Electrochromic device preparation method

Abstract

The application provides a preparation method of an electrochromic device, comprising the following steps: forming a stepped through hole in an electrochromic diaphragm, the through hole exposes a binding part formed by a part of a first conductive layer or a second conductive layer, and the through hole cooperates with a first base material to form a glue groove; electrically connecting an outgoing structure on the binding part, and making the outgoing structure located in the glue groove; filling and solidifying sealant into the glue groove, the sealant covers the outgoing structure and an end surface of the electrochromic diaphragm; and removing part of the sealant to expose part of the outgoing structure. The sealant covers the outgoing structure and the end surface of the electrochromic diaphragm together, blocks the water and oxygen access channel between the electrochromic diaphragm and the sealant, improves the sealing performance of the device, and is beneficial to maintaining the structural stability of the entire electrochromic device.

Description

Technical Field

[0001] This invention relates to the field of electrochromic technology, and more particularly to a method for preparing an electrochromic device. Background Technology

[0002] An electrochromic device is a device that can change color under the influence of voltage. The core of an electrochromic device is an electrochromic material. When a voltage is applied or removed, the electrochromic material changes its light absorption characteristics, thereby changing its color.

[0003] In electrochromic devices, the electrochromic film is sealed with sealant. Simultaneously, a portion of the conductive layer within the electrochromic film needs to extend beyond the sealed area to connect with the flexible circuit board. However, the exposed end face of this conductive layer results in poor sealing at the interface with the sealant, allowing moisture and oxygen to easily penetrate into the electrochromic film and compromise the overall structural stability of the electrochromic device. Summary of the Invention

[0004] In order to solve the problems existing in the prior art, one of the objectives of this invention is to provide a method for preparing an electrochromic device.

[0005] This invention provides a technical solution as described below:

[0006] An electrochromic film and a first substrate are provided. The electrochromic film includes a first substrate, a first conductive layer, a color-changing material layer, a second conductive layer, and a second substrate, which are stacked sequentially. A stepped through-hole is formed in the electrochromic film, exposing a bonding portion formed by a portion of the first conductive layer or a portion of the second conductive layer, and the through-hole cooperates with the first substrate to form an adhesive groove. An lead-out structure is electrically connected to the bonding portion, and the lead-out structure is located in the adhesive groove. A sealant is filled into the adhesive groove and cured, and the sealant covers the lead-out structure and the end face of the electrochromic film. A portion of the sealant is removed to expose a portion of the lead-out structure.

[0007] Preferably, the cured sealant includes curing only the remaining portion of the sealant excluding the removed portion.

[0008] Preferably, the cured sealant includes: pre-curing all of the sealant; removing a portion of the sealant to expose a portion of the lead-out structure; and curing the remaining portion of the sealant until fully cured.

[0009] Preferably, curing the sealant includes: masking the portion of the sealant to be removed, and irradiating the remaining portion of the sealant using a photocuring source, wherein the sealant includes a photocurable material.

[0010] Preferably, the through hole includes a first through hole and a second through hole that are interconnected. The first through hole extends from the surface of the second substrate to the surface of the first conductive layer, and the second through hole extends through the first conductive layer and the first substrate. The cross-sectional size of the first through hole is larger than the cross-sectional size of the second through hole.

[0011] Preferably, the electrochromic film is fixed to the first substrate by a first adhesive layer, and the through hole penetrates the first adhesive layer.

[0012] Preferably, the preparation method further includes removing a portion of the first adhesive layer to form a groove communicating with the adhesive groove between the electrochromic film and the first adhesive layer, and the sealant further fills the groove.

[0013] Preferably, the entire sealant is pre-cured with a first curing energy and the remaining portion is cured with a second curing energy, wherein the first curing energy accounts for 5 to 30% of the sum of the first curing energy and the second curing energy.

[0014] Preferably, the preparation method further includes: dividing the electrochromic film into a first film and a second film, wherein the second film surrounds the outside of the first film and a through groove is formed between the first film and the second film, the through groove penetrating the electrochromic film and communicating with the through hole;

[0015] The through groove and the through hole cooperate with the first substrate to form the adhesive groove.

[0016] Preferably, the second diaphragm is removed, while the sealant covering the end face of the first diaphragm is retained.

[0017] Preferably, a portion of the sealant is removed, leaving the end of the lead-out structure away from the binding portion exposed to the sealant.

[0018] As a further optional embodiment of the method for fabricating the electrochromic device, the curing of the sealant includes:

[0019] A first part of cured sealant, the first part including sealant corresponding to the bonding portion; and a second part of semi-cured or uncured sealant, the second part including sealant corresponding to the end of the lead-out structure away from the bonding portion.

[0020] As a further optional embodiment of the method for fabricating the electrochromic device, the curing of the sealant includes:

[0021] The curing energy exerted by the curing source on the first part is greater than the curing energy exerted on the second part.

[0022] As a further optional embodiment of the method for fabricating the electrochromic device, the curing of the sealant includes:

[0023] A photocurable source is used to irradiate the first part of the sealant and the second part of the sealant, respectively. The irradiation energy per unit time applied to the first part is greater than the irradiation energy per unit time applied to the second part, or the curing time applied to the first part is greater than the curing time applied to the second part; or

[0024] A thermosetting source is used to heat the first part of the sealant and the second part of the sealant, respectively. The curing temperature of the thermosetting source when applied to the first part is higher than that when applied to the second part, or the curing time of the thermosetting source when applied to the first part is longer than that when applied to the second part.

[0025] As a further optional solution to the method for preparing the electrochromic device, the sealant for the first part and the sealant for the second part are made of different materials.

[0026] As a further optional embodiment of the method for fabricating the electrochromic device, the curing of the sealant includes:

[0027] The curing source delivers curing energy to the first part of the sealant and prevents the curing energy from being delivered to the second part of the sealant.

[0028] The method for preparing the electrochromic device provided by this invention has the following beneficial effects:

[0029] When fabricating an electrochromic device using the above-described method, a through-hole is first formed in the electrochromic film, penetrating the film. Simultaneously, a first substrate and the through-hole form a glue groove. The stepped through-hole within the electrochromic film exposes one of the conductive layers within the glue groove, forming a bonding portion. Subsequently, a lead-out structure is bonded to the bonding portion and housed within the glue groove. Sealant is then filled into the glue groove, covering both the lead-out structure and the end faces of the electrochromic film. After the sealant cures, it completely covers both the lead-out structure and the end faces of the electrochromic film, eliminating the need for the conductive layer in the electrochromic film to extend beyond the sealant. This blocks the entry of water and oxygen between the electrochromic film and the sealant, improving the device's sealing performance and contributing to the overall structural stability of the electrochromic device.

[0030] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0031] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0032] Figure 1 A schematic diagram of the structure of an electrochromic device in the related technology is shown;

[0033] Figure 2 A flowchart illustrating the steps of a method for fabricating an electrochromic device according to an embodiment of the present invention is shown.

[0034] Figure 3 A cross-sectional schematic diagram of the glue tank is shown;

[0035] Figure 4 A top view of the glue tank in one embodiment is shown;

[0036] Figure 5 A top view of the glue tank in another embodiment is shown;

[0037] Figure 6 A top view of the glue tank in yet another embodiment is shown;

[0038] Figure 7 A schematic diagram of the state after the lead-out structure is bound is shown;

[0039] Figure 8 A schematic diagram of the groove structure is shown;

[0040] Figure 9 This diagram illustrates the state after filling with sealant in one embodiment of the present invention.

[0041] Figure 10 This diagram illustrates the state of the sealant after separation within the second region, according to an embodiment of the present invention.

[0042] Figure 11 A schematic diagram of the final form of the electrochromic device in one embodiment of the present invention is shown.

[0043] Figure 12 A schematic diagram of the state after placing the second substrate is shown in another embodiment of the present invention;

[0044] Figure 13 A schematic diagram showing the thickness dimensions of an electrochromic device provided in an embodiment of the present invention is shown;

[0045] Figure 14 A schematic diagram showing the width dimensions of an electrochromic device provided in an embodiment of the present invention is shown;

[0046] Figure 15 This diagram illustrates the structure of an electrochromic device provided in an embodiment of the present invention outside the lead-out structure binding area.

[0047] Explanation of key component symbols:

[0048] 10 - Water and oxygen barrier layer; 20 - Optical adhesive layer; 30 - Thin film substrate layer; 40 - Conductive layer; 50 - Functional layer; 60 - Flexible circuit board; 70 - Protective adhesive layer;

[0049] 100 - Electrochromic film; 101 - First film; 102 - Second film; 110 - First substrate; 120 - First conductive layer; 121 - Bonding portion; 130 - Color-changing material layer; 140 - Second conductive layer; 150 - Second substrate; 200 - First base material; 210 - Center portion; 220 - Edge portion; 300 - Adhesive groove; 310 - First region; 320 - Second region; 400 - Lead-out structure; 410 - Lead-out portion; 500 - Electrical connector; 600 - First adhesive layer; 610 - Groove; 700 - Second base material; 800 - Second adhesive layer; 900 - Sealant layer; 450 - Through hole; 401 - First through hole; 402 - Second through hole; 460 - Through groove. Detailed Implementation

[0050] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0051] It should be noted that when an element is said to be "fixed to" another element, it can be directly on the other element or there may be an intervening element. When an element is said to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. Conversely, when an element is said to be "directly on" another element, there is no intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0052] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0053] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0054] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the template description is for the purpose of describing particular embodiments only and is not intended to limit the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0055] Please see Figure 1 In related technologies, electrochromic devices mainly include a water-oxygen barrier layer 10, an optical adhesive layer 20, a thin film substrate layer 30, a conductive layer 40, a functional layer 50, a sealant layer 900, a flexible circuit board 60, and a protective adhesive layer 70. Electrochromic devices are widely used in automotive sunroofs, automotive side windows, rearview mirrors, curtain walls, consumer electronics housings, eyeglasses, and other fields. The functional layer 50, including the electrochromic layer, changes its transmittance in response to voltage changes. The functional layer 50 is sensitive to water vapor and oxygen and requires protection. Therefore, a water-oxygen barrier layer 10 is bonded to one side of the thin film substrate layer 30 using the optical adhesive layer 20, and a sealant layer 900 is placed between the water-oxygen barrier layer 10 and the conductive layer 40 on the opposite side of the thin film substrate layer 30. The sealant layer 900 effectively prevents water vapor and oxygen from entering the functional layer 50 from its end face.

[0056] Since the bonding area between the conductive layer 40 and the flexible circuit board 60 is located outside the sealant layer 900, the conductive layer 40 needs to extend beyond the sealing area to bond with the flexible circuit board 60. This results in the sealant layer 900 only bonding the water and oxygen barrier layer 10 on one side and the conductive layer 40 on the other side within the bonding area. The poor sealing effect of the interface between the sealant layer 900 and the conductive layer 40 creates a channel for water and oxygen to enter. This leads to a channel between the sealant layer 900 and the conductive layer 40 that allows water and oxygen to enter the functional layer 50, potentially damaging the structural stability of the functional layer 50 and the entire electrochromic device.

[0057] For information regarding the problems existing in the relevant prior art, please refer to [link / reference]. Figure 2 as well as Figure 3 and Figure 4 This application provides a method for fabricating an electrochromic device, comprising the following steps:

[0058] S01, providing an electrochromic film 100 and a first substrate 200, please refer to Figure 3 The electrochromic film 100 includes a first substrate 110, a first conductive layer 120, a color-changing material layer 130, a second conductive layer 140, and a second substrate 150, which are stacked sequentially.

[0059] S02, please refer to Figure 3 and Figure 4 A stepped through-hole 450 is formed within the electrochromic film 100, exposing a bonding portion 121 formed by a portion of the conductive layer, which mates with the first substrate 200 to form an adhesive groove 300. It is worth noting that the exposed portion of the conductive layer may be a portion of the first conductive layer 120 and / or a portion of the second conductive layer 140. This application embodiment further details the process using the exposed portion of the first conductive layer 120.

[0060] The electrochromic film 100 is fixed to the first substrate 200 by the first adhesive layer 600, and the through hole 450 penetrates the first adhesive layer 600.

[0061] Furthermore, stepped through-holes 450 are formed at the locations on the electrochromic film 100 where bonding is required. Specifically, the through-holes can be formed in the following ways:

[0062] Alternatively, the electrochromic film 100 can be formed with a through hole 450 first, and then the electrochromic film 100 and the first substrate 200 can be fixed together by the first adhesive layer 600. Or, the electrochromic film 100 and the first substrate 200 can be fixed together by the first adhesive layer 600 first, and then the through hole 450 can be formed in the electrochromic film 100.

[0063] In some embodiments, please combine Figure 3 The through-hole 450 includes a first through-hole 401 and a second through-hole 402 that are interconnected. The first through-hole 401 extends from the surface of the second substrate 150 to the surface of the first conductive layer 120, that is, it penetrates the second substrate 150, the second conductive layer 140, and the color-changing material layer 130. The second through-hole 402 penetrates the first conductive layer 120, the first substrate 110, and the first adhesive layer 600. The cross-sectional dimension of the first through-hole 401 is larger than that of the second through-hole 402, thereby exposing a portion of the first conductive layer 120 that will subsequently be used as the bonding portion 121.

[0064] In the implementation process, two first etch lines penetrating the second substrate 150, the second conductive layer 140, and the color-changing material layer 130 can be formed by laser cutting. After removing the film and wiping, the first conductive layer 120 is exposed, forming the first via 401. Then, a second etch line penetrating the first conductive layer 120 and the first substrate 110 is laser-etched on the exposed first conductive layer 120. After removing the corresponding first substrate 110 and first conductive layer 120, the second via 402 can be formed.

[0065] There are various ways to combine the electrochromic film 100 with the first substrate 200. In this embodiment, the two are bonded together by the first adhesive layer 600, which is only an example.

[0066] Furthermore, the method for forming the electrochromic film 100 can be any of the conventional techniques.

[0067] For example, firstly, a flexible first substrate 110 and a first conductive layer 120 are released, and an electrochromic material layer is formed on the surface of the first conductive layer 120 facing away from the first substrate 110. Simultaneously, a flexible second substrate 150 and a second conductive layer 140 are released, and an ion storage layer is formed on the surface of the second conductive layer 140 facing away from the second substrate 150. Then, the electrochromic material layer and the ion storage layer are positioned opposite each other, an electrolyte is formed between the electrochromic material layer and the ion storage layer, and the electrolyte is cured to form an electrolyte layer, ultimately obtaining an electrochromic film 100.

[0068] The electrochromic material layer, the electrolyte layer, and the ion storage layer together constitute the color-changing material layer 130.

[0069] Specifically, such as Figure 3 As shown, the first substrate 200 includes a central portion 210 and an edge portion 220 surrounding the central portion 210. A first through-hole 401 is formed by removing a portion of the second substrate 150, the second conductive layer 140, and the color-changing material layer 130 from the outer surface of the second substrate 150 toward the first conductive layer 120 in a direction perpendicular to the first substrate 200. Then, a portion of the first conductive layer 120, the first substrate 110, and the first adhesive layer 600 smaller than the cross-sectional size of the first through-hole 401 is removed from the outer surface of the first conductive layer 120 toward the first substrate 200, forming a second through-hole 402. This forms a stepped through-hole 450 within the electrochromic film 100, with the edge portion 220 serving as a bottom and engaging with the through-hole 450 to form an adhesive groove 300. In this embodiment, the opposing sidewalls of the first diaphragm 101 and the second diaphragm 102 surround the surface of the first substrate 200 to form a sealant groove 300 for containing sealant. The first substrate 200 serves as the bottom to support the sealant, and the first diaphragm 101 and the second diaphragm 102 serve as the sidewalls of the sealant groove 300 to restrict the flow of the sealant, thereby facilitating the application of the sealant.

[0070] It is worth noting that the cross-sectional dimensions mentioned in this application refer to the dimensions along the electrochromic film 100 from the inside out.

[0071] like Figure 4 As shown, in other embodiments, the method of forming the stepped through-hole 450 may also include using a laser to form a first etch line that penetrates the entire film and a second etch line spaced apart from the first etch line. After removing this part of the film, a third etch line with a notch shape that penetrates the second substrate 150, the second conductive layer 140 and the color-changing material layer 130 is etched into the corresponding internal film. Then, the corresponding part is removed to expose part of the first conductive layer 120, thereby forming the bonding part 121.

[0072] like Figure 4 As shown, in some embodiments of this application, the through hole 450 may be provided only for the part that needs to be bound, or it may form an annular through groove 460 (e.g. Figure 5 As shown in the figure, that is, when viewed from the plane extending from the electrochromic film 100, the projections of the through hole 450 and the through groove 460 on the plane where the electrochromic film 100 is located coincide.

[0073] like Figure 6 As shown, in some embodiments of this application, the preparation method further includes: dividing the electrochromic film 100 into a first film 101 and a second film 102, the second film 102 surrounding the outside of the first film 101, and forming an annular through groove 460 between the first film 101 and the second film 102, the through groove 460 penetrating the electrochromic film 100 and communicating with the through hole 450; the through groove 460 and the through hole 450 cooperating with the first substrate 200 to form the adhesive groove 300. It is worth noting that in this application, the order in which the through hole 450 and the through groove 460 are formed is not limited; they can be formed separately or together. The adhesive groove 300 structure can be formed. The annular shape can be circular or square; in this application, it means forming a circumferential through groove.

[0074] In some embodiments, the preparation method further includes: removing the second diaphragm 102 while retaining the sealant covering the end face of the first diaphragm 101. Removing the second diaphragm 102 can be performed using laser cutting to remove both the second diaphragm 102 and the first substrate 200 corresponding to the second diaphragm 102.

[0075] For example, the first substrate 200 employs a water-oxygen barrier layer 10. The water-oxygen barrier layer 10 can better block water vapor and oxygen, and together with the sealant, effectively seal the electrochromic film 100.

[0076] The conductive layer may be a first conductive layer 120 and / or a second conductive layer 140.

[0077] In this embodiment, taking a portion of the first conductive layer 120 as the bonding portion 121 as an example, one or more bonding areas are provided inside the edge portion 220 of the first substrate 200. When removing the electrochromic film 100 above the edge portion 220, the first substrate 110 and the first conductive layer 120 relative to the bonding area are retained, and only the color-changing material layer 130, the second conductive layer 140, and the second substrate 150 relative to the bonding area are removed, thereby forming the bonding portion 121. It can be understood that the bonding portion 121 protrudes from the inside to the outside of the color-changing material layer 130 along the electrochromic film 100 so as to be electrically connected to the lead-out structure 400.

[0078] S03, the lead-out structure 400 is electrically connected to the binding part 121, and the lead-out structure 400 is located in the glue groove 300.

[0079] Please combine Figure 7 For example, the lead-out structure 400 is a flexible circuit board, through which the conductive layer 40 of the electrochromic film 100 is connected to an external power source, and the lead-out structure 400 is bound to the binding part 121 by an electrical connector 500.

[0080] The electrical connector 500 can be made of ACF (Anisotropic Conductive Film) or ACP (Anisotropic Conductive Paste).

[0081] In other embodiments, a portion of the second conductive layer 140 may be exposed as the bonding portion 121. The implementation principle is the same as forming the bonding portion 121 on the first conductive layer 120, and will not be elaborated further here. When only one conductive layer 40 is retained as the bonding portion 121, the electrochromic film 100 adopts a single-sided lead-out method. For example, two independent and electrically insulated regions are provided on the first conductive layer 120, one region connecting to the busbar on the first conductive layer 120, and the other region electrically connecting to the busbar on the second conductive layer 140; this achieves single-sided conduction. Similarly, forming the bonding portion 121 solely on the second conductive layer 140 is also acceptable, and will not be elaborated further here. Using the single-sided conduction method, it is only necessary to align the bonding portion 121 towards the opening of the through hole 450 to facilitate bonding the lead-out structure 400. Simultaneously, sealant is injected through the opening of the through hole 450, and the sealant directly covers the lead-out structure 400. The lead-out structure 400 does not obstruct the sealant from filling the glue groove 300, making it easier for the sealant to fill the entire glue groove 300, thereby improving the sealing performance.

[0082] Furthermore, in some other embodiments of this application, a portion of the first conductive layer 120 and a portion of the second conductive layer 140 may be exposed simultaneously as a bonding area. The bonding portions 121 of the first conductive layer 120 and the second conductive layer 140 are respectively connected to the lead-out structure 400 and respectively connected to the positive or negative terminal of the power supply through the lead-out structure 400.

[0083] S04, fill and cure sealant into the glue tank 300, and the sealant covers the end faces of the lead-out structure 400 and the electrochromic diaphragm 100.

[0084] Please combine Figure 3 As shown, in the direction in which the binding part 121 extends, the binding part 121 does not completely cover the width of the through hole 450. That is to say, there is a gap between the end face of the binding part 121 and the second diaphragm 102, and the end face of the electrochromic diaphragm 100 is covered by sealant filled through the gap.

[0085] S05, Remove part of the sealant to expose part of the lead-out structure 400.

[0086] It is worth noting that the order of the above steps can be arbitrarily changed without conflict. When fabricating an electrochromic device using the above-described method, a through-hole 450 is first formed through the electrochromic film 100, and simultaneously, a first substrate 200 serves as the bottom to form a glue groove 300 with the through-hole 450. A bonding portion 121 is formed on the conductive layer of the electrochromic film 100; the bonding portion 121 is essentially a portion of the conductive layer protruding from the color-changing material layer 130. The bonding portion 121 is exposed in the glue groove 300, and then the lead-out structure 400 is bonded to the bonding portion 121, making the lead-out structure 400 electrically connected to the bonding portion 121. The lead-out structure 400 is housed within the glue groove 300, and then sealant is filled into the glue groove 300, covering the lead-out structure 400 and the bonding portion 121. After the sealant cures, it will cover the end of the lead-out structure 400 near the bonding part and the bonding part 121 together. The conductive layer 40 in the electrochromic film 100 does not need to extend to the outside of the sealant. This blocks the water and oxygen entry channels between the conductive layer 40 and the sealant, improves the sealing performance of the device, and helps maintain the structural stability of the entire electrochromic device.

[0087] In some embodiments, a first adhesive layer 600 is placed on a first substrate 200, and an electrochromic film 100 is adhered to the first adhesive layer 600.

[0088] Subsequently, the first adhesive layer 600 and the electrochromic film 100 above the edge portion 220 are removed, while the first adhesive layer 600, the first substrate 110, and the first conductive layer 120 relative to the bonding area are retained. Removing the first adhesive layer 600 above the edge portion 220 is equivalent to covering the end face of the first adhesive layer 600 with sealant, thereby reducing the entry of water and oxygen from the end face of the first adhesive layer 600 into the interior of the electrochromic film 100.

[0089] For example, the first adhesive layer 600 uses optical adhesives, including but not limited to OCA (Optically Clear Adhesive) and OCR (Optical Clear Resin).

[0090] Please combine Figure 8 Furthermore, considering that the optical adhesive constituting the first adhesive layer 600 is relatively thin and easily absorbs and permeates water vapor and oxygen, the preparation method also includes removing part of the first adhesive layer 600, so that a groove 610 communicating with the adhesive groove 300 is formed between the electrochromic film 100 and the first adhesive layer 600, and the sealant also fills the groove 610.

[0091] Specifically, a portion of the first adhesive layer 600 corresponding to the bonding portion 121 is removed, that is, the portion of the first adhesive layer 600 relative to the circumferential edge of the first diaphragm 101 is removed, forming a groove 610 communicating with the adhesive groove 300, and then sealant is filled into the groove 610. Alternatively, sealant can be directly filled into the adhesive groove 300, allowing it to penetrate into the interior of the groove 610 due to its fluidity. In this case, the contact area between the sealant and the first substrate 200 is larger, reducing the entry of water and oxygen from the end face of the first adhesive layer 600 into the electrochromic diaphragm 100, thus improving the overall sealing performance of the device.

[0092] For improvements based on any of the above embodiments, please refer to [link / reference]. Figure 9 This embodiment provides a method for fabricating an electrochromic device, which, in addition to the aforementioned steps S01 to S05, also includes:

[0093] Step S14, before curing the sealant, apply as follows Figure 9 The second substrate 700 shown is placed on the outer surface of the electrochromic film 100; and as shown Figure 10 The portion of the electrochromic device shown is removed, exposing the end of the lead-out structure 400 that is not connected to the bonding portion 121, thereby facilitating electrical connection to the power supply via the lead-out structure 400.

[0094] In this implementation, please refer to Figure 9The curing sealant can simultaneously cure the sealant in both the first region 310 and the second region 320, i.e., all the sealant; or it can cure only the sealant in the first region 310 while leaving the sealant in the second region 320 uncured. It can be either removing a portion of the sealant after it has fully cured, or removing a portion of the sealant after it has partially cured. It can be understood that the sealant in the second region 320 is the sealant that needs to be removed, and the first region 310 corresponds to the remaining sealant besides the removed sealant.

[0095] When the curing sealant simultaneously cures the sealant in the first region 310 and the second region 320, the sealant in the second region 320 can be separated by laser cutting. Alternatively, a peelable sealant can be provided at the end of the lead-out structure 400 away from the binding part 121, and the sealant can be quickly removed by the peelable sealant.

[0096] Specifically, when removing part of the sealant after it has partially cured, the removal can be done either during step S15 or after step S15 has ended.

[0097] In this embodiment, the curing sealant may be: curing only the remaining portion of the sealant excluding the removed portion, that is, curing only the first part of the sealant.

[0098] The first part of the cured sealant includes the sealant corresponding to the bonding portion 121. The sealant corresponding to the bonding portion 121 includes a portion of sealant covering the bonding portion 121 and the end of the lead-out structure 400 that is bonded to the bonding portion 121. The second part of the semi-cured or uncured sealant includes the sealant corresponding to the end of the lead-out structure 400 away from the bonding portion 121.

[0099] At this point, because the second part of the sealant is not cured or not fully cured, it is easier to remove without damaging the entire device and the lead-out structure 400. It is worth noting that in this embodiment, the curing of the first part can be performed in stages or all at once. Removal of the second part of the sealant can be performed after the first part is fully cured or after it is partially cured. The first and second parts can be cured separately.

[0100] Specifically, such as Figure 9 As shown, the sealant inside the first region 310 is cured, and the sealant inside the second region 320 is semi-cured or uncured.

[0101] Thus, a space exists between the bonding portion 121 and the boundary of the first region 310, which can also be considered as the second through-hole 402. This space accommodates the sealant, and its width is at least 0.5 mm. In other words, after removing the sealant from the second portion, a sealant width of at least 0.5 mm remains covering the end face of the electrochromic film 100. The end of the lead-out structure 400 near the bonding portion 121 and the bonding portion 121 are covered by the cured sealant within the first region 310. Simultaneously, the other end of the lead-out structure 400 extending outwards from the electrochromic film 100 into the second region 320 is exposed as the sealant within the second region 320 separates. The exposed lead-out structure 400 has a conductive port for electrical connection to a power supply or a device interface.

[0102] The "device interface" refers to the interface on the product to which the electrochromic device is applied. For example, when applied to eyeglasses, the device interface serves as the power supply for the eyeglasses.

[0103] Optionally, the width ratio of the first and second portions of the sealant is 1:1 to 1:0.5, with the first portion sufficient to cover the bonding portion 121. Since the second region 320 needs to be removed eventually, the width of the second region 320 is set to be smaller than the width of the first region 310 to avoid sealant waste. Additionally, to prevent the sealant in the first region 310 from being too narrow and failing to effectively seal the electrochromic film 100, the width ratio of the first region 310 and the second portion 320 is within a suitable range. That is, the width ratio of the first region 310 and the second region 320 is 1:1 to 1:0.5.

[0104] Understandably, the first and second parts of the sealant can be the same material or different materials, meaning the sealant for the first part and the sealant for the second part have different materials. When the first and second parts of the sealant are different materials, the first part uses an easily curable material, and the second part uses a difficult-to-curable material. For example, the curing temperatures of the first and second parts may differ, with the first part having a lower curing temperature and the second part a higher curing temperature. Therefore, when heating the first and second parts from a low temperature, the sealant for the first part will cure first, while the second part remains semi-cured or uncured. Alternatively, the light curing energy of the first and second parts may differ, with the first part having a lower light curing energy and the second part a higher light curing energy. Therefore, when irradiating the first and second parts with a UV lamp from a low temperature, the sealant for the first part will cure first, while the second part remains semi-cured or uncured. In short, by using two different materials and applying the same curing source, the second part may remain semi-cured or uncured while the first part cures.

[0105] In other embodiments, the first part of the sealant comprises a photocurable material, and the second part of the sealant comprises a thermocurable material; or vice versa, the first part of the sealant comprises a thermocurable material, and the second part of the sealant comprises a photocurable material. The first and second parts are cured using different curing sources. This avoids the curing of the first part affecting the curing quality of the second part, thus preventing the sealant in the second part from becoming difficult to remove.

[0106] When the first and second parts of the sealant are made of different materials, they can be cured in stages. For example, different curing sources can be used to cure sealants of different materials sequentially, thus curing the first part of the sealant while leaving the second part uncured, making it easier to remove the second part of the sealant. This also ensures coverage of the bonding portion 121, thereby guaranteeing sealing performance.

[0107] In this embodiment, the first and second parts of the sealant are made of the same material. By applying different curing energies to the first and second parts, the second part can be partially or completely cured while the first part is cured, thus facilitating its removal.

[0108] Accordingly, the curing sealant includes:

[0109] The curing energy exerted by the curing source on the first part is greater than that exerted on the second part, thereby achieving curing of the first part of the sealant, while the second part of the sealant is semi-cured or uncured.

[0110] The curing source can be a light-curing source, which cures the sealant by radiating it. Alternatively, it can be a heat-curing source, which cures the sealant by heating it. The curing energy can be determined by the curing frequency or curing time per unit time. Therefore, by adjusting the curing frequency and curing time, the curing energy of the first part can be made greater than that of the second part. In this case, the first and second parts of the sealant need to be cured step by step.

[0111] In some embodiments, a photocuring source is used to irradiate the sealant in the first part and the sealant in the second part, respectively.

[0112] The irradiation energy per unit time of the photocuring source acting on the first part is greater than the irradiation energy per unit time of the second part.

[0113] When the curing time is the same, the first part of the sealant and the second part of the sealant cure separately. Since the irradiation energy of the light curing source acting on the first part per unit time is greater than that acting on the second part per unit time, when the irradiation time is the same, the first part of the sealant is fully cured, while the second part of the sealant is not cured or not fully cured.

[0114] And / or, the curing time of the photocurable source on the first part is greater than the curing time on the second part.

[0115] Given the same irradiation energy per unit time, since the curing time of the photocuring source on the first part is longer than that on the second part, when the first part of the sealant is fully cured, the second part of the sealant is not cured or not fully cured.

[0116] In other embodiments, a thermosetting source is used to heat the first portion of the sealant and the second portion of the sealant, respectively. In particular, when the curing source is a thermosetting source, it can heat the sealant by means of thermal radiation or by means of thermal conduction; this embodiment does not limit this.

[0117] Wherein, the curing temperature of the thermosetting source when applied to the first part is higher than the curing temperature when applied to the second part, and / or, the heating rate of the thermosetting source on the first part is greater than the heating rate of the second part.

[0118] Given the same curing time, since the curing temperature of the heat curing source is higher when it acts on the first part than when it acts on the second part, the second part of the sealant is not cured or not fully cured when the first part of the sealant is fully cured.

[0119] Alternatively, the curing time of the thermosetting source acting on the first part is greater than the curing time acting on the second part.

[0120] At the same curing temperature, since the curing time of the heat curing source acting on the first part is longer than that acting on the second part, when the first part of the sealant is fully cured, the second part of the sealant is not cured or not fully cured.

[0121] Furthermore, based on any of the above embodiments, an improvement is made by including the following step before the step of curing the sealant:

[0122] The second substrate 700 is placed on the electrochromic film 100.

[0123] After the sealant has cured, both the first substrate 200 and the second substrate 700 are bonded to the sealant.

[0124] For example, the second substrate 700 also employs the water and oxygen barrier layer 10.

[0125] In some embodiments, after the electrochromic film 100 is placed on the first substrate 200, the second adhesive layer 800 is first placed on the electrochromic film 100, and then the first adhesive layer 600, the electrochromic film 100 and the second adhesive layer 800 above the edge portion 220 are removed, thereby forming a through hole 450 through the electrochromic film 100.

[0126] Therefore, when placing the second substrate 700, the second substrate 700 is placed directly on the second adhesive layer 800 and is bonded and fixed to the electrochromic film 100 through the second adhesive layer 800.

[0127] For example, the second adhesive layer 800 uses optical adhesives, including but not limited to OCA (Optically Clear Adhesive) and OCR (Optical Clear Resin).

[0128] Please combine Figure 10 and Figure 11 Furthermore, when separating the sealant within the second region 320, the first substrate 200 and the second substrate 700 of the second region 320 are simultaneously removed, thereby exposing the lead-out structure 400 and obtaining the final form of the electrochromic device. Compared with electrochromic devices in related technologies, the water and oxygen entry channels are sealed with sealant, thus improving the sealing effect of the electrochromic device.

[0129] For example, the first substrate 200 and the second substrate 700 of the second region 320 are removed by cutting from both sides. The electrochromic film 100 located on the periphery of the second region 320 is only connected to the first substrate 200 and the second substrate 700, and is removed along with the first substrate 200 and the second substrate 700. Subsequently, uncured or incompletely cured sealant in the second region 320 can be wiped away with a tool, or the uncured or incompletely cured sealant in the second region 320 can be washed away with the corresponding adhesive solvent.

[0130] A further improvement based on any of the above embodiments is made to the step of curing the sealant, which includes: pre-curing all of the sealant; removing a portion of the sealant to expose a portion of the lead-out structure 400; and curing the remaining portion of the sealant until fully cured.

[0131] Pre-curing step: The sealant is cured with a first curing energy until the sealant in the adhesive tank is pre-cured.

[0132] Full curing step: Remove the second portion of the sealant, exposing the end of the lead-out structure away from the bonding portion to the sealant, and then cure the first portion of the sealant with a second curing energy to fully cure the first portion of the sealant.

[0133] Understandably, the pre-cured sealant is fixed and no longer moves, while maintaining a certain adhesive strength with the first substrate 200, the second substrate 700, and the lead-out structure 400, but it can be separated and removed. Based on this, the second portion of the sealant is removed, and then the first portion of the sealant is cured until it is completely cured. This covers the end of the lead-out structure 400 near the binding part 121 and the binding part 121 together, achieving a seal. Simultaneously, the end of the lead-out structure 400 away from the binding part 121 is exposed, facilitating electrical connection to the power source.

[0134] Specifically, the first curing energy is used to pre-cure all the sealant, and after removing part of the sealant, the second curing energy is used to cure the remaining part, wherein the first curing energy accounts for 5 to 30% of the sum of the first curing energy and the second curing energy.

[0135] Understandably, the sum of the first curing energy and the second curing energy is the curing energy that is just enough to completely cure the sealant.

[0136] If the proportion of the first curing energy is too low, the sealant cannot be well set and is prone to flow. When separating the sealant in the second region 320, the sealant in the first region 310 is prone to detach from the first substrate 200, the second substrate 700, and the lead-out structure 400.

[0137] Conversely, if the proportion of the first curing energy is too high, the bonding strength between the sealant and the first substrate 200, the second substrate 700 and the lead-out structure 400 will be high, which may lead to incomplete separation of the sealant in the second region 320 from the lead-out structure 400, which is not conducive to the exposure of the lead-out structure 400.

[0138] In other embodiments, the step of curing the sealant includes:

[0139] The curing source delivers curing energy to the first part of the sealant and prevents the curing energy from being delivered to the second part of the sealant.

[0140] Understandably, by preventing the curing energy from being transferred to the second part of the sealant, the curing energy exerted by the curing source on the second part is less than the curing energy exerted by the curing source on the first part. Ideally, the curing energy exerted by the curing source on the second part is zero. Thus, when the first part of the sealant is fully cured, the second part of the sealant is not cured or not fully cured, making it easier to remove the second part of the sealant and exposing the end of the lead-out structure 400 away from the binding part 121 to the sealant.

[0141] Furthermore, in this embodiment, the step of curing the sealant is as follows:

[0142] A masking layer is used to shield the second portion of the sealant, and a photocuring source is used to irradiate the first portion of the sealant. The sealant comprises a photocurable material.

[0143] Understandably, after the masking layer covers the second part of the sealant, the light emitted by the curing source cannot reach the second part of the sealant, but can only reach the first part. When the first part of the sealant cures, the second part of the sealant remains uncured, thus making it easier to remove the second part of the sealant.

[0144] Optionally, the light-curing material is a UV-curing adhesive.

[0145] In other embodiments of this application, a thermosetting source can also be used to irradiate the sealant. Simultaneously, a heat-reflective material such as aluminum foil is used to shield the second portion of the sealant, or the thermosetting source is controlled to irradiate only the second portion of the sealant, thereby preventing curing energy from being transferred to the second portion of the sealant.

[0146] Based on any of the above embodiments, the electrochromic device fabrication method provided in this embodiment has the same advantages as... Figure 2 The preparation methods shown are largely the same, with the following differences:

[0147] In this embodiment, refer to Figure 12 No electrochromic membrane 100 is retained around the through hole 450, that is, the first through hole 401 and the second through hole 402 are located at the edge of the electrochromic membrane 100.

[0148] Please combine Figure 12 In this embodiment, sealant is filled into the glue tank 300 from the periphery, so that the sealant fills the glue tank 300 and covers the end of the lead-out structure 400 near the binding part 121 and the binding part 121, and then the sealant is cured.

[0149] Please see Figure 11 This embodiment also provides an electrochromic device, which is prepared using the above-described electrochromic device preparation method. The electrochromic device includes a first substrate 200, an electrochromic film 100, and a second substrate 700 stacked sequentially, and an lead-out structure 400 is connected to the conductive layer of the electrochromic film 100.

[0150] The electrochromic film 100 includes a first substrate 110, a first conductive layer 120, a color-changing material layer 130, a second conductive layer 140, and a second substrate 150, which are stacked sequentially. Specifically, the conductive layers of the electrochromic film 100 refer to the first conductive layer 120 and the second conductive layer 140, and the first conductive layer 120 and / or the second conductive layer 140 are connected to the lead-out structure 400.

[0151] Understandably, in some embodiments, the first conductive layer 120 is connected to the lead-out structure 400. In other embodiments, the second conductive layer 140 is connected to the lead-out structure 400. In still other embodiments, the number of lead-out structures 400 is at least two, with one portion of the lead-out structures 400 connected to the first conductive layer 120 and the other portion connected to the second conductive layer 140. This embodiment does not limit this; the figure only shows the connection between the second conductive layer 140 and the lead-out structure 400 as an illustration.

[0152] The lead-out structure 400 has a lead-out portion 410 and is connected to the conductive layer through the lead-out portion 410, and the lead-out portion 410 is located between the first substrate 200 and the second substrate 700.

[0153] Furthermore, a sealant layer 900 is provided between the first substrate 200 and the second substrate 700. The sealant layer 900 extends circumferentially along the electrochromic film 100 and covers the lead-out portion 410 and the conductive layer.

[0154] For example, the sealant layer 900 is cured by UV adhesive or thermosetting adhesive.

[0155] In the aforementioned electrochromic device, the sealant layer 900 extends circumferentially along the electrochromic film 100, covering both the conductive layer of the electrochromic film 100 and the lead-out portion 410 of the lead-out structure 400. This prevents the end face of the conductive layer from being exposed outside the sealant layer 900, ensuring that the interface between the conductive layer and the sealant layer 900 is located inside the sealant layer 900. This blocks the water and oxygen entry channels between the conductive layer and the sealant layer 900, resulting in a better sealing effect and helping to maintain the structural stability of the entire electrochromic device.

[0156] For example, the materials of the first conductive layer 120 and the second conductive layer 140 include, but are not limited to, thin-film conductive materials such as ITO (Indium Tin Oxide), silver, and copper. The materials of the first conductive layer 120 and the second conductive layer 140 may be the same or different, and this embodiment does not limit this.

[0157] Furthermore, the materials of the first substrate 110 and the second substrate 150 may be the same or different, and this embodiment does not limit this.

[0158] Taking the connection between the first conductive layer 120 and the lead-out structure 400 as an example, an electrical connector 500 is provided on the side of the first conductive layer 120 away from the first substrate 110, and is connected to the lead-out portion 410 through the electrical connector 500. The material of the electrical connector 500 can be ACF (Anisotropic Conductive Film) or ACP (Anisotropic Conductive Paste).

[0159] Furthermore, the electrochromic device also includes a first adhesive layer 600 and a second adhesive layer 800.

[0160] On the one hand, the electrochromic film 100 is connected to the first substrate 200 through the first adhesive layer 600, specifically the first substrate 110 is connected to the first substrate 200 through the first adhesive layer 600.

[0161] On the other hand, the electrochromic film 100 is connected to the second substrate 700 through the second adhesive layer 800, specifically the second substrate 150 is connected to the second substrate 700 through the second adhesive layer 800.

[0162] In addition, the sealant layer 900 extends circumferentially along the first adhesive layer 600 and the second adhesive layer 800, covering the first adhesive layer 600 and the second adhesive layer 800. This prevents the first adhesive layer 600 and the second adhesive layer 800 from extending to the outside of the sealant layer 900, blocking the entry of water and oxygen present inside the first adhesive layer 600 and the second adhesive layer 800 into the channels. This results in a better sealing effect and also helps maintain the structural stability of the entire electrochromic device.

[0163] For example, both the first adhesive layer 600 and the second adhesive layer 800 are made of optical adhesives, including but not limited to OCA (Optically Clear Adhesive) and OCR (Optical Clear Resin). The types of optical adhesives used in the first adhesive layer 600 and the second adhesive layer 800 can be the same or different, and this embodiment does not limit this.

[0164] In some embodiments, the first conductive layer 120 and / or the second conductive layer 140 have a bonding portion 121. The bonding portion 121 protrudes from the inside to the outside of the electrochromic film 100 from the color-changing material layer 130, and the bonding portion 121 is connected to the lead-out portion 410. Accordingly, the sealant layer 900 covers the lead-out portion 410 and the bonding portion 121.

[0165] Taking the connection between the first conductive layer 120 and the lead-out portion 410 as an example, the edge portion of the first conductive layer 120 protrudes from the inside to the outside of the electrochromic film 100 beyond the color-changing material layer 130 and the second conductive layer 140, forming a bonding portion 121 for connection with the lead-out portion 410. An electrical connector 500 is provided on the bonding portion 121, and the lead-out portion 410 is connected through the electrical connector 500.

[0166] At this time, the sealant layer 900 covers the lead-out part 410 and also covers the binding part 121.

[0167] Understandably, when the edge portion of the first conductive layer 120 protrudes from the inside out of the electrochromic film 100 from the color-changing material layer 130 and the second conductive layer 140 to form the bonding portion 121, the edge portion of the first substrate 110 also protrudes from the inside out of the electrochromic film 100 to support the bonding portion 121, and a first adhesive layer 600 is also provided between this portion of the first substrate 110 and the first substrate 200.

[0168] Furthermore, since the bonding portion 121 protrudes from the inside out along the electrochromic film 100 from the color-changing material layer 130, the width of the sealant layer 900 around the bonding portion 121 from the inside out along the electrochromic film 100 is smaller than that of the sealant layer 900 in other areas.

[0169] Meanwhile, considering that the optical adhesive constituting the first adhesive layer 600 and the second adhesive layer 800 is relatively thin and easily absorbs and allows moisture and oxygen to pass through, the edges of the first adhesive layer 600 and / or the second adhesive layer 800 are recessed relative to the electrochromic film 100 to form a groove 610. The groove 610 is correspondingly provided with the bonding portion 121, and the sealant layer 900 fills the groove 610.

[0170] Taking the connection between the first conductive layer 120 and the lead-out portion 410 as an example, a groove 610 is provided at the edge of the first adhesive layer 600 corresponding to the bonding portion 121, and the sealant layer 900 fills the groove 610, thereby increasing the contact area between the sealant layer 900 and the first substrate 200 and improving the sealing reliability.

[0171] Optionally, the groove 610 extends from the outside to the inside of the electrochromic film 100 to a depth of H, satisfying H≥1mm, to ensure that the interface between the sealant layer 900 and the first substrate 200 has sufficient sealing performance.

[0172] Understandably, when the above-mentioned electrochromic device is applied to end products such as curtain walls, car sunroofs, car side windows, and car windshields, the greater the depth of the groove 610, the better the sealing reliability. It is only necessary to set black ink on the edge of the end product to form a black edge, which can cover the sealing adhesive layer 900 in the groove 610 without affecting the aesthetics of the product.

[0173] When the aforementioned electrochromic device is applied to end products such as rearview mirrors, electronic product housings, eyeglasses, and electronic product display panels, the depth of the groove 610 shall not exceed 5mm to avoid affecting the aesthetics of the product.

[0174] Please see Figure 13 In some embodiments, for the lead-out structure 400 connected to the first conductive layer 120, the thickness of its lead-out portion 410 is A, and the sum of the thicknesses of the color-changing material layer 130, the second conductive layer 140, the second substrate 150, and the second adhesive layer 800 is B2, satisfying A < B2.

[0175] At this time, the lead-out portion 410 connected to the first conductive layer 120 can be smoothly placed between the first conductive layer 120 and the second substrate 700, and the smaller the size of the lead-out portion 410, the better the sealing performance of the sealant layer 900 at the lead-out structure 400.

[0176] Preferably, A < B 2-30 μm is satisfied so that an electrical connector 500 can be provided on the binding part 121.

[0177] Similarly, for the lead-out structure 400 connected to the second conductive layer 140, the thickness of its lead-out portion 410 is A, and the sum of the thicknesses of the color-changing material layer 130, the first conductive layer 120, the first substrate 110 and the first adhesive layer 600 is B1, satisfying A < B1, so that the lead-out portion 410 connected to the second conductive layer 140 can be smoothly placed between the second conductive layer 140 and the first substrate 200.

[0178] Preferably, A < B1-30μm is satisfied so that an electrical connector 500 can be provided on the binding part 121.

[0179] Please see Figure 14 In some embodiments, the width of the lead-out structure 400 is D, and the side width of the electrochromic device where the lead-out structure 400 is located is W, satisfying 0.5mm < D < W / 3.

[0180] Similarly, the smaller the size of the lead-out structure 400, the better the sealing performance of the sealant layer 900 at the lead-out structure 400, thus making the width of the lead-out structure 400 less than one-third of the side width of the electrochromic device.

[0181] Furthermore, a sealant affinity layer is provided on the surface of the lead-out structure 400, which makes the lead-out structure 400 compatible with the sealant layer 900, thereby enhancing the sealing performance of the sealant layer 900 at the lead-out structure 400.

[0182] For example, the materials of the sealant affinity layer include, but are not limited to, PI (Polyimide) and PET (Polyester).

[0183] In some embodiments, the first substrate 200 and / or the second substrate 700 employ a water-oxygen barrier layer.

[0184] The water and oxygen barrier layer can better block water vapor and oxygen, and together with the sealant layer 900, it can effectively seal the electrochromic film 100.

[0185] In some embodiments, the first substrate 200 employs a water-oxygen barrier layer. In other embodiments, the second substrate 700 employs a water-oxygen barrier layer. In still other embodiments, both the first substrate 200 and the second substrate 700 employ water-oxygen barrier layers. This embodiment is not limited to these embodiments.

[0186] For example, the material of the water and oxygen barrier layer includes, but is not limited to, water and oxygen barrier film materials, glass plates, etc. In addition, when both the first substrate 200 and the second substrate 700 are made of water and oxygen barrier layers, the materials of the first substrate 200 and the second substrate 700 can be the same or different, and this embodiment does not limit this.

[0187] Specifically, the water and oxygen barrier layer includes a substrate layer and a barrier coating layer stacked together, with the barrier coating layer disposed on at least one side of the substrate layer.

[0188] For example, the material of the barrier coating can be silicon dioxide and its modified forms.

[0189] In some embodiments, a barrier coating is disposed on one side of the substrate layer.

[0190] In other embodiments, barrier coatings are disposed in pairs on both sides of the substrate layer.

[0191] In some other embodiments, a barrier coating is disposed on one side of the substrate layer, and an antireflective layer or a hardening layer is disposed on the other side of the substrate layer.

[0192] Understandably, when an anti-reflective layer is placed on the other side of the substrate, the reflection of light by the water and oxygen barrier layer can be reduced. When a hardening layer is placed on the other side of the substrate, the hardness of the entire water and oxygen barrier layer can be enhanced.

[0193] Please refer to the following: Figure 11 and Figure 15In summary, the electrochromic device comprises a first substrate 200, a first adhesive layer 600, a first substrate 110, a first conductive layer 120, a color-changing material layer 130, a second conductive layer 140, a second substrate 150, a second adhesive layer 800, and a second substrate 700, which are stacked sequentially. A sealant layer 900 is provided between the first substrate 200 and the second substrate 700, and the sealant layer 900 covers the end faces of the first adhesive layer 600, the first substrate 110, the first conductive layer 120, the color-changing material layer 130, the second conductive layer 140, the second substrate 150, and the second adhesive layer 800.

[0194] Taking the connection between the first conductive layer 120 and the lead-out structure 400 as an example, a portion of the first conductive layer 120 protrudes from the inside to the outside of the electrochromic film 100 beyond the color-changing material layer 130, the second conductive layer 140, and the second substrate 150, thereby forming a bonding portion 121. The bonding portion 121 is further connected to the lead-out portion 410 of the lead-out structure 400. The lead-out structure 400 extends through the sealant layer 900, and the exposed portion of the lead-out structure 400 is used for bonding.

[0195] Therefore, in this electrochromic device, the lead-out structure 400 is first encased within the sealant layer 900 before being exposed, ensuring that both sides of the sealant layer 900 are bonded with water and oxygen barrier layers. This prevents the end face of the second conductive layer 140 from being exposed outside the sealant layer 900, ensuring that the interface between the second conductive layer 140 and the sealant layer 900 is located inside the sealant layer 900. This blocks the water and oxygen entry channels between the second conductive layer 140 and the sealant layer 900, and also blocks the water and oxygen entry channels inside the second adhesive layer 800, resulting in better sealing and improving the structural stability of the entire electrochromic device. Simultaneously, since the sealant layer 900 covers the lead-out portion 410, it acts as a protective adhesive for the lead-out structure, eliminating the need for the separate application of protective adhesive and curing adhesive, reducing processes and improving efficiency.

[0196] In all examples shown and described herein, any specific values ​​should be interpreted as merely exemplary and not as limitations; therefore, other examples of exemplary embodiments may have different values.

[0197] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0198] The above-described embodiments are merely illustrative of several implementations of the present invention, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements all fall within the scope of protection of the present invention.

Claims

1. A method for fabricating an electrochromic device, characterized in that, include: An electrochromic film and a first substrate are provided. The electrochromic film includes a first substrate, a first conductive layer, a color-changing material layer, a second conductive layer, and a second substrate stacked sequentially. A stepped through-hole is formed in the electrochromic film, the through-hole exposing a bonding portion formed by a portion of the first conductive layer or a portion of the second conductive layer, and the through-hole cooperates with the first substrate to form an adhesive groove; An electrical lead-out structure is electrically connected to the binding part, and the lead-out structure is located within the adhesive groove; A sealant is filled into the glue tank and cured, and the sealant covers the end face of the lead-out structure and the electrochromic film; Remove some of the sealant to expose part of the lead-out structure.

2. The method for preparing an electrochromic device according to claim 1, characterized in that, Curing sealant includes: Only the remaining portion of the sealant, excluding the removed portion, is cured.

3. The method for preparing an electrochromic device according to claim 1, characterized in that, Curing sealant includes: Pre-cure all of the sealant; Remove a portion of the sealant to expose a portion of the lead-out structure, and cure the remaining portion of the sealant until fully cured.

4. The method for preparing an electrochromic device according to claim 2, characterized in that, The cured sealant includes: The portion of the sealant to be removed is masked, and the remaining portion of the sealant is irradiated using a photocuring source, wherein the sealant comprises a photocurable material.

5. The method for preparing an electrochromic device according to claim 1, characterized in that, The via includes a first via and a second via that are interconnected. The first via extends from the surface of the second substrate to the surface of the first conductive layer, and the second via extends through the first conductive layer and the first substrate. The cross-sectional size of the first via is larger than that of the second via.

6. The method for preparing an electrochromic device according to claim 1, characterized in that, The electrochromic film is fixed to the first substrate by a first adhesive layer, and the through hole penetrates the first adhesive layer.

7. The method for preparing an electrochromic device according to claim 6, characterized in that, The preparation method further includes removing a portion of the first adhesive layer to form a groove communicating with the adhesive groove between the electrochromic film and the first adhesive layer, and the sealant further fills the groove.

8. The method for preparing an electrochromic device according to claim 3, characterized in that, The sealant is pre-cured with a first curing energy and the remaining portion is cured with a second curing energy, wherein the first curing energy accounts for 5 to 30% of the sum of the first curing energy and the second curing energy.

9. The method for preparing an electrochromic device according to claim 1, characterized in that, The preparation method further includes: dividing the electrochromic film into a first film and a second film, wherein the second film surrounds the outside of the first film and a through groove is formed between the first film and the second film, the through groove penetrates the electrochromic film and communicates with the through hole; The through groove and the through hole cooperate with the first substrate to form the adhesive groove.

10. The method for preparing an electrochromic device according to claim 9, characterized in that, The preparation method further includes removing the second membrane while retaining the sealant covering the end face of the first membrane.

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