Control method and state machine of patch taking cycle state machine of patch machine

Abstract

This invention relates to the field of automated control technology for surface mount technology (SMT) equipment, and discloses a control method and state machine for a pick-and-place cycle state machine of a pick-and-place machine. The method includes: selecting the current substrate to be processed and activating the substrate mounting cycle state machine; the substrate mounting cycle state machine, as a sub-state machine of the pick-and-place cycle state machine, selecting the current panel to be processed and activating the panel mounting cycle state machine; the panel mounting cycle state machine, as a sub-state machine of the substrate mounting cycle state machine, selecting the current component task and activating the specific pick-and-place cycle state machine; and the specific pick-and-place cycle state machine, as a sub-state machine of the panel mounting cycle state machine, being used to perform specific component pick-and-place operations for a single component. This scheme constructs a hierarchical nested control scheme for the entire pick-and-place operation process of a pick-and-place machine, achieving clear hierarchy, event-driven operation, unified context, support for flexible switching, and partial recovery capability in the pick-and-place process control.

Description

Technical Field

[0001] This invention relates to the field of automated control technology for surface mount technology equipment, specifically to a control method and state machine for a pick-and-place cycle state machine of a chip mounter. Background Technology

[0002] Pick-and-place machines are the core equipment in surface mount technology (SMT) production lines. Their pick-and-place process typically includes substrate entry and positioning, marking and identification, component feeding, component pickup, vision recognition, placement execution, and cycle propulsion. This process involves multiple execution units such as motion control, vision processing, material feeding coordination, and vacuum detection. It also needs to handle the switching relationships between substrates, panels, and components, making the overall control logic quite complex.

[0003] In existing technologies, the control methods for the sticker removal process mainly include the following categories: (1) Linear process-based control method: The pick-and-place process is organized into several consecutive steps in a fixed order (such as substrate positioning, substrate identification, feeding, picking up, identification, and placement). Each step is executed sequentially. This method is intuitive in structure, but its adaptability to complex process branches and dynamic process switching is limited.

[0004] (2) Control method based on flag bits or conditional branches: In the main process, a large number of flag bits and conditional judgments are used to control different process branches (such as whether to enable early material picking, whether to perform Mark recognition, whether to exchange nozzles, whether the current component has failed to be picked up, etc.). This method can be compatible with different operating scenarios to a certain extent, but as the number of process conditions increases, it is easy to encounter problems such as scattered judgment logic and enhanced coupling between processes.

[0005] (3) Control method based on single-layer state machine: The entire pick-and-place process is incorporated into a single state machine, and the execution of actions and the progress of the process are realized through state switching. This method is conducive to the explicit expression of the process, but when the process involves multiple loop objects such as substrate, panel, and components, as well as multiple abnormal branches, it is easy to cause the number of states to expand and the state transition path to become complicated.

[0006] (4) Combination process based on local action encapsulation: Actions such as feeding, picking, identification, and mounting are encapsulated into reusable execution units, and then coordinated and scheduled by a unified process controller. This method improves the reusability of action modules, but the scheduling logic still needs to handle the nesting relationship and state connection of multi-level tasks, making it difficult to fundamentally solve the problems of multi-level cyclic coupling and exception recovery.

[0007] Overall, while existing pick-and-place process control schemes can complete basic placement operations, they mostly focus on organizing the execution sequence of single actions. They still lack clear, unified, and easily expandable control schemes in areas such as multi-level cyclic task management, the progression relationship between different task levels, local recovery under abnormal conditions, and compatibility with flexible process strategies. Summary of the Invention

[0008] To address the aforementioned technical shortcomings, the present invention aims to provide a control method and state machine for a pick-and-place cycle state machine of a chip mounter.

[0009] To solve the above-mentioned technical problems, the present invention adopts the following technical solution: The first aspect provides a control method for a pick-and-place cycle state machine of a chip mounter, comprising the following processes: After selecting the current substrate to be processed and establishing the current substrate task context, the substrate mounting cycle state machine is activated; the substrate mounting cycle state machine is a sub-state machine of the pick-and-place cycle state machine, used to organize the overall mounting task for a single substrate, so as to cyclically organize the panelization task within the substrate range. The substrate mounting cycle state machine selects the current panel to be processed according to the panel task set in the current substrate task context and activates the panel mounting cycle state machine; the panel mounting cycle state machine is a sub-state machine of the substrate mounting cycle state machine, and is used to organize mounting tasks for the panel units in the current substrate, so as to cyclically organize the component tasks within the current panel range. The panel mounting cycle state machine establishes the current panel task context, selects the current component task according to the component task list in the current panel task context, and activates the specific pick-and-place cycle state machine; the specific pick-and-place cycle state machine is a sub-state machine of the panel mounting cycle state machine, and is used to perform specific component pick-and-place operations for a single component.

[0010] A second aspect of the present invention provides a pick-and-place cycle state machine for, After selecting the current substrate to be processed and establishing the current substrate task context, enable the substrate mounting cycle state machine; The substrate mounting cycle state machine serves as a sub-state machine of the pick-and-place cycle state machine. It is used to organize the overall mounting task for a single substrate to perform cyclic organization of panelization tasks within the substrate range. It is configured to select the current panel to be processed based on the panelization task set in the current substrate task context and enable the panel mounting cycle state machine. The panel mounting cycle state machine serves as a sub-state machine of the substrate mounting cycle state machine. It is used to organize mounting tasks for panel units in the current substrate to cyclically organize component tasks within the current panel range. It is configured to establish a current panel task context, select the current component task according to the component task list in the current panel task context, and enable the specific pick-and-place cycle state machine. The specific pick-and-place cycle state machine serves as a sub-state machine of the panel mounting cycle state machine, and is used to perform specific component pick-and-place operations for individual components.

[0011] The beneficial effects of this invention are as follows: By constructing a hierarchical nested control scheme for the entire pick-and-place operation of a chip mounter through the above technical solution, the pick-and-place process is transformed from the traditional linear serial control method or single-layer state control method into a hierarchical organization and unified scheduling cyclic control system. This achieves a pick-and-place process control with clear hierarchy, event-driven, context-unified, flexible switching support and local recovery capability, so as to meet the control needs of modern chip mounters under complex process conditions and flexible production modes. Attached Figure Description

[0012] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0013] Figure 1 This is a schematic diagram of the control flow of the cyclic state machine for taking and attaching objects according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the control flow of the substrate mounting cycle state machine according to an embodiment of the present invention; Figure 3 This is a schematic diagram of the control flow of the panel mounting cycle state machine according to an embodiment of the present invention; Figure 4 This is a schematic diagram of the control flow of the specific picking and pasting cycle state machine in an embodiment of the present invention. Detailed Implementation

[0014] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0015] This invention provides a control method for a pick-and-place cycle state machine of a chip mounter, comprising the following processes: After selecting the current substrate to be processed and establishing the current substrate task context, enable the substrate mounting cycle state machine; The pick-and-place cycle state machine is the core control module, used to manage the complete pick-and-place process of the pick-and-place machine from waiting for production, identification, picking up, to placement. It is the sole state control core in the entire pick-and-place control logic. For example... Figure 1 As shown, the pick-and-place cycle state machine mainly includes the following mutually exclusive states: production not started, waiting for production, material rejection / special return (initialization phase), material rejection / special return, return to standby position, reference post identification, substrate mark identification, panel mark identification, nozzle exchange, pick-up, placement, substrate mark identification (early pick-up), panel mark identification (early pick-up), placement list update, and panel number update. The transitions between states are event-driven and are protected by the device state, task state, and configuration parameters in the shared context. During actual operation, the pick-and-place cycle state machine selects the target state from multiple states based on the current task level, configuration strategy, and action feedback results. For example, when configuration parameters indicate that substrate mark identification or panel mark identification needs to be performed, the state machine can enter the corresponding identification state; when the early pick-up strategy is enabled, the state machine can enter the substrate mark identification (early pick-up) or panel mark identification (early pick-up) state path; when an action fails, the state machine can enter the material rejection / special return, return to standby position, or other recovery-related states according to the exception handling strategy.

[0016] The substrate mounting state machine, panel mounting state machine, and specific pick-and-place state machine exist as internal task organization units. Unlike the traditional approach of designing separate state machines for each layer of substrate, panel, and component, this invention uses only one pick-and-place cycle state machine for unified management of process action states. The specific substrate, panel, or component being processed is selected and advanced by the internal state machines at each level based on the task data structure. This implementation reduces the state explosion problem caused by nested state machines while retaining the controllability and scalability required for complex processes.

[0017] The substrate mounting cycle state machine selects the current panel to be processed based on the panelization task set in the current substrate task context and activates the panelization mounting cycle state machine. The substrate mounting cycle state machine, as a sub-state machine of the pick-and-place cycle state machine, is used to organize the overall mounting task for a single substrate, thereby cyclically organizing the panelization tasks within the substrate area. Figure 2 As shown; Furthermore, when the substrate mounting cycle state machine enters a state that allows substrate-level processing, the internal action logic of the state machine selects the current substrate to be processed from the task data structure, and resets and updates the substrate task context before each substrate begins mounting. The substrate mounting cycle state machine cyclically organizes the panelization tasks within the substrate range, such as... Figure 2 As shown, the process is as follows: Based on the current substrate task context, it is determined whether the current substrate to be processed needs to perform a preparation action. If so, the relevant data of the preparation action is written into the current substrate task context, and the pick-and-place cycle state machine is triggered to switch to the corresponding state to complete the preparation action. After that, the substrate mounting cycle state machine writes the result of the completed preparation action back into the current substrate task context, and then performs the panelization task cycle organization. The current substrate task context includes: the current substrate number, the number of panels contained in the current substrate, the current substrate identification status, the current substrate completion status, the current substrate abnormal status, or the panelization task information corresponding to the current substrate. For example, when the configuration parameters indicate that substrate mark recognition is required, and the current substrate has not yet been recognized, the substrate mounting cycle state machine does not directly perform recognition. Instead, it writes the "current substrate to be recognized" information into the shared context and triggers the pick-up cycle state machine to switch to the "substrate mark recognition" or "substrate mark recognition (early pick-up)" state. After the recognition is completed and the recognition result is written back to the shared context, the substrate mounting state machine continues to execute the subsequent panelization task group.

[0018] Based on the panelization task set corresponding to the current substrate to be processed, the current panel to be processed is selected according to the preset panelization order, priority rules or process rules, and the panelization mounting cycle state machine is activated for processing; wherein, whenever a panelization mounting cycle state machine completes a task, the substrate mounting cycle state machine updates the current panelization state according to the return result, and determines whether there are still incomplete panels in the current substrate, whether there are abnormal panels that need to be skipped, or whether the current substrate has been fully mounted; After all panel mounting tasks within the current substrate are completed, update the current substrate completion flag, and / or update the mounting results and error history of the current substrate, and determine whether there are any remaining substrates to be processed based on the mounting results. If it exists, proceed to the next substrate task; if there are no remaining substrate tasks in the current batch, return the "substrate cycle ended" result so that the substrate pick-and-place cycle state machine switches to the standby position, waiting for production or the end state.

[0019] For anomaly handling, the substrate mounting state machine primarily addresses anomalies that affect the continued production of the entire substrate. For example, when anomalies occur such as substrate marking and identification failure, substrate positioning anomaly, invalid current substrate data, or all panels under the current substrate being unexecutable, the substrate mounting state machine can terminate the current substrate, mark the current substrate as abnormally completed, skip the current substrate and record the anomaly, or report the anomaly to the pick-and-place cycle state machine, which will then enter a unified anomaly handling path.

[0020] The panel mounting cycle state machine establishes the current panel task context, selects the current component task according to the component task list in the current panel task context, and enables the specific pick-and-place cycle state machine. Furthermore, the panel mounting cycle state machine cyclically organizes the component tasks within the current panel range, such as... Figure 3 As shown, the process is as follows: The panel mounting cycle state machine determines whether the current panel needs to perform a preparation action based on the current panel task context. If so, it writes the relevant data of the preparation action into the current panel task context and triggers the pick-and-place cycle state machine to switch to the corresponding state to complete the preparation action. After that, the panel mounting cycle state machine writes the result of completing the preparation action back into the current panel task context, updates the compensation data of the current panel, and then performs component task cycle organization. For example, when configuration parameters require panel mark recognition to be performed, and the current panel recognition has not yet been completed, the panel placement state machine writes the "current panel to be recognized" information into the shared context and drives the pick-and-place cycle state machine to switch to the "panel mark recognition" or "panel mark recognition (early pick-up)" state. After the recognition result is returned and written into the context, the state machine updates the compensation data of the current panel accordingly, and then enters the component task organization stage. The current panel task context includes: the current panel number, the position index of the current panel in the substrate, the current panel recognition status, the current panel completion status, the current panel abnormal status, or the component set corresponding to the current panel.

[0021] According to the component task list, the current component task is selected in a predetermined order, path optimization strategy, or priority rule, and the specific pick-and-place cycle state machine is activated to perform feeding, picking, identification, placement, and result processing; wherein, whenever a specific pick-and-place cycle state machine completes a task, the panel placement cycle state machine updates the component status according to the execution result, and determines whether there are still unplaced components in the current panel, whether the current component abnormality has been partially handled, whether it is necessary to switch to the next component, or whether the current panel has been completely completed; After all component placement tasks under the current panel are completed, update the current panel completion flag and return the result to the substrate placement cycle state machine. If the current panel cannot continue due to a local anomaly, the strategy will be executed to skip the current panel, mark the current panel as abnormally completed, or report the anomaly to the substrate mounting cycle state machine.

[0022] For exception handling, the panel mounting state machine mainly addresses exceptions that affect the continued execution of the current panel, such as panel mark recognition failure, multiple consecutive component placement failures within the current panel, and the failure to meet local panel conditions for continued execution. For such exceptions, the panel mounting state machine can terminate the current panel, skip the current panel, mark the current panel as abnormally completed, or report the exception result to the substrate mounting state machine.

[0023] The specific pick-and-place cycle state machine, as a sub-state machine of the panelization and placement cycle state machine, is used to perform specific component pick-and-place operations for individual components. When the panelization and placement state machine selects a component as the current object to be processed based on the component task list within the current panel, the specific pick-and-place state machine first establishes the current component task context. The current component task context includes: current component number, component type, package attributes, material source, corresponding material feeding station, target placement coordinates, target placement angle, required nozzle model, identification strategy, placement process parameters, current execution stage, current identification status, current placement status, and current abnormal status, etc.

[0024] Furthermore, such as Figure 4 As shown, the specific component pick-and-place cycle state machine performs the specific component pick-and-place operation, and the process is as follows: S1. Component Placement Path Initialization Phase: After selecting a component, the specific pick-up state machine reads the component's feeding method, nozzle requirements, recognition strategy, and placement parameters. Combined with the current placement head status, nozzle type, feeder availability, vision system status, and substrate and panel compensation information, it determines the initial processing path for the current component. If the current component is marked as non-executable, skipped, completed, or does not meet conditions in the current component task context, the corresponding result is directly written and the process returns to the panel placement state machine, without entering the complete pick-up process. This initialization phase can promptly filter out components that do not meet processing conditions, reducing invalid state transitions.

[0025] S2, Nozzle Matching and Resource Judgment Phase: The specific pick-up state machine determines whether the nozzle of the current placement head matches the component requirements based on the component type, size, and placement requirements. It further determines the availability of the vacuum system, placement head, and related execution units. If the nozzle does not match, the state machine does not directly perform a nozzle replacement. Instead, it writes a nozzle exchange request and the target nozzle model into the current component task context, and the pick-up cycle state machine switches to the nozzle exchange state for processing. After the nozzle exchange is completed, the state machine writes the exchange result back to the shared context, and the specific pick-up state machine resumes current component processing accordingly. This achieves the separation of component task organization and equipment action execution.

[0026] S3. Feeding Preparation and Pickup Stage: After the nozzle type meets the requirements, the specific pickup state machine confirms the status of the feeder or tray based on the component supply source, determining whether feeding is complete, the pickup position is valid, and the placement head is ready for pickup. When the conditions are met, the specific pickup state machine writes the pickup object, pickup coordinates, pickup parameters, and adsorption confirmation flag into the current component task context, and the pickup cycle state machine switches to the pickup state. After the pickup action is completed, the underlying execution module generates a pickup success or failure result based on the vacuum detection result, position feedback result, and action completion feedback, and writes it back to the current component task context. If pickup fails, the specific pickup state machine first performs a retry count check at the component level; if the set limit is not exceeded, it allows re-entering the feeding confirmation and pickup path; only when the retry is ineffective or the current component is determined to be unpickable will it switch to discarding, special return, skipping the current component, or reporting to the next higher-level processing path. This mechanism can prevent the process from being interrupted directly due to a single pickup failure.

[0027] S4. Identification, Judgment, and Compensation Calculation Stage: For components that have been picked up, the specific pick-up and placement state machine reads the visual recognition results, performs posture validity judgment, and calculates placement compensation. The specific pick-up and placement state machine integrates the recognition results with the current substrate compensation data, panel compensation data, and the component's placement process parameters to generate the final placement coordinate compensation value and angle compensation value, which is then written into the current component task context as the direct basis for the pick-up and placement cycle state machine to enter the placement state. If the recognition result is invalid or does not meet the preset quality threshold, the specific pick-up and placement state machine selects recognition retry, rejection, special return, skipping the current component, or abnormal reporting according to the process strategy. Unlike the traditional approach that uses the recognition result only as feedback for a single action, this solution uses the recognition result directly as the basis for determining the state machine path branch, enabling the component-level state machine to dynamically process around the current component.

[0028] S5. Placement Execution and Result Confirmation Phase: After the placement compensation value is calculated and the placement conditions are met, the specific pick-and-place state machine writes the placement target, compensation parameters, and placement execution request to the current component task context. The pick-and-place loop state machine then switches to the placement state, driving the placement head to move the component to the target position for placement. After placement, the underlying execution module writes the placement completion, failure, or exception result back to the current component task context. The specific pick-and-place state machine confirms the completion of the current component based on the result: if placement is successful, it updates the component completion flag, completion time, result code, and related statistical information; if placement fails, it decides according to the preset placement strategy whether to re-place, whether to perform a discard or special return, whether to skip the current component directly, or to escalate the exception to the panel placement state machine.

[0029] S6. Placement Result Return and Loop Exit Stage: If the component is successfully placed, the specific pick-up state machine updates the completion flag of the component in the task data structure and can trigger the "Pick-up State Machine Update Successful" event to advance the subsequent component tasks in the current panel; if the placement or recognition fails, the strategy will be executed to discard the component, return it specially, skip the current component, or report an error.

[0030] To address the issues of numerous anomalies and wide-ranging impacts in the pick-and-place machine's pick-and-place cycle, and the fact that traditional solutions often involve complete process interruption, another embodiment of this invention provides an anomaly handling and recovery method for the pick-and-place machine's pick-and-place cycle state machine, comprising: Specific pick-and-place state machine-level exception handling: When an exception only affects the processing of the current component, recovery is prioritized within the specific pick-and-place state machine. For example, for situations such as pick-up failure, identification failure, placement failure, unavailable current component, or timeout, operations such as retry, discard, special return, skipping the current component, recording the exception result, and handling it according to a preset strategy can be performed. After processing is complete, the placement of subsequent components in the current panel can continue based on the result.

[0031] (2) Panelization state machine level exception handling: When an exception affects the tasks of multiple components in the current panel, or when the current panel can no longer be properly mounted, the panelization state machine will handle the exception. For example, it can terminate the current panel task, mark the current panel as abnormal, skip the panel and switch to the next panel.

[0032] (3) Substrate mounting state machine level anomaly handling: When an anomaly has affected the mounting conditions of the entire substrate, it is handled by the substrate mounting state machine. For example, when there is an anomaly in substrate positioning, substrate identification failure, or the current substrate conditions no longer meet production requirements, the current substrate task can be terminated, the current substrate can be marked as an anomaly, or the current substrate can be skipped.

[0033] (4) Abnormal handling of the picking and pasting cycle state machine: When a serious equipment error, emergency stop, power interruption or unavailability of key execution unit occurs, the picking and pasting cycle state machine will uniformly execute abnormal termination, stop the subsequent state advancement, and enter the waiting state or standby position recovery state, while waiting for manual intervention or recovery command.

[0034] This invention establishes an anomaly handling and recovery mechanism corresponding to a hierarchical nested state machine structure. This mechanism follows the principle of "prioritizing handling within the least impact level, and escalating to the next level only when recovery is impossible," providing tiered responses to anomalies at different levels. Through this hierarchical anomaly handling and recovery mechanism, anomalies can be handled first within the minimum impact range, only escalating to the next level for processing when recovery is impossible at the current level. This avoids local anomalies directly causing interruptions to the entire panel or substrate process, improving the continuous operation capability and system stability of the mounting process.

[0035] Based on the same inventive concept, a second aspect of the present invention provides a pick-and-place cycle state machine for a chip mounter, used for... After selecting the current substrate to be processed and establishing the current substrate task context, enable the substrate mounting cycle state machine; The substrate mounting cycle state machine serves as a sub-state machine of the pick-and-place cycle state machine. It is used to organize the overall mounting task for a single substrate to perform cyclic organization of panelization tasks within the substrate range. It is configured to select the current panel to be processed based on the panelization task set in the current substrate task context and enable the panel mounting cycle state machine. The panel mounting cycle state machine serves as a sub-state machine of the substrate mounting cycle state machine. It is used to organize mounting tasks for panel units in the current substrate to cyclically organize component tasks within the current panel range. It is configured to establish a current panel task context, select the current component task according to the component task list in the current panel task context, and enable the specific pick-and-place cycle state machine. The specific pick-and-place cycle state machine serves as a sub-state machine of the panel mounting cycle state machine, and is used to perform specific component pick-and-place operations for individual components.

[0036] The technical solution of the present invention has the following beneficial effects: (1) It provides a hierarchical control system for a complete pick-and-place cycle: the pick-and-place process of the pick-and-place machine is divided into different cycle control layers according to the task object and execution level, so that each level undertakes the task organization and cycle advancement within the corresponding range, thereby solving the problem of complex process and unclear structure caused by the mixing of multiple layers of logic in the prior art. (2) It provides a nested cycle organization method suitable for multi-panel and multi-component scenarios: it enables the pick-and-place machine to advance the pick-and-place cycle in an orderly manner around the hierarchical relationship of "substrate-panel-component", thereby solving the problem of difficult process maintenance caused by the reliance on a large number of flag bits and condition branches in multi-panel and batch placement scenarios in the prior art. (3) It provides a unified state transition and process advancement mechanism: the state switching and event triggering mechanism enables the execution of various actions, state switching and task advancement in the pick-and-place process to be coordinated under a unified control framework, thereby solving the problems of scattered state switching, inconsistent condition judgment and insufficient reliability of process connection in the prior art. (4) Provide a pick-and-place cycle control scheme that supports flexible process strategies: enabling the system to be compatible with various process actions and strategy switching such as substrate marking recognition, panel marking recognition, nozzle exchange, feeding, picking, component recognition, placement, discarding, special return and early picking, thereby improving the process adaptability and control flexibility in complex production scenarios. (5) Provide a control mechanism with layered anomaly handling and recovery capabilities: enabling the system to take corresponding handling measures for different task levels and different types of anomalies, thereby improving the continuous operation capability and system stability of the pick-and-place process.

[0037] In summary, the above technical solutions construct a hierarchical nested control scheme for the entire pick-and-place process of a chip mounter. This transforms the pick-and-place process from the traditional linear serial control or single-layer state control to a hierarchical, unified, and cyclical control system. This achieves a pick-and-place process control that is hierarchical, event-driven, context-consistent, supports flexible switching, and has local recovery capabilities, thus meeting the control requirements of modern chip mounters under complex process conditions and flexible production modes.

[0038] The above description is merely an example and illustration of the concept of the present invention. Those skilled in the art can make various modifications or additions to the specific embodiments described or use similar methods to replace them, as long as they do not deviate from the concept of the invention or exceed the scope defined in this specification, they should all fall within the protection scope of the present invention.

Claims

1. A control method of a pick-up cycle state machine of a chip mounter, characterized by, Includes the following processes: After selecting the current substrate to be processed and establishing the current substrate task context, the substrate mounting cycle state machine is activated; the substrate mounting cycle state machine is a sub-state machine of the pick-and-place cycle state machine, used to organize the overall mounting task for a single substrate, so as to cyclically organize the panelization task within the substrate range. The substrate mounting cycle state machine selects the current panel to be processed according to the panel task set in the current substrate task context and activates the panel mounting cycle state machine; the panel mounting cycle state machine is a sub-state machine of the substrate mounting cycle state machine, and is used to organize mounting tasks for the panel units in the current substrate, so as to cyclically organize the component tasks within the current panel range. The panel mounting cycle state machine establishes the current panel task context, selects the current component task according to the component task list in the current panel task context, and activates the specific pick-and-place cycle state machine; the specific pick-and-place cycle state machine is a sub-state machine of the panel mounting cycle state machine, and is used to perform specific component pick-and-place operations for a single component.

2. The method of claim 1, wherein, The substrate mounting cycle machine cyclically organizes the panelization tasks within the substrate area, as follows: Based on the panelization task set corresponding to the current substrate to be processed, the current panel to be processed is selected according to the preset panelization order or rules, and the panelization mounting cycle state machine is activated for processing; wherein, whenever a panelization mounting cycle state machine completes a task, the substrate mounting cycle state machine updates the current panelization state according to the return result, and determines whether there are still incomplete panels in the current substrate, whether there are abnormal panels that need to be skipped, or whether the current substrate has been fully mounted; After all panel mounting tasks within the current substrate are completed, update the current substrate completion flag, and / or update the mounting results and error history of the current substrate, and determine whether there are any remaining substrates to be processed based on the mounting results. If it exists, proceed to the next substrate task; if there are no remaining substrate tasks in the current batch, return the "substrate cycle ended" result so that the substrate pick-and-place cycle state machine switches to the standby position, waiting for production or the end state.

3. The method of claim 2, wherein, The method further includes: The substrate mounting cycle state machine determines whether the substrate to be processed needs to perform a preparation action based on the current substrate task context. If so, it writes the relevant data of the preparation action into the current substrate task context and triggers the pick-and-place cycle state machine to switch to the corresponding state to complete the preparation action. After that, the substrate mounting cycle state machine writes the result of the completed preparation action back into the current substrate task context and then performs the panelization task cycle organization. The current substrate task context includes: the current substrate number, the number of panels contained in the current substrate, the current substrate identification status, the current substrate completion status, the current substrate abnormal status, or the panelization task information corresponding to the current substrate.

4. The method of claim 1, wherein, The panel mounting cycle state machine cyclically organizes the component tasks within the current panel range, as follows: According to the component task list, the current component task is selected in a predetermined order or according to the rules, and the specific pick-and-place cycle state machine is activated; wherein, whenever the specific pick-and-place cycle state machine completes a task, the panel mounting cycle state machine updates the component status according to the execution result, and determines whether there are still unmounted components in the current panel, whether the current component abnormality has been partially handled, whether it is necessary to switch to the next component, or whether the current panel has been completely completed. After all component placement tasks under the current panel are completed, update the current panel completion flag and return the result to the substrate placement cycle state machine. If the current panel cannot continue due to a local anomaly, the strategy will be executed to skip the current panel, mark the current panel as abnormally completed, or report the anomaly to the substrate mounting cycle state machine.

5. The method of claim 4, wherein, The method further includes: The panel mounting cycle state machine determines whether the current panel needs to perform a preparation action based on the current panel task context. If so, it writes the relevant data for the preparation action into the current panel task context and triggers the pick-and-place cycle state machine to switch to the corresponding state to complete the preparation action. Afterward, the panel mounting cycle state machine writes the result of completing the preparation action back into the current panel task context, updates the compensation data of the current panel, and then performs component task cycle organization. The current panel task context includes: the current panel number, the position index of the current panel in the substrate, the current panel identification status, the current panel completion status, the current panel abnormal status, or the component set corresponding to the current panel.

6. The method of claim 1, wherein, The specific component pick-and-place cycle state machine performs the specific component pick-and-place operation, and the process is as follows: After the current component is selected in the panel mounting cycle state machine, the current component task context is established and the picking path of the current component is determined. For components that do not meet the picking conditions, there is no need to enter the complete picking process. The corresponding result is written in the current component task context and the task returns to the panel mounting cycle state machine. Determine whether the nozzle of the current placement head matches the current component requirements; If a match is found, the feeder, tray, and placement head status are determined based on the component supply source to determine whether the pick-up conditions are met. If they are met, relevant pick-up data is written into the current component task context to trigger the pick-up cycle state machine to switch to the pick-up state. Read the visual recognition results of the completed component picking, perform posture validity judgment and placement compensation calculation to meet the placement conditions; Write the current placement target, compensation parameters, and placement execution request into the current component task context to trigger the pick-and-place loop state machine to switch to the placement state; After a component is successfully mounted, the completion flag of the corresponding component in the task data structure is updated to trigger a successful update event of the mounting state machine, thus advancing the task of subsequent components in the current panel.

7. The method according to claim 6, characterized in that, The process involves determining whether the nozzle of the current placement head matches the requirements of the current component. If they do not match, a nozzle exchange request is written into the current component task context to trigger the pick-and-place cycle state machine to switch to the nozzle exchange state. After the pick-and-place cycle state machine completes the nozzle exchange and writes the result into the current component task context, the specific pick-and-place cycle state machine resumes current component processing based on the written result.

8. The method according to claim 6, characterized in that, After switching to the pick-up state and completing the pick-up, the execution device returns the pick-up result and writes it into the current component task context. The specific pick-up cycle state machine judges based on the pick-up result. If the pick-up fails, the specific pick-up cycle state machine first performs a retry count judgment at the component level. When the retry count does not exceed the set upper limit, it is allowed to re-enter the material supply confirmation and pick-up path. Only when the retry is invalid or it is determined that the current component cannot continue to be picked up, it will switch to any one of the following: material rejection, special return, skipping the current component, or reporting to the previous level pick-up path.

9. The method according to claim 6, characterized in that, If the visual recognition result is invalid or does not meet the preset quality threshold, then according to the process strategy, any one of the following can be selected: recognition retry, material rejection, special return, skipping the current component, or abnormal reporting.

10. The method according to claim 6, characterized in that, After switching to the placement state and completing the placement, the execution device returns the placement result and writes it into the current component task context. The specific placement cycle state machine confirms the completion of the current component based on the placement result: if the placement is successful, the corresponding component completion flag, completion time, result code, and related statistical information are updated; if the placement fails, a preset placement strategy is used to determine whether to allow re-placement, whether to perform material rejection or special return, whether to skip the current component directly, or whether to escalate the exception to the panel placement cycle state machine.

11. The method according to any one of claims 1-10, characterized in that, When an exception occurs during the sticker retrieval cycle When the anomaly only affects the processing of the current component, the specific pick-and-place cycle state machine is activated to handle the situation according to the preset strategy, and the subsequent components in the current panel are placed according to the processing result after the processing is completed. When an anomaly affects the tasks of multiple components within the current panel or the current panel can no longer be properly mounted, the panel mounting cycle state machine is activated to handle the situation according to a preset strategy. When an anomaly has affected the mounting conditions of the entire substrate, the substrate mounting cycle state machine is activated to handle the situation according to a preset strategy. When an anomaly occurs, such as a serious equipment error, emergency stop, power outage, or unavailability of a critical execution unit, the pick-and-place cycle state machine will uniformly terminate the anomaly, stop the subsequent state progression, and transition to a waiting state or a standby position recovery state.

12. A pick-and-place cycle state machine for a chip mounter, characterized in that, For, After selecting the current substrate to be processed and establishing the current substrate task context, enable the substrate mounting cycle state machine; The substrate mounting cycle state machine serves as a sub-state machine of the pick-and-place cycle state machine. It is used to organize the overall mounting task for a single substrate to perform cyclic organization of panelization tasks within the substrate range. It is configured to select the current panel to be processed based on the panelization task set in the current substrate task context and enable the panel mounting cycle state machine. The panel mounting cycle state machine serves as a sub-state machine of the substrate mounting cycle state machine. It is used to organize mounting tasks for the panel units in the current substrate to cyclically organize the component tasks within the current panel range. It is configured to establish a current panel task context, select the current component task according to the component task list in the current panel task context, and enable the specific pick-and-place cycle state machine. The specific pick-and-place cycle state machine serves as a sub-state machine of the panel mounting cycle state machine, and is used to perform specific component pick-and-place operations for individual components.

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