Preparation process of aluminum foil-based copper-clad plate for printed circuit board

By combining magnetic nanoparticle synthesis and bio-enzyme degradation technology with laser cladding and vacuum pressurization processes, the problems of uneven film layer and weak adhesion in the preparation of aluminum foil-based copper clad laminates have been solved, realizing a multi-layer gradient structure with high thermal conductivity, high insulation and high thermal stability, meeting the requirements of high-precision manufacturing.

CN122179985APending Publication Date: 2026-06-09GUANGDONG CHENGYUE NEW MATERIAL TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
GUANGDONG CHENGYUE NEW MATERIAL TECH CO LTD
Filing Date
2026-03-31
Publication Date
2026-06-09

AI Technical Summary

Technical Problem

The existing manufacturing process for aluminum foil-based copper clad laminates for printed circuit boards suffers from problems such as uneven film layers, cracking of heat-sealed holes, weak adhesion, poor heat resistance of PET/PI polymer substrate materials, high impurity content in ceramic powders, and poor sintering activity, making it difficult to meet the manufacturing requirements of high precision and high production efficiency.

Method used

By employing the synergistic effect of magnetic nanoparticle synthesis, functionalization modification, and bio-enzyme-directed degradation, highly magnetically responsive nanoparticles are synthesized through hydrothermal coupling technology. The surface is coated with a silica-polyacrylic acid bilayer to enhance the adsorption capacity of noble metal ions. The stability of the system is improved by using tea polyphenol green dispersant. Combined with laser cladding, vacuum pressurization, and annealing processes, a multi-layer gradient structure is formed.

Benefits of technology

It improves the surface activity and adhesion of the aluminum substrate, enhances the coating adhesion of the copper foil, reduces interfacial porosity and residual stress, improves the density and functional properties of the composite copper plate, and achieves high thermal conductivity, insulation and high thermal stability to meet diverse application needs.

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Abstract

This invention relates to the field of circuit board technology, specifically to a process for preparing an aluminum foil-based copper-clad laminate for printed circuit boards. The process involves immersing copper foil in a sulfuric acid solution to form activated copper foil, preparing a co-deposition solution, placing the activated copper foil in the co-deposition solution to obtain a composite-plated copper foil, and grafting the composite-plated copper foil to obtain a reinforced copper foil. In this invention, the aluminum substrate is laser-clad to introduce boron nitride and nanodiamonds, improving its hardness and thermal conductivity. The copper foil undergoes co-deposition of a nanodiamond gradient layer and silane grafting to enhance the coating adhesion and surface activity. Vacuum pressurization and annealing processes reduce interfacial porosity and residual stress, increasing the density of the composite copper plate. The active paste promotes chemical bonding between the aluminum substrate and the copper foil. Laser scanning achieves precise and efficient local connections, avoiding thermal damage. The final product possesses high thermal conductivity, high insulation, high thermal stability, and strong interfacial adhesion.
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