A protection method for preventing spring probe connector metal electrolysis from causing poor contact

Abstract

This invention relates to the field of electronic connectors and circuit protection technology, and discloses a protection method to prevent poor contact caused by metal electrolysis in spring probe connectors. The method includes a main control chip that sends a microsecond-level detection signal to the connector for monitoring. The signal pulse width is less than the electrochemical polarization establishment time threshold, and charge discharge is used to suppress the electrolytic reaction. After detecting liquid conduction, the graphene heating module is controlled to operate at a constant temperature, and the physical drying time is determined using the dynamic voltage division principle of thermal impedance. Heating is then maintained for a preset time to remove microscopic residual moisture. Finally, a cold-state insulation re-inspection is performed. After the connector naturally cools to ambient temperature, the insulation impedance is tested again, and power is restored only when the cold-state impedance meets the recovery standard. This invention avoids electrolytic corrosion caused by the monitoring process and effectively eliminates misjudgments caused by high-temperature false drying and salt moisture return, ensuring the electrical safety of the connector after recovery.

Description

Technical Field

[0001] This invention relates to the field of electronic connectors and circuit protection technology, specifically a protection method to prevent poor contact caused by metal electrolysis in spring probe connectors. Background Technology

[0002] Spring-loaded probe connectors are widely used in wearable electronic devices such as true wireless stereo (TWS) Bluetooth headsets, smartwatches, and smart bracelets to enable power transmission and data communication. The charging contacts of these devices are often exposed to the external environment during actual use, easily coming into contact with human sweat, sebum, or rainwater. To detect whether a device is connected, the main control circuit typically keeps the spring probe in a standby detection state.

[0003] Existing standby detection solutions mostly use continuous output of DC voltage or low-frequency level signals to monitor circuit impedance. When a conductive liquid is present between the connector pins, the continuous detection signal will establish a stable potential difference between the pins. This potential difference, combined with the electrolyte liquid, satisfies the conditions for electrochemical corrosion, causing metal ion deposition and plating peeling from the metal probe acting as the anode. The resulting oxides or corrosion products will adhere to the contact surface, leading to increased contact resistance and causing poor charging contact.

[0004] Furthermore, existing protection mechanisms primarily employ passive methods such as overcurrent protection or short-circuit interruption, failing to actively remove residual liquid. Some solutions incorporating heating typically rely solely on impedance values ​​at high temperatures as a drying criterion, immediately stopping heating and restoring power upon detecting an increase in impedance. However, for salty electrolyte solutions like sweat, the residual salt crystals after water evaporation are hygroscopic. At high temperatures, dried salt crystals exhibit a high-resistivity state, easily leading to false positives of "dryness." When the equipment cools, the residual salt absorbs moisture from the air and deliquesces, causing the insulation impedance to decrease again. Current technology lacks a mechanism to verify the insulation state after this thermal effect is eliminated, posing a risk of re-corrosion due to premature power restoration. Summary of the Invention

[0005] To address the shortcomings of existing technologies, this invention provides a protection method to prevent poor contact caused by metal electrolysis in spring probe connectors. This method solves the problems in existing technologies, such as DC detection signals easily inducing electrochemical corrosion of damp contacts, the inability of traditional passive protection or single heating methods to completely remove residual salt electrolytes, and the lack of a cold-state re-inspection mechanism leading to unsafe power restoration.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a protection method for preventing poor contact caused by metal electrolysis in spring probe connectors, comprising the following steps: the main control chip performs electrolytic polarization suppression monitoring, sends a microsecond-level detection signal to the first pin of the spring probe connector body through the power control port, and determines whether there is a conductive path between the first pin and the second pin based on the detection voltage value collected by the analog-to-digital conversion acquisition port; when a conductive path is determined, the main control chip performs dynamic voltage divider circuit detection of thermal impedance, controls the graphene heating module to operate and provide heat energy through the heating control port, and determines the physical drying time based on the real-time voltage value collected by the analog-to-digital conversion acquisition port; after determining the physical drying time, the main control chip performs post-drying safety maintenance processing; after the post-drying safety maintenance processing is completed, the main control chip performs cold insulation re-check, controls the graphene heating module to stop, monitors the real-time temperature using the temperature acquisition port connected to the temperature sensor, and restores power supply to the external device to be connected when the insulation recovery standard is met after cooling.

[0007] Preferably, in the electroless polarization suppression monitoring step, the main control chip sets the pulse width of the microsecond-level detection signal so that the high-level duration of the microsecond-level detection signal is sufficient to charge the equivalent parasitic capacitance in the circuit to establish the detection voltage, and is less than the polarization establishment time threshold of the electrochemical reaction of the liquid medium at the current voltage. By controlling the high-level duration to be less than the polarization establishment time threshold, sampling is completed before the redox reaction occurs in the double layer on the electrode surface, thereby avoiding electrochemical corrosion.

[0008] Preferably, the electroless polarization suppression monitoring step further includes performing charge discharge reset. After the pulse width of the microsecond-level detection signal ends, the main control chip controls the power control port to switch from a high-level output state to a low-level output state, grounding the first pin and discharging the polarization charge through the internal pull-down circuit of the power control port. This operation restores the potential of the electrode interface to zero, eliminating charge accumulation caused by continuous scanning.

[0009] Preferably, the method for determining whether a conduction path exists between the first pin and the second pin includes: the main control chip compares the acquired probe voltage value with a preset trigger threshold; when a single comparison shows that the acquired probe voltage value is greater than the preset trigger threshold, the main control chip starts a verification counter and repeatedly performs sampling and comparison operations within a continuous scanning cycle; only when multiple consecutive sampling results meet the condition that the acquired probe voltage value is greater than the preset trigger threshold, the main control chip confirms that a conduction path exists. This multi-cycle determination logic can filter out transient false triggers caused by electromagnetic interference or contact jitter.

[0010] Preferably, the preset trigger threshold is established based on the detection sensitivity verification step. The main control chip sets the maximum detection impedance threshold, and according to the principle of resistor voltage division, calculates the voltage value after the high-level voltage of the power control port is divided by the maximum detection impedance threshold and the equivalent input pull-down impedance of the analog-to-digital conversion acquisition port, and stores this voltage value as the preset trigger threshold.

[0011] Preferably, the thermal impedance dynamic voltage divider circuit detection includes: the main control chip controlling the power control port to output a bias voltage, controlling the graphene heating module to operate at a constant temperature according to the preset dehydration temperature; the main control chip constructs a monitoring model, and the real-time voltage value acquired by the analog-to-digital conversion acquisition port has a negative correlation with the conduction equivalent resistance of the liquid medium between the first and second pins; as the liquid evaporates, the conduction equivalent resistance increases, and the real-time voltage value decreases.

[0012] Preferably, the method for determining the physical drying time includes: the main control chip compares the real-time voltage value with a preset drying threshold voltage; when the real-time voltage value is continuously lower than the preset drying threshold voltage, it indicates that the conductive path between the first pin and the second pin is broken and the impedance is in a high-resistance state, and the main control chip determines that the physical drying time has been reached.

[0013] Preferably, the post-drying safety maintenance process includes: after determining the physical drying time, the main control chip starts a timer and controls the graphene heating module to maintain operation for a preset safety maintenance time; during the timing period, the main control chip continuously monitors the real-time voltage value; if the real-time voltage value is detected to rise again, the main control chip resets the timer and restarts the timing; when the timer expires and the real-time voltage value remains stable, the main control chip terminates the heating excitation. This step, by extending the heating time, allows residual moisture in the pin roots or fine gaps to evaporate.

[0014] Preferably, in the cold insulation retest step, the method for monitoring the real-time temperature includes: after the main control chip controls the graphene heating module to stop outputting, the real-time temperature of the temperature sensor is obtained through the temperature acquisition port; the main control chip remains in a waiting state until the real-time temperature drops below or equal to the hysteresis cooling threshold, which is set as the sum of the ambient temperature and the preset temperature difference margin.

[0015] Preferably, in the cold-state insulation retest step, determining compliance with the insulation recovery standard includes: the main control chip controlling the power control port to output a bias voltage, and reading the cold-state retest voltage value through the analog-to-digital converter acquisition port; the main control chip comparing the cold-state retest voltage value with a safe reset voltage threshold calculated based on the reset allowable impedance; and confirming compliance with the insulation recovery standard only when the cold-state retest voltage value is less than or equal to the safe reset voltage threshold. This step is used to eliminate misjudgments caused by increased ion mobility or temporary high resistance states exhibited by hygroscopic materials at high temperatures, ensuring that the connector has stable insulation performance at room temperature.

[0016] This invention provides a method for preventing poor contact caused by metal electrolysis in spring probe connectors. It has the following beneficial effects:

[0017] 1. This invention establishes a time threshold by setting the high-level duration of the microsecond-level detection signal to be less than the electrochemical polarization of the liquid medium, and combines this with a charge discharge reset mechanism to suppress electrochemical reactions while detecting the conduction path. This method prevents double-layer polarization and redox reactions on the metal contact surface caused by the continuous application of the detection signal when the main control chip continuously scans and monitors the pins, thereby preventing electrolytic corrosion of the metal pins caused by the monitoring process itself and extending the service life of the spring probe connector.

[0018] 2. This invention employs a dynamic voltage divider loop detection based on thermal impedance combined with post-drying safety maintenance, achieving closed-loop control of the drying process. The physical drying time is determined by real-time monitoring of voltage changes, and heating is maintained for a preset time after drying is confirmed. If the voltage rises during this period, the timer is reset. This mechanism eliminates residual moisture at the pin roots or in micro-gap areas due to capillary action, preventing contact risks caused by only detecting surface dryness while the interior remains damp, thus ensuring the thoroughness of the dehydration process.

[0019] 3. This invention introduces a cold-state insulation re-inspection step, which verifies the insulation performance again after heating is stopped and the connector is allowed to cool to ambient temperature. This step eliminates the influence of nonlinear changes in electrolyte ion mobility on impedance measurement under high-temperature conditions, as well as the situation where hygroscopic salts exhibit a temporary high-resistivity state at high temperatures but regain conductivity after cooling. By confirming that the insulation impedance meets the standard under thermal equilibrium conditions before restoring power supply, the electrical safety and reliability of the connector are ensured when it resumes operation. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall architecture of the present invention; Figure 2 This is a flowchart of the protection method of the present invention.

[0021] Among them, 100 is the main control chip; 101 is the analog-to-digital conversion acquisition port; 102 is the power control port; 103 is the heating control port; 104 is the temperature acquisition port; 200 is the spring probe connector body; 201 is the first pin; 202 is the second pin; 203 is the graphene heating module; 204 is the temperature sensor; 300 is the external device to be connected; and 400 is the equivalent parasitic capacitance. Detailed Implementation

[0022] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0023] See attached document Figure 1 , Figure 1 This is a schematic diagram of the overall architecture of a protection system for preventing poor contact caused by metal electrolysis in a spring probe connector according to an embodiment of the present invention. The present invention provides a protection method for preventing poor contact caused by metal electrolysis in a spring probe connector, based on a protection system. This system mainly includes a main control chip 100, a spring probe connector body 200, and an external device 300 to be connected.

[0024] The main control chip 100, as the core processing unit of the system, is electrically connected to the spring probe connector body 200 and is configured to perform status monitoring, data processing, and dewatering control logic. The spring probe connector body 200 includes an insulating base and multiple metal conductive terminals fixed on the insulating base. In this embodiment, a pair of pins that are not directly connected to each other are selected as the monitoring objects, namely the first pin 201 and the second pin 202.

[0025] The metal contact portions of the first pin 201 and the second pin 202 are exposed to the external environment for making contact with the corresponding contacts of the external device 300 to be connected. Specifically, the external device 300 to be connected (e.g., the earphone head of a TWS earphone) is provided with external corresponding contacts A and B that match the charging case. When the earphone is placed in the charging case, the first pin 201 makes physical contact with the external corresponding contact A, and the second pin 202 makes physical contact with the external corresponding contact B, thereby forming a complete circuit connection. A graphene heating module 203 and a temperature sensor 204 are integrated on the spring probe connector body 200. The graphene heating module 203 is physically located adjacent to the first pin 201 and the second pin 202 and is used to provide heat energy. The temperature sensor 204 (e.g., an NTC thermistor) is disposed within the insulating base of the spring probe connector body 200 and is used to monitor the temperature of the connector in real time. The main control chip 100 also includes a temperature acquisition port 104, which is electrically connected to the temperature sensor 204 and configured to acquire ambient temperature and temperature rise data during the heating process, thereby realizing closed-loop temperature control and providing heat energy to the metal plating surface of the first pin 201 and the second pin 202.

[0026] The main control chip 100 includes a power control port 102, which is electrically connected to the first pin 201 of the spring probe connector body 200. The power control port 102 is configured as a general purpose input / output interface (GPIO) with switchable circuit output states. The circuit output states include at least a high-level output state, a low-level output state, and a high-impedance input state.

[0027] In normal power supply mode, the power control port 102 outputs a stable DC voltage; in monitoring mode, the power control port 102 is configured to output a microsecond-level pulse signal or be in a high-impedance state to control the on / off state of the monitoring circuit and suppress the electrolytic polarization effect.

[0028] The main control chip 100 includes an analog-to-digital converter (ADC) acquisition port 101, which is electrically connected to the second pin 202 of the spring probe connector body 200. The ADC acquisition port 101 integrates an ADC and input / output control circuitry. The ADC acquisition port 101 is configured to acquire the voltage amplitude signal from the second pin 202 to ground during the sampling period.

[0029] An equivalent parasitic capacitance 400 exists in the circuit. This equivalent parasitic capacitance 400 is not a separately soldered physical capacitor element, but rather a distributed capacitance parameter composed of the internal input capacitance of the analog-to-digital converter acquisition port 101, the structural capacitance of the second pin 202, and the capacitance of the connecting circuit board traces. In circuit principle, the equivalent parasitic capacitance 400 manifests as a charge storage unit connected in parallel between the second pin 202 and the system.

[0030] In the subsequent testing process, the equivalent parasitic capacitance 400 and the equivalent resistance of the liquid medium together form an RC filter network to filter out high-frequency noise interference, so that the analog-to-digital conversion acquisition port 101 can acquire a stable voltage divider signal when the power control port 102 continuously outputs a bias voltage.

[0031] The main control chip 100 includes a heating control port 103, which is electrically connected to the graphene heating module 203. The main control chip 100 outputs a pulse width modulation (PWM) signal through the heating control port 103 to adjust the heating power of the graphene heating module 203.

[0032] The heat generated by the graphene heating module 203 is conducted to the surfaces of the first pin 201 and the second pin 202. The heat generated by the graphene heating module 203 is used to accelerate the evaporation of the liquid medium and to change the ion mobility of the electrolyte solution or damp salt remaining between the first pin 201 and the second pin 202.

[0033] When water, sweat, or other conductive liquids adhere to the surface of the spring probe connector body 200, the liquid medium forms an equivalent resistance between the first pin 201 and the second pin 202. The value of this equivalent resistance varies with the composition, concentration, and temperature of the liquid medium.

[0034] The main control chip 100 is equipped with a memory that stores computer-executable instructions. By executing these instructions, the main control chip 100 controls the output state switching of the power control port 102, the sampling timing of the analog-to-digital conversion acquisition port 101, and the power output of the heating control port 103, thereby realizing the identification and protection of the contact state of the spring probe connector body 200.

[0035] See attached document Figure 2 , Figure 2 This is a flowchart of a protection method for preventing poor contact caused by metal electrolysis in a spring probe connector according to an embodiment of the present invention. The present invention provides a protection method for preventing poor contact caused by metal electrolysis in a spring probe connector, comprising the following steps: S100, perform electroless polarization suppression monitoring; the main control chip 100 configures the power control port 102 to pulse output mode, periodically sending microsecond-level detection signals to the first pin 201 of the spring probe connector body 200; the analog-to-digital conversion acquisition port 101 acquires the detection voltage value of the second pin 202 during the high-level duration of the detection signal; the main control chip 100 determines whether there is a conduction path between the first pin 201 and the second pin 202 based on the detection voltage value; if a conduction path is determined to exist, proceed to step S200; if no conduction is determined, maintain the current monitoring state; S200: Perform dynamic voltage divider circuit detection of thermal impedance; the main control chip 100 controls the graphene heating module 203 to run continuously to provide heat energy; during the heating process, the main control chip 100 controls the power control port 102 and the analog-to-digital conversion acquisition port 101 to work together, controlling the power control port 102 to continuously output bias voltage and controlling the analog-to-digital conversion acquisition port 101 to perform continuous voltage divider sampling operation; the main control chip 100 determines whether the first pin 201 and the second pin 202 have reached a dry state based on the change of the real-time voltage value over time; if it is determined that it is not dry, repeat this step; if it is determined that it is dry, proceed to step S300; S300, Perform the safety maintenance process after drying; After drying is determined in step S200, the main control chip 100 controls the graphene heating module 203 not to stop immediately, but to continue to work for a preset fixed time and continuously monitor the voltage status to ensure that the residual moisture in the pin root or micro gap is completely evaporated and to prevent false drying. S400, perform cold insulation retest; the main control chip 100 controls the graphene heating module 203 to stop working and waits for the spring probe connector body 200 to cool to ambient temperature; the main control chip 100 performs another transient sampling operation based on the principle of resistive voltage division; if the voltage amplitude detected by the analog-to-digital conversion acquisition port 101 is higher than the safety reset voltage threshold (indicating that the impedance has not been restored), the main control chip 100 generates an abnormal state flag and locks the power output; if the voltage amplitude meets the insulation recovery standard, the main control chip 100 restores the normal power supply function to the external device 300.

[0036] In step S100, the main control chip 100 detects the conduction state of the spring probe connector body 200 by generating a discontinuous electrical signal with specific timing characteristics. This process specifically includes the following sub-steps: Step S101: Configure microsecond-level detection pulse parameters. The timer module inside the main control chip 100 is configured to generate periodic trigger signals. The main control chip 100 sets the pulse width of the detection signal. and scan cycle Pulse width The value range is set below the polarization establishment time threshold of the electrochemical reaction. Electrochemical polarization establishment time refers to the physical time required for the double-layer capacitance on the electrode surface to charge to the minimum potential difference required to initiate the water electrolysis reaction. The main control chip 100 sets the pulse width according to the following inequality: ; in, Represents pulse width; This represents the electrochemical activation time constant of the liquid medium at the current voltage. Based on the electrochemical characteristics of water under 3.3V excitation, the main control chip 100 will... The pulse width is set between 10 and 100 microseconds. It is sufficient to complete the circuit continuity detection, but not enough to enable the hydroxide ions on the electrode surface to complete the directional migration and undergo redox reaction.

[0037] Scan cycle The duty cycle is set between 100 milliseconds and 1000 milliseconds to ensure an extremely low duty cycle, so that the first pin 201 is in a zero potential state for most of the time, which is conducive to the natural dissipation of residual charge.

[0038] Step S102: Output the detection signal and synchronize sampling. When the timer triggers the monitoring cycle, the main control chip 100 controls the power control port 102 to switch instantaneously from a low-level state to a high-level output state. At this time, the power control port 102 outputs a transient voltage with an amplitude of 3.3V to the first pin 201. Simultaneously, the main control chip 100 configures the analog-to-digital converter acquisition port 101 to enable the internal pull-down resistor or connect an external pull-down load, thereby constructing a defined equivalent input pull-down impedance for the analog-to-digital converter acquisition port 101. This ensures that the input level of the analog-to-digital converter (ADC) acquisition port 101 remains low when the first pin 201 and the second pin 202 are not conducting. The main control chip 100 controls the ADC acquisition port 101 to start sampling conversion. The sampling timing of the ADC acquisition port 101... It is configured to be synchronously delayed and triggered with the rising edge of the power control port 102, and the sampling completion time is strictly controlled within Before concluding, the specific working principle and register configuration of the internal sample-and-hold circuit of the analog-to-digital converter acquisition port 101 are well-known to those skilled in the art and will not be elaborated upon here.

[0039] Step S103: Perform charge discharge reset. (During the pulse width...) After completion, the main control chip 100 immediately controls the power control port 102 to switch from a high-level output state back to a low-level state. By grounding the first pin 201, if there is a conductive path composed of a liquid medium between the first pin 201 and the second pin 202, the trace polarization charge accumulated at the double-layer interface during the pulse will be rapidly discharged to ground through the internal pull-down circuit of the power control port 102. This operation forces the potential of the electrode interface to return to zero, preventing the charge accumulation effect caused by continuous scanning, thereby eliminating the necessary conditions for electrochemical corrosion.

[0040] Step S104: Threshold determination of the conduction state. The main control chip 100 reads the digital voltage value acquired in step S102. When the first pin 201 and the second pin 202 are shorted by a conductive liquid, the detection voltage output from the first pin 201 forms a voltage divider circuit with the pull-down impedance of the analog-to-digital converter acquisition port 101 through the equivalent resistance of the liquid medium. The detection voltage value acquired by the analog-to-digital converter acquisition port 101... Follows the following circuit principle: ; in, This represents the detected voltage value acquired by the analog-to-digital converter acquisition port 101; This represents the high-level voltage output from power control port 102. This represents the equivalent input pull-down impedance of analog-to-digital conversion acquisition port 101; This represents the equivalent resistance of the liquid medium between the first pin 201 and the second pin 202. This represents the total series impedance of the detection circuit.

[0041] The main control chip 100 will detect the voltage value. With the preset trigger threshold Compare. Trigger threshold. The setting is calculated based on the maximum allowable detection impedance value of the system. If Greater than The main control chip 100 detects liquid intrusion and generates an interrupt signal to trigger the subsequent media identification process; if Less than or equal to The main control chip 100 determines that the connector is in a dry or open-circuit state, and the system remains in low-power standby mode and waits for the next scan cycle.

[0042] After acquiring the probe voltage value from the analog-to-digital converter acquisition port 101, the main control chip 100 performs the following data processing steps to establish the physical contact state of the connector: Step S105: Perform detection sensitivity verification and parameter configuration. The main control chip 100 will acquire the voltage value from the analog-to-digital converter acquisition port 101. As a criterion for judgment. To ensure that the system can identify the weak conductivity state formed by trace amounts of liquid, and to avoid false triggering caused by high humidity environments, the system is set with a maximum detection impedance threshold. This represents the maximum resistance value between the first pin 201 and the second pin 202, which the system can determine as being in a conducting state. The main control chip 100 establishes a preset trigger threshold based on the principle of resistor voltage division. With the maximum detection impedance threshold The numerical relationship between them: ; in, This represents the maximum detectable impedance threshold, which is configured to be between 100 kiloohms and 1 megaohm. This represents the equivalent input pull-down impedance of analog-to-digital conversion acquisition port 101; This represents the high-level voltage output from power control port 102. This represents the preset trigger threshold. During the system initialization phase, the main control chip 100, based on the inherent characteristics of the circuit hardware, triggers the system. Parameters and settings for application scenarios The target value is calculated using the above formula, and the corresponding voltage value is stored as a preset trigger threshold. .

[0043] Step S106: Perform multi-cycle interference filtering judgment. Considering that electromagnetic interference, electrostatic discharge, or mechanical vibration can easily cause transient voltage spikes in a single sampling, the main control chip 100 uses multi-cycle counting logic to verify the validity of the conduction signal. When the single comparison result in step S104 displays the probe voltage value acquired by the analog-to-digital conversion acquisition port 101... Greater than the preset trigger threshold At this time, the main control chip 100 does not immediately trigger an alarm, but instead starts a verification counter. The main control chip 100 then... The sampling and comparison operation is repeated within each consecutive scan cycle. Only when consecutive... All sampling results met the detection voltage values ​​acquired by analog-to-digital conversion acquisition port 101. Greater than the preset trigger threshold Under certain conditions, the main control chip 100 will confirm the transient conduction event is valid. (Number of verifications) It is a positive integer, and the value range is set to 2 to 5.

[0044] The multi-cycle counting logic ensures the continuous stability of the conduction signal in terms of timing logic. Only when the conduction state duration exceeds N scan cycles (i.e., greater than...) will the signal remain stable. The system only recognizes a valid trigger when the triggering logic is triggered at a certain time. Through multi-cycle counting logic, it effectively filters out sporadic electromagnetic interference or contact transient jitter that lasts shorter than the decision window, ensuring the accuracy of the triggering logic.

[0045] Step S107: Lock the state and generate an event trigger signal. Once step S106 confirms the conduction event is valid, the main control chip 100 immediately switches the system state from standby monitoring mode to active dewatering mode. At this time, the main control chip 100 executes the interrupt service routine, pauses the current low-power timer, and sets the liquid intrusion flag. Simultaneously, the main control chip 100 disables the power control port 102 from entering continuous power supply mode to prevent large current output to the connector before the subsequent dewatering process is completed. The flag bit operation and interrupt vector jump logic of the main control chip's internal registers are well-known technologies to those skilled in the art and will not be described in detail here. Subsequently, the system directly jumps to step S200 to perform the dewatering operation.

[0046] In step S200, the main control chip 100 executes a constant temperature heating and status monitoring process, which specifically includes the following steps: S201, the constant temperature heating and bias circuit is started; the main control chip 100 controls the heating control port 103 to output a PWM signal, driving the graphene heating module 203 to operate at a preset standard dehydration temperature (e.g., 55 degrees Celsius). Simultaneously, the main control chip 100 controls the power control port 102 to output a bias voltage. A stable voltage divider monitoring loop is established between the first pin 201 and the second pin 202.

[0047] S202, Construct a monitoring model based on the principle of resistive voltage division; Equivalent resistance of the liquid medium between the first pin 201 and the second pin 202. The equivalent resistance of the liquid medium during conduction. The fixed pull-down impedance inside the analog-to-digital conversion acquisition port 101 Series connection. Real-time voltage value acquired by analog-to-digital converter acquisition port 101. Follow the physical relationship as follows: ; In the presence of a liquid, The value is small. It is at a high level; as heating proceeds, the liquid evaporates. The value gradually increases. It then declined.

[0048] in, represent Real-time voltage value acquired by analog-to-digital converter acquisition port 101 at any given time; This represents the bias voltage output from power control port 102; This represents the equivalent input pull-down impedance of analog-to-digital conversion acquisition port 101; represent The equivalent resistance of the liquid medium between pin 201 and pin 202 at any given moment. As heating proceeds, liquid evaporation leads to... As the value gradually increases, the denominator increases, making... It then declined.

[0049] S203 determines the physical drying time; the main control chip 100 continuously compares the real-time voltage value. With the preset drying threshold voltage When the liquid completely evaporates, the liquid bridge breaks. It instantly becomes a high-resistivity state (approaching infinity), leading to It quickly dropped to near 0V. Persistently below At that time, the main control chip 100 determines the physical drying time. Arrived.

[0050] In step S200, the physical drying time is confirmed. Afterwards, the main control chip 100 enters step S300 to perform post-drying safety maintenance processing. This step aims to ensure thorough drying through time redundancy, and the specific process is as follows: S301, Start Safety Maintenance Timer; After detecting a voltage drop below the drying threshold, the main control chip 100 starts a timer. The timer duration is preset to the safety maintenance time. (For example, 30 to 60 seconds). This time value is set based on the statistical margin under the most difficult volatilization condition measured experimentally.

[0051] S302, maintain heating and status monitoring; in During the timing period, the main control chip 100 controls the graphene heating module 203 to continue maintaining the standard dehydration temperature. Simultaneously, the main control chip 100 continuously monitors the real-time voltage value using the formula in step S202. If detected during the maintenance period If the temperature rises again (indicating residual droplets flowing back or overflowing due to heat), the main control chip 100 resets the timer and restarts the timing.

[0052] S303, terminate excitation; when the timer expires and... When the voltage level remains stable at a low level, the main control chip 100 stops sending PWM signals to the heating control port 103 and turns off the output of the power control port 102. The system then enters the natural cooling phase.

[0053] After completing the heating and dehydration process, the system proceeds to step S400 to perform a cold insulation re-inspection.

[0054] The cold state refers to the physical state of the spring probe connector body 200 when the heating excitation stops and it cools naturally to reach a thermal equilibrium state with the ambient temperature (e.g., the temperature difference is less than 5 degrees Celsius).

[0055] Cold-state insulation refers to the electrical impedance characteristics exhibited between the first pin 201 and the second pin 202 when the spring probe connector body 200 is cooled naturally to a thermal equilibrium state with the ambient temperature (cold state). Cold-state insulation retest refers to the process of verifying the insulation impedance again under cold conditions after the system passes the high-temperature drying test, without immediately restoring power supply, but by deliberately introducing a cooling waiting period.

[0056] Introducing cold-state insulation retesting. On the one hand, high-temperature environments significantly increase the mobility of residual electrolyte ions, potentially leading to nonlinear deviations in impedance measurements. On the other hand, certain hygroscopic salts (such as sweat crystals) are in a dry, high-resistivity state at high temperatures, but may rapidly absorb moisture from the air during cooling, resulting in "moisture reabsorption" and a decrease in insulation. Therefore, only through cold-state insulation retesting can we eliminate the misjudgment caused by "false dryness" due to thermal effects and ensure that the connector possesses truly reliable electrical isolation capabilities during long-term storage at room temperature.

[0057] The specific re-inspection process is as follows: Step S401: Perform natural cooling. The main control chip 100 controls the heating control port 103 to stop outputting the PWM signal, causing the graphene heating module 203 to enter a natural cooling state. During this period, the main control chip 100 continuously monitors the real-time temperature through a temperature sensor. The system sets a hysteresis cooling threshold. The threshold is configured to be the ambient temperature. Adding a preset temperature margin (e.g., 5 degrees Celsius), the main control chip 100 executes a wait command until the real-time temperature is reached. Drop to below or equal to the hysteresis cooling threshold This is to ensure that the first pin 201 and the second pin 202 return to thermal equilibrium.

[0058] Step S402: Perform cold impedance detection. Once the temperature meets the aforementioned cold conditions, the main control chip 100 controls the power control port 102 to output the bias voltage. The circuit is supplied with transient power. The main control chip 100 reads the voltage value through the analog-to-digital converter acquisition port 101 and records it as the cold-state retest voltage value. To determine whether the connector's insulation performance meets the recovery standard, the main control chip 100 calculates the safe reset voltage threshold based on the principle of resistor voltage division. And perform the following comparison logic: ; in, This represents the cold-state retest voltage value; Represents the safe reset voltage threshold; This represents the bias voltage output from power control port 102; This represents the equivalent input pull-down impedance of analog-to-digital conversion acquisition port 101; Represents the reset allowance impedance. Reset allowance impedance The value is set to be greater than the drying cutoff impedance. (For example, set to 20 megohms).

[0059] Step S403, determination and state reset. Only when the cold state re-check voltage value... Less than or equal to the safe reset voltage threshold At this point, the main control chip 100 determines that a stable insulation resistance has been established between the first pin 201 and the second pin 202 in a cold state. The main control chip 100 then determines that the dehydration process is complete, removes the disable status of the USB data path or charging path, allows the device to resume normal function, and clears the detection flag. If the determination condition is not met, it indicates that there is a moisture backflow phenomenon. The main control chip 100 generates an error log and keeps the port disabled. At this time, the system is configured to trigger an alarm prompt, or, provided that the maximum number of retries has not been reached, jump back to step S200 to re-execute the heating process.

Claims

1. A method for protecting against poor contact caused by metal electrolysis in spring probe connectors, characterized in that, Includes the following steps: The main control chip (100) performs electroless polarization suppression monitoring and sends a microsecond-level detection signal to the first pin (201) of the spring probe connector body (200) through the power control port (102). Based on the detection voltage value collected by the analog-to-digital conversion acquisition port (101), it determines whether there is a conduction path between the first pin (201) and the second pin (202). When the conduction path is determined to exist, the main control chip (100) performs thermal impedance dynamic voltage divider circuit detection, controls the graphene heating module (203) to operate and provide heat energy through the heating control port (103), and determines the physical drying time based on the real-time voltage value collected by the analog-to-digital conversion acquisition port (101). After determining the physical drying time, the main control chip (100) performs a post-drying safety maintenance process; After the drying and safety maintenance process is completed, the main control chip (100) performs a cold insulation retest, controls the graphene heating module (203) to stop, uses the temperature acquisition port (104) connected to the temperature sensor (204) to monitor the real-time temperature, and restores the power supply to the external device (300) to be connected when it is determined that the insulation restoration standard is met after cooling.

2. The protection method for preventing poor contact caused by metal electrolysis in a spring probe connector according to claim 1, characterized in that, In the step of performing electroless polarization suppression monitoring, the main control chip (100) sets the pulse width of the microsecond-level detection signal so that the high-level duration of the microsecond-level detection signal satisfies the requirement that the equivalent parasitic capacitance (400) in the circuit is charged to establish the detection voltage value, and is less than the polarization establishment time threshold of the electrochemical reaction of the liquid medium under the current voltage.

3. The protection method for preventing poor contact caused by metal electrolysis in a spring probe connector according to claim 1, characterized in that, The step of performing electroless polarization suppression monitoring also includes performing charge discharge reset: After the pulse width of the microsecond-level detection signal ends, the main control chip (100) controls the power control port (102) to switch from a high-level output state back to a low-level output state, so that the first pin (201) is grounded and the polarization charge is discharged through the internal pull-down circuit of the power control port (102).

4. The protection method for preventing poor contact caused by metal electrolysis in a spring probe connector according to claim 1, characterized in that, The determination of whether there is a conductive path between the first pin (201) and the second pin (202) includes: The main control chip (100) compares the collected detection voltage value with a preset trigger threshold; When a single comparison result shows that the detected voltage value is greater than the preset trigger threshold, the main control chip (100) starts the verification counter and repeatedly performs sampling and comparison operations within the continuous scanning cycle; The main control chip (100) confirms the existence of the conduction path only when the collected detection voltage value is greater than the preset trigger threshold condition in multiple consecutive sampling results.

5. The protection method for preventing poor contact caused by metal electrolysis in a spring probe connector according to claim 4, characterized in that, The preset trigger threshold is established based on the detection sensitivity verification step: The main control chip (100) is set to a maximum detection impedance threshold; The main control chip (100) calculates the voltage value of the high-level voltage of the power control port (102) after being divided by the maximum detection impedance threshold and the equivalent input pull-down impedance of the analog-to-digital conversion acquisition port (101) according to the principle of resistor voltage division, and stores the voltage value as the preset trigger threshold.

6. The protection method for preventing poor contact caused by metal electrolysis in a spring probe connector according to claim 1, characterized in that, The dynamic voltage divider circuit detection of thermal impedance includes: The main control chip (100) controls the power control port (102) to output a bias voltage, and controls the graphene heating module (203) to operate at a constant temperature according to the preset dehydration temperature; The main control chip (100) constructs a monitoring model, and the real-time voltage value collected by the analog-to-digital conversion acquisition port (101) has a negative correlation with the equivalent resistance of the liquid medium between the first pin (201) and the second pin (202). As the liquid evaporates, the equivalent resistance of the conduction increases, and the real-time voltage value decreases.

7. The protection method for preventing poor contact caused by metal electrolysis in a spring probe connector according to claim 1, characterized in that, The determination of the physical drying time includes: The main control chip (100) compares the real-time voltage value with the preset drying threshold voltage; When the real-time voltage value is continuously lower than the preset drying threshold voltage, it indicates that the liquid bridge is broken and the impedance is in a high-resistance state. The main control chip (100) determines that the physical drying time has been reached.

8. The protection method for preventing poor contact caused by metal electrolysis in a spring probe connector according to claim 1, characterized in that, The post-drying safety maintenance process includes: After determining the physical drying time, the main control chip (100) starts a timer and controls the graphene heating module (203) to maintain the preset safe operating time. During the timing period, the main control chip (100) continuously monitors the real-time voltage value. If the real-time voltage value is detected to rise again, the main control chip (100) resets the timer and restarts the timing. When the timer expires and the real-time voltage value remains stable, the main control chip (100) terminates the heating excitation.

9. The protection method for preventing poor contact caused by metal electrolysis in a spring probe connector according to claim 1, characterized in that, In the cold insulation re-inspection step, the real-time temperature monitoring includes: After the main control chip (100) controls the graphene heating module (203) to stop output, it obtains the real-time temperature of the temperature sensor (204) through the temperature acquisition port (104). The main control chip (100) remains in a waiting state until the real-time temperature drops below or equal to the hysteresis cooling threshold, which is set as the sum of the ambient temperature and a preset temperature difference margin.

10. The protection method for preventing poor contact caused by metal electrolysis in a spring probe connector according to claim 1, characterized in that, In the cold insulation re-inspection step, determining whether the insulation restoration standard is met includes: The main control chip (100) controls the power control port (102) to output a bias voltage and reads the cold retest voltage value through the analog-to-digital conversion acquisition port (101); The main control chip (100) compares the cold-state retest voltage value with the safe reset voltage threshold calculated based on the reset allowable impedance; The insulation restoration standard is confirmed to be met only when the cold retest voltage value is less than or equal to the safety reset voltage threshold.

Images