Semiconductor package workpiece sorting method, device, apparatus and cutting and sorting integrated machine

Abstract

The application relates to a semiconductor packaging workpiece sorting method, device, equipment and cutting and sorting integrated machine, wherein the semiconductor packaging workpiece sorting method comprises the following steps: recognizing each discrete packaging substructure by using a visual recognition module, judging whether each packaging substructure is a good product device or a defective product device; determining the position information of the good product device and the defective product device on the adsorption workbench according to the corresponding recognition result of each packaging substructure and the corresponding position information of the packaging substructure on the adsorption workbench; driving a sorting arm to transfer the good product device to a good product tray according to the position information of the good product device on the adsorption workbench; and driving the sorting arm to transfer the defective product device to a defective product tray according to the position information of the defective product device on the adsorption workbench. The application can realize the corresponding centralized sorting of the good product device and the defective product, and avoids the problem of frequent path switching of the sorting arm caused by the mixed types of the packaging substructures.

Description

Technical Field

[0001] This application relates to the field of chip sorting technology, and in particular to a semiconductor packaging workpiece sorting method, apparatus, equipment and integrated cutting and sorting machine. Background Technology

[0002] Currently, after the semiconductor packaging workpiece is packaged, it needs to be cut to separate the various packaging substructures in the semiconductor packaging workpiece. Then, the cut semiconductor packaging workpiece is placed in a sorting device to sort the packaging substructures that belong to the good product type and the defective product type.

[0003] However, in the existing technology, the sorting arm in the sorting device is generally controlled to extract each packaged substructure in the order of rows and columns. Then, based on the visual results of each packaged substructure, it is determined whether each packaged substructure is a good product or a defective product, and the packaged substructure is placed into the corresponding good product tray or defective product tray. Therefore, when sorting each packaged substructure, the sorting arm is prone to unnecessary movement, which leads to low sorting efficiency of the sorting device for packaged substructures. Summary of the Invention

[0004] This application provides a method, apparatus, equipment, and integrated cutting and sorting machine for sorting semiconductor packaged workpieces. It can realize the centralized sorting of good and defective products located on the adsorption worktable, avoiding the problem of frequent movement path switching caused by the mixed types of packaged substructures of the sorting arm, thereby improving the sorting efficiency of the semiconductor packaged workpiece sorting device.

[0005] In a first aspect, a method for sorting semiconductor packaged parts is provided, applied to a semiconductor packaged part sorting device. The semiconductor packaged parts include multiple mutually independent packaged substructures. The semiconductor packaged part sorting device includes a sorting arm, and an adsorption stage, a good product tray, and a defective product tray arranged sequentially along the X-axis. The sorting arm is used to sort the various packaged substructures located in the adsorption stage into the good product tray or the defective product tray. The method includes: The visual recognition module is used to identify each discrete package substructure and determine whether each package substructure is a good or defective device. After the target number of packaged substructures in the semiconductor packaged workpiece are transferred to the adsorption worktable, the position information of each good device and each defective device on the adsorption worktable is determined based on the identification results of each packaged substructure on the adsorption worktable and the position information of each packaged substructure on the adsorption worktable. Based on the position information of each good device on the adsorption worktable, drive the sorting arm to transfer the good devices to the good device tray; Based on the position information of each defective device on the adsorption worktable, the sorting arm is driven to transfer the defective devices to the defective tray.

[0006] Optionally, multiple packaging substructures in the semiconductor packaging workpiece are arranged sequentially in the row and column directions; there are two adsorption stages, and the two adsorption stages are arranged sequentially along the X-axis direction. Each adsorption stage is provided with multiple spaced adsorption slots, and there are spacer slots between adjacent adsorption slots. The multiple adsorption slots and multiple spacer slots are arranged in the row and column directions; wherein, the position information of each adsorption slot in the adsorption stage away from the good product tray corresponds to the position information of each spacer slot in the adsorption stage close to the good product tray. Accordingly, the method also includes: Based on the position information of the packaged substructure in the semiconductor package workpiece, the position information of each adsorption tank in the adsorption stage away from the good product tray, and the position information of each adsorption tank in the adsorption stage close to the good product tray, the packaged substructures are sequentially and alternately placed into the adsorption tanks in the two adsorption stages, so that the packaged substructures that are spaced apart in the semiconductor package workpiece are respectively transferred to the adsorption tanks in the adsorption stage away from the good product tray, and the other packaged substructures that are spaced apart in the semiconductor package workpiece are respectively transferred to the adsorption tanks in the adsorption stage close to the good product tray. Accordingly, based on the identification results of each packaged substructure on the adsorption stage and the position information of each packaged substructure on the adsorption stage, the position information of each good device and each defective device on the adsorption stage is determined, including: For each package substructure on the adsorption worktable that is far from the good product tray, the position information of each good product device and the position information of each defective product device on the adsorption worktable are determined based on the identification result corresponding to the package substructure and the position information of the package substructure on the adsorption worktable. For each package substructure on the adsorption stage near the good product tray, the position information of each good product device and each defective product device on the adsorption stage is determined based on the identification result corresponding to the package substructure and the position information of the package substructure on the adsorption stage.

[0007] Optionally, based on the position information of each good device on the adsorption worktable, the sorting arm is driven to transfer the good devices to the good device tray, including: For each adsorption workbench, based on the position information of the good device on the adsorption workbench, the sorting arm is driven to extract the good device from its corresponding adsorption tank and transfer it to the good product tray. For each adsorption workbench, after all good devices are transferred to the good device tray, the sorting arm is driven to extract the good devices from their corresponding adsorption tanks and transfer them to the defective device tray according to the position information of the defective devices on the adsorption workbench, until all defective devices on the adsorption workbench have been transferred to the defective device tray.

[0008] Optionally, the sorting arm includes multiple suction nozzles; for each adsorption stage, based on the position information of the good device on the adsorption stage, the sorting arm is driven to extract the good device from its corresponding adsorption tank and transfer it to the good device tray, including: For each adsorption workbench, after the drive sorting arm moves to the top of the adsorption workbench, multiple suction nozzles are controlled to adsorb the good devices located on the adsorption workbench according to the position information of the good devices on the adsorption workbench. After all the nozzles in the sorting arm have corresponding good products attached to them, control multiple nozzles to move above the good product tray and transfer the good products attached to the nozzles to the good product tray. Repeat the above steps until all good devices on the adsorption stage have been transferred to the good device tray.

[0009] Optionally, multiple suction nozzles are arranged sequentially along the X-axis; for each adsorption stage, based on the position information of the good device on the adsorption stage, the multiple suction nozzles are controlled to adsorb the good device located on the adsorption stage, including: For each adsorption workbench, the initial adsorption tank of the sorting arm is determined in the adsorption tank located at the corner of the plane area where multiple adsorption tanks are located. Control the sorting arm to move along the X-axis so that the nozzle in the sorting arm that is close to the initial adsorption tank moves above the initial adsorption tank; Control the sorting arm to move above the row where the initial adsorption tank is located, and control multiple nozzles in the sorting arm to adsorb good devices located on that row one by one. If all good devices in the same row are picked up by the sorting arm, and at least one nozzle in the sorting arm does not pick up a good device, then another adsorption tank that is close to the adsorption tank in the same row that is far from the initial adsorption tank is taken as the new initial adsorption tank, and the above steps are repeated until each nozzle in the sorting arm picks up a good device.

[0010] Optionally, it also includes: For each adsorption workbench, if not all good products on the adsorption workbench are placed onto the good product tray by the sorting arm, and each nozzle in the sorting arm adsorbs a good product, then the adsorption slot corresponding to another good product that is adjacent in the row direction to the last good product picked up by the sorting arm and has not been picked up by the sorting arm is taken as the new initial adsorption slot, and the moving direction of the sorting arm along that row is taken as the target direction. After the sorting arm places the extracted good devices onto the good device tray, the sorting arm is controlled to move along the row where the new initial adsorption groove is located in the target direction, so that multiple nozzles in the sorting arm adsorb the good devices located on that row one by one.

[0011] Optionally, it also includes: For each adsorption workbench, if all good products on the adsorption workbench are extracted from the adsorption tank, and some nozzles in the sorting arm adsorb good products on the adsorption workbench, then the nozzles in the sorting arm that do not adsorb good products will be controlled to adsorb defective products on the adsorption workbench one by one until all nozzles in the sorting arm that do not adsorb good products adsorb one defective product.

[0012] Optionally, both adsorption stages can move along the Y-axis, and both adsorption stages have a loading position and a sorting position; based on the position information of the packaged substructure in the semiconductor packaged workpiece, the position information of each adsorption slot in the adsorption stage farther from the good product tray, and the position information of each adsorption slot in the adsorption stage closer to the good product tray, the packaged substructures are sequentially and alternately placed into the adsorption slots of the two adsorption stages, including: Control one of the two adsorption worktables to move to the feeding position, and control the other of the two adsorption worktables to move to the sorting position; The control sorting arm sorts the packaged substructures in the adsorption worktable at the sorting position; and according to the position information of each adsorption tank in the adsorption worktable at the loading position and the position information of the packaged substructures set at intervals in the semiconductor packaged workpiece, the packaged substructures set at intervals in the semiconductor packaged workpiece are transferred to each adsorption tank in the adsorption worktable at the loading position. After the sorting arm sorts the packaged substructures in the adsorption worktable at the sorting position, it controls the adsorption worktable at the sorting position to move to the loading position; and after all the packaged substructures that are spaced apart in the semiconductor packaged workpiece are transferred to the adsorption worktable at the loading position, it controls the adsorption worktable at the loading position to move to the sorting position.

[0013] Secondly, a semiconductor packaging workpiece sorting device is provided, used for sorting multiple mutually independent packaging substructures in a semiconductor packaging workpiece. The device includes a sorting arm, and an adsorption stage, a good product tray, and a defective product tray arranged sequentially along the X-axis. The sorting arm is used to sort each packaging substructure located on the adsorption stage into the good product tray or the defective product tray. The device also includes: The judgment module is used to identify each discrete package substructure using the visual recognition module and determine whether each package substructure is a good or defective device. The position information determination module is used to determine the position information of each good device and each defective device on the adsorption worktable after the target number of packaged substructures in the semiconductor packaged workpiece are transferred to the adsorption worktable, based on the identification results of each packaged substructure on the adsorption worktable and the position information of each packaged substructure on the adsorption worktable. The first drive module is used to drive the sorting arm to transfer the good devices to the good device tray based on the position information of each good device on the adsorption worktable. The second drive module is used to drive the sorting arm to transfer the defective devices to the defective tray based on the position information of each defective device on the adsorption worktable.

[0014] Thirdly, an electronic device is provided, comprising: a processor and a memory for storing a computer program, the processor for calling and running the computer program stored in the memory, and performing the methods as described in the first aspect or its various implementations.

[0015] Fourthly, a computer-readable storage medium is provided for storing a computer program that causes a computer to perform the methods described in the first aspect or its various implementations.

[0016] Fifthly, a cutting and sorting integrated machine is provided, including a semiconductor packaged workpiece sorting device as described in the first aspect or its various implementations, or an electronic device as described in the third aspect.

[0017] The technical solution provided in this application firstly uses a visual recognition module to identify each discrete packaging substructure and determine whether each packaging substructure is a good or defective device. Then, after the target number of packaging substructures in the semiconductor packaging workpiece are transferred to the adsorption worktable, the position information of each good device and each defective device on the adsorption worktable is determined based on the recognition results of each packaging substructure on the adsorption worktable and the position information of each packaging substructure on the adsorption worktable. Next, based on the position information of each good device on the adsorption worktable, the sorting arm is driven to transfer the good devices to the good device tray. Finally, based on the position information of each defective device on the adsorption worktable, the sorting arm is driven to transfer the defective devices to the defective device tray. The method provided in this application not only enables centralized sorting of good and defective devices located on the adsorption worktable, avoiding the problem of frequent movement path switching caused by the mixing of different types of package substructures, but also directly reduces the number of long-distance movements of the sorting arm between the adsorption worktable and the defective product tray. This can effectively shorten the sorting time for each package substructure and improve the sorting efficiency of the semiconductor package workpiece sorting device.

[0018] Other features and advantages of this disclosure will be described in detail in the following detailed description section. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 An application scenario diagram provided for an embodiment of this application; Figure 2 A flowchart of a semiconductor packaging workpiece sorting method provided in this application embodiment; Figure 3 This is a schematic diagram of the structure of a semiconductor packaging workpiece sorting device provided in an embodiment of this application; Figure 4 This is a schematic diagram of the structure of an adsorption worktable in a semiconductor packaging workpiece sorting device provided in an embodiment of this application; Figure 5 A schematic diagram of a module for another semiconductor packaged workpiece sorting device provided in an embodiment of this application; Figure 6 This is a schematic block diagram of the electronic device provided in the embodiments of this application. Detailed Implementation

[0021] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0022] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or server that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or devices.

[0023] In existing technologies, the sorting arm in the sorting device typically extracts each packaged substructure sequentially according to its row and column order. Then, based on the visual results of each packaged substructure, it is determined whether each packaged substructure is a good or defective product, and the packaged substructure is placed into the corresponding good or defective product tray. For example, after the 10 nozzles in the sorting arm pick up 10 packaged substructures from the sorting device, there may be 5 good products and 3 defective products among the picked-up packaged substructures. Therefore, when placing the packaged substructures picked up by the 10 nozzles onto the corresponding good or defective product tray, the sorting arm is prone to unnecessary movement, which affects the sorting efficiency of the sorting device for packaged substructures.

[0024] To address at least one of the technical problems existing in the prior art or related technologies, the present invention provides a processing method, apparatus, and cutting equipment for surface mount packaging structures. The method includes: using a visual recognition module to identify each discrete packaging substructure and determine whether each packaging substructure is a good or defective device; after all packaging substructures are transferred to the adsorption worktable, determining the position information of each good device and each defective device on the adsorption worktable based on the identification results and position information of each packaging substructure on the adsorption worktable; driving a sorting arm to transfer the good devices to a good device tray based on the position information of each good device on the adsorption worktable; and driving a sorting arm to transfer the defective devices to a defective device tray based on the position information of each defective device on the adsorption worktable. This application enables centralized sorting of good and defective components, avoiding the problem of frequent path switching caused by the mixed types of package substructures of the sorting arm. It also directly reduces the number of long-distance movements of the sorting arm between the adsorption worktable and the defective product tray, effectively shortening the sorting time for each package substructure and improving the sorting efficiency of the semiconductor package workpiece sorting device.

[0025] It should be understood that the technical solution of this application can be applied to the following scenarios, but is not limited to: In some possible ways, Figure 1 An application scenario diagram provided for an embodiment of this application, such as Figure 1 As shown, this application scenario may include electronic device 110 and network device 120. Electronic device 110 can establish a connection with network device 120 through a wired network or a wireless network.

[0026] For example, electronic device 110 may be a desktop computer, laptop computer, tablet computer, etc., but is not limited thereto. Network device 120 may be a terminal device or a server, but is not limited thereto. In one embodiment of this application, electronic device 110 may send a request message to network device 120, which may be used to request the identification results corresponding to each encapsulation substructure. Further, electronic device 110 may receive a response message sent by network device 120, which includes obtaining the identification results corresponding to each encapsulation substructure.

[0027] also, Figure 1 An electronic device 110 and a network device 120 are provided as examples, but other numbers of electronic and network devices may be included in practice, and this application does not limit this.

[0028] In other possible implementations, the technical solution of this application may also be executed by the aforementioned electronic device 110, or by the aforementioned network device 120, and this application does not impose any restrictions on this.

[0029] After introducing the application scenarios of the embodiments of this application, the technical solution of this application will be described in detail below: Figure 2 The flowchart illustrates a semiconductor packaging workpiece sorting method provided in this application embodiment, and it can be implemented by, for example... Figure 1 The illustrated electronic device 110 performs, but is not limited to, this method. It is applied to a semiconductor package workpiece sorting device, whereby the semiconductor package workpiece comprises multiple mutually discrete package substructures. For example... Figure 2 As shown, the method may include the following steps: S210. Use the visual recognition module to identify each discrete package substructure and determine whether each package substructure is a good or defective device.

[0030] Among them, such as Figure 3 As shown, the semiconductor packaging workpiece sorting device includes a sorting arm 1, and an adsorption worktable 1, a good product tray 3, and a defective product tray 4 arranged sequentially along the X-axis. The sorting arm 1 is used to sort each packaging substructure located in the adsorption worktable 2 into the good product tray 3 or the defective product tray 4.

[0031] It should be noted that the semiconductor package workpiece here refers to the semiconductor package workpiece after it has been cut, and the upper surface of each independent package substructure cut from the semiconductor package workpiece is marked with a good product mark or a defective product mark. The good product mark can be a circular mark, and the defective product mark can be a cross mark.

[0032] Accordingly, when using the visual recognition module to identify each discrete package substructure and determine whether each package substructure is a good or defective device, the markings on the upper surface of the package substructure can be used to determine whether each package substructure is a good or defective device. For example, if the visual recognition module marks a circular mark on the upper surface of the package substructure located in the first row and second column, then the package substructure is determined to be a good device; if the visual recognition module marks a cross-shaped mark on the upper surface of the package substructure located in the first row and third column, then the package substructure is determined to be a defective device.

[0033] Here, under normal circumstances, the number of good devices in a semiconductor packaged component accounts for more than 95% of the total number of packaged substructures.

[0034] In this step, by identifying and classifying each individual package substructure before transferring all package substructures of the semiconductor package workpiece to the adsorption worktable, the attributes (good / defective) of each package substructure are clarified. This avoids the problem of additional movement caused by the suction nozzle on the sorting arm determining the attributes only after the package substructure has been adsorbed and moved, which would result in the attribute determination result not matching the target placement tray.

[0035] S220. After the target number of packaged substructures in the semiconductor packaged workpiece are transferred to the adsorption worktable, the position information of each good device and the position information of each defective device on the adsorption worktable are determined according to the identification results of each packaged substructure on the adsorption worktable and the position information of each packaged substructure on the adsorption worktable.

[0036] Here, the position information of each of the packaging substructures on the adsorption worktable can be either the coordinate position information of the packaging substructure on the adsorption worktable or the position information of the packaging substructure in the world coordinate system of the semiconductor packaging workpiece sorting device.

[0037] It should be noted that when all the packaging substructures of a semiconductor packaging workpiece can be placed on the adsorption worktable, the target number can be the number of packaging substructures in the semiconductor packaging workpiece; when some of the packaging substructures of a semiconductor packaging workpiece can be placed on the adsorption worktable, the target number can be the number of packaging substructures that the adsorption worktable can place. For example, when 270 packaging substructures of a semiconductor packaging workpiece can be placed on the adsorption worktable, the target number is 270.

[0038] In this step, by determining the position information of each good device and each defective device on the adsorption worktable based on the identification results of each package substructure on the adsorption worktable and the position information of each package substructure on the adsorption worktable, the sorting arm in the subsequent step can easily extract the good and defective devices from the adsorption worktable.

[0039] S230. Based on the position information of each good device on the adsorption worktable, drive the sorting arm to transfer the good devices to the good device tray.

[0040] Since the adsorption worktable, good product tray, and defective product tray are arranged sequentially along the X-axis, the distance between the adsorption worktable and the good product tray is smaller than the distance between the adsorption worktable and the defective product tray. Furthermore, since the number of good devices in semiconductor packaged parts accounts for more than 95% of the total number of packaged substructures, the sorting arm is driven to transfer the good devices to the good product tray based on the position information of each good device on the adsorption worktable. This allows the sorting arm to complete the sorting of good devices located on the adsorption worktable with minimal travel distance by only reciprocating between the adsorption worktable and the good product tray, thereby significantly improving the sorting efficiency of good devices.

[0041] In this step, by controlling the sorting arm to centrally sort all good devices on the adsorption worktable, all good devices can be transferred to the good device tray in batches. There is no need for the sorting arm to repeatedly switch between good and defective devices, which reduces the number of times and the distance the sorting arm moves, thereby improving sorting efficiency.

[0042] S240. Based on the position information of each defective device on the adsorption worktable, drive the sorting arm to transfer the defective devices to the defective tray.

[0043] Since the number of defective devices in a semiconductor package workpiece accounts for less than 5% of the total number of package substructures, the number of defective devices on the adsorption table is relatively small. For example, if the number of package substructures in a semiconductor package workpiece is 540, the number of defective devices on the adsorption table is less than 27. Therefore, by driving the sorting arm to transfer the defective devices to the defective tray, the devices on the adsorption table can be quickly sorted onto the defective tray.

[0044] In this step, by using the position information of each defective device on the adsorption worktable, the sorting arm can be driven to quickly transfer the defective devices to the defective tray, thereby completing the sorting of defective devices.

[0045] By using the above method, after controlling the sorting arm to centrally transfer good devices located on the adsorption stage to the good device tray, and then controlling the sorting arm to transfer defective devices located on the adsorption stage to the defective device tray, not only is centralized sorting of good and defective devices achieved, avoiding the problem of frequent movement path switching caused by the mixing of different types of package substructures, but also the number of long-distance movements of the sorting arm between the adsorption stage and the defective device tray is directly reduced. This can effectively shorten the sorting time for each package substructure and improve the sorting efficiency of the semiconductor package workpiece sorting device.

[0046] In some possible implementations, multiple package substructures in a semiconductor package artifact are arranged sequentially in both row and column directions; such as Figure 3 As shown, there are two adsorption worktables 2, and the two adsorption worktables 2 are arranged sequentially along the X-axis direction, as follows: Figure 4 As shown, the adsorption workbench 2 is provided with a plurality of adsorption tanks 201 spaced apart, and a spacer 202 is provided between two adjacent adsorption tanks 201. The plurality of adsorption tanks 201 and the plurality of spacer 202 are distributed in the row direction and the column direction. The position information of each adsorption tank 201 in the adsorption workbench 201 far away from the good product tray 3 corresponds to the position information of each spacer 202 in the adsorption workbench 201 close to the good product tray 3.

[0047] Here, the row direction can be the same as the X-axis direction, and the column direction can be the same as the Y-axis direction.

[0048] The sum of the number of adsorption tanks and spacer tanks on the adsorption worktable is the same as the number of packaging substructures in the semiconductor packaging workpiece, and the sum of the number of adsorption tanks and spacer tanks in the same row on the adsorption worktable is the same as the number of packaging substructures in the same row in the semiconductor packaging workpiece.

[0049] It should be noted that the position information of each adsorption tank in the adsorption worktable can be the number of rows and columns of each adsorption tank on the adsorption worktable; the position information of each spacer tank in the adsorption worktable can be the number of rows and columns of each spacer tank on the adsorption worktable. Therefore, the position information of each adsorption tank in the adsorption worktable away from the good product tray corresponds to the same position information of each spacer tank in the adsorption worktable close to the good product tray. This can be understood as follows: the number of rows of each adsorption tank in the adsorption worktable close to the good product tray corresponds to the same number of rows of each spacer tank in the adsorption worktable away from the good product tray; and the number of columns of each adsorption tank in the adsorption worktable close to the good product tray corresponds to the same number of columns of each spacer tank in the adsorption worktable away from the good product tray.

[0050] Therefore, when the position information of each adsorption tank in the adsorption stage far from the good product tray corresponds to the position information of each spacer in the adsorption stage near the good product tray, the positions of each adsorption tank on the adsorption stage far from the good product tray and each adsorption tank on the adsorption stage near the good product tray are complementary, so that each package substructure located in the semiconductor package workpiece is placed in an adsorption tank with the same number of rows and columns as its corresponding arrangement number.

[0051] Accordingly, the semiconductor package workpiece sorting method may further include: according to the position information of the package substructure in the semiconductor package workpiece, the position information of the adsorption tank in the adsorption worktable, and the position information of the adsorption tank in the adsorption worktable, placing each package substructure sequentially into the adsorption tank or adsorption tank, so that some package substructures spaced apart in the semiconductor package workpiece are respectively transferred to each adsorption tank in the adsorption worktable, and another portion of package substructures spaced apart in the semiconductor package workpiece are respectively transferred to each adsorption tank in the adsorption worktable.

[0052] The target quantity can be the number of the partially packaged substructures that are spaced apart in the semiconductor package workpiece.

[0053] Considering the packaging substructures A, B, C, and D located in the first row and first to fourth columns of a semiconductor packaging workpiece, and the packaging substructures E, F, G, and H located in the second row and first to fourth columns, if the slot in the first column of the first row of the adsorption stage A, which is closer to the good product tray, corresponds to an adsorption slot, and the slot in the second column of the first row of the adsorption stage B, which is farther from the good product tray, corresponds to an adsorption slot, then packaging substructure A is placed in the adsorption slot in the first column of the first row of adsorption stage A, and packaging substructure C is placed in the adsorption slot in the second column of the first row of adsorption stage B. In adsorption table A, the encapsulation substructure F is placed in the adsorption tank located in the second column of the second row; the encapsulation substructure H is placed in the adsorption tank located in the fourth column of the second row; the encapsulation substructure B is placed in the adsorption tank located in the second column of the first row; the encapsulation substructure D is placed in the adsorption tank located in the fourth column of the first row; the encapsulation substructure E is placed in the adsorption tank located in the first column of the second row; and the encapsulation substructure G is placed in the adsorption tank located in the third column of the second row.

[0054] Therefore, by sequentially and alternately placing each package substructure onto two adsorption stages based on the position information of the package substructure in the semiconductor package workpiece, the position information of each adsorption slot in the adsorption stage near the good product tray, and the position information of each adsorption slot in the adsorption stage away from the good product tray, it is possible to transfer some package substructures that are spaced apart in the semiconductor package workpiece to the adsorption slots in the adsorption stage near the good product tray, and to transfer another portion of package substructures that are spaced apart in the semiconductor package workpiece to the adsorption slots in the adsorption stage away from the good product tray. At the same time, it is also possible to ensure that the position information of each adsorption slot used to place each package substructure after it is placed on the two adsorption stages is the same as the position information of each package substructure in the semiconductor package workpiece, thus facilitating the recording of the position information of each package substructure on the two adsorption stages.

[0055] Accordingly, based on the identification results of each packaged substructure on the adsorption stage and the position information of each packaged substructure on the adsorption stage, the position information of each good device and the position information of each defective device on the adsorption stage can be determined, which may also include the following steps: S310. For each package substructure on the adsorption worktable that is far from the good product tray, determine the position information of each good product device and the position information of each defective product device on the adsorption worktable based on the identification result corresponding to the package substructure and the position information of the package substructure on the adsorption worktable.

[0056] Here, the position information of the encapsulation substructure on the adsorption worktable away from the good product tray can be the position information of the adsorption tank where the encapsulation substructure is located on the adsorption worktable. That is, the position information of the encapsulation substructure on the adsorption worktable away from the good product tray can be the number of rows and columns of the adsorption tank where the encapsulation substructure is located on the adsorption worktable.

[0057] S320. For each package substructure on the adsorption worktable near the good product tray, based on the identification result corresponding to the package substructure and the position information of the package substructure on the adsorption worktable, determine the position information of each good product device and the position information of each defective product device on the adsorption worktable.

[0058] Here, the position information of the encapsulation substructure on the adsorption worktable near the good product tray can be the position information of the adsorption tank where the encapsulation substructure is located in the adsorption worktable, that is, the position information of the encapsulation substructure on the adsorption worktable can be the number of rows and columns of the adsorption tank where the encapsulation substructure is located in the adsorption worktable.

[0059] In this embodiment, since there are two adsorption worktables, and some of the packaged substructures of the semiconductor packaged workpiece are located in the adsorption slots of one adsorption worktable, and another portion of the packaged substructures are located in the adsorption slots of the other adsorption worktable, in order for the sorting arm to accurately sort good and defective devices from the corresponding packaged substructures in the two adsorption worktables, the position information of each good device and each defective device on their respective adsorption worktables is determined based on the identification results of the packaged substructures and the position information of each packaged substructure on the two adsorption worktables. This allows the sorting arm to sort the good and defective devices based on the obtained position information.

[0060] In some possible implementations, the sorting arm is driven to transfer the good devices to the good device tray based on the position information of each good device on the adsorption worktable. This can include the following methods: S410. For each adsorption workbench, based on the position information of the good device on the adsorption workbench, drive the sorting arm to extract the good device from its corresponding adsorption tank and transfer it to the good device tray.

[0061] In this step, for each adsorption workbench, the sorting arm is driven to transfer the good devices located on the adsorption workbench to the good device tray according to the position information of the good devices on the adsorption workbench. This enables precise and rapid sorting of the good devices located on the adsorption workbench by the sorting arm.

[0062] S420. For each adsorption workbench, after all good products on the adsorption workbench have been transferred to the good product tray, the sorting arm is driven to extract the good products from their corresponding adsorption tanks and transfer them to the defective product tray according to the position information of the defective products on the adsorption workbench, until all defective products on the adsorption workbench have been transferred to the defective product tray.

[0063] Here, for each adsorption workbench, after all the good devices on the adsorption workbench have been transferred to the good device tray, the number of defective devices on the adsorption workbench is relatively small. Therefore, by adopting the above method, after all the good devices on the adsorption workbench have been transferred to the good device tray, the defective devices on the adsorption workbench are transferred to the defective device tray by the drive arm. This can complete the rapid sorting of all the good devices located on the adsorption workbench. Moreover, when the sorting arm is transferring the position of the packaging substructure located on the adsorption workbench, it controls the sorting arm to perform centralized sorting of good and defective devices separately, so as to reduce the travel distance of the sorting arm when transferring the position of good and defective devices.

[0064] In some possible implementations, see [link to relevant documentation]. Figure 3 The sorting arm 1 includes multiple suction nozzles 101.

[0065] For each adsorption workbench, based on the position information of the good device on the adsorption workbench, the sorting arm is driven to extract the good device from its corresponding adsorption tank and transfer it to the good product tray. This may include the following steps: S510: For each adsorption workbench, after the drive sorting arm moves to the top of the adsorption workbench, according to the position information of the good device on the adsorption workbench, control multiple suction nozzles to adsorb the good device located on the adsorption workbench.

[0066] S520: After all the nozzles in the sorting arm have corresponding good products adsorbed on them, control multiple nozzles to move above the good product tray and transfer the good products adsorbed by the nozzles to the good product tray.

[0067] S530. Repeat the above steps until all good devices on the adsorption stage have been transferred to the good device tray.

[0068] Using the above method, the good products located on the adsorption worktable can be quickly transferred to the good product tray by driving the sorting arm, so as to complete the sorting of the good products located on the adsorption worktable.

[0069] In some possible implementations, such as Figure 3 As shown, multiple suction nozzles 101 are arranged sequentially along the X-axis.

[0070] It should be noted that the semiconductor packaging workpiece sorting device also includes a linear module arranged along the X-axis. The sorting arm is mounted on the linear module, which is used to drive the sorting arm to reciprocate along the X-axis, so that the sorting arm reciprocates between the adsorption table and the good product tray, or between the adsorption table and the defective product tray, thereby enabling the sorting arm to transfer good products located on the adsorption table to the good product tray, and the sorting arm to transfer defective products located on the adsorption table to the defective product tray.

[0071] Furthermore, the adsorption worktable, the good product tray, and the defective product tray in the semiconductor packaging workpiece sorting device of this application can all move along the Y-axis direction.

[0072] For each adsorption stage, based on the position information of the good device on the adsorption stage, multiple suction nozzles are controlled to adsorb the good device located on the adsorption stage. This may include the following steps: S610. For each adsorption workbench, determine the initial adsorption tank of the sorting arm in the adsorption tank located at the corner of the plane area where multiple adsorption tanks are located.

[0073] Taking the sum of the number of adsorption tanks and spacer tanks in the same row as 90 and the sum of the number of adsorption tanks and spacer tanks in the same column as 60 as an example, the adsorption tanks located at the corners of the plane area where multiple adsorption tanks are located are the adsorption tanks at both ends of the first row and the adsorption tanks at both ends of the 90th row.

[0074] Here, the adsorption groove located at the corner of the plane area away from the good product tray can be selected as the initial adsorption groove. Following the example above, the adsorption groove located in the first row away from the good product tray can be selected.

[0075] In this step, by selecting the adsorption tank at the corner of the adsorption tank plane area as the initial adsorption tank, the starting point of the adsorption of the nozzle in the sorting arm can be clearly defined, avoiding the sorting arm blindly searching for the adsorption position during the adsorption process and reducing ineffective movement. At the same time, using the adsorption tank at the corner as the initial adsorption tank facilitates the orderly advancement and adsorption of good devices along the row and along the X-axis direction of the subsequent sorting arm, laying the foundation for subsequent batch adsorption and path optimization.

[0076] S620: Control the sorting arm to move along the X-axis so that the suction nozzle in the sorting arm that is close to the initial suction tank moves above the initial suction tank.

[0077] Here, by moving the nozzles in the sorting arm that are close to the initial adsorption tank above the initial adsorption tank, each nozzle in the sorting arm can be moved to a position corresponding to the position of each adsorption tank in the row where the initial adsorption tank is located when the sorting arm is controlled to move away from the initial adsorption tank along the X-axis.

[0078] S630: Control the sorting arm to move above the row where the initial adsorption tank is located, and control the multiple nozzles in the sorting arm to adsorb the good devices located on that row one by one.

[0079] Specifically, when controlling multiple nozzles in the sorting arm to adsorb good devices located in the row one by one, the sorting arm is controlled to move away from the initial adsorption groove along the X-axis so that each nozzle in the sorting arm can move to a position corresponding to the position of each adsorption groove in the row where the initial adsorption groove is located, thereby realizing that multiple nozzles in the sorting arm adsorb good devices located in the row one by one.

[0080] Here, by determining the initial adsorption tank of the sorting arm in the adsorption tank located at the corner of the plane area where multiple adsorption tanks are located, and then controlling the sorting arm to move above the row where the initial adsorption tank is located, the sorting arm can adsorb each good device located on the adsorption worktable one by one, starting from the adsorption tank located at the corner. This ensures the transfer efficiency of the sorting arm to the good devices on the adsorption worktable, while also ensuring that the good devices on the adsorption worktable are adsorbed one by one and transferred to the good device tray.

[0081] S640. If all good devices in the same row are picked up by the sorting arm, and at least one nozzle in the sorting arm does not adsorb a good device, then another adsorption tank that is close to the adsorption tank in the same row that is far from the initial adsorption tank is taken as the new initial adsorption tank, and the above steps are repeated until each nozzle in the sorting arm adsorbs a good device.

[0082] Taking a sorting arm with 10 suction nozzles as an example, when all the good products in the first row have been picked up by the sorting arm, and five suction nozzles in the sorting arm have not picked up any good products, the suction groove at the end of the second row that is far away from the initial suction groove is taken as the new initial suction groove. This allows the sorting arm to move along the X-axis away from the new initial suction groove, so that the five suction nozzles that have not picked up any good products can pick up the good products in the second row.

[0083] In this step, when all good devices in the same row are picked up by the sorting arm, and at least one nozzle in the sorting arm has not adsorbed a good device, another adsorption tank that is close to the adsorption tank in the same row that is far from the initial adsorption tank is used as the new initial adsorption tank. This allows the sorting arm to move in two different directions when adsorbing good devices in two adjacent rows. For example, when the sorting arm moves above the adsorption tank in the first row, it moves from left to right, and when it moves above the adsorption tank in the second row, it moves from right to left. This shortens the movement path of the sorting arm and improves the sorting efficiency of the sorting arm.

[0084] By employing the above method, the initial adsorption slot of the sorting arm is determined in the adsorption slots located at the corners of the planar area containing multiple adsorption slots. The sorting arm is then controlled to move along the X-axis so that the nozzles in the sorting arm that are close to the initial adsorption slot move above the initial adsorption slot. This avoids redundant actions such as disordered movement of the sorting arm in multiple directions and the nozzles individually searching for adsorption positions, thus shortening the travel distance of the sorting arm. Simultaneously, when all good devices in the same row have been extracted by the sorting arm, and at least one nozzle in the sorting arm has not adsorbed a good device, the utilization rate of the nozzles can be improved by using another adsorption slot in the same row that is close to the adsorption slot far from the initial adsorption slot as the new initial adsorption slot. This improves the adsorption efficiency of the sorting arm, ensures that all nozzles can adsorb good devices, avoids nozzle idleness, and maximizes the utilization of nozzle resources.

[0085] In some possible embodiments, the semiconductor package workpiece sorting method further includes: S710. For each adsorption workbench, if not all good products on the adsorption workbench are placed onto the good product tray by the sorting arm, and each nozzle in the sorting arm adsorbs a good product, then the adsorption slot corresponding to another good product that is adjacent in the row direction to the last good product picked up by the sorting arm and has not been picked up by the sorting arm is taken as the new initial adsorption slot, and the moving direction of the sorting arm along that row is taken as the target direction.

[0086] Taking a sorting arm with 10 suction nozzles as an example, when all 10 suction nozzles have adsorbed good products, and there are still good products on the adsorption worktable that have not been transferred to the good product tray, the position information of the adsorption slot containing the last good product picked up by the sorting arm is in the 2nd row and 3rd column, and the position information of the adsorption slot of the good product adjacent to the good product in the row direction that has not been picked up by the sorting arm is in the 2nd row and 1st column. Then, the adsorption slot located in the 2nd row and 1st column is taken as the new initial adsorption slot, and the moving direction from the 3rd column to the 1st column is taken as the target direction.

[0087] S720. After the sorting arm places the extracted good devices onto the good device tray, control the sorting arm to move along the row where the new initial adsorption groove is located in the target direction, so that the multiple nozzles in the sorting arm adsorb the good devices located on that row one by one.

[0088] In this step, when not all good devices on the adsorption worktable have been placed onto the good device tray by the sorting arm, and each nozzle of the sorting arm has adsorbed one good device, by using the adsorption slot corresponding to another good device that is adjacent in the row direction to the last good device picked up by the sorting arm and has not been picked up by the sorting arm as the new initial adsorption slot, and by using the movement direction of the sorting arm along that row as the target direction, the sorting arm can move along the path determined by the new initial adsorption slot and the target direction after it has moved back above the adsorption worktable from the good device tray. This allows the sorting arm to adsorb the remaining good devices on the adsorption worktable one by one, reducing the movement distance of the sorting arm along the X-axis and improving the sorting efficiency of the sorting arm.

[0089] By employing the above method, when not all good products on the adsorption worktable are placed onto the good product tray by the sorting arm, and each nozzle in the sorting arm adsorbs one good product, the initial adsorption groove and target direction are redefined. This allows the sorting arm to adsorb the remaining good products on the adsorption worktable one by one, reducing the travel distance of the sorting arm along the X-axis, improving the sorting efficiency of the sorting arm, enhancing the continuity of the adsorption action of the sorting arm on good products, shortening the adsorption time per batch, and further improving the overall sorting efficiency.

[0090] Optionally, the semiconductor packaged workpiece sorting method further includes: for each adsorption worktable, if all good devices on the adsorption worktable are extracted from the adsorption tank, and some nozzles in the sorting arm adsorb good devices on the adsorption worktable, then the nozzles in the sorting arm that do not adsorb good devices adsorb one by one adsorb the defective devices on the adsorption worktable, until all nozzles in the sorting arm that do not adsorb good devices adsorb one defective device.

[0091] Using the above method, the sorting process of multiple nozzles in the sorting arm can be seamlessly connected to the adsorption process of good and defective devices on the adsorption worktable. This avoids the interruption of sorting of defective devices and invalid path planning when all good devices on the adsorption worktable are extracted from the adsorption tank and some nozzles in the sorting arm are adsorbed with good devices on the adsorption worktable. This ensures that the sorting action of good and defective devices on the adsorption worktable is continuous and efficient, while also making full use of the remaining adsorption space of the nozzles in the sorting arm.

[0092] In some possible embodiments, both adsorption stages can move along the Y-axis, and both adsorption stages have a loading position and a sorting position.

[0093] Here, when the adsorption worktable is in the loading position, the loading robotic arm places the packaged substructures to be sorted in the semiconductor packaged workpiece onto the adsorption worktable; when the adsorption worktable is in the sorting position, the adsorption worktable is located below the sorting arm so that the sorting arm can sort the various packaged substructures located on the adsorption worktable.

[0094] Accordingly, based on the position information of the packaged substructure in the semiconductor packaged workpiece, the position information of each adsorption slot in the adsorption stage far from the good product tray, and the position information of each adsorption slot in the adsorption stage close to the good product tray, the packaged substructures are sequentially and alternately placed into the adsorption slots in the two adsorption stages, which may include the following steps: S810 controls one of the two adsorption worktables to move to the feeding position, and controls the other of the two adsorption worktables to move to the sorting position.

[0095] S820: Control the sorting arm to sort the packaged substructures in the adsorption worktable located at the sorting position; and according to the position information of each adsorption tank in the adsorption worktable located at the loading position, and the position information of the packaged substructures spaced apart in the semiconductor packaged workpiece, transfer the packaged substructures spaced apart in the semiconductor packaged workpiece to each adsorption tank in the adsorption worktable located at the loading position.

[0096] Taking adsorption workbench A, located near the good product tray, at the loading position, and adsorption workbench B, located away from the good product tray, at the sorting position, while controlling the sorting arm to sort the packaged substructures in adsorption workbench B at the sorting position, the partially spaced packaged substructures of the semiconductor packaged workpiece are transferred to the respective adsorption tanks in the adsorption workbench at the loading position. This allows the two adsorption workbench to perform the loading and sorting processes simultaneously, effectively reducing the gap between the loading and sorting processes and thus improving the rhythm and efficiency of the overall sorting operation. At the same time, this also clarifies the division of labor between the two adsorption workbench, avoiding operational errors caused by confusion between the corresponding workstations of the two adsorption workbench.

[0097] In this step, the sorting and loading of the two adsorption worktables can be controlled synchronously, maximizing the use of the sorting arm's working time, avoiding idle sorting arms, greatly improving the utilization rate of the sorting arms and the efficiency of sorting the packaged substructures, and solving the efficiency bottleneck of "sorting and loading cannot be carried out at the same time" when a single adsorption worktable is operating.

[0098] S830: After the sorting arm completes the sorting of the packaged substructures in the adsorption worktable located at the sorting position, the adsorption worktable located at the sorting position is controlled to move to the loading position; and after all the packaged substructures that are spaced apart in the semiconductor packaged workpiece are transferred to the adsorption worktable located at the loading position, the adsorption worktable located at the loading position is controlled to move to the sorting position.

[0099] Following the example in step S820, after the sorting arm completes the sorting of the packaged substructures in the adsorption workbench B located at the sorting position, the adsorption workbench B is controlled to move to the loading position. At the same time, after the portion of the packaged substructures that are spaced apart in the semiconductor packaged workpiece are respectively transferred to the respective adsorption tanks in the adsorption workbench A located at the loading position, the adsorption workbench A located at the loading position is controlled to move to the sorting position, so that the two adsorption workbenches can perform the next process respectively.

[0100] This step enables the two adsorption workstations to operate alternately in a cyclical manner, forming a closed-loop process of "loading-sorting-switching-reloading-resorting," completely eliminating breakpoints in the sorting process. On the one hand, after sorting the packaged substructures located on one adsorption workstation, controlling the adsorption workstation to switch to the loading position allows for the rapid transfer of the next batch of packaged substructures, avoiding idleness at the loading station. On the other hand, the timely switching of the adsorption workstation to the sorting position after loading allows the sorting arm to continuously perform sorting operations, achieving seamless connection between the loading and sorting processes and significantly shortening the overall operation cycle.

[0101] Furthermore, when the sorting arm sorts the packaged substructures located in the adsorption stage, such as Figure 4 As shown, since the length of the adsorption worktable in the row direction is greater than the length of the adsorption worktable in the column direction, if the two adsorption worktables are located at the sorting position, that is, the length direction of both adsorption worktables is parallel to the X-axis direction, the two adsorption worktables are prone to collision due to the limited distance between them. Therefore, the two adsorption worktables are switched alternately, and the adsorption worktables are kept parallel to the X-axis direction only at the sorting position, while the width direction of the adsorption worktables is parallel to the Y-axis direction at other times, so as to avoid collisions between the two adsorption worktables.

[0102] By adopting the above method, the sorting and loading processes corresponding to the two adsorption worktables can be synchronized and parallelized, realizing the efficient, accurate and orderly placement and sorting of semiconductor package substructures, maximizing the use of sorting arms and adsorption worktables, significantly shortening the overall sorting operation cycle, and increasing the sorting capacity of package substructures per unit time.

[0103] Figure 5This is a schematic diagram of a semiconductor packaging workpiece sorting device 900 according to an embodiment of the present invention. The semiconductor packaging workpiece sorting device 900 is used to sort multiple mutually independent packaging substructures within a semiconductor packaging workpiece. The device includes a sorting arm, and an adsorption stage, a good product tray, and a defective product tray arranged sequentially along the X-axis. The sorting arm is used to sort the various packaging substructures located on the adsorption stage into the good product tray or the defective product tray; for example... Figure 3 As shown, the device 900 also includes: The judgment module 910 is used to identify each discrete package substructure using the visual recognition module and determine whether each package substructure is a good or defective device. The position information determination module 920 is used to determine the position information of each good device and each defective device on the adsorption worktable after the target number of packaged substructures in the semiconductor packaged workpiece are transferred to the adsorption worktable, based on the identification results corresponding to each packaged substructure on the adsorption worktable and the position information of each packaged substructure on the adsorption worktable. The first drive module 930 is used to drive the sorting arm to transfer the good devices to the good device tray based on the position information of each good device on the adsorption worktable. The second drive module 940 is used to drive the sorting arm to transfer the defective devices to the defective tray based on the position information of each defective device on the adsorption worktable.

[0104] In some implementations, multiple packaging substructures in a semiconductor package workpiece are arranged sequentially in the row and column directions; there are two adsorption stages, which are arranged sequentially along the X-axis. Each adsorption stage has multiple spaced adsorption slots, with a spacer slot between adjacent adsorption slots. The multiple adsorption slots and multiple spacer slots are arranged in the row and column directions; the position information of each adsorption slot in the adsorption stage farther from the good product tray corresponds to the position information of each spacer slot in the adsorption stage closer to the good product tray. Accordingly, the device 900 also includes: The placement module is used to sequentially and alternately place each package substructure into the adsorption slots of two adsorption stages based on the position information of the package substructure in the semiconductor package workpiece, the position information of each adsorption slot in the adsorption stage away from the good product tray, and the position information of each adsorption slot in the adsorption stage close to the good product tray. This allows a portion of the package substructures that are spaced apart in the semiconductor package workpiece to be transferred to the adsorption slots in the adsorption stage away from the good product tray, and another portion of the package substructures that are spaced apart in the semiconductor package workpiece to be transferred to the adsorption slots in the adsorption stage close to the good product tray. Accordingly, the location information determination module 920 includes: The first position information determination unit is used to determine the position information of each good device and each defective device on the adsorption worktable based on the identification result corresponding to the package substructure and the position information of the package substructure on the adsorption worktable for each package substructure that is far away from the good product tray. The second position information determination unit is used to determine the position information of each good device and each defective device on the adsorption worktable based on the identification result corresponding to the package substructure and the position information of the package substructure on the adsorption worktable for each package substructure near the good product tray.

[0105] In some implementations, the first drive module 930 includes: The first driving unit is used to drive the sorting arm to extract the good device from its corresponding adsorption tank and transfer it to the good device tray for each adsorption worktable, based on the position information of the good device on the adsorption worktable. The second drive unit is used to, for each adsorption workbench, after all good devices on the adsorption workbench have been transferred to the good device tray, drive the sorting arm to extract the good devices from their corresponding adsorption tanks and transfer them to the defective device tray according to the position information of the defective devices on the adsorption workbench, until all defective devices on the adsorption workbench have been transferred to the defective device tray.

[0106] In some implementations, the sorting arm includes multiple suction nozzles; the first drive unit includes: The first control subunit is used to control multiple suction nozzles to adsorb the good devices located on the adsorption worktable after the drive sorting arm moves above the adsorption worktable for each adsorption worktable, based on the position information of the good devices on the adsorption worktable. The second control subunit is used to control multiple nozzles to move above the good product tray after all the nozzles in the sorting arm have corresponding good products adsorbed on them, and to transfer the good products adsorbed by the nozzles to the good product tray. The third control subunit is used to repeat the above steps until all good devices on the adsorption stage have been transferred to the good device tray.

[0107] In some implementations, multiple suction nozzles are arranged sequentially along the X-axis; the first control subunit includes: The first initial adsorption tank determination subunit is used to determine the initial adsorption tank of the sorting arm in the adsorption tanks located at the corner positions of the plane area where multiple adsorption tanks are located for each adsorption workbench. The first motion control subunit is used to control the sorting arm to move along the X-axis so that the suction nozzle in the sorting arm that is close to the initial suction tank moves above the initial suction tank. The second movement control subunit is used to control the sorting arm to move above the row where the initial adsorption tank is located, and to control the multiple nozzles in the sorting arm to adsorb the good devices located on that row one by one. The first repeating subunit is configured to, if all good devices in the same row are picked up by the sorting arm and at least one nozzle in the sorting arm does not adsorb a good device, then take another adsorption tank that is close to the adsorption tank in the row that is far from the initial adsorption tank as the new initial adsorption tank, and repeat the above steps until each nozzle in the sorting arm adsorbs a good device.

[0108] In some possible implementations, the device 900 further includes: The first moving path determination module is used for each adsorption workbench. If not all good products on the adsorption workbench are placed on the good product tray by the sorting arm, and each nozzle in the sorting arm adsorbs a good product, then the adsorption slot corresponding to another good product that is adjacent to the last good product picked up by the sorting arm in the row direction and has not been picked up by the sorting arm is taken as the new initial adsorption slot, and the moving direction of the sorting arm along the row is taken as the target direction. The third drive module is used to control the sorting arm to move along the row where the new initial adsorption groove is located in the target direction after the sorting arm places the good devices it has extracted onto the good device tray, so that the multiple nozzles in the sorting arm adsorb the good devices located on that row one by one.

[0109] In some possible implementations, the device 900 further includes: The fourth drive module is used to, for each adsorption workbench, if all good devices on the adsorption workbench are extracted from the adsorption tank, and some nozzles in the sorting arm adsorb good devices on the adsorption workbench, then control the nozzles in the sorting arm that do not adsorb good devices to adsorb defective devices on the adsorption workbench one by one, until all nozzles in the sorting arm that do not adsorb good devices adsorb one defective device.

[0110] In some implementations, both adsorption stages are movable along the Y-axis, and both stages have a loading position and a sorting position; the placement unit includes: The first workbench movement control subunit is used to control one of the two adsorption workbenches to move to the feeding position, and to control the other of the two adsorption workbenches to move to the sorting position. The sorting control subunit is used to control the sorting arm to sort the packaged substructures in the adsorption workbench located at the sorting position; and according to the position information of each adsorption tank in the adsorption workbench located at the loading position, and the position information of the packaged substructures that are spaced apart in the semiconductor packaged workpiece, the packaged substructures that are spaced apart in the semiconductor packaged workpiece are respectively transferred to each adsorption tank in the adsorption workbench located at the loading position. The second workbench movement control subunit is used to control the adsorption workbench located at the sorting position to move to the loading position after the sorting arm has sorted the packaged substructures in the adsorption workbench located at the sorting position; and to control the adsorption workbench located at the loading position to move to the sorting position after all the packaged substructures that are spaced apart in the semiconductor packaged workpiece have been transferred to the adsorption workbench located at the loading position.

[0111] It should be understood that the embodiments of the semiconductor packaged workpiece sorting device and the embodiments of the semiconductor packaged workpiece sorting method can correspond to each other, and similar descriptions can be found in the embodiments of the semiconductor packaged workpiece sorting method. To avoid repetition, further details are omitted here. Specifically, Figure 5 The apparatus 900 shown can perform the above-described semiconductor packaged workpiece sorting method embodiment, and the aforementioned and other operations and / or functions of each module in the apparatus 900 are respectively for implementing the corresponding process in the above-described semiconductor packaged workpiece sorting method, which will not be described in detail here for the sake of brevity.

[0112] The apparatus 900 of this invention, in conjunction with the accompanying drawings, has been described above from the perspective of functional modules. It should be understood that this functional module can be implemented in hardware, in software instructions, or in a combination of hardware and software modules. Specifically, the steps of the semiconductor packaged workpiece sorting method and detection method embodiments of this invention can be completed by integrated logic circuits in the processor's hardware and / or by software instructions. The steps of the semiconductor packaged workpiece sorting method and detection method disclosed in this invention can be directly manifested as execution by a hardware decoding processor, or by a combination of hardware and software modules in the decoding processor. Optionally, the software module can be located in a mature storage medium in the art, such as random access memory, flash memory, read-only memory, programmable read-only memory, electrically erasable programmable memory, or registers. This storage medium is located in memory; the processor reads information from the memory and, in conjunction with its hardware, completes the steps of the above-described semiconductor packaged workpiece sorting method and detection method embodiments.

[0113] Figure 6 This is a schematic block diagram of an electronic device 110 according to an embodiment of the present invention.

[0114] like Figure 6 As shown, the electronic device 110 may include: The system includes a memory 111 and a processor 112. The memory 111 stores computer programs and transfers the program code to the processor 112. In other words, the processor 112 can retrieve and run the computer programs from the memory 111 to implement the methods described in the embodiments of the present invention.

[0115] For example, the processor 112 can be used to execute the above-described method embodiments according to instructions in the computer program.

[0116] In some embodiments of the present invention, the electronic device 110 may include, but is not limited to: General-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc.

[0117] In some embodiments of the present invention, the memory 111 includes, but is not limited to: Volatile memory and / or non-volatile memory. Non-volatile memory can be read-only memory (ROM), programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM), or flash memory. Volatile memory can be random access memory (RAM), used as an external cache. By way of example, but not limitation, many forms of RAM are available, such as Static RAM (SRAM), Dynamic RAM (DRAM), Synchronous DRAM (SDRAM), Double Data Rate SDRAM (DDR SDRAM), Enhanced Synchronous DRAM (ESDRAM), Synchronous Link DRAM (SLDRAM), and Direct Rambus RAM (DR RAM).

[0118] In some embodiments of the present invention, the computer program may be divided into one or more modules, which are stored in the memory 111 and executed by the processor 112 to perform the method provided by the present invention. The one or more modules may be a series of computer program instruction segments capable of performing a specific function, which describe the execution process of the computer program in the controller.

[0119] like Figure 6 As shown, the electronic device 110 may further include: Transceiver 113, which can be connected to processor 112 or memory 111.

[0120] The processor 112 can control the transceiver 113 to communicate with other devices; specifically, it can send information or data to other devices or receive information or data sent by other devices. The transceiver 113 may include a transmitter and a receiver. The transceiver 113 may further include antennas, and the number of antennas may be one or more.

[0121] It should be understood that the various components in the electronic device are connected through a bus system, which includes a data bus, a power bus, a control bus, and a status signal bus.

[0122] One embodiment of the present invention provides a cutting and sorting integrated machine, including a semiconductor packaging workpiece sorting device as described in the above embodiment, or an electronic device as described in the above embodiment.

[0123] The present invention also provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a computer, enables the computer to perform the methods of the above-described method embodiments. Alternatively, one embodiment of the present invention also provides a computer program product containing instructions that, when executed by a computer, cause the computer to perform the methods of the above-described method embodiments.

[0124] When implemented using software, it can be implemented entirely or partially as a computer program product. This computer program product includes one or more computer instructions. When these computer program instructions are loaded and executed on a computer, all or part of the processes or functions described in the embodiments of the present invention are generated. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions can be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another. For example, the computer instructions can be transmitted from one website, computer, server, or data center to another via wired (e.g., coaxial cable, fiber optic, Digital Subscriber Line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) means. The computer-readable storage medium can be any available medium accessible to a computer or a data storage device such as a server or data center that integrates one or more available media. The available medium can be a magnetic medium (e.g., floppy disk, hard disk, magnetic tape), an optical medium (e.g., Digital Video Disc (DVD)), or a semiconductor medium (e.g., Solid State Disk (SSD)).

[0125] Those skilled in the art will recognize that the modules and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementations should not be considered beyond the scope of this invention.

[0126] In the several embodiments provided by this invention, it should be understood that the disclosed systems, apparatuses, and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of modules is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple modules or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between devices or modules may be electrical, mechanical, or other forms.

[0127] The modules described as separate components may or may not be physically separate. The components shown as modules may or may not be physical modules; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. For example, the functional modules in the various embodiments of this application may be integrated into one processing module, or each module may exist physically separately, or two or more modules may be integrated into one module.

[0128] The above are merely specific embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A method for sorting semiconductor packaged parts, applied to a semiconductor packaged part sorting device, characterized in that, The semiconductor packaged workpiece includes multiple discrete packaged substructures; the semiconductor packaged workpiece sorting device includes a sorting arm, and an adsorption stage, a good product tray, and a defective product tray arranged sequentially along the X-axis; the sorting arm is used to sort each of the packaged substructures located in the adsorption stage into the good product tray or the defective product tray; the method includes: The visual recognition module is used to identify each discrete package substructure and determine whether each package substructure is a good or defective device. After the target number of the packaged substructures in the semiconductor packaged workpiece are transferred to the adsorption worktable, the position information of each good device and the position information of each defective device on the adsorption worktable are determined according to the identification results corresponding to each of the packaged substructures on the adsorption worktable and the position information of each of the packaged substructures on the adsorption worktable. Based on the position information of each of the good products on the adsorption worktable, the sorting arm is driven to transfer the good products to the good product tray; Based on the position information of each defective device on the adsorption worktable, the sorting arm is driven to transfer the defective device to the defective tray. The semiconductor packaging workpiece has multiple packaging substructures arranged sequentially in the row and column directions; there are two adsorption stages, which are arranged sequentially along the X-axis. Each adsorption stage has multiple spaced adsorption slots, and there is a spacer slot between two adjacent adsorption slots. The multiple adsorption slots and the multiple spacer slots are arranged in the row and column directions; wherein, the position information of each adsorption slot in the adsorption stage away from the good product tray corresponds to the position information of each spacer slot in the adsorption stage close to the good product tray. Accordingly, the method further includes: Based on the position information of the encapsulation substructure in the semiconductor package workpiece, the position information of each adsorption slot in the adsorption stage away from the good product tray, and the position information of each adsorption slot in the adsorption stage close to the good product tray, each encapsulation substructure is sequentially and alternately placed into the adsorption slots in the two adsorption stages, so that a portion of the encapsulation substructures spaced apart in the semiconductor package workpiece are respectively transferred to the adsorption slots in the adsorption stage away from the good product tray, and another portion of the encapsulation substructures spaced apart in the semiconductor package workpiece are respectively transferred to the adsorption slots in the adsorption stage close to the good product tray; Accordingly, determining the position information of each good device and each defective device on the adsorption worktable based on the identification results corresponding to each of the encapsulation substructures located on the adsorption worktable and the position information of each of the encapsulation substructures on the adsorption worktable includes: For each of the encapsulation substructures on the adsorption worktable that is far from the good product tray, the position information of each good product device and the position information of each defective product device on the adsorption worktable are determined based on the identification result corresponding to the encapsulation substructure and the position information of the encapsulation substructure on the adsorption worktable. For each of the encapsulation substructures on the adsorption worktable near the good product tray, the position information of each good product device and the position information of each defective product device on the adsorption worktable are determined based on the identification result corresponding to the encapsulation substructure and the position information of the encapsulation substructure on the adsorption worktable.

2. The semiconductor packaging workpiece sorting method according to claim 1, characterized in that, The step of driving the sorting arm to transfer the good devices to the good device tray based on the position information of each of the good devices on the adsorption worktable includes: For each of the adsorption worktables, based on the position information of the good product device on the adsorption worktable, the sorting arm is driven to extract the good product device from the adsorption tank corresponding to it and transfer it to the good product tray. For each adsorption workbench, after all the good products on the adsorption workbench are transferred to the good product tray, the sorting arm is driven to extract the good products from their corresponding adsorption tanks and transfer them to the defective product tray according to the position information of the defective products on the adsorption workbench, until all the defective products on the adsorption workbench are transferred to the defective product tray.

3. The semiconductor packaging workpiece sorting method according to claim 2, characterized in that, The sorting arm includes multiple suction nozzles; for each of the adsorption worktables, based on the position information of the good product device on the adsorption worktable, the sorting arm is driven to extract the good product device from its corresponding adsorption tank and transfer it to the good product tray, including: For each of the adsorption worktables, after driving the sorting arm to move above the adsorption worktable, according to the position information of the good product device on the adsorption worktable, multiple suction nozzles are controlled to adsorb the good product device located on the adsorption worktable. After all the good products are attached to the nozzles in the sorting arm, the nozzles are moved to the top of the good product tray and the good products attached to the nozzles are transferred to the good product tray. Repeat the above steps until all the good devices located on the adsorption stage have been transferred to the good device tray.

4. The semiconductor packaging workpiece sorting method according to claim 3, characterized in that, Multiple suction nozzles are arranged sequentially along the X-axis; for each suction stage, based on the position information of the good device on the suction stage, the multiple suction nozzles are controlled to adsorb the good device located on the suction stage, including: For each of the adsorption workbenches, the initial adsorption groove of the sorting arm is determined in the adsorption groove located at the corner of the plane area where the multiple adsorption grooves are located. Control the sorting arm to move along the X-axis so that the suction nozzle in the sorting arm that is close to the initial adsorption tank moves above the initial adsorption tank; The sorting arm is controlled to move above the row where the initial adsorption tank is located, and the multiple nozzles in the sorting arm are controlled to adsorb the good devices located on that row one by one. If all the good products in the same row are picked up by the sorting arm, and at least one nozzle in the sorting arm does not pick up the good product, then the other adsorption tank that is close to the adsorption tank in the same row that is far away from the initial adsorption tank is taken as the new initial adsorption tank, and the above steps are repeated until each nozzle in the sorting arm picks up a good product.

5. The semiconductor packaged workpiece sorting method according to claim 4, characterized in that, Also includes: For each of the adsorption worktables, if not all of the good products on the adsorption worktable are placed onto the good product tray by the sorting arm, and each nozzle in the sorting arm adsorbs one good product, then the adsorption slot corresponding to another good product that is adjacent in the row direction to the last good product picked up by the sorting arm and has not been picked up by the sorting arm is taken as a new initial adsorption slot, and the moving direction of the sorting arm along that row is taken as the target direction. After the sorting arm places the extracted good products onto the good product tray, the sorting arm is controlled to move along the row where the new initial adsorption groove is located in the target direction, so that the multiple nozzles in the sorting arm adsorb the good products located on that row one by one.

6. The semiconductor packaging workpiece sorting method according to claim 4, characterized in that, Also includes: For each of the adsorption worktables, if all the good products on the adsorption worktable are extracted from the adsorption tank, and some of the nozzles in the sorting arm have adsorbed the good products on the adsorption worktable, then the nozzles in the sorting arm that have not adsorbed the good products will be controlled to adsorb the defective products on the adsorption worktable one by one, until all the nozzles in the sorting arm that have not adsorbed the good products have adsorbed one defective product.

7. The semiconductor packaged workpiece sorting method according to claim 1, characterized in that, Both adsorption worktables are movable along the Y-axis, and both adsorption worktables have a loading position and a sorting position; the step of sequentially and alternately placing each of the encapsulation substructures into the adsorption slots of the two adsorption worktables according to the position information of the encapsulation substructure in the semiconductor package workpiece, the position information of each of the adsorption slots in the adsorption worktable away from the good product tray, and the position information of each of the adsorption slots in the adsorption worktable close to the good product tray, includes: Control one of the two adsorption worktables to move to the feeding position, and control the other of the two adsorption worktables to move to the sorting position; The sorting arm is controlled to sort the encapsulation substructures in the adsorption workbench located at the sorting position; and according to the position information of each adsorption tank in the adsorption workbench located at the loading position, and the position information of the encapsulation substructures spaced apart in the semiconductor encapsulation workpiece, the encapsulation substructures spaced apart in the semiconductor encapsulation workpiece are respectively transferred to each adsorption tank in the adsorption workbench located at the loading position. After the sorting arm sorts the packaged substructures in the adsorption worktable located at the sorting position, the adsorption worktable located at the sorting position is moved to the loading position; and after all the packaged substructures that are spaced apart in the semiconductor packaged workpiece are transferred to the adsorption worktable located at the loading position, the adsorption worktable located at the loading position is moved to the sorting position.

8. A semiconductor package workpiece sorting device, used for sorting multiple mutually independent package substructures in a semiconductor package workpiece, characterized in that, The device includes a sorting arm, and an adsorption worktable, a good product tray, and a defective product tray arranged sequentially along the X-axis. The sorting arm is used to sort the various packaging substructures located in the adsorption worktable into the good product tray or the defective product tray. The device also includes: The judgment module is used to identify each discrete package substructure using the visual recognition module, and to determine whether each package substructure is a good device or a defective device. The position information determination module is used to determine the position information of each good device and the position information of each defective device on the adsorption worktable after the target number of the packaged substructures in the semiconductor packaged workpiece are transferred to the adsorption worktable, based on the identification results corresponding to each of the packaged substructures located on the adsorption worktable and the position information corresponding to each of the packaged substructures on the adsorption worktable. The first drive module is used to drive the sorting arm to transfer the good products to the good product tray according to the position information of each of the good products on the adsorption worktable; The second drive module is used to drive the sorting arm to transfer the defective devices to the defective tray according to the position information of each defective device on the adsorption worktable. The semiconductor packaging workpiece has multiple packaging substructures arranged sequentially in the row and column directions; there are two adsorption stages, which are arranged sequentially along the X-axis. Each adsorption stage has multiple spaced adsorption slots, and there is a spacer slot between two adjacent adsorption slots. The multiple adsorption slots and the multiple spacer slots are arranged in the row and column directions; wherein, the position information of each adsorption slot in the adsorption stage away from the good product tray corresponds to the position information of each spacer slot in the adsorption stage close to the good product tray. Accordingly, the semiconductor packaged workpiece sorting device further includes: A placement module is configured to, based on the position information of the packaged substructure in the semiconductor packaged workpiece, the position information of each adsorption slot in the adsorption stage away from the good product tray, and the position information of each adsorption slot in the adsorption stage close to the good product tray, sequentially and alternately place each packaged substructure into the adsorption slots of two adsorption stages, so that a portion of the packaged substructures spaced apart in the semiconductor packaged workpiece are respectively transferred to the adsorption slots in the adsorption stage away from the good product tray, and another portion of the packaged substructures spaced apart in the semiconductor packaged workpiece are respectively transferred to the adsorption slots in the adsorption stage close to the good product tray; Accordingly, the location information determination module includes: The first position information determination unit is used to determine the position information of each good device and each defective device on the adsorption worktable based on the identification result corresponding to the encapsulation substructure and the position information of the encapsulation substructure on the adsorption worktable for each encapsulation substructure that is far away from the good product tray. The second position information determination unit is used to determine the position information of each good product device and the position information of each defective product device on the adsorption worktable for each of the packaging substructures near the good product tray, based on the identification result corresponding to the packaging substructure and the position information of the packaging substructure on the adsorption worktable.

9. An electronic device, characterized in that, include: A processor and a memory, the memory being used to store a computer program, the processor being used to invoke and run the computer program stored in the memory to perform the method of any one of claims 1-7.

10. A computer-readable storage medium, characterized in that, Used to store a computer program that causes a computer to perform the method as described in any one of claims 1-7.

11. A cutting and sorting integrated machine, characterized in that, This includes the semiconductor packaged workpiece sorting device as described in claim 8, or the electronic device as described in claim 9.

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