A portable computer device heat dissipation device

Abstract

This application relates to a portable computer device heat dissipation device, belonging to the field of computer device heat dissipation technology. It includes a micro-cooling module, a micro-cooling plate, a composite heat dissipation module, and a circulation pipeline. The micro-cooling module includes a micro-cooling chip for cooling the coolant. The micro-cooling plate is disposed on the surface of the core heat source of the portable computer device. The composite heat dissipation module includes a first micro-fan. The circulation pipeline connects the micro-cooling module, the micro-cooling plate, and the composite heat dissipation module to form a loop. The coolant flows out from the micro-cooling module, flows through the micro-cooling plate and the composite heat dissipation module in sequence, and then flows back. The micro-cooling plate absorbs the heat of the core heat source, and the composite heat dissipation module enhances heat dissipation. The components are miniaturized and compactly integrated, adaptable to the high-density space of portable computer devices, and takes into account the requirements of efficient heat dissipation, portability, and space utilization.

Description

Technical Field

[0001] This application relates to the field of computer equipment heat dissipation technology, and in particular to a portable computer equipment heat dissipation device. Background Technology

[0002] With the rapid development of technologies such as cloud computing and artificial intelligence, the core computing performance of computing devices continues to upgrade. Whether it is a large computing server or a portable high-performance laptop, the power consumption of core heat-generating components has shown a significant upward trend, and the heat density per unit volume has increased significantly. Excessive heat accumulation can not only cause core components to trigger performance throttling due to high temperature, affecting computing efficiency, but also, in severe cases, accelerate hardware aging or even cause direct failure. Therefore, an efficient heat dissipation system has become a core key component to ensure the long-term reliable operation of computing devices.

[0003] In related technologies, existing server cooling systems are typically used in rack-mount or tower-type servers, which have ample internal installation space and high power supply redundancy. Therefore, the cooling system is usually designed based on the server's high power consumption cooling requirements: a miniature cooling plate is set up to be directly attached to the core heat source. The heat generated by the core heat source when it is working is transferred to the miniature cooling plate through heat conduction. The high-temperature coolant carrying the heat is transported to an independently set water-cooled heat exchanger through a sealed circulation pipeline. To accelerate heat dissipation, the system is equipped with a high-power cooling fan. The fan drives the outside cold air to form forced convection with the water-cooled heat exchanger, thereby quickly transferring the heat in the coolant to the outside environment.

[0004] However, since servers are typically rack-mount or tower-type structures with ample internal installation space, and their power supply capabilities and heat dissipation redundancy requirements differ from those of portable computer devices, miniature cooling plates and water-cooled heat exchangers are designed to match the heat dissipation power of servers, and their fan power is also designed to meet the high power consumption heat dissipation requirements of servers. In contrast, laptops, as typical portable computer devices, are designed with portability and space utilization in mind, and their internal components are arranged in a high-density integrated layout. The space available for installing a heat dissipation system is limited, and there is an objective contradiction between the structural design of existing liquid cooling systems and the compact design requirements of laptops. Summary of the Invention

[0005] To address the aforementioned problems, this application provides a convenient computer device heat dissipation device.

[0006] This application provides a portable computer device heat dissipation device with the following technical solution: it includes a micro-cooling module, a micro-cooling plate, a composite heat dissipation module, and a circulation pipeline. The micro-cooling module includes a micro-cooling chip for cooling the coolant. The micro-cooling plate is disposed on the core heat source surface of the portable computer device. The composite heat dissipation module is disposed between the micro-cooling plate and the micro-cooling module. The composite heat dissipation module includes a first micro-fan. The circulation pipeline connects the micro-cooling module, the micro-cooling plate, and the composite heat dissipation module to form a coolant circulation loop. After flowing out of the micro-cooling module, the coolant flows sequentially through the micro-cooling plate, the composite heat dissipation module, and the micro-cooling module.

[0007] By adopting the above technical solution, the micro-cooling module, micro-cooling plate, and composite heat dissipation module form a complete coolant circulation loop through the circulation pipeline. The coolant flows out of the micro-cooling module, flows through the micro-cooling plate and the composite heat dissipation module in sequence, and then flows back to the micro-cooling module. The micro-cooling plate is closely attached to the surface of the core heat source, efficiently absorbing the heat of the core heat source. The composite heat dissipation module integrates a first micro fan, which enhances heat dissipation when the coolant flows through it. The micro-cooling module cools the coolant through micro-cooling plates, forming an orderly circulation path with the circulation pipeline. Each component adopts a miniaturized design and is compactly integrated, which can achieve efficient installation in the high-density internal space of portable computer equipment. It not only meets the heat dissipation requirements of the core heat source in portable computer equipment, but also adapts to the design requirements of portable computer equipment for space utilization and portability.

[0008] Preferably, the miniature cooling plate is provided with a heat-conducting substrate, which is in direct contact with the core heat source of the portable computer device. The miniature cooling plate has a first flow channel inside, and the two ends of the first flow channel are respectively connected to the circulation pipeline. The first flow channel is distributed in a serpentine pattern.

[0009] By adopting the above technical solution, the heat-conducting substrate is in direct contact with the core heat source of the portable computer device, which can quickly conduct the heat generated by the core heat source to the micro cooling plate. In conjunction with the first flow channel with a serpentine distribution inside the micro cooling plate, the flow path of the coolant is extended within the compact structure of the micro cooling plate, so that the coolant can fully contact the inner wall of the first flow channel and evenly cover the heat exchange area corresponding to the core heat source, thereby improving the heat transfer efficiency from the micro cooling plate to the coolant and achieving efficient heat absorption of the core heat source, which is compatible with the compact layout requirements of portable computer devices.

[0010] Preferably, the composite heat dissipation module further includes a heat sink, a first driving component, and a first air guide shroud. The first micro fan is disposed on the heat sink, the first driving component is connected to the first micro fan and drives the first micro fan to rotate, the first air guide shroud covers the first micro fan, and a second flow channel is provided inside the heat sink. The second flow channel is distributed in a serpentine pattern and is connected to the first flow channel through the circulation pipe.

[0011] By adopting the above technical solution, the coolant, which has been heated after absorbing heat in the micro-cooling plate, flows into the second flow channel inside the heat sink through the first flow channel, which is distributed in a serpentine pattern. The serpentine structure extends the flow path of the coolant, allowing the heated coolant to fully contact the heat sink and transfer heat to the heat sink body. At this time, the first driving component drives the first micro fan to rotate, and the first guide shroud covering the first micro fan directs the airflow to flow efficiently across the surface of the heat sink, accelerating the convection speed between the heat sink and the air, and quickly removing the heat absorbed by the heat sink from the coolant. This allows the coolant to achieve initial cooling after flowing through the heat sink. This initial cooling process effectively reduces the temperature of the coolant when it enters the subsequent micro-refrigeration module, reduces the temperature difference that the micro-refrigeration plate needs to handle, and ensures that the micro-refrigeration plate can perform deep cooling of the coolant more efficiently and stably. At the same time, the compact integrated structure of the first driving component, the first guide shroud, the first micro fan, and the heat sink, on the basis of achieving synergistic heat dissipation of liquid cooling and air cooling, adapts to the high-density layout requirements of portable computer equipment.

[0012] Preferably, the circulation pipeline is equipped with a temperature sensor, which is located at the outlet of the micro-cooling plate and the outlet of the composite heat dissipation module.

[0013] By adopting the above technical solution, temperature sensors installed at the outlets of the micro-cooling plate and the composite heat dissipation module in the circulation pipeline can monitor the coolant temperature at different heat exchange nodes in real time. The temperature at the outlet of the micro-cooling plate can directly reflect the actual thermal state of the coolant after the core heat source heats up. The temperature at the outlet of the composite heat dissipation module can directly reflect the cooling effect of the composite heat dissipation module on the coolant. The specific temperature data formed by the two provide parameter support for the operation and adjustment of the heat dissipation device. Based on this, the cooling power of the micro-cooling module and the rotation speed of the first micro fan can be dynamically adjusted so that the working state of the micro-cooling module and the first micro fan matches the actual heat dissipation requirements.

[0014] Preferably, the micro-refrigeration module includes a housing and a cold plate, the micro-refrigeration chip is disposed inside the housing, and one side of the micro-refrigeration chip is fixedly connected to the cold plate.

[0015] By adopting the above technical solution, the housing provides a stable installation space and protection for the micro-cooling chip and the cold plate. One side of the micro-cooling chip is directly fixed to the cold plate, so that the low temperature generated when the micro-cooling chip is working can be quickly conducted to the entire cold plate, allowing the cold plate to quickly form a uniform low temperature cooling surface. After cooling, the cold plate can efficiently exchange heat with the flowing coolant, quickly remove the heat in the coolant, and ensure the cooling effect of the coolant circulation loop.

[0016] Preferably, the micro-cooling module further includes a water pump and a liquid storage box. The interior of the cooling plate is provided with a third flow channel. The two ends of the water pump are respectively connected to the liquid storage box and the third flow channel. The end of the liquid storage box away from the water pump is connected to the second flow channel through the circulation pipe. The end of the third flow channel away from the water pump is connected to the micro-cooling plate through the circulation pipe.

[0017] By adopting the above technical solution, the water pump provides stable power for the coolant circulation, driving the coolant in the reservoir to flow into the third flow channel inside the cold plate. After being cooled by the cold plate, the coolant is transported to the micro-cooling plate through the circulation pipeline. After absorbing heat, it flows through the second flow channel of the composite heat dissipation module and finally flows back to the reservoir to form a complete closed loop. The reservoir can stabilize the coolant level in the loop and replenish the coolant required for circulation. The connection between the third flow channel and the circulation pipeline ensures smooth coolant flow, guaranteeing the circulation stability and cooling efficiency of heat dissipation, and also adapting to the internal space layout requirements of portable computer equipment.

[0018] Preferably, the micro-cooling module further includes a micro-metal fin, a second micro-fan, and a second air guide. One side of the micro-metal fin is fixed to the side of the micro-cooling plate away from the cold plate, the second micro-fan is fixed to the other side of the micro-metal fin, and the second air guide covers the second micro-fan.

[0019] By adopting the above technical solution, one side of the micro metal fin is fixedly connected to the side of the micro cooling chip away from the cold plate, which can quickly conduct the redundant heat generated by the micro cooling chip when it is working. The second micro fan is fixed to the other side of the micro metal fin, and together with the second guide shroud, it guides the airflow to flow efficiently across the surface of the micro metal fin, accelerating the convective heat exchange between the micro metal fin and the air to quickly dissipate the redundant heat of the micro cooling chip.

[0020] Preferably, the micro-refrigeration module further includes a thermally conductive adhesive component, wherein the cold plate is bonded and fixed to the micro-refrigeration chip via the thermally conductive adhesive component, and the micro-metal fins are bonded and fixed to the micro-refrigeration chip via the thermally conductive adhesive component.

[0021] By adopting the above technical solution, the thermally conductive adhesive not only achieves a stable bond between the cold plate and the micro-cooling chip, as well as between the micro-metal fins and the micro-cooling chip, but also significantly reduces the contact thermal resistance between the cold plate and the micro-cooling chip, as well as between the micro-metal fins and the micro-cooling chip, thanks to its thermal conductivity. This allows the low temperature generated by the micro-cooling chip to be efficiently conducted to the cold plate, while simultaneously allowing the redundant heat from the hot end of the micro-cooling chip to be quickly transferred to the micro-metal fins. This ensures that the cooling effect of the cold plate and the heat dissipation efficiency of the micro-metal fins are improved simultaneously. Furthermore, the bonding method makes the integration of each component more compact, adapting to the internal space layout requirements of portable computer equipment.

[0022] Preferably, the first micro fan is provided with a first shock-absorbing pad, the second micro fan is provided with a second shock-absorbing pad, the first shock-absorbing pad is disposed between the first micro fan and the heat sink, and the second shock-absorbing pad is disposed between the second micro fan and the micro metal fins.

[0023] By adopting the above technical solution, the first shock-absorbing pad is disposed between the first micro fan and the heat sink, and the second shock-absorbing pad is disposed between the second micro fan and the micro metal fins. These pads effectively buffer the vibrations generated when the first micro fan and the second micro fan are running, reducing the transmission of vibrations to the heat sink, the micro metal fins and the surrounding area, thereby reducing the noise during heat dissipation.

[0024] Preferably, a sealing ring and a clamp are provided at the connection between the circulation pipeline and the micro cooling plate, and at the connection between the circulation pipeline and the composite heat dissipation module. The sealing ring is sleeved on the outer periphery of the connection between the micro cooling plate and the heat dissipation block and the circulation pipeline and fits against the inner wall of the circulation pipeline. The clamp is sleeved on the outer wall of the circulation pipeline.

[0025] By adopting the above technical solution, the sealing ring installed at the connection between the micro cooling plate and heat sink and the circulation pipeline, by fitting the sealing ring around the outer periphery of the connection between the micro cooling plate, composite heat dissipation module and micro refrigeration module and fitting against the inner wall of the circulation pipeline, fully fills the gap between the pipeline and the connection between the micro cooling plate, composite heat dissipation module and micro refrigeration module, ensuring the airtightness of the coolant circulation, ensuring that the coolant is stable and does not leak during the flow process. The clamp is fitted on the outer wall of the circulation pipeline, and can tightly press the connection between the circulation pipeline and the micro cooling plate and heat sink through its own fastening force, strengthening the sealing effect, ensuring the long-term airtightness of the coolant circulation loop, maintaining the smooth flow of coolant to stabilize heat dissipation performance.

[0026] In summary, this application includes at least one of the following beneficial technical effects: 1. A complete coolant circulation loop is formed by connecting the micro-cooling module, micro-cooling plate, and composite heat dissipation module through a circulation pipeline. The coolant flows out of the micro-cooling module, flows through the micro-cooling plate and composite heat dissipation module in sequence, and then flows back to the micro-cooling module. The micro-cooling plate is closely attached to the core heat source to efficiently absorb heat. The composite heat dissipation module integrates a first micro fan to enhance the heat dissipation when the coolant flows through. The micro-cooling module cools the coolant through micro-cooling chips. Each component adopts a miniaturized design and compact integration, which can be efficiently installed in the high-density internal space of portable computer equipment to meet the heat dissipation requirements of the core heat source, and can also adapt to the design requirements of the equipment for space utilization and portability. Attached Figure Description

[0027] Figure 1 This is a structural schematic diagram of an embodiment of this application.

[0028] Figure 2 This is a structural schematic diagram of an embodiment of this application.

[0029] Figure 3 This is a cross-sectional view of the cold plate in an embodiment of this application.

[0030] Figure 4 This is a structural schematic diagram of an embodiment of this application.

[0031] Figure 5 This is a cross-sectional view of the micro-cooling plate in an embodiment of this application.

[0032] Figure 6 The micro-cooling plate in the composite heat dissipation module, micro-cooling plate, and circulation pipeline in the embodiments of this application is a micro-cooling plate.

[0033] Figure 7 This is an embodiment of the present application. Figure 5 An enlarged diagram of A in the diagram.

[0034] Figure 8 This is a cross-sectional view of the heat sink in an embodiment of this application.

[0035] Explanation of reference numerals in the attached drawings: 1. Miniature refrigeration module; 11. Miniature refrigeration chip; 12. Housing; 121. Heat conduction port; 13. Cold plate; 131. Third flow channel; 14. Water pump; 15. Liquid storage box; 16. Miniature metal fins; 17. Second miniature fan; 171. Second outer shell; 18. Second air guide; 19. Thermally conductive adhesive; 2. Miniature cooling plate; 21. Thermally conductive substrate; 22. First flow channel; 3. Composite heat dissipation module; 31. Heat sink; 311. Groove; 312. Second flow channel; 32. First miniature fan; 321. First outer shell; 33. First driving component; 34. First air guide; 4. Circulation pipeline; 41. Sealing ring; 42. Clamp; 5. Temperature sensor; 6. First shock-absorbing pad; 7. Second shock-absorbing pad; 8. Connector. Detailed Implementation

[0036] The following is in conjunction with the appendix Figure 1-8 This application will be described in further detail.

[0037] This application discloses a portable computer device cooling system. (Refer to...) Figure 1 and 2 It includes a miniature cooling module 1, a miniature cooling plate 2, a composite heat dissipation module 3, and a circulation pipeline 4. The circulation pipeline 4 connects the miniature cooling module 1, the miniature cooling plate 2, and the composite heat dissipation module 3 to form a coolant circulation loop. After the coolant flows out of the miniature cooling module 1, it flows through the miniature cooling plate 2, the composite heat dissipation module 3, and the miniature cooling module 1 in sequence, achieving the effect of heat dissipation for portable computer equipment. This is because the coolant can continuously carry away and dissipate the heat generated by the core heat source during the circulation process. Each component adopts a miniaturized design and is compactly integrated, which can be efficiently installed in the high-density internal space of portable computer equipment.

[0038] Specifically, the micro-cooling module 1 includes a micro-cooling chip 11, a housing 12, a cold plate 13, a water pump 14, a liquid storage box 15, micro-metal fins 16, a second micro-fan 17, a second air guide shroud 18, and a thermally conductive adhesive 19. Specifically, the micro-cooling chip 11 is used to cool the coolant. In this embodiment, the micro-cooling chip 11 is configured as a semiconductor cooling chip. The working principle of the semiconductor cooling chip is based on the Peltier effect, and it is composed of an array of electric couples consisting of N-type and P-type semiconductors. When a direct current is applied, electrons and holes are driven by the electric field to move directionally at the semiconductor interface, absorbing heat at one end to form a cold end and releasing heat at the other end to form a hot end, thereby achieving directional heat transfer.

[0039] Furthermore, the cold end of the micro-cooling chip 11 is fixedly connected to the cold plate 13 via a thermally conductive adhesive 19. The thermally conductive adhesive 19 is set as thermally conductive silicone grease. The thermally conductive silicone grease contains highly thermally conductive fillers that fill the tiny gaps at the contact surface between the cold end of the micro-cooling chip 11 and the cold plate 13, thereby reducing the interfacial thermal resistance and allowing the low temperature of the cold end of the micro-cooling chip 11 to be efficiently transferred to the cold plate 13. It also has strong chemical stability, is resistant to high temperatures and does not easily dry out, and can maintain the filling effect for a long time. At the same time, it is easy to apply and adapts to the compact structure of the micro-cooling module 1.

[0040] Reference Figure 3Furthermore, the water pump 14 is configured as a miniature centrifugal water pump 14, the liquid storage box 15 is used to store coolant, and the interior of the cold plate 13 is provided with a third flow channel 131. The two ends of the water pump 14 are connected to the liquid storage box 15 and the third flow channel 131 respectively. The water pump 14 provides stable power for the circulation of coolant, driving the coolant in the liquid storage box 15 to flow into the third flow channel 131 inside the cold plate 13. The coolant flows in the third flow channel 131, and the end of the third flow channel 131 away from the water pump 14 is connected to the miniature cooling plate 2 through the circulation pipe 4.

[0041] Meanwhile, in this embodiment, the material of the cold plate 13 is set as copper. Copper has a high thermal conductivity, which can quickly receive the low temperature of the cold end of the micro-cooling chip 11 transferred by the thermally conductive adhesive 19 and evenly diffuse it to the entire cold plate 13. Then, through contact with the coolant, the cold energy is efficiently transferred to the coolant. Copper also has high thermal conductivity, which can reduce the loss of cold energy transfer. At the same time, copper has good ductility and is easy to process and form, which can be adapted to the compact space design of the micro-cooling module 1. In addition, it has strong chemical stability and good compatibility with the coolant and the thermally conductive adhesive 19, and can maintain a stable heat exchange effect for a long time.

[0042] In addition, the third flow channel 131 is set as a continuously bent serpentine structure. The continuous bending serpentine structure extends the flow path and residence time of the coolant in the cold plate 13, allowing the coolant to fully contact the heat-conducting surface of the copper cold plate 13, maximizing the absorption of cold energy. It is compatible with the good ductility of copper, is easy to process and form, and can ensure smooth coolant circulation while improving the overall heat exchange efficiency.

[0043] Furthermore, one side of the micro metal fin 16 is also fixed to the hot end of the micro-cooling chip 11 by the thermally conductive adhesive 19. In this embodiment, the micro metal fin 16 is made of aluminum alloy. Relying on the high thermal conductivity of aluminum alloy, the heat of the hot end of the micro-cooling chip 11 is quickly conducted. Aluminum alloy has a high thermal conductivity, low density, and light weight, which will not increase the overall load of the micro-cooling module 1. At the same time, it has good processing and formability, and can be made into thin and dense micro metal fins 16 to fit the compact space of the micro-cooling module 1. It also has good compatibility with the thermally conductive adhesive 19 and can stably transfer heat.

[0044] Meanwhile, the second micro fan 17 is fixed to the side of the micro metal fin 16 away from the thermally conductive adhesive 19. The second micro fan 17 is provided with a second housing 171, which is fixed to the micro metal fin 16. The second micro fan 17 is rotatably disposed inside the second housing 171, and the second air guide shroud 18 is fixed to the second housing 171.

[0045] Furthermore, the housing 12 has a rectangular block structure. The cold plate 13, water pump 14, liquid storage box 15, micro metal fins 16, second micro fan 17, second airflow guide 18, and thermally conductive adhesive 19 are all disposed inside the housing 12. From a vertical layout perspective, the cold plate 13 is located at the bottom of the housing 12. The upper end of the cold plate 13 is bonded and fixed to the cold end of the micro-cooling chip 11 via the thermally conductive adhesive 19. The hot end of the micro-cooling chip 11 is connected to the micro metal fins 16 via the thermally conductive adhesive 19. The second micro fan 17 is correspondingly disposed at the upper end of the micro metal fins 16. The second airflow guide 18 cooperates with the second micro fan 17 to optimize the heat dissipation airflow path. From a horizontal distribution perspective, the water pump 14 and liquid storage box 15 are both disposed on one side of the third flow channel 131 inside the cold plate 13, and are designed to assist in heat dissipation. (Refer to...) Figure 4 The side wall of the housing 12 near the second micro fan 17 has several through heat conduction ports 121. These heat conduction ports 121 are usually oriented toward the ventilation port of the portable computer in order to quickly dissipate heat.

[0046] In addition, the housing 12 serves to protect components such as the micro-cooling chip 11. The housing 12 is made of high-strength plastic. The cold plate 13 is located at the bottom of the housing 12. The micro-cooling chip 11 is located at the top of the cold plate 13 and is bonded to it by a thermally conductive adhesive 19. The micro-metal fin 16 is located at the top of the micro-cooling chip 11 and is bonded to it by a thermally conductive adhesive 19. The second micro-fan 17 is located at the top of the micro-metal fin 16. The water pump 14 and the liquid storage box 15 are located on one side of the third flow channel 131. Several heat conduction ports 121 are provided on the side wall of the housing 12 near the second micro-fan 17. The heat conduction ports 121 penetrate the housing 12 and are usually oriented towards the ventilation port of the portable computer.

[0047] This illustrates that when a direct current is applied to the micro-cooling chip 11, a cold end is formed at one end and a hot end at the other, completing the initial generation of cooling capacity. The cooling capacity of the cold end of the micro-cooling chip 11 is transferred to the cold plate 13. The cold end of the micro-cooling chip 11 is connected to the cold plate 13 through the thermally conductive adhesive 19. When the water pump 14 is started, the coolant in the liquid storage box 15 flows out and enters the third flow channel 131 inside the cold plate 13, so that the coolant fully contacts the thermally conductive surface of the copper cold plate 13 and absorbs the cooling capacity transferred by the cold plate 13. After absorbing the cooling capacity, the coolant flows out from the end of the third flow channel 131 away from the water pump 14 and flows through the circulation pipeline 4 to the micro-cooling plate 2 to cool the core heat source of the portable computer equipment.

[0048] Meanwhile, the heat generated by the hot end of the micro-cooling chip 11 is transferred to the micro-metal fin 16 through the thermally conductive adhesive 19, spreading the heat to the entire micro-metal fin 16. The second micro fan 17 rotates, and in conjunction with the second air guide shroud 18, optimizes the airflow path, blowing the heat on the surface of the micro-metal fin 16 toward the side wall of the housing 12. The heat is quickly discharged to the outside of the housing 12 through the through heat conduction port 121 on the housing 12.

[0049] Furthermore, a miniature cooling plate 2 is disposed on the surface of the core heat source. The miniature cooling plate 2 is provided with a thermally conductive substrate 21, which is in direct contact with the core heat source. The thermally conductive substrate 21 is also made of copper. Copper has excellent thermal conductivity, which can quickly and efficiently transfer the instantaneous high heat of the core heat source. It also has excellent ductility and can be precisely machined to fit the tiny bumps and depressions on the surface of the heat source.

[0050] Reference Figure 5 Meanwhile, the miniature cooling plate 2 has a first flow channel 22 inside, which is distributed in a serpentine shape. The miniature cooling plate 2 is made of aluminum alloy. Aluminum alloy has a low density, which reduces the weight of the cooling plate and meets the lightweight requirements of portable computer equipment. Aluminum alloy has excellent processing and formability and can be quickly made into a serpentine flow channel structure through extrusion processing and other methods.

[0051] This demonstrates that the thermally conductive substrate 21 is in direct contact with the core heat source, rapidly transferring the heat generated by the core heat source to the micro-cooling plate 2. The serpentine distribution of the first flow channels 22 inside the micro-cooling plate 2 extends the flow path of the coolant within the compact structure, ensuring that the coolant fully contacts the inner wall of the first flow channels 22 and evenly covers the heat exchange area corresponding to the core heat source. This significantly improves the efficiency of heat transfer from the micro-cooling plate 2 to the coolant, ultimately achieving efficient heat dissipation of the core heat source. Furthermore, the overall structure is highly compatible with the compact layout of portable devices.

[0052] Reference Figure 6 Specifically, the composite heat dissipation module 3 is disposed between the micro cooling plate 2 and the micro refrigeration module 1. It includes a first micro fan 32, a heat sink 31, a first drive component 33, and a first airflow guide 34. The first micro fan 32 is provided with a first housing 321 and is rotatably disposed within the first housing 321. The heat sink 31 is provided with a groove 311, and the first housing 321 is fixed within the groove 311. The first drive component 33 is disposed inside the first housing 321 and drives the first micro fan 32 to rotate. The first drive component 33 is a three-speed motor, where "speed" is defined as the time to complete one revolution. The higher the speed, the higher the output power of the motor. Meanwhile, referring to... Figure 8The heat sink 31 has a second flow channel 312 inside. The second flow channel 312 is connected to the first flow channel 22 through the circulation pipe 4. After the coolant flows out from the micro cooling plate 2, it enters the second flow channel 312. The second flow channel 312 is connected to the liquid storage box 15 through the first outer shell 321 through the circulation pipe 4. In addition, the heat sink 31 is also made of aluminum alloy. Aluminum alloy can quickly receive the heat from the core heat source transferred when the coolant flows through the second flow channel 312.

[0053] This explains that the second flow channel 312 inside the heat sink 31 is connected to the first flow channel 22 through the circulation pipe 4, and can accurately receive the coolant flowing out from the micro cooling plate 2. When the coolant flows through the second flow channel 312, it transfers the heat absorbed by the core heat source to the heat sink 31 body. Since the first driving component 33 has high output power, it can drive the first micro fan 32 to rotate at a faster speed, thereby enhancing the airflow intensity and providing sufficient power for rapid heat dissipation. The first micro fan 32 rotates under the drive of the first driving component 33, and with the directional guidance of the first guide shroud 34, the airflow can flow efficiently and concentratedly across the surface of the heat sink 31, accelerating the convection speed between the heat sink 31 and the surrounding air, and initially removing the heat absorbed by the heat sink 31 from the coolant.

[0054] Furthermore, since the second circulation channel 312 is connected to the liquid storage box 15 through the circulation pipe 4 and passes through the first outer shell 321, and is transferred to the cold plate 13 by the water pump 14, the temperature of the coolant is significantly reduced after the initial heat dissipation by the composite heat dissipation module 3. The micro-cooling chip 11 can cool the coolant to the target temperature more efficiently. At the same time, the initial heat dissipation reduces the temperature difference pressure between the coolant and the cooling chip, making the cooling effect of the micro-cooling chip 11 more stable.

[0055] In addition, temperature sensors 5 are installed at the outlets of the micro-cooling plate 2 and the heat sink 31. The temperature sensors 5 can monitor the coolant temperature at different heat exchange nodes in real time. The temperature at the outlet of the micro-cooling plate 2 can directly reflect the actual thermal state of the coolant after the core heat source heat is absorbed. The temperature at the outlet of the composite heat dissipation module 3 can directly reflect the cooling effect of the composite heat dissipation module 3 on the coolant. The specific temperature data formed by the two provides parameter support for the operation and adjustment of the heat dissipation device. Based on this, the cooling power of the micro-cooling module 1 and the rotation speed of the first micro fan 32 can be dynamically adjusted so that the working state of the micro-cooling module 1 and the first micro fan 32 matches the actual heat dissipation requirements.

[0056] Furthermore, the first micro fan 32 is provided with a first shock-absorbing pad 6, and the second micro fan 17 is provided with a second shock-absorbing pad 7. The first shock-absorbing pad 6 is disposed between the first housing 321 and the heat sink 31 and is fixedly connected to the first housing 321 and the heat sink 31 respectively. The second shock-absorbing pad 7 is disposed between the second housing 171 and the micro metal fin 16 and is fixedly connected to the second housing 171 and the micro metal fin 16 respectively. Both the first shock-absorbing pad 6 and the second shock-absorbing pad 7 are made of silicone. Silicone has strong elasticity and recovery, which can effectively buffer the vibration of the first micro fan 32 and the second micro fan 17 during operation, reduce the vibration transmitted to the heat sink 31 or the micro metal fin 16, and thus reduce the noise during heat dissipation. Silicone has a wide temperature resistance range and can adapt to the temperature environment during operation.

[0057] Reference Figure 7 Meanwhile, clamps 42 and sealing rings 41 are provided at the connection points of the circulation pipe 4 with the micro cooling plate 2, the composite heat dissipation module 3 and the micro refrigeration module 1. The micro cooling plate 2 and the heat dissipation block 31 are provided with joints 8. The sealing ring 41 is sleeved on the outer periphery of the joint 8 and fits against the inner wall of the circulation pipe 4. The sealing ring 41 is fixedly connected to the joint 8 and the circulation pipe 4. The clamp 42 is sleeved on the outer wall of the circulation pipe 4. The clamp 42 can be used to tightly press the connection points of the circulation pipe 4 with the micro cooling plate 2 and the heat dissipation block 31 through the fastening force of the clamp 42. The sealing ring 41 can fully fill the gap between the joint 8 and the circulation pipe 4 to ensure the airtightness of the coolant circulation loop.

[0058] The implementation principle of a portable computer equipment heat dissipation device according to an embodiment of this application is as follows: After the micro-cooling chip 11 is powered by DC, one end of the micro-cooling chip 11 forms a cold end and the other end forms a hot end. The cold end of the micro-cooling chip 11 is bonded and fixed to the cold plate 13 by a thermally conductive adhesive 19. The thermally conductive adhesive 19 fills the gap between the contact surface of the micro-cooling chip 11 and the cold plate 13 to reduce the interface thermal resistance. The water pump 14 is started to provide power for the circulation of coolant and drive the coolant stored in the liquid storage box 15 to flow into the third flow channel 131 inside the cold plate 13. The serpentine structure extends the flow path and residence time of the coolant in the cold plate 13, so that the coolant can fully contact the low-temperature heat-conducting surface of the cold plate 13 and maximize the absorption of cold energy to complete the cooling. Then the cooled coolant flows out from the end of the third flow channel 131 away from the water pump 14 and flows to the micro-cooling plate 2 through the circulation pipe 4.

[0059] The miniature cooling plate 2 is disposed on the surface of the core heat source of the portable computer device. The miniature cooling plate 2 has a heat-conducting base 21 that is in direct contact with the core heat source, which quickly conducts the heat generated by the core heat source to the miniature cooling plate 2. At the same time, the coolant after being cooled by the cold plate 13 flows into the first flow channel 22 inside the miniature cooling plate 2. The first flow channel 22 is also a serpentine structure that extends the flow path of the coolant in a compact space, so that the coolant is in full contact with the inner wall of the first flow channel 22, efficiently absorbing the heat of the core heat source transferred by the miniature cooling plate 2, and completing the initial heat transfer of the core heat source.

[0060] After absorbing heat, the high-temperature coolant flows into the heat sink 31 of the composite heat dissipation module 3 through the circulation pipe 4. The second flow channel 312 inside the heat sink 31 is connected to the first flow channel 22. When the coolant flows in the second flow channel 312, it transfers heat to the heat sink 31. At this time, the first driving component 33 drives the first micro fan 32 to rotate, and the first guide shroud 34 guides the airflow to flow efficiently across the surface of the heat sink 31, accelerating the convection speed between the heat sink 31 and the air, and quickly carrying away the heat absorbed by the heat sink 31 from the coolant, thus achieving the initial cooling of the coolant.

[0061] After being initially cooled by the composite heat dissipation module 3, the coolant flows out from the second flow channel 312 of the heat sink 31, passes through the first outer shell 321 via the circulation pipe 4, and finally flows back to the liquid storage box 15 of the micro-cooling module 1, forming a complete closed loop of coolant circulation and continuously dissipating heat for the core heat source.

[0062] In addition, the hot end of the micro-cooling chip 11 is bonded and fixed to the micro-metal fin 16 through the thermally conductive adhesive 19. The redundant heat generated by the hot end of the micro-cooling chip 11 is quickly transferred to the micro-metal fin 16 through the thermally conductive adhesive 19. A second micro fan 17 is provided on the side of the micro-metal fin 16 away from the thermally conductive adhesive 19. The second micro fan 17 rotates and cooperates with the second air guide shroud 18 to guide the airflow across the surface of the micro-metal fin 16, accelerating convective heat transfer. At the same time, a through heat conduction port 121 is opened on the side wall of the housing 12 of the micro-cooling module 1 near the second micro fan 17. The heat is guided through the heat conduction port 121 to the ventilation port of the portable computer and finally dissipated to the outside of the device.

[0063] Temperature sensors 5 are installed at the outlets of the micro-cooling plate 2 and the composite heat dissipation module 3 in the circulation pipeline 4 to monitor the coolant temperature at both nodes in real time. The outlet temperature of the micro-cooling plate 2 reflects the thermal state of the coolant after the heat from the core heat source is absorbed, while the outlet temperature of the heat dissipation block 31 reflects the heat dissipation effect of the composite heat dissipation module 3. The cooling power of the micro-cooling chip 11 and the rotation speed of the first micro-fan 32 can be dynamically adjusted to ensure that the working state of the heat dissipation device is precisely matched to the actual heat dissipation requirements of the core heat source.

[0064] Sealing rings 41 are provided at the connection points of the circulation pipe 4 with the micro cooling plate 2, the composite heat dissipation module 3, and the micro refrigeration module 1. Connectors 8 are provided at the corresponding connection points of the micro cooling plate 2, the heat sink 31, and the housing 12. The sealing rings 41 are fitted around the outer periphery of the connectors 8 and fit against the inner wall of the circulation pipe 4 to fill the gaps and ensure the airtightness of the coolant circulation loop. At the same time, a first shock-absorbing pad 6 is provided between the first micro fan 32 and the heat sink 31, and a second shock-absorbing pad 7 is provided between the second micro fan 17 and the micro metal fins 16. These measures can buffer the vibration of the first micro fan 32 and the second micro fan 17 during operation, reduce the transmission of vibration to surrounding components, and reduce noise during the heat dissipation process.

[0065] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A portable computer equipment heat dissipation device, characterized in that: The device includes a micro-cooling module (1), a micro-cooling plate (2), a composite heat dissipation module (3), and a circulation pipeline (4). The micro-cooling module (1) includes a micro-cooling chip (11) for cooling the coolant. The micro-cooling plate (2) is placed on the core heat source surface of the portable computer device. The composite heat dissipation module (3) is placed between the micro-cooling plate (2) and the micro-cooling module (1). The composite heat dissipation module (3) includes a first micro-fan (32). The circulation pipeline (4) connects the micro-cooling module (1), the micro-cooling plate (2), and the composite heat dissipation module (3) to form a coolant circulation loop. After the coolant flows out of the micro-cooling module (1), it flows sequentially through the micro-cooling plate (2), the composite heat dissipation module (3), and the micro-cooling module (1).

2. The portable computer equipment heat dissipation device according to claim 1, characterized in that: The micro cooling plate (2) is provided with a heat-conducting substrate (21), which is in direct contact with the core heat source of the portable computer device. The micro cooling plate (2) is provided with a first flow channel (22), and the two ends of the first flow channel (22) are respectively connected to the circulation pipeline (4). The first flow channel (22) is distributed in a serpentine shape.

3. The portable computer equipment heat dissipation device according to claim 2, characterized in that: The composite heat dissipation module (3) further includes a heat sink (31), a first driving component (33), and a first air guide (34). The first micro fan (32) is disposed on the heat sink (31). The first driving component (33) is connected to the first micro fan (32) and drives the first micro fan (32) to rotate. The first air guide (34) covers the first micro fan (32). The heat sink (31) has a second flow channel (312) inside. The second flow channel (312) is serpentine. The second flow channel (312) is connected to the first flow channel (22) through the circulation pipe (4).

4. The portable computer equipment heat dissipation device according to claim 1, characterized in that: The circulation pipeline (4) is equipped with a temperature sensor (5), which is located at the outlet of the micro cooling plate (2) and the outlet of the composite heat dissipation module (3).

5. The portable computer equipment heat dissipation device according to claim 3, characterized in that: The micro-cooling module (1) includes a housing (12) and a cold plate (13). The micro-cooling chip (11) is disposed inside the housing (12), and one side of the micro-cooling chip (11) is fixedly connected to the cold plate (13).

6. The portable computer equipment heat dissipation device according to claim 5, characterized in that: The micro-cooling module (1) also includes a water pump (14) and a liquid storage box (15). The interior of the cold plate (13) is provided with a third flow channel (131). The two ends of the water pump (14) are respectively connected to the liquid storage box (15) and the third flow channel (131). The end of the liquid storage box (15) away from the water pump (14) is connected to the second flow channel (312) through the circulation pipe (4). The end of the third flow channel (131) away from the water pump (14) is connected to the micro-cooling plate (2) through the circulation pipe (4).

7. The portable computer equipment heat dissipation device according to claim 5, characterized in that: The micro-cooling module (1) further includes a micro-metal fin (16), a second micro-fan (17), and a second air guide (18). One side of the micro-metal fin (16) is fixed to the side of the micro-cooling plate (11) away from the cold plate (13), the second micro-fan (17) is fixed to the other side of the micro-metal fin (16), and the second air guide (18) covers the second micro-fan (17).

8. The portable computer equipment heat dissipation device according to claim 7, characterized in that: The micro-cooling module (1) further includes a thermally conductive adhesive (19), the cold plate (13) is bonded and fixed to the micro-cooling chip (11) through the thermally conductive adhesive (19), and the micro-metal fin (16) is bonded and fixed to the micro-cooling chip (11) through the thermally conductive adhesive (19).

9. The portable computer equipment heat dissipation device according to claim 7, characterized in that: The first micro fan (32) is provided with a first shock-absorbing pad (6), and the second micro fan (17) is provided with a second shock-absorbing pad (7). The first shock-absorbing pad (6) is located between the first micro fan (32) and the heat sink (31), and the second shock-absorbing pad (7) is located between the second micro fan (17) and the micro metal fin (16).

10. The portable computer equipment heat dissipation device according to claim 3, characterized in that: A sealing ring (41) and a clamp (42) are provided at the connection between the circulation pipe (4) and the micro cooling plate (2) and at the connection between the circulation pipe (4) and the composite heat dissipation module (3). The sealing ring (41) is sleeved on the outer periphery of the connection between the micro cooling plate (2) and the heat dissipation block (31) and the circulation pipe (4) and fits against the inner wall of the circulation pipe (4). The clamp (42) is sleeved on the outer wall of the circulation pipe (4).

Images