Integrated wireless power transfer device and electrical device

Abstract

An integrated wireless power transfer apparatus includes a laminate substrate including a plurality of layers; a first circuit including first and second transformer windings coupled in series between first and second input nodes; a second circuit electrically isolated from the first circuit and including third and fourth transformer windings coupled in series between first and second output nodes; and a plurality of first contact pads and a plurality of second contact pads formed on a bottom surface of the laminate substrate. The first transformer winding is formed on a first layer of the laminate substrate, the third transformer winding is formed on the first layer of the laminate substrate, the fourth transformer winding is formed vertically above the first transformer winding on a second layer of the laminate substrate, the second transformer winding is formed vertically above the third transformer winding on the second layer of the laminate substrate, a first contact pad of the plurality of first contact pads is electrically coupled to the first circuit and a second contact pad of the plurality of second contact pads is electrically coupled to the second circuit. Electrical apparatuses are also provided.

Description

Technical Field

[0001] This disclosure relates generally to wireless power transmission systems, and also to integrated wireless power transmission equipment and electrical equipment. Background Technology

[0002] Wireless power transfer systems, such as wireless charging systems, provide a convenient and safe way to transfer energy from a power source to a load. In wireless power transfer systems, energy is transferred via an isolation transformer, eliminating the need for a wired connection between the power source and the load.

[0003] A wireless power transmission system may include a transmitter coil and a first driver chip on the input side of the system, and a receiver coil and a second driver chip on the output side. The transmitter coil can receive power from a power source. A load can be connected to the receiver coil. During operation of the wireless power transmission system, the input and output sides are connected to different potentials. Current isolation between components connected to different potentials is crucial. Implementing appropriate measures to meet current isolation requirements can be expensive and / or may significantly increase the size of the wireless power transmission system.

[0004] There is a need for a wireless power transmission system that meets all requirements regarding current isolation, is compact, and can be easily manufactured at low cost. Summary of the Invention

[0005] An integrated wireless power transmission device includes: a laminated substrate comprising multiple layers; a first circuit including a first transformer winding and a second transformer winding connected in series between a first input node and a second input node; a second circuit, which is current-isolated from the first circuit and includes a third transformer winding and a fourth transformer winding connected in series between a first output node and a second output node; and a plurality of first contact pads and a plurality of second contact pads formed on the bottom surface of the laminated substrate, wherein the first transformer winding is formed on the first layer of the laminated substrate, the third transformer winding is formed on the first layer of the laminated substrate laterally spaced from the first transformer winding, the fourth transformer winding is formed vertically above the first transformer winding on the second layer of the laminated substrate, the second transformer winding is formed vertically above the third transformer winding on the second layer of the laminated substrate, the first contact pads of the plurality of first contact pads are electrically coupled to the first circuit, and the second contact pads of the plurality of second contact pads are electrically coupled to the second circuit.

[0006] An electrical device includes: an integrated wireless power transmission device; a first circuit device including a first circuit element, wherein the first circuit device is electrically coupled to one or more of a plurality of first contact pads; a second circuit device including a second circuit element, wherein the second circuit device is electrically coupled to one or more of a plurality of second contact pads, wherein the first circuit device and the second circuit device are electrically isolated from each other, and the integrated wireless power transmission device is configured to transmit power from the first circuit device to the second circuit device to operate the second circuit element.

[0007] The invention can be better understood by referring to the following figures and description. The components in the figures are not necessarily to scale, but rather the emphasis is on illustrating the principles of the invention. Furthermore, in the figures, the same reference numerals denote corresponding parts in different views. Attached Figure Description

[0008] Figure 1 The components of a conventional wireless power transmission device are schematically shown in a circuit diagram.

[0009] Figure 2 The components of an integrated wireless power transmission device according to an embodiment of the present disclosure are schematically shown in a circuit diagram.

[0010] Figure 3 The transformer windings of an integrated wireless power transmission device according to an embodiment of the present disclosure are shown schematically in cross-sectional view.

[0011] Figure 4 An integrated wireless power transmission device according to an embodiment of the present disclosure is illustrated schematically in cross-sectional view.

[0012] Figure 5 An integrated wireless power transmission device according to an embodiment of the present disclosure is illustrated schematically in top view.

[0013] Figure 6 Another cross-sectional view schematically illustrates an integrated wireless power transmission device according to an embodiment of the present disclosure.

[0014] Figure 7 An integrated wireless power transmission device according to another embodiment of the present disclosure is illustrated schematically in cross-sectional view.

[0015] Figure 8 An integrated wireless power transmission device according to another embodiment of the present disclosure is illustrated schematically in top view.

[0016] Figure 9 Another cross-sectional view schematically illustrates an integrated wireless power transmission device according to another embodiment of the present disclosure.

[0017] Figure 10 An integrated wireless power transmission device according to a further embodiment of the present disclosure is illustrated schematically in a top view.

[0018] Figure 11 Another cross-sectional view schematically illustrates an integrated wireless power transmission device according to a further embodiment of the present disclosure.

[0019] Figure 12 An integrated wireless power transmission device according to an embodiment of the present disclosure is illustrated schematically in cross-sectional view.

[0020] Figures 13A to 13C An integrated wireless power transmission device according to another embodiment of the present disclosure is illustrated schematically in cross-sectional view.

[0021] Figure 14 An electrical device according to an embodiment of the present disclosure is shown schematically in cross-sectional view.

[0022] Figure 15A and Figure 15B A transformer winding of an integrated wireless power transmission device according to another embodiment of the present disclosure is schematically shown in a top view. Detailed Implementation

[0023] Wireless power transfer systems, such as wireless charging systems, provide a convenient and safe way to transfer energy from a power source to a load. In wireless power transfer systems, energy is transferred via an isolation transformer, eliminating the need for a current connection between the power source and the load. (See reference...) Figure 1 A wireless power transmission system is schematically illustrated. The system includes a first transformer coil 110 and a first control unit 114 on a first side 100, and a second transformer coil 210 and a second control unit 214 on a second side 200. The first transformer coil 110 can receive power from a power source 112. A load 212 can be connected to the second transformer coil 210. During operation of the wireless power transmission system, the first side 100 and the second side 200 are each connected to different potentials. In other words, the first circuit 100 can be configured to operate in a first voltage domain, and the second circuit 200 can be configured to operate in a second voltage domain different from the first voltage domain. Current isolation between components connected to different potentials or voltage domains is crucial. Implementing appropriate measures to meet the requirements regarding current isolation can be expensive and / or may significantly increase the size of the wireless power transmission system.

[0024] Now refer to Figure 2 and Figure 3The diagram schematically illustrates an integrated wireless power transmission device according to an embodiment of the present disclosure. Specifically, Figure 2 The elements of an integrated wireless power transmission device according to an embodiment of the present disclosure are illustrated in block diagram. Figure 3 A cross-sectional view schematically illustrates a laminated substrate 300 in which transformer windings of an integrated wireless power transmission device are formed, according to an embodiment of the present disclosure. In the integrated wireless power transmission device, the first circuit 100 includes a first transformer winding 110a and a second transformer winding 110b instead of a single transformer coil 110. Similarly, the second circuit 220 includes a third transformer winding 210a and a fourth transformer winding 210b instead of a single transformer coil 210. Specifically, the integrated wireless power transmission device includes a first circuit 100 and a second circuit 200. The first circuit 100 includes a first transformer winding 110a and a second transformer winding 110b connected in series between a first input node IN1 and a second input node IN2. The second circuit 200 is currently isolated from the first circuit 100 and includes a third transformer winding 210a and a fourth transformer winding 210b connected in series between a first output node OUT1 and a second output node OUT2. Similar to the above... Figure 1 As described, the first transformer winding 110a and the second transformer winding 110b can receive power from the power source 112. The load 212 can be connected to the third transformer winding 210a and the fourth transformer winding 210b.

[0025] exist Figure 2 In the wireless power transmission device exemplarily shown, power can be transmitted from the first circuit 100 to the second circuit 200. However, this is merely an example. The wireless power transmission device may also typically be bidirectional. That is, it is generally possible that, in a first mode, the wireless power transmission device is configured to transmit power from the first circuit 100 to the second circuit 200. The wireless power transmission device can also be configured to transmit power from the second circuit 200 to the first circuit 100 in a second mode. That is, as... Figure 2 The wireless power transmission device shown, with its components and interconnections, is merely one of several possible examples. Wireless power transmission devices can include more than... Figure 2 The components shown are more than just those shown. Furthermore, the different components can generally be connected to each other in any suitable manner that allows power to be transmitted from the first circuit 100 to the second circuit 200 and / or from the second circuit 200 to the first circuit 100.

[0026] Reference Figure 3The integrated wireless power transmission device further includes: a laminated substrate 300 comprising multiple layers; and a plurality of first contact pads 310 and a plurality of second contact pads 312 formed on the bottom surface of the laminated substrate 300. A first transformer winding 110a is formed on the first layer of the laminated substrate 300, a third transformer winding 210a is formed laterally spaced from the first transformer winding 110a on the first layer of the laminated substrate 300, a fourth transformer winding 210b is formed vertically above the first transformer winding 110a on the second layer of the laminated substrate 300, and a second transformer winding 110b is formed vertically above the third transformer winding 210a on the second layer of the laminated substrate 300. The first contact pads 310 of the plurality of first contact pads 310 are electrically coupled to a first circuit 100, and the second contact pads 312 of the plurality of second contact pads 312 are electrically coupled to a second circuit 200. The specific arrangement of the different transformer windings 110a, 110b, 210a, and 210b in the laminate 300 enables the integration of wireless power transmission devices in a very compact manner and at a relatively low cost, while fully complying with all requirements regarding current isolation. This will be described in further detail below.

[0027] The first and second layers of the laminate substrate 300 may be directly adjacent layers. However, it is also possible that one or more additional layers of the laminate substrate 300 are disposed between the first and second layers. Furthermore, the surface of the first layer may form the bottom surface of the laminate substrate 300. Alternatively, one or more additional layers of the laminate substrate 300 may be disposed between the first layer and the bottom of the laminate substrate 300.

[0028] As in Figure 3As can be seen in the cross-sectional view, the first transformer winding 110a and the fourth transformer winding 210b can be arranged closer to the first lateral side than to the second lateral side of the laminate substrate 300 (which is opposite to the first lateral side), and the third transformer winding 210a and the second transformer winding 110b can be arranged closer to the second lateral side than to the first lateral side of the laminate substrate 300. For example, a plurality of first contact pads 310 can be partially arranged below the first transformer winding 110a, and a plurality of second contact pads 312 can be partially arranged below the third transformer winding 210a. That is, the plurality of first contact pads 310 can be partially arranged below the transformer windings to which they are electrically connected. Similarly, the plurality of second contact pads 312 can be partially arranged below the transformer windings to which they are electrically connected. However, the contact pads of the first plurality of contact pads 310 and the second plurality of contact pads 312 do not necessarily have to be partially arranged below the corresponding transformer windings 110a and 210a. Some or all of the contact pads can be arranged laterally spaced from the corresponding transformer windings 110a, 210a. However, it can be said that the plurality of first contact pads 310 can be arranged closer to the first transformer winding 110a than closer to the third transformer winding 210a, and the plurality of second contact pads 312 can be arranged closer to the third transformer winding 210a than closer to the first transformer winding 110a. Since the plurality of first contact pads 310 and the first transformer winding 110a are coupled to the same potential, and similarly, the plurality of second contact pads 312 and the third transformer winding 210a are coupled to the same potential, the first layer of the laminate 300 and any (optional) additional layers disposed below the first transformer winding 110a and the third transformer winding 210a (between the first transformer winding 110a and the third transformer winding 210a and the bottom of the laminate 300) can be implemented as relatively thin layers. This is because only functional isolation is required between components coupled to the same potential.

[0029] The current isolation between the plurality of first contact pads 310 and the third transformer winding 210a is caused by a sufficiently large lateral distance between the relevant components. The same applies to the plurality of second contact pads 312 and the first transformer winding 110a. Furthermore, by means of the different layers of the laminate 300 disposed therebetween (i.e., the first and second layers of the laminate 300, and any optional additional layers of the laminate 300), the plurality of first contact pads 310 are sufficiently current isolated from the fourth transformer winding 210b, and the plurality of second contact pads 312 are sufficiently current isolated from the second transformer winding 110b. The specific arrangement of the different components in the laminate 300, particularly the diagonal arrangement of the first transformer winding 110a and the second transformer winding 110b, and the third transformer winding 210a and the fourth transformer winding 210b, respectively, ensures sufficient current isolation between the components of the first circuit 100 and the components of the second circuit.

[0030] Still refer to Figure 3 The following applies. The laminate substrate 300 can be substantially divided into a first section S1 and a second section S2 arranged adjacent to each other in the lateral direction. A first transformer winding 110a, a fourth transformer winding 210b, and a plurality of first contact pads 310 can be arranged in the first section S1, and a third transformer winding 210a, a second transformer winding 110b, and a plurality of second contact pads 312 can be arranged in the second section S2. A third section S3 can be arranged between the first section S1 and the second section S2, wherein no other conductive structures are arranged in the third section S3 except for the simple conductor tracks required to electrically couple the components arranged in the first section S1 to the components arranged in the second section S2. In this way, current isolation between the components arranged in the first section S1 and the components arranged in the second section S2 can be ensured.

[0031] As described above, the first circuit 100 can be configured to wirelessly transmit power to and / or wirelessly receive power from the second circuit 200. Therefore, the first circuit 100 may further include a first control component 114 configured to control power transmission from the first circuit 100 to the second circuit 200. Alternatively or additionally, the first control component 114 may be configured to control power reception. The second circuit 200 may further include a second control component 214 configured to control power reception and disposed on or integrated into the laminated substrate 300. Alternatively or additionally, the second control component 214 may be configured to control power transmission from the second circuit 200 to the first circuit 100. Figure 2 The exemplary circuit diagram schematically shows the first control unit 114 and the second control unit 214.

[0032] The first control component 114 and the second control component 214 may be disposed on or integrated into the laminated substrate 300. Now refer to Figure 4 At least a third layer of the laminated substrate 300 may be disposed between the second layer and the top surface of the laminated substrate 300 opposite to the bottom surface, wherein a second transformer winding 110b and a fourth transformer winding 210b are formed on the second layer. A second control member 214 is disposed on the top surface of the laminated substrate 300, and a first control member 114 is disposed on the top surface of the laminated substrate 300. Figure 4 In the example shown, the second control component 214 is arranged closer to the first lateral side than to the second lateral side of the laminate 300, and the first control component 114 is arranged closer to the second lateral side than to the first lateral side of the laminate 300. In this way, the first control component 114, as part of the first circuit 100, is arranged closer to the second transformer winding 110b, which is also part of the first circuit 100, than to the fourth transformer winding 210b, which is also part of the second circuit 200. Similarly, the second control component 214, as part of the second circuit 200, is arranged closer to the fourth transformer winding 210b, which is also part of the second circuit 200, than to the second transformer winding 110b, which is also part of the first circuit 100. In this way, sufficient current isolation between the first circuit 100 and the second circuit 200 can be ensured even if any layer of the laminate 300, vertically arranged above the second layer, is relatively thin.

[0033] Still refer to Figure 4 And further refer to Figure 5 and Figure 6 The second control unit 214 may be arranged at least partially vertically above the fourth transformer winding 210b, and / or the first control unit 114 may be arranged at least partially vertically above the second transformer winding 110b. In this way, the integrated wireless power transmission device can be implemented in a compact and space-saving manner, while still providing sufficient current isolation between the first circuit 100 and the second circuit 200. Figure 5 An integrated wireless power transmission device is schematically shown in a top view, wherein a second control unit 214 is arranged partially vertically above a fourth transformer winding 210b, and a first control unit 114 is arranged at least partially vertically above a second transformer winding 110b. Figure 6 schematically shown Figure 5 Another cross-sectional view of the integrated wireless power transmission device (along as shown) Figure 5 The cross section A-A' is shown. However, Figure 4 , Figure 5 and Figure 6 The arrangement shown is merely an example.

[0034] According to an alternative embodiment, the first control member 114 may also be arranged closer to the first lateral side than to the second lateral side of the laminated substrate 300, and the second control member 214 may be arranged closer to the second lateral side than to the first lateral side of the laminated substrate 300. This is in Figure 7 , Figure 8 and Figure 9 This is schematically illustrated. In this case, the first control component 114, which is part of the first circuit 100, is arranged closer to the fourth transformer winding 210b, which is part of the second circuit 200, than to the second transformer winding 110b, which is part of the first circuit 100. Similarly, the second control component 214, which is part of the second circuit 200, is arranged closer to the second transformer winding 110b, which is part of the first circuit 100, than to the fourth transformer winding 210b, which is part of the second circuit 200. Therefore, to ensure sufficient current isolation between the first circuit 100 and the second circuit 200, in this example, the first control component 114 can be laterally spaced from the fourth transformer winding 210b, such that the lateral distance d1 between the first control component 114 and the fourth transformer winding 210b is greater than zero (see [reference]). Figure 8 and Figure 9 Alternatively or additionally, the second control unit 214 may be laterally spaced from the second transformer winding 110b, such that the lateral distance d2 between the second control unit 214 and the second transformer winding 110b is greater than zero (see [link to relevant documentation]). Figure 8 The lateral distances d1 and d2 can typically be set large enough to ensure dielectric isolation between the first control unit 114 and the fourth transformer winding 210b, and between the second control unit 214 and the second transformer winding 110b, respectively. In some cases, short lateral distances d1 and d2 may be sufficient, while in others, relatively large lateral distances d1 and d2 may be required to reliably ensure dielectric isolation.

[0035] exist Figures 4 to 9 In the exemplary arrangement shown, both the first control component 114 and the second control component 214 are disposed on the laminated substrate 300 (i.e., on the top surface of the laminated substrate 300 opposite to the bottom surface). However, it is also generally possible to integrate at least one of the first control component 114 and the second control component 214 into the laminated substrate 300. Figure 10 and Figure 11 In the schematic arrangement shown, both the first control component 114 and the second control component 214 are integrated into the laminate substrate 300. For example, and as shown... Figure 11As schematically shown in the cross-sectional view, the first control component 114 and / or the second control component 214 may be arranged on the first layer of the laminate substrate 300 (on the same layer, the first transformer winding 110a and the third transformer winding 210a are formed).

[0036] exist Figure 10 and Figure 11 In the example shown, the first control component 114 is arranged closer to the first lateral side than to the second lateral side, and the second control component 214 is arranged closer to the second lateral side than to the first lateral side. In this way, the first control component 114, as part of the first circuit 100, is arranged in the same plane as the first transformer winding 110a and the third transformer winding 210a, and is closer to the first transformer winding 110a, which is part of the first circuit 100, than to the third transformer winding 210a, which is part of the second circuit 200. The second control component 214, as part of the second circuit 200, is also arranged in the same plane as the first transformer winding 110a and the third transformer winding 210a, and is closer to the third transformer winding 210a, which is part of the second circuit 200, than to the first transformer winding 110a, which is part of the first circuit 100. Therefore, the lateral distance d1 between the first control component 114 and the first transformer winding 110a, and the lateral distance d2 between the second control component 214 and the third transformer winding 210a, can be relatively small.

[0037] Electrical connections between different components of an integrated wireless power transmission device can be achieved using conductor tracks (e.g., metal layers) on different layers of the laminated substrate 300. For example, conductor tracks arranged on different layers of the laminated substrate 300 can be electrically coupled to each other via so-called through-holes. Figure 5 , Figure 8 and Figure 10 In the diagram, conductor tracks formed on the first layer of the laminated substrate 300 are indicated by dashed lines, while conductor tracks formed on the second layer of the laminated substrate 300 are indicated by solid lines. Through-holes between conductor tracks arranged on different layers are indicated by circles. Figure 5 , Figure 8 and Figure 10 In the top view, only the second transformer winding 110b and the fourth transformer winding 210b arranged on the second layer of the laminate substrate 300 are visible. The first transformer winding 110a arranged on the first layer is hidden by the fourth transformer winding 210b, and the third transformer winding 210a arranged on the first layer is hidden by the second transformer winding 110b.

[0038] According to some examples, the first transformer winding 110a can be wound clockwise, and the second transformer winding 110b can be wound counterclockwise. Alternatively, the first transformer winding 110a can be wound counterclockwise, and the second transformer winding 110b can be wound clockwise. This similarly applies to the third transformer winding 210a and the fourth transformer winding 210b. In particular, the third transformer winding 210a can be wound clockwise, and the fourth transformer winding 210b can be wound counterclockwise, or the third transformer winding 210a can be wound counterclockwise, and the fourth transformer winding 210b can be wound clockwise. If two transformer windings belonging to the same circuit 100 and 200 are wound clockwise and counterclockwise respectively, this causes the magnetic fields to cancel each other out at a certain distance from the respective transformer windings.

[0039] Now refer to Figure 12 The integrated wireless power transmission device may also include a molding compound 400 that covers the top surface of the laminate 300 opposite the bottom surface. In this way, the top surface of the laminate 300 and any components disposed thereon (e.g., the first control component 114 and / or the second control component 214) can be protected from environmental influences and mechanical damage. Therefore, the integrated wireless power transmission device can be safely handled and integrated into electrical equipment, which will be described in further detail below.

[0040] Now refer to Figure 13A The integrated wireless power transmission device may further include a first magnetic core 402, which comprises one or more layers of magnetic material and extends vertically through the laminated substrate 300 and through the central region of the fourth transformer winding 210b and the central region of the first transformer winding 110a. Alternatively or additionally, the integrated wireless power transmission device may further include a second magnetic core 404, which comprises one or more layers of magnetic material and extends vertically through the laminated substrate 300 and through the central region of the second transformer winding 110b and the central region of the third transformer winding 210a. The first magnetic core 402 and the second magnetic core 404 may be configured to guide corresponding magnetic fields. For example, the first magnetic core 402 and the second magnetic core 404 may comprise ferromagnetic metals (such as iron) or ferrimagnetic compounds (such as ferrite) or be composed of ferromagnetic metals (such as iron) or ferrimagnetic compounds (such as ferrite). Compared to implementations without a magnetic core, the use of a magnetic core can increase the magnetic field strength in the electromagnetic coil by hundreds of times. Figure 13AIn this design, transformer windings 110a, 110b, 210a, and 210b are indicated by circles extending around a central region and around the corresponding magnetic cores 402 and 404 arranged in the central region. This is only a very general indication of the arrangement of the transformer windings in the laminate 300. Different windings of the transformer can be arranged in the same plane, such as... Figure 13A The diagram illustrates, for example, arrangements in different planes.

[0041] Each of the first magnetic core 402 and the second magnetic core 404 may extend through all layers of the laminated substrate 300 or only through a subset of the layers of the laminated substrate 300. Figure 13A In the example shown, the first magnetic core 402 and the second magnetic core 404 extend only through a subset of the layers of the laminated substrate 300. That is, in Figure 13A In the example shown, the first magnetic core 402 and the second magnetic core 404 are not visible at the top and bottom surfaces of the laminate 300. However, the first magnetic core 402 and the second magnetic core 404 may also extend through the entire layer stack forming the laminate 300, making them visible at the top and bottom surfaces of the laminate 300. The first magnetic core 402 and the second magnetic core 404 can generally be implemented in any suitable manner.

[0042] Reference Figure 13B and Figure 13C , instead of Figure 13A As shown, it extends vertically through the laminated substrate 300 and through the central region of the corresponding transformer winding, or in addition to... Figure 13A As shown, extending vertically through the laminated substrate 300 and beyond the central region of the respective transformer windings, magnetic cores 402 and 404 may also be located between the respective transformer windings (see...). Figure 13B ), above and / or below the corresponding transformer winding (see Figure 13C) Horizontal extension. That is, generally speaking, an integrated wireless power transmission device may include: a first magnetic core 402, which includes one or more magnetic material layers disposed between the fourth transformer winding 210b and the first transformer winding 110a, one or more magnetic material layers disposed between the first transformer winding 110a and the bottom surface of the laminate substrate 300, and / or one or more magnetic material layers disposed between the fourth transformer winding 210b and the top surface of the laminate substrate 300 opposite to the bottom surface. Similarly, an integrated wireless power transmission device may include: a second magnetic core 404, which includes one or more magnetic material layers disposed between the second transformer winding 110b and the third transformer winding 210a, one or more magnetic material layers disposed between the third transformer winding 210a and the bottom surface of the laminate substrate 300, and / or one or more magnetic material layers disposed between the second transformer winding 110b and the top surface of the laminate substrate 300.

[0043] Figure 13A , Figure 13B and Figure 13C The different implementations shown can generally be appropriately combined with each other. Figure 13B and Figure 13C In the diagram, the first magnetic core 402 is shown with a dimension in the horizontal direction x that is substantially equal to the dimension of the corresponding transformer windings 110a and 210b in the same direction. Similarly, the second magnetic core 404 is shown with a dimension in the horizontal direction x that is substantially equal to the dimension of the corresponding transformer windings 110b and 210a. However, this is merely an example. The magnetic cores 402 and 404 in the horizontal direction x can typically have dimensions different from those of the corresponding transformer windings in the same direction. The magnetic material forming the first magnetic core 402 and the second magnetic core 404 can be applied to or formed in one or more layers of the laminate substrate 300. By appropriately selecting the general shape and size of the magnetic cores 402 and 404, the field distribution can be set or influenced in a desired manner.

[0044] Now refer to Figure 14The diagram schematically illustrates an electrical device according to an embodiment of the present disclosure. The electrical device includes an integrated wireless power transmission device according to any of the various embodiments described herein. The electrical device also includes: a first circuit device 502 including a first circuit element 602, wherein the first circuit device 502 is electrically coupled to one or more of a plurality of first contact pads 310; and a second circuit device 504 including a second circuit element 604, wherein the second circuit device 504 is electrically coupled to one or more of a plurality of second contact pads 312. The first circuit device 502 and the second circuit device 504 are electrically isolated, and the integrated wireless power transmission device is configured to transmit power from the first circuit device 502 to the second circuit device 504 to operate the second circuit element 604 (and vice versa).

[0045] According to some implementation methods, and as Figure 14 As schematically shown, the first circuit arrangement 502 may include a second laminated substrate, and the second circuit arrangement 504 may include a third laminated substrate that is separate from and distinct from the second laminated substrate. In this example, the integrated wireless power transmission device may be mechanically and electrically coupled to one or more contact elements (e.g., contact pads) disposed on the surface of the second laminated substrate, and the integrated wireless power transmission device may be mechanically and electrically coupled to one or more contact elements (e.g., contact pads) disposed on the surface of the third laminated substrate. Figure 14 (Contact elements not specifically shown in the image).

[0046] For example, one or more of the plurality of first contact pads 310 may be mechanically and electrically coupled (directly or indirectly via intermediary connecting elements such as pins or bonding wires) to one or more contact pads disposed on the surface of the second laminate substrate, and one or more of the plurality of second contact pads 312 may be mechanically and electrically coupled (directly or indirectly via intermediary connecting elements such as pins or bonding wires) to one or more contact elements disposed on the surface of the third laminate substrate. According to some embodiments, the integrated wireless power transmission device may be mechanically coupled to one or more contact elements disposed on the surface of the second laminate substrate by means of a glued joint, soldered connection, welded connection, or clamp connection. Similarly, the integrated wireless power transmission device may be mechanically coupled to one or more contact elements disposed on the surface of the third laminate substrate by means of a glued joint, soldered connection, welded connection, or clamp connection.

[0047] However, the electrical device including the first circuit device 502 and the second circuit device 504 is merely an example, wherein the first circuit device 502 includes a second laminated substrate, and the second circuit device 504 includes a third laminated substrate separate from and distinct from the second laminated substrate. According to another example (not specifically shown), alternatively, the first circuit device 502 may be arranged on and / or integrated within a first segment of a fourth laminated substrate, and the second circuit device 504 may be arranged on and / or integrated within a second segment of the fourth laminated substrate. The first and second segments of the fourth laminated substrate may be arranged adjacent to each other in the lateral direction. The third segment of the fourth laminated substrate may be arranged between the first and second segments, wherein no conductive elements or structures are arranged in the third segment. In this way, even if the first circuit device 502 and the second circuit device 504 are arranged on or integrated within the same laminated substrate, current isolation between components electrically coupled to different potentials can be ensured. In this configuration, the integrated wireless power transmission device can be mechanically and electrically coupled to one or more contact elements disposed on the surface of the fourth laminate substrate. Specifically, one or more of the plurality of first contact pads 310 can be mechanically and electrically coupled to one or more of the first contact elements disposed on the surface of the fourth laminate substrate, and one or more of the plurality of second contact pads 312 can be mechanically and electrically coupled to one or more of the second contact elements disposed on the surface of the fourth laminate substrate.

[0048] Similar to the above about Figure 14 As described, the integrated wireless power transmission device can be mechanically coupled to one or more first contact elements disposed on the surface of a fourth laminate substrate by means of adhesive joints, brazing connections, welding connections, diffusion bonding connections, or clamping connections, and the integrated wireless power transmission device can be mechanically coupled to one or more second contact elements disposed on the surface of the fourth laminate substrate by means of adhesive joints, brazing connections, welding connections, or clamping connections.

[0049] Whether the integrated wireless power transmission device is electrically and mechanically coupled to two separate laminates (i.e., the second laminate and the third laminate) or electrically and mechanically coupled to a single laminate (i.e., the fourth laminate), the first circuit element 602 may be a controller or may include a controller, and the second circuit element 604 may be a controllable transistor device or may include a controllable transistor device.

[0050] exist Figures 3 to 14In the illustrated embodiment, a plurality of first contact pads 310 are arranged laterally spaced apart from each other along a first lateral side of the laminated substrate 300, and a plurality of second contact pads 312 are arranged laterally spaced apart from each other along a second lateral side of the laminated substrate 300, wherein the second lateral side is opposite to the first lateral side. However, this is merely an example. The plurality of first contact pads 310 and the plurality of second contact pads 312 may typically be arranged along the same lateral side of the laminated substrate 300 or along different lateral sides. (Refer to...) Figure 15A For example, a plurality of first contact pads 310 are arranged along a first lateral side of the laminated substrate 300, and a plurality of second contact pads 312 are arranged along a second lateral side of the laminated substrate 300. However, in this example, the second lateral side extends perpendicular to the first lateral side. Figure 15B The diagram schematically illustrates an arrangement in which a plurality of first contact pads 310 and a plurality of second contact pads 312 extend along the same lateral side of the laminate substrate 300. However, as described above, the plurality of first contact pads 310 may be arranged closer to the first transformer winding 110a than to the third transformer winding, and the plurality of second contact pads 312 may be arranged closer to the third transformer winding 210a than to the first transformer winding 110a, in order to ensure sufficient current isolation. In another embodiment (not specifically shown), the contact pads forming the plurality of first contact pads 310 may be distributed along more than one lateral side of the laminate substrate 300, and / or the contact pads forming the plurality of second contact pads 312 may be distributed along more than one lateral side of the laminate substrate 300.

[0051] The laminate substrate 300 is typically formed of a non-conductive material that provides mechanical support and electrical insulation for any components and conductive traces disposed thereon or integrated therein. The laminate substrate may include or be composed of rigid materials such as, for example, glass fiber reinforced epoxy laminates, bismaleimide-triazine, BT, resins, or imide-based polymers. The laminate substrate 300 may include core elements used in the lamination process to add additional layers. The core element itself may include or be composed of laminated elements. Any other suitable materials are generally possible. Multilayer substrates typically comprise two or more distinct layers. A laminate substrate 300 including contact pads disposed on its bottom surface and forming terminal elements for contacting external connection elements may be referred to as a platform grid array (LGA) substrate. Integrated wireless power transmission devices may be provided in the form of an LGA package. In other implementations, the wireless power transmission device may be provided as a pin grid array (PGA) package or a ball grid array (BGA) package, wherein terminal elements may be provided in the form of pins or balls connected to the provided contact pads.

[0052] If the integrated wireless power transmission device includes a first control component 114 and / or a second control component 214 disposed on the top surface of the laminate substrate 300, the corresponding control components 114, 214 can be electrically coupled to the corresponding structure of the integrated wireless power transmission device by means of a so-called flip-chip assembly. That is, the contact pads of the corresponding control components 114, 214 can be directly attached to the corresponding contact pads disposed on the top surface of the laminate substrate 300. Alternatively, the corresponding control components 114, 214 can also be electrically coupled to the corresponding contact pads disposed on the top surface of the laminate substrate 300 by means of bonding wires.

[0053] In conventional wireless power transmission devices, components belonging to one voltage domain are typically arranged relatively close to components belonging to another voltage domain. In such devices, appropriate measures are required to provide sufficient current isolation between different voltage domains. For example, if the lateral distance between related components is too short, one or more layers of the multilayer substrate may have to be implemented with a defined minimum thickness. Alternatively, the lateral distance between related components needs to be increased. Such measures typically result in an increase in the size (laterally and / or vertically) of the corresponding substrate. Due to the lateral separation of components arranged in the same layer of the laminate 300 and belonging to different voltage domains, the integrated wireless power transmission devices according to the various embodiments described herein can be implemented in a compact manner. The integrated wireless power transmission devices according to the embodiments described herein meet all requirements regarding functional isolation and enhanced isolation. Enhanced isolation for operating voltages up to 10.3 kV in integrated wireless power transmission equipment is typically required only in the lateral direction, specifically between the first transformer winding 110a and the third transformer winding 210a arranged on the first layer, and between the fourth transformer winding 210b and the second transformer winding 110b arranged on the second layer of the laminate substrate 300. This enhanced isolation can be easily achieved by arranging corresponding components belonging to different voltage domains with a defined lateral distance between them.

[0054] This disclosure can be further illustrated by the following implementation methods.

[0055] According to the first example, the integrated wireless power transmission device includes: a laminated substrate 300 comprising multiple layers; a first circuit 100 including a first transformer winding 110a and a second transformer winding 110b series coupled between a first input node IN1 and a second input node IN2; a second circuit 200, which is current-isolated from the first circuit 100 and includes a third transformer winding 210a and a fourth transformer winding 210b series coupled between a first output node OUT1 and a second output node OUT2; and a plurality of first contact pads 310 and a plurality of second contact pads 312 formed on the bottom surface of the laminated substrate 300, wherein the first transformer... A transformer winding 110a is formed on the first layer of the laminate substrate 300. A third transformer winding 210a is formed on the first layer of the laminate substrate 300, spaced laterally from the first transformer winding 110a. A fourth transformer winding 210b is formed vertically on the second layer of the laminate substrate 300 above the first transformer winding 110a. A second transformer winding 110b is formed vertically on the second layer of the laminate substrate 300 above the third transformer winding 210a. The first contact pad 310 of the plurality of first contact pads 310 is electrically coupled to the first circuit 100, and the second contact pad 312 of the plurality of second contact pads 312 is electrically coupled to the second circuit 200.

[0056] According to a second example based on the first example, the first circuit 100 can be configured to wirelessly send power to and / or wirelessly receive power from the second circuit 200.

[0057] According to a third example based on the second example, the first circuit 100 may further include a first control component 114 disposed on or integrated in the laminated substrate 300, and the second circuit 200 may further include a second control component 214 disposed on or integrated in the laminated substrate 300, wherein the first control component 114 and the second control component 214 are configured to control the power transmission between the first circuit 100 and the second circuit 200.

[0058] According to the fourth example based on any one of the first to third examples, the first contact pads 310 of the plurality of first contact pads 310 may be arranged laterally spaced apart from each other along the lateral side of the laminated substrate 300, and the second contact pads 312 of the plurality of second contact pads 312 may be arranged laterally spaced apart from each other along the same or different lateral side of the laminated substrate 300 along the lateral side of the plurality of first contact pads 310.

[0059] According to a fifth example based on the fourth example, the laminate 300 may include a first lateral side and a second lateral side opposite to the first lateral side, wherein the first transformer winding 110a and the fourth transformer winding 210b are arranged closer to the first lateral side than to the second lateral side of the laminate 300, and the third transformer winding 210a and the second transformer winding 110b are arranged closer to the second lateral side than to the first lateral side of the laminate 300.

[0060] According to a sixth example based on the fourth or fifth example, the integrated wireless power transmission device may also include a molding compound 400 that covers the top surface of the laminate substrate 300 opposite to the bottom surface.

[0061] According to the seventh example based on any one of the fourth to sixth examples, at least a third layer of the laminate 300 may be disposed between the second layer and the top surface of the laminate 300 opposite to the bottom surface, wherein a second transformer winding 110b and a fourth transformer winding 210b are formed on the second layer, wherein a second control member 214 is disposed on the top surface of the laminate 300, and a first control member 114 is disposed on the top surface of the laminate 300.

[0062] According to the eighth example based on the seventh example, the laminated substrate 300 may include a first lateral side and a second lateral side opposite to the first lateral side, wherein the second control member 214 is arranged closer to the first lateral side than the second lateral side of the laminated substrate 300, and the first control member 114 is arranged closer to the second lateral side than the first lateral side of the laminated substrate 300.

[0063] According to the ninth example based on the eighth example, the second control component 214 may be arranged at least partially vertically above the fourth transformer winding 210b, and / or the first control component 114 may be arranged at least partially vertically above the second transformer winding 110b.

[0064] According to the tenth example based on the seventh example, the first control member 114 can be arranged closer to the first lateral side than to the second lateral side of the laminate substrate 300, and the second control member 214 can be arranged closer to the second lateral side than to the first lateral side of the laminate substrate 300.

[0065] According to the eleventh example based on the tenth example, the first control component 114 may be laterally spaced from the fourth transformer winding 210b such that the lateral distance d1 between the first control component 114 and the fourth transformer winding 210b is greater than zero, and / or the second control component 214 may be laterally spaced from the second transformer winding 110b such that the lateral distance d2 between the second control component 214 and the second transformer winding 110b is greater than zero.

[0066] According to the twelfth example based on any of the foregoing examples, the first transformer winding 110a can be wound clockwise and the second transformer winding 110b can be wound counterclockwise, or the first transformer winding 110a can be wound counterclockwise and the second transformer winding 110b can be wound clockwise, and the third transformer winding 210a can be wound clockwise and the fourth transformer winding 210b can be wound counterclockwise, or the third transformer winding 210a can be wound counterclockwise and the fourth transformer winding 210b can be wound clockwise.

[0067] According to the thirteenth example based on any of the foregoing examples, the integrated wireless power transmission device may further include a first magnetic core 402 and / or a second magnetic core 404, the first magnetic core 402 comprising one or more layers of magnetic material and extending vertically through the laminated substrate 300 and through the central region of the fourth transformer winding 210b and the central region of the first transformer winding 110a, the second magnetic core 404 comprising one or more layers of magnetic material and extending vertically through the laminated substrate 300 and through the central region of the second transformer winding 110b and the central region of the third transformer winding 210a.

[0068] According to the fourteenth example based on any of the foregoing examples, the integrated wireless power transmission device may further include: a first magnetic core 402 and / or a second magnetic core 404, the first magnetic core 402 including one or more magnetic material layers disposed between the fourth transformer winding 210b and the first transformer winding 110a, one or more magnetic material layers disposed between the first transformer winding 110a and the bottom surface of the laminate substrate 300, and / or one or more magnetic material layers disposed between the fourth transformer winding 210b and the top surface of the laminate substrate 300 opposite to the bottom surface; the second magnetic core 404 including one or more magnetic material layers disposed between the second transformer winding 110b and the third transformer winding 210a, one or more magnetic material layers disposed between the third transformer winding 210a and the bottom surface of the laminate substrate 300, and / or one or more magnetic material layers disposed between the second transformer winding 110b and the top surface of the laminate substrate 300.

[0069] According to the fifteenth example based on any of the foregoing examples, the first circuit 100 may be configured to operate in a first voltage domain, and the second circuit 200 may be configured to operate in a second voltage domain different from the first voltage domain.

[0070] According to the sixteenth example, the electrical device includes: an integrated wireless power transmission device of any of the preceding examples; a first circuit device 502 including a first circuit element 602, wherein the first circuit device 502 is electrically coupled to one or more of a plurality of first contact pads 310; a second circuit device 504 including a second circuit element 604, wherein the second circuit device 504 is electrically coupled to one or more of a plurality of second contact pads 312, wherein the first circuit device 502 and the second circuit device 504 are current isolated, and the integrated wireless power transmission device is configured to transmit power from the first circuit device 502 to the second circuit device 504 to operate the second circuit element 604.

[0071] According to the seventeenth example based on the sixteenth example, the first circuit device 502 may include a second laminated substrate, and the second circuit device 504 may include a third laminated substrate that is separate from and different from the second laminated substrate.

[0072] According to the eighteenth example based on the seventeenth example, the integrated wireless power transmission device can be mechanically and electrically coupled to one or more contact elements disposed on the surface of the second laminate substrate, and the integrated wireless power transmission device can be mechanically and electrically coupled to one or more contact elements disposed on the surface of the third laminate substrate.

[0073] According to the nineteenth example based on the eighteenth example, one or more of the plurality of first contact pads 310 may be mechanically and electrically coupled to one or more contact elements disposed on the surface of the second laminate substrate, and one or more of the plurality of second contact pads 312 may be mechanically and electrically coupled to one or more contact elements disposed on the surface of the third laminate substrate.

[0074] According to the twentieth example based on the eighteenth or nineteenth example, the integrated wireless power transmission device can be mechanically coupled to one or more contact elements disposed on the surface of the second laminate substrate by means of adhesive joints, brazing connections, welding connections or clamping connections, and the integrated wireless power transmission device can be mechanically coupled to one or more contact elements disposed on the surface of the third laminate substrate by means of adhesive joints, brazing connections, welding connections or clamping connections.

[0075] According to the twenty-first example based on the sixteenth example, the first circuit device 502 may be arranged on and / or integrated in the first segment of the fourth laminate substrate, and the second circuit device 504 may be arranged on and / or integrated in the second segment of the fourth laminate substrate.

[0076] According to Example Twenty-Two, which is based on Example Twenty-One, the integrated wireless power transmission device can be mechanically and electrically coupled to one or more contact elements disposed on the surface of the fourth laminate substrate.

[0077] According to the twenty-third example based on the twenty-second example, one or more of the plurality of first contact pads 310 may be mechanically and electrically coupled to one or more of the first contact elements disposed on the surface of the fourth laminate substrate, and one or more of the plurality of second contact pads 312 may be mechanically and electrically coupled to one or more of the second contact elements disposed on the surface of the fourth laminate substrate.

[0078] According to Example 24, which is based on Example 22 or Example 23, the integrated wireless power transmission device can be mechanically coupled to one or more first contact elements disposed on the surface of the fourth laminate substrate by means of adhesive joints, brazing connections, welding connections or clamping connections, and the integrated wireless power transmission device can be mechanically coupled to one or more second contact elements disposed on the surface of the fourth laminate substrate by means of adhesive joints, brazing connections, welding connections or clamping connections.

[0079] According to Example Twenty-Five, which is based on any of Examples Sixteen through Twenty-Four, the first circuit element 602 may be a controller or may include a controller, and the second circuit element 604 may be a controllable transistor device or may include a controllable transistor device.

Claims

1. An integrated wireless power transmission device, comprising: A laminated substrate (300) comprising multiple layers; The first circuit (100) includes a first transformer winding (110a) and a second transformer winding (110b) connected in series between a first input node (IN1) and a second input node (IN2). The second circuit (200), which is current-isolated from the first circuit (100), includes a third transformer winding (210a) and a fourth transformer winding (210b) connected in series between the first output node (OUT1) and the second output node (OUT2); and A plurality of first contact pads (310) and a plurality of second contact pads (312) are formed on the bottom surface of the laminated substrate (300), wherein, The first transformer winding (110a) is formed on the first layer of the laminate substrate (300). The third transformer winding (210a) is formed laterally spaced from the first transformer winding (110a) on the first layer of the laminate substrate (300). The fourth transformer winding (210b) is formed vertically above the first transformer winding (110a) on the second layer of the laminate substrate (300). The second transformer winding (110b) is formed vertically above the third transformer winding (210a) on the second layer of the laminate substrate (300). The first contact plate (310) of the plurality of first contact plates (310) is electrically coupled to the first circuit (100), and The second contact plate (312) of the plurality of second contact plates (312) is electrically coupled to the second circuit (200).

2. The integrated wireless power transmission device according to claim 1, wherein, The first circuit (100) is configured to wirelessly transmit power to the second circuit (200) and / or wirelessly receive power from the second circuit (200).

3. The integrated wireless power transmission device according to claim 2, wherein, The first circuit (100) further includes a first control component (114) disposed on or integrated into the laminated substrate (300), and The second circuit (200) further includes a second control component (214) disposed on or integrated in the laminated substrate (300), wherein, The first control unit (114) and the second control unit (214) are configured to control the power transmission between the first circuit (100) and the second circuit (200).

4. The integrated wireless power transmission device according to claim 3, wherein, The first contact pads (310) of the plurality of first contact pads (310) are arranged laterally spaced from each other along the lateral side of the laminated substrate (300), and The second contact pads (312) of the plurality of second contact pads (312) are arranged laterally spaced from each other along the same or different lateral sides of the laminate substrate (300) from the lateral sides along which the plurality of first contact pads (310) are arranged.

5. The integrated wireless power transmission device according to claim 4, wherein, The laminated substrate (300) includes a first lateral side and a second lateral side opposite to the first lateral side, and wherein, The first transformer winding (110a) and the fourth transformer winding (210b) are arranged closer to the first lateral side than to the second lateral side of the laminate substrate (300); and The third transformer winding (210a) and the second transformer winding (110b) are arranged to be closer to the second lateral side than to the first lateral side of the laminate substrate (300).

6. The integrated wireless power transmission device according to claim 4 or 5, further comprising a molding compound (400) covering a top surface of the laminated substrate (300) opposite the bottom surface.

7. The integrated wireless power transmission device according to any one of claims 4 to 6, wherein, At least a third layer of the laminate (300) is disposed between the second layer and the top surface of the laminate (300) opposite to the bottom surface, and the second transformer winding (110b) and the fourth transformer winding (210b) are formed on the second layer. The second control component (214) is disposed on the top surface of the laminate substrate (300); and The first control component (114) is disposed on the top surface of the laminate substrate (300).

8. The integrated wireless power transmission device according to claim 7, wherein, The laminated substrate (300) includes a first lateral side and a second lateral side opposite to the first lateral side, and wherein, The second control component (214) is arranged closer to the first lateral side than to the second lateral side of the laminated substrate (300); and The first control component (114) is arranged closer to the second lateral side than to the first lateral side of the laminate substrate (300).

9. The integrated wireless power transmission device according to claim 8, wherein, The second control unit (214) is arranged at least partially vertically above the fourth transformer winding (210b), and / or The first control unit (114) is arranged at least partially vertically above the second transformer winding (110b).

10. The integrated wireless power transmission device according to claim 7, wherein, The laminated substrate (300) includes a first lateral side and a second lateral side opposite to the first lateral side, and wherein, The first control component (114) is arranged closer to the first lateral side than to the second lateral side of the laminated substrate (300); and The second control component (214) is arranged closer to the second lateral side than to the first lateral side of the laminate substrate (300).

11. The integrated wireless power transmission device according to claim 10, wherein, The first control unit (114) is laterally spaced from the fourth transformer winding (210b) such that the lateral distance (d1) between the first control unit (114) and the fourth transformer winding (210b) is greater than zero; and / or The second control component (214) is laterally spaced from the second transformer winding (110b) such that the lateral distance (d2) between the second control component (214) and the second transformer winding (110b) is greater than zero.

12. The integrated wireless power transmission device according to any one of the preceding claims, wherein, The first transformer winding (110a) is wound clockwise, and the second transformer winding (110b) is wound counterclockwise; or the first transformer winding (110a) is wound counterclockwise, and the second transformer winding (110b) is wound clockwise. The third transformer winding (210a) is wound clockwise and the fourth transformer winding (210b) is wound counterclockwise, or the third transformer winding (210a) is wound counterclockwise and the fourth transformer winding (210b) is wound clockwise.

13. The integrated wireless power transmission device according to any one of the preceding claims further comprises: A first magnetic core (402) comprises one or more layers of magnetic material and extends vertically through the laminated substrate (300) and through the central region of the fourth transformer winding (210b) and the central region of the first transformer winding (110a), and / or The second magnetic core (404) includes one or more layers of magnetic material and extends vertically through the laminate substrate (300) and through the central region of the second transformer winding (110b) and the central region of the third transformer winding (210a).

14. The integrated wireless power transmission device according to any one of the preceding claims, further comprising: The first magnetic core (402) includes one or more magnetic material layers disposed between the fourth transformer winding (210b) and the first transformer winding (110a), one or more magnetic material layers disposed between the first transformer winding (110a) and the bottom surface of the laminated substrate (300), and / or one or more magnetic material layers disposed between the fourth transformer winding (210b) and the top surface of the laminated substrate (300) opposite to the bottom surface, and / or The second magnetic core (404) includes one or more magnetic material layers disposed between the second transformer winding (110b) and the third transformer winding (210a), one or more magnetic material layers disposed between the third transformer winding (210a) and the bottom surface of the laminate substrate (300), and / or one or more magnetic material layers disposed between the second transformer winding (110b) and the top surface of the laminate substrate (300).

15. The integrated wireless power transmission device according to any one of the preceding claims, wherein, The first circuit (100) is configured to operate in a first voltage domain, and the second circuit (200) is configured to operate in a second voltage domain different from the first voltage domain.

16. An electrical device comprising: The integrated wireless power transmission device according to any one of claims 1 to 15; A first circuit device (502) includes a first circuit element (602), wherein the first circuit device (502) is electrically coupled to one or more of the plurality of first contact pads (310); A second circuit device (504) includes a second circuit element (604), wherein the second circuit device (504) is electrically coupled to one or more of the plurality of second contact pads (312), wherein, The first circuit device (502) is current isolated from the second circuit device (504), and The integrated wireless power transmission device is configured to send power from the first circuit device (502) to the second circuit device (504) to operate the second circuit element (604).

17. The electrical equipment according to claim 16, wherein, The first circuit device (502) includes a second laminated substrate, and the second circuit device (504) includes a third laminated substrate that is separate from and different from the second laminated substrate.

18. The electrical equipment according to claim 17, wherein, The integrated wireless power transmission device is mechanically and electrically coupled to one or more contact elements disposed on the surface of the second laminate substrate; and The integrated wireless power transmission device is mechanically and electrically coupled to one or more contact elements disposed on the surface of the third laminate substrate.

19. The electrical equipment according to claim 18, wherein, One or more of the plurality of first contact pads (310) are mechanically and electrically coupled to one or more contact elements disposed on the surface of the second laminate substrate, and One or more of the plurality of second contact pads (312) are mechanically and electrically coupled to one or more contact elements disposed on the surface of the third laminate substrate.

20. The electrical equipment according to claim 18 or 19, wherein, The integrated wireless power transmission device is mechanically coupled to one or more contact elements disposed on the surface of the second laminate substrate by means of adhesive joints, brazing connections, welding connections, or clamping connections; and The integrated wireless power transmission device is mechanically coupled to one or more contact elements disposed on the surface of the third laminate substrate by means of adhesive joints, brazing connections, welding connections, or clamping connections.

21. The electrical equipment according to claim 16, wherein, The first circuit device (502) is disposed on and / or integrated in the first section of the fourth laminate substrate, and the second circuit device (504) is disposed on and / or integrated in the second section of the fourth laminate substrate.

22. The electrical equipment according to claim 21, wherein, The integrated wireless power transmission device is mechanically and electrically coupled to one or more contact elements disposed on the surface of the fourth laminate substrate.

23. The electrical equipment according to claim 22, wherein, One or more of the plurality of first contact pads (310) are mechanically and electrically coupled to one or more first contact elements disposed on the surface of the fourth laminate substrate, and One or more of the plurality of second contact pads (312) are mechanically and electrically coupled to one or more second contact elements disposed on the surface of the fourth laminate substrate.

24. The electrical equipment according to claim 22 or 23, wherein, The integrated wireless power transmission device is mechanically coupled to one or more first contact elements disposed on the surface of the fourth laminate substrate by means of adhesive joints, brazing connections, welding connections, or clamping connections; and The integrated wireless power transmission device is mechanically coupled to one or more second contact elements disposed on the surface of the fourth laminate substrate by means of adhesive joints, brazing connections, welding connections, or clamping connections.

25. The electrical equipment according to any one of claims 16 to 24, wherein, The first circuit element (602) is a controller or includes a controller, and the second circuit element (604) is a controllable transistor device or includes a controllable transistor device.

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