A processing method for improving plate warping of FPCOIL product during implantation

Abstract

The application discloses a processing method for improving board warping of FPCOIL products in a grafting process, comprising the following steps: providing a circuit board material containing products and a grafting jig capable of grafting single products; removing the whole board of the circuit board material containing defective products, marking the defective products with an identification mark, and delivering the defective products to a grafting process area; removing the defective products by using the grafting jig, wherein the grafting jig comprises a pressing plate and a cutter, the pressing plate is pressed on the circuit board material, and then the cutter is used to graft the defective products; removing the frame of the circuit board material, and using a cover plate to turn over the surface of the board; using a cotton swab to stick a good product patch, embedding the good product patch in the circuit board material, and making the products of the whole circuit board material complete. The application can effectively solve the problem of board warping caused by grafting of FPCOIL products, the pressing plate in the grafting jig can effectively hold the circuit board material when the cutter grafts the defective products, the products are not bent under the premise of stress, and the purpose of not causing product bending in the grafting process can be met.

Description

Technical Field

[0001] This invention relates to the field of circuit board processing technology, and in particular to a processing method for improving the warping of FPCOIL products during the transfer process. Background Technology

[0002] The description in this section provides only background information related to the disclosure of this invention and does not constitute prior art.

[0003] FPCOIL refers to circuit boards for coil motors. These electronic products have high requirements for all components installed on them; failure of any one component will render the entire product unusable. Therefore, users require all products supplied by manufacturers to be of good quality. To address this issue, manufacturers need to perform circuit testing after completing the entire board production. Defective products are directly rejected during shipment inspection and disposed of. Since individual products are typically small, to improve production efficiency, manufacturers generally use modular production, arranging multiple individual products on the same board for various processing techniques. The final shipment stage also uses whole boards. Therefore, if a board contains defective products during the shipment inspection stage, the entire board must be discarded. Previously, warping of the boards was prone to occur during the transfer of defective products.

[0004] It should be noted that the above description of the technical background is only for the purpose of providing a clear and complete explanation of the technical solutions of the present invention and facilitating understanding by those skilled in the art. It should not be assumed that the above technical solutions are known to those skilled in the art simply because they have been described in the background section of this invention. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to provide a processing method to improve the bending and warping of FPCOIL products during the transplantation process, in order to address the shortcomings of the prior art.

[0006] This application discloses a processing method to improve the warping of FPCOL products during the transfer process, including the following steps: Provide circuit boards containing products and transplantation jigs that can transplant individual products; Remove the entire circuit board containing defective products, mark the defective products, and ship them to the grafting process area. The defective product is removed using a transplant jig, which includes a pressure plate and a cutting tool. The pad is pressed onto the circuit board, and then the defective product is transplanted using the cutting tool. Remove the border of the circuit board and use a cover plate to flip the board surface over. Use a cotton swab to apply the good quality replacement part, then embed the good quality replacement part into the circuit board to make the entire circuit board product complete.

[0007] Furthermore, in the above-mentioned processing method for improving the warping of FPCOIL products during the transfer process, the circuit board includes multiple product units arranged in a matrix, each product unit including a circuit area and a waste area, the waste area being located on the periphery of the circuit area.

[0008] Furthermore, the above-mentioned processing method for improving the warping of FPCOIL products during the transplantation process includes the step of "removing the defective product using a transplantation fixture", which involves: first pressing the pressure plate onto the waste area, and then using a cutting tool to cut the defective product and the waste area, so that the circuit board does not warp during the cutting process.

[0009] Furthermore, in the above-mentioned processing method for improving the bending of the FPCOIL product during the transplantation process, the pressure plate includes a first pressing part, a second pressing part, and a third pressing part disposed on the periphery of the product. The first pressing part and the second pressing part are disposed at both ends of the third pressing part, and the first pressing part and the second pressing part form a concave structure that cooperates with the product.

[0010] Furthermore, in the above-mentioned processing method for improving the bending of FPCOIL products during the transfer process, the cumulative manufacturing tolerance of the pressure plate and the cutting tool is ±0.02mm.

[0011] Furthermore, in the above-mentioned method for improving the processing of FPCOIL products to prevent board warping during the transfer process, the cutting accuracy tolerance of the cutting tool is ±0.01mm.

[0012] Furthermore, in the above-mentioned processing method for improving the warping of FPCOIL products during the transplantation process, the inlay tolerance of the good replacement parts is ±0.01mm.

[0013] In summary, the structure adopted in the embodiments of the present invention has the following advantages: The processing method described in this invention for improving the warping of FPCOIL products during transplantation effectively solves the problem of warping during FPCOIL product transplantation. The pressure plate in the transplantation fixture can effectively hold the circuit board in place when the tool is transplanting defective products, preventing the product from bending under stress. This achieves the goal of preventing product bending during transplantation. The defective products are removed through an inspection process, and then individually removed from the circuit board containing the defective products through a defective product removal process and a good product replacement process. Good products are then inserted to replace the defective products in the entire board. This allows for the shipment of all good circuit boards while greatly reducing the amount of waste from defective products, effectively saving various production materials. After the above process, the overall appearance of the circuit board is good and the flatness is high.

[0014] To further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are for reference and illustration only and are not intended to limit the present invention. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments or prior art of this specification, the drawings used in the description of the embodiments or prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this specification. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a flowchart illustrating the processing method for improving board warping during the transplantation process of FPCOIL products in an embodiment of the present invention. Figure 2 This is a schematic diagram of the circuit board material in an embodiment of the present invention; Figure 3 This is a schematic diagram of the pressure plate in an embodiment of the present invention; Figure 4 This is a schematic diagram of the cutting tool in an embodiment of the present invention; Figure 5 This is a schematic diagram illustrating the removal of the defective product using a transplantation jig in an embodiment of the present invention; Figure 6 This is a schematic diagram of the circuit board after the defective product has been transplanted in an embodiment of the present invention.

[0017] The reference numerals in the above figures are as follows: 1. Circuit board; 2. Circuit area; 3. Waste area; 4. First pressing part; 5. Second pressing part; 6. Third pressing part; 7. Cutting tool. Detailed Implementation

[0018] To enable those skilled in the art to better understand the technical solutions in this specification, the technical solutions in the embodiments of this specification will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this specification, and not all embodiments. Based on the embodiments in this specification, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of this specification.

[0019] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. Furthermore, the accompanying drawings of the present invention are for simple illustrative purposes only and are not depictions of actual dimensions; this is stated in advance. The following embodiments will further describe the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the scope of protection of the present invention.

[0020] It should be understood that while terms such as "first," "second," and "third" may be used in this document to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one signal from another. Furthermore, the term "or" as used herein should, as appropriate, include any combination of one or more of the related listed items.

[0021] Reference Figures 1 to 6 As shown in the figure, this application discloses a processing method to improve board warping during the transfer process of FPCOIL products, including the following steps: Provides a circuit board containing the product and a transplantation fixture capable of transplanting individual products; Remove the entire circuit board containing defective products, mark the defective products, and ship it to the grafting process area. The defective product is removed using a transplant jig, which includes a pressure plate and a cutting tool 7. The pad is pressed onto the circuit board 1, and then the defective product is transplanted using the cutting tool 7. Remove the border of circuit board 1 and use a cover plate to flip the board surface. Use a cotton swab to apply the good quality replacement part and embed it into the circuit board 1 to make the product of the entire circuit board 1 complete.

[0022] Specifically, in this embodiment, the circuit board 1 includes multiple product units arranged in a matrix, each product unit including a circuit area 2 and a waste area 3, the waste area 3 being located on the periphery of the circuit area 2.

[0023] Specifically, in this embodiment, the step "removing the defective product using a transplant jig" includes: first pressing the pressure plate onto the waste area 3, and then using a cutting tool 7 to cut the defective product and the waste area 3, so that the circuit board 1 will not warp during the cutting process.

[0024] Specifically, in this embodiment, the pressure plate includes a first pressing part 4, a second pressing part 5, and a third pressing part 6 disposed around the product. The first pressing part 4 and the second pressing part 5 are disposed at both ends of the third pressing part 6, and the first pressing part 4 and the second pressing part 5 form a concave structure that mates with the product. The first pressing part 4, the second pressing part 5, and the third pressing part 6 press against the board material surrounding the defective product. When the tool 7 cuts the defective product and the waste area 3, the circuit board material 1 will not warp during the cutting process.

[0025] Specifically, in this embodiment, the manufacturing tolerance of the pressure plate and the cutting tool 7 is a total of ±0.02mm.

[0026] Specifically, in this embodiment, the cutting accuracy tolerance of the tool 7 is ±0.01mm.

[0027] Specifically, in this embodiment, the inlay tolerance of the good replacement part is ±0.01mm.

[0028] The above method effectively solves the problem of board bending during FP-coil product transplantation. The pressure plate in the transplantation fixture can effectively hold down the circuit board 1 when the tool 7 transplants defective products, so that the product does not bend under force. This satisfies the goal of preventing product bending during the transplantation process. The defective products are removed through the inspection process. The defective products are removed individually from the circuit board 1 containing defective products through the defective product removal process and the good product replacement process. Good products are then inserted to replace the defective products in the whole board with good products. This can achieve the goal of shipping all good products from the circuit board 1 while greatly reducing the amount of waste from defective products, effectively saving various production materials. After the above process, the overall appearance of the circuit board 1 is good and the flatness is high.

[0029] The content disclosed above is only a preferred and feasible embodiment of the present invention, and is not intended to limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention specification and drawings are included in the scope of the patent application of the present invention.

[0030] The various embodiments in this specification are described in a progressive manner. The same or similar parts between the various embodiments can be referred to each other. Each embodiment focuses on describing the differences from other embodiments.

[0031] Although this application has been described by way of examples, those skilled in the art will know that this application has many modifications and variations without departing from the spirit of this application, and it is intended that the appended embodiments include these modifications and variations without departing from this application.

Claims

1. A processing method for improving board warping during the transfer of FPCOIL products, characterized in that, Includes the following steps: Provide circuit boards containing products and transplantation jigs that can transplant individual products; Remove the entire circuit board containing defective products, mark the defective products, and ship them to the grafting process area. The defective product is removed using a transplant jig, which includes a pressure plate and a cutting tool. The pressure plate is pressed onto the circuit board, and then the defective product is transplanted using the cutting tool. Remove the border of the circuit board and use a cover plate to flip the board surface over. Use a cotton swab to apply the good quality replacement part, then embed the good quality replacement part into the circuit board to make the entire circuit board product complete.

2. The processing method for improving board warping during the transfer process of FPCOIL products according to claim 1, characterized in that, The circuit board comprises multiple product units arranged in a matrix, each product unit including a circuit area and a waste area, the waste area being located on the periphery of the circuit area.

3. The processing method for improving board warping during the transfer process of FPCOIL products according to claim 2, characterized in that, The step "removing the defective product using a transplant jig" includes: first pressing the pressure plate onto the board material surrounding the defective product, and then using a cutter to cut the connection between the defective product and the waste area, so that the circuit board material will not warp during the cutting process.

4. The processing method for improving board warping during the transfer process of FPCOIL products according to claim 3, characterized in that, The pressure plate includes a first pressing part, a second pressing part, and a third pressing part disposed around the product. The first pressing part and the second pressing part are disposed at both ends of the third pressing part, and the first pressing part and the second pressing part form a concave structure that cooperates with the product.

5. The processing method for improving board warping during the transfer process of FPCOIL products according to claim 4, characterized in that, The cumulative manufacturing tolerance of the pressure plate and the cutting tool is ±0.02mm.

6. The processing method for improving board warping during the transfer process of FPCOIL products according to claim 1, characterized in that, The cutting accuracy tolerance of the tool is ±0.01mm.

7. The processing method for improving board warping during the transfer process of FPCOIL products according to claim 1, characterized in that, The inlay tolerance of the good quality replacement parts is ±0.01mm.

Images