Method for manufacturing a substrate and display panel

Abstract

This application belongs to the field of display technology, specifically relating to a method for fabricating a substrate and a display panel. The method includes providing a substrate, forming an electrode layer on the substrate, the electrode layer including at least one driving electrode; fabricating a hydrophobic layer on the surface of the substrate with the electrode layer; configuring the driving electrode to connect to a driving circuit; applying a voltage to a selected driving electrode according to a target pattern, causing a corresponding area on the hydrophobic layer to become a hydrophilic area, thereby forming a hydrophilic pattern; and delivering a functional material solution to the substrate surface via a microfluidic chip, causing the functional material solution to adsorb onto the hydrophilic pattern, thus obtaining a patterned target substrate. This application, by applying voltage to the substrate and allowing solution adsorption, produces a patterned substrate, reducing the process cost of display panel manufacturing and improving the material utilization rate in the display panel patterning process.

Description

Technical Field

[0001] This application belongs to the field of display technology, specifically relating to a method for preparing a substrate and a display panel. Background Technology

[0002] With the development of display technology, the patterning process for display panels is also constantly evolving, moving towards greater precision and efficiency. Display panel patterning refers to the process of using technical means to etch precise circuit or electrode patterns onto a glass substrate or other base material during the manufacturing of a display screen, in order to achieve the desired application.

[0003] In the manufacturing process of display panels, lithography machines and photomasks are mainly used for patterning. During lithography, photoresist and other functional materials need to be removed through development, resulting in low utilization of evaporated materials and resource waste. Furthermore, the process and equipment costs of using lithography machines and photomasks for the entire patterning process are high, and the processing size of lithography machines is limited, leading to low adaptability and versatility of display panels.

[0004] Therefore, how to improve the material utilization rate of the display panel patterning process while reducing process costs is an urgent problem to be solved in this application. Summary of the Invention

[0005] This application provides a method for preparing a substrate and a display panel, aiming to solve the problem of improving the material utilization rate of display panel patterning while reducing process costs.

[0006] In a first aspect, this application provides a method for preparing a substrate, comprising:

[0007] A substrate is provided, and an electrode layer is formed on the substrate, the electrode layer including at least one driving electrode; A hydrophobic layer is prepared on the surface of a substrate on which an electrode layer is formed; The driving electrode is configured to be connected to the driving circuit. A voltage is applied to the selected driving electrode according to the target pattern, so that the corresponding area on the hydrophobic layer becomes a hydrophilic area to form a hydrophilic pattern. A functional material solution is delivered to the substrate surface using a microfluidic chip, allowing the solution to be adsorbed onto the hydrophilic pattern, thus obtaining a patterned target substrate.

[0008] Optionally, the driving electrode is configured to be connected to the driving circuit, and a voltage is applied to the selected driving electrode according to the target pattern, including: Connect the driving electrode of the electrode layer to the driving circuit, and select the target driving electrode according to the target pattern; After applying an activation voltage to the target driving electrode, a first driving voltage lasting for a first time, a second driving voltage lasting for a second time, and a third driving voltage lasting for a third time are sequentially applied to the target driving electrode.

[0009] Optionally, Functional material solutions are delivered to the substrate surface via a microfluidic chip, allowing the functional material solutions to adsorb onto the hydrophilic pattern, including: The functional material solution is delivered to the substrate surface using a microfluidic chip, so that the substrate is immersed in the functional material solution; A fourth driving voltage is applied to the selected driving electrode through the driving circuit, causing the functional material solution to be adsorbed onto the hydrophilic pattern.

[0010] Optionally, after the functional material solution is adsorbed onto the hydrophilic pattern, the method further includes: The substrate is dried and baked to solidify the hydrophilic pattern, resulting in a patterned target substrate.

[0011] Optionally, the substrate includes a color filter substrate or an array substrate; When the substrate is a color filter substrate, the driving electrode is a common electrode, and the functional material solution is a first functional material solution; When the substrate is an array substrate, the driving electrode is a pixel electrode, and the functional material solution is a second functional material solution.

[0012] Optionally, when the substrate is a color filter substrate, the target pattern includes a black matrix image, a red subpixel image, a green subpixel pattern, a blue subpixel image, and an optically transparent adhesive layer pattern. The first functional material solution includes a black matrix functional material solution, a red quantum dot conversion functional material solution, a green quantum dot conversion functional material solution, a blue quantum dot conversion functional material solution, and an optically transparent adhesive layer functional material solution.

[0013] Optionally, before obtaining the patterned target substrate, the method further includes: Main pillars and auxiliary pillars are formed on the color filter substrate; After obtaining the patterned target substrate, the method further includes: The target substrate and the polarizer are spliced ​​together to obtain the target color filter substrate.

[0014] Optionally, when the substrate is an array substrate, the target pattern includes an alignment layer pattern and a polarization layer pattern; The second functional material solution includes a first colored resin solution corresponding to the alignment layer pattern and a second colored resin solution corresponding to the polarization layer pattern; wherein the first colored resin solution and the second colored resin solution are different.

[0015] Optionally, the substrate is a glass substrate or a flexible polyimide substrate; When the substrate is a flexible polyimide substrate, the hole injection layer, the light-emitting layer and the electron transport layer are sequentially prepared by an electrowetting deposition process.

[0016] Secondly, this application provides a display panel, the display panel comprising: A color filter substrate prepared according to any one of the methods described in the first aspect of the invention; And an array substrate prepared by any one of the methods described in the first aspect of the invention; The first substrate and the second substrate are arranged in a box.

[0017] The technical solution provided in this application has at least the following beneficial effects: This application utilizes an external driving circuit to apply a driving voltage to the driving electrodes in a time-division manner, causing hydrophilic regions corresponding to the target pattern to appear on the hydrophobic layer of the substrate. This fixes the position of the target pattern and precisely positions it, improving the accuracy of patterning. The substrate is immersed in a functional material solution, and a microfluidic chip successfully delivers the solution to the hydrophilic regions, allowing for successful adsorption and formation of the target pattern. This improves material utilization and avoids resource waste. Through hydrophobic layer deposition, voltage driving, and solution adsorption in the entire substrate fabrication process, successful substrate patterning is achieved. These steps simplify the substrate fabrication process, reduce costs, and streamline the traditional photolithography patterning process, lowering equipment operating costs. Furthermore, the fabricated substrate has no size requirements, improving the versatility of display panels. Attached Figure Description

[0018] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure. It is obvious that the drawings described below are merely some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort.

[0019] Figure 1 The diagram shown is a flowchart of a substrate fabrication method provided in an embodiment of this application. Figure 1 ; Figure 2 The diagram shown is a flowchart of a substrate fabrication method provided in an embodiment of this application. Figure 2 ; Figure 3 The diagram shown is a flowchart of a substrate fabrication method provided in an embodiment of this application. Figure 3 ; Figure 4This is a schematic diagram of voltage driving provided in an embodiment of this application; Figure 5 The diagram shown is a flowchart of a substrate fabrication method provided in an embodiment of this application. Figure 4 ; Figure 6 A schematic diagram of the electrowetting patterning process of the red sub-pixel provided in an embodiment of this application; Figure 7 This is a schematic diagram of the structure of the display panel provided in an embodiment of this application; Figure 8 This is a schematic diagram of the manufacturing process of the display panel provided in an embodiment of this application.

[0020] Explanation of reference numerals in the attached figures: 600, Color filter substrate; 610, Red quantum dot conversion functional material solution; 620, Hydrophobic layer; 630, Hydrophilic region; 640, Black matrix; 650, Red sub-pixel; 660, Green sub-pixel; 670, Blue sub-pixel; 680, Optically transparent adhesive layer; 690, Polarizing film; 691, Isolation pillar; 700, Display panel; 710, Liquid crystal; 720, Array substrate; 721, Alignment layer; 822, Polarizing layer; 730, Printed circuit board assembly; 740, Chip-on film; 750, Backlight module. Detailed Implementation

[0021] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided to make this application more comprehensive and complete, and to fully convey the concept of the exemplary embodiments to those skilled in the art.

[0022] Furthermore, the described features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. Numerous specific details are provided in the following description to give a thorough understanding of embodiments of this application. However, those skilled in the art will recognize that the technical solutions of this application can be practiced without one or more of the specific details, or other methods, components, apparatuses, steps, etc., can be employed. In other instances, well-known methods, apparatuses, implementations, or operations are not shown or described in detail to avoid obscuring various aspects of this application.

[0023] The present application will now be described in further detail with reference to the accompanying drawings and specific embodiments. It should be noted that the technical features involved in the various embodiments described below can be combined with each other as long as they do not conflict with each other. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present application, and should not be construed as limiting the present application.

[0024] To facilitate a clear description of the technical solutions in the embodiments of this application, some terms and technologies involved in the embodiments of this application will be briefly introduced below: Flexible polyimide (PI) substrate: a type of circuit board that can be bent and folded, with polyimide film as the insulating substrate and coated with conductive materials such as copper foil.

[0025] Black Matrix (BM): A mesh-like light-shielding layer located inside the color filter of a liquid crystal display. It is typically made of a mixture of resin and black pigment or metal, and is fabricated into an opaque, fine mesh structure. In this application, it may be simply referred to as BM.

[0026] Spin coating is a process that uses centrifugal force to rapidly prepare ultrathin, uniform films on a flat substrate.

[0027] Polydimethylsiloxane (PDMS) microfluidic chip: The PDMS microfluidic chip is a miniaturized fluid manipulation platform based on a flexible polymer. It achieves precise control of liquids from nano-scale to micro-scale through a micron-level channel network.

[0028] Bonding Chip On Film: Through high-precision hot pressing and material bonding, the display driver chip is fixed on the flexible thin film circuit, and the flexible thin film circuit is connected to the display panel through bonding process to form a complete display module.

[0029] Printed Circuit Board Assembly (PCBA): A finished carrier board on which electronic components are assembled onto a bare printed circuit board through a soldering process. It is the core functional carrier of most electronic devices. In this application, it is referred to as PCBA.

[0030] In this application, the electrowetting patterning and electrowetting deposition processes are the same steps and have the same effect.

[0031] With the development of display technology, the application scenarios of displays are becoming more and more extensive, suitable for industrial equipment, home appliances or higher precision applications. Display panels have become the interactive windows for perceiving corresponding scenes, and their importance is self-evident.

[0032] The manufacturing of display panels is a complex process that integrates semiconductor technology, materials, and engineering. Among these processes, patterning of the display panel is the most important, and its fabrication is mostly achieved using photolithography machines and photomasks.

[0033] Traditional photolithography involves pre-coating photoresist, exposing the image using a pre-designed photomask, developing the image through development, and finally transferring the image onto the display panel through etching using a photolithography machine.

[0034] However, traditional photolithography requires expensive equipment and photomasks, resulting in high operating costs. During the photolithography process, most of the photoresist and functional materials need to be removed through development, leading to low material utilization during evaporation. Inkjet printing also results in solution waste and low material utilization. The photolithography process involves multiple exposures, development, and etching steps, making the process complex.

[0035] Therefore, how to improve the material utilization rate of the display panel patterning process while reducing process costs is an urgent problem to be solved in this application.

[0036] Based on this, this application provides a method for preparing a substrate and a display panel, which can be used in the field of display technology and aims to solve the above-mentioned technical problems.

[0037] In a first aspect, this application provides a method for preparing a substrate, specifically including the following embodiments: Figure 1 The diagram shown is a flowchart of a substrate fabrication method provided in an embodiment of this application. Figure 1 ,like Figure 1 As shown, the substrate fabrication method includes: S101. A substrate is provided, and an electrode layer is formed on the substrate, the electrode layer including at least one driving electrode.

[0038] Specifically, the substrate includes a color filter substrate and an array substrate. The substrate is then cleaned.

[0039] When the substrate is a color filter substrate, an electrode layer (common electrode layer) is formed on the color filter substrate.

[0040] When the substrate is an array substrate, an electrode layer (pixel electrode layer) is formed on the array substrate.

[0041] S102. Prepare a hydrophobic layer on the surface of the substrate on which the electrode layer is formed.

[0042] Specifically, a hydrophobic layer is deposited on the entire surface of the substrate where the electrode layer is formed by spin coating.

[0043] The hydrophobic layer refers to the hydrophobic insulating layer of perfluoropolymer material (Cytop) or other fluoropolymers.

[0044] The thickness of the hydrophobic layer is 1 to 3 μm.

[0045] S103. Configure the driving electrode to be connected to the driving circuit, apply voltage to the selected driving electrode according to the target pattern, so that the corresponding area on the hydrophobic layer becomes a hydrophilic area to form a hydrophilic pattern.

[0046] Specifically, a target driving electrode is selected based on the target pattern and activated. The first driving voltage, the second driving voltage, and the third driving voltage indicated by the target pattern are applied in a time-division manner, so that the region corresponding to the hydrophobic layer becomes a hydrophilic region, forming a hydrophilic pattern.

[0047] When the substrate is a color filter substrate, the target pattern includes a black matrix image, a red subpixel image, a green subpixel image, a blue subpixel image, and an optically transparent adhesive layer pattern.

[0048] When the target pattern is indicated as a black matrix image, the driving electrode corresponding to the black matrix image is connected to the driving circuit. First, the driving electrode corresponding to the black matrix image is activated by an activation voltage, and then a first driving voltage, a second driving voltage, and a third driving voltage are applied sequentially, causing the region corresponding to the black matrix image on the hydrophobic layer to become a hydrophilic region, forming a hydrophilic pattern. The first and third driving voltages can be 18V, and the second driving voltage can be 0V.

[0049] Similarly, when the target pattern indicates a red sub-pixel image, the driving electrode corresponding to the red sub-pixel image is connected to the driving circuit. First, the driving electrode corresponding to the red sub-pixel image is activated by an activation voltage, and then a first driving voltage, a second driving voltage, and a third driving voltage are applied time-divisionally, causing the region corresponding to the red sub-pixel image on the hydrophobic layer to become a hydrophilic region, forming a hydrophilic pattern corresponding to the red sub-pixel image. The first and third driving voltages can be 17V, and the second driving voltage can be 0V.

[0050] Similarly, when the target pattern indicates a green subpixel image, the driving electrode corresponding to the green subpixel image is connected to the driving circuit. First, the driving electrode corresponding to the green subpixel image is activated by an activation voltage, and then a first driving voltage, a second driving voltage, and a third driving voltage are applied time-divisionally, causing the region corresponding to the green subpixel image on the hydrophobic layer to become a hydrophilic region, forming a hydrophilic pattern corresponding to the green subpixel image. The first and third driving voltages can be 16V, and the second driving voltage can be 0V.

[0051] Similarly, when the target pattern indicates a blue sub-pixel image, the driving electrode corresponding to the blue sub-pixel image is connected to the driving circuit. First, the driving electrode corresponding to the blue sub-pixel image is activated by an activation voltage, and then a first driving voltage, a second driving voltage, and a third driving voltage are applied time-divisionally, causing the region corresponding to the blue sub-pixel image on the hydrophobic layer to become a hydrophilic region, forming a hydrophilic pattern corresponding to the blue sub-pixel. The first and third driving voltages can be 19V, and the second driving voltage can be 0V.

[0052] Similarly, when the target pattern indicates an optically transparent adhesive layer pattern, the driving electrode corresponding to the optically transparent adhesive layer pattern is connected to the driving circuit. First, the driving electrode corresponding to the optically transparent adhesive layer pattern is activated by an activation voltage, and then a first driving voltage, a second driving voltage, and a third driving voltage are applied time-divisionally, causing the region corresponding to the optically transparent adhesive layer pattern on the hydrophobic layer to become a hydrophilic region, thus obtaining a hydrophilic pattern corresponding to the optically transparent adhesive layer pattern. The first and third driving voltages can be 20V, and the second driving voltage can be 0V.

[0053] When the substrate is an array substrate, the target pattern includes an alignment layer pattern and a polarization layer pattern.

[0054] When the target pattern indicates an alignment layer pattern, the driving electrode corresponding to the alignment layer pattern is connected to the driving circuit. First, the driving electrode corresponding to the alignment layer pattern is activated by an activation voltage, and then a first driving voltage, a second driving voltage, and a third driving voltage are applied sequentially, causing the region corresponding to the alignment layer pattern on the hydrophobic layer to become a hydrophilic region, thus obtaining the hydrophilic pattern corresponding to the alignment layer pattern. The first and third driving voltages can be 18V, and the second driving voltage can be 0V.

[0055] When the target pattern indicates a polarization layer pattern, the driving electrode corresponding to the polarization layer pattern is connected to the driving circuit. First, the driving electrode corresponding to the polarization layer pattern is activated by an activation voltage, and then a first driving voltage, a second driving voltage, and a third driving voltage are applied sequentially, causing the region corresponding to the polarization layer pattern on the hydrophobic layer to become a hydrophilic region, thus obtaining the hydrophilic pattern corresponding to the polarization layer pattern. The first and third driving voltages can be 15V, and the second driving voltage can be 0V.

[0056] S104. The functional material solution is delivered to the substrate surface through a microfluidic chip, so that the functional material solution is adsorbed on the hydrophilic pattern to obtain a patterned target substrate.

[0057] Specifically, a functional material solution is delivered to the substrate surface using a PDMS microfluidic chip, allowing the functional material solution to be adsorbed onto the hydrophilic pattern. The substrate is then dried and baked to solidify the target pattern adsorbed onto the hydrophilic pattern, resulting in a patterned target substrate.

[0058] The PDMS microfluidic chip has a channel width of 80μm and a height of 50μm.

[0059] When the substrate is a color filter substrate, and the functional material solution is a first functional material solution, the first functional material solution includes a black matrix functional material solution, a red quantum dot conversion functional material solution, a green quantum dot conversion functional material solution, a blue quantum dot conversion functional material solution, and an optically transparent adhesive layer functional material solution.

[0060] When the target pattern is a black matrix, a black matrix functional material solution is delivered to the corresponding hydrophilic pattern positions on the substrate surface using a PDMS microfluidic chip. This allows the black matrix functional material solution to adsorb onto the hydrophilic pattern positions and remain wetted for 10-30 seconds. Residual black matrix functional material solution is then removed by gentle rinsing with deionized water and dried with nitrogen. Finally, the substrate is baked at a set high temperature of 120°C for 20 minutes to solidify the black matrix material, forming the patterned black matrix layer substrate.

[0061] When the target pattern is a red subpixel, a red quantum dot conversion functional material solution is delivered to the hydrophilic pattern position corresponding to the red subpixel on the substrate surface via a PDMS microfluidic chip. This allows the red quantum dot conversion functional material solution to adsorb onto the hydrophilic pattern position and remain wetted for 10-30 seconds. Residual red quantum dot conversion functional material solution is then removed by gentle rinsing with deionized water and dried with nitrogen. Finally, the substrate is baked at a set high temperature for a certain period to solidify the red subpixel material, forming the patterned red subpixel substrate.

[0062] When the target pattern is a green sub-pixel, a green quantum dot conversion functional material solution is delivered to the hydrophilic pattern position corresponding to the green sub-pixel on the substrate surface via a PDMS microfluidic chip. This allows the green quantum dot conversion functional material solution to adsorb onto the hydrophilic pattern position and remain wetted for 10-30 seconds. Residual green quantum dot conversion functional material solution is then removed by gentle rinsing with deionized water and dried with nitrogen. Finally, the substrate is baked at a set high temperature for a certain period to solidify the green sub-pixel material, forming the patterned green sub-pixel substrate.

[0063] When the target pattern is a blue sub-pixel, a blue quantum dot conversion functional material solution is delivered to the hydrophilic pattern position corresponding to the blue sub-pixel on the substrate surface using a PDMS microfluidic chip. This allows the blue quantum dot conversion functional material solution to adsorb onto the hydrophilic pattern position and remain wetted for 10-30 seconds. Residual blue quantum dot conversion functional material solution is then removed by gentle rinsing with deionized water and dried with nitrogen. Finally, the substrate is baked at a set high temperature for a certain period to solidify the blue sub-pixel material, forming the patterned blue sub-pixel substrate.

[0064] When the target pattern is an optically transparent adhesive layer pattern, the optically transparent adhesive layer functional material solution is delivered to the corresponding hydrophilic pattern position on the substrate surface using a PDMS microfluidic chip. This allows the optically transparent adhesive layer functional material solution to be adsorbed onto the hydrophilic pattern position and wetted for 10-30 seconds. Residual optically transparent adhesive layer functional material solution is then removed by gentle rinsing with deionized water and dried with nitrogen. Finally, it is baked at a set high temperature for a certain period of time to cure the optically transparent adhesive layer material, forming the patterned optically transparent adhesive layer substrate.

[0065] After all the target patterns are patterned on the color filter substrate, the main pillars and auxiliary pillars are photolithographically formed to obtain the patterned target substrate. Furthermore, a polarizer needs to be externally attached to the target substrate to obtain the target color filter substrate.

[0066] When the substrate is an array substrate and the functional material solution is a second functional material solution, then the first colored resin solution corresponding to the alignment layer pattern and the second colored resin solution corresponding to the polarization layer pattern are used.

[0067] When the target pattern is an alignment layer pattern, a first colored resin solution is delivered to the corresponding hydrophilic pattern position on the substrate surface using a PDMS microfluidic chip. This allows the first colored resin solution to adsorb onto the hydrophilic pattern position and soak for 10-30 seconds. Residual first colored resin solution is then removed by gentle rinsing with deionized water and dried with nitrogen. Finally, the substrate is baked at a set high temperature for a certain time to solidify the alignment layer material, forming the patterned alignment layer substrate.

[0068] When the target pattern is a polarization layer pattern, a second colored resin solution is delivered to the hydrophilic pattern position corresponding to the alignment layer on the substrate surface using a PDMS microfluidic chip. This allows the second colored resin solution to adsorb onto the hydrophilic pattern position and remain wetted for 10-30 seconds. Residual second colored resin solution is then removed by gentle rinsing with deionized water and dried with nitrogen. Finally, the substrate is baked at a set high temperature for a certain time to solidify the polarization layer material, forming the patterned polarization layer substrate.

[0069] After all the target patterns are patterned on the array substrate, the patterned target substrate is obtained.

[0070] In addition, when the substrate is a flexible PI substrate, flexible indium tin oxide pixel electrodes or metal mesh electrodes are prepared; and OLED (Organic Light-Emitting Diode) functional layers such as hole injection layer, light-emitting layer, and electron transport layer are deposited sequentially through the above steps.

[0071] The driving circuit can also employ a multi-step voltage application strategy or a specific refresh sequence, which allows solutions containing multiple functional materials to be directly driven by multi-step continuous voltage, enabling multiple materials to be directly impregnated and formed, and reducing solution switching time.

[0072] When the substrate is a color filter substrate, it is not necessary to attach an external polarizer. The polarization layer of the color filter substrate can be fabricated in the same way as the polarization layer of the array substrate, eliminating the need for an external polarizer and realizing the fabrication of a substrate with a fully built-in polarization layer.

[0073] To explain the embodiments of this application, a specific embodiment is introduced herein: Figure 2 The diagram shown is a flowchart of a substrate fabrication method provided in an embodiment of this application. Figure 2 ,like Figure 2 As shown, taking a glass substrate as the substrate and a color filter substrate as an example, the specific steps include: Since the target pattern of the color filter substrate includes a black matrix image, a red subpixel image, a green subpixel image, a blue subpixel image, and an optically transparent adhesive layer pattern, a color filter substrate is prepared using these target patterns as an example.

[0074] S201. Provide a color filter substrate and form an electrode layer on the color filter substrate.

[0075] S202. Prepare a hydrophobic layer on the surface of the color filter substrate on which the electrode layer is formed.

[0076] S203. Connect the driving electrode corresponding to the black matrix to the driving circuit, and apply the activation voltage, the first driving voltage, the second driving voltage and the third driving voltage to the driving electrode corresponding to the black matrix image in a time-division manner to obtain the hydrophilic region corresponding to the black matrix image to form a hydrophilic pattern; and deliver the black matrix functional material solution to the substrate surface through the microfluidic chip, and perform drying and baking treatment to obtain a patterned black matrix substrate.

[0077] The first and third driving voltages are both 18V, while the second driving voltage is 0V.

[0078] S204. Connect the driving electrode corresponding to the red sub-pixel image to the driving circuit, and apply the activation voltage, the first driving voltage, the second driving voltage and the third driving voltage to the driving electrode corresponding to the red sub-pixel image in a time-division manner to obtain the hydrophilic region corresponding to the red sub-pixel image and form a hydrophilic pattern; and transport the red quantum dot conversion functional material solution to the surface of the black matrix substrate through the microfluidic chip, and perform drying and baking treatment to obtain the patterned red sub-pixel substrate.

[0079] The first and third driving voltages are both 17V, while the second driving voltage is 0V.

[0080] S205. Connect the driving electrode corresponding to the green sub-pixel image to the driving circuit, and apply the activation voltage, the first driving voltage, the second driving voltage and the third driving voltage to the driving electrode corresponding to the green sub-pixel image in a time-division manner to obtain the hydrophilic region corresponding to the green sub-pixel image and form a hydrophilic pattern; and transport the green quantum dot conversion functional material solution to the surface of the red sub-pixel substrate through the microfluidic chip and perform drying and baking treatment to obtain the patterned green sub-pixel substrate.

[0081] The first and third driving voltages are both 16V, while the second driving voltage is 0V.

[0082] S206. Connect the driving electrode corresponding to the blue sub-pixel image to the driving circuit, and apply the activation voltage, the first driving voltage, the second driving voltage and the third driving voltage to the driving electrode corresponding to the blue sub-pixel image in a time-division manner to obtain the hydrophilic region corresponding to the blue sub-pixel image and form a hydrophilic pattern; and transport the blue quantum dot conversion functional material solution to the surface of the green sub-pixel substrate through the microfluidic chip, and perform drying and baking treatment to obtain the patterned blue sub-pixel substrate.

[0083] The first and third driving voltages are both 16V, while the second driving voltage is 0V.

[0084] S207. Connect the driving electrode corresponding to the optically transparent adhesive layer to the driving circuit, and apply the activation voltage, the first driving voltage, the second driving voltage and the third driving voltage to the driving electrode corresponding to the optically transparent adhesive layer in a time-division manner to obtain the hydrophilic region corresponding to the optically transparent adhesive layer and form a hydrophilic pattern; and transport the optically transparent adhesive layer functional material solution to the surface of the blue sub-pixel substrate through the microfluidic chip, and perform drying and baking treatment to obtain a patterned optically transparent adhesive layer substrate.

[0085] S208. The optically transparent adhesive substrate is photolithographically formed into main pillars and auxiliary pillars to obtain a color filter substrate.

[0086] Furthermore, a polarizer needs to be externally attached to the color filter substrate.

[0087] Similarly, the array substrate is also fabricated using the electrowetting deposition process described above.

[0088] This application utilizes an external driving circuit to apply a driving voltage to the driving electrodes in a time-division manner, causing hydrophilic regions corresponding to the target pattern to appear on the hydrophobic layer of the substrate. This fixes the position of the target pattern and precisely positions it, improving the accuracy of patterning. The substrate is immersed in a functional material solution, and a microfluidic chip successfully delivers the solution to the hydrophilic regions, allowing for successful adsorption and formation of the target pattern. This improves material utilization and avoids resource waste. Through hydrophobic layer deposition, voltage driving, and solution adsorption in the entire substrate fabrication process, successful substrate patterning is achieved. These steps simplify the substrate fabrication process, reduce costs, and streamline the traditional photolithography patterning process, lowering equipment operating costs. Furthermore, the fabricated substrate has no size requirements, improving the versatility of display panels.

[0089] In another embodiment, Figure 3 The diagram shown is a flowchart of a substrate fabrication method provided in an embodiment of this application. Figure 3 , Figure 3 Is Figure 1 and Figure 2 Based on the illustrated embodiment, the steps for obtaining hydrophilic patterns by connecting an external driving circuit to the driving electrode are described in detail, such as... Figure 3 As shown, the specific steps include: S301. Connect the driving electrode of the electrode layer to the driving circuit, and select the target driving electrode according to the target pattern.

[0090] Specifically, the drive circuit external to the drive electrode is connected.

[0091] Select the corresponding target driving electrode based on the target pattern.

[0092] S302. After applying an activation voltage to the target driving electrode, a first driving voltage lasting for a first time, a second driving voltage lasting for a second time, and a third driving voltage lasting for a third time are sequentially applied to the target driving electrode.

[0093] Specifically, when the substrate is a color filter substrate, an activation voltage needs to be applied to the target driving electrode corresponding to the electrode layer on the color filter substrate for activation.

[0094] When the substrate is an array substrate, an activation voltage needs to be applied to the target driving electrode corresponding to the electrode layer on the array substrate to activate it.

[0095] The activation voltage is 0-5V and lasts for 10 milliseconds.

[0096] A first driving voltage is applied to the target driving electrode indicated by the target pattern for a first time.

[0097] It is worth noting that the first time and the first driving voltage are different depending on the target pattern.

[0098] After applying the first driving voltage, a second driving voltage is applied to the target driving electrode indicated by the target pattern for a second duration.

[0099] It is worth noting that the second time and the second driving voltage differ depending on the target pattern. After applying the second driving voltage, a third driving voltage for a third duration is applied to the target driving electrode indicated by the target pattern to obtain the hydrophilic region indicated by the target pattern. It is worth noting that the third time and the third driving voltage differ depending on the target pattern.

[0100] The first and third driving voltages are the same, while the second driving voltage is 0. Furthermore, the sum of the first and third time intervals is not less than five times the value of the second time interval.

[0101] refer to Figure 4 , Figure 4 This is a voltage drive schematic diagram provided for an embodiment of this application, such as... Figure 4 As shown, the first driving voltage applied is 18V, the second driving voltage is 0V, and the third driving voltage is 18V.

[0102] The first time interval (T2-T1) is 1.5 milliseconds, the second time interval (T3-T2) is 0.3 milliseconds, and the third time interval (T4-T3) is 2 milliseconds. Therefore, the sum of the first and second times is 3.5 milliseconds, and 5 times the value of the second time interval is 1.5 milliseconds.

[0103] Among them, 3.5 milliseconds is greater than 1.5 milliseconds, which can effectively reduce visual artifacts.

[0104] The technical effect provided by the embodiments of this application is that by applying different driving voltages for different target patterns in a time-division manner, the electrowetting deposition area can be more precise, and the deposition of target patterns can be achieved for different target patterns. This reduces the waste rate of using a large amount of solution in each step of the traditional photolithography method, effectively reduces the diffusion of solution across regions, improves pattern accuracy, and meets the requirements of high resolution.

[0105] In another embodiment, Figure 5 The diagram shown is a flowchart of a substrate fabrication method provided in an embodiment of this application. Figure 4 , Figure 5 exist Figure 1 Based on this, the specific steps for solution adsorption on the substrate surface are explained, such as... Figure 5 As shown, it includes: S501. The functional material solution is delivered to the substrate surface through a microfluidic chip, so that the substrate is immersed in the functional material solution.

[0106] Specifically, a solution of the functional material corresponding to the target pattern is delivered to the surface of the substrate using a microfluidic chip.

[0107] During the pattern deposition process, the hydrophobic layer of the substrate is immersed in a functional material solution, which facilitates the adhesion of the material in the solution to the hydrophilic pattern area.

[0108] The microfluidic chip has a transfer rate of 0.5 mL / min.

[0109] S502. A fourth driving voltage is applied to the selected driving electrode through the driving circuit, so that the functional material solution is adsorbed on the hydrophilic pattern.

[0110] Specifically, the fourth driving voltage refers to the driving voltage applied to the substrate by the driving circuit during the wetting process.

[0111] With the timing control method, a base voltage of 18V is first applied and maintained for 10 seconds, and then a fine-tuning voltage of 3V is applied and maintained for 3 seconds, so that the material in the functional material solution is adsorbed onto the hydrophilic pattern.

[0112] To facilitate the explanation of the embodiments of this application, a specific embodiment is introduced herein, taking the electrowetting patterning process of the red sub-pixel as an example. Figure 6 This is a schematic diagram of the electrowetting patterning process of the red sub-pixel provided in an embodiment of this application, as shown below. Figure 6 As shown: The substrate is a color filter substrate 600, with a hydrophobic layer 620 on top and a hydrophilic region 630 corresponding to the hydrophobic layer 620. The ellipse in the figure represents the red quantum dot conversion functional material solution 610.

[0113] The figure includes four images, which, from top to bottom, represent the state of the substrate, the state of the substrate after applying voltage to the target driving electrode corresponding to the red sub-pixel, the state of the substrate after the red quantum dot conversion functional material solution wets the substrate, and the state of the substrate after the red sub-pixel pattern is deposited.

[0114] In particular, the hydrophilic region 630 begins to deposit material under the action of the red quantum dot conversion functional material solution 610.

[0115] The applied voltage includes four time periods: applying activation voltage, applying first driving voltage, applying second driving voltage, and applying third driving voltage.

[0116] Furthermore, during the solution wetting process, a fourth driving voltage can be applied in conjunction with sequential voltage control to make pattern deposition more efficient.

[0117] The technical effect provided by the embodiments of this application is that by wetting the solution and applying voltage, the material in the solution is more easily adsorbed onto the hydrophilic region, thereby achieving continuous patterned deposition, improving the interlayer alignment accuracy, and reducing the probability of blurred pattern edges.

[0118] In another embodiment, the substrate with the hydrophilic pattern obtained in the above embodiment is lightly rinsed with deionized water to remove residual functional material solution, and then dried with nitrogen gas.

[0119] Baking is performed at a set temperature, and after a set baking time, the material adsorbed on the hydrophilic pattern is solidified to form a patterned target substrate.

[0120] The technical effect provided by this embodiment is that by drying and baking the substrate, the pattern can be cured. Furthermore, since the target pattern is different, the corresponding drying conditions are also different, which can effectively achieve the deposition and curing of different patterns.

[0121] In another embodiment, the substrate may be a color filter substrate or an array substrate.

[0122] Furthermore, when the substrate is a color filter substrate, its corresponding driving electrode is a common electrode, and the corresponding functional material solution is also the first functional material solution.

[0123] When the substrate is an array substrate, its corresponding driving electrode is a pixel electrode, and the corresponding functional material solution is also a second functional material solution.

[0124] It should be noted that the first functional material solution and the second functional material solution are different, and the target patterns to be deposited for the color filter substrate and the array substrate are also different.

[0125] The technical effect provided by the embodiments of this application is that it classifies and explains the cases where the substrate is a color filter substrate and an array substrate respectively, and provides a preparation method that can produce a variety of substrates.

[0126] In another embodiment, when the substrate is a color filter substrate, the target pattern to be deposited includes: a black matrix image, a red subpixel image, a green subpixel image, a blue subpixel image, and an optically transparent adhesive layer pattern.

[0127] The corresponding first functional material solutions include: black matrix functional material solution, red quantum dot conversion functional material solution, green quantum dot conversion functional material solution, blue quantum dot conversion functional material solution, and optically transparent adhesive layer functional material solution.

[0128] Therefore, the deposition of the target pattern can be achieved based on the target pattern and the first functional material solution.

[0129] The technical effect provided by this embodiment is that by limiting the target pattern and solution when the substrate is a color filter substrate, the deposition process conditions of the target pattern are made more precise.

[0130] In another embodiment, when the substrate is a color filter substrate, after the target pattern has been deposited and cured, additional isolation pillars need to be formed; wherein the isolation pillars include main pillars and auxiliary pillars. They are formed using conventional photolithography.

[0131] When the substrate is a color filter substrate, an additional polarizer needs to be attached.

[0132] The technical advantage provided by this embodiment is that only the main pillars and auxiliary pillars of the color filter substrate need to be completed by photolithography, while other steps can be completed without photolithography, thus reducing the cost of using the photolithography machine.

[0133] In another embodiment, when the substrate is an array substrate, the target pattern includes only the alignment layer pattern and the bias layer pattern.

[0134] The corresponding second functional material solution includes a first colored resin solution corresponding to the alignment layer pattern and a second colored resin solution corresponding to the polarization layer pattern.

[0135] The first colored resin solution and the second colored resin solution are different.

[0136] The technical effect provided by the embodiments of this application is that by defining the target pattern and functional material solution of the array substrate, the alignment layer and polarization layer steps no longer depend on the traditional photolithography method, but can also be achieved through electrowetting patterning.

[0137] In another embodiment, the substrate can be a glass substrate or a flexible PI substrate. Furthermore, the provided substrate also includes a metal layer; wherein the metal layer includes scan lines and data lines.

[0138] When the substrate is a glass substrate, the electrowetting patterning deposition steps provided in the above embodiments can be used for patterning.

[0139] When the substrate is a flexible PI substrate, the hole injection layer, the light-emitting layer and the electron transport layer can also be prepared sequentially by the electrowetting deposition process provided in the above embodiments.

[0140] The technical advantage provided by this embodiment is that it can be fabricated using electrowetting deposition process when the substrate is a glass substrate or a flexible PI substrate, with only the target pattern differing. This improves the versatility of the electrowetting deposition process, eliminating limitations on substrate fabrication or substrate size, and reducing the size constraints associated with traditional photolithography methods.

[0141] Secondly, this application also provides a display panel. Figure 7 This is a schematic diagram of the structure of the display panel provided in the embodiments of this application, such as... Figure 7 As shown, the display panel 700 includes: A color filter substrate 600 and an array substrate 720.

[0142] The color filter substrate 600 includes a black matrix 640, red sub-pixels 650, green sub-pixels 660, blue sub-pixels 670, an optically transparent adhesive layer 580, a polarizing plate 690, and isolation pillars 691. The isolation pillars 691 include main pillars and auxiliary pillars.

[0143] The array substrate 720 includes an alignment layer 721 and a polarizing layer 822. The polarizing layer 822 is disposed on the side close to the backlight module 750, and the alignment layer 721 is disposed on the side close to the liquid crystal 710.

[0144] Both the color filter substrate 600 and the array substrate 720 are prepared by the electrowetting deposition process provided in the above embodiments. Furthermore, the color filter substrate 600 and the array substrate 720 are arranged in a cell-to-cell configuration.

[0145] The display panel also includes: a liquid crystal 710, a printed circuit board assembly 730, and a flip-chip film 740.

[0146] The liquid crystal 710 is disposed between the color filter substrate 600 and the array substrate 710.

[0147] The PCBA printed circuit board assembly 730 is connected to the array substrate 720 via a flip-chip film 740.

[0148] The backlight module 750 is located below the array substrate 720.

[0149] Figure 7 The arrows shown indicate the direction of light illumination.

[0150] Figure 8 This is a schematic diagram of the manufacturing process of the display panel provided in the embodiments of this application, as shown below. Figure 8 As shown: S801. The color filter substrate and the array substrate are molded, filled with liquid crystal, sealed, and cleaned to obtain a liquid crystal display panel.

[0151] S802. Connect the liquid crystal display panel to the flip-chip film, and connect the printed circuit components and other peripheral circuits to the flip-chip film.

[0152] Among them, the flip-chip film is produced using a flip-chip film bonding process.

[0153] S803. Assemble the backlight module below the array substrate to form a display panel.

[0154] Similarly, Micro LED (Light Emitting Diode) chips (5-10μm in diameter, GaN material) can also be fabricated using an electrowetting deposition process. This process involves transferring the chip from an ethanol solution (concentration 500-1000g / ml) to the hydrophilic region indicated by the substrate electrode, applying a set voltage, and immersing the chip for a set time to obtain a Micro LED display panel.

[0155] Since the polarizer plate 690 of the color filter substrate 600 is externally connected to the color filter substrate 600, the polarization layer of the color filter substrate 600 can be prepared in a similar manner to the preparation method of the polarization layer 822 of the array substrate 720, thereby realizing a display panel with a fully built-in polarization layer.

[0156] The technical advantages provided by the embodiments of this application are that, through the fabrication of the color filter substrate and the array substrate, the entire manufacturing process of the display panel no longer relies entirely on traditional photolithography, reducing costs and simplifying the process flow. Furthermore, due to the similarity in the fabrication processes of the color filter substrate and the array substrate, their designed driving modules share commonalities, allowing for the omission of driving for unnecessary circuit designs, facilitating the sharing of substrate materials in the early stages.

[0157] Furthermore, the terms "first," "second," "third," and "fourth," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first," "second," "third," and "fourth" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0158] In the description of this specification, references to terms such as "some embodiments," "exemplarily," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. The illustrative expressions of the above terms in this specification do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0159] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application. Therefore, any changes or modifications made in accordance with the claims and description of this application should fall within the scope of this patent application.

Claims

1. A method for preparing a substrate, characterized in that, The method includes: A substrate is provided, on which an electrode layer is formed, the electrode layer including at least one driving electrode; A hydrophobic layer is prepared on the surface of a substrate on which the electrode layer is formed; The driving electrode of the electrode layer is configured to be connected to the driving circuit. A voltage is applied to the selected driving electrode according to the target pattern, so that the corresponding area on the hydrophobic layer becomes a hydrophilic area to form a hydrophilic pattern. A functional material solution is delivered to the surface of the substrate using a microfluidic chip, causing the functional material solution to be adsorbed onto the hydrophilic pattern, thereby obtaining a patterned target substrate.

2. The method according to claim 1, characterized in that, The step of configuring the driving electrode of the electrode layer to be connected to the driving circuit and applying a voltage to the selected driving electrode according to the target pattern includes: Connect the driving electrode of the electrode layer to the driving circuit, and select the target driving electrode according to the target pattern; After applying an activation voltage to the target driving electrode, a first driving voltage lasting for a first time, a second driving voltage lasting for a second time, and a third driving voltage lasting for a third time are sequentially applied to the target driving electrode.

3. The method according to claim 2, characterized in that, The step of delivering a functional material solution to the substrate surface via a microfluidic chip, so that the functional material solution is adsorbed onto the hydrophilic pattern, includes: The functional material solution is delivered to the surface of the substrate using a microfluidic chip, thereby immersing the substrate in the functional material solution. The functional material solution is adsorbed onto the hydrophilic pattern by applying a fourth driving voltage to the selected driving electrode through the driving circuit.

4. The method according to claim 3, characterized in that, After the functional material solution is adsorbed onto the hydrophilic pattern, the method further includes: The substrate is dried and baked to solidify the hydrophilic pattern, thereby obtaining the patterned target substrate.

5. The method according to claim 4, characterized in that, The substrate includes a color filter substrate or an array substrate; When the substrate is a color filter substrate, the driving electrode is a common electrode, and the functional material solution is a first functional material solution; When the substrate is an array substrate, the driving electrode is a pixel electrode, and the functional material solution is a second functional material solution.

6. The method according to claim 5, characterized in that, When the substrate is a color filter substrate, the target pattern includes a black matrix image, a red sub-pixel image, a green sub-pixel image, a blue sub-pixel image, and an optically transparent adhesive layer pattern. The first functional material solution includes a black matrix functional material solution, a red quantum dot conversion functional material solution, a green quantum dot conversion functional material solution, a blue quantum dot conversion functional material solution, and an optically transparent adhesive layer functional material solution.

7. The method according to claim 6, characterized in that, Before obtaining the patterned target substrate, the method further includes: Main pillars and auxiliary pillars are formed on the color filter substrate; After obtaining the patterned target substrate, the process also includes: The target substrate and the polarizer are spliced ​​together to obtain the target color filter substrate.

8. The method according to claim 5, characterized in that, When the substrate is an array substrate, the target pattern includes an alignment layer pattern and a polarization layer pattern; The second functional material solution includes a first colored resin solution corresponding to the alignment layer pattern and a second colored resin solution corresponding to the polarization layer pattern; The first colored resin solution and the second colored resin solution are different.

9. The method according to any one of claims 1-8, characterized in that, The substrate is a glass substrate or a flexible polyimide substrate; When the substrate is a flexible polyimide substrate, a hole injection layer, a light-emitting layer, and an electron transport layer are sequentially prepared by an electrowetting deposition process.

10. A display panel, characterized in that, The display panel includes Color filter substrate prepared by the method according to any one of claims 1 to 9; And the array substrate prepared by the method according to any one of claims 1 to 9; in, The color filter substrate and the array substrate are arranged in a cell.

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