Display device

Abstract

A display device according to an embodiment of this specification includes: a display area having a plurality of sub-pixels therein and a substrate configured to surround the display area; a plurality of light-emitting elements respectively disposed in the plurality of sub-pixels on the substrate and each including an anode, a light-emitting layer and a cathode; a dam disposed in the display area and the non-display area and configured to cover the end of the anode; a dam disposed in the non-display area on the substrate and configured to surround the display area; and a power line configured to overlap the dam in the non-display area, disposed on the same layer as the anode and made of the same material as the anode, wherein the power line includes: a first portion, the first portion being a portion overlapping the dam; and a second portion, the second portion being a portion extending from the first portion toward the display area, and wherein the dam includes: a plurality of first opening portions disposed along the dam; and a second opening portion extending from the first opening portions and disposed along the side surface of the second portion.

Description

[0001] Cross-references to related applications

[0002] This application claims priority to Korean Patent Application No. 10-2024-0190481, filed on December 18, 2024, with the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference. Technical Field

[0003] This specification relates to a display device, and more specifically, to a display device capable of minimizing moisture penetration into the display area while minimizing damage to power lines located in the non-display area. Background Technology

[0004] With the advent of the information age, display devices that visually display electrical information signals are developing rapidly. Various research efforts are underway to develop thinner, lighter, lower-power-consuming display devices with improved performance.

[0005] Representative display devices include liquid crystal displays (LCDs), field emission displays (FEDs), electrowetting displays (EWDs), and organic light-emitting diode displays (OLEDs).

[0006] Electroluminescent displays, as a representative type of organic light-emitting display device, refer to self-emissive display devices. Unlike liquid crystal displays (LCDs), electroluminescent displays do not require a separate light source, thus allowing them to be manufactured as lightweight and thin devices. Furthermore, electroluminescent displays are advantageous in terms of power consumption because they operate at low voltages. In addition, because electroluminescent displays excel in color reproduction, response speed, viewing angle, and contrast ratio (CR), they are expected to be used in various fields. Summary of the Invention

[0007] The purpose of this specification is to provide a display device that minimizes damage to power lines located in non-display areas during the manufacturing process.

[0008] Another objective of this specification is to provide a display device capable of preventing moisture from penetrating into the display area.

[0009] The purpose of this disclosure is not limited to the above-described purposes, and other purposes not mentioned above will be clearly understood by those skilled in the art from the following description.

[0010] A display device according to an embodiment of this specification includes: a substrate including a display area having a plurality of sub-pixels and a non-display area configured to surround the display area; a plurality of light-emitting elements respectively disposed in the plurality of sub-pixels on the substrate and each including an anode, a light-emitting layer and a cathode; a dam disposed in the display area and the non-display area and configured to cover the end of the anode; a dam disposed in the non-display area on the substrate and configured to surround the display area; and a power line configured to overlap with the dam in the non-display area, disposed on the same layer as the anode and made of the same material as the anode, wherein the power line includes: a first portion, the first portion being the portion overlapping the dam; and a second portion, the second portion being the portion extending from the first portion toward the display area, and wherein the dam includes: a plurality of first opening portions disposed along the dam; and a second opening portion extending from the first opening portions and disposed along the side surface of the second portion.

[0011] A display device according to another embodiment of this specification includes: a substrate including a display area and a non-display area; a plurality of light-emitting elements disposed on the substrate in the display area and each including an anode, a light-emitting layer and a cathode; a partition disposed on the anode and configured to cover an end of the anode; and a power line disposed in the non-display area, disposed on the same layer as the anode, made of the same material as the anode and electrically connected to the cathode, wherein the power line includes: a first portion disposed in the non-display area and configured to surround at least a portion of the display area; and a second portion protruding from the first portion toward the display area, wherein the partition includes: a plurality of first opening portions configured to surround at least a portion of the display area and configured to at least partially overlap with the first portion; and a second opening portion configured to extend from the first opening portions along the side surface of the second portion.

[0012] Further details of the exemplary embodiments are included in the specific embodiments and the accompanying drawings.

[0013] In this specification, the reliability of the display device can be improved by minimizing damage to the power cord during the manufacturing process.

[0014] In this specification, the reliability and display quality of a display device can be improved by minimizing moisture penetration into the display area.

[0015] In this specification, production yield can be improved by minimizing damage to power lines during the manufacturing process, and the process can be optimized by reducing production energy.

[0016] The effects of this disclosure are not limited to those illustrated above, and many more effects are included in this specification. Attached Figure Description

[0017] The above and other aspects, features and advantages of this disclosure will become clearer from the following detailed description taken in conjunction with the accompanying drawings, wherein:

[0018] Figure 1 This is a top plan view of a display device according to an embodiment of this specification;

[0019] Figure 2 It is along Figure 1 A cross-sectional view taken by line A-A' in the diagram;

[0020] Figures 3A to 3C yes Figure 1 Enlarged top view of region B in the diagram;

[0021] Figure 4 It is along Figure 3A A cross-sectional view taken by line C-C' in the diagram;

[0022] Figure 5 This is an enlarged top view of a display device according to another embodiment of this specification;

[0023] Figure 6A and Figure 6B This is an enlarged top view of a display device according to yet another embodiment of this specification;

[0024] Figure 7 This is an enlarged top view of a display device according to another embodiment of this specification;

[0025] Figure 8 This is an enlarged top view of a display device according to yet another embodiment of this specification;

[0026] Figure 9 This is an enlarged top plan view of a display device according to a further embodiment of this specification; and

[0027] Figure 10 This is an enlarged top view of a display device according to another further embodiment of this specification. Detailed Implementation

[0028] The advantages and features of this disclosure, as well as methods for implementing these advantages and features, will become clear from the exemplary embodiments described in detail below and the accompanying drawings. However, this disclosure is not limited to the exemplary embodiments disclosed herein, but will be implemented in various forms. The exemplary embodiments are provided by way of example only so that those skilled in the art can fully understand the disclosure and scope of this disclosure.

[0029] The shapes, sizes, ratios, angles, quantities, etc., shown in the accompanying drawings used to describe exemplary embodiments of this disclosure are merely examples, and this disclosure is not limited thereto. Throughout the specification, the same reference numerals generally denote the same elements. Furthermore, in the following description of this disclosure, detailed explanations of known related technologies may be omitted to avoid unnecessarily obscuring the subject matter of this disclosure. Terms such as “comprising,” “having,” and “consisting of” as used herein are generally intended to allow for the addition of additional components, unless these terms are used in conjunction with the term “only.” Unless otherwise expressly stated, any reference to the singular may include the plural.

[0030] Even without explicit explanation, components are interpreted as including the normal tolerance range.

[0031] When using terms such as “above,” “over,” “below,” or “next” to describe the positional relationship between two parts, one or more parts may be located between the two parts unless these terms are used in conjunction with the terms “immediately following” or “directly.”

[0032] When one element or layer is placed "on" another element or layer, other layers or other elements can be directly inserted on or between the other element.

[0033] Although the terms "first," "second," etc., are used to describe various components, these components are not limited by these terms. These terms are only used to distinguish one component from other components. Therefore, the first component mentioned below can be the second component in the technical concept of this disclosure.

[0034] Throughout the specification, the same reference numerals generally denote the same elements.

[0035] For ease of description, the size and thickness of each component shown in the accompanying drawings are illustrated, and this disclosure is not limited to the size and thickness of the components shown.

[0036] Features of the various embodiments of this disclosure may be combined or integrated with each other in part or in whole, and may be technically interlocked and operated in various ways, and the embodiments may be performed independently or in association with each other.

[0037] Various embodiments of this disclosure will be described in detail below with reference to the accompanying drawings.

[0038] Figure 1 This is a schematic top view of a display device 100 according to an embodiment of this specification.

[0039] refer to Figure 1 The substrate 110 includes a display area AA and a non-display area.

[0040] The substrate 110 is a base component for supporting various types of parts of the display device 100, and may be made of an insulating material. For example, the substrate 110 may be made of glass or a plastic material such as polyimide.

[0041] The display area AA is the area where the image is displayed. Multiple subpixels SP and drivers for operating these subpixels SP are set within the display area AA. Multiple subpixels SP are the smallest unit constituting the display area AA. n subpixels SP can constitute a single pixel. For example, a subpixel SP may include red, green, and blue subpixels, or it may include white, red, green, and blue subpixels. Depending on the light emission characteristics, a subpixel SP may have one or more different light emission areas.

[0042] For example, a driver may include various components for operating multiple sub-pixels SP, such as power lines, gate lines, data lines, transistors, and storage capacitors. However, this specification is not limited thereto.

[0043] refer to Figure 1 The substrate 110 may have different corner regions. The display area AA may have a shape corresponding to the different corner regions of the substrate 110. The corners of the substrate 110 and the corners of the display area AA may each have a rounded shape. However, this specification is not limited thereto. The substrate 110 and the display area AA may have various shapes suitable for the design of an electronic device equipped with the display device 100.

[0044] The non-display area is the area where no image is displayed. Various lines and circuits used to operate the display elements in the display area AA are located in the non-display area. For example, data drivers DD, gate drivers, connecting lines, and pads can be located in the non-display area.

[0045] The non-display area can be an area extending from the display area AA. However, this specification is not limited to this. The non-display area can also be an area surrounding the display area AA.

[0046] The non-display area includes a first non-display area NA1, a curved area BA, and a second non-display area NA2. The first non-display area NA1 extends from the display area AA. The curved area BA extends from the first non-display area NA1. The curved area BA may be curved. The second non-display area NA2 extends from the curved area BA.

[0047] The data driver DD can be located in the second non-display area NA2. Although not shown, a pad section having pads that connect to various types of signal lines or PCBs can be further located in the second non-display area NA2. For example, power pads, data pads, gate pads, etc., can be located on the pad section.

[0048] The data driver DD can be mounted on or connected to a separate PCB and connected to the display panel via pads. Alternatively, the data driver DD can be mounted or connected between the pads and the display area AA as a chip-on-panel (COP). The data driver DD includes at least one source driver integrated circuit (IC). The at least one source driver IC is supplied with digital video data and source timing control signals from a timing controller. In response to the source timing control signals, the at least one source driver IC generates a data voltage by converting the digital video data into a gamma voltage and supplies the data voltage through data lines in the display area AA.

[0049] The bending area BA can be a region where the substrate 110 is bent. For example, the substrate 110 can remain flat and unbent in regions other than the bending area BA, and the substrate 110 can be configured to be bent in the bending area BA. Therefore, the display device 100 can be bent such that two unbent regions of the substrate 110, other than the bending area BA, face each other.

[0050] The first non-display area NA1 is the area between the curved area BA and the display area AA. Connecting lines such as power lines and data lines can be provided in the first non-display area NA1. That is, the first non-display area NA1 is used to transmit signals output from the driver to the display area AA. When the substrate 110 includes different corner areas, the first non-display area NA1 can have a shape corresponding to the shape of the substrate 110 and the shape of the display area AA.

[0051] Although not shown, the gate drivers can be positioned on two opposite sides of the display area AA within the first non-display area NA1 of the non-display area. The gate drivers can be implemented using a gate-in-panel (GIP) method. However, this specification is not limited thereto.

[0052] In the following text, reference will be made to Figure 2 The cross-sectional structure of the plurality of sub-pixels SP disposed in the display area AA of the display device 100 is described in more detail.

[0053] Figure 2 It is along Figure 1The cross-sectional view taken by line A-A' in the diagram. Figure 2 This is a cross-sectional view of a sub-pixel SP disposed in the display area AA of the display device 100 according to an embodiment of this specification.

[0054] refer to Figure 2 In the sub-pixel SP located in the display area AA, the transistor layer TRL can be disposed on the substrate layer SUB, and the planarization layer PLN can be disposed on the transistor layer TRL. Furthermore, the light-emitting element layer EDL can be disposed above the planarization layer PLN, and the encapsulation layer ENCAP can be disposed above the light-emitting element layer EDL.

[0055] The substrate layer SUB can be configured to support various components included in the display device 100, and includes a substrate 110 having multiple layers. For example, the substrate 110 can be made of an insulating material. The substrate 110 can include a first substrate 110a, a second substrate 110b, and an insulating layer 110c. The insulating layer 110c can be disposed between the first substrate 110a and the second substrate 110b. As described above, the substrate 110 is composed of the first substrate 110a, the second substrate 110b, and the insulating layer 110c, which can suppress moisture penetration. For example, the first substrate 110a and the second substrate 110b can each be a substrate made of polyimide (PI).

[0056] Various types of patterns GE, DE, SE, and ACT used to form transistors such as driving transistors DT, as well as various types of insulating layers 111a, 111b, 112, 113, and 114, can be disposed on the transistor layer TRL in the display area AA.

[0057] The layered structure of the transistor layer (TRL) will be described in more detail below.

[0058] A multi-buffer layer 111a may be disposed on a second substrate 110b, and an active buffer layer 111b may be disposed on the multi-buffer layer 111a. The multi-buffer layer 111a and the active buffer layer 111b may each be made of an inorganic insulating material, including at least any one of silicon nitride (SiNx) and silicon oxide (SiOx).

[0059] Although not shown, a light-blocking layer used as a light-shielding element may be provided on the multi-buffer layer 111a.

[0060] The active layer ACT that drives the transistor DT can be set on the active buffer layer 111b.

[0061] For example, the active layer ACT can include low-temperature polycrystalline silicon (LTPS). This is because polycrystalline silicon materials have high mobility (100 cm⁻¹). 2With its low power consumption (or higher), low voltage, and excellent reliability, polysilicon can be applied to gate drivers and / or multiplexers (MUX) as driving elements for thin-film transistors used to operate display elements. In the display device 100 according to an embodiment of this specification, polysilicon can be applied to the active layer of the driving transistor DT. However, this specification is not limited thereto. For example, depending on the characteristics of the display device, polysilicon can also be applied to the active layer of the switching thin-film transistor.

[0062] The active layer ACT may include a channel region that forms a channel when driving the transistor DT to operate, and source and drain regions disposed on two opposite sides of the channel region. The source region refers to the portion of the active layer ACT connected to the source electrode SE, which will be described below, and the drain region refers to the portion of the active layer ACT connected to the drain electrode DE, which will be described below. The source and drain regions can be configured by doping the active layer ACT with ions (impurities). The source and drain regions can be formed by doping polysilicon material with ions. The channel region may refer to the portion in which the polysilicon material is retained without ion doping.

[0063] For example, the active layer ACT can be made of oxide semiconductor. Oxide semiconductor materials are materials with a larger band gap than silicon materials and have a low cutoff current because electrons cannot cross the band gap in the cutoff state. Therefore, thin-film transistors including an active layer ACT made of oxide semiconductor can be used for switching thin-film transistors that maintain short on-time and long off-time. However, this specification is not limited to this. Depending on the characteristics of the display device 100, oxide semiconductor materials can also be used in thin-film drive transistors DT. Furthermore, since oxide semiconductor materials have low cutoff current and can reduce the amount of auxiliary capacitance, oxide semiconductor materials are suitable for high-resolution display elements. For example, the active layer ACT can be made of metal oxide. For example, the active layer ACT can be made of various metal oxides such as indium gallium zinc oxide (IGZO), indium zinc oxide (IZO), indium gallium tin oxide (IGTO), or indium gallium oxide (IGO).

[0064] The gate insulating layer 112 can be disposed on the active layer ACT. The gate insulating layer 112 can be made of an inorganic insulating material, such as silicon oxide (SiOx), silicon nitride (SiNx), or multiple layers thereof.

[0065] Furthermore, the gate electrode GE of the driving transistor DT can be disposed on the gate insulating layer 112. The gate electrode GE is disposed on the gate insulating layer 112 and overlaps with the active layer ACT. The gate electrode GE can be made of various conductive materials, for example, any one selected from the group consisting of magnesium (Mg), aluminum (Al), nickel (Ni), chromium (Cr), molybdenum (Mo), tungsten (W), gold (Au), titanium (Ti), neodymium (Nd), and copper (Cu), or alloys thereof. However, this specification is not limited thereto.

[0066] The interlayer insulating layer 113 can be configured to cover the gate electrode GE. The interlayer insulating layer 113 can be made of inorganic or organic insulating materials. For example, the interlayer insulating layer 113 can be made of silicon oxide (SiOx), silicon nitride (SiNx), or multiple layers thereof.

[0067] The source electrode SE and drain electrode DE of the driving transistor DT can be disposed on the interlayer insulating layer 113.

[0068] The source electrode SE and drain electrode DE can be connected to one side and the other side of the active layer ACT, respectively, through contact holes provided in the interlayer insulating layer 113 and the gate insulating layer 112. The source electrode SE and drain electrode DE can each be made of various conductive materials, such as any one selected from the group consisting of magnesium (Mg), aluminum (Al), nickel (Ni), chromium (Cr), molybdenum (Mo), tungsten (W), gold (Au), titanium (Ti), neodymium (Nd), and copper (Cu), or alloys thereof. However, this specification is not limited thereto.

[0069] The portion of the active layer ACT that overlaps with the gate electrode GE is the channel region. One of the source electrode SE and the drain electrode DE is connected to one side of the channel region of the active layer ACT, and the other of the source electrode SE and the drain electrode DE is connected to the other side of the channel region of the active layer ACT.

[0070] Passivation layer 114 can be disposed on the source electrode SE and the drain electrode DE. Passivation layer 114 can be used to protect the drive transistor DT and can be configured as an inorganic layer, such as silicon oxide (SiOx), silicon nitride (SiNx) or multiple layers thereof.

[0071] The planarization layer PLN can be located above the transistor layer TRL.

[0072] The planarization layer PLN may include a first planarization layer 115a and a second planarization layer 115b. The planarization layer PLN protects the driving transistor DT and planarizes the upper part of the driving transistor DT.

[0073] The first planarization layer 115a can be disposed on the passivation layer 114.

[0074] The connecting electrode CE can be disposed on the first planarization layer 115a.

[0075] The connecting electrode CE can be connected to one of the source electrode SE and the drain electrode DE through a contact hole provided in the first planarization layer 115a.

[0076] The second planarization layer 115b can be disposed on the connecting electrode CE.

[0077] The light-emitting element layer (EDL) can be located above the second planarization layer 115b.

[0078] The layered structure of the light-emitting element layer (EDL) will be described in detail below.

[0079] Multiple light-emitting elements (EDs) can be disposed in multiple sub-pixels (SPs) on the substrate 110, and each includes an anode (E1), a light-emitting layer (EL), and a cathode (E2). The anode (E1) can be disposed on the second planarization layer 115b. In this case, the anode (E1) can be electrically connected to the connecting electrode (CE) through a contact hole disposed in the second planarization layer 115b. The anode (E1) can be made of a metallic material.

[0080] In the case where the display device 100 is a top-emitting type display device in which light emitted from the light-emitting element ED propagates toward the upper side of the substrate 110 on which the light-emitting element ED is disposed, the anode E1 may further include a transparent conductive layer and a reflective layer disposed below the transparent conductive layer. For example, the transparent conductive layer may be made of a transparent conductive oxide such as ITO or IZO. For example, the reflective layer may be made of silver (Ag), aluminum (Al), gold (Au), molybdenum (Mo), tungsten (W), chromium (Cr), or alloys thereof.

[0081] The partition 116a can be disposed in the display area AA and the non-display area NA, and is configured to cover the end of the anode E1. The partition 116a can be disposed on the anode E1. An opening can be made in the portion of the partition 116a corresponding to the light-emitting area of ​​the sub-pixel SP. A portion of the anode E1 can be exposed through the opening portion of the partition 116a (hereinafter referred to as the opening area). In this case, the partition 116a can be made of an inorganic insulating material such as silicon nitride (SiNx) or silicon oxide (SiOx), or an organic insulating material such as benzocyclobutene-based resin, acrylic resin, or imide-based resin. However, this specification is not limited to this.

[0082] Spacer 116b may be further disposed on barrier 116a. Spacer 116b can suppress potential damage to the light-emitting element ED when the fine metal mask (FMM) used to form the light-emitting layer EL of the light-emitting element ED comes into direct contact with barrier 116a or cathode E2. Spacer 116b may be made of the same material as barrier 116a, but may be made of an insulating material different from the insulating material of barrier 116a. However, this specification is not limited thereto. In addition, spacer 116b and barrier 116a may be integrated. When spacer 116b is disposed on barrier 116a, cathode E2 and light-emitting layer EL may be configured to cover spacer 116b and barrier 116a.

[0083] The light-emitting layer EL can be disposed in the opening region of the partition 116a. Therefore, the light-emitting layer EL can be disposed on the anode E1 exposed through the opening region of the partition 116a.

[0084] The cathode E2 can be placed on the light-emitting layer EL.

[0085] The light-emitting layer (EL) can include multiple organic layers.

[0086] The encapsulation layer ENCAP can be located above the light-emitting element layer EDL (i.e., multiple light-emitting elements ED).

[0087] The encapsulation layer ENCAP can have a single-layer or multi-layer structure. For example, the encapsulation layer ENCAP may include a first encapsulation layer 117a, a second encapsulation layer 117b, and a third encapsulation layer 117c.

[0088] In this configuration, the first encapsulation layer 117a and the third encapsulation layer 117c can each be configured as inorganic layers, and the second encapsulation layer 117b can each be configured as an organic layer. Among the first encapsulation layer 117a, the second encapsulation layer 117b, and the third encapsulation layer 117c, the second encapsulation layer 117b can be the thickest and serves as a planarization layer.

[0089] The first encapsulation layer 117a can be disposed on the cathode E2 and is closest to the light-emitting element ED. For example, the first encapsulation layer 117a can be made of silicon nitride (SiNx), silicon oxide (SiOx), silicon oxynitride (SiON), aluminum oxide (Al2O3), etc.

[0090] The second encapsulation layer 117b may have a smaller area than the first encapsulation layer 117a. In this case, the second encapsulation layer 117b may be formed to expose the two opposite ends of the first encapsulation layer 117a. The second encapsulation layer 117b may serve as a buffer layer to alleviate stress between layers. The second encapsulation layer 117b may be used to improve planarization performance.

[0091] For example, the second encapsulation layer 117b can be made of an organic insulating material such as acrylic resin, epoxy resin, polyimide, polyethylene, or silicon oxycarbon (SiOC). For example, the second encapsulation layer 117b can also be formed by inkjet printing. However, this specification is not limited thereto.

[0092] A third encapsulation layer 117c can be formed over a substrate 110 having a second encapsulation layer 117b to cover the top and side surfaces of each of the second encapsulation layer 117b and the first encapsulation layer 117a. In this case, the third encapsulation layer 117c can minimize or block external moisture or oxygen from penetrating into the first encapsulation layer 117a and the second encapsulation layer 117b. For example, the third encapsulation layer 117c can be made of an inorganic insulating material such as silicon nitride (SiNx), silicon oxide (SiOx), silicon oxynitride (SiON), or aluminum oxide (Al2O3). For example, the first encapsulation layer 117a and the third encapsulation layer 117c can be formed by a chemical vapor deposition (CVD) process, which allows deposition at low temperatures by obtaining high reaction energy from plasma.

[0093] Simultaneously, although not shown, a polarizing layer may be further disposed on the encapsulation layer ENCAP. The polarizing layer suppresses the reflection of external light in the display area AA of the substrate 110. When the display device 100 is used externally, external natural light may be introduced and reflected by a reflective layer included in the anode E1 of the light-emitting element ED, or reflected by an electrode made of metal and disposed on the lower part of the light-emitting element ED. The reflected light beams as described above may suppress the visual recognition of the image on the display device 100. The polarizing layer can polarize the light introduced from the outside in a specific direction, thereby suppressing the reflected light from being emitted to the outside of the display device 100 again.

[0094] Although not shown, the cover glass can be bonded to the polarizing layer via a bonding layer. The bonding layer can be used to bond components of the display device 100. For example, the bonding layer can be formed using an adhesive for optically transparent displays, such as a pressure-sensitive adhesive, an optically transparent adhesive (optically transparent adhesive (OCR)), or an optically transparent resin (optically transparent resin (OCR)). However, this specification is not limited thereto.

[0095] The cover glass can protect the components of the display device 100 from external impacts and inhibit damage such as scratches.

[0096] Figures 3A to 3C yes Figure 1 An enlarged top-view plan of region B in the diagram. Figure 4 It is along Figure 3AThe cross-sectional view taken from line C-C' in the diagram. Figures 3A to 3C This is a top view used to explain the arrangement of the second power line PL2, the third power line PL3, the partition 116a, and the cathode E2 located in the first non-display area NA1. For ease of description, Figure 3A Only the third power line PL3, the partition 116a, and the cathode E2 among the various components of the display device 100 are shown. Figure 3B Only the third power line PL3 and the partition 116a among the various components of the display device 100 are shown. Figure 3C Only the second power line PL2 and the third power line PL3 are shown. Figure 4 This is a cross-sectional view of the first non-display area NA1 of the display device 100 according to an embodiment of this specification. (The following is a partial translation of the original text: "From...") Figure 4 The middle ellipsis is the opposite of the middle ellipsis. Figure 2 The components shown are essentially the same, and are described repeatedly. The same reference numerals are used for the same parts.

[0097] refer to Figures 3A to 4 A substrate 110, a first power line PL1, a second power line PL2, a third power line PL3, a cathode E2, multiple dams DAM, a passivation layer 114, a first planarization layer 115a, a second planarization layer 115b, a partition 116a, a spacer 116b, and an encapsulation layer ENCAP are disposed in a first non-display area NA1 between the display area AA and the curved area BA. Meanwhile, Figure 4 This illustration shows that no other insulating layer or electrode is provided between the substrate 110 and the passivation layer 114. However, various insulating layers or electrodes provided in the display area AA may be further provided between the substrate 110 and the passivation layer 114. However, this specification is not limited thereto.

[0098] refer to Figure 3A , Figure 3B and Figure 4 Multiple dam sections DAM are set in the first non-display area NA1 and surround the display area AA.

[0099] Multiple dam section DAMs may include a first dam section DAM1 and a second dam section DAM2. For example, the first dam section DAM1 and the second dam section DAM2 may be configured to overlap with the second power line PL2 and the third power line PL3, but not with the first planarization layer 115a.

[0100] For example, multiple dammed areas (DAMs) can block the flow of the organic layer, that is, the flow of the second encapsulation layer 117b constituting the encapsulation layer ENCAP. Specifically, the multiple dammed areas (DAMs) can be arranged in a closed curve shape in the first non-display area NA1 and surround the display area AA. Therefore, when the second encapsulation layer 117b is applied to the display area AA, the second encapsulation layer 117b made of organic insulating material can inhibit the flow of the second encapsulation layer 117b in the direction of the first non-display area NA1 and into the pad portion.

[0101] Multiple dam section DAMs can have a predetermined height or higher to block the flow of the second encapsulation layer 117b. For this purpose, the multiple dam section DAMs can be configured from one or more layers made of at least an organic material. However, this specification is not limited to this. For example, the multiple dam section DAMs can be made of the same material as the second planarization layer 115b, the dike 116a, and the spacer 116b. However, this specification is not limited to this. In this case, multiple dam section DAMs can be configured without adding a mask process and increasing costs.

[0102] refer to Figure 4 The first power line PL1 can be disposed in the first non-display area NA1 and on the substrate 110. The first power line PL1 can be spaced apart from the plurality of dams DAM. For example, a first power supply, i.e., a high potential voltage, can be supplied to the sub-pixels SP of the display device 100 through the first power line PL1. In this case, the first power line PL1 can be disposed on the same layer as the source electrode SE or drain electrode DE disposed in the display area AA and made of the same material. However, this specification is not limited thereto.

[0103] The passivation layer 114 and the first planarization layer 115a can be configured to cover the first power line PL1. In the display area AA and the first non-display area NA1 between the plurality of dams DAM, a plurality of contact holes for exposing the first power line PL1 can be formed in the passivation layer 114 and the first planarization layer 115a.

[0104] In the display area AA and the first non-display area NA1 between multiple dam sections DAM, the second power line PL2 can be disposed on the first planarization layer 115a. (See reference) Figure 3C The second power line PL2 can extend from the first non-display area NA1 between the display area AA and the bending area BA to the outside of the plurality of dam sections DAM, and overlap with the plurality of dam sections DAM. However, this specification is not limited thereto. For example, the second power line PL2 can overlap with the first dam section DAM1 and the second dam section DAM2 in the first non-display area NA1 between the display area AA and the bending area BA.

[0105] The second power line PL2 can be connected to the first power line PL1 through multiple contact holes in the passivation layer 114 and the first planarization layer 115a disposed in the first non-display area NA1 between the display area AA and the curved area BA. For example, a second power supply (e.g., a low potential voltage) can be supplied to the sub-pixel SP of the display device 100 through the second power line PL2. Therefore, the second power line PL2, the third power line PL3, and the cathode E2 are electrically connected, so that the second power supply can be applied to the sub-pixel SP of the display device 100. In this case, the second power line PL2 can be disposed on the same layer as the connecting electrode CE disposed in the display area AA and made of the same material. However, this specification is not limited thereto.

[0106] At the same time, refer to Figure 3C and Figure 4 The second power line PL2 may include multiple holes. For example, gases generated during the manufacturing process from the first planarization layer 115a or the second planarization layer 115b can be easily discharged to the outside through the multiple holes.

[0107] The second planarization layer 115b can be disposed on the second power line PL2 to cover the second power line PL2 in the first non-display area NA1 between the display area AA and the curved area BA.

[0108] The third power line PL3 may be disposed on at least a portion of the second planarization layer 115b in the first non-display area NA1 between the display area AA and the curved area BA.

[0109] For example, the third power line PL3 can be configured to overlap with the first dam section DAM1 and the second dam section DAM2 in the first non-display area NA1 between the display area AA and the curved area BA. In this case, the third power line PL3 can be disposed on the same layer as the anode E1 disposed in the display area AA and made of the same material.

[0110] At the same time, refer to Figures 3A to 3C The third power line PL3 may include a first part PL3a and a second part PL3b.

[0111] The first portion PL3a of the third power line PL3 is the portion that overlaps with multiple dam sections DAM. The first portion PL3a can be configured to overlap with at least a portion of the display area AA. The first portion PL3a is configured to overlap with the first dam section DAM1 and the second dam section DAM2. The first portion PL3a can be positioned along at least a portion of the first dam section DAM1 and at least a portion of the second dam section DAM2 in the plan view, and is configured in a shape that surrounds at least a portion of the display area AA.

[0112] At the same time, refer to Figure 3A , Figure 3B and Figure 4 The side surface of the first portion PL3a opposite to the inner side of the display device 100 is configured to overlap with the first dam portion DAM1, and the side surface of the first portion PL3a opposite to the outer side of the display device 100 is configured to overlap with the second dam portion DAM2. Furthermore, refer to... Figure 3A and Figure 3B The side surfaces of the first portion PL3a that do not overlap with the first dam section DAM1 and the second dam section DAM2 may overlap with the connecting portion CP, which is the portion of the dike 116a that extends from and connects to each other in the first dam section DAM1 and the second dam section DAM2, respectively. Therefore, all side surfaces of the first portion PL3a may be configured to be at least covered by the dike 116a.

[0113] The second part of the third power line PL3, PL3b, extends from the first part PL3a toward the display area AA. For example, as... Figure 3C As shown, the second part PL3b can protrude from the first part PL3a and has a polygonal shape in the plan view. However, this specification is not limited thereto.

[0114] refer to Figures 3A to 3C The second part PL3b may include multiple holes. For example, gases generated during the manufacturing process from the second planarization layer 115b or the dike 116a can be easily discharged to the outside through the multiple holes.

[0115] refer to Figure 3A and Figure 3B The second portion PL3b of the third power line PL3 can be the portion that contacts and is electrically connected to the cathode E2. For example, a contact hole CH for exposing the third power line PL3 can be formed in the partition 116a that overlaps with the second portion PL3b. Therefore, the second portion PL3b of the third power line PL3 can be electrically connected to the cathode E2 through the contact hole CH formed in the partition 116a, and a second power supply as a low potential voltage can be supplied to the cathode E2.

[0116] Dike 116a may be disposed on at least a portion of the second planarization layer 115b and at least a portion of the third power line PL3 in the first non-display area NA1 between the display area AA and the curved area BA.

[0117] refer to Figures 3A to 4 The partition 116a, which is set in the first non-display area NA1 between the display area AA and the curved area BA, includes a plurality of first opening portions OP1 and second opening portions OP2.

[0118] Multiple first opening portions OP1 can be areas formed by opening the dike 116a, and can expose a portion of the third power line PL3. For example... Figure 3A , Figure 3B and Figure 4 As shown, multiple first opening portions OP1 can be arranged along multiple dam sections DAM. The multiple first opening portions OP1 can be configured to surround at least a portion of the display area AA. The multiple first opening portions OP1 can be configured such that a first portion PL3a surrounds at least a portion of the display area AA. For example, the multiple first opening portions OP1 can be areas formed by removing the dike 116a from the outer portion of the multiple dam sections DAM.

[0119] refer to Figure 3A , Figure 3B and Figure 4 Multiple first opening portions OP1 can be located inside the first dam section DAM1, between the first dam section DAM1 and the second dam section DAM2, and outside the second dam section DAM2.

[0120] In this configuration, at least a portion of the first opening OP1 may overlap with the first portion PL3a of the third power line PL3. The portion of the first opening OP1 located inside the first dam section DAM1 and the portion of the first opening OP1 located between the first dam section DAM1 and the second dam section DAM2 may overlap with the third power line PL3. Furthermore, the first opening OP1 located outside the second dam section DAM2 may not overlap with the third power line PL3. However, this specification is not limited thereto.

[0121] At the same time, refer to Figure 3A and Figure 3B The connecting portion CP is disposed on the portion of the dike 116a that overlaps with the end of the first portion PL3a. The connecting portion CP is the area between the plurality of first opening portions OP1, that is, the portion of the first portion PL3a that is not exposed by the plurality of first opening portions OP1. Because the connecting portion CP is provided, the first opening portions OP1 do not need to be disposed at the end of the first portion PL3a. Therefore, the plurality of first opening portions OP1 do not need to expose the end (side surface) of the first portion PL3a of the third power line PL3. At the same time, the connecting portion CP can be a portion of the dike 116a that extends from and connects to each other, including the first dam section DAM1 and the second dam section DAM2.

[0122] The second opening OP2 can be an area formed by opening the partition 116a, and can expose a portion of the third power line PL3. The second opening OP2 is a portion extending from the first opening OP1 and disposed along the side surface of the second portion PL3b of the third power line PL3. The second opening OP2 is a portion disposed and extending from the first opening OP1 along the side surface of the second portion PL3b. The second opening OP2 can extend from the first opening OP1 toward the display area AA.

[0123] At the same time, refer to Figure 3A and Figure 3B The second opening portion OP2 includes a first sub-opening portion OP2a and a second sub-opening portion OP2b.

[0124] The first sub-opening OP2a of the second opening OP2 may be a portion that overlaps with the second portion PL3b and has a linear shape. The first sub-opening OP2a is configured to expose the second portion PL3b.

[0125] refer to Figure 3B The first sub-opening portion OP2a can be connected to the contact hole CH formed in the partition 116a to electrically connect the second portion PL3b of the third power line PL3 to the cathode E2. Therefore, the first sub-opening portion OP2a can increase the contact area between the second portion PL3b of the third power line PL3 and the cathode E2, and reduce the contact resistance between the third power line PL3 and the cathode E2.

[0126] The second sub-opening OP2b of the second opening portion OP2 can be a line-shaped portion that does not overlap with the second portion PL3b. The second sub-opening OP2b can be set to be spaced apart from the second portion PL3b.

[0127] refer to Figure 3B The ends of the first sub-opening portion OP2a and the second sub-opening portion OP2b can be connected to each other. That is, the innermost first opening portion OP1 among the first sub-opening portion OP2a, the second sub-opening portion OP2b, and the plurality of first opening portions OP1 can be arranged in a closed curve shape around the display area AA. In other words, the partition 116a can be separated and respectively arranged inside and outside the closed curve formed by the first sub-opening portion OP2a, the second sub-opening portion OP2b, and the first opening portion OP1.

[0128] At the same time, refer to Figure 3B A portion of the side surface of the third power line PL3 may be exposed from the dike 116a at the point where the ends of the first sub-opening portion OP2a and the second sub-opening portion OP2b are connected.

[0129] The first encapsulation layer 117a extending from the display area AA may be disposed on the partition 116a, a portion of the third power line PL3, the first dam section DAM1, and the second dam section DAM2 in the first non-display area NA1 between the display area AA and the curved area BA.

[0130] The first encapsulation layer 117a extending from the display area AA can be disposed on the first dam section DAM1 and the second dam section DAM2 in the first non-display area NA1 between the display area AA and the curved area BA.

[0131] The second encapsulation layer 117b, made of organic insulating material, may be located only inside the first dam section DAM1 in the first non-display area NA1 between the display area AA and the curved area BA.

[0132] Furthermore, in the first non-display area NA1 between the display area AA and the curved area BA, a third encapsulation layer 117c extending from the display area AA can be disposed on the substrate 110 on which the second encapsulation layer 117b is disposed, and covers the top and side surfaces of the first encapsulation layer 117a and the second encapsulation layer 117b. The second encapsulation layer 117b can minimize the penetration of external moisture or oxygen into the first encapsulation layer 117a and the third encapsulation layer 117c.

[0133] At the same time, refer to Figures 3A to 4 The ends a of the first encapsulation layer 117a and the third encapsulation layer 117c are disposed outside the plurality of first opening portions OP1 and spaced apart from the plurality of first opening portions OP1. Therefore, the region in which the ends a of the first encapsulation layer 117a and the third encapsulation layer 117c are formed (i.e., the region in which the edges of the opening portions of the mask for forming the first encapsulation layer 117a and the third encapsulation layer 117c are disposed) can be configured to be spaced apart from the portion of the third power line PL3 exposed from the plurality of first opening portions OP1.

[0134] For example, chemical vapor deposition (CVD) can be used to form multiple inorganic encapsulation layers among the components of an encapsulation layer in a display device. CVD has the advantage of allowing deposition at low temperatures by obtaining high reaction energy from plasma.

[0135] However, during the formation of multiple inorganic encapsulation layers using chemical vapor deposition (CVD), an alignment process can be performed to precisely align the mask used to pattern the multiple inorganic encapsulation layers. In this case, the mask is moved to various positions by means of a motor or the like. During this process, multiple electrons may be induced by static electricity at the ends of the mask made of a metal such as Invar (i.e., the ends of the opening portion of the mask corresponding to the ends of the multiple inorganic encapsulation layers).

[0136] Furthermore, in the case of chemical vapor deposition using plasma, electrons induced at the ends of the openings in the mask may gain high reaction energy from the plasma, and therefore, a strong current may be emitted from the ends of the mask. Consequently, due to the strong current, burnt defects may occur in the components of the display device adjacent to the openings of the mask used to form multiple inorganic encapsulation layers.

[0137] Meanwhile, in the constituent elements of the light-emitting element, the anode may include multiple layers, including a reflective layer and multiple conductive layers. Therefore, multiple patterning processes are performed during the manufacturing of the anode, and as a result, residual films of multiple photoresists used in the patterning processes may remain on the anode and on the side surfaces of the constituent elements on the same layer as the anode. These residual photoresist films may become vulnerable points when burn-out defects occur. Therefore, the anode and the side surfaces of the constituent elements disposed on the same layer as the anode can be covered by a dike or similar material made of a non-polar organic insulating material with excellent insulating properties, thereby protecting the anode and the side surfaces of the constituent elements disposed on the same layer as the anode from the strong currents that could lead to burn-out defects.

[0138] Meanwhile, since the dike is made of an organic insulating material with low resistance to moisture penetration, the dike extending from the non-display area to the display area may act as a moisture penetration path, through which moisture generated in the non-display area can propagate to the display area. Therefore, the dike is also configured to have an opening area with a closed curve shape along multiple dam sections surrounding the display area, thereby separating the dikes located in the non-display area and the display area and minimizing moisture penetration into the display area via the dike.

[0139] However, when the barrier has an opening region with a closed curve shape surrounding the display area, the power lines disposed on the same layer as the anode in the power lines configured to transmit low potential voltage from the non-display area to the cathode are at least partially and necessarily exposed from the barrier. In this case, since the portion of the power lines exposed from the barrier cannot be protected by the barrier during the chemical vapor deposition process of forming multiple inorganic encapsulation layers, burn-out defects may occur, where the power lines exposed from the barrier are damaged by strong current during the chemical vapor deposition process.

[0140] Therefore, the area of ​​the opening in the barrier in the non-display area (which corresponds to the side surface of the power line on the same layer as the anode) is not opened, so that the side surface of the power line can be protected from burn-out defects. However, since a portion of the opening in the barrier is not opened, additional problems may occur where moisture penetrates and propagates from the non-display area to the display area through the unopened portion of the barrier.

[0141] In the display device 100 according to an embodiment of this specification, the first sub-opening portion OP2a and the second sub-opening portion OP2b of the partition 116a extend along the side surface of the second portion PL3b of the third power line PL3, such that the partition 116a can protect the side surface of the third power line PL3 in areas susceptible to burn-out defects.

[0142] In the display device 100 according to an embodiment of this specification, the partition 116a includes a first sub-opening portion OP2a and a second sub-opening portion OP2b extending from the first opening portion OP1 along the side surface of the second portion PL3b of the third power line PL3. That is, the first sub-opening portion OP2a and the second sub-opening portion OP2b can extend toward the display area AA. The ends of the first sub-opening portion OP2a and the ends of the second sub-opening portion OP2b can be connected to each other. Using the above structure, the portion of the third power line PL3 exposed from the partition 116a can be configured not to be adjacent to the region forming the end a of the first encapsulation layer 117a and the third encapsulation layer 117c (i.e., the region susceptible to burn-in defects). Therefore, the partition 116a can be configured to protect all side surfaces of the third power line PL3 in the region adjacent to the region forming the end a of the first encapsulation layer 117a and the third encapsulation layer 117c. Therefore, in the display device 100 according to the embodiments of this specification, the first sub-opening portion OP2a and the second sub-opening portion OP2b of the partition 116a extend along the side surface of the second portion PL3b of the third power line PL3, so that the partition 116a can be configured to protect the side surface of the third power line PL3 and protect the third power line PL3 in the area susceptible to burn-out defects, thereby improving the reliability of the display device 100.

[0143] In the display device 100 according to an embodiment of this specification, the ends of the first sub-opening portion OP2a and the second sub-opening portion OP2b of the dike 116a can be connected to each other, thereby minimizing the propagation of moisture through the dike 116a.

[0144] In the display device 100 according to an embodiment of this specification, the partition 116a includes a first sub-opening portion OP2a and a second sub-opening portion OP2b extending from the first opening portion OP1 along the side surface of the second portion PL3b of the third power line PL3. The ends of the first sub-opening portion OP2a and the ends of the second sub-opening portion OP2b can be connected to each other. That is, the first sub-opening portion OP2a, the second sub-opening portion OP2b, and the innermost first opening portion OP1 among the plurality of first opening portions OP1 can be arranged in a closed curve shape around the display area AA. Therefore, even if moisture permeates through the partition 116a provided outside the closed curve formed by the first sub-opening portion OP2a, the second sub-opening portion OP2b, and the first opening portion OP1, the moisture permeation will not propagate to the partition 116a provided inside the closed curve. Therefore, in the display device 100 according to the embodiment of this specification, the ends of the first sub-opening portion OP2a and the second sub-opening portion OP2b of the partition 116a can be connected to each other, thereby minimizing the propagation of moisture penetration through the partition 116a and improving the display quality of the display device 100.

[0145] Figure 5 This is an enlarged top view of a display device 500 according to another embodiment of this specification. Figure 5 The display device 500 in Figures 1 to 4 The only difference between the display device 100 and the one in the figure is the second opening portion OP2 in the partition 516a. Therefore, repeated descriptions of substantially the same parts will be omitted. The same reference numerals are used for the same parts.

[0146] refer to Figure 5 Dike 516a includes multiple first opening portions OP1 and second opening portions OP2. The second opening portion OP2 includes a first sub-opening portion OP2a and a second sub-opening portion OP2b.

[0147] refer to Figure 5The first sub-opening portion OP2a and the second sub-opening portion OP2b can be configured to be spaced apart from each other. For example, the first sub-opening portion OP2a of the second opening portion OP2 can be a portion that overlaps with the second portion PL3b and has a linear shape. The first sub-opening portion OP2a is configured to expose the second portion PL3b. The second sub-opening portion OP2b of the second opening portion OP2 can be a portion that has a linear shape and does not overlap with the second portion PL3b. The second sub-opening portion OP2b can be configured to be spaced apart from the second portion PL3b. Therefore, since the first sub-opening portions OP2a and the second sub-opening portions OP2b are configured to be spaced apart from each other, the plurality of first opening portions OP1 and second opening portions OP2 of the partition 516a can be configured not to expose the side surface of the third power line PL3 disposed below the partition 516a.

[0148] In a display device 500 according to another embodiment of this specification, a first sub-opening portion OP2a and a second sub-opening portion OP2b of a partition 516a extend along the side surface of the second portion PL3b of a third power line PL3 and are spaced apart from each other, such that the partition 516a can protect the side surface of the third power line PL3 in areas susceptible to burn-out defects.

[0149] In a display device 500 according to another embodiment of this specification, a partition 516a includes a first sub-opening portion OP2a and a second sub-opening portion OP2b extending from a first opening portion OP1 along the side surface of a second portion PL3b of a third power line PL3. That is, the first sub-opening portion OP2a and the second sub-opening portion OP2b can extend toward the display area AA. The first sub-opening portion OP2a and the second sub-opening portion OP2b can be spaced apart from each other. Using the above structure, the third power line PL3 can be configured such that its side surface is not exposed in the region where the ends a of the first encapsulation layer 117a and the third encapsulation layer 117c are formed (i.e., the region susceptible to burn-in defects). That is, the plurality of first opening portions OP1 and second opening portions OP2 of the partition 516a can be configured not to expose the side surfaces of the third power line PL3 disposed below the partition 516a. Therefore, the partition 516a can be configured to protect all side surfaces of the third power line PL3 in the region adjacent to the region where the ends a of the first encapsulation layer 117a and the third encapsulation layer 117c are formed. Therefore, in a display device 500 according to another embodiment of this specification, the first sub-opening portion OP2a and the second sub-opening portion OP2b of the partition 516a extend along the side surface of the second portion PL3b of the third power line PL3 and are spaced apart from each other, so that the partition 516a can protect the side surface of the third power line PL3 in areas susceptible to burn-out defects, thereby improving the reliability of the display device 500.

[0150] Figure 6A and Figure 6B This is an enlarged top view of a display device 600 according to yet another embodiment of this specification. Figure 6A and Figure 6B The display device 600 in Figures 1 to 4 The only difference between the display device 100 and the recess DP and the second opening portion OP2 in the partition 616a is that they are identical. Therefore, repeated descriptions of substantially the same parts will be omitted. The same reference numerals are used for the same parts.

[0151] refer to Figure 6A and Figure 6B The third power line PL3 includes a recess DP. The third power line PL3 includes a recess DP that extends inwardly from the side surface of the second portion PL3b adjacent to the first portion PL3a. For example... Figure 6B As shown, the recess DP can be a portion formed by removing a part of the third power line PL3.

[0152] refer to Figure 6A and Figure 6B The second opening portion OP2 of the partition 616a is provided in the recess DP on the side surface of the second portion PL3b. In this case, the second opening portion OP2 is set to be spaced apart from the recess DP. Therefore, the second opening portion OP2 can be configured not to expose the side surface of the third power line PL3.

[0153] Meanwhile, because the second opening portion OP2 is located in the recess DP of the second portion PL3b, the length of the path for moisture penetration from the connecting portion CP to the display area AA can be increased by increasing the length of the second opening portion OP2 located in the recess DP of the partition 616a. Therefore, the second opening portion OP2 can be located in the recess DP of the second portion PL3b, thereby minimizing the propagation of moisture penetration to the display area AA via the connecting portion CP in the partition 616a.

[0154] In a display device 600 according to another embodiment of this specification, the third power line PL3 includes a recess DP, and a second opening portion OP2 of the partition 616a is disposed in the recess DP and spaced apart from the recess DP, such that the partition 616a can protect the side surface of the third power line PL3 in areas susceptible to burn-out defects.

[0155] In a display device 600 according to another embodiment of this specification, the third power line PL3 includes a recess DP extending inwardly from the side surface of the second portion PL3b adjacent to the first portion PL3a. Furthermore, a second opening portion OP2 of the partition 616a is disposed on the side surface of the second portion PL3b, disposed within the recess DP, and spaced apart from the recess DP. Therefore, the second opening portion OP2 can be configured not to expose the side surface of the third power line PL3. Using the above structure, the third power line PL3 can be configured such that its side surface is not exposed in the region where the first encapsulation layer 117a and the third encapsulation layer 117c form the end a (i.e., the region susceptible to burn-in defects). In other words, the plurality of first opening portions OP1 and second opening portions OP2 of the partition 616a can be configured not to expose the side surface of the third power line PL3 disposed below the partition 616a. Therefore, the barrier 616a can be configured to protect all side surfaces of the third power line PL3 in a region adjacent to the region where the first encapsulation layer 117a and the third encapsulation layer 117c are formed. In a display device 600 according to another embodiment of this specification, the third power line PL3 includes a recess DP, and a second opening portion OP2 of the barrier 616a is disposed in and spaced apart from the recess DP, such that the barrier 616a can protect the side surfaces of the third power line PL3 in areas susceptible to burn-in defects, thereby improving the reliability of the display device 600.

[0156] Figure 7 This is an enlarged top view of a display device 700 according to another embodiment of this specification. Figure 7 The display device 700 in Figures 1 to 4 The only difference between the display device 100 and the one in the figure is that the third power line PL3 further includes a third part PL3c. Therefore, repeated descriptions of substantially the same components will be omitted. The same reference numerals are used for the same components.

[0157] refer to Figure 7 The third power line PL3 further includes multiple third portions PL3c. These multiple third portions PL3c are spaced apart from the second portion PL3b. The multiple third portions PL3c extend in a first direction toward the display area AA. All of the multiple third portions PL3c may extend straight in the same first direction.

[0158] refer to Figure 7The innermost first opening OP1 among the plurality of first openings OP1 of the dike 716a is configured to be spaced apart from and surround the plurality of third portions PL3c. Therefore, the plurality of third portions PL3c may not overlap with the innermost first opening OP1. That is, the plurality of third portions PL3c may not be exposed from the dike 716a.

[0159] In a further embodiment of the display device 700 according to this specification, the third power line PL3 further includes a plurality of third portions PL3c, and the first opening portion OP1 is configured to be spaced apart from and surround the plurality of third portions PL3c, thereby further minimizing the propagation of moisture penetration via the dike 716a.

[0160] In a further embodiment of the display device 700 according to this specification, the third power line PL3 further includes a plurality of third portions PL3c. The plurality of third portions PL3c extend in a first direction toward the display area AA. Furthermore, the innermost of the plurality of first opening portions OP1 of the partition 716a is configured to be spaced apart from and surround the plurality of third portions PL3c. Therefore, the plurality of third portions PL3c may not be exposed from the partition 716a. Using the above structure, the length of the path for moisture penetration from the connecting portion CP to the display area AA can be increased by increasing the length of the edges of the plurality of third portions PL3c. Therefore, the propagation of moisture penetration to the display area AA via the connecting portion CP in the partition 716a can be minimized. Therefore, in a further embodiment of the display device 700 according to this specification, the third power line PL3 further includes a plurality of third portions PL3c, and the first opening portion OP1 is configured to be spaced apart from and surround the plurality of third portions PL3c, thereby further minimizing the propagation of moisture penetration through the dike 716a and further improving the display quality of the display device 700.

[0161] Figure 8 This is an enlarged top view of a display device 800 according to yet another embodiment of this specification. Figure 8 The display device 800 in Figure 7 The only difference between the display device 700 and the one described herein is the third part, PL3c. Therefore, repeated descriptions of substantially the same components will be omitted. The same reference numerals are used for the same components.

[0162] refer to Figure 8 The third power line PL3 has multiple third portions PL3c extending in a first direction and a second direction intersecting the first direction. For example, the shape defined by the multiple third portions PL3c can be '+' shaped. However, this specification is not limited to this.

[0163] refer to Figure 8 The innermost first opening OP1 among the plurality of first openings OP1 of the dike 816a is configured to be spaced apart from and surround the plurality of third portions PL3c. Therefore, the plurality of third portions PL3c may not overlap with the innermost first opening OP1. That is, the plurality of third portions PL3c may not be exposed from the dike 816a.

[0164] In a further embodiment of the display device 800 according to this specification, a plurality of third portions PL3c extend in a first direction and a second direction intersecting the first direction, and a first opening portion OP1 is configured to be spaced apart from and surround the plurality of third portions PL3c, thereby further minimizing the propagation of moisture penetration via the dike 816a.

[0165] In yet another embodiment of the display device 800 according to this specification, the third power line PL3 further includes a plurality of third portions PL3c. The plurality of third portions PL3c extend in a first direction and a second direction intersecting the first direction. The shape defined by the plurality of third portions PL3c can be '+' shaped. Furthermore, the innermost first opening portion OP1 of the plurality of first opening portions OP1 of the partition 816a is configured to be spaced apart from and surround the plurality of third portions PL3c. Therefore, the plurality of third portions PL3c may not be exposed from the partition 816a. With the above structure, the length of the path for moisture penetration from the connecting portion CP to the display area AA can be increased by increasing the length of the edges of the plurality of third portions PL3c. Therefore, the propagation of moisture penetration to the display area AA via the connecting portion CP in the partition 816a can be minimized. Therefore, in a further embodiment of the display device 800 according to this specification, a plurality of third portions PL3c extend in a first direction and a second direction intersecting the first direction, and a first opening portion OP1 is configured to be spaced apart from and surround the plurality of third portions PL3c, thereby further minimizing the propagation of moisture penetration through the dike 816a and further improving the display quality of the display device 800.

[0166] Figure 9 This is an enlarged top view of a display device 900 according to a further embodiment of this specification. Figure 9 The display device 900 in Figure 7 The only difference between the display device 700 and the one described herein is the third part, PL3c. Therefore, repeated descriptions of substantially the same components will be omitted. The same reference numerals are used for the same components.

[0167] refer to Figure 9The third power line PL3 has multiple third portions PL3c extending in a first direction and a second direction intersecting the first direction. For example, the shape defined by the multiple third portions PL3c can be 'T' shaped. However, this specification is not limited thereto.

[0168] refer to Figure 9 The innermost first opening OP1 among the plurality of first openings OP1 of the dike 916a is configured to be spaced apart from and surround the plurality of third portions PL3c. Therefore, the plurality of third portions PL3c may not overlap with the innermost first opening OP1. That is, the plurality of third portions PL3c may not be exposed from the dike 916a.

[0169] In a further embodiment of the display device 900 according to this specification, a plurality of third portions PL3c extend in a first direction and a second direction intersecting the first direction, and a first opening portion OP1 is configured to be spaced apart from and surround the plurality of third portions PL3c, thereby further minimizing the propagation of moisture penetration via the dike 916a.

[0170] In a further embodiment of the display device 900 according to this specification, the third power line PL3 further includes a plurality of third portions PL3c. The plurality of third portions PL3c extend in a first direction and a second direction intersecting the first direction. For example, the shape defined by the plurality of third portions PL3c can be 'T'-shaped. Furthermore, the innermost first opening OP1 among the plurality of first openings OP1 of the partition 916a is configured to be spaced apart from and surround the plurality of third portions PL3c. Therefore, the plurality of third portions PL3c may not be exposed from the partition 916a. Using the above structure, the length of the path for moisture penetration from the connecting portion CP to the display area AA can be increased by increasing the length of the edges of the plurality of third portions PL3c. Therefore, the propagation of moisture penetration to the display area AA via the connecting portion CP in the partition 916a can be minimized. Therefore, in a further embodiment of the display device 900 according to this specification, a plurality of third portions PL3c extend in a first direction and a second direction intersecting the first direction, and a first opening portion OP1 is configured to be spaced apart from and surround the plurality of third portions PL3c, thereby further minimizing the propagation of moisture penetration via the dike 916a and further improving the display quality of the display device 900.

[0171] Figure 10 This is an enlarged top view of a display device 1000 according to another further embodiment of this specification. Figure 10 The display device 1000 in Figure 7The only difference between the display device 700 and the one in the figure is the first opening portion OP1. Therefore, repeated descriptions of substantially the same parts will be omitted. The same reference numerals are used for the same parts.

[0172] refer to Figure 10 The third power line PL3 further includes multiple third portions PL3c. These multiple third portions PL3c are spaced apart from the second portion PL3b. The multiple third portions PL3c extend toward the display area AA in a first direction. All of the multiple third portions PL3c may extend straight in the same first direction.

[0173] refer to Figure 10 The innermost first opening OP1 among the plurality of first openings OP1 of the dike 1016a is positioned to be spaced apart from and surround the plurality of third portions PL3c. Furthermore, the first opening OP1 among the plurality of first openings OP1 that overlaps with the first portion PL3a is positioned and extends to overlap with the third portion PL3c. Therefore, for example, the dike 1016a positioned between the plurality of first openings OP1 can have a wavy shape.

[0174] In a further embodiment of the display device 1000 according to this specification, the third power line PL3 further includes a plurality of third portions PL3c, and the first opening portion OP1 is configured to have a wavy shape, thereby further minimizing the propagation of moisture penetration via the dike 1016a.

[0175] In a further embodiment of the display device 1000 according to this specification, the third power line PL3 further includes a plurality of third portions PL3c. The plurality of third portions PL3c extend in a first direction toward the display area AA. Furthermore, the innermost first opening portion OP1 of the plurality of first opening portions OP1 of the partition 716a is configured to be spaced apart from and surround the plurality of third portions PL3c. In this case, the first opening portion OP1 overlapping with the first portion PL3a is configured and extends to overlap with the third portion PL3c. Therefore, for example, the partition 1016a disposed between the plurality of first opening portions OP1 can have a wavy shape. Using the above structure, the length of the path for moisture penetration from the connecting portion CP to the display area AA can be increased by increasing the length of the wavy shape. Therefore, the propagation of moisture penetration to the display area AA via the connecting portion CP in the partition 1016a can be minimized. Therefore, in a further embodiment of the display device 1000 according to this specification, the third power line PL3 further includes a plurality of third portions PL3c, and the first opening portion OP1 is configured to have a wavy shape, thereby further minimizing the propagation of moisture penetration through the dike 1016a and further improving the display quality of the display device 1000.

[0176] Exemplary embodiments of this disclosure can also be described as follows:

[0177] According to one aspect of this disclosure, a display device may include: a substrate comprising a display area having a plurality of sub-pixels and a non-display area configured to surround the display area; a plurality of light-emitting elements disposed in the plurality of sub-pixels on the substrate, each including an anode, a light-emitting layer, and a cathode; a dam disposed in the display area and the non-display area and configured to cover the end of the anode; a dam disposed in the non-display area on the substrate and configured to surround the display area; and a power line configured to overlap with the dam in the non-display area, disposed on the same layer as the anode, and made of the same material as the anode. The power line may include: a first portion, which is a portion overlapping the dam; and a second portion, which is a portion extending from the first portion toward the display area. The dam may include a plurality of first opening portions disposed along the dam; and a second opening portion extending from the first opening portions and disposed along the side surface of the second portion.

[0178] The dike may further include a connecting portion, which is configured to overlap with the end of the first portion among a plurality of first opening portions without exposing the end of the first portion.

[0179] The second opening portion may include: a first sub-opening portion configured to overlap with the second portion and having a linear shape; and a second sub-opening portion configured to be spaced apart from the second portion and having a linear shape.

[0180] The cathode can be electrically connected to the second part of the power line through a contact hole provided in the diaphragm.

[0181] The first sub-opening portion can be connected to the contact hole.

[0182] The ends of the first sub-opening portion and the ends of the second sub-opening portion can be connected to each other.

[0183] The first sub-opening portion and the second sub-opening portion can be set to be spaced apart from each other.

[0184] The power cord may include a recess extending inwardly from the side surface of the second portion adjacent to the first portion.

[0185] The second opening can be located in the recess.

[0186] The second opening can be set to be spaced apart from the recess of the power cord.

[0187] The power cord may further include a plurality of third portions spaced apart from the second portion and extending in a first direction toward the display area.

[0188] The innermost first opening among a plurality of first openings can be configured to be spaced apart from and surround the third portion.

[0189] All the multiple third parts can extend straight in the same first direction.

[0190] Multiple third parts can extend in the first direction and in the second direction intersecting the first direction.

[0191] The shape defined by multiple third parts can be a "T" shape or a "+" shape.

[0192] The third part may not overlap with the first opening.

[0193] One of the multiple first opening portions that overlaps with the first portion can be configured to overlap with the third portion.

[0194] The display device may further include an encapsulation layer disposed above a plurality of light-emitting elements, disposed in a portion of the display area and a portion of the non-display area, and comprising a plurality of inorganic and organic layers.

[0195] The ends of the multiple inorganic layers of the encapsulation layer can be disposed outside the multiple first opening portions and are configured to be spaced apart from the multiple first opening portions.

[0196] According to another aspect of this disclosure, a display device may include: a substrate including a display area and a non-display area; a plurality of light-emitting elements disposed in the display area on the substrate, each including an anode, a light-emitting layer, and a cathode; a partition disposed on the anode and configured to cover an end of the anode; and a power line disposed in the non-display area, disposed on the same layer as the anode, made of the same material as the anode, and electrically connected to the cathode. The power line may include: a first portion disposed in the non-display area and configured to surround at least a portion of the display area; and a second portion projecting from the first portion toward the display area. The partition may include: a plurality of first opening portions surrounding at least a portion of the display area and configured to at least partially overlap the first portions; and a second opening portion extending from the first opening portions along a side surface of the second portion.

[0197] The dike may further include a connecting portion, which is configured to overlap with the end of the first portion without exposing the end of the first portion.

[0198] The second opening portion may include: a first sub-opening portion configured to overlap with the second portion and having a linear shape; and a second sub-opening portion spaced apart from the second portion and having a linear shape.

[0199] The display device may further include an encapsulation layer disposed above a plurality of light-emitting elements, disposed in a portion of the display area and a portion of the non-display area, and comprising a plurality of inorganic and organic layers.

[0200] The ends of the multiple inorganic layers of the encapsulation layer can be disposed outside the multiple first opening portions and are configured to be spaced apart from the multiple first opening portions.

[0201] Although exemplary embodiments of the present disclosure have been described in detail with reference to the accompanying drawings, the present disclosure is not limited thereto and may be implemented in many different forms without departing from the technical concept of the present disclosure. Therefore, the exemplary embodiments of the present disclosure are for illustrative purposes only and are not intended to limit the technical concept of the present disclosure. The scope of the technical concept of the present disclosure is not limited thereto. Therefore, it should be understood that the above exemplary embodiments are illustrative in all respects and do not limit the present disclosure. The scope of protection of the present disclosure should be interpreted based on the appended claims, and all technical concepts within their equivalent scope should be interpreted as falling within the scope of the present disclosure.

Claims

1. A display device, comprising: A substrate, the substrate including a display area in which a plurality of sub-pixels are disposed and a non-display area configured to surround the display area; Multiple light-emitting elements are respectively disposed in the multiple sub-pixels on the substrate, and each includes an anode, a light-emitting layer and a cathode; A partition is provided in the display area and the non-display area, and is configured to cover the end of the anode; A dam portion is disposed in the non-display area on the substrate and configured to surround the display area; as well as A power cord, configured to partially overlap with the dam portion in the non-display area, is disposed on the same layer as the anode and is made of the same material as the anode. The power cord includes: The first part, which overlaps with the dam section; and The second part, the second part is the portion extending from the first part toward the display area, and The dike includes: Multiple first openings are provided along the dam section; and A second opening portion extends from the first opening portion and is disposed along the side surface of the second portion.

2. The display device according to claim 1, wherein, The dike further includes a connecting portion, which is configured to overlap with the end of the first portion between the plurality of first opening portions without exposing the end of the first portion.

3. The display device according to claim 2, wherein, The second opening includes: A first sub-opening portion configured to overlap with the second portion and having a linear shape; and A second sub-opening portion is configured to be spaced apart from the second portion and has a linear shape.

4. The display device according to claim 3, wherein, The cathode is electrically connected to the second portion of the power line through a contact hole disposed in the dam, and The first sub-opening portion is connected to the contact hole.

5. The display device according to claim 3, wherein, The ends of the first sub-opening portion and the ends of the second sub-opening portion are connected to each other.

6. The display device according to claim 3, wherein, The first sub-opening portion and the second sub-opening portion are spaced apart from each other.

7. The display device according to claim 1, wherein, The power cord includes a recess that extends inwardly from the side surface of the second portion adjacent to the first portion. The second opening portion is disposed in the recess.

8. The display device according to claim 7, wherein, The second opening is configured to be spaced apart from the recess of the power line.

9. The display device according to claim 1, wherein, The power cord further includes a plurality of third portions, which are spaced apart from the second portion and extend in a first direction toward the display area. The innermost of the plurality of first opening portions is configured to be spaced apart from and surround the third portion.

10. The display device according to claim 9, wherein, All of the aforementioned third parts extend straight in the same first direction.

11. The display device according to claim 9, wherein, The plurality of third portions extend in the first direction and in a second direction intersecting the first direction.

12. The display device according to claim 11, wherein, The shape defined by the plurality of third parts is either 'T' or '+'.

13. The display device according to claim 9, wherein, The third part does not overlap with the first opening.

14. The display device according to claim 9, wherein, The first opening portion among the plurality of first opening portions that overlaps with the first portion is configured to overlap with the third portion.

15. The display device according to claim 1, further comprising: An encapsulation layer is disposed above the plurality of light-emitting elements, within a portion of the display area and a portion of the non-display area, and comprises a plurality of inorganic and organic layers. The ends of the plurality of inorganic layers of the encapsulation layer are disposed outside the plurality of first opening portions and are spaced apart from the plurality of first opening portions.

16. A display device, comprising: A substrate, the substrate including a display area and a non-display area; A plurality of light-emitting elements are disposed in the display area on the substrate, and each includes an anode, a light-emitting layer and a cathode; A dike is disposed on the anode and configured to cover the end of the anode; as well as A power cord, disposed in the non-display area, on the same layer as the anode, made of the same material as the anode, and electrically connected to the cathode. The power cord includes: The first part, the second part, is disposed in the non-display area and is configured to surround at least a portion of the display area; and The second part is the portion that protrudes from the first part toward the display area, and The dike includes: A plurality of first opening portions, the plurality of first opening portions being configured to surround at least a portion of the display area and to at least partially overlap with the first portions; and A second opening portion is configured to extend from the first opening portion along the side surface of the second portion.

17. The display device according to claim 16, wherein, The dike further includes a connecting portion, which is configured to overlap with the end of the first portion without exposing the end of the first portion.

18. The display device according to claim 16, wherein, The second opening includes: A first sub-opening portion configured to overlap with the second portion and having a linear shape; and A second sub-opening portion spaced apart from the second portion and having a linear shape.

19. The display device according to claim 16, further comprising: An encapsulation layer is disposed above the plurality of light-emitting elements, within a portion of the display area and a portion of the non-display area, and comprises a plurality of inorganic and organic layers. The ends of the plurality of inorganic layers of the encapsulation layer are disposed outside the plurality of first opening portions and are spaced apart from the plurality of first opening portions.

Images