substrate; the front surface of the array substrate is combined with the front surface of the counter substrate, so that the encapsulating adhesive layer is in abutment with the micro-cup barrier wall, the first support structure is in abutment with the counter substrate, and a first preset pressure is applied; and the pressure is gradually released and the encapsulating adhesive layer is solidified. Through the above design, the display effect of the display panel is improved, and the preparation yield of the display panel is improved.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a method for manufacturing a display panel, a display panel, and a display device. Background Technology

[0002] Cholesteric liquid crystal electronic paper display technology is a reflective, bistable display technology. Its core principle is to utilize the selective Bragg reflection property of cholesteric liquid crystals: under a specific molecular helical arrangement (planar state), it selectively reflects light of a specific wavelength, while light of other wavelengths passes through.

[0003] However, existing display panels may experience color bleeding during the vacuum forming process, which leads to a decrease in the display effect. Summary of the Invention

[0004] The purpose of this application is to provide a method for manufacturing a display panel, a display panel, and a display device, to improve the display effect of the display panel and increase the manufacturing yield of the display panel.

[0005] This application discloses a method for manufacturing a display panel, the method comprising the following steps: An array substrate and a pair of opposing substrates are provided. A first support structure and a microcup baffle are provided on the front side of the array substrate. The microcup baffle forms a plurality of microcups, and the microcups are filled with a dimming material. An encapsulating adhesive layer is applied to the front side of the opposing substrate; The front side of the array substrate is aligned with the front side of the opposing substrate, such that the encapsulating adhesive layer abuts against the microcup barrier, the first support structure abuts against the opposing substrate, and a first preset pressure is applied. The pressure is gradually released and the encapsulating adhesive layer is cured.

[0006] Optionally, the opposing substrate includes a first region and a second region, the first region is disposed around the second region, the first region is used to correspond to the first support structure, the second region is used to correspond to the microcup baffle, the second region includes a pixel unit region and a spacing region, the spacing region is located between two adjacent pixel unit regions, the pixel unit region corresponds to the microcup, and the spacing region corresponds to the microcup baffle. In the step of applying an encapsulating adhesive layer on the front side of the opposing substrate: The encapsulating adhesive layer is formed only in the spaced-out area.

[0007] Optionally, the opposing substrate includes a first region and a second region, the first region being disposed around the second region, the first region being used to correspond to the first support structure, and the second region being used to correspond to the microcup baffle. In the step of applying an encapsulating adhesive layer on the front side of the opposing substrate: The encapsulating adhesive layer is applied only to the entire second region.

[0008] Optionally, the second region includes a pixel unit region and a spacing region, wherein the spacing region is located between two adjacent pixel unit regions, the pixel unit region corresponds to the microcup, and the spacing region corresponds to the microcup baffle. The step of applying an encapsulating adhesive layer to the front side of the opposing substrate further includes: The encapsulating adhesive layer in the pixel unit region is cured.

[0009] Optionally, after the step of applying the encapsulating adhesive layer on the front side of the opposing substrate, the method further includes: The encapsulating adhesive layer is pre-cured.

[0010] Optionally, the step of providing an array substrate and a pair of opposing substrates, wherein a first support structure and a microcup baffle are disposed on the front side of the array substrate, the microcup baffle forming a plurality of microcups, and the microcups being filled with a dimming material includes: Provide an array substrate and a pair of opposing substrates; Microcup baffles are formed on the front side of the array substrate, and the microcup baffles form multiple microcup baffles; The microcup is filled with a dimming material.

[0011] Optionally, in the step of forming a microcup barrier on the front side of the array substrate, wherein the microcup barrier forms a plurality of microcups: The direction along the array substrate toward the opposing substrate is defined as the first direction, and the thickness of the microcup barrier gradually increases along the first direction.

[0012] This application also discloses a display panel, which includes an array substrate, a first support structure, a microcup barrier, an adhesive layer, and a counter substrate. The first support structure and the microcup barrier are both disposed on the array substrate, the counter substrate is disposed opposite to the array substrate, and the adhesive layer is located between the microcup barrier and the counter substrate.

[0013] Optionally, a first direction is defined as the direction along the array substrate toward the opposing substrate, and the thickness of the microcup barrier gradually increases along the first direction.

[0014] This application also discloses a display device, which includes a driving circuit and a display panel, wherein the driving circuit is connected to the display panel.

[0015] Compared to existing display panel manufacturing methods, the method of this application involves coating an encapsulating adhesive layer on the front side of the opposing substrate; aligning the front side of the array substrate with the front side of the opposing substrate, such that the encapsulating adhesive layer abuts against the microcup baffle, the first support structure abuts against the opposing substrate, and applying a first preset pressure; gradually releasing the pressure and curing the encapsulating adhesive layer. In this way, while gradually releasing the pressure, the encapsulating adhesive layer above the microcup baffle is not fully cured, so curing occurs simultaneously with the pressure release. The deformation of the opposing substrate causes a gap to form between the microcup baffle and the opposing substrate. The uncured encapsulating adhesive layer fills the gap and is then cured, thereby preventing capillary action between the microcup baffle and the opposing substrate, preventing liquid crystal migration within adjacent microcups, preventing color mixing, improving the display effect of the display panel, and increasing the manufacturing yield of the display panel. Attached Figure Description

[0016] The accompanying drawings, which form part of the specification, are used to provide a further understanding of the embodiments of this application and illustrate the implementation methods of this application, together with the textual description, to explain the principles of this application. Obviously, the drawings described below are merely some embodiments of this application, and those skilled in the art can obtain other drawings based on these drawings without any creative effort. In the drawings: Figure 1 This is a schematic diagram of a display device according to an embodiment of this application; Figure 2 This is a schematic flowchart of a method for manufacturing a display panel according to an embodiment of this application; Figure 3 This is a process diagram illustrating a method for manufacturing a display panel according to an embodiment of this application; Figure 4 This is a schematic diagram of a process in which the encapsulating adhesive layer is coated only on the entire surface of the second region according to an embodiment of this application; Figure 5 This is a process diagram of a microcup barrier according to an embodiment of this application; Figure 6 This is a schematic diagram of a display panel according to an embodiment of this application; Figure 7 This is a schematic diagram of another display panel according to an embodiment of this application; Figure 8 This is a schematic diagram of a microcup retaining wall according to an embodiment of this application; Figure 9 This is an enlarged schematic diagram of a microcup retaining wall according to an embodiment of this application.

[0017] Among them, 10 is a display device; 20 is a driving circuit; 30 is a display panel; 100 is an array substrate; 110 is a first support structure; 120 is a microcup barrier; 121 is a microcup; 130 is a dimming material; 200 is an opposing substrate; 210 is an encapsulating adhesive layer; 211 is a recess; 310 is a first region; 320 is a second region; 321 is a pixel unit region; 322 is a spacing region; 400 is an opening structure; and 500 is a photomask. Detailed Implementation

[0018] It should be understood that the terminology, specific structural and functional details used herein are merely for describing particular embodiments and are representative. However, this application may be implemented in many alternative forms and should not be construed as being limited to the embodiments set forth herein.

[0019] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating relative importance or implying the number of technical features indicated. Therefore, unless otherwise stated, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature; "multiple" means two or more. The term "comprising" and any variations thereof mean non-exclusive inclusion, where one or more other features, integers, steps, operations, units, components, and / or combinations thereof may be present or added.

[0020] In addition, terms such as “center,” “horizontal,” “up,” “down,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” and “outer” that indicate orientation or positional relationship are based on the orientation or relative positional relationship shown in the accompanying drawings. They are only for the purpose of simplifying the description of this application and do not indicate that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0021] Furthermore, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium, or internal connections between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0022] The present application will now be described in detail with reference to the accompanying drawings and optional embodiments.

[0023] Figure 1 This is a schematic diagram of a display device according to an embodiment of this application, as shown below. Figure 1As shown, this application discloses a display device 10, which includes a driving circuit 20 and a display panel 30, wherein the driving circuit 20 is connected to the display panel 30.

[0024] The driving circuit 20 is used to drive the display panel 30 to display images.

[0025] This application also discloses a method for manufacturing a display panel. The display panel 30 manufactured by the method can be used in the display device 10 described above. Regarding the display panel 30, this application provides the following design: Figure 2 This is a schematic flowchart illustrating a method for manufacturing a display panel according to an embodiment of this application. Figure 3 This is a process diagram illustrating a method for manufacturing a display panel according to an embodiment of this application, as shown below. Figures 2-3 As shown, this application discloses a method for manufacturing a display panel, the method comprising the steps of: S1: An array substrate and a pair of opposing substrates are provided. A first support structure and a microcup baffle are provided on the front side of the array substrate. The microcup baffle forms a plurality of microcups, and the microcups are filled with a dimming material. For example, taking the reflective color electronic paper display panel 30 as an example, the dimming material 130 includes cholesteric liquid crystal, which can reflect light of different wavelengths to achieve the display of color images.

[0026] For example, the dimming material 130 may also be black ink or electrophoretic particles.

[0027] S2: Apply an encapsulating adhesive layer to the front side of the opposing substrate; The encapsulating adhesive layer 210 includes a photocrosslinker and a photoinitiator. The photocrosslinker includes acrylates such as ethylene glycol dimethacrylate, hydroxyethyl methacrylate, and ethoxylated trimethylolpropane triacrylate; modified biopolymers such as methacrylamide gelatin (GelMA), methacrylamide hyaluronic acid (HAMA), modified hyaluronic acid, and modified mussel adhesive protein; and at least one of organosilicon materials such as polydimethylsiloxane and trimethoxysilane containing isocyanate-terminated groups. The photoinitiator includes Irgacure 2959, Irgacure 1173, Irgacure 184, LAP, TPO, and ruthenium. The photocrosslinker accounts for 10%–80% of the mass of the encapsulating adhesive layer 210, and the photoinitiator accounts for 0.5%–10% of the mass of the encapsulating adhesive layer 210; they are used after mixing.

[0028] S3: Align the front side of the array substrate with the front side of the opposing substrate, so that the encapsulating adhesive layer abuts against the microcup barrier, the first support structure abuts against the opposing substrate, and a first preset pressure is applied; By applying a first preset pressure to the back of the array substrate 100 and the back of the opposing substrate 200, the encapsulating adhesive layer 210 on the array substrate 100 can abut against the microcup barrier 120, and the first support structure 110 can abut against the opposing substrate 200.

[0029] S4: Gradually release the pressure and cure the encapsulating adhesive layer 210.

[0030] It is understood that the gradual release of pressure begins with a first preset pressure and continues for a first preset time, then continues with a second preset pressure for a second preset time, then continues with a third preset pressure for a third preset time, until no pressure is applied, and the pressure values ​​of the first preset pressure, the second preset pressure, and the third preset pressure gradually decrease.

[0031] While gradually releasing the pressure, the encapsulating adhesive layer 210 is continuously cured. The curing method can be UV light curing or heat curing.

[0032] The opposing substrate 200 includes a first region 310 and a second region 320. The first region 310 is disposed around the second region 320. The first region 310 is used to correspond to the first support structure 110, and the second region 320 is used to correspond to the microcup baffle 120.

[0033] For example, the first support structure 110 includes silicon balls, which mainly serve to support the array substrate 100 and the opposing substrate 200.

[0034] Since the process of aligning the front of the array substrate 100 with the front of the opposing substrate 200 is carried out in a vacuum environment, the height of the first support structure 110 needs to be greater than the height of the microcup baffle 120. This is to prevent atmospheric pressure from squeezing the liquid crystal at the edge of the display panel 30 after the alignment of the front of the array substrate 100 with the front of the opposing substrate 200 is completed, causing the liquid crystal at the edge of the display panel 30 to gather towards the center of the screen.

[0035] Typically, the height of the first support structure 110 is 0.5µm to 1µm greater than the height of the microcup baffle 120. This results in a gap between the microcup baffle 120 and the opposing substrate 200 before the cell is pressurized. When the front side of the array substrate 100 and the front side of the opposing substrate 200 are pressurized in a vacuum environment, the pressure forces the opposing substrate 200 to deform and squeeze the microcup baffle 120. After the cell is assembled, the pressure is released. With prolonged use, the deformation of the opposing substrate 200 will recover, causing the microcup baffle 120 and the opposing substrate 200 to separate, resulting in capillary action where the dimming material 130 is drawn out. This causes the dimming material 130 of the two adjacent microcups 121 to migrate, resulting in color mixing.

[0036] The thickness of the encapsulating adhesive layer 210 is equal to the thickness of the first support structure 110 minus the thickness of the microcup baffle 120 plus the tolerance of the microcup baffle 120 of 1µm, thereby ensuring that the encapsulating adhesive layer 210 can be connected to the microcup baffle 120.

[0037] Compared to existing display panel manufacturing methods, the method of this application involves coating an encapsulating adhesive layer 210 on the front side of the opposing substrate 200; aligning the front side of the array substrate 100 with the front side of the opposing substrate 200, such that the encapsulating adhesive layer 210 abuts against the microcup barrier 120, and the first support structure 110 abuts against the opposing substrate 200, while applying a first preset pressure; gradually releasing the pressure and curing the encapsulating adhesive layer 210, thus, as the pressure is gradually released, the microcup barrier 120… The encapsulating adhesive layer 210 above 0 is not fully cured, so it is cured while the pressure is gradually released. The deformation of the opposing substrate 200 causes a gap to form between the microcup baffle 120 and the opposing substrate 200. The uncured encapsulating adhesive layer 210 will fill the gap and then be cured, thereby avoiding the formation of capillary phenomena between the microcup baffle 120 and the opposing substrate 200, preventing the migration of liquid crystal in adjacent microcups 121, avoiding color crosstalk, improving the display effect of the display panel 30, and increasing the manufacturing yield of the display panel 30.

[0038] S2: After the step of applying an encapsulating adhesive layer on the front side of the opposing substrate, the method further includes: S21: Pre-cure the encapsulating adhesive layer.

[0039] For example, the pre-curing UV irradiation is 10mJ~50mJ for 10min~40min. This results in the encapsulating adhesive layer 210 reaching a viscosity of 2000cps~20000cps. By pre-curing the encapsulating adhesive layer 210, its viscosity is increased, preventing it from falling into the liquid crystal inside the microcup 121.

[0040] Since the encapsulating adhesive layer 210 is only used to connect the microcup barrier 120 and the opposing substrate 200, the encapsulating adhesive layer 210 can be formed only on top of the microcup barrier 120 by printing. Specifically: The opposing substrate 200 includes a first region 310 and a second region 320. The first region 310 is disposed around the second region 320. The first region 310 is used to correspond to the first support structure 110. The second region 320 is used to correspond to the microcup barrier 120. The second region 320 includes a pixel unit region 322 and a spacing region 322. The spacing region 322 is located between two adjacent pixel unit regions 322. The pixel unit region 322 corresponds to the microcup 121, and the spacing region 322 corresponds to the microcup barrier 120.

[0041] In the step of applying the encapsulating adhesive layer on the front side of the opposing substrate 200 in S2, the encapsulating adhesive layer 210 is formed only in the interval region 322.

[0042] For example, the width of the interval region 322 is greater than the width of the microcup barrier 120.

[0043] By forming the encapsulating adhesive layer 210 only in the spacing region 322, the encapsulating adhesive layer 210 can be precisely applied to the area where the microcup barrier 120 and the opposing substrate 200 need to be connected, thus avoiding the situation where the encapsulating adhesive layer 210 contaminates the cholesteric liquid crystal in the microcup 121 corresponding to the pixel unit region 322.

[0044] Moreover, this method of applying the encapsulating adhesive layer 210 only in the interval area 322 can avoid the interference of the encapsulating adhesive layer 210 with light, reduce the scattering and absorption of light, thereby improving the contrast and clarity of the display panel 30 and further enhancing the display effect.

[0045] Figure 4 This is a schematic diagram of a process in which the encapsulating adhesive layer is coated only on the entire second region, according to an embodiment of this application. Figure 4 As shown, the encapsulating adhesive layer 210 can also be coated on the entire surface of the second region 320. Specifically, the opposing substrate 200 includes a first region 310 and a second region 320. The first region 310 is arranged around the second region 320. The first region 310 is used to correspond to the first support structure 110, and the second region 320 is used to correspond to the microcup barrier 120.

[0046] In step S2: applying an encapsulating adhesive layer to the front side of the opposing substrate: The encapsulating adhesive layer 210 is applied only to the entire surface of the second region 320.

[0047] Compared to the solution of forming the encapsulating adhesive layer 210 only in the interval region 322, the solution of coating the encapsulating adhesive layer 210 only on the entire surface of the second region 320 is simpler in terms of process.

[0048] The second region 320 includes a pixel unit region 322 and a spacing region 322. The spacing region 322 is located between two adjacent pixel unit regions 322. The pixel unit region 322 corresponds to the microcup 121, and the spacing region 322 corresponds to the microcup barrier 120.

[0049] To prevent the encapsulating adhesive layer 210 in the pixel unit region 322 from affecting the cholesteric liquid crystal within the microcup 121, S2: after the step of applying the encapsulating adhesive layer on the front side of the opposing substrate, the method further includes: S21: The encapsulating adhesive layer in the pixel unit region is cured.

[0050] In simple terms, it involves curing the encapsulating adhesive layer 210 in the pixel unit region 322 so that the encapsulating adhesive layer 210 is completely cured within the pixel unit region 322.

[0051] For example, the encapsulating adhesive layer 210 of the pixel unit region 322 can be completely cured by setting a photomask 500 and then illuminating it.

[0052] Once the encapsulating adhesive layer 210 within the pixel unit region 322 has fully cured, it can further ensure that the cholesteric liquid crystal within the microcup 121 is not affected by subsequent processes or external factors.

[0053] Moreover, and more importantly, the encapsulating adhesive layer 210 cured within the pixel unit region 322 can better achieve the connection function between the microcup barrier 120 and the opposing substrate 200, stabilizing the structure of the display panel 30. That is, during cell assembly, the cured encapsulating adhesive layer 210 can abut against and limit the movement of the inner wall of the microcup barrier 120.

[0054] Figure 5 This is a schematic diagram of the manufacturing process of a microcup baffle according to an embodiment of this application, as shown below. Figure 5 As shown, step S1: providing an array substrate and a pair of opposing substrates, wherein a first support structure and a microcup baffle are disposed on the front side of the array substrate, the microcup baffle forming a plurality of microcups, and the step of filling the microcups with a dimming material includes: S11: Provides an array substrate and a pair of opposing substrates; S12: A microcup barrier is formed on the front side of the array substrate, and the microcup barrier forms a plurality of microcups; S13: Fill the microcup with a dimming material.

[0055] In step S12: after forming a microcup barrier on the front side of the array substrate 0, and after forming a plurality of microcups, the method further includes: S121: A first support structure is formed on the front side of the array substrate; For example, the first support structure 110 is mixed in the frame adhesive and then applied to the front side of the array substrate 100 at the position corresponding to the first region 310.

[0056] The first support structure 110 provides stable support for the entire structure during subsequent processes such as cell alignment, preventing unevenness in the distance between the array substrate 100 and the opposing substrate 200 due to external forces or process operations.

[0057] In step S2: forming a microcup barrier on the front side of the array substrate, wherein the microcup barrier forms multiple microcups: The direction along the array substrate toward the opposing substrate is defined as the first direction, and the thickness of the microcup barrier gradually increases along the first direction.

[0058] That is, by setting the microcup baffle 120 into an inverted trapezoidal shape, a strong tenon and mortise structure is formed at the position of the microcup baffle 120 and the encapsulating adhesive layer 210, which helps to enhance the bonding force between the microcup baffle 120 and the array substrate 100. The microcup baffle 120 can be more firmly attached to the array substrate 100. Moreover, when the pressure is gradually released, the connection area between the inverted trapezoidal microcup baffle 120 and the encapsulating adhesive layer 210 is larger, which can prevent the microcup baffle 120 and the encapsulating adhesive layer 210 from breaking off.

[0059] Figure 6 This is a schematic diagram of a display panel according to an embodiment of this application. Figure 7 This is another schematic diagram of a display panel according to an embodiment of this application, combined with... Figure 6 and Figure 7 As shown, this application also discloses a display panel 30, characterized in that the display panel 30 includes an array substrate 100, a first support structure 110, a microcup barrier 120, an adhesive layer, and an opposing substrate 200. The first support structure 110 and the microcup barrier 120 are both disposed on the array substrate 100, the opposing substrate 200 is disposed opposite to the array substrate 100, and the adhesive layer is located between the microcup barrier 120 and the opposing substrate 200.

[0060] The display panel 30 of this application is constructed by coating an encapsulating adhesive layer 210 on the front side of the opposing substrate 200; aligning the front side of the array substrate 100 with the front side of the opposing substrate 200, such that the encapsulating adhesive layer 210 abuts against the microcup barrier 120, and the first support structure 110 abuts against the opposing substrate 200, and applying a first preset pressure; gradually releasing the pressure and curing the encapsulating adhesive layer 210, so that when the pressure is gradually released, the encapsulating adhesive layer 210 above the microcup barrier 120... Since the microcup 10 is not fully cured, it is cured while the pressure is gradually released. The deformation of the opposing substrate 200 causes a gap to form between the microcup baffle 120 and the opposing substrate 200. The uncured encapsulating adhesive layer 210 will fill the gap and then be cured, thereby avoiding the formation of capillary phenomena between the microcup baffle 120 and the opposing substrate 200, preventing the migration of liquid crystals in adjacent microcups 121, avoiding color crosstalk, improving the display effect of the display panel 30, and increasing the manufacturing yield of the display panel 30.

[0061] See Figure 6 As shown, the encapsulating adhesive layer 210 in the display panel 30 is only above the microcup barrier 120. That is, the opposing substrate 200 includes a first region 310 and a second region 320. The first region 310 is arranged around the second region 320. The first region 310 is used to correspond to the first support structure 110, and the second region 320 is used to correspond to the microcup barrier 120. The second region 320 includes a pixel unit region 322 and a spacing region 322. The spacing region 322 is located between two adjacent pixel unit regions 322. The pixel unit region 322 corresponds to the microcup 121, and the spacing region 322 corresponds to the microcup barrier 120. The encapsulating adhesive layer 210 is only within the spacing region 322.

[0062] See Figure 7 The encapsulating adhesive layer 210 in the display panel 30 is only above the microcup baffle 120 and the microcup 121. That is, the opposing substrate 200 includes a first region 310 and a second region 320. The first region 310 is arranged around the second region 320. The first region 310 is used to correspond to the first support structure 110, and the second region 320 is used to correspond to the microcup baffle 120. The encapsulating adhesive layer 210 is only in the second region 320.

[0063] Figure 8 This is a schematic diagram of a microcup retaining wall according to an embodiment of this application. Figure 9 This is an enlarged schematic diagram of a microcup baffle wall according to an embodiment of this application, combined with... Figure 8 and Figure 9As shown, the direction along the array substrate 100 toward the opposing substrate 200 is defined as the first direction, and the thickness of the microcup barrier 120 gradually increases along the first direction.

[0064] By setting the microcup baffle 120 in an inverted trapezoidal shape, a strong tenon-and-mortise structure is formed at the position of the microcup baffle 120 and the cured encapsulating adhesive layer 210. That is, after curing, the encapsulating adhesive layer 210 forms an opening structure 400 that is wider at the top and narrower at the bottom at the position corresponding to the microcup baffle 120. The inner wall of the opening structure 400 abuts against the outer wall of the microcup baffle 120, thereby helping to enhance the bonding force between the microcup baffle 120 and the array substrate 100. The microcup baffle 120 can be more firmly attached to the array substrate 100. Moreover, when the pressure is gradually released, the connection area between the inverted trapezoidal microcup baffle 120 and the encapsulating adhesive layer 210 is larger, which can prevent the microcup baffle 120 and the encapsulating adhesive layer 210 from breaking off.

[0065] For example, see Figure 6 In the display panel 30 where the encapsulating adhesive layer 210 is formed only in the interval region 322, the two sides of the encapsulating layer are recessed inward to form recesses 211.

[0066] It should be noted that the limitations on each step involved in this solution are not considered as limiting the order of steps, provided that they do not affect the implementation of the specific solution. The steps listed first can be executed first, later, or even simultaneously. As long as this solution can be implemented, it should be considered to fall within the scope of protection of this application.

[0067] It should be noted that the inventive concept of this application can form many embodiments, but due to the limited space of the application documents, they cannot all be listed. Therefore, without conflict, the embodiments described above or the technical features can be arbitrarily combined to form new embodiments. After the embodiments or technical features are combined, the original technical effect will be enhanced.

[0068] The above description, in conjunction with specific optional embodiments, provides a further detailed explanation of this application and should not be construed as limiting the specific implementation of this application to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of this application, and all such modifications or substitutions should be considered within the scope of protection of this application.

Claims

1. A method for manufacturing a display panel, characterized in that, The method for manufacturing the display panel includes the following steps: An array substrate and a pair of opposing substrates are provided. A first support structure and a microcup baffle are provided on the front side of the array substrate. The microcup baffle forms a plurality of microcups, and the microcups are filled with a dimming material. An encapsulating adhesive layer is applied to the front side of the opposing substrate; The front side of the array substrate is aligned with the front side of the opposing substrate, such that the encapsulating adhesive layer abuts against the microcup barrier, the first support structure abuts against the opposing substrate, and a first preset pressure is applied. The pressure is gradually released and the encapsulating adhesive layer is cured.

2. The method for manufacturing a display panel according to claim 1, characterized in that, The opposing substrate includes a first region and a second region. The first region surrounds the second region. The first region corresponds to the first support structure, and the second region corresponds to the microcup baffle. The second region includes a pixel unit region and a spacing region. The spacing region is located between two adjacent pixel unit regions. The pixel unit region corresponds to the microcup, and the spacing region corresponds to the microcup baffle. In the step of applying an encapsulating adhesive layer on the front side of the opposing substrate: The encapsulating adhesive layer is formed only in the spaced-out area.

3. The method for manufacturing a display panel according to claim 1, characterized in that, The opposing substrate includes a first region and a second region, the first region is arranged around the second region, the first region is used to correspond to the first support structure, and the second region is used to correspond to the microcup baffle. In the step of applying an encapsulating adhesive layer on the front side of the opposing substrate: The encapsulating adhesive layer is applied only to the entire second region.

4. The method for manufacturing a display panel according to claim 3, characterized in that, The second region includes a pixel unit region and a spacing region. The spacing region is located between two adjacent pixel unit regions. The pixel unit region corresponds to the microcup, and the spacing region corresponds to the microcup barrier. The step of applying an encapsulating adhesive layer to the front side of the opposing substrate further includes: The encapsulating adhesive layer in the pixel unit region is cured.

5. The method for manufacturing a display panel according to claim 1, characterized in that, The step of applying an encapsulating adhesive layer to the front side of the opposing substrate further includes: The encapsulating adhesive layer is pre-cured.

6. The method for manufacturing a display panel according to claim 1, characterized in that, The step of providing an array substrate and a pair of opposing substrates, wherein a first support structure and a microcup baffle are disposed on the front side of the array substrate, the microcup baffle forming a plurality of microcups, and the microcups being filled with a dimming material includes: Provide an array substrate and a pair of opposing substrates; Microcup baffles are formed on the front side of the array substrate, and the microcup baffles form multiple microcup baffles; The microcup is filled with a dimming material.

7. The method for manufacturing a display panel according to claim 6, characterized in that, In the step of forming a microcup barrier on the front side of the array substrate, wherein the microcup barrier forms a plurality of microcups: The direction along the array substrate toward the opposing substrate is defined as the first direction, and the thickness of the microcup barrier gradually increases along the first direction.

8. A display panel, characterized in that, The display panel is manufactured by the method of any one of claims 1-7. The display panel includes an array substrate, a first support structure, a microcup barrier, an encapsulation layer, and an opposing substrate. The first support structure and the microcup barrier are both disposed on the array substrate. The opposing substrate is disposed opposite to the array substrate. The encapsulation layer is located between the microcup barrier and the opposing substrate.

9. The display panel according to claim 8, characterized in that, The direction along the array substrate toward the opposing substrate is defined as the first direction, and the thickness of the microcup barrier gradually increases along the first direction.

10. A display device, characterized in that, The display device includes a driving circuit and a display panel as described in claims 1-7, wherein the driving circuit is connected to the display panel.

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