High frequency module and communication device

By employing a combined structure of mounting substrate, elastic wave filter, metal block, resin layer and shielding layer in the high-frequency module, the problem of insufficient shielding is solved, better shielding and heat dissipation are achieved, the filter characteristics are stabilized, and the overall performance of the communication device is improved.

CN122178930APending Publication Date: 2026-06-09MURATA MFG CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
MURATA MFG CO LTD
Filing Date
2021-06-30
Publication Date
2026-06-09

AI Technical Summary

Technical Problem

The shielding in existing high-frequency modules and communication devices is insufficient and difficult to improve effectively.

Method used

The system employs a combination structure consisting of a mounting substrate, an elastic wave filter, a metal block, a resin layer, and a shielding layer. The metal block is in contact with the shielding layer, the resin layer covers the outer periphery of the elastic wave filter and the metal block, and the shielding layer covers the resin layer and the metal block, achieving full coverage.

Benefits of technology

It improves the shielding and heat dissipation of the high-frequency module, stabilizes the temperature characteristics of the elastic wave filter, suppresses the characteristic degradation between filters, and enhances the overall performance of the communication device.

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  • Figure CN122178930A_ABST
    Figure CN122178930A_ABST
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Abstract

This invention relates to a high-frequency module and a communication device, achieving improved shielding. The high-frequency module (100) comprises: a mounting substrate (9), an elastic wave filter (1), a metal block (3), a resin layer (5), and a shielding layer (6). The mounting substrate (9) has a first main surface (91) and a second main surface (92) facing each other, and a ground layer (94). The elastic wave filter (1) is mounted on the first main surface (91) of the mounting substrate (9). The metal block (3) is disposed on the first main surface (91) of the mounting substrate (9) and connected to the ground layer (94). The resin layer (5) is disposed on the first main surface (91) of the mounting substrate (9) and covers the outer peripheral surface (13) of the elastic wave filter (1) and the outer peripheral surface (33) of the metal block (3). The shielding layer (6) covers the resin layer (5), the metal block (3), and the main surface (12) of the elastic wave filter (1) opposite to the side of the mounting substrate (9). The metal block (3) is in contact with the shielding layer (6).
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