Electronic device

Abstract

This invention provides an electronic device that saves space while preventing cable connections from coming loose. The electronic device includes: a substrate on which a heating element, a connector, and a stud are mounted; a heat dissipation module for cooling the heating element; a flat cable having a connection portion for connecting to the connector; and a bracket configured to span the cable in the width direction and hold the cable above the connector and the connection portion. The bracket has a first end on one side and a second end on the other side in the direction spanning the cable. The first end is threadedly fastened to the stud, and the second end is pressed by a portion of the heat dissipation module.

Description

Technical Field

[0001] This invention relates to electronic devices having a substrate. Background Technology

[0002] Electronic devices such as laptop PCs have various connectors mounted on a substrate within a chassis. For example, Patent Document 1 discloses a structure that connects a flexible substrate connected to a display to a connector mounted on the substrate.

[0003] Patent Document 1: Japanese Patent Application Publication No. 2023-084008

[0004] The connection between the connector and the cable, as described above, needs to be durable and not easily detached. Therefore, for example, one could consider pressing the cable from above the connector by mounting stud components on both sides of the connector and threading the ends of the bracket. However, in this configuration, two stud components need to be mounted on the substrate for one bracket. Therefore, in this configuration, it can sometimes be difficult to ensure sufficient space for the stud components on the substrate, potentially impacting the electrical / electronic (E / E) design of electronic devices. Summary of the Invention

[0005] The present invention was made in view of the problems of the prior art described above, and its object is to provide an electronic device that can save space while preventing the cable connection from coming loose.

[0006] An electronic device according to one aspect of the present invention includes: a substrate on which a heating element, a connector, and a stud are mounted; a heat dissipation module for cooling the heating element; a flat cable having a connection portion for connection with the connector; and a bracket configured to span the cable in the width direction and hold the cable above the connector and the connection portion, the bracket having a first end on one side and a second end on the other side in the direction spanning the cable, the first end being threadedly fastened to the stud, and the second end being pressed by a portion of the heat dissipation module.

[0007] According to the above-described method of the present invention, space can be saved while preventing the cable connection from coming loose. Attached Figure Description

[0008] Figure 1 This is a schematic top view of an electronic device according to one embodiment, viewed from above.

[0009] Figure 2 It is a top view that schematically shows the internal structure of the frame.

[0010] Figure 3A It is magnification Figure 2 A schematic perspective view of the bracket and its surrounding parts.

[0011] Figure 3B It means to Figure 3A The diagram shown is an exploded perspective view of the bracket being installed on the mother plate.

[0012] Figure 4 This is a schematic side sectional view of the electronic equipment in the bracket and its surrounding area.

[0013] Figure 5 It is a schematic front sectional view of the bracket and the electronic equipment in its surrounding area.

[0014] Explanation of reference numerals in the attached figures

[0015] 10…Electronic equipment; 11…Cover; 12…Frame; 24…Heat dissipation module; 25…Motherboard; 25a…CPU; 32…Heat diffusion component; 34a…Leaf spring component; 36…Fan; 42, 60…Stud component; 48a…Exhaust port; 50…Exhaust path; 52…Cable; 52a…Connection; 54…Connector; 56…Bracket; 56a…First end; 56b…Second end; 56b1…Standing piece; 62…Threaded fastener; 64…Protruding piece; 66…Step; 68, 70…Cushioning material. Detailed Implementation

[0016] Hereinafter, preferred embodiments are listed, and the electronic device involved in the present invention will be described in detail with reference to the accompanying drawings.

[0017] Figure 1 This is a schematic top view of an electronic device 10 according to one embodiment, viewed from above. (Example) Figure 1 As shown, the electronic device 10 in this embodiment is a clamshell-type laptop PC. The electronic device 10 has a structure in which the cover 11 and the frame 12 are connected by a hinge 14 to form a structure that allows them to rotate relative to each other. In this embodiment, an electronic device 10 of a laptop PC is shown as an example. In addition to a laptop PC, the electronic device may also be a tablet PC, a smartphone, or a portable game console.

[0018] The cover 11 is a thin, flat, box-shaped frame. The cover 11 houses a display 16. The display 16 is, for example, an organic EL display or a liquid crystal display.

[0019] The frame 12 is a thin, flat box. The keyboard device 18 and the touchpad 19 face the upper surface (surface 12a) of the frame 12. Hereinafter, regarding the frame 12 and the various components mounted on it, based on the posture of the operator operating the keyboard device 18, the width direction (left and right) of the frame 12 will be referred to as X1 and X2 directions, the depth direction (front and back) of the frame 12 will be referred to as Y1 and Y2 directions, and the thickness direction (up and down) of the frame 12 will be referred to as Z1 and Z2 directions. Sometimes, X1 and X2 directions are collectively referred to as the X direction, and similarly, Y1 and Y2 directions and Z1 and Z2 directions are sometimes referred to as the Y direction and Z direction. In addition, for ease of explanation, in the thickness direction of the frame 12, the Z1 direction is sometimes referred to as down, and its opposite direction (Z2 direction) is referred to as up (see reference). Figures 3A to 5 These directions are provided for ease of explanation, and may vary depending on the usage or orientation of the electronic device 10.

[0020] The frame 12 is composed of frame members 20 forming the upper surface and the four sides, and a cover member 21 forming the lower surface. The frame members 20 can be composed of plate-like members forming the surface 12a of the frame 12. The cover member 21 can be composed of a plate portion 21A forming the bottom surface 12b of the frame 12 and vertical walls 21B forming the sides of the frame 12 (see reference). Figure 4 The upright wall 21B rises from the edge of the plate portion 21A in the Z1 direction. The frame member 20 and the cover member 21 overlap in the thickness direction and are detachably connected to each other. The upright wall 21B may also be formed on the frame member 20. In this case, the cover member 21 may also be composed only of the plate portion 21A.

[0021] A hinge 14 is provided in a concave hinge mounting slot 12c formed on the rear edge of the frame 12, connecting the frame 12 and the cover 11. The hinge 14 is, for example, constructed such that a hinge shaft 14a, which serves as a rotation axis, is supported at both ends of the hinge frame along its long side. One end of the hinge shaft 14a is axially supported by a bracket fixed to the frame member 20. The other end of the hinge shaft 14a is supported within the hinge frame 14b, which is inserted into the hinge mounting slot 12c. The cover 11 has a jaw-shaped edge portion 11a protruding towards the display surface 16a of the display 16. The hinge frame 14b is fixed to the edge portion 11a, supporting the other end of the hinge shaft 14a (see reference). Figure 1 as well as Figure 4 ). Figure 4 Reference numeral 22 in the figure refers to the border member surrounding the display surface 16a of the display 16.

[0022] Figure 2 It is a top view that schematically shows the internal structure of the frame 12. Figure 2This is a diagram showing the interior of the frame component 20 from the bottom side after removing the cover 21.

[0023] like Figure 2 As shown, the heat dissipation module 24, motherboard 25, and battery device 26 are housed inside the frame 12. Various electronic components and mechanical components are also installed inside the frame 12.

[0024] The motherboard (substrate) 25 is the circuit board that serves as the mainboard of the electronic device 10. The motherboard 25 is disposed on the Y2 side of the frame 12 and extends in the X direction. The battery device 26 is a rechargeable battery that serves as the power source for the electronic device 10. The battery device 26 is disposed on the Y1 side of the motherboard 25 and extends in the X direction.

[0025] In this embodiment, the motherboard 25 is equipped with a CPU (Central Processing Unit) 25a. Besides the CPU 25a, the motherboard 25 can also be equipped with various electronic components, such as a GPU (Graphics Processing Unit), memory, communication modules, etc. For the motherboard 25, for example, the first surface 25A on the Z1 side serves as a mounting surface relative to the frame member 20, and the second surface 25B on the Z2 side serves as a mounting surface for the CPU 25a, etc.

[0026] Next, the structure of the heat dissipation module 24 will be described.

[0027] CPU 25a is the largest heat-generating component among the electronic components housed within the housing 12. The heat dissipation module 24 absorbs and dissipates the heat generated by CPU 25a, releasing it outside the housing 12. The heat dissipation module 24 can also be configured to cool heat-generating components other than CPU 25a, such as the GPU.

[0028] like Figure 2 As shown, the heat dissipation module 24 may include a heat diffusion member 32 comprising a metal plate 30, a pressing member 34, and a pair of left and right fans 36. In this embodiment, the heat dissipation module 24 integrally assembles the heat diffusion member 32 and the pressing member 34, while the fans 36 are separate from them. The heat dissipation module 24 may also be a structure in which the heat diffusion member 32, the pressing member 34, and the fans 36 are integrally assembled.

[0029] The heat dissipation member 32 is capable of absorbing and dissipating heat from the CPU 25a. The heat dissipation member 32 is configured to cover a portion of the second surface 25B of the motherboard 25 together with the CPU 25a. The heat dissipation member 32 has, for example, a rectangular shape that is longer in the X direction and narrower in the Y direction. Fans 36 are respectively arranged on the left and right sides of the heat dissipation member 32.

[0030] The metal plate 30 is a thin, plate-shaped metal component made of a material with high thermal conductivity, such as copper or aluminum. In this embodiment, the metal plate 30 is a copper plate. The metal plate 30 is configured to extend in the X direction between the left and right fans 36, 36. The heat diffusion member 32 can be stacked on the Z1 side of the metal plate 30 with heat transfer devices such as heat pipes or vapor chambers. A heat pipe is a pipe formed by flattening a thin metal tube into an elliptical cross-section and sealing the working fluid in the enclosed space inside. A vapor chamber is a vapor chamber formed between two metal plates and sealing the working fluid in the enclosed space.

[0031] Multiple heat sinks 37 and rectifier members 38 can be provided on the surface 30a of the Z2 side of the metal plate 30. The heat sinks 37 can, for example, have a rod shape extending in the X direction. The heat sinks 37 increase the surface area of ​​the metal plate 30, improving heat dissipation efficiency. The rectifier member 38 is located at the center of the metal plate 30 along its long side. The rectifier member 38 is a component used to smoothly direct the air discharged from the exhaust ports 36b of the left and right fans 36 and flowing along the surface 30a towards the exhaust port 48a of the frame 12. The rectifier member 38 can, for example, be constructed from a copper block having a triangular apex facing the Y2 side.

[0032] The pressing member 34 is used to press the heat diffusion member 32 against the CPU 25a. The pressing member 34 always applies force to the heat diffusion member 32 against the second surface 25B of the mother plate 25. The pressing member 34 has a pair of leaf spring members 34a, 34a in the Y direction. The leaf spring members 34a are connected, for example, to a thin metal frame fixed to the Z1 side of the heat diffusion member 32 at the center, and the heat diffusion member 32 is pressed against the CPU 25a via the metal frame. The metal frame is configured to surround the CPU 25a inside the frame and is fixed to the surface 32b by welding or the like. The two ends of each leaf spring member 34a are fastened to the stud member 42 (see reference) mounted on the second surface 25B of the mother plate 25 using screws 44. Figure 5 The stud component 42 is a generally cylindrical component mounted on the grounding pattern 25b provided on the second surface 25B (see reference). Figure 5 The stud component 42 has an internally threaded hole capable of securing the screw 44.

[0033] like Figure 2As shown, the left and right fans 36 are arranged in the X direction, facing each other, with each fan 36 crossing the heat diffusion member 32 between them. Each fan 36 has an exhaust port 36b on its facing side 36a. The exhaust ports 36b of the left and right fans 36 are positioned opposite each other, sandwiching the heat diffusion member 32 between them. Thus, each fan 36 can exhaust air toward the heat dissipation module 24. Each fan 36 has an intake port 36c on at least the Z2 side of its upper and lower end faces facing the Z direction. The intake port 36c can also be provided on the Z1 side end face. The intake port 36c can, for example, draw in external air (cold air) from a vent formed on the bottom surface of the frame 12. The fan 36 can be a centrifugal fan that rotates an impeller housed inside the housing by a motor. The fan 36 can exhaust the air drawn in from the intake port 36c through the exhaust port 36b.

[0034] The fan 36 is mounted to the frame member 20, for example, using two mounting portions 36d and 36e. The mounting portions 36d and 36e can be formed by plates protruding from the side of the fan 36's housing. One mounting portion 36d is located on the side opposite to the heat diffuser member 32. The mounting portion 36d is fixed to the Z2 side (inner surface 20a) of the frame member 20 using screws 46. The other mounting portion 36e is located on the side of the heat diffuser member 32. The mounting portion 36e is fixed to the second surface 25B of the mother plate 25 (see reference 25B) using screws 47. Figure 3A Screw 47, for example, is fastened to the internal threaded hole of a specified stud component assembled on the second side 25B.

[0035] like Figure 2 As shown, the frame 12 is equipped with an exhaust port 48a on the vertical wall 21B (outer wall 48) formed on its rear edge (Y2 side edge). The exhaust port 48a is a vent that can discharge air (warm air) that is discharged from the exhaust port 36b of each fan 36 and flows around the motherboard 25 and the heat dissipation module 24 to the outside of the frame 12.

[0036] In this embodiment, the vertical wall 21B on the Y2 side extends along its long side and has a hinge mounting groove 12c recessed towards the Y1 side. The outer wall 48 is the bottom wall (front wall) of the hinge mounting groove 12c. An exhaust port 48a is provided near the center in the long side direction of the outer wall 48. The exhaust port 48a is, for example, composed of a plurality of small windows arranged close together in the X direction. With the arrangement direction (X direction) of the left and right fans 36, 36 as a reference, the exhaust port 48a is located between the fans 36, 36. The exhaust port 48a is located on the Y2 side of the rectifier member 38. The vertical wall 21B can also be configured without the hinge mounting groove 12c. In this case, the exhaust port 48a can be formed on the vertical wall 21B itself, which is the outer wall.

[0037] Figure 2 The dotted-line arrows shown schematically illustrate airflow. (As...) Figure 2 As shown, in the electronic device 10, the air exhausted from the exhaust ports 36b of the left and right fans 36 cools the heat dissipation module 24 and the motherboard 25, which absorb and diffuse heat from the CPU 25a, etc. The cooled air is discharged outside the frame 12 through the exhaust port 48a. At this time, on the second surface 25B side of the motherboard 25, an exhaust path 50 is formed between the left and right stud members 42 (screws 44) of the leaf spring member 34a fixed on the Y2 side.

[0038] Figure 3A It is magnification Figure 2 A schematic perspective view of the bracket 56 and its surrounding parts. Figure 3B It means to Figure 3A An exploded perspective view showing the action of the bracket 56 being installed on the mother plate 25. Figure 4 This is a schematic side sectional view of the bracket 56 and the electronic equipment 10 around it. Figure 4 The diagram shows the cutting of the electronic device 10 through the YZ plane at the second end 56b of the bracket 56, which will be described later. Figure 5 This is a schematic front sectional view of the bracket 56 and the electronic equipment 10 around it.

[0039] like Figures 2-5 As shown, the electronic device 10 includes a cable 52, a connector 54, and a bracket 56. The cable 52, connector 54, and bracket 56 are located near the edge 12d on the Y2 side of the housing 12. The edge 12d is connected to the edge 11a of the cover 11 via a hinge 14.

[0040] Cables 52 are arranged in pairs, for example, on the left and right sides. One cable 52 is, for example, a flat cable used to connect the display 16 mounted on the cover 11 to the motherboard 25. The other cable 52 is, for example, used to connect the camera 17 mounted on the cover 11 (see reference). Figure 1 The flat wiring is connected to the motherboard 25. Each cable 52 can be made of, for example, a flexible printed circuit board (FPC). Each cable 52 is pulled from the edge 11a of the cover 11 through the edge 12d of the frame 12 into the frame 12.

[0041] The cable 52 has a connecting portion 52a on one end of the cable 52 at the side of the frame 12. The connecting portion 52a is a terminal that connects to the connector 54. Figures 3B to 5 As shown, the cable 52 may have a plate 52b forming the back side of the connector 52a. The plate 52b is, for example, a metal plate such as stainless steel (SUS).

[0042] like Figure 4As shown, the cable 52 extends from the connector 52a toward the display 16 (or camera 17) in a generally S-shape within the frame 12, and then passes from the edge portion 12d into the edge portion 11a of the cover 11. The frame 12 may have a cable insertion hole 48b on the outer wall 48 (vertical wall 21B) of the edge portion 12d.

[0043] Figures 3A-4 Reference numeral 53 in the figure refers to a support member for securing the cable 52 and maintaining the S-shaped loop. The support member 53 is a strip plate that passes through the cable 52 in the width direction and is threaded at both ends to the inner surface 20a of the frame member 20. The S-shaped loop of the cable 52 is to absorb the excess length of the cable 52 when the cover 11 rotates relative to the frame 12.

[0044] As described above, this embodiment includes a pair of cables 52 on the left and right. Therefore, in this embodiment, a pair of connectors 54 and a bracket 56 are also provided on the left and right sides respectively. There may be only one cable 52 or more cables 52. In this case, the number of connectors 54 and brackets 56 can also be provided in a number corresponding to the number of cables 52.

[0045] Connector 54 connects to the connection portion 52a of cable 52. Each connector 54 is mounted on the second surface 25B of motherboard 25. The connector 54 in this embodiment connects the cable 52 of the FPC and the motherboard 25, and is a so-called BtoB connector (board-to-board connector).

[0046] The bracket 56 can be made of metal sheet such as stainless steel (SUS). Figure 2 As shown, the left and right brackets 56 can be used to symmetrically arrange the same component. The left and right brackets 56 can also be of different shapes. The brackets 56 are configured to cross the cable 52 in the width direction, pressing and holding the cable 52 from above the connection part 52a and the connector 54. Thus, the brackets 56 prevent the connection part 52a from falling off the connector 54.

[0047] The bracket 56 can have a general bottle shape that is longer in the X direction and narrower in the Y direction when viewed from above. The bracket 56 has a first end 56a on one side and a second end 56b on the other side in the direction that crosses the cable 52 (X direction).

[0048] The first end 56a is the portion that is fastened to the second surface 25B of the mother plate 25 by means of a screw 58. A fastening hole 56a1 is formed through the first end 56a for the screw 58 to be inserted.

[0049] A stud component 60 for fastening screw 58 is fitted on the second surface 25B. The stud component 60 is, for example, a cylindrical component that is welded to the grounding pattern 25b of the second surface 25B (see reference). Figure 5The stud component 60 stands upright from the second surface 25B in the Z2 direction. The stud component 60 has an upward-facing internally threaded hole 60a opening on the top surface, which can fasten the screw 58.

[0050] like Figures 2-3B as well as Figure 5 As shown, the stud member 60 is configured to be aligned in the X direction relative to the stud member 42 that threadedly fastens the leaf spring member 34a. The stud member 60 is configured to sandwich a connector 54 (cable 52) between itself and the stud member 42. Viewed from the stud member 42, the stud member 60 is located on the opposite side of the exhaust path 50 in the X direction. Therefore, the stud member 60 does not obstruct the exhaust path 50 formed between the left and right stud members 42.

[0051] The second end 56b is pressed by a part of the heat dissipation module 24 of the motherboard 25 (leaf spring member 34a in this embodiment). That is, the first end 56a of the bracket 56 is threaded to the stud member 60, and the second end 56b is supported by the heat dissipation module 24. Thus, the bracket 56 can be mounted on the motherboard 25 and the cable 52 can be pressed to the connector 54 from above (Z2 side).

[0052] The second end 56b can be formed to be narrower in the Y direction than the first end 56a. The first end 56a of the bracket 56 can be located on the side further away from the exhaust path 50 than the second end 56b. That is, when viewed from the stud member 42 of the leaf spring member 34a, the second end 56b is arranged on the opposite side to the exhaust path 50 in the X direction, and will not block the exhaust path 50.

[0053] like Figures 2-3B as well as Figure 5 As shown, threaded fasteners 62, protruding pieces 64, and stepped portions 66 can be provided at both ends of the leaf spring member 34a on the Y2 side.

[0054] The threaded fastening part 62 is used to fix the leaf spring member 34a to the mother plate 25. The threaded fastening part 62 has a through hole through which the screw 44 can be inserted, and can be fastened to the stud member 42.

[0055] The protruding piece 64 is a plate that is configured to protrude from the threaded fastener 62 toward the bracket 56. The protruding piece 64 protrudes from the threaded fastener 62 in the X direction toward the side opposite to the venting path 50. The protruding piece 64 can press the second end 56b of the bracket 56 from above (Z2 side). Specifically, the second end 56b is inserted between the protruding piece 64 and the second surface 25B and is supported by the protruding piece 64.

[0056] The stepped portion 66 is a crank-shaped portion in the Z direction provided between the threaded fastening portion 62 and the protruding piece 64. The stepped portion 66 is configured such that the height of the protruding piece 64 above the second surface 25B of the mother plate 25 is higher than that of the threaded fastening portion 62. Therefore, the stepped portion 66 can eliminate the height difference between the second end 56b of the bracket 56 and the leaf spring member 34a (see reference). Figure 5 ).

[0057] like Figure 5 As shown, for example, the top surfaces of stud members 42 and 60 are at approximately the same height as the second surface 25B. Without the step 66, the protruding piece 64 is at the same height as the top surface of stud member 42. The first end 56a of the bracket 56 is also at the same height as the top surface of stud member 60. Therefore, if the stud members 42 and 60 are at approximately the same height, without the step 66, the second end 56b is flush with the protruding piece 64. In particular, the connector 54, connecting portion 52a, cable 52, plate 52b, and the cushioning material 68 (described later) are sandwiched between the bracket 56 and the second surface 25B. Therefore, it is also assumed that the second end 56b side is inclined upwards (Z2 side) than the first end 56a side (see reference). Figure 5 Therefore, by providing a step portion 66 near the front of the protruding piece 64, the leaf spring member 34a can reliably press the second end 56b from above. The step portion 66 can also be omitted depending on the height relationship of the stud members 42 and 60, etc.

[0058] The second end 56b can have a pair of upright tabs 56b1 that stand upright from both sides in the width direction (Y direction). The upright tabs 56b1 stand upright on the upper side (Z2 side) supported by the protruding tab 64. Thus, the second end 56b has a groove shape with a generally U-shaped cross section. The pair of upright tabs 56b1, 56b1 are configured to clamp the protruding tab 64 between each other and are locked on both end faces of the protruding tab 64 in the width direction (Y direction). Thus, the upright tabs 56b1 become locking pins to prevent the bracket 56 from rotating with the first end 56a as a fulcrum when the screw 58 is tightened. The upright tabs 56b1 can also prevent the second end 56b, which is pressed only from above by the protruding tab 64, from misaligning in the Y direction and falling off the protruding tab 64.

[0059] like Figure 3B as well as Figure 5As shown, the bracket 56 has a conductive cushioning material 68 on the surface that presses against the cable 52. The cushioning material 68 can be formed of conductive sponge or the like. In this embodiment, the cushioning material 68 is a conductive washer. The cushioning material 68 is fixed to the surface of the bracket 56 by double-sided tape or the like. The cushioning material 68 is pressed against the cable 52 (plate 52b), electrically connecting the bracket 56 and the cable 52. Thus, the bracket 56 can ground the cable 52 to the grounding pattern 25b via screws 57 and stud members 60.

[0060] like Figure 4 As shown, a conductive cushioning material 70 can also be fixed to the inner surface of the cover 21. Like the cushioning material 68, the cushioning material 70 can be formed from a conductive sponge, for example, a conductive washer. The cushioning material 70 is pressed against the surface of the bracket 56 on the Z2 side. Thus, the bracket 56 can also ground (frame ground) the cable 52 to the frame member 20 via the cushioning materials 68 and 70.

[0061] As described above, the electronic device 10 of this embodiment includes: a substrate (mother plate 25) on which a heat-generating element (e.g., CPU 25a), a connector 54, and a stud member 60 are mounted; a heat dissipation module 24 for cooling the heat-generating element; and a flat cable 52 having a connection portion 52a that connects to the connector 54. Furthermore, the electronic device 10 includes a bracket 56 configured to span the cable 52 in the width direction and hold the cable 52 above the connector 54 and the connection portion 52a. The bracket 56 has a first end 56a on one side and a second end 56b on the other side in the direction spanning the cable 52. The first end 56a is threadedly fastened to the stud member 60. The second end 56b is pressed by a portion of the heat dissipation module 24.

[0062] Therefore, by using the bracket 56 to support the cable 52, the electronic device 10 can prevent the cable 52 from detaching from the connector 54. Furthermore, the first end 56a of the bracket 56 is threaded onto the stud member 60, and the second end 56b is pressed by the heat dissipation module 24. Therefore, for the installation of one bracket 56, the electronic device 10 only needs to assemble one stud member 60 on the motherboard 25. That is, the electronic device 10 does not need to use two stud members 60 in the installation of one bracket 56. Therefore, the electronic device 10 can reduce the number of stud members 60, thus reducing component costs. In addition, since the number of stud members 60 assembled on the motherboard 25 is halved, space on the motherboard 25 can be saved. Thus, the electronic device 10 can also achieve miniaturization of the frame 12 due to the space saving on the motherboard 25, and can also suppress the impact on the E / E design.

[0063] Thus, the second end 56b of the bracket 56 is supported from above by a portion of the heat dissipation module 24. Therefore, when the heat dissipation module 24 is removed during the replacement of components such as the CPU 25a and memory mounted on the motherboard 25 in the electronic device 10, it can be easily removed without removing the bracket 56.

[0064] The heat dissipation module 24 may include a heat diffusion member 32 capable of dissipating heat from the heat-generating element, and a leaf spring member 34a for pressing the heat diffusion member 32 against the heat-generating element. In this case, it is preferable that the leaf spring member 34a presses down on the second end 56b of the bracket 56. That is, in the configuration of pressing the heat diffusion member 32 against the heat-generating element mounted on the mother plate 25, the leaf spring member 34a needs to be fixed to the mother plate 25. In other words, at least the leaf spring member 34a of the heat dissipation module 24 is fixed to the mother plate 25. Therefore, by configuring the heat dissipation module 24 with the leaf spring member 34a pressing down on the second end 56b, the bracket 56 can be supported more stably and securely.

[0065] In the electronic device 10, with the arrangement direction (X direction) of the pair of fans 36, 36 as a reference, the left and right stud members 60 and brackets 56 can be spaced apart to form a space for the exhaust path 50 from the exhaust outlet 36b of each fan 36 toward the exhaust port 48a of the frame 12. In this case, it is preferable that the first end 56a of each bracket 56 is on the side further away from the exhaust path 50 than the second end 56b. In this way, the electronic device 10 can avoid the stud members 60 that fasten the first end 56a of the bracket 56 from interfering with the exhaust path 50. As a result, in the electronic device 10, the air delivery efficiency of the fan 36 is improved, and the cooling capacity of the heat dissipation module 24 is improved. That is to say, the electronic device 10 can use one stud member 60 to mount one bracket 56, thereby also suppressing the influence of the stud member 60 on the heat dissipation design.

[0066] Furthermore, the present invention is not limited to the embodiments described above, and can of course be freely modified within the scope of the spirit of the present invention.

Claims

1. An electronic device, characterized in that, have: The substrate is equipped with a heating element, a connector, and stud components; The heat dissipation module cools the aforementioned heat-generating element; A flat cable having a connection portion for connection with the aforementioned connector; and The bracket is configured to span the cable in the width direction and hold the cable above the connector and the connection portion. The aforementioned bracket has a first end on one side and a second end on the other side in the direction of crossing the aforementioned cable. The first end is threaded to the stud component. The second end is pressed down by a portion of the heat dissipation module.

2. The electronic device according to claim 1, characterized in that, The above-mentioned heat dissipation module has the following features: A heat diffusion component capable of diffusing the heat from the aforementioned heating element; and A leaf spring component is used to press the aforementioned heat diffusion component against the aforementioned heating element. The second end of the bracket is pressed down by the leaf spring member.

3. The electronic device according to claim 2, characterized in that, The above-mentioned leaf spring component has: The threaded fastening part is threadedly fastened to the aforementioned substrate; The protruding piece is configured to protrude from the aforementioned threaded fastener; as well as A stepped portion is provided between the threaded fastening portion and the protruding piece, and is configured such that the height of the protruding piece from the surface of the substrate is higher than that of the threaded fastening portion. The second end of the bracket is inserted between the protruding piece and the surface of the substrate and is pressed by the protruding piece.

4. The electronic device according to claim 3, characterized in that, The second end of the bracket has a pair of upright tabs that are locked on the end faces of the protruding tabs on both sides.

5. The electronic device according to any one of claims 1 to 4, characterized in that, have: The frame houses the aforementioned substrate and the aforementioned heat dissipation module; and A pair of fans, mounted within the aforementioned frame, are configured to span the aforementioned heat dissipation module and have exhaust ports on their opposite sides capable of expelling air toward the heat dissipation module. The aforementioned frame has an exhaust port located between the pair of fans, based on the arrangement direction of the pair of fans. The aforementioned stud components and the aforementioned brackets are each provided in pairs. With the arrangement direction of the pair of fans as a reference, the pair of stud components and the bracket are spaced apart from each other to form a space for the exhaust path from the outlet of the pair of fans toward the exhaust port. The first end of the aforementioned pair of brackets is located on the side further away from the aforementioned exhaust path than the second end.

6. The electronic device according to any one of claims 1 to 4, characterized in that, The aforementioned bracket is made of metal. The bracket has a conductive cushioning material on the surface where the cable is pressed.

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