Heating device and semiconductor processing apparatus
By incorporating a second air duct and a cooling mechanism into the heating device, the problem of uneven wafer film formation was solved, achieving uniform temperature distribution and improved film uniformity.
CN122235692APending Publication Date: 2026-06-19BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
- Filing Date
- 2020-05-26
- Publication Date
- 2026-06-19
AI Technical Summary
Technical Problem
During the CVD process, uneven gas pressure leads to inconsistent film thickness, resulting in poor film uniformity.
Method used
A heating device is designed that, by setting a second air passage and a cooling mechanism in the edge area of the heating body, utilizes gas cooling of the workpiece edge and heat conduction path to synergistically cool the edge of the heating body, thereby achieving uniform distribution of gas and heat.
Benefits of technology
This achieves a uniform temperature distribution on the wafer, avoiding uneven film thickness in different areas and improving film uniformity.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN122235692A_ABST
Abstract
This application provides a heating device and semiconductor processing equipment, relating to the field of semiconductor manufacturing technology, to solve the problem of poor film uniformity in wafers. The heating device includes a base, a heating body, a cooling mechanism, and an air duct plate. A first air duct is formed between the air duct plate and the heating body. The heating body has a second air duct, the outlet of which is located at the edge region of the heating surface of the heating body. The second air duct communicates with the first air duct and is used to cool the outer edge region of the workpiece to be processed. The base is disposed on the side of the air duct plate opposite to the heating body, and an installation space is formed between the base and the air duct plate. The cooling mechanism is disposed in the installation space and is thermally connected to the outer edge region of the air duct plate to cool the edge of the heating body through the outer edge region of the air duct plate. This can solve the problem of poor film uniformity in wafers.
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