Electronic paper laminating device and electronic paper laminating method
By designing a semi-automated electronic paper lamination device, and utilizing the combined motion control of the A support module, B horizontal module, and Z vertical module, the problem of low efficiency in electronic paper lamination process was solved, enabling efficient and customized production of small-sized products.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- JIANGXI XINGTAI TECH INC
- Filing Date
- 2026-04-10
- Publication Date
- 2026-06-16
Smart Images
Figure CN122211041A_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of electronic paper bonding technology, specifically relating to electronic paper bonding apparatus and electronic paper bonding method. Background Technology
[0002] Currently, the 3D bonding process for electronic paper color-changing nail clippers involves pressing an FPL (fiberglass laminate) onto an empty nail clipper using a mold, followed by UV curing and removal from the mold. In existing technologies, this process is entirely manual, resulting in low efficiency, and the control of curing pressure and UV irradiation time is not precise. Optimizing the process and improving production efficiency is the technical problem this application aims to solve.
[0003] Especially for small-sized electronic paper products, such as electronic paper nail products, the size is small and the patterns are usually customized in small batches, so a certain degree of flexibility is required. If they are applied separately, the efficiency is very low, and if they are applied manually, the efficiency is even lower.
[0004] Definitions: PLC is an abbreviation for "Programmable Logic Controller". It is a general-purpose industrial automatic control device that uses a microprocessor as its core and integrates computer technology, automatic control technology and communication technology. Summary of the Invention
[0005] The technical problem to be solved by the present invention is to avoid the problem of low production efficiency of electronic paper bonding devices and electronic paper bonding methods in the prior art, and to provide a semi-automatic electronic paper bonding device and electronic paper bonding method, thereby improving production efficiency through the design of the production device.
[0006] The technical solution of this application to solve the above-mentioned technical problems is an electronic paper bonding device for bonding electronic paper and components to be bonded; it includes a support module A, a horizontal module B, and a vertical module Z; the support module A includes a horizontal support plate A1; the horizontal module B includes a cylinder B1, a support rod B2, and a horizontal moving plate B3; the cylinder B1 drives the support rod B2 to move horizontally, and the support rod B2 drives the horizontal moving plate B3 to move horizontally; the horizontal support plate A1 is located below the horizontal moving plate B3; the vertical module Z includes a cylinder Z1, a support rod Z2, and a vertical moving plate Z3; Z... 1. Cylinder drives Z2 support rod to move vertically, Z2 support rod drives Z3 vertical moving plate to move vertically; Z3 vertical moving plate is located above B3 horizontal moving plate; Usage state 1: B3 horizontal moving plate moves to the far end, for the user to put in electronic paper FPL sheet and the part to be bonded; Usage state 2: B3 horizontal moving plate moves to the near end, that is, below Z3 vertical moving plate; Usage state 3: Z3 vertical moving plate presses down, applying pressure to electronic paper FPL sheet and the part to be bonded, so that electronic paper FPL sheet and the part to be bonded are pressed and bonded into a single part.
[0007] It may also include an L1 ultraviolet lamp, which is installed below the A1 horizontal support plate, which includes holes for ultraviolet light to pass through; and the B3 horizontal moving plate includes a transparent part for ultraviolet light to pass through.
[0008] It can be used for bonding electronic paper color-changing nail plates, wherein the electronic paper color-changing nail plate includes an electronic paper FPL layer and a nail plate substrate; the holes are shaped like nail plates; and the component to be bonded includes an array of multiple nail plate substrates.
[0009] Alternatively, the Z3 vertical moving plate may be provided with a pressure-applying part, which corresponds to the hole; the B3 horizontal moving plate may be provided with a bearing part, which has multiple accommodating spaces for accommodating electronic paper color-changing nail covers.
[0010] It may also include a control module, which is electrically connected to cylinder B1 and used to control cylinder B1; the control module is electrically connected to cylinder Z1 and used to control cylinder Z1; the control module is electrically connected to ultraviolet lamp L1 and used to control ultraviolet lamp L1; the control module includes a K1 button, which is used to control entering the next state; the control module includes a K0 button, which is used to control entering the initial state.
[0011] Yes, the B horizontal module also includes a B4 position sensing module; the B4 position sensing module is used to sense the far end position of the B3 horizontal moving plate; the B horizontal module also includes a B5 position sensing module; the B5 position sensing module is used to sense the near end position of the B3 horizontal moving plate.
[0012] Yes, the Z vertical module also includes a Z4 position sensing module; the Z4 position sensing module is used to sense the far end position of the Z3 vertical moving plate; the Z vertical module also includes a Z5 position sensing module; the Z5 position sensing module is used to sense the near end position of the Z3 vertical moving plate.
[0013] The technical solution of this application to solve the above-mentioned technical problems is an electronic paper bonding method, used to control the electronic paper bonding device of claim 7, including: Step T1, initial position return: the control module receives the instruction that the K0 button is pressed, drives the B1 cylinder to move the B3 horizontal moving plate to the proximal position of the B3 horizontal moving plate, and drives the Z1 cylinder to move the Z3 vertical moving plate to the proximal position of the Z3 vertical moving plate; Step T2, move to the position for placing the component to be bonded: the control module receives the instruction that the K1 button is pressed, drives the B1 cylinder to move the B3 horizontal moving plate to the distal position of the B3 horizontal moving plate, waiting to place the electronic paper FPL sheet and the component to be bonded; Step T3, move to the bonding position: the control module receives the instruction that the K1 button is pressed, drives the B1 cylinder to move the B3 horizontal moving plate to the proximal position of the B3 horizontal moving plate; Step T4, bonding: the control module receives the instruction that the K1 button is pressed, drives the Z1 cylinder to move the Z3 vertical moving plate to the distal position of the Z3 vertical moving plate, pressing the electronic paper FPL sheet and the component to be bonded together.
[0014] It could be that after step T4, there is a light illumination step T41: the L1 ultraviolet lamp electrical signal is turned on, allowing the ultraviolet lamp to irradiate the electronic paper FPL sheet and the component to be bonded for a set time.
[0015] It can include: Step T5, removing the attached material: The control module receives the instruction that the K1 button is pressed, drives the Z1 cylinder to move the Z3 vertical moving plate to the far end position of the Z3 vertical moving plate; drives the B1 cylinder to move the B3 horizontal moving plate to the far end position of the B3 horizontal moving plate, waiting to remove the attached material.
[0016] One of the beneficial effects of this application is that the combination of the A support module, the B horizontal module, and the Z vertical module enables motion control in two directions, achieving semi-automation.
[0017] One of the advantages of this application is that ultraviolet light can pass through moving parts to perform UV curing, ensuring product reliability.
[0018] One of the beneficial effects of this application is that the cooperation between the pressure-applying part and the load-bearing part is the cooperation between the upper mold and the lower mold. Multiple 3D accommodating spaces for small-sized products can be provided on both the upper and lower molds; alternatively, multiple 3D accommodating spaces for small-sized products can be provided on one of the upper or lower molds. These multiple 3D accommodating spaces provide accommodating space for multiple 3D small-sized products.
[0019] One of the benefits of this application is that the control module achieves automated control, improving the accuracy of cylinder pressure control and timing control.
[0020] One of the benefits of this application is that the buttons provide a simple control interface, which makes it easy for humans to intervene in the process at any time for quality control or troubleshooting.
[0021] One of the benefits of this application is that the setting of the position sensing module makes position control more precise, and precise size control can be performed in both motion dimensions.
[0022] One of the advantages of this application is that the method and steps are simple and easy to implement.
[0023] One of the advantages of this application is that it allows for safer removal of the attached material when the material is moved to the far end of the B3 horizontal moving plate and waited to be removed. Attached Figure Description
[0024] Figure 1 This is a schematic diagram of an electronic paper bonding device; Figure 2 This is a schematic diagram of an electronic paper bonding device; Figure 3 This is a schematic diagram of an electronic paper bonding device; Figure 4 This is a schematic diagram of an electronic paper bonding device; Figure 5 This is a schematic diagram of an electronic paper bonding device; Figure 6 This is a schematic diagram of an electronic paper bonding device; Figure 7 This is a schematic diagram of an electronic paper bonding device; Figure 8 This is a schematic diagram of an electronic paper bonding device; Figure 9 This is a three-dimensional schematic diagram of the electronic paper bonding device; Figure 10 This is a partially exploded schematic diagram of the electronic paper bonding device; Figure 11 This is a partially exploded schematic diagram of the electronic paper bonding device; Figure 12 This is a partial 3D schematic diagram of the electronic paper bonding device; Figure 13 This is a three-dimensional schematic diagram of the bonding state of the electronic paper bonding device. Detailed Implementation
[0025] The embodiments of the present invention will be further described in detail below with reference to the accompanying drawings.
[0026] It should be noted that the following description of preferred embodiments of this application does not constitute any limitation on this application. The description of preferred embodiments is merely an illustration of the general principles of this application. The embodiments described in this application are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0027] In the description of this application, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the equipment or components referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. Furthermore, the terms "first," "second," and technical features numbered with Arabic numerals 1, 2, 3, etc., and designations such as "A" and "B," are used for descriptive purposes only, for the convenience of explanation, and do not represent a temporal or spatial order; they should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined with "first," "second," and numbered with Arabic numerals 1, 2, 3, etc., may explicitly or implicitly include one or more of that feature. In the description of this application, "several" means two or more, unless otherwise expressly and specifically defined.
[0028] like Figure 1 As shown, an embodiment of an electronic paper bonding device is used for bonding electronic paper and a component to be bonded; it includes a support module A, a horizontal module B, and a vertical module Z; the support module A includes an A1 horizontal support plate 0110; the horizontal module B includes a B1 cylinder 0120, a B2 support rod 0130, and a B3 horizontal moving plate 0140; the B1 cylinder drives the B2 support rod to move horizontally, and the B2 support rod drives the B3 horizontal moving plate to move horizontally; the A1 horizontal support plate is located below the B3 horizontal moving plate; the vertical module Z includes a Z1 cylinder 0150, a Z2 support rod 0160, and a Z3 vertical moving plate 0170; the Z1 cylinder drives the Z2 support rod to move vertically, and the Z2 support rod drives the Z3 vertical moving plate to move vertically; the Z3 vertical moving plate is located above the B3 horizontal moving plate.
[0029] like Figure 2 Usage State 1: The B3 horizontal moving plate moves to the far end, allowing the user to place the part to be bonded and the electronic paper FPL sheet.
[0030] like Figure 3 As shown, the B3 horizontal moving plate moves to the far end, and the user places the component to be bonded 0320 and the electronic paper FPL sheet 0310 on the B3 horizontal moving plate.
[0031] like Figure 4 As shown, in usage state 2: The B3 horizontal moving plate moves to the near end, that is, below the Z3 vertical moving plate, along with the component to be bonded and the electronic paper FPL sheet.
[0032] like Figure 5 As shown, in usage state 3: the Z3 vertical moving plate presses down, applying pressure to the electronic paper FPL sheet and the component to be bonded, so that the electronic paper FPL sheet and the component to be bonded are pressed and bonded into a single component.
[0033] like Figure 6 As shown, after maintaining state 3 for a set time, switch to state 4: Z3 vertical moving plate lifts up, releasing the pressure applied to the electronic paper FPL sheet and the part to be bonded.
[0034] like Figure 7 As shown, switch to usage state 5: B3 horizontal moving plate moves to the far end, allowing the user to remove the already bonded bonding component 0320 and electronic paper FPL sheet 0310.
[0035] like Figure 1 As shown, an embodiment of an electronic paper bonding device further includes an L1 ultraviolet lamp 0190, which is installed below an A1 horizontal support plate. The A1 horizontal support plate includes holes for ultraviolet light to pass through. The B3 horizontal moving plate includes a transparent portion for ultraviolet light to pass through.
[0036] like Figures 9 to 12 As shown, an embodiment of an electronic paper bonding device is used for bonding electronic paper color-changing nail plates. The electronic paper color-changing nail plate includes an electronic paper FPL layer and a nail plate substrate; the holes are shaped like nail plates; the component to be bonded includes an array of multiple nail plate substrates.
[0037] like Figure 11 As shown, the Z3 vertical moving plate is provided with a pressure applying part 13, which corresponds to the hole; as Figure 9 As shown, the horizontal moving plate B3 is provided with a support part 0910, and the support part is provided with multiple accommodating spaces for accommodating electronic paper color-changing nail caps.
[0038] like Figures 8 to 12As shown, an embodiment of an electronic paper bonding device further includes a control module, which is electrically connected to the B1 cylinder and is used to control the B1 cylinder; the control module is electrically connected to the Z1 cylinder and is used to control the Z1 cylinder; and the control module is electrically connected to the L1 ultraviolet lamp and is used to control the L1 ultraviolet lamp.
[0039] like Figures 8 to 12 As shown, the control module includes a K1 button; the K1 button is used to control entering the next state; the K1 button is... Figure 9 The middle part is labeled 0920; it includes the K0 button; the K0 button is used to control entering the initial state, and the K0 button is... Figure 9 The number is 0930.
[0040] like Figure 10 As shown, the B horizontal module also includes a B4 position sensing module; the B4 position sensing module is used to sense the far-end position of the B3 horizontal moving plate, and the B4 position sensing module can be... Figure 10 The lower mold endpoint sensing grating of number 9; the B horizontal module also includes the B5 position sensing module; the B5 position sensing module is used to sense the near-end position of the B3 horizontal moving plate.
[0041] like Figure 11 As shown, the Z vertical module also includes a Z4 position sensing module; the Z4 position sensing module is used to sense the far-end position of the Z3 vertical moving plate; the Z4 position sensing module can be... Figure 10 The upper mold endpoint sensing grating (reference number 5) is also included. The Z-vertical module further includes a Z5 position sensing module; the Z5 position sensing module is used to sense the near-end position of the Z3 vertical moving plate. The Z5 position sensing module can be... Figure 11 The upper mold starting position sensing grating of number 12.
[0042] An electronic paper bonding method for controlling the aforementioned electronic paper bonding device includes: Step T1: The control module receives a command that the K0 button is pressed, returns to its initial position, and after returning to its original position, it proceeds as follows... Figure 1 As shown, drive cylinder B1 to move horizontal moving plate B3 to the near end position of horizontal moving plate B3, and drive cylinder Z1 to move vertical moving plate Z3 to the near end position of vertical moving plate Z3.
[0043] Step T2: The control module receives the instruction that button K1 has been pressed, and moves to the position where the material to be pasted is placed, i.e. Figure 2 As shown in the diagram, drive cylinder B1 to move horizontal moving plate B3 to its far end, awaiting the placement of the material to be bonded. Once the material is placed, it will proceed as shown. Figure 3The state shown. The composite to be bonded includes a nail-shaped substrate and an electronic paper FPL layer. The nail-shaped substrate and the electronic paper FPL layer can be placed in the carrier portion 0910 simultaneously. Alternatively, the nail-shaped substrate can be placed in the carrier portion 0910, and the electronic paper FPL layer can be placed in the pressure application portion 13.
[0044] Step T3: The control module receives the instruction that button K1 has been pressed and moves to the mating position. Figure 4 At the position shown, drive cylinder B1 to move the horizontal moving plate B3 to its proximal position. In the B horizontal module, position sensing module B5 is used to sense the proximal position of the horizontal moving plate B3.
[0045] Step T4: The control module receives the instruction that button K1 has been pressed, and then engages, i.e. Figure 5 As shown, the Z1 cylinder is driven, moving the Z3 vertical moving plate to its far end position to press the material to be bonded. The Z4 position sensing module is used to sense that the Z3 vertical moving plate is already at the far end position.
[0046] Step T41, after step T4, includes activating the L1 ultraviolet lamp electrical signal to allow the ultraviolet lamp to irradiate the attached material for a set time.
[0047] Step T5, Removing the Adhesive: The control module receives the instruction that button K1 is pressed, drives cylinder Z1, and moves vertical moving plate Z3 to its far end position, i.e., as shown. Figure 6 The state shown; drive cylinder B1 to move the horizontal moving plate B3 to the far end position of the horizontal moving plate B3, that is... Figure 7 As shown in the image, wait to remove the adhesive.
[0048] The electronic paper bonding device and electronic paper bonding method of this application are applied in the field of electronic paper color-changing nail 3D bonding.
[0049] The technical solution of this application is a semi-automated production device. It can semi-automatically complete the 3D pressure holding and UV curing of nails, thereby simplifying the production process and improving efficiency.
[0050] Design expectation function: The lower mold containing the fingernail is placed on the loading position of the equipment and positioned by the mold positioning groove → the lower mold automatically moves to the holding pressure position → the upper mold presses down → after a certain interval after pressing, the UV lamp is turned on to cure the UV glue → after curing is completed, the upper mold automatically lifts up and the lower mold exits to the loading position.
[0051] Design steps: The lower and upper molds are moved using cylinders. The cylinder speed and pressure are adjusted by regulating the upper and lower pressures. A sensor grating is added at the end point (far end) of the lower mold drive cylinder. When the sensor grating detects that the lower mold has moved to the pressure holding position, the upper mold begins to press down.
[0052] A sensor grating is also added at the end point of the upper die's downward pressure. When the sensor grating detects that the upper die has moved to the holding pressure position, the timing starts. When the timing reaches the set value, the UV lamp is turned on, illuminates for a set time, and then turns off. After the set time is turned off, the upper die is lifted.
[0053] A sensor grating is also added at the starting position of the upper mold, i.e., near the end. When the sensor grating detects that the upper mold has moved to the starting position, the lower mold begins to retract to the loading position.
[0054] Figure 10 The various labels and corresponding components are as follows: 1: Lower mold cylinder; 2: Upper mold pressing guide post; 3: Lower mold forward guide rail and slider; 4: UV lamp; 5: Upper mold end position sensing grating; 6: Upper mold pressing bushing; 7: Lower mold positioning block; 8: Lower mold bearing platform; 9: Lower mold end position sensing grating.
[0055] Figure 11 and Figure 12 The various labels and corresponding components are as follows: 10: Upper mold cylinder; 11: Upper mold cylinder fixing plate; 12: Upper mold starting position sensing grating; 13: 3D pressing upper mold; 14: Iron plate to block UV light; 15: Emergency stop button; 16: Start button; 17: Display panel.
[0056] Figure 13 This is a diagram illustrating the pressing state. The control module can be a PLC programmable control module. The control module first presets the air pressure of the upper and lower mold cylinders, the pre-pressurization time, the UV irradiation time, and the holding pressure time.
[0057] The following process can be implemented through PLC programming: After pressing the start button → a start signal is sent to the lower mold cylinder → the lower mold cylinder moves to the end position → the lower mold end point sensor grating sends a signal to the PLC → timing starts → after timing ends, a start signal is sent to the upper mold cylinder → the upper mold cylinder moves to the end position → the upper mold end point sensor grating sends a signal to the PLC → timing starts → after timing ends, a signal is sent to the UV lamp → the UV lamp starts → timing starts → after timing ends, a signal is sent to the UV lamp → the UV lamp turns off → timing starts → after timing ends, a start signal is sent to the upper mold cylinder → the upper mold moves to the starting position → the upper mold start point sensor grating sends a signal to the PLC → a start signal is sent to the lower mold cylinder → the lower mold cylinder moves to the starting position, completing one operation.
[0058] As shown in the accompanying drawings, the above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural or procedural transformations made using the content of the invention specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present invention.
Claims
1. An electronic paper bonding device, characterized in that, Used for bonding electronic paper and components to be bonded; Includes A support module, B horizontal module, and Z vertical module; Support module A includes horizontal support plate A1; The horizontal module B includes cylinder B1, support rod B2, and horizontal moving plate B3. Cylinder B1 drives support rod B2 to move horizontally, and support rod B2 drives horizontal moving plate B3 to move horizontally; horizontal support plate A1 is located below horizontal moving plate B3. The Z vertical module includes a Z1 cylinder, a Z2 support rod, and a Z3 vertical moving plate. Cylinder Z1 drives support rod Z2 to move vertically, and support rod Z2 drives vertical moving plate Z3 to move vertically; vertical moving plate Z3 is located above horizontal moving plate B3. Usage State 1: The B3 horizontal moving plate moves to the far end, allowing the user to place the electronic paper FPL sheet and the component to be bonded; Usage State 2: The B3 horizontal moving plate is moved to the near end, that is, below the Z3 vertical moving plate; Operating State 3: The Z3 vertical moving plate presses down, applying pressure to the electronic paper FPL sheet and the component to be bonded, so that the electronic paper FPL sheet and the component to be bonded are pressed and bonded into a single component.
2. The electronic paper bonding device according to claim 1, characterized in that, It also includes an L1 ultraviolet lamp, which is installed below the A1 horizontal support plate, which includes holes for ultraviolet light to pass through; the B3 horizontal moving plate includes a transparent part for ultraviolet light to pass through.
3. The electronic paper bonding device according to claim 2, characterized in that, For bonding electronic paper color-changing nail covers, the electronic paper color-changing nail cover includes an electronic paper FPL layer and a nail cover substrate; the holes are shaped like nail covers; the component to be bonded includes an array of multiple nail cover substrates.
4. The electronic paper bonding device according to claim 3, characterized in that, The Z3 vertical moving plate is provided with a pressure-applying part, which corresponds to the hole; The B3 horizontal moving plate is equipped with a support section, which has multiple accommodating spaces for accommodating electronic paper color-changing nail clippers.
5. The electronic paper bonding device according to claim 2, characterized in that, It also includes a control module, which is electrically connected to the B1 cylinder and is used to control the B1 cylinder. The control module is electrically connected to the Z1 cylinder, and the control module is used to control the Z1 cylinder; The control module is electrically connected to the L1 ultraviolet lamp, and the control module is used to control the L1 ultraviolet lamp; The control module includes a K1 button; the K1 button is used to control the entry into the next state. The control module includes a K0 button; the K0 button is used to control entry into the initial state.
6. The electronic paper bonding device according to claim 1, characterized in that, The B horizontal module also includes the B4 position sensing module; the B4 position sensing module is used to sense the far end position of the B3 horizontal moving plate. The B horizontal module also includes the B5 position sensing module; the B5 position sensing module is used to sense the near-end position of the B3 horizontal moving plate.
7. The electronic paper bonding device according to claim 6, characterized in that, The Z vertical module also includes the Z4 position sensing module; the Z4 position sensing module is used to sense the far end position of the Z3 vertical moving plate. The Z vertical module also includes the Z5 position sensing module; the Z5 position sensing module is used to sense the near-end position of the Z3 vertical moving plate.
8. A method for bonding electronic paper, characterized in that, For controlling the electronic paper bonding device of claim 7, comprising: Step T1, initial position return: The control module receives the instruction that the K0 button is pressed, drives the B1 cylinder to move the B3 horizontal moving plate to the near end position of the B3 horizontal moving plate, drives the Z1 cylinder to move the Z3 vertical moving plate to the near end position of the Z3 vertical moving plate. Step T2, move to the position where the component to be bonded is placed: The control module receives the instruction that the K1 button is pressed, drives the B1 cylinder, and moves the B3 horizontal moving plate to the far end of the B3 horizontal moving plate, waiting to place the electronic paper FPL sheet and the component to be bonded. Step T3, move to the fitting position: The control module receives the instruction that the K1 button is pressed, drives the B1 cylinder, and moves the B3 horizontal moving plate to the near end position of the B3 horizontal moving plate. Step T4, bonding: When the control module receives the instruction that the K1 button is pressed, it drives the Z1 cylinder to move the Z3 vertical moving plate to the far end of the Z3 vertical moving plate, pressing the electronic paper FPL sheet and the component to be bonded together.
9. The electronic paper bonding method according to claim 8, characterized in that, Its features include: After step T4, the following step is the illumination step T41: the L1 ultraviolet lamp electrical signal is turned on, allowing the ultraviolet lamp to irradiate the electronic paper FPL sheet and the component to be bonded for a set time.
10. The electronic paper bonding method according to claim 8, characterized in that, Its features include: Step T5, Remove the attached material: The control module receives the instruction that the K1 button is pressed, drives the Z1 cylinder, and moves the Z3 vertical moving plate to the far end position of the Z3 vertical moving plate. Drive cylinder B1 to move horizontal moving plate B3 to the far end of horizontal moving plate B3, waiting to remove the attached material.