Quality determination method and substrate production system
The quality determination method and system address solder ball insufficiency by implementing a comprehensive process to detect and correct deficiencies, ensuring efficient solder ball supply and enhancing circuit board production quality.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- FUJI CORP
- Filing Date
- 2025-02-04
- Publication Date
- 2026-06-18
Smart Images
Figure 0007876014000001 
Figure 0007876014000002 
Figure 0007876014000003
Abstract
Description
【Technical Field】 【0001】 This specification discloses techniques related to a pass / fail determination method and a substrate production system. 【Background Art】 【0002】 The solder ball mounter described in Patent Document 1 uses a tape structure in which a plurality of first solder balls are formed on one main surface side of an insulating tape and a plurality of second solder balls electrically connected to the first solder balls respectively are formed on the other main surface side. The tape structure is mounted on a plurality of electrode pads of an insulating substrate for each tape structure, and image processing for inspecting the mounted state is performed after the tape structure is mounted. Thus, the invention described in Patent Document 1 attempts to reduce defective mounting of solder balls. 【Prior Art Documents】 【Patent Documents】 【0003】 【Patent Document 1】 Japanese Patent Application Laid-Open No. 2001-110933 【Summary of the Invention】 【Problems to be Solved by the Invention】 【0004】 There is a possibility that the solder balls in the group of solder balls held by the suction nozzle are insufficient. 【0005】 In view of such circumstances, this specification discloses a pass / fail determination method and a substrate production system capable of dealing with the insufficiency of the solder balls in the group of solder balls held by the suction nozzle. 【Means for Solving the Problems】 【0006】 This specification discloses a method for determining whether a component is good or bad, comprising a supply step, an adsorption step, an imaging step, a determination step, and a supplementation step. The supply step supplies a group of solder balls, which are arranged to match the electrode positions of a component, to a target area, which is at least a part of the mounting area of a component to be mounted on a substrate. The adsorption step adsorbs and holds the group of solder balls supplied in the supply step using an adsorption nozzle. The imaging step images the group of solder balls held by the adsorption nozzle. The determination step determines whether the group of solder balls is good or bad before being supplied to the target area based on the image data of the group of solder balls acquired in the imaging step. The supplementation step supplies the missing solder balls to the target area when the determination step determines that the group of solder balls is defective due to a shortage of solder balls. 【0007】 This specification also discloses a substrate production system including a component mounting machine for mounting components onto a substrate to produce a substrate product, and a management device for managing the production of the substrate product. The substrate production system comprises a supply device, a suction nozzle, a component camera, a determination unit, and a supplementation unit. The supply device supplies a group of solder balls, which are arranged to match the electrode positions of the components, to a target area that is at least a part of the mounting area of the components to be mounted on the substrate. The suction nozzle adsorbs and holds the group of solder balls supplied by the supply device. The component camera images the group of solder balls held by the suction nozzle. The determination unit determines the quality of the group of solder balls before supplying them to the target area based on the image data of the group of solder balls acquired by the component camera. The supplementation unit supplies the missing solder balls to the target area when the determination unit determines that the group of solder balls is defective due to a shortage of solder balls. [Effects of the Invention] 【0008】 According to the above quality determination method, when it is determined that there is a shortage of solder balls in the group of solder balls held by the suction nozzle, the missing solder balls can be supplied to the target area. The above-mentioned quality determination method also applies to the circuit board production system. [Brief explanation of the drawing] 【0009】 [Figure 1] This is a plan view showing an example configuration of a parts mounting machine. [Figure 2] This is a plan view showing an example of the configuration of a supply unit. [Figure 3] This is a block diagram showing an example of a control block for a pass / fail judgment device. [Figure 4] This flowchart shows an example of a control procedure using a pass / fail judgment device. [Figure 5] This is a schematic diagram showing an example of image data of a group of solder balls. [Figure 6] This is a side view showing an example configuration of the first imaging device. [Figure 7] This is a side view showing an example configuration of the third imaging device. [Modes for carrying out the invention] 【0010】 1. Embodiment 1-1. Example configuration of component mounting machine 10 The quality determination device 50 is applied to the component mounting machine 10. The component mounting machine 10 mounts a plurality of mounting components 92, including component 91, onto the substrate 90. Component 91 is mounted to the substrate 90 via solder balls 80. As shown in Figure 1, the component mounting machine 10 includes a substrate transport device 11, a supply device 12, a transfer device 13, a component camera 14, a substrate camera 15, and a control device 16. 【0011】 The substrate transport device 11 is composed of, for example, a belt conveyor and transports the substrate 90 in the transport direction (X-axis direction). The substrate 90 is a circuit board on which various circuits such as electronic circuits, electrical circuits, and magnetic circuits are formed. The substrate transport device 11 carries the substrate 90 into the component mounting machine 10, positions the substrate 90 at a predetermined position inside the machine, and clamps it. After the component mounting machine 10 has finished mounting the components 92, the substrate transport device 11 unclams the substrate 90 and transports the substrate 90 out of the component mounting machine 10. 【0012】 The supply device 12 supplies the mounting components 92. The supply device 12 may be equipped with a feeder 12a provided along the transport direction (X-axis direction) of the substrate 90. The feeder 12a feeds a carrier tape containing multiple chip components in a pitch manner, supplying the chip components in a pickable manner at the supply position located on the leading edge of the feeder 12a. The supply device 12 can also supply components 91 that are relatively larger than chip components (for example, components of a BGA (Ball Grid Array)) on a pallet 30. The feeder 12a and the pallet 30 are provided in the supply device 12 in a detachable (replaceable) manner. 【0013】 The supply device 12 can also supply a group of solder balls 80g using a pallet 30. Multiple supply units 70 (six in Figure 1) are arranged on the pallet 30. As shown in Figures 1 and 2, each of the multiple (six) supply units 70 is loaded with a group of solder balls 80g. The group of solder balls 80g is a plurality of solder balls 80 supplied to a target area TA0, which is at least a part of the mounting area MA0 of a component 91 mounted on a substrate 90, and is arranged in accordance with the electrode positions of the component 91. 【0014】 Specifically, the supply unit 70 includes a plate-shaped base member 71 on which a group of solder balls 80g can be mounted. The base member 71 has multiple holes formed in it to match the electrode positions of the component 91. The size of each of the multiple holes is slightly smaller than the size of the solder ball 80, so that one solder ball 80 can be mounted in each hole. Also, as shown in Figure 1, the target region TA0 may be the entire mounting region MA0 of the component 91. The target region TA0 may be at least one of the divided regions obtained by dividing the mounting region MA0 into multiple (for example, four) regions. 【0015】 The pallet 30 is moved, for example, by a drive unit 41 in the Y-axis direction (a direction perpendicular to the X-axis direction in the horizontal plane). The drive unit 41 pulls out a pallet 30 to be used in the production of a substrate product from among the multiple pallets 30 stored in the storage unit 40, moves the pallet 30 in the Y-axis direction, and loads it into the supply unit 12. The drive unit 41 can also move used pallets 30 used in the production of substrate products in the Y-axis direction and retrieve them from the supply unit 12 to the storage unit 40. 【0016】 The transfer device 13 comprises a head drive device 13a and a mobile table 13b. The head drive device 13a is configured to move the mobile table 13b in the X-axis and Y-axis directions by a linear motion mechanism. A mounting head 20 is detachably (replaceable) attached to the mobile table 13b by a clamping member. The mounting head 20 uses at least one suction nozzle 21 to suction and hold the mounting components 92 supplied by the supply device 12, and mounts the mounting components 92 onto the substrate 90 positioned by the substrate transport device 11. 【0017】 The component camera 14 and the substrate camera 15 can use known imaging devices. The component camera 14 is fixed to the base of the component mounting machine 10 such that the optical axis is upward in the vertical direction (Z-axis direction orthogonal to the X-axis and Y-axis directions). The component camera 14 can image the mounted component 92 held by the suction nozzle 21 from below. The substrate camera 15 is provided on the moving table 13b of the transfer device 13 such that the optical axis is downward in the vertical direction (Z-axis direction). The substrate camera 15 can image the substrate 90 from above. 【0018】 The component camera 14 and the substrate camera 15 perform imaging based on control signals sent from the control device 16. The image data of the images captured by the component camera 14 and the substrate camera 15 is transmitted to the control device 16. The control device 16 includes a known arithmetic device and a storage device, and a control circuit is configured. Information output from various sensors provided in the component mounting machine 10, image data, etc. are input to the control device 16. The control device 16 sends control signals to each device based on a control program and predetermined mounting conditions set in advance. 【0019】 For example, the control device 16 causes the substrate camera 15 to image the substrate 90 positioned by the substrate transfer device 11. The control device 16 performs image processing on the image captured by the substrate camera 15 to recognize the positioning state of the substrate 90. Also, the control device 16 causes the suction nozzle 21 to adsorb and hold the mounted component 92 supplied by the supply device 12, and causes the component camera 14 to image the mounted component 92 held by the suction nozzle 21. The control device 16 performs image processing on the image captured by the component camera 14 to recognize the holding posture of the mounted component 92. 【0020】 The control device 16 moves the suction nozzle 21 upwards towards the planned mounting position, which is predetermined by a control program or the like. The control device 16 also corrects the planned mounting position based on the positioning state of the substrate 90, the holding posture of the mounting component 92, etc., to set the actual mounting position for mounting the component 92. The planned mounting position and the mounting position include rotation angles in addition to position (X-axis coordinates and Y-axis coordinates). 【0021】 The control device 16 corrects the target position (X-axis coordinates and Y-axis coordinates) and rotation angle of the suction nozzle 21 to match the mounting position. The control device 16 lowers the suction nozzle 21 at the corrected target position and corrected rotation angle to mount the mounting component 92 onto the substrate 90. The control device 16 repeats the above pick-and-place cycle to perform a mounting process in which multiple mounting components 92 are mounted onto the substrate 90. 【0022】 The same applies to the object TS0 as described above regarding the mounting component 92. Specifically, the suction nozzle 21 adsorbs and holds the object TS0, which is the supply unit 70 or the group of solder balls 80g mounted on the supply unit 70, and supplies it to the target area TA0 of the substrate 90. The suction nozzle 21 is moved by the mounting head 20, just as in the case of the mounting component 92. 【0023】 When the suction nozzle 21 adsorbs the supply unit 70 (object TS0 is the supply unit 70), the suction nozzle 21 adsorbs the base member 71. The base member 71 is made of an insulating material so that the multiple solder balls 80 contained in the solder ball group 80g are electrically insulated. Furthermore, when the suction nozzle 21 adsorbs the solder ball group 80g mounted on the supply unit 70 (object TS0 is the solder ball group 80g), the suction nozzle 21 has multiple holes formed in it to match the electrode positions of the component 91. The size of each of the multiple holes is formed to be slightly smaller than the size of the solder ball 80, so that one solder ball 80 can be adsorbed into each hole. 【0024】 1-2. Example of the configuration of the pass / fail judgment device 50 As previously described, the component mounting machine 10 may be equipped with a pallet 30. The pallet 30 has a supply unit 70 on which a group of solder balls 80g, which are positioned according to the electrode positions of the component 91, are mounted. The suction nozzle 21 picks up and holds the target object TS0 and supplies it to the target area TA0 of the substrate 90. In this case, if the suction nozzle 21 picks up a target object TS0 that includes a group of defective solder balls 80g, it will be necessary to deal with the defective solder balls 80g after the target object TS0 has been supplied, which may reduce production efficiency. 【0025】 Therefore, a quality determination device 50 is applied to the component mounting machine 10 of this embodiment. The quality determination device 50 includes a first determination unit 51. The quality determination device 50 may also include a first imaging unit 52. The quality determination device 50 may also include at least the second imaging unit 53 among the second imaging unit 53 and the third imaging unit 54, and at least the second determination unit 55 among the second determination unit 55 and the third determination unit 56. The component mounting machine 10 may also include a supplementary unit 57. As shown in Figure 3, the quality determination device 50 of this embodiment includes a first determination unit 51, a first imaging unit 52, a second imaging unit 53, a third imaging unit 54, a second determination unit 55, and a third determination unit 56. In addition, the control device 16 of the component mounting machine 10 includes a supplementary unit 57. 【0026】 The quality determination device 50 can be installed on various control devices, management devices, or on the cloud. As shown in Figure 3, the quality determination device 50 of this embodiment is installed on the control device 16 of the component mounting machine 10. The quality determination device 50 of this embodiment performs control according to the flowchart shown in Figure 4. The first determination unit 51 performs the process shown in step S12. The first imaging unit 52 performs the process shown in step S11. The second imaging unit 53 performs the process shown in step S17. The third imaging unit 54 performs the process shown in step S15. The second determination unit 55 performs the process shown in step S18. The third determination unit 56 performs the process shown in step S16. The complementation unit 57 makes the judgment shown in step S19 and performs the process shown in step S20. The control device 16 of the component mounting machine 10 makes the judgment shown in step S13 and performs the process shown in step S14. 【0027】 1-2-1. First determination unit 51 and first imaging unit 52 The first determination unit 51 determines the quality of the solder ball group 80g mounted on at least one of the multiple supply units 70 arranged on the pallet 30 before the suction nozzle 21 picks up the object TS0 (step S12). 【0028】 The first determination unit 51 only needs to be able to determine whether the solder ball group 80g is good or bad, and can take various forms. For example, the first determination unit 51 can determine whether the solder ball group 80g is good or bad using a known detection device that detects the solder ball group 80g mounted on the supply unit 70. In this embodiment, the first determination unit 51 determines whether the solder ball group 80g is good or bad based on the image data PD0 of the solder ball group 80g acquired by the first imaging unit 52. 【0029】 The first imaging unit 52 causes the first imaging device 61 to image the group of solder balls 80g mounted on at least one of the multiple supply units 70 arranged on the pallet 30 (step S11). The first imaging device 61 only needs to be able to image the group of solder balls 80g, and any known imaging device can be used. For example, the first imaging device 61 can be a substrate camera 15. The substrate camera 15 images the group of solder balls 80g mounted on the base member 71 from above. 【0030】 Figure 5 shows an example of image data PD0 of a group of 80g of solder balls. This figure shows an example of image data PD0 captured by the substrate camera 15 from above the base member 71 of one of the supply units 70 of the pallet 30, capturing the group of 80g of solder balls mounted on the base member 71. As shown in Figures 2 and 5, the image data PD0 captures multiple solder balls 80 (47 pieces), which is one less than the specified number (48 pieces in the example shown in Figure 2) that should be mounted on one supply unit 70. 【0031】 For example, when the lid covering the pallet 30 is removed by an operator and the pallet 30 is loaded into the storage device 40, solder balls 80 may adhere to the lid. As a result, there is a possibility that the number of solder balls 80 contained in the solder ball group 80g will be insufficient for the specified number (48 in the above example) in the supply unit 70. 【0032】 Therefore, the first determination unit 51 determines that the solder ball group 80g is good when the number of solder balls 80 included in the solder ball group 80g, as recognized by image processing of the image data PD0 of the solder ball group 80g, matches the specified number (48) that should be mounted on the supply unit 70. The first determination unit 51 determines that the solder ball group 80g is defective when the number of solder balls 80 included in the solder ball group 80g, as recognized by image processing of the image data PD0 of the solder ball group 80g, is less than the specified number (48). In the example shown in Figure 5, there is one solder ball 80 missing from the specified number (48). Therefore, in this case, the first determination unit 51 determines that the solder ball group 80g is defective. 【0033】 Furthermore, for example, if the supply units 70 are arranged on the pallet 30 by an operator, there is a possibility that supply units 70 different from the ones that should be arranged may be placed on the pallet 30. As a result, there is a possibility that the size of each solder ball 80 contained in the solder ball group 80g may differ from the predetermined size that should be mounted on the supply unit 70. 【0034】 Therefore, the first determination unit 51 can also determine that the solder ball group 80g is good when the size of each solder ball 80 included in the solder ball group 80g, which has been recognized by image processing of the image data PD0 of the solder ball group 80g, matches a predetermined size that should be mounted on the supply unit 70. The first determination unit 51 can also determine that the solder ball group 80g is defective when the size of at least one solder ball 80 included in the solder ball group 80g, which has been recognized by image processing of the image data PD0 of the solder ball group 80g, differs from a predetermined size. 【0035】 Furthermore, the first determination unit 51 can also determine that the solder ball group 80g is good when the number of solder balls 80 included in the solder ball group 80g matches the specified number to be mounted on the supply unit 70, and the size of each solder ball 80 included in the solder ball group 80g matches the predetermined size to be mounted on the supply unit 70. The first determination unit 51 can also determine that the solder ball group 80g is defective when the number of solder balls 80 included in the solder ball group 80g is less than the specified number, and when at least one of the following conditions is met: the size of at least one solder ball 80 included in the solder ball group 80g is different from the predetermined size. 【0036】 The specified number and size of solder balls 80 to be mounted on the supply unit 70 can be obtained, for example, from a control device that manages the production of circuit board products. Specifically, the first determination unit 51 can obtain information from the control device regarding solder balls 80 that match the type of circuit board product to be produced by supplying the solder ball group 80g, and recognize the specified number and size of solder balls 80 to be mounted on the supply unit 70. The same applies to the second determination unit 55 and the third determination unit 56, which will be described later, regarding the specified number of solder balls 80 to be mounted on the supply unit 70. 【0037】 As previously described, the supply unit 70 includes a plate-shaped base member 71 on which a group of solder balls 80g can be mounted. As shown in Figure 2, in this embodiment, the base member 71 is colored in a blackish color. In addition, a group of white solder balls 80g is mounted on the base member 71. In this case, it is easy to recognize multiple solder balls 80g contained in the group of solder balls 80g by binarization processing. Therefore, the first determination unit 51 is better able to determine the quality of the group of solder balls 80g by binarizing the image data PD0 of the group of white solder balls 80g mounted on the blackish base member 71 to recognize each solder ball 80g contained in the group of solder balls 80g. 【0038】 In Figure 1, for illustrative purposes, the base member 71 is shown in white. Even if the base member 71 is not colored in a black-like color, the first determination unit 51 can still recognize each solder ball 80 included in the solder ball group 80g by binarizing the image data PD0 of the solder ball group 80g and determine whether the solder ball group 80g is good or bad. In this case, it is preferable to lower the threshold for the binarization process compared to the case where the base member 71 is colored in a black-like color. 【0039】 The first imaging unit 52 can cause the first imaging device 61 to image the solder ball group 80g mounted on each of a predetermined number of supply units 70 (six in the example shown in Figure 1) arranged on the pallet 30. The number of supply units 70 that the first imaging device 61 images (the predetermined number mentioned above) may be one or multiple. In this case, the first determination unit 51 can determine whether the solder ball group 80g is good or bad for each predetermined number of supply units 70. 【0040】 As previously described, in this embodiment, the first imaging device 61 is a substrate camera 15. For example, the predetermined number can be set to match the number of supply units 70 included in the imaging field of view of the substrate camera 15. The mounting head 20 can also support a plurality of suction nozzles 21, each capable of picking up an object TS0. In this case, the predetermined number can also be set to match the number of object TS0 to be picked up in one pick-and-place cycle of the mounting head 20. 【0041】 As previously described, the supply unit 70 includes a plate-shaped base member 71 on which a group of solder balls 80g can be mounted. As shown in Figure 2, the base member 71 is provided with a reference part 72 used to recognize the mounted group of solder balls 80g. The reference part 72 is a positional reference for recognizing the group of solder balls 80g and can take various forms. In the example shown in the figure, the reference part 72 is a white triangle and is provided at one of the four corners of the roughly square-shaped base member 71. 【0042】 Furthermore, the reference unit 72 is often provided in a recognizable manner by being illuminated by incident light, and the solder ball group 80g is made more recognizable by being illuminated by oblique light. Therefore, as shown in Figure 6, in this embodiment, the first imaging device 61 includes a reference unit light source 61a, an incident light conversion unit 61b, and a solder ball group light source 61c. The reference unit light source 61a is a light source that illuminates the reference unit 72. The incident light conversion unit 61b converts the illumination light irradiated from the reference unit light source 61a into incident light and illuminates the reference unit 72 from above in the vertical direction (Z-axis direction). 【0043】 The solder ball group light source 61c illuminates the solder ball group 80g from an oblique angle above, tilted at a predetermined angle with respect to the vertical direction (Z-axis direction). The predetermined angle is an angle at which the solder ball group 80g can be recognized and is set in advance through simulation, verification with an actual device, etc. The reference light source 61a and the solder ball group light source 61c can use, for example, known light-emitting diodes, and the wavelength of the emitted light is not limited. In addition, the incident light conversion unit 61b can use, for example, a half mirror. 【0044】 The reference light source 61a emits light toward the incident light conversion unit 61b (arrow L11). The emitted light from the reference light source 61a is reflected by the incident light conversion unit 61b and travels toward the reference unit 72 (arrow L12). The reflection angle is set to 90 degrees. The emitted light reflected by the reference unit 72 travels toward the lens 15b (arrow L13). The emitted light that reaches the lens 15b passes through the lens 15b and travels toward the image sensor 15a (arrow L14). 【0045】 Furthermore, the solder ball group light source 61c irradiates the solder ball group 80g with light from diagonally above at a predetermined angle with respect to the vertical direction (Z-axis direction) (arrow L21). The irradiated light reflected by the solder ball group 80g travels toward the lens 15b (arrow L22). The irradiated light that reaches the lens 15b passes through the lens 15b and travels toward the image sensor 15a (arrow L23). The above description regarding the first imaging device 61 also applies to the third imaging device 63, except for the direction of illumination. 【0046】 In this manner, the first imaging unit 52 acquires image data PD0 of the reference unit 72, which is captured by illuminating the reference unit 72 using the reference unit light source 61a and the incident light conversion unit 61b, and image data PD0 of the solder ball group 80g, which is captured by illuminating the solder ball group 80g using the solder ball group light source 61c. In this case, the first determination unit 51 can recognize each solder ball 80 included in the solder ball group 80g based on the image data PD0 of the reference unit 72 and the image data PD0 of the solder ball group 80g, using the reference unit 72 as a reference, and determine whether the solder ball group 80g is good or bad. 【0047】 If the first determination unit 51 determines that the solder ball group 80g is good (if the result is Yes in step S13 shown in Figure 4), the control device 16 of the component mounting machine 10 picks up the object TS0, which includes the solder ball group 80g that has been determined to be good, onto the suction nozzle 21 (step S14). 【0048】 As in this embodiment, it is assumed that the first imaging unit 52 causes the first imaging device 61 to image the group of solder balls 80g mounted on each supply unit 70. If the first determination unit 51 determines that the group of solder balls 80g is defective (if the result is No in step S13), the control returns to the process shown in step S11, as shown in Figure 4. The first imaging unit 52 then causes the first imaging device 61 to image the group of solder balls 80g mounted on the other supply units 70 (step S11). The processes and determinations shown in steps S11 to S13 are repeated until the first determination unit 51 determines that the group of solder balls 80g is good. 【0049】 Furthermore, it is assumed that the first imaging unit 52 causes the first imaging device 61 to image the group of solder balls 80g mounted on each of the multiple supply units 70. If the first determination unit 51 determines that the group of solder balls 80g is defective (No in step S13), the control returns to the process shown in step S12. The first determination unit 51 then determines whether the group of solder balls 80g mounted on the other supply units 70 is good or bad (step S12). If there is no group of solder balls 80g that is good, the control returns to the process shown in step S11. The processes and judgments shown in steps S11 to S13 are then repeated until the first determination unit 51 determines that the group of solder balls 80g is good. 【0050】 1-2-2. Second imaging unit 53, third imaging unit 54, second determination unit 55, and third determination unit 56 The suction nozzle 21 adsorbs and holds the object TS0 and supplies it to the target area TA0 of the substrate 90. For example, the object TS0 may fall off while being supplied to the target area TA0 of the substrate 90. Therefore, the quality determination device 50 is preferably equipped with at least the second imaging unit 53 of the second imaging unit 53 and the third imaging unit 54, and at least the second determination unit 55 of the second determination unit 55 and the third determination unit 56. 【0051】 The second imaging unit 53 causes the second imaging device 62 to image the group of solder balls 80g of the object TS0 supplied to the target area TA0 of the substrate 90 by the suction nozzle 21 (step S17 shown in Figure 4). The second imaging device 62 only needs to be able to image the group of solder balls 80g of the object TS0 supplied to the target area TA0, and any known imaging device can be used. For example, the substrate camera 15 can be used as the second imaging device 62. 【0052】 In this case, the substrate camera 15 images the group of solder balls 80g of the object TS0 supplied to the target area TA0 from above. As previously described, the substrate camera 15 is provided on the transfer device 13 that moves the mounting head 20 equipped with a suction nozzle 21. Thus, the second imaging device 62 is provided on the transfer device 13 that moves the mounting head 20 equipped with a suction nozzle 21 and can be used interchangeably with the first imaging device 61. 【0053】 When the target object TS0 is a group of solder balls 80g, the target area TA0 of the substrate 90 is provided with a region reference section similar to the reference section 72 provided on the base member 71. In this case, the explanation of the second imaging device 62 can be given by replacing the reference section 72 with the region reference section in the explanation of the first imaging device 61, and redundant explanations are omitted in this specification. Furthermore, the second imaging unit 53 can cause the second imaging device 62 to image the group of solder balls 80g for each target area TA0. Moreover, the second imaging unit 53 can also cause the second imaging device 62 to image the group of solder balls 80g for each of multiple target areas TA0. 【0054】 The third imaging unit 54 causes the third imaging device 63 to image the group of solder balls 80g of the object TS0 held by the suction nozzle 21 (step S15). The third imaging device 63 only needs to be able to image the group of solder balls 80g of the object TS0 held by the suction nozzle 21, and any known imaging device can be used. For example, the third imaging device 63 can be a component camera 14. 【0055】 In this case, the component camera 14 images the group of solder balls 80g of the object TS0 held by the suction nozzle 21 from below. As previously described, the component camera 14 is fixed to the base of the component mounting machine 10. In this way, the third imaging device 63 is fixed to the base of the component mounting machine 10 and can image the group of solder balls 80g of the object TS0 held by the suction nozzle 21 from below. 【0056】 In the third imaging device 63, when the object TS0 is the supply unit 70, the reference unit 72 is provided on the side of the base member 71 facing the third imaging device 63. When the object TS0 is a group of solder balls 80g, the reference unit 72 is provided on the suction nozzle 21 or the mounting head 20. Also, as shown in Figure 7, the illumination direction of the third imaging device 63 is different from that of the first imaging device 61. Specifically, the third imaging device 63, like the first imaging device 61, includes a reference unit light source 63a, an incident light conversion unit 63b, and a solder ball group light source 63c. 【0057】 However, the incident light conversion unit 63b of the third imaging device 63 converts the illumination light irradiated from the reference unit light source 63a into incident light to illuminate the reference unit 72 from below in the vertical direction (Z-axis direction). The solder ball group light source 63c of the third imaging device 63 illuminates the solder ball group 80g from diagonally below at a predetermined angle inclined with respect to the vertical direction (Z-axis direction). The third imaging unit 54 acquires image data PD0 of the reference unit 72, which is captured by illuminating the reference unit 72 using the reference unit light source 63a and the incident light conversion unit 63b, and image data PD0 of the solder ball group 80g, which is captured by illuminating the solder ball group 80g using the solder ball group light source 63c. 【0058】 Furthermore, if the mounting head 20 supports multiple suction nozzles 21, the third imaging unit 54 can cause the third imaging device 63 to image the group of solder balls 80g of the object TS0 for each suction nozzle 21. 【0059】 The second determination unit 55 is provided when the quality determination device 50 includes a second imaging unit 53. The second determination unit 55 determines the quality of the solder ball group 80g of the object TS0 after it has been supplied to the target area TA0 based on the image data PD0 of the solder ball group 80g acquired by the second imaging unit 53 (step S18). The second determination unit 55 can determine the quality of the solder ball group 80g in the same manner as the first determination unit 51. 【0060】 The second determination unit 55 determines that the solder ball group 80g is good when the number of solder balls 80 included in the solder ball group 80g, as recognized by image processing of the image data PD0 of the solder ball group 80g, matches the specified number (48 in the example described above) that should be supplied to the target area TA0. The second determination unit 55 determines that the solder ball group 80g is defective when the number of solder balls 80 included in the solder ball group 80g, as recognized by image processing of the image data PD0 of the solder ball group 80g, is less than the specified number (48). 【0061】 The third determination unit 56 is provided when the quality determination device 50 includes a third imaging unit 54. The third determination unit 56 determines the quality of the solder ball group 80g of the object TS0 before it is supplied to the target area TA0 based on the image data PD0 of the solder ball group 80g acquired by the third imaging unit 54 (step S16). What has been described above regarding the second determination unit 55 also applies to the third determination unit 56. 【0062】 Furthermore, the second imaging unit 53 can cause the second imaging device 62 to image the group of solder balls 80g of the object TS0 for each predetermined number of target regions TA0, and the second determination unit 55 can determine the quality of the group of solder balls 80g for each predetermined number of target regions TA0. Similarly, the third imaging unit 54 can cause the third imaging device 63 to image the group of solder balls 80g of the object TS0 held by each predetermined number of suction nozzles 21, and the third determination unit 56 can determine the quality of the group of solder balls 80g for each predetermined number of suction nozzles 21. 【0063】 Furthermore, since defects in the solder ball group 80g may occur after the solder ball group 80g has been imaged by the third imaging unit 54, it is preferable that the quality determination device 50 includes at least the second imaging unit 53 of the second imaging unit 53 and the third imaging unit 54, and at least the second determination unit 55 of the second determination unit 55 and the third determination unit 56. 【0064】 1-2-3. Supplementary Section 57 The supplementation unit 57 supplies the missing solder balls 80 to the target area TA0 when at least the second determination unit 55 of the second determination unit 55 and the third determination unit 56 determines that the solder ball group 80g is defective (when the answer is Yes in step S19 and step S20 shown in Figure 4). 【0065】 For example, the supplementation unit 57 supplies the missing solder balls 80 to the target area TA0 using a suction nozzle 21 capable of picking up one solder ball 80 at a time. Specifically, the supplementation unit 57 moves the mounting head 20 to pick up and hold one solder ball 80 from a storage case that holds multiple solder balls 80 using the suction nozzle 21. Then, the supplementation unit 57 moves the mounting head 20 to supply solder balls 80 to areas of the target area TA0 where solder balls 80 have not been supplied (missing areas). 【0066】 If multiple missing regions occur in a single target region TA0, the interpolation unit 57 repeats the interpolation process described above. Furthermore, if the mounting head 20 supports multiple suction nozzles 21, the interpolation unit 57 can pre-attach solder balls 80 to a suction nozzle 21 capable of holding one solder ball 80. 【0067】 Furthermore, consider a case where the substrate 90 is sequentially transported to multiple component mounting machines 10 and multiple mounting components 92, including component 91, are mounted. In this case, the supplementation unit 57 can supply the missing solder balls 80 to the target area TA0 at the component mounting machine 10 that supplied the target object TS0 to the target area TA0. The supplementation unit 57 can also supply the missing solder balls 80 to the target area TA0 at a component mounting machine 10 located downstream of the component mounting machine 10 that supplied the target object TS0 to the target area TA0. In this case, the solder ball supply process and the supplementation process can be distributed. The supplementation unit 57 can also supply solder balls 80 in bulk to multiple missing areas that occur in multiple component mounting machines 10 at a component mounting machine located downstream of the said component mounting machine 10. 【0068】 Furthermore, let's consider a case where the quality determination device 50 includes a third imaging unit 54 and a third determination unit 56, and a defect occurs in the solder ball group 80g before the solder ball group 80g is imaged by the third imaging unit 54. In this case, there is a high probability that the defect in the solder ball group 80g will be determined by the third determination unit 56 before the defect in the solder ball group 80g is determined by the second determination unit 55. Therefore, the interpolation unit 57 can begin preparing for interpolation processing when the third determination unit 56 determines that the solder ball group 80g is defective. For example, if the mounting head 20 supports multiple suction nozzles 21, the interpolation unit 57 can pre-attach a solder ball 80 to a suction nozzle 21 capable of suctioning one solder ball 80. The interpolation unit 57 can also start interpolation processing after the solder ball group 80g has been imaged by the second imaging unit 53 and before the quality of the solder ball group 80g is determined by the second determination unit 55. 【0069】 1-3. Method for determining quality The same applies to the quality determination method as to the quality determination device 50. Specifically, the quality determination method includes a first determination step. The first determination step corresponds to the control performed by the first determination unit 51. The quality determination method may also include a first imaging step. The first imaging step corresponds to the control performed by the first imaging unit 52. The quality determination method may also include at least the second imaging step from the second imaging step and the third imaging step, and at least the second determination step from the second determination step and the third determination step. The second imaging step corresponds to the control performed by the second imaging unit 53. The third imaging step corresponds to the control performed by the third imaging unit 54. The second determination step corresponds to the control performed by the second determination unit 55. The third determination step corresponds to the control performed by the third determination unit 56. Furthermore, the control by the component mounting machine 10 may also include a complementary step. The complementary step corresponds to the control performed by the complementary unit 57. 【0070】 2. An example of the effects of the embodiment According to the quality determination method, when it is determined that there is a shortage of solder balls 80 in the group of solder balls 80g held by the suction nozzle 21, the missing solder balls 80 can be supplied to the target area TA0. The above-mentioned quality determination method also applies to the substrate production system. [Explanation of symbols] 【0071】 10: Component mounting machine, 12: Feeding device, 14: Component camera, 21: Suction nozzle, 56: Third determination unit (corresponding to the determination unit), 57: Complementary part, 80: Solder ball, 80g: Solder balls, 90g: Circuit board, 91g: Components, PD0: Image data, MA0: Mounting area, TA0: Target area.
Claims
[Claim 1] A supply step of supplying a group of solder balls, which are arranged in accordance with the electrode positions of the component, to a target area that is at least a part of the mounting area of the component to be mounted on the substrate, The suction step involves adsorbing and holding the group of solder balls supplied in the supply step using an adsorption nozzle, An imaging step of imaging the group of solder balls held by the adsorption nozzle, A determination step in which the quality of the solder ball group before it is supplied to the target area is determined based on the image data of the solder ball group acquired by the imaging step, When the determination step determines that the solder ball group is defective due to a shortage of solder balls, a supplementation step is performed to supply the missing solder balls to the target area. Equipped with, The aforementioned supplementation step is a quality determination method in which, when multiple defective regions occur in a plurality of component mounting machines in which the substrate is transported sequentially, the component mounting machine located downstream of the component mounting machine in which the multiple defective regions occurred, supplies the missing solder balls to the multiple defective regions all at once. [Claim 2] The method for determining whether a solder ball is good or bad according to claim 1, wherein the determination step determines that the solder ball group is good when the number of solder balls included in the solder ball group recognized by image processing the image data matches a predetermined number to be supplied to the target area, and determines that the solder ball group is defective due to a shortage of solder balls when the number of solder balls included in the recognized solder ball group is insufficient compared to the predetermined number. [Claim 3] The quality determination method according to claim 1 or 2, wherein the supplementation step is to supply the deficient solder balls to the target area using the adsorption nozzle capable of adsorbing one of the solder balls. [Claim 4] The quality determination method according to claim 1, wherein the supplementation step starts preparations to supply the missing solder balls to the target area when the judgment step determines that the group of solder balls is defective. [Claim 5] Multiple component mounting machines that attach components to circuit boards to produce circuit board products, A control device for managing the production of the aforementioned substrate product, A substrate production system including, A supply device that supplies a group of solder balls, which are arranged to match the electrode positions of the component, to a target region that is at least a part of the mounting area of the component mounted on the substrate, A suction nozzle for adsorbing and holding the group of solder balls supplied by the supply device, A component camera for imaging the group of solder balls held by the suction nozzle, A determination unit that determines the quality of the solder ball group before it is supplied to the target area based on image data of the solder ball group acquired by the component camera, When the determination unit determines that the solder ball group is defective due to a shortage of solder balls, the supplementation unit supplies the missing solder balls to the target area. Equipped with, The aforementioned supplementary unit is a substrate production system that, when multiple missing regions occur in the target area of the multiple component mounting machines in which the substrates are transported sequentially, a component mounting machine downstream of the component mounting machine in which the multiple missing regions occurred, supplies the missing solder balls to the multiple missing regions all at once.