A signal amplification device and a method of manufacturing the same

By fabricating a composite electrode structure of piezoelectric fiber film and gold film, combined with a three-dimensional stacking design, the problems of poor signal amplification and anti-interference ability in the miniaturization and flexibility of piezoelectric sensors were solved, achieving a high signal-to-noise ratio and low power consumption signal amplification effect.

CN122248959APending Publication Date: 2026-06-19SUZHOU UNIV
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SUZHOU UNIV
Filing Date
2026-05-22
Publication Date
2026-06-19

AI Technical Summary

⚠Technical Problem

Existing piezoelectric pressure/strain sensors face challenges in miniaturization and flexibility, including a trade-off between sensitivity and size, complex signal chains and increased power consumption, gain bottlenecks in planar structures, and poor anti-interference capabilities. These challenges make it difficult to achieve high signal-to-noise ratio and high reliability signal amplification in low-power scenarios.

⚗Method used

Piezoelectric fiber membranes are prepared by coaxial electrospinning and combined with PDMS and gold thin films to form a unique composite electrode structure. Through three-dimensional stacking design, intralayer parallel and interlayer series connections are realized to construct array-type or stacked high-performance devices, which directly amplify signals at the physical level and reduce output impedance and external amplifier dependence.

🎯Benefits of technology

It significantly improves signal amplification by 2 to 10 times, reduces system power consumption and size, improves signal-to-noise ratio, is suitable for curved surface attachment applications, and maintains high performance and mechanical reliability in extremely thin thickness.

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Abstract

This invention discloses a signal amplification device and its fabrication method. The fabrication method includes the following steps: preparing a piezoelectric fiber membrane using coaxial electrospinning; immersing the piezoelectric fiber membrane in a PDMS solution under vacuum-assisted immersion to allow the PDMS prepolymer to fully penetrate the pores and interfibers of the piezoelectric fiber membrane, resulting in a PDMS-cured piezoelectric fiber membrane; uniformly depositing a gold thin film on both sides of the PDMS-cured piezoelectric fiber membrane; coating a conductive composite paste onto the surface of the gold thin film to form an electrode layer; and then heating and curing the paste; reliably connecting the device to the pre-reserved pad area of ​​the cured composite electrode using flexible wires or conductive cloth to form electrode leads; and fabricating a transparent encapsulation protective layer on the upper and lower surfaces of the device with lead-out electrodes. This invention directly amplifies the voltage signal at the physical level through structural design, achieving an amplification of 2 to 10 times, depending on the number of stacked layers and the number of series connections, resulting in a significant increase in the output signal amplitude.
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