Display device

Abstract

A display device includes: a display panel, comprising: a first region including a display area; a second region; and a bending region disposed between the first region and the second region in an unfolded state; a metal plate disposed under the display panel in the first region, directly contacting the display panel, and protruding at least partially from the first region to the bending region in a plan view; a protective film disposed under the display panel in the second region when the display panel is in an unfolded state, and in a plan view, when the display panel is in a bent state, the protective film protrudes from the second region to the bending region further than the metal plate protrudes from the first region to the bending region; and a filler material disposed under the display panel in the bending region when the display panel is in an unfolded state, and filling the space between the metal plate and the protective film.

Description

Technical Field

[0001] This disclosure relates to a display device and an electronic device including the display device. More specifically, this disclosure relates to a display device for providing visual information and an electronic device including the display device. Background Technology

[0002] Recently, flat panel display devices have been researched and developed in various ways. Because of their thinness and lightness, flat panel display devices are being used in a wider range of applications. Furthermore, flat panel display devices have recently become more flexible, making them easier to carry and expanding their applications.

[0003] Because flexible flat panel displays can be bent or folded, their advantages include reducing the size of the display or improving visibility at various angles. However, because the display is thin, defects may easily occur during the manufacturing process, resulting in high manufacturing costs, and the lifespan of the display may be reduced due to the stress caused by bending. Accordingly, efforts are being made to improve the durability of bent display devices, thereby increasing their lifespan. Summary of the Invention

[0004] One object of this disclosure is to provide a display device with improved reliability.

[0005] Another object of this disclosure is to provide an electronic device including the display device.

[0006] A display device according to one embodiment of this disclosure includes: a display panel, comprising: a first region including a display area; a second region; and a bending region disposed between the first region and the second region in an unfolded state; a metal plate disposed in the first region below the display panel, directly contacting the display panel, and protruding at least partially from the first region to the bending region in a plan view; a protective film disposed in the second region below the display panel when the display panel is in an unfolded state, and in the plan view, when the display panel is in a bending state, the protective film protrudes from the second region to the bending region further than the metal plate protrudes from the first region to the bending region; and a filler material disposed in the bending region below the display panel when the display panel is in the unfolded state, and filling the space between the metal plate and the protective film.

[0007] In one embodiment, when the display panel is in the bent state, the radius of curvature of the bent area of ​​the display panel may be about 0.5 mm or less.

[0008] In one embodiment, the display device may further include a cover panel disposed between the metal plate and the protective film when the display panel is in the bent state, and to protect the display panel.

[0009] In one embodiment, the filler material may contact at least a portion of one side of the cover panel.

[0010] In one embodiment, the filler material may include at least one selected from the group consisting of silicone resins, acrylic resins and urethane resins.

[0011] In one embodiment, the display device may further include a bending protective layer disposed on the display panel in the bending region.

[0012] In one embodiment, the filler material and the bending protection layer may comprise the same material as each other.

[0013] In one embodiment, the display panel may include a substrate comprising polyimide.

[0014] The display device in another embodiment of this disclosure includes: a display panel, comprising: a first region including a display area; a second region; and a bending region disposed between the first region and the second region in an unfolded state; a metal plate disposed in the first region below the display panel, directly contacting the display panel, and comprising: an engraved pattern defined in the thickness direction of the metal plate at a portion near (or adjacent to) the bending region; a protective film disposed in the second region below the display panel when the display panel is in the unfolded state; and a filler material disposed in the bending region below the display panel when the display panel is in the unfolded state, and filling the space between the metal plate and the protective film.

[0015] In one embodiment, the engraved pattern may include a plurality of holes defined in the metal plate and extending through the metal plate in the thickness direction.

[0016] In one embodiment, in a cross-sectional view, the engraved pattern may include grooves created by partially removing material in the thickness direction of the metal plate.

[0017] In one embodiment, the filler material may cover at least a portion of the upper surface of the engraved pattern.

[0018] In one embodiment, when the display panel is in the bent state, the radius of curvature of the bent area of ​​the display panel may be about 0.5 mm or less.

[0019] In one embodiment, the display device may further include a cover panel disposed between the metal plate and the protective film when the display panel is in the bent state, and to protect the display panel.

[0020] In one embodiment, the filler material may include at least one selected from the group consisting of silicone resins, acrylic resins and urethane resins.

[0021] In one embodiment, the display device may further include a bending protective layer disposed on the display panel in the bending region.

[0022] In one embodiment, the filler material and the bending protection layer may comprise the same material as each other.

[0023] In one embodiment, the display panel may include a substrate comprising polyimide.

[0024] An electronic device according to one embodiment of this disclosure includes: a housing; and a display device housed in the housing and configured to display an image, wherein the display device includes: a display panel including: a first region including a display area; a second region; and a bending region disposed between the first region and the second region; a metal plate disposed below the first region, directly contacting the display panel, and projecting at least partially from the first region to the bending region in a plan view; a protective film disposed below the second region when the display panel is in an unfolded state, and in the plan view, when the display panel is in a bent state, the protective film projecting from the second region to the bending region further than the metal plate projecting from the first region to the bending region; and a filler material disposed below the bending region when the display panel is in the unfolded state, and filling the space between the metal plate and the protective film.

[0025] A display device in one embodiment of this disclosure may include: a display panel, comprising: a first region including a display area; a second region; and a bending region disposed between the first region and the second region; a metal plate disposed below the first region, directly contacting the display panel, and protruding at least partially from the first region to the bending region in a plan view; a protective film disposed below the second region when the display panel is in an unfolded state, and in the plan view, when the display panel is in a bent state, the protective film protrudes from the second region to the bending region further than the metal plate protrudes from the first region to the bending region; and a filler material disposed below the bending region when the display panel is in the unfolded state, and filling the space between the metal plate and the protective film.

[0026] Accordingly, the end of the metal plate protrudes less than the protective film, resulting in less pressure on the bending areas of the display panel, thus preventing or reducing the occurrence of cracks in the display panel. Furthermore, when an engraved pattern is formed in the metal plate, the modulus of the metal plate can be reduced, thereby reducing the pressure applied to the display panel. This allows for a reduction in the radius of curvature of the display panel, thereby reducing the size of the surrounding area. Additionally, since the protective film and the like are not disposed between the metal plate and the display panel, the thickness of the display device itself can be reduced.

[0027] As a result, by reducing the length of the metal plate and the pattern formation, the pressure applied to the display panel can be reduced, making it possible to produce a reliable display device. Furthermore, by reducing the peripheral area and / or the thickness of the display device, convenience can be provided to the user. Attached Figure Description

[0028] The accompanying drawings, which are included to provide a further understanding of the inventive concept and are incorporated in and constitute a part of this specification, illustrate embodiments of the inventive concept together with the description.

[0029] Figure 1 A perspective view illustrating an embodiment of a display device according to the present disclosure.

[0030] Figure 2 To show Figure 1 An exploded perspective view of the components of the display device.

[0031] Figure 3 To show Figure 2 A plan view of one embodiment of the display panel.

[0032] Figure 4 To show Figure 2 A perspective view of the display panel and metal plate.

[0033] Figure 5 To show Figure 2 A cross-sectional view of an embodiment of a display device in a bent state.

[0034] Figure 6 To show Figure 5 A cross-sectional view of an embodiment of the display panel.

[0035] Figure 7 To show Figure 5 A cross-sectional view of an embodiment of a display device in its unfolded state.

[0036] Figure 8 To show Figure 5 A cross-sectional view of another embodiment of the display device in its unfolded state.

[0037] Figure 9 To show Figure 2 A cross-sectional view of another embodiment of the display device in a bent state.

[0038] Figure 10 To show Figure 9 A cross-sectional view of an embodiment of a display device in its unfolded state.

[0039] Figure 11 To show Figure 9 A cross-sectional view of another embodiment of the display device in its unfolded state.

[0040] Figure 12 To show Figure 10 A plan view of a cut embodiment of a metal plate.

[0041] Figure 13 To show Figure 11 A perspective view of a cut embodiment of a metal plate.

[0042] Figure 14 To show Figure 11 A perspective view of another cut embodiment of the metal plate.

[0043] Figure 15 A block diagram illustrating an embodiment of an electronic device according to the present disclosure.

[0044] Figure 16 To show Figure 15 A perspective view of an embodiment of an electronic device implemented as a smartphone. Detailed Implementation

[0045] The specific structures and functional descriptions of the embodiments disclosed herein are merely illustrative and are intended to illustrate the purpose of the embodiments of this disclosure. The embodiments of this disclosure may be implemented in various forms and should not be construed as limited to the described embodiments.

[0046] Because this disclosure is subject to various changes and can take many forms, exemplary embodiments will be illustrated in the accompanying drawings and described in detail herein. However, this is not intended to limit this disclosure to the specific forms disclosed, and it should be understood to include all changes, equivalents, and substitutions that fall within the spirit and technical scope of this disclosure.

[0047] Terms such as "first" and "second" may be used to describe various components, but these components should not be limited by these terms. The terms above may be used for the purpose of distinguishing one component from another. For example, a first component may be referred to as a second component, and similarly, a second component may be referred to as a first component, without departing from the scope of this disclosure.

[0048] It will be understood that when an element is referred to as “connected” or “linked” to another element, it may be directly connected or linked to the other element, or there may be an intermediary element. Conversely, when an element is referred to as “directly connected” or “directly linked” to another element, there is no intermediary element. Other terms used to describe the relationship between elements should be interpreted in a similar manner (e.g., “between” vs. “directly between”, “adjacent” vs. “directly adjacent”, etc.).

[0049] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the inventive concept. As used herein, the singular forms “a” and “described” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprising” and / or “including”, when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0050] Terms such as “below,” “at the bottom,” “under,” “below,” “above,” “on top,” and “on top” are used to describe the relationships between the components shown in the accompanying drawings. These terms are relative concepts and are interpreted based on the directions indicated in the drawings.

[0051] As used herein, “about” or “approximately” includes the stated value and means within an acceptable deviation of the particular value, determined by a person skilled in the art considering the measurement in question and the errors associated with the measurement of the particular quantity (i.e., limitations of the measurement system). For example, the term “about” may mean within one or more standard deviations, or within ±30%, 20%, 10%, or 5% of the stated value.

[0052] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which the inventive concept pertains. It will be further understood that terms such as those defined in common dictionaries shall be interpreted as having the same meaning as they have in the context of the relevant art, and shall not be interpreted in an idealized or overly formal sense unless expressly defined herein.

[0053] The embodiments will be described in detail below with reference to the accompanying drawings. In the drawings, the same reference numerals are used for the same parts, and redundant descriptions of the same parts will be omitted.

[0054] In this specification, a plane may be defined by a first direction D1 and a second direction D2 intersecting the first direction D1. In one embodiment, for example, the second direction D2 may be perpendicular to the first direction D1. Additionally, a third direction D3 may be the normal direction of the plane. That is, the third direction D3 may be perpendicular to the plane formed by the first direction D1 and the second direction D2.

[0055] Figure 1 A perspective view illustrating an embodiment of a display device according to the present disclosure.

[0056] refer to Figure 1 The display device DD may include a display area DA and a peripheral area SA. The display area DA may be at least partially surrounded by the peripheral area SA.

[0057] The display area DA can be an area that generates light or controls the transmission of light provided from an external light source to display an image. The peripheral area SA can be an area where no image is displayed. However, embodiments of this disclosure are not limited to this, and at least a portion of the peripheral area SA can also display an image.

[0058] The display area DA can display multiple images IM. Through these images IM, the user can receive information from the display device DD.

[0059] Figure 2 To show Figure 1 An exploded perspective view of the components of the display device. Figure 3 To show Figure 2 A plan view of one embodiment of the display panel.

[0060] refer to Figure 1 , Figure 2 and Figure 3 The display device DD may include a metal plate MP, a display panel DP, a polymer layer POL, and a window layer WL.

[0061] The metal plate MP can be installed below the display panel DP. The metal plate MP supports the display panel DP and protects the display device DD from external impacts. See later. Figure 5 The length of one side of the metal plate MP and the pattern defined in the metal plate MP are described.

[0062] The metal plate MP may include metallic materials. In one embodiment, the metal plate MP may include, for example, copper (Cu), aluminum (Al), stainless steel (“SUS”), etc. These materials may be used alone or in any combination thereof. However, embodiments of this disclosure are not limited thereto.

[0063] The display panel DP can be disposed on the metal plate MP. The display panel DP may include a first region A1, a second region A2, and a bent region BA disposed between the first region A1 and the second region A2. The first region A1 includes a display region DA. In some embodiments, the metal plate MP may be disposed below the display panel DP in the first region A1.

[0064] The first region A1 of the display device DD may include a light-emitting diode (e.g., a light-emitting diode). Figure 6 (Light emitting diodes, LEDs). See below for reference. Figure 6 The description includes light-emitting diodes (e.g., Figure 6 A cross-sectional view of a display panel DP containing light-emitting elements (e.g., light-emitting diodes, LEDs).

[0065] The bend protection layer (BPL) can be set in the bend area (BA) of the display panel (DP). Although the bend protection layer (BPL) is... Figure 2 The diagram shows the bend layer BPL only disposed in the bending region BA, but the bend protection layer BPL may also be disposed in portions of the first region A1 and / or the second region A2. The bend protection layer BPL protects the bending region BA of the display panel DP from external impacts. In one embodiment, the bend protection layer BPL may comprise, for example, silicone resin, acrylic resin, or urethane resin. These materials may be used alone or in combination, but the embodiments disclosed herein are not limited thereto.

[0066] A driver chip DIC can be disposed in the second region A2 of the display panel DP. The display panel DP can provide visual information to the user of the display device DD based on electrical signals transmitted from the driver chip DIC. The driver chip DIC can be disposed on the substrate of the display device DD (e.g., Figure 5 The driver chip (DIC) is mounted on a substrate (SUB). That is, the driver chip (DIC) can be set (e.g., mounted) using a chip-on-plastic ("COP") method.

[0067] The circuit board (FPC) can be attached to the second area A2 of the display panel (DP). The FPC can be electrically connected to electronic components (e.g., a timing controller). The FPC can generate scan control signals, data control signals, and image data using video and timing signals received from the electronic components. The scan control signals, data control signals, and image data can be provided to the driver chip (DIC) via the FPC.

[0068] The polymer layer POL can be disposed on the display panel DP. The polymer layer POL can adhere the display panel DP to the window layer WL. Additionally, the polymer layer POL can support the window layer WL to prevent sagging and protect the display panel DP from external impacts. The polymer layer POL can have a single-layer or multi-layer structure.

[0069] A window layer WL can be disposed on a polymer layer POL. The front surface of the window layer WL can be divided into a transmissive area TA and a border area BZA. The transmissive area TA can be the area for displaying the image IM and can correspond to the display area DA. That is, the user can see the image IM through the transmissive area TA. In this embodiment, the transmissive area TA can have a rounded quadrilateral shape, such as a rounded rectangle shape, but the embodiments of this disclosure are not limited to this.

[0070] The bezel region BZA may surround the transmissive region TA. Accordingly, the planar shape of the transmissive region TA may be substantially defined by the bezel region BZA. The bezel region BZA may correspond to the peripheral region SA of the display device DD. The bezel region BZA may have a predetermined color, such as black or gray. However, embodiments of this disclosure are not limited to this, and the bezel region BZA may be configured to be located on only one side close to (or adjacent to) the transmissive region TA.

[0071] exist Figure 2 In the present invention, the display device DD includes a metal plate MP, a display panel DP, a polymer layer POL, and a window layer WL, but this disclosure is not limited thereto. A cover panel (e.g., a cover panel) may be included beneath the metal plate MP. Figure 5 Additional components for the cover panel (CP).

[0072] Figure 4 To show Figure 2 A perspective view of the display panel and metal plate. Specifically, Figure 4 The metal plate MP is shown below the display panel DP, and the bending area BA of the display panel DP is in a bent state.

[0073] refer to Figure 2 , Figure 3 and Figure 4 The bending area BA of the display panel DP can be bent around a virtual line extending in the first direction D1. When the bending area BA of the display panel DP is bent, the second area A2 can be positioned below the first area A1. In other words, the second area A2 of the display panel DP can be positioned facing the first area A1. As a result, components such as the circuit board FPC attached to the second area A2 can also be positioned below the first area A1.

[0074] When the display panel DP is bent, its planar area can be reduced compared to when it is not bent. As a result, the size of the peripheral area SA of the display device DD can be reduced, providing greater ease of use for the user of the display device DD.

[0075] Figure 5 To show Figure 2 A cross-sectional view of an embodiment of a display device in a bent state.

[0076] refer to Figure 2 and Figure 5 The display device DD may include a cover panel CP, a first adhesive layer AD1, a metal plate MP, a substrate SUB, a circuit element layer CEL, a light-emitting element LED, a polymer layer POL, a window layer WL, a bending protection layer BPL, a filler material FM, a second adhesive layer AD2, a protective film PF, a driver chip DIC, and a circuit board FPC. (Already referenced) Figure 2 The description includes the metal plate (MP), polymer layer (POL), window layer (WL), bending protection layer (BPL), driver chip (DIC), and circuit board (FPC), so repetitive content can be omitted or simplified.

[0077] A cover panel CP may be disposed beneath a metal plate MP. The cover panel CP may be disposed within a first region A1 of the display panel DP. The cover panel CP protects the display panel DP from external impacts or intrusion of foreign substances. The cover panel CP may have a multi-layer structure, including a support layer, a heat dissipation layer, and a shock-absorbing layer for absorbing impacts. In some embodiments, when the display panel DP is in a bent state, the cover panel CP may be disposed between the metal plate MP and the protective film PF.

[0078] In one embodiment, the cover panel CP may include a conductive material. Because the cover panel CP includes a conductive material, it can perform a discharge function for the display device DD. That is, static electricity generated in the circuit board FPC or other components can be released through the cover panel CP, thus protecting the display device DD.

[0079] A first adhesive layer AD1 may be disposed on a cover panel CP. The first adhesive layer AD1 may adhere the cover panel CP to the metal plate MP. The first adhesive layer AD1 may include materials such as optically clear adhesive (“OCA”), optically clear resin (“OCR”), or pressure-sensitive adhesive (“PSA”). These materials may be used alone or in any combination thereof. However, the embodiments disclosed herein are not limited thereto.

[0080] The metal plate MP can be disposed on the first adhesive layer AD1. The metal plate MP can protect the light-emitting element LED from external impacts.

[0081] In one embodiment, at least a portion of the metal plate MP may protrude from the first region A1 to the bent region BA in the second direction D2 in a plan view. Specifically, in a plan view, the metal plate MP may cover not only the first region A1 but also a portion of the bent region BA to protect the light-emitting element LED.

[0082] The substrate SUB can be disposed on a metal plate MP. The substrate SUB can include materials such as glass, metal, or plastic. In one embodiment, the plastic substrate can include, for example, polyimide. Accordingly, Figure 5The substrate shown may be a flexible substrate. However, the embodiments of this disclosure are not limited to this, and the substrate SUB may include an inorganic layer, an organic layer, or a composite layer.

[0083] In one embodiment, the substrate SUB may be bent around a virtual line extending in the first direction D1. Accordingly, the substrate SUB may have a radius of curvature in a cross-sectional view. This radius of curvature may be about 0.5 mm or less. Preferably, the radius of curvature may be about 0.4 mm or less. When the radius of curvature of the substrate SUB meets the above range, the thickness of the display device DD in the third direction D3 can be minimized. In some embodiments, when the display panel DP is in a bent state, the radius of curvature of the bent region BA of the display panel DP may be about 0.5 mm or less.

[0084] In one embodiment, one surface of the substrate SUB can be in direct contact with one surface of the metal plate MP. For example... Figure 5 As shown, the substrate SUB can be configured to contact the metal plate MP. That is, in the cross-sectional view, the configuration such as the protective film PF may not be placed between the substrate SUB and the metal plate MP.

[0085] Because the substrate SUB and the metal plate MP are in direct contact without any additional configuration, the thickness of the display device DD in the third direction D3 can be relatively reduced. Accordingly, the manufacturing process for the display device DD can be simplified, and the manufacturing cost of the display device DD can be reduced. Furthermore, the reduced thickness of the display device DD provides convenience for users. Additionally, the reduced radius of curvature of the display panel DP allows for a thinner display device DD.

[0086] A circuit element layer CEL may be disposed on a substrate SUB. The circuit element layer CEL may be configured to correspond to the upper surface of the substrate SUB. In one embodiment, for example, the circuit element layer CEL may have a flat plane at a location corresponding to a first region A1 and a second region A2, and may have a bent surface at a location corresponding to a bent region BA. The circuit element layer CEL may include metal (e.g., Figure 6 A switching element (e.g., a transistor, TR) transmits signals from the driver chip DIC to the light-emitting element LED. (See later...) Figure 6 Describe the configuration of circuit element layers such as CEL.

[0087] Light-emitting elements (LEDs) can be placed on the circuit element layer (CEL). LEDs emit light to provide information to the user. (Reference) Figure 6 Describe the details about the light-emitting element, LED.

[0088] A bend protection layer (BPL) can be disposed on the bend area BA of the substrate SUB. The bend protection layer BPL can contact the substrate SUB or the circuit element layer CEL. Because the bend protection layer BPL is disposed on the outside of the substrate SUB, it can protect the bend area BA of the substrate SUB from external impacts and prevent cracking. Furthermore, when the substrate SUB is bent, the bend protection layer BPL can also prevent cracks from appearing in the bend area BA of the substrate SUB.

[0089] The bending protective layer (BPL) may include silicone resins, acrylic resins, or urethane resins. These materials may be used alone or in any combination thereof. However, the embodiments disclosed herein are not limited thereto.

[0090] The polymer layer POL can be applied to the light-emitting element (LED). The polymer layer POL can prevent the window layer WL from sagging or protect the LED from external impacts.

[0091] The window layer WL may be disposed on the polymer layer POL. The window layer WL may be disposed in the first region A1 and / or the second region A2. The window layer WL may comprise glass or a synthetic resin film. These materials may be used alone or in any combination thereof. However, the embodiments disclosed herein are not limited thereto.

[0092] exist Figure 5 In the illustration, the window layer WL is shown to have a flat shape, but the embodiments of this disclosure are not limited to this. The window layer WL may be bent about a reference axis parallel to the first direction D1. In other words, in a cross-sectional view, the window layer WL may have a shape bent in a third direction D3. In addition, functional layers such as anti-reflective layers and / or anti-fingerprint layers may be further disposed on the window layer WL.

[0093] A protective film PF may be disposed below the cover panel CP. A portion of the protective film PF may protrude from the second region A2 to the bending region BA. Specifically, the protective film PF may protrude from the second region A2 in the second direction D2.

[0094] In one embodiment, the edge of the protective film PF may protrude further than the edge of the metal plate MP in the second direction D2. That is, in a plan view, when the display panel DP is in a bent state, the protective film PF may protrude from the second region A2 to the bending region BA to a greater extent than the metal plate MP may protrude from the first region A1 to the bending region BA. By making the edge of the metal plate MP protrude less than the edge of the protective film PF, the pressure exerted by the metal plate MP on the display panel DP can be reduced. As a result, the pressure exerted by the metal plate MP on the display panel DP is reduced, thereby preventing or reducing phenomena such as cracks in the display panel DP.

[0095] Figure 6 To show Figure 5A cross-sectional view of an embodiment of the display panel.

[0096] refer to Figure 1 , Figure 5 and Figure 6 The display panel DP may include a substrate SUB, a circuit element layer CEL, light-emitting elements LED, a pixel defining layer PDL, and an encapsulation layer ENC. The circuit element layer CEL may include a buffer layer BUF, a gate insulating layer GI, a switching element TR, an interlayer insulating layer IL, a connection electrode CNE, a first via layer VIA1, and a second via layer VIA2.

[0097] The switching element TR may include an active layer ACT, a gate electrode GE, a source electrode SE, and a drain electrode DE. The light-emitting element LED may include a pixel electrode PE, an emitter layer EL, and a common electrode CE.

[0098] The substrate SUB may include a glass substrate, a metal substrate, a plastic substrate, etc. In one embodiment, the plastic substrate in the substrate SUB may include, for example, polyimide. However, this disclosure is not limited thereto, and the substrate SUB may be an inorganic layer, an organic layer, or a composite material layer.

[0099] A buffer layer (BUF) may be disposed on the substrate (SUB). The buffer layer (BUF) prevents impurities such as oxygen and moisture from penetrating through the substrate (SUB) and into the upper portion of the substrate (SUB). The buffer layer (BUF) may include an inorganic insulating material.

[0100] The active layer ACT may be disposed on the buffer layer BUF. The active layer ACT may include oxide semiconductors, silicon semiconductors, organic semiconductors, etc. In one embodiment, the oxide semiconductor may include an oxide of at least one metal selected from, for example, indium (In), gallium (Ga), tin (Sn), zirconium (Zr), vanadium (V), hafnium (Hf), cadmium (Cd), germanium (Ge), chromium (Cr), titanium (Ti), and zinc (Zn). The silicon semiconductor may include amorphous silicon, polycrystalline silicon, etc. The active layer ACT may include a source region, a drain region, and a channel region disposed between the source region and the drain region.

[0101] A gate insulating layer GI may be disposed on a buffer layer BUF. Specifically, the gate insulating layer GI may cover the active layer ACT on the buffer layer BUF. The gate insulating layer GI may include an inorganic insulating material. In one embodiment, the gate insulating layer GI may be disposed completely over the display area DA and the peripheral area SA. In one embodiment, the gate insulating layer GI may be disposed only below the gate electrode GE.

[0102] The gate electrode GE may be disposed on the gate insulating layer GI. The gate electrode GE may at least partially overlap with the channel region of the active layer ACT. The gate electrode GE may include a conductive material, such as a metal, alloy, conductive metal nitride, conductive metal oxide, or transparent conductive material. In embodiments, conductive materials that can be used for the gate electrode GE may include gold (Au), silver (Ag), aluminum (Al), platinum (Pt), nickel (Ni), titanium (Ti), palladium (Pd), magnesium (Mg), calcium (Ca), lithium (Li), chromium (Cr), tantalum (Ta), tungsten (W), copper (Cu), molybdenum (Mo), scandium (Sc), neodymium (Nd), iridium (Ir), alloys containing or composed of aluminum, alloys containing or composed of silver, alloys containing or composed of copper, alloys containing or composed of molybdenum, aluminum nitride (AlN), tungsten nitride (WN), titanium nitride (TiN), chromium nitride (CrN), tantalum nitride (TaN), strontium ruthenium oxide (SrRuO), zinc oxide (ZnO), indium tin oxide (“ITO”), tin oxide (SnO), indium oxide (InO), gallium oxide (GaO), indium zinc oxide (“IZO”), etc. These materials may be used alone or in any combination thereof. In an alternative embodiment, the gate electrode GE may have a single-layer structure or a multi-layer structure including multiple conductive layers.

[0103] An interlayer insulating layer IL may be disposed on the gate electrode GE. Specifically, the interlayer insulating layer IL may be disposed on the gate insulating layer GI and cover the gate electrode GE on the gate insulating layer GI. The interlayer insulating layer IL may include an inorganic insulating material.

[0104] The source electrode SE and drain electrode DE may be disposed on the interlayer insulating layer IL. Each of the source electrode SE and drain electrode DE may be connected to the active layer ACT. In one embodiment, for example, the source electrode SE may contact the source region of the active layer ACT, and the drain electrode DE may contact the drain region of the active layer ACT. Each of the source electrode SE and drain electrode DE may include a conductive material. The active layer ACT, the gate electrode GE, the source electrode SE, and the drain electrode DE may form a switching element TR.

[0105] The first via layer VIA1 may be disposed on the source electrode SE and the drain electrode DE. Specifically, the first via layer VIA1 may be disposed on the interlayer insulating layer IL and cover the source electrode SE and the drain electrode DE on the interlayer insulating layer IL. The first via layer VIA1 may include an organic insulating material. In one embodiment, the first via layer VIA1 may be formed only in the display area DA and a portion of the peripheral area SA near (or adjacent to) the display area DA.

[0106] The connecting electrode CNE can be disposed on the first via layer VIA1. The connecting electrode CNE can transmit the signal transmitted from the switching element TR to the light-emitting element LED. The connecting electrode CNE may include metals, alloys, conductive metal nitrides, conductive metal oxides, transparent conductive materials, etc. These materials can be used alone or in any combination thereof. However, the embodiments disclosed herein are not limited thereto.

[0107] The second via layer VIA2 may be disposed on the connection electrode CNE. Specifically, the second via layer VIA2 may be disposed on the first via layer VIA1 and cover the connection electrode CNE. The second via layer VIA2 may comprise a material substantially the same as that of the first via layer VIA1.

[0108] The pixel electrode PE may be disposed on the second via layer VIA2. The pixel electrode PE may include a conductive material. The pixel electrode PE may be connected to the drain electrode DE via the connection electrode CNE. Accordingly, the pixel electrode PE may be electrically connected to the switching element TR.

[0109] A pixel defining layer (PDL) may be disposed on the pixel electrode (PE). In one embodiment, for example, the PDL may expose at least a portion of the pixel electrode (PE). The PDL may comprise an inorganic insulating material or an organic insulating material.

[0110] An emitting layer (hereinafter also referred to as a light-emitting layer) EL may be disposed on a pixel electrode PE. Specifically, the light-emitting layer EL may be disposed within an opening defined by a pixel-defining layer PDL. That is, the light-emitting layer EL may be surrounded by the pixel-defining layer PDL. The light-emitting layer EL may include at least one of organic light-emitting materials and quantum dots. However, the embodiments disclosed herein are not necessarily limited thereto.

[0111] A common electrode CE can be disposed on the light-emitting layer EL. Alternatively, the common electrode CE can be disposed on the pixel-defining layer PDL. That is, the common electrode CE can be continuously disposed on the light-emitting layer EL and the pixel-defining layer PDL. The common electrode CE may include a conductive material. The light-emitting layer EL can emit light based on the voltage difference between the pixel electrode PE and the common electrode CE.

[0112] An encapsulation layer ENC may be disposed on the common electrode CE. The encapsulation layer ENC may include at least one inorganic encapsulation layer and at least one organic encapsulation layer. In one embodiment, the inorganic and organic encapsulation layers may be alternately disposed. In one embodiment, for example, the organic encapsulation layer may include a cured polymer, such as polyacrylate, epoxy resin, or silicone resin. In one embodiment, for example, the inorganic encapsulation layer may include silicon oxide, silicon nitride, silicon carbide, aluminum oxide, tantalum oxide, hafnium oxide, zirconium oxide, titanium oxide, etc.

[0113] Figure 7 To show Figure 5A cross-sectional view of an embodiment of a display device in its unfolded state. Figure 8 To show Figure 5 A cross-sectional view of another embodiment of the display device in its unfolded state. Specifically, because Figure 7 and Figure 8 Show Figure 5 The unfolded state of the display device DD can be omitted or simplified for repetitive description. Figure 7 and Figure 8 Describe the shape and arrangement of the infill material FM.

[0114] refer to Figure 5 , Figure 7 and Figure 8 The filler material FM can be disposed between the metal plate MP and the protective film PF. When the display device DD is unfolded, the metal plate MP and the protective film PF can be spaced apart in the second direction D2, with the filler material FM between them. The filler material FM can be disposed below the bending region BA of the substrate SUB to prevent cracking or damage when the substrate SUB is bent. In some embodiments, when the display panel DP is in the unfolded state, the protective film PF can be disposed below the display panel DP in the second region A2. In some embodiments, when the display panel DP is in the unfolded state, the filler material FM can be disposed below the display panel DP in the bending region BA and can fill the space between the metal plate MP and the protective film PF.

[0115] In one embodiment, the filler material FM may include at least one of silicone resins, acrylic resins, and urethane resins. These materials may be used alone or in any combination thereof. That is, the filler material FM may include substantially the same material as the material of the bending protective layer BPL. However, embodiments of this disclosure are not necessarily limited thereto.

[0116] In one embodiment, such as Figure 7 As shown, the filler material FM can contact portions of the side surfaces of both the metal plate MP and the protective film PF. That is, the height of the upper surface of the filler material FM can be lower than the height of the upper surface of each of the metal plate MP and the protective film PF.

[0117] In one embodiment, such as Figure 8 As shown, the filler material FM can cover at least a portion of the upper surface of the metal plate MP. When the filler material FM covers at least a portion of the upper surface of the metal plate MP, the adhesive strength between the filler material FM and the metal plate MP can be improved. Additionally, the filler material FM can contact at least a portion of one side of the cover panel CP disposed on the metal plate MP. That is, the filler material FM can be disposed between the metal plate MP and the protective film PF, and can contact the metal plate MP and / or the cover panel CP, thereby improving the adhesive strength within the display device DD. Accordingly, the reliability of the display device DD's durability can be improved.

[0118] Figure 9 To show Figure 2 A cross-sectional view of another embodiment of the display device in a bent state. Specifically, Figure 9 The display device DD' shown in the figure and Figure 5 The display device DD shown is essentially the same as the one shown, except for the cross-sectional shape of the metal plate MP'. Therefore, repeated details can be omitted or simplified.

[0119] refer to Figure 2 , Figure 5 and Figure 9 The display device DD' may include a cover panel CP, a first adhesive layer AD1, a metal plate MP', a substrate SUB, a circuit element layer CEL, a light-emitting element LED, a polymer layer POL, a window layer WL, a bending protection layer BPL, a filler material FM, a second adhesive layer AD2, a protective film PF, a driver chip DIC, and a circuit board FPC.

[0120] A metal plate MP' can be disposed on the first adhesive layer AD1. The metal plate MP' protects the light-emitting element (LED) from external impacts. Figure 9 As shown, the engraved pattern GP can be defined in one surface of the metal plate MP' in the thickness direction (e.g., third direction D3).

[0121] In one embodiment, the metal plate MP' may include an engraved pattern GP in a portion near (or adjacent to) the bending region BA. Specifically, the engraved pattern GP can be defined by removing material from the upper surface of the metal plate MP' on the third direction D3. By defining the engraved pattern GP, ​​the modulus of the metal plate MP' can be relaxed. Accordingly, the metal plate MP' can be bent when the display device DD' bends. As a result, cracking can be prevented or reduced when the metal plate MP' bends along with the substrate SUB. In some embodiments, the filler material FM may cover at least a portion of the upper surface of the engraved pattern GP.

[0122] Figure 10 To show Figure 9 A cross-sectional view of an embodiment of a display device in its unfolded state. Figure 11 To show Figure 9 A cross-sectional view of another embodiment of the display device in its unfolded state. Specifically, Figure 10 and Figure 11 The display device DD' shown in the figure and Figure 7 and Figure 8 The display device DD shown is essentially the same as the one shown, except for the metal plate MP'. Therefore, repeated details can be omitted or simplified.

[0123] refer to Figure 9 , Figure 10and Figure 11 The metal plate MP' may include an engraved pattern GP in a portion near (or adjacent to) the bending region BA. In one embodiment, for example, the engraved pattern GP may be... Figure 10 The first engraved pattern GP1 shown in the example Figure 11 The second engraved pattern GP2 is shown in the example.

[0124] In one embodiment, such as Figure 10 As shown, the first engraved pattern GP1 may be defined in a portion of the metal plate MP' near (or adjacent to) the bending region BA. In the cross-sectional view, the first engraved pattern GP1 may have a hole shape penetrating the metal plate MP' in the thickness direction. That is, the first engraved pattern GP1 may be a plurality of holes defined in the metal plate MP' penetrating the metal plate MP' in the third direction D3. When the first engraved pattern GP1 is defined in the metal plate MP', at least a portion of the upper surface of the substrate SUB may be exposed.

[0125] The filler material FM can fill the first engraved pattern GP1 defined in the metal plate MP'. Specifically, the filler material FM can be disposed between the metal plate MP' and the protective film PF, and fill the first engraved pattern GP1 of the metal plate MP'. By filling the first engraved pattern GP1, the adhesive strength between the metal plate MP' and the filler material FM can be enhanced.

[0126] In one embodiment, such as Figure 11 As shown, the second engraved pattern GP2 may be defined in a portion of the metal plate MP' near (or adjacent to) the bending region BA. In the cross-sectional view, the second engraved pattern GP2 may have a groove shape that does not penetrate the metal plate MP', where material is removed from the metal plate MP'.

[0127] For reference Figure 10 Similarly, in Figure 11 In this process, the filler material FM can fill the second engraved pattern GP2 defined in the metal plate MP'. Specifically, the filler material FM is disposed between the metal plate MP' and the protective film PF, and can fill the second engraved pattern GP2 of the metal plate MP'. When the filler material FM fills the second engraved pattern GP2 of the metal plate MP', it can enhance the adhesive strength between the metal plate MP' and the filler material FM.

[0128] Figure 12 To show Figure 10 A plan view of a cut embodiment of a metal plate.

[0129] refer to Figure 10 and Figure 12The pattern area PA can be defined on one side of the metal plate MP'. Specifically, the pattern area PA can be defined on a portion of the metal plate MP' near (or adjacent to) the bending region BA. Multiple first engraved patterns GP1 can be defined in the pattern area PA. In one embodiment, for example, the first engraved patterns GP1 can penetrate the metal plate MP' in a third direction D3. That is, the first engraved patterns GP1 can penetrate from the upper surface of the metal plate MP' to the upper surface of the substrate SUB.

[0130] Figure 13 To show Figure 11 A perspective view of a cut embodiment of a metal plate. Figure 14 To show Figure 11 A perspective view of another cut embodiment of the metal plate.

[0131] refer to Figure 11 and Figure 13 The pattern area PA of the metal plate MP' may include a second engraved pattern GP2. For example... Figure 13 As shown, the second engraved pattern GP2 may extend in the width direction of the metal plate MP'. The second engraved pattern GP2 may have a groove shape in a cross-sectional view, created by partially removing material in the thickness direction of the metal plate MP', and may have a shape extending in the first direction D1 in a planar view. However, embodiments of this disclosure are not necessarily limited to this.

[0132] Further reference Figure 11 and Figure 14 The second engraved pattern GP2′ can be as follows Figure 14 The diagram shows groove shapes spaced apart from each other in the pattern area PA along a first direction D1 and / or a second direction D2.

[0133] Figure 15 A block diagram illustrating an embodiment of an electronic device according to the present disclosure. Figure 16 To show Figure 15 A perspective view of an embodiment of an electronic device implemented as a smartphone.

[0134] refer to Figure 15 and Figure 16 The electronic device ED may include a processor 110, a memory device 120, a storage device 130, an input / output (“I / O”) device 140, a power supply 150, and a display device DD. The display device DD included in the electronic device ED may be... Figure 1 The display device DD. Additionally, the electronic device ED may further include various ports for communicating with graphics cards, sound cards, memory cards, universal serial bus (“USB”) devices, or other systems.

[0135] Processor 110 can perform predetermined calculations or tasks. In one embodiment, processor 110 may be a microprocessor, a central processing unit (“CPU”), or an application processor. Processor 110 can be connected to other components via buses such as address buses, control buses, and data buses. In one embodiment, processor 110 may also be connected to an expansion bus such as a peripheral component interconnect (“PCI”) bus. Processor 110 can output data control signals and image data to a timing controller.

[0136] The memory device 120 may store data required for the operation of the electronic device ED. In one embodiment, for example, the memory device 120 may include a non-volatile memory device such as erasable programmable read-only memory (“EPROM”) (e.g., electrically erasable programmable read-only memory (“EEPROM”), flash memory, phase-change random access memory (“PRAM”), resistive random access memory (“RRAM”), nanofloating gate memory (“NFGM”), polymer random access memory (“PoRAM”), magnetic random access memory (“MRAM”), or ferroelectric random access memory (“FRAM”), and / or a volatile memory device such as dynamic random access memory (“DRAM”) (e.g., mobile DRAM) or static random access memory (“SRAM”).

[0137] Storage device 130 may include a solid-state drive (“SSD”), a hard disk drive (“HDD”), or an optical disc read-only memory (“CD-ROM”). I / O device 140 may include input devices such as a keyboard, keypad, touchpad, touchscreen, or mouse, and output devices such as speakers or printers. In one embodiment, display device DD may be included as part of I / O device 140. Power supply 150 may supply the power required for the operation of electronic device ED. Display device DD may be connected to other components via a bus or communication link.

[0138] In one embodiment, such as Figure 16 As shown, the electronic device ED can be implemented as a smartphone. The electronic device ED may include a window layer WL, a display device DD, and a housing HS.

[0139] The window layer WL may cover the display device DD. In one embodiment, for example, the window layer WL may be disposed in the display area DA of the display device DD (e.g., Figure 1 On the display area DA), to protect the display area DA of the displayed image.

[0140] The housing HS may surround the display device DD. In one embodiment, for example, the display device DD may be housed within the housing HS, which may cover the sides and bottom of the display device DD. The housing HS provides additional rigidity and protects the display device DD from external impacts.

[0141] Functional modules, such as camera modules or sensor modules, can be housed within the housing HS. These functional modules can be electrically connected to the display device DD to perform predetermined functions. However, the type and arrangement of the functional modules are not limited to this.

Claims

1. A display device, comprising: The display panel includes: The first area includes the display area; The second region; and The bending area is positioned between the first area and the second area in the unfolded state; A metal plate is disposed in the first region below the display panel, directly contacting the display panel, and protruding at least partially from the first region to the bending region in a plan view; A protective film, disposed beneath the display panel in the second region when the display panel is in the unfolded state, and in the plan view, when the display panel is in the bent state, the protective film protrudes from the second region toward the bent region further than the metal plate protrudes from the first region toward the bent region; and A filling material is disposed under the display panel in the bending area when the display panel is in the unfolded state, and fills the space between the metal plate and the protective film.

2. The display device according to claim 1, wherein when the display panel is in the bent state, the radius of curvature of the bent region of the display panel is 0.5 mm or less.

3. The display device according to claim 1, further comprising: A cover panel is disposed between the metal plate and the protective film when the display panel is in the bent state, and protects the display panel.

4. The display device according to claim 3, wherein the filling material contacts at least a portion of one side of the cover panel.

5. The display device according to claim 1, wherein the filling material comprises at least one selected from the group consisting of silicone resins, acrylic resins and urethane resins.

6. The display device according to claim 1, further comprising: A bending protective layer is disposed on the display panel in the bending area.

7. The display device of claim 6, wherein the filling material and the bending protective layer comprise the same material as each other.

8. The display device according to any one of claims 1 to 7, wherein the display panel comprises a substrate, the substrate comprising polyimide.

9. A display device, comprising: The display panel includes: The first area includes the display area; The second region; and The bending area is positioned between the first area and the second area in the unfolded state; A metal plate, disposed in the first region below the display panel and in direct contact with the display panel, the metal plate comprising: The engraved pattern is defined in the thickness direction of the metal plate at a portion close to the bending area; A protective film, disposed in the second region beneath the display panel when the display panel is in the unfolded state; and A filling material is disposed under the display panel in the bending area when the display panel is in the unfolded state, and fills the space between the metal plate and the protective film.

10. The display device of claim 9, wherein the engraved pattern includes a plurality of holes defined in the metal plate and extending through the metal plate in the thickness direction of the metal plate.

Images