Reinforced cover for electronic device

Abstract

Strengthened covers for electronic devices are disclosed herein. Cover members of the devices can be strengthened by ion exchange in combination with ion implantation to provide both impact resistance and bend resistance.

Description

Cross-references to related applications

[0001] This application is a non-provisional application filed on February 5, 2025, entitled “Strengthened Covers for Electronic Devices”, U.S. Provisional Patent Application No. 63 / 754,400, and claims the benefit of that U.S. Provisional Patent Application, and also claims the benefit of European Application No. 24386147.3, filed on December 20, 2024, entitled “Strengthened Covers for Electronic Devices”, the disclosures of which are incorporated herein by reference in their entirety. Technical Field

[0002] The described embodiments generally relate to reinforced covers for electronic devices and electronic devices including such covers. More specifically, this embodiment relates to covers reinforced by ion exchange and ion implantation, and portable electronic devices including such covers. Background Technology

[0003] Some common devices include displays that can be protected by transparent components that shield the display from external elements. In some cases, the transparent component is formed of glass or plastic. While glass offers enhanced scratch resistance and other beneficial properties, it can be less impact-resistant than some other materials. The systems and techniques described herein relate to glass covers that have been reinforced to provide improved mechanical properties, including enhanced impact resistance. Summary of the Invention

[0004] The aspects disclosed below relate to a cover for an electronic device, which is reinforced to provide impact resistance. The cover may be located above the display of the device or may form another part of the housing. In some cases, the cover includes a cover member formed of glass or glass-ceramic material, and the cover is reinforced by forming a compressive stress layer that provides impact resistance.

[0005] In some cases, the compressive stress layer can provide impact resistance by offering a deeper compressive depth and a higher maximum compressive stress. The deeper compressive depth can be sufficient to provide resistance to crack initiation and / or propagation. Higher compressive stress near the surface of the cover member can provide resistance to bending of that surface. In some examples, the cover and cover member are located above the display and / or optical sensors of a portable electronic device.

[0006] In some respects, the cap member is strengthened by both ion exchange and ion implantation. One or more ion exchange operations can provide a greater depth of compression. One or more ion implantation operations can provide higher compressive stress near this surface of the cap member.

[0007] This disclosure provides an electronic device comprising: a display; a cover located above the display and including a cover member formed of an ion-exchangeable silicate material including lithium ions, the cover member including: a first compressive stress region extending from an outer surface of the cover member to a first depth, the first compressive stress region including: a first concentration of sodium ions; and a first concentration of alkali metal ions, the alkali metal ions being greater than potassium ions and embedded in the cover member; and a second compressive stress region extending inwardly from the first compressive stress region to a second depth, the second compressive stress region including a second concentration of the sodium ions and substantially free of the alkali metal ions.

[0008] Alternatively or additionally, this disclosure provides an electronic device comprising: a housing; a cover coupled to the housing and including a cover member formed of an alkaline aluminosilicate material, the cover member including: an ion-modified layer comprising: a first region extending from a surface of the cover member to an implantation depth of alkali metal ions greater than potassium ions, the first region including the alkali metal ions and a first concentration of sodium ions; a second region extending from the first region to a depth of the ion-modified layer and including a second concentration of sodium ions; a core region extending from the second region and including lithium ions; and a display located below the cover member.

[0009] Alternatively or additionally, this disclosure provides an electronic device comprising: a display; a housing; a cover coupled to the housing, located above the display, and including a cover member formed of an ion-exchangeable silicate material, the cover member including: a first compressive stress layer extending from an outer surface of the cover member to a first compression depth, the first compressive stress layer defining a first compressive stress at the outer surface and including: a first aggregate of alkali metal ions greater than potassium ions, the first aggregate of alkali metal ions defining a first injection depth less than the first compression depth within the cover member; and a first aggregate of sodium ions; a second compressive stress layer extending from an inner surface of the cover member to a second compression depth, the inner surface opposite the outer surface, and the second compressive stress layer defining a second compressive stress at the inner surface and including: a second aggregate of alkali metal ions, the second aggregate of alkali metal ions defining a second injection depth less than the second compression depth within the cover member; and a second aggregate of sodium ions; and a tensile stress region located between the first compressive stress layer and the second compressive stress layer and including lithium ions. Attached Figure Description

[0010] This disclosure will be more readily understood from the following detailed description taken in conjunction with the accompanying drawings, wherein similar reference numerals denote similar elements.

[0011] Figure 1A A front perspective view of an example electronic device is shown.

[0012] Figure 1B It shows Figure 1A Rear perspective view of an electronic device.

[0013] Figure 2 An example cover component for use in electronic devices is shown.

[0014] Figure 3 An example of a reinforced cover component is shown.

[0015] Figure 4 An example of a front perspective view of another electronic device is shown.

[0016] Figure 5 An example of a cross-sectional view of an electronic device is shown.

[0017] Figure 6A An example cross-sectional view of the ion-modified layer in the cover component is shown.

[0018] Figure 6B It shows Figure 6A An example of a magnified view.

[0019] Figure 7A A cross-sectional view of the compressive stress layer in the cover member is shown.

[0020] Figure 7B It shows Figure 7A An example of a magnified view.

[0021] Figure 8A An example of compressive stress distribution formed by ion exchange is shown.

[0022] Figure 8B An example of compressive stress distribution formed by ion exchange and ion implantation is shown.

[0023] Figure 9A An example of symmetrical compressive stress distribution in a cover member is shown.

[0024] Figure 9B An example of asymmetric compressive stress distribution in a cover member is shown.

[0025] Figure 10 A cross-sectional view of the outlined cover component is shown.

[0026] Figure 11 An example of the internal stress distribution in the peripheral portion of a contoured cover member is shown.

[0027] Figure 12 Another example of internal stress distribution in the peripheral portion of a contoured cover member is shown.

[0028] Figure 13 An example block diagram of the components of an electronic device is shown.

[0029] The purpose of crosshairs or shading lines in the accompanying drawings is generally provided to clarify the boundaries between adjacent elements and also to enhance the readability of the drawings. Therefore, the presence or absence of crosshairs or shading lines does not indicate or suggest any preference or requirement for a particular material, material properties, element proportions, element dimensions, commonalities of similar illustrative elements, or any other characteristic, property, or nature of any element illustrated in the accompanying drawings.

[0030] Additionally, it should be understood that the proportions and dimensions (relative or absolute) of the various features and elements (as well as their sets and groups), and the boundaries, spacing, and positional relationships therebetween, are provided in the accompanying drawings solely to facilitate understanding of the various embodiments described herein, and may therefore be unnecessarily presented or illustrated for scaling and are not intended to indicate any preference or requirement for the illustrated embodiments to exclude embodiments described herein. Detailed Implementation

[0031] Reference will now be made in detail to the representative embodiments illustrated in the accompanying drawings. It should be understood that the following description is not intended to limit the embodiments to a single preferred embodiment. Rather, the embodiments are intended to cover alternatives, modifications, and equivalents that may be included within the scope and spirit of this disclosure and the appended claims.

[0032] As described herein, portable electronic devices may include a glass sheet or glass article located above the device's display, also referred to as a "cover glass." The aspects disclosed below relate to a cover for an electronic device that is reinforced to provide impact resistance. The cover may be located above the device's display or may form another part of the housing. In some cases, the cover includes a cover member formed of glass or glass-ceramic material. In some examples, the cover and the cover member are located above the display and / or optical sensors of the portable electronic device.

[0033] In some aspects, at least a portion of the cap member is strengthened by a process including ion exchange and ion implantation operations. The strengthening process can create a compressive stress layer extending from at least one surface of the cap member and providing impact resistance to the cap member. This impact resistance may include a combination of crack resistance and flexural resistance. The compressive stress distribution of the compressive stress layer may have a relatively large compression depth to provide crack resistance. The compressive stress distribution may also have relatively high near-surface compressive stress to provide flexural resistance.

[0034] In some implementations, including at least one ion implantation operation during the strengthening process increases the surface compressive stress compared to a strengthening process that does not include ion implantation. For example, the surface compressive stress obtained using ion implantation combined with ion exchange can be two to five times that obtained using ion exchange alone. Therefore, the compressive stress layer generated by a process including at least one ion exchange operation and at least one ion implantation operation can provide both relatively high compressive stress and relatively large compression depth.

[0035] The following text is for reference only. Figures 1A to 13 These and other implementation schemes are discussed. However, those skilled in the art will readily understand that the detailed descriptions given herein with respect to the accompanying drawings are for illustrative purposes only and should not be construed as limiting.

[0036] Figure 1A A front perspective view of an exemplary electronic device 100 is shown, and Figure 1B A rear perspective view of the exemplary electronic device is shown. The electronic device 100 may be a mobile phone (also known as a cell phone). In other examples, the electronic device may be in the form of a tablet computer, a laptop computer, a display monitor, a wearable electronic device (e.g., a smartwatch or headphones), or another type of electronic device.

[0037] Electronic device 100 includes housing 105. Housing 105 includes housing 110, front cover 120, and rear cover 121. In some examples, front cover 120 has a profiled shape, and cover members included in front cover 120 also have a profiled shape.

[0038] Housing 105 defines an internal cavity in which one or more device components are housed. Therefore, housing 105 at least partially surrounds one or more device components. Electronic device 100 includes a display assembly 170 and a rear sensor assembly 189. Electronic device 100 also includes a forward-facing camera and / or a forward-facing biometric sensor 184 (which may be an optical sensor), and / or related... Figure 13 All or some of the other device components described. For example, the electronic device may include one or more of a display assembly, a processor, a power supply, a sensor system (e.g., an optical sensor system), an input / output mechanism, a wireless communication or charging component, or a memory. The electronic device 100 may also include electronic circuitry operatively connected to the device components.

[0039] like Figure 1A As shown in the example, the front cover 120 is positioned above the display assembly 170. The display assembly 170 may include a touch-sensitive layer. In some embodiments, the display assembly 170 is an organic light-emitting diode (OLED) display assembly or an active-layer organic light-emitting diode (AMOLED) display assembly. In other embodiments, the display assembly 170 is a liquid crystal (LCD) assembly, a light-emitting diode (LED) display assembly, or an LED-backlit LCD display assembly.

[0040] The front cover defines at least a portion of the front surface 102 of the electronic device. The front cover 120 defines an opening 168 that allows input to a microphone or another device component. The cover 120 includes a cover member 130. This cover member may comprise or be formed of any of the materials described below with respect to cover member 230. The cover 120 may also include a surface coating disposed above the outer surface of the cover member 130, such as an anti-reflective coating and / or a stain-resistant (e.g., oleophobic) coating. The cover 120 may also include a coating disposed above the inner surface of the cover member 130. As an example, this inner coating may provide a decorative effect and / or a masking function.

[0041] like Figure 1BAs shown in the example, electronic device 100 includes a rear sensor assembly 189. The rear sensor assembly 189 includes multiple cameras 191 and 192. Electronic device 100 also includes components 193 and 194, which may be light sources, sensors such as depth sensors, or any other suitable components. At least a portion of the rear sensor assembly is located beneath a rear cover 121. Figure 1B The number of cameras and other components of the rear sensor assembly shown are exemplary and not limiting, and in other examples, the electronic device may include more or fewer cameras and / or other components of the rear sensor assembly.

[0042] The rear cover 121 defines at least a portion of the rear surface 104 of the electronic device. The cover 121 includes a cover member 131. Figure 1B In one example, the rear cover 121 defines a protrusion 127 at the location of the rear sensor assembly 189. The protrusion 127 may define an assembly of openings, and one or more components of the rear sensor assembly and / or other components of the electronic device may extend at least partially through an opening in the assembly of openings. In some examples, a cover member 131 defines the protrusion 127. In other examples, the protrusion 127 may be defined by a plurality of cover members, one of which is cover member 131. In some embodiments, the rear cover 121 may be located above a display, which may be an additional display.

[0043] The cover member 131 may comprise or be formed of any of the materials described below with respect to cover member 230. The cover 121 may also include a surface coating disposed above the outer surface of the cover member 131, such as an anti-reflective coating and / or a stain-resistant (e.g., oleophobic) coating. The cover 121 may also include a coating disposed above the inner surface of the cover member 131. As an example, this inner coating may provide a decorative effect and / or a masking function.

[0044] Each of the front cover member 130, the rear cover member 131, the front cover 120, and the rear cover 121 may define any of a variety of surface textures. In some examples, the rear cover member 131 may have a texture with a higher amplitude (alternatively, height), approximately the same amplitude, and / or a lower amplitude than the anti-glare texture of the front cover member 130. In some cases, the rear cover member 131 may have a combination of surface textures.

[0045] The housing 110 of the electronic device 100 is coupled to each of the front cover 120 and the rear cover 121. The housing 110 includes input devices 185, 186, 187, and 188. Figure 1A and Figure 1B In the example, each input device in the input device list can be a button, a touch-activated button, etc. Figure 1A and Figure 1B The examples provided are not limiting, and in other examples, electronic device 100 may include input devices in the form of knobs, crowns, scroll wheels, etc. Housing 110 also includes a window 113 that facilitates the transmission of wireless communication signals. Housing 110 further defines openings to facilitate input to the electronic device. Opening 117 may allow input to a microphone and / or output from a speaker. Opening 119 may define a port. In some cases, housing 110 is formed of a metallic material, or includes one or more components formed of a metallic material. Examples of metallic materials suitable for housing 110 include iron-based alloys (e.g., steel), titanium-based alloys, aluminum-based alloys, magnesium-based alloys, etc. In other cases, housing 110 is formed of or includes one or more components formed of glass, glass-ceramic, or ceramic materials.

[0046] exist Figure 1A and Figure 1B In the example, housing 110 is formed of multiple components, such as components 111, 112, 114, 116, and 118. In some embodiments, components 111, 112, 114, 116, and 118 are metallic components separated by dielectric components 115 (e.g., polymer or polymer composite components). The dielectric components may provide electrical isolation between adjacent metallic components. One or more of the metallic components may be coupled to the internal circuitry of the electronic device 100 and may be used as antennas for transmitting and receiving wireless communications. Housing 110 may define a side surface 106 of the electronic device, and each of the metallic components and dielectric components may define a corresponding portion of the side surface. Figure 1A and Figure 1B The examples are not intended to be restrictive, and other configurations may be appropriate.

[0047] Figure 2 An example cover member for an electronic device is shown. In some examples, the cover member 230 is positioned above one or more of the display, camera, or sensor array of the electronic device. The cover member 230 defines an outer surface 242, an inner surface 244, and a side surface 246. When the cover member is assembled with other components of the housing, the inner surface 244 of the cover member 230 may at least partially define the inner surface of the housing.

[0048] The cover component 230 defines the perimeter 233. For example... Figure 2 As shown in the example, the cover member 230 includes a central portion 232 and a peripheral portion 231 defining a periphery 233. Figure 2 In the example, the peripheral portion 231 completely surrounds the central portion 232. In some cases, the central portion 232 is substantially flat, and the peripheral portion 231 is curved; examples of these are at least in [the following text is missing]. Figure 10As shown in the cross-sectional view. The central portion 232 may define an area larger than that of one or more surfaces of the cover member than that of the peripheral portion 231. The cover member 230 has a thickness T, a length L, and a width W. The dimensions of the cover member 230 are adapted to an electronic device. In some cases, the cover member 230 may have a thickness greater than 500 micrometers to 5 mm, 400 micrometers to 3 mm, or 200 micrometers to 1 mm.

[0049] In some embodiments, the cover member 230 has a three-dimensional or profiled shape other than a flat sheet. For example, the cover member 230 may have a profiled shape. In some cases, the cover member 230 includes a peripheral portion defining one or more curved surfaces, and is therefore alternatively referred to herein as a curved peripheral portion. In some examples, each of the outer and inner surfaces of the curved peripheral portion of the cover member defines a curved distribution or a profiled shape. The outer surface may define a convex curved distribution, and the inner surface may define a concave curved distribution, such that the curved peripheral portion curves toward the interior of the electronic device housing. The curved peripheral portion may extend from another substantially flat portion of the cover member, such as the central portion of the cover member. The display or another component of the electronic device may be located inside the housing. Figure 5 and Figure 10 Examples of cover members with defined curvature distributions are shown in the figures, and the descriptions provided with respect to these figures are generally applicable to this document.

[0050] The cover member 230 may include an ion-exchangeable material, such as a glass material or a glass-ceramic material. The ion-exchangeable material may be a silicate material. The silicate material may be a basic aluminosilicate material, such as an aluminosilicate material including lithium ions. In some embodiments, the cover member 230 is a glass cover member formed of a silicate glass material. In some cases, the cover member 230 may be formed of a silicate glass-ceramic material. In some cases, the cover member 230 may have a laminated structure comprising one or more layers of glass material, glass-ceramic material, and / or polymer material. In some cases, the outer layer of the laminated structure may be formed of glass and / or glass-ceramic material, while in other cases, the outer layer of the laminated structure may be formed of a polymer material. In some embodiments, the glass material or glass-ceramic material may be sufficiently transparent for use over a display and / or optical sensor. In some cases, the glass material or glass-ceramic material may have at least 80% transmittance within the operating wavelength range of the display or sensor. In some examples, the operating wavelength range may be the visible wavelength range and / or the infrared wavelength range.

[0051] In some embodiments, the reinforced cap member 230 is produced by performing one or more ion exchange operations and one or more ion implantation operations on a substrate of ion-exchangeable material. Each of the one or more ion exchange operations and one or more ion implantation operations can modify the composition of the substrate. This process can form an ion-modified layer extending from one or more surfaces of the reinforced cap member. Modification of the ion composition within the ion-modified layer can generate compressive stress within the ion-modified layer, as described in more detail with respect to Figures 6 through 9. The description provided with respect to Figures 6 through 9 is generally applicable herein and will not be repeated here.

[0052] The strengthening process typically includes at least one operation in which smaller ions in the ion-exchangeable material are exchanged for larger ions, thereby creating an ion-exchange layer. For example, if the glass material contains sodium ions, the sodium ions can be exchanged for potassium ions. Similarly, if the ion-exchangeable material contains lithium ions, the lithium ions can be exchanged for sodium ions and / or potassium ions. In some embodiments, the ion-exchange layer extends above the outer, inner, and side surfaces of the substrate.

[0053] In addition to at least one ion exchange operation, the enhancement process may also include at least one ion implantation operation. This ion implantation operation typically modifies the composition within the ion exchange layer. Due to the differences in the mechanisms of ion implantation and ion exchange operations, the modification of the composition achieved by ion implantation may differ from the modification produced by ion exchange. In some embodiments, the ion implantation operation implants ions larger than those introduced during the ion exchange operation. The implanted ions may alternatively be referred to as encapsulated ions. In some cases, the relative size of the ions may be determined based on the ionic radius of one ion relative to the ionic radius of another ion. In some cases, the ion implantation operation implants ions with ionic radii larger than that of potassium. For example, the implantation operation may implant alkali metal ions, such as rubidium ions (e.g., Rb). + ) and / or cesium ions (e.g., Cs) + Ions introduced through implantation may concentrate near the surface of the capping member. In some cases, ions can be implanted to depths greater than zero and less than or equal to 0.5 micrometers, greater than zero and less than or equal to 1 micrometer, greater than zero and less than or equal to 2 micrometers, greater than zero and less than or equal to 5 micrometers, greater than zero and less than or equal to 10 micrometers, greater than zero and less than or equal to 20 micrometers, or greater than zero and less than or equal to 50 micrometers.

[0054] In some embodiments, the ion implantation operation can define a maximum depth of implanted ions from the surface, which may alternatively be referred to herein as the implantation depth. In some embodiments, the implantation depth is in the range of greater than 0 to 0.5 micrometers, greater than 0 to 1.0 micrometers, greater than 0 to 2.0 micrometers, greater than 0 to 5 micrometers, greater than 0.25 micrometers to 5 micrometers, greater than 0 to 10 micrometers, greater than 0.25 micrometers to 10 micrometers, greater than 0.5 micrometers to 10 micrometers, greater than 0 to 20 micrometers, greater than 0.5 micrometers to 20 micrometers, greater than 1 micrometer to 20 micrometers, greater than 1 micrometer to 50 micrometers, or greater than 2 micrometers to 50 micrometers. Regarding Figures 6A to 7B The additional descriptions provided regarding ions introduced by implantation are generally applicable to this document and will not be repeated here.

[0055] In some embodiments, the strengthening process produces an ion-modified layer extending from each of the outer surface 242, inner surface 244, and side surface 246 of the cover member. In some cases, the ion-modified layer may be substantially uniform across all surfaces of the cover member. In these cases, the resulting strengthening of the cover member may be substantially uniform. In other cases, the ion-modified layer may vary over the cover member. In some examples, the strengthening provided at the outer surface 242 may differ from the strengthening provided at the inner surface 244 and / or the side surface 246. For example, the strengthening provided at the outer surface 242 may be similar to the strengthening provided at the inner surface 244, but the strengthening provided at the side surface 246 may be greater. In some embodiments, the strengthening process strengthens different areas of the cover member in different ways, as explained in more detail below.

[0056] The changes in the ion-modified layer and the resulting enhancements can be achieved in several ways. In some examples, the capping member can be selectively exposed to an ion exchange medium by masking other areas of the capping member or by selectively applying an ion exchange medium and / or an energy source to enhance ion exchange. Alternatively or additionally, the capping member can be selectively implanted with ions.

[0057] The compressive stress layer generated by the strengthening process defines the surface compressive stress. In some embodiments, including at least one ion implantation operation during the strengthening process increases the surface compressive stress compared to a strengthening process that does not include ion implantation. Therefore, the compressive stress layer generated by a process including at least one ion exchange operation and at least one ion implantation operation can provide both relatively high compressive stress and relatively large compression depth. In some embodiments, the surface compressive stress generated using the methods described herein is greater than 500 MPa or greater than 1 GPa. In some examples, this surface compressive stress can be greater than 500 MPa for glass-ceramic materials and greater than 1 GPa for glass materials.

[0058] The stress distribution across the thickness of the cap member can be symmetrical or asymmetrical. In some embodiments, the stress distribution across the thickness of the cap member is symmetrical. In some cases, the depth of compression from the outer surface of the cap member and the depth of compression from the inner surface are substantially the same (e.g., differing by no more than 10%). In some embodiments, when the cap member is symmetrically reinforced, the depth of compression can range from 15% to 30% of the thickness of the cap member. The compressive stress at the outer surface and the compressive stress at the inner surface can also be substantially the same.

[0059] In other embodiments, the stress distribution is asymmetrical across the thickness of the cap member. In some cases, the compression depth can differ at different surfaces of the cap member. For example, a first compressive stress layer extending from a first surface of the cap member can be formed by at least one ion exchange operation and at least one ion implantation operation, while a second compressive stress layer extending from a second surface of the cap member can be formed by only one or more ion implantation operations. In this example, the compression depth of the first portion of the compressive stress layer can be greater than the compression depth of the second portion of the compressive stress layer. In some examples, when the cap member is asymmetrically strengthened, the deeper compressive stress layer can have a compression depth in the range of greater than or equal to 30% or less than or equal to 60% of the thickness of the cap member.

[0060] Alternatively or additionally, when the cover member has an asymmetric stress distribution, the surface compressive stress may differ at different surfaces of the cover member. In an example where a first compressive stress layer extending from a first surface is formed by ion exchange and ion implantation operations, and a second compressive stress layer extending from a second surface is formed by ion exchange operations only, the first compressive stress layer may have a higher surface compressive stress than the second compressive stress layer.

[0061] In some implementations, ion implantation operations, as described herein, can affect the birefringence level of the cover member when applied locally to areas of the cover member. In some cases, the process of strengthening the substrate may include additional operations (such as heat treatment) to reduce the birefringence level. Where these areas are covered with a coating that reduces light transmission (such as an ink layer), additional heat treatment may not be necessary.

[0062] Figure 3 An example of a reinforced component is shown. Cover component 330 includes reinforced peripheral regions 351 and 353. Cover component 330 also includes another reinforced region 352. In some embodiments, the reinforced peripheral regions 351 and 353 are located within the peripheral portion 331 of the cover component. The reinforced region 352 may be located within the central portion 332 of the cover component. When the shape of the cover component defines a center, the central portion (such as the central portion 332) may include a center.

[0063] In some embodiments, the cover member 330 has a profiled shape. In some cases, the peripheral portion 331 is curved, and reinforced peripheral regions 351 and 353 are located within the curved peripheral portion 331 of the cover member. The peripheral portion 331 may define curved outer and inner surfaces, and these surfaces may have any of the curved shapes described herein, including those relating to... Figure 10 The shape described by the curved periphery.

[0064] The periphery 331 defines the periphery 333 of the cover member 330. The periphery 333 further defines the corner 336. Figure 3 The examples provided are not intended to be limiting, and in other examples, the cover member may not need to define any corners or may not need to define four corners. In some examples, the corners may be rounded. Cover member 330 may be similar to cover member 230 in thickness, material, and other properties.

[0065] like Figure 3 As illustrated in the example, each reinforced peripheral region 351 in the set of reinforced peripheral regions 351 includes a corresponding corner 336 in the set of corners 336. Each reinforced peripheral region 353 is located between a pair of reinforced peripheral regions 351. In some embodiments, each of the reinforced peripheral regions 351 and 353 and each of the reinforced regions 352 is reinforced by ion exchange. Additionally, one or more of the reinforced regions 351, 352, and 333 may be reinforced by ion implantation.

[0066] In some embodiments, the reinforcement of the cover member is substantially the same in each of the reinforcement zones 351, 352, and 353. In other embodiments, the reinforced peripheral zone 351 is reinforced in a different manner than the reinforcement zone 352. In some cases, the reinforced peripheral zone 351 may be reinforced similarly to the reinforced peripheral zone 353, such that the reinforcement of the cover member is substantially uniform along the perimeter 333. In other cases, the reinforced peripheral zone 353 may be reinforced similarly to the reinforcement zone 352.

[0067] In some embodiments, the reinforcement varies within each of the reinforced peripheral regions 351 and 353. In some embodiments, customized reinforcement of the reinforced peripheral regions 351 and 353 allows control over the level and location of maximum tensile stress within the bent peripheral portion while still providing impact resistance. At least regarding Figure 11 and Figure 12 The additional description of the customized enhancement provided is generally applicable to this document and will not be repeated here. In some embodiments, one or more of the enhanced peripheral regions 351 and 353 and the enhanced region 352 are enhanced using a process including at least one ion exchange operation and at least one ion implantation operation.

[0068] Figure 4 An example of a front perspective view of another electronic device is shown. Figure 4 The device can be a wearable electronic device, such as a watch (e.g., an electronic watch such as a smartwatch) or another wrist-worn device.

[0069] Electronic device 400 includes a housing 405. The housing includes a casing 410 and a front cover 420 that defines at least a portion of the front surface 402 of the electronic device. The front cover 420 is located above a display assembly 470. The housing may also include a rear cover that can be located above a sensing panel.

[0070] In some embodiments, the cover member 430 is profiled. In some cases, the cover member 430 is shaped such that the central portion of the cover member protrudes relative to the peripheral portion. Alternatively, the central portion of the cover member may be described as offset relative to the peripheral portion (e.g., in the vertical direction). Figure 5 and Figure 10 The cross-sectional view shows an example of a cover with a profile. Cover member 430 may include or be formed of any of the ion-exchangeable materials previously described with respect to cover member 230.

[0071] Housing 405 defines an internal cavity in which one or more device components are housed. Electronic device 400 includes a display assembly 470 and may also include a rear sensing panel. Electronic device 400 includes an input device 412, which may be a knob having an outer surface configured to receive rotary input. Electronic device 400 also includes an input device 414, which may be a button configured to receive touch or press input. A strap 408 is attached to housing 410 and configured to secure the electronic device to a user.

[0072] Figure 5 An example cross-sectional view of an electronic device is shown. Cover 520 includes cover member 530 defining a contoured shape. Figure 5 In the example, the peripheral portion 531 of the cover member 530 defines a curved outer surface 543 and a curved inner surface 545. The electronic device 500 may be... Figure 4 An example of an electronic device 400, whose cross-section is along Figure 4 The CC cutoff in the text could be an example of other electronic devices described in this article.

[0073] The peripheral portion 531 may be curved, and may be any curved peripheral portion similar to the curved peripheral portions described herein (including...). Figure 3 and Figure 10 The curved peripheral portion is reinforced. In some cases, the reinforcement of the peripheral portion 531 can be tailored to create a greater offset between the tensile stress region and the side surface compared to a uniformly reinforced peripheral portion 531. Similarly, the reinforcement of the peripheral portion 531 can create a greater offset between the tensile stress region and the transition between the outer surface and the side surface of the cover member 530.

[0074] The housing 505 of the electronic device 500 includes a cover 520 and a housing 510. The housing 510 may include, as per [the relevant information]... Figure 1A The housing 110 describes one or more housing components. Figure 5 In the example, a portion of the side surface 546 of the cover member 530 protrudes relative to the housing 110; however, this example is not intended to be limiting, and in other examples, the side surface 546 may be flush with or recessed relative to the housing 110. The assembly 511 may include one or more of the following: a support for the cover member 530, a touchscreen, a portion of a display assembly, a sensor assembly, or, with respect to Figure 1 and... Figure 13 Any one of the components described. For example... Figure 5As shown in the example, assembly 511 is positioned along and coupled to the curved inner surface 545. In some embodiments, a portion of the display assembly is positioned along and coupled to the curved inner surface 545. In some specific embodiments, the display may be flexible or have a non-planar shape, such that the surface of the display conforms to or otherwise has a curved shape corresponding to the curved inner surface 545, such that the display follows the curved distribution of the curved inner surface 545.

[0075] Figure 6A A cross-sectional view of the ion-modified layer in the cover member is shown. Figure 6A Examples can be along Figure 2 The cover component 230 line AA, along Figure 3 The line BB in the middle or along Figure 4 An example of a cross-sectional view captured by CC in [the image / framework]. Figure 6A As shown in the example, cover member 630a defines an outer surface 642a and an ion-modified layer 662a extending from the outer surface 642a. Cover member 630a further defines an inner surface 644a and an ion-modified layer 664a extending from the inner surface 644a. Cover member 630a also includes a region 682a having an unmodified composition between the ion-modified layers 662a and 664a. This region 682a may alternatively be referred to herein as a core region of the cover member, and layers 662a and 664a may alternatively be referred to as modified composition layers. Although Figure 6A Examples show ion-modified layers 662a and 664a with substantially the same depth, but this example is not intended to be limiting, and in other examples, layers of modified composition extending from the outer and inner surfaces need not have the same depth and / or composition distribution.

[0076] Each of the ion-modified layers 662a and 664a can be generated by a process including ion exchange and ion implantation operations. Therefore, each of the ion-modified layers 662a and 664a can include ions introduced by ion exchange and ions introduced by ion implantation. Each of the ion-modified layers 662a and 664a can include the maximum concentration of ions introduced by ion exchange (e.g., sodium ions). Each of the ion-modified layers 662a and 664a can also include the maximum concentration of ions introduced by ion implantation (e.g., ions with an ionic radius larger than that introduced by ion exchange).

[0077] Figure 6BAn enlarged view is shown of an ion-modified layer produced by ion implantation following ion exchange in the cap member 630b. The ion-modified layer 662b includes a first region 691 extending from the outer surface 642b and a second region 692 extending from the first region 691. In some embodiments, the first region 691 includes ions introduced by ion implantation and also includes ions introduced by ion exchange. The first region 691 may extend from the outer surface 642b to a first depth DOI. E This may alternatively be referred to herein as the implantation depth. The second region 692 includes ions introduced via ion exchange, but is substantially free of ions introduced via ion implantation.

[0078] Ions introduced via ion implantation can have a larger ionic radius than ions introduced via ion exchange. In some embodiments, the ion exchange operation can exchange lithium ions for sodium and / or potassium ions. Ions introduced via ion implantation can be alkali metal ions. These alkali metal ions can have a larger ionic radius than potassium ions (e.g., rubidium and / or cesium ions). Regarding Figure 2 The additional descriptions of ions introduced via ion exchange and ion implantation provided are generally applicable to this paper and will not be repeated here.

[0079] In some embodiments, the first depth (or injection depth) of the first region 691 is in the range of greater than 0 to 0.5 micrometers, greater than 0 to 1.0 micrometers, greater than 0 to 2.0 micrometers, greater than 0 to 5 micrometers, greater than 0.25 micrometers to 5 micrometers, greater than 0 to 10 micrometers, greater than 0.25 micrometers to 10 micrometers, greater than 0.5 micrometers to 10 micrometers, greater than 0 to 20 micrometers, greater than 0.5 micrometers to 20 micrometers, greater than 1 micrometer to 20 micrometers, greater than 1 micrometer to 50 micrometers, or greater than 2 micrometers to 50 micrometers.

[0080] The second region 692 extends from the first region 691 to the second depth DOL. E The second depth is the depth of the ion-modified layer, alternatively referred to as the layer depth of the ion-modified layer. In some embodiments in which the ion-modified layers 662a and 664a are symmetrical, the layer depth may be in the range of 15% to 40% of the thickness of the cap member.

[0081] Similar to ion-modified layer 662a, Figure 6A The ion-modified layer 664a may include a third region extending from the inner surface 644a and including ions introduced by ion implantation and ions introduced by ion exchange. The third region may extend to a third depth, which may alternatively be referred to as a second implantation depth. Figure 6A The ion-modified layer 644a may further include a fourth region extending from the third region and including ions introduced by ion exchange, but substantially free of ions introduced by ion implantation. The fourth region may extend to a fourth depth DOL. I The fourth depth is the depth of the ion exchange layer from the inner surface, and is alternatively referred to herein as the second layer depth.

[0082] Figure 7A A cross-sectional view of the compressive stress layer in the cover member is shown. Figure 7A Examples can be along Figure 2 The cover component 230 line AA, along Figure 3 The line BB in the middle or along Figure 4 An example of a cross-sectional view captured by CC in [the image / framework]. Figure 7A As shown in the example, cover member 730a defines an outer surface 742a and a compressive stress layer 762a extending from the outer surface 742a. ​​Cover member 730a further defines an inner surface 744a and a compressive stress layer 764a extending from the inner surface 744a. Tensile stress region 782a is located between compressive stress layer 762a and compressive stress layer 764a.

[0083] Each of the compressive stress layers 762a and 764a can be generated by a process including ion exchange and ion implantation operations. Therefore, each of the compressive stress layers 762a and 764a can include ions introduced by ion exchange and ions introduced by ion implantation. In some embodiments, compressive stress layer 762a includes a first set of alkali ions larger than potassium ions and a first set of sodium ions, and compressive stress layer 764a includes a second set of alkali ions larger than potassium ions and a second set of sodium ions. Each of the compressive stress layers 762a and 764a can be generated by a corresponding ion-modified layer (such as...). Figure 6A and Figure 6B It is formed within the ion-modified layer. The tensile stress zone 782a may include lithium ions.

[0084] Each of the compressive stress layers 762a and 764a defines a corresponding compressive stress distribution, compression depth, and surface compressive stress. Figure 8B , Figure 9A and Figure 9B A non-limiting example of a compressive stress distribution that can be formed using the strengthening techniques described herein is shown. Although Figure 7A Examples show compressive stress layers 762a and 764a with substantially the same depth DOC. 7E and DOC 7IHowever, this example is not intended to be limiting, and in other examples, the compressive stress layers extending from the outer and inner surfaces need not have the same compression depth, surface compressive stress, and / or compressive stress distribution.

[0085] Figure 7B An enlarged view is shown of a compressive stress layer 762b resulting from ion implantation following ion exchange in the cap member 730b. The compressive stress layer 762b comprises layers extending from the outer surface 742b to a depth D. 7E A first compressive stress region 791 and a second compressive stress region 792 extending from the first compressive stress region 791 to a certain depth, the depth being equal to the compressive depth DOC from the outer surface of the combination of the first compressive stress region 791 and the second compressive stress region 792. 7E In some embodiments, the first compressive stress region 791 may be located in a region similar to that of the ion-modified layer. Figure 6B Within region 691, this region includes ions introduced via ion implantation and also includes ions introduced via ion exchange. The second compressive stress region 792 may be located in a region similar to that of the ion-modified layer. Figure 6B Within region 692, this region primarily comprises ions introduced via ion exchange. In some cases, the second compressive stress region 792 may be substantially free of ions introduced via ion implantation.

[0086] Similar to compressive stress layer 762a, Figure 7A The compressive stress layer 764a may include a third compressive stress region extending from the inner surface 744a and including ions introduced by ion implantation and ions introduced by ion exchange. Figure 7A The compressive stress layer 764a may also include a fourth compressive stress region extending from the third region and including ions introduced by ion exchange, but may substantially contain no ions introduced by ion implantation. Regarding Figure 2 and Figures 6A to 6B The additional descriptions of ions introduced via ion exchange and ion implantation provided are generally applicable to this paper and will not be repeated here.

[0087] Figure 8A and Figure 8B The compressive stress distribution at different stages of the strengthening process, which includes ion exchange and ion implantation operations, is shown. Figure 8A An example of the compressive stress distribution generated by an ion exchange operation is shown. The compressive stress distribution 871 defines the depth of compression (DOC). A and surface compressive stress CS A In some implementations, the ion exchange operation can exchange lithium ions for sodium ions and / or potassium ions, as previously discussed. Figure 2 and Figures 6A to 6B The subject of discussion.

[0088] Figure 8B An example of a compressive stress distribution formed by ion implantation following ion exchange is shown. The compressive stress distribution 872 defines the depth of compression (DOC). B and surface compressive stress CS B This ion exchange process can be similar to that regarding Figure 8A The described ion exchange process.

[0089] In some implementations, the ion implantation operation implants ions with ionic radii larger than those of potassium ions. Ion implantation operations can implant alkali metal ions with ionic radii larger than those of potassium ions. Examples of such alkali metal ions include rubidium ions (e.g., Rb). + ), cesium ions (e.g., Cs) + ) etc. Regarding Figure 2 and Figures 6A to 6B The additional discussion on ion implantation procedures provided is largely applicable to this paper, and those details will not be repeated here.

[0090] Figure 8B The compressive stress distribution 872 can be in Figure 7A and Figure 7B Examples of compressive stress distributions formed in the compressive stress regions of 762a, 762b, or 764a. The first region 891 of the compressive stress distribution 872 may be in... Figure 7B An example of the region of compressive stress distribution formed in compressive stress region 791. As previously discussed... Figure 7B The region 791 discussed includes ions introduced via ion implantation, and also includes ions introduced via ion exchange. The second region 892 of the compressive stress distribution 872 can be in... Figure 7B An example of the region of compressive stress distribution formed in compressive stress region 792. As previously discussed... Figure 7B The region under discussion, 792, primarily includes ions introduced via ion exchange and may be substantially free of ions introduced via ion implantation.

[0091] Therefore, the first region 891 of the compressive stress distribution 872 can be determined by both the compressive stress caused by ion implantation and the compressive stress caused by ion exchange. The second region 892 of the compressive stress distribution 872 can be determined by the compressive stress caused by ions introduced through ion exchange. When the ionic radius of the ions introduced through implantation is greater than the ionic radius of the ions introduced through ion exchange, ... Figure 8A Compared to the corresponding region of compressive stress distribution 871, the compressive stress in region 891 can increase. Therefore, the surface compressive stress CS B Greater than Figure 8ASurface compressive stress CS A In some examples, the surface compressive stress obtained by combining ion implantation with ion exchange can be two to five times that obtained by using ion exchange alone.

[0092] The compressive stress distribution 872 provides both crack resistance and flexural resistance. Depth of compression (DOC) B It provides crack resistance, and compared to the compressive stress distribution 871, the larger surface compressive stress CS B Improved flexural strength can be provided. In some embodiments, the surface compressive stress generated using the methods described herein is greater than 500 MPa or greater than 1 GPa. In some examples, this surface compressive stress may be greater than 500 MPa for glass-ceramic materials and greater than 1 GPa for glass materials. In some embodiments, the compression depth may be in the range of 15% to 30% of the thickness of the symmetrically strengthened cap member, and in the range of greater than or equal to 30% and less than or equal to 60% of the thickness of the asymmetrically strengthened cap member.

[0093] Figure 9A An example of a symmetrical compressive stress distribution in a cap member is shown. Each of the compressive stress distributions 972a and 974a can be formed by a strengthening process including ion exchange and ion implantation. Thus, each of the compressive stress distributions 972a and 974a can provide both crack resistance and flexural resistance to the outer and inner surfaces of the cap member. Compressive stress distribution 972a may alternatively be referred to as a first compressive stress distribution, and compressive stress distribution 974a may alternatively be referred to as a second compressive stress distribution.

[0094] The cover member includes a compressive stress distribution 972a extending from the outer surface of the cover member and a compressive stress distribution 974a extending from the inner surface of the cover member. Figure 9A In the example, compressive stress distribution 974a is substantially the same as compressive stress distribution 972a. For example, each of compressive stress distributions 972a and 974a defines a surface compressive stress CS. 9A and compression depth DOC 9A In some implementations, the compression depth DOC 9A It can be in the range of 15% to 30% of the thickness of the cover component. This thickness is defined by the distance between the two vertical axes.

[0095] The compressive stress distribution 972a includes a first region 991a and a second region 992a, while the compressive stress distribution 974a includes a third region 993a and a fourth region 994a. The first region 991a and the third region 993a can be related to the previously mentioned... Figure 8BThe method described is similar to that described above, determined by both compressive stress induced by ion implantation and compressive stress induced by ion exchange. The second region 992a and the fourth region 994a can be compared with those previously discussed... Figure 8B The methods described are similar, primarily determined by the compressive stress caused by ion exchange. Regarding... Figure 8B The description provided is generally applicable to this article.

[0096] like Figure 9A As shown, the first region 991a has characteristics similar to the third region 993a, and the second region 992a has characteristics similar to the fourth region 994a. The first region 991a defines a first maximum slope, and the second region 992a defines a second maximum slope that is less than the first maximum slope. The third region 993a defines a third maximum slope, and the fourth region 994a defines a fourth maximum slope that is less than the third maximum slope.

[0097] Figure 9A A tensile stress distribution 982a is also shown between compressive stress distribution 972a and compressive stress distribution 974a. The compressive stress distribution 972a, compressive stress distribution 974a and tensile stress distribution 982a together at least partially define the total stress distribution in the cover member, which can pass through the thickness of the cover member. Figure 9A The total stress distribution shown is symmetrical.

[0098] Figure 9B An example of asymmetric compressive stress distribution in a cover member is shown. Figure 9B In the example, the compressive stress distribution 972b extending from the outer surface of the cover member is different from the compressive stress distribution 974b extending from the inner surface of the cover member.

[0099] The compressive stress distribution 972b has a greater depth of compression (DOC) than the compressive stress distribution 974b. 9BI Compression depth DOC 9BE .and Figure 9A Compared to the example, stress distribution 972b has a greater depth of compression (DOC) than stress distribution 972a. 9BE In some implementations, the compression depth DOC 9BE It can be within the range of 30% or more of the thickness of the cover component or less than or equal to 60%.

[0100] exist Figure 9B In the example, compressive stress distribution 972b has a smaller compressive surface stress CS than compressive stress distribution 974b. 9BI Compressive surface stress CS 9BEThis stress distribution configuration can help provide force balance within the cap member and limit torsion due to asymmetric strengthening. However, this example is not limiting, and in other examples, the difference between the surface compressive stresses of the compressive stress distribution extending from the outer surface and the compressive stress distribution extending from the inner surface may differ. Figure 9B As shown. As an example, the compressive surface stress at the outer surface can be greater than the compressive surface stress at the inner surface.

[0101] Figure 9B A tensile stress distribution 982b is also shown between compressive stress distribution 972b and compressive stress distribution 974b. The compressive stress distribution 972b, tensile stress distribution 982b, and compressive stress distribution 974b together at least partially define the total stress distribution in the cover member, which can pass through the thickness of the cover member.

[0102] The compressive stress distribution 972b can be formed through a strengthening process including ion exchange and implantation, and therefore can have the same compressive stress distribution as... Figure 8B The compressive stress distribution 872 and Figure 9A The compressive stress distributions 972a and 974a have similar properties. For example, the compressive stress distribution 972b can provide impact resistance to the outer surface of the cover member by providing both crack resistance and bending resistance. The compressive stress distribution 972b includes a first compression region 991b and a second compression region 992b.

[0103] The compressive stress distribution 974b can provide flexural resistance to the inner surface of the cap member. In some cases, the compressive stress distribution 974b can be formed solely by an ion implantation operation. For example, the compressive stress distribution 974b can be formed by ion implantation. The implanted ions can be those previously mentioned... Figure 2 and Figures 6A to 6B Any ion discussed (e.g., alkali metal ions larger than potassium ions). In other cases, the compressive stress distribution may be formed solely by ion exchange operations. For example, compressive stress distribution 974b can be formed by introducing potassium ions into the cap member via ion exchange.

[0104] Figure 10 A cross-sectional view of the outlined cover component is shown. Figure 10 It can be Figure 4 An example of a profiled cover member of an electronic device, or any other profiled cover member described herein, in cross-sectional view. This cross-sectional view can be viewed along... Figure 4 The line CC in the middle, along Figure 3 The line BB in the middle or along Figure 2 Cut off line AA in the middle. For example... Figure 10As shown in the example, the cover member 1030 has a three-dimensional shape including a curved peripheral portion. The cover member defines an outer surface 1042, an inner surface 1044, and a side surface 1046 extending from the outer surface 1042 to the inner surface 1044. The cover member 1030 may be... Figure 4 An example of cover member 430, and may be similar to cover member 230 in terms of thickness, material and other properties.

[0105] like Figure 10 As shown, the cover member 1030 includes a curved first portion 1031 and a second portion 1032. Each of the curved first portion 1031 and the second portion 1032 can be reinforced by the techniques described herein. In some embodiments, a first compressive stress layer extending from at least a portion of the outer surface 1042 and a second compressive stress layer extending from at least a portion of the inner surface 1044 are each formed by an ion exchange operation and an ion implantation operation, and may have properties specific to the requirements of... Figure 7A and Figure 7B The compressive stress layers 762a, 762b and 764a and Figure 8B The compressive stress distribution in 872 has similar characteristics to those described.

[0106] The first curved portion 1031 defines the side surface 1046 of the cover member, and is therefore an example of the curved peripheral portion of the cover member. Figure 10 In the example, the first curved portion 1031 may be curved toward the interior of the housing. The first curved portion 1031 of the cover member 1030 defines a curved outer surface 1043 and a curved inner surface 1045. The curved outer surface 1043 may alternatively be referred to as a convex outer surface of the cover member 1030 or a curved first outer surface. The curved inner surface 1045 may alternatively be referred to as a concave inner surface of the cover member 1030 or a curved first inner surface. The convex outer surface 1043 and Figure 10 In the example, the concave inner surface 1045 is generally opposite. The curved outer surface 1043 may alternatively be referred to as the curved outer surface region of the outer surface 1042, and the curved inner surface 1045 may alternatively be referred to as the curved inner surface region of the inner surface 1044. The outer surface 1042 may represent the entire outer surface of the cover member 1030, and the inner surface 1044 may represent the entire inner surface of the cover member 1030.

[0107] In some embodiments, a first portion 1031 of the bend in the cover member extends from a second portion 1032. The second portion 1032 of the cover member 1030 defines an outer surface 1047 and an inner surface 1048. In some embodiments, the magnitude of the curvature of the outer surface 1047 is less than the magnitude of the curvature of the outer surface 1043, and the magnitude (alternately, in absolute value) of the curvature of the inner surface 1048 is less than the magnitude of the curvature of the inner surface 1045. Figure 10 In the example, each of the outer surface 1047 and the inner surface 1048 is substantially flat (or, substantially planar). The outer surface 1047 may alternatively be referred to as the second outer surface or the outer surface region of the outer surface 1042. The inner surface 1048 may alternatively be referred to as the second inner surface or the inner surface region of the inner surface 1044.

[0108] Figure 11 An example of the internal stress distribution in the peripheral portion of a contoured cover member is shown. Figure 11 This is a non-limiting example of compression zone 1166, which produces an asymmetrical stress distribution across the thickness of cover member 1130. Figure 11 The internal stress distribution shown can be Figure 10 Examples of internal stress distribution in detailed areas 11 and 12. Figure 11 As shown, the curved peripheral portion 1131 of the cover member 1130 includes a compression zone 1166 extending from a curved outer surface 1143, a curved inner surface 1145, and a side surface 1146. As previously discussed... Figure 3 As described, one or more parameters of the compressive stress zone 1166 may vary within the curved peripheral portion 1131. These parameters include, but are not limited to, compression depth, surface compressive stress, and the compressive stress distribution within the compression zone. Figure 11 In the example, compression zone 1166 extends from side surface 1146 to a greater depth than from curved outer surface 1143. Compression zone 1166 also extends from curved outer surface 1143 to a greater depth than curved inner surface 1145. Cover member 1130 also includes tension zones 1186 and 1188, wherein tension zone 1188 has a higher magnitude of tensile stress. Dashed line 1192 indicates the boundary between compressive and tensile stresses.

[0109] Figure 12 Another example of the internal stress distribution in the peripheral portion 1231 of a contoured cover member is shown. Figure 12 This is a non-limiting example of a compression zone 1266 that creates a symmetrical stress distribution across the thickness of the cover member 1230. The compression zone 1266 extends from the side surface 1246 to a greater depth than the curved outer surface 1243 or the curved inner surface 1245. The cover member 1230 also includes tensile zones 1286 and 1288, wherein the tensile zone 1288 has a higher magnitude of tensile stress. The dashed line 1292 indicates the boundary between the compressive and tensile stresses.

[0110] Figure 13 An example block diagram of the components of an electronic device is shown. Electronic device 1300 can be an example of electronic device 100 or any other electronic device described herein. Figure 13As shown, the electronic device includes a display 1302, a processor 1304, a power supply 1306, a sensor system 1310, an input / output mechanism 1312, a memory 1308, and a system 1314 that communicates with the components 1302, 1304, 1306, 1308, 1310, and 1312.

[0111] In various embodiments, electronic device 1300 may include display 1302. Display 1302 may include liquid crystal display (LCD), light-emitting diode (LED) display, LED-backlit LCD display, organic light-emitting diode (OLED) display, active-matrix organic light-emitting diode (AMOLED) display, organic electroluminescent (EL) display, electrophoretic ink display, etc. If display 1302 is a liquid crystal display or electrophoretic ink display, display 1302 may also include a backlight assembly controllable to provide a variable display brightness level. If display 1302 is an organic light-emitting diode or organic electroluminescent display, the brightness of display 1302 can be controlled by modifying the electrical signals provided to the display element. Furthermore, information regarding the configuration and / or orientation of the electronic device can be used to control the output of the display, as described with respect to input device 1312. In some cases, the display is integrated with a touch sensor and / or force sensor to detect touch and / or force applied along the outer surface of device 1300.

[0112] Device 1300 also includes a processor 1304. Processor 1304 may be operatively connected to computer-readable storage 1308. Processor 1304 may be operatively connected to components of storage 1308 via an electronic bus or bridge. Processor 1304 may be implemented as one or more computer processors or microcontrollers configured to perform operations in response to computer-readable instructions. Processor 1304 may include the central processing unit (CPU) of device 1300. Additionally and / or alternatively, processor 1304 may include other electronic circuitry located within device 1300, including application-specific integrated circuits (ASICs) and other microcontroller devices. Processor 1304 may be configured to perform the functions described in the examples above.

[0113] Device 1300 also includes a power supply 1306. In some embodiments, the power supply includes a battery configured to provide power to the components of electronic device 1300. The battery may include one or more power storage units linked together to provide an internal power supply. The battery may be operatively coupled to power management circuitry configured to provide appropriate voltage and power levels for individual components or groups of components within electronic device 1300. The battery may be configured via the power management circuitry to receive power from an external power source, such as an AC power outlet. The battery may store the received power, allowing electronic device 1300 to operate for extended periods, ranging from several hours to several days, without connection to an external power source.

[0114] Memory 1308 may include various types of non-transitory computer-readable storage media, including, for example, read-access memory (RAM), read-only memory (ROM), erasable programmable memory (e.g., EPROM and EEPROM), or flash memory. Memory 1308 is configured to store computer-readable instructions, sensor values, and other persistent software elements.

[0115] Device 1300 also includes a sensor system 1310. Sensor system 1310 may include one or more sensors or sensor components, such as force sensors, capacitive sensors, accelerometers, barometers, gyroscopes, proximity sensors, light sensors, microphones, acoustic sensors, light sensors (including ambient light, infrared (IR) light, ultraviolet (UV) light), optical facial recognition sensors, depth measurement sensors (e.g., time-of-flight sensors), health monitoring sensors (e.g., electrocardiogram (ECG) sensors, heart rate sensors, photoplethysmography (PPG) sensors, pulse oximeters), biometric sensors (e.g., fingerprint sensors), or other types of sensing devices. In some cases, device 1300 includes a sensor array (also referred to as a sensing array), which transmits… The sensor array includes multiple sensors. For example, the sensor array may include an ambient light sensor, a lidar sensor, and a microphone. In another example, one or more camera components may also be associated with the sensor array. The sensor system 1310 is operatively coupled to processing circuitry. In some embodiments, the sensors may detect deformation and / or changes in configuration of the electronic device and are operatively coupled to processing circuitry that controls a display based on sensor signals. In some specific embodiments, the output from the sensor system is used to reconfigure the display output to correspond to the orientation or folded / unfolded configuration or state of the device. Exemplary sensors for this purpose include accelerometers, gyroscopes, magnetometers, and other similar types of positioning / orientation sensing devices.

[0116] Input / output mechanism 1312 may include one or more input devices and one or more output devices. Input devices are devices configured to receive input from a user or environment. For example, input devices may include, for instance, push-buttons, touch-activated buttons, capacitive touch sensors, touchscreens (e.g., touch-sensitive displays or force-sensitive displays), capacitive touch buttons, dial pads, crowns, etc. In some embodiments, input devices may provide dedicated or primary functions, including, for example, power buttons, volume buttons, home buttons, scroll wheels, and camera buttons. One or more output devices include a display 1302 that presents visual information that can be generated by processor 1304. One or more output devices may also include one or more speakers for providing audio output and / or one or more tactile devices configured to generate tactile or perceptual outputs along the outer surface of device 1300. Input / output mechanism may also include a communication port or communication channel. The communication channel may include one or more wireless interfaces adapted to provide communication between processor 1304 and external devices, one or more antennas (e.g., antennas including or using housing components as radiating elements), communication circuitry, firmware, software, or any other components or systems that facilitate wireless communication with other devices.

[0117] Electronic device 1300 also includes system 1314 that communicates with components 1302, 1304, 1306, 1308, 1310, and 1312. In some examples, system 1314 includes circuitry such as electronic buses and / or bridges. System 1314 may also include application-specific integrated circuits (ASICs) and other microcontroller devices.

[0118] As used herein, the terms “substantially the same,” “substantially equal to,” or “similar to” relative to two values ​​mean that the difference between the two values ​​is less than 10%. The term “substantially free” means that the concentration is less than 0.01%. The term “substantially” used with respect to flatness (alternatively, planarity) may mean a height variation of no more than 10% relative to a flat or planar surface.

[0119] The following discussion applies to the electronic devices described herein, and its scope extends to devices that can be used to acquire personally identifiable information data. It is well known that the use of personally identifiable information should comply with privacy policies and practices that are generally recognized as meeting or exceeding industry or governmental requirements for protecting user privacy. Specifically, personally identifiable information data should be managed and processed to minimize the risk of unintentional or unauthorized access or use, and the nature of authorized use should be clearly explained to the user.

[0120] For illustrative purposes, the foregoing description uses specific names to provide a thorough understanding of the described embodiments. However, it will be apparent to those skilled in the art that specific details are not required to practice the described embodiments. Therefore, for illustrative and descriptive purposes, the foregoing description of specific embodiments described herein is presented. They are not intended to be exhaustive or to limit the embodiments to the precise forms disclosed. It will be apparent to those skilled in the art that many modifications and variations are possible in light of the teachings above.

[0121] Additional Notes An electronic device is provided, comprising: a display; a cover located above the display and including a cover member formed of an ion-exchangeable silicate material including lithium ions, the cover member including: a first compressive stress region extending from an outer surface of the cover member to a first depth, the first compressive stress region including: a first concentration of sodium ions; and a first concentration of alkali metal ions, the alkali metal ions being greater than potassium ions and embedded in the cover member; and a second compressive stress region extending inwardly from the first compressive stress region to a second depth, the second compressive stress region including a second concentration of the sodium ions and substantially free of the alkali metal ions.

[0122] Preferably, the cover member further includes: a third compressive stress region extending from the inner surface of the cover member to a third depth, the third compressive stress region including: a third concentration of sodium ions; and a second concentration of alkali metal ions, the alkali metal ions being greater than potassium ions and embedded in the cover member; a fourth compressive stress region extending inward from the second compressive stress region to a fourth depth, the fourth compressive stress region including a fourth concentration of sodium ions and substantially free of alkali metal ions; and a tensile stress region located between the second compressive stress region and the fourth compressive stress region and including lithium ions.

[0123] Preferably, the third depth differs from the first depth by no more than 10%, and the fourth depth differs from the second depth by no more than 10%.

[0124] Preferably, the ion-exchangeable silicate material comprising the lithium ions is a glass-ceramic material, the first compressive stress region defines a first compressive stress at the outer surface; the third compressive stress region defines a second compressive stress at the inner surface; and each of the first compressive stress and the second compressive stress is greater than 500 MPa.

[0125] Preferably, the cover member defines a first compressive stress distribution extending from the outer surface of the cover member to the second depth and a second compressive stress distribution extending from the inner surface of the cover member to the fourth depth; the first compressive stress distribution defines a first maximum slope in the first compressive stress region and a second maximum slope in the second compressive stress region, the second maximum slope being less than the first maximum slope, and the second compressive stress distribution defines a third maximum slope in the third compressive stress region and a fourth maximum slope in the fourth compressive stress region, the fourth maximum slope being less than the third maximum slope.

[0126] Preferably, the difference between the first maximum slope and the third maximum slope does not exceed 10%.

[0127] Preferably, wherein the second depth defines a first compression depth from the outer surface, the cover member further includes: a third compressive stress region extending from the inner surface of the cover member to a second compression depth less than the first compression depth, the third compressive stress region including a second concentration of the alkali metal ions, the alkali metal ions being greater than potassium ions and embedded in the cover member; and a tensile stress region located between the second compressive stress region and the third compressive stress region and including the lithium ions.

[0128] An electronic device is provided, comprising: a housing; a cover coupled to the housing and including a cover member formed of an alkaline aluminosilicate material, the cover member including: an ion-modified layer including: a first region extending from a surface of the cover member to an implantation depth of alkali metal ions greater than potassium ions, the first region including the alkali metal ions and sodium ions of a first concentration; a second region extending from the first region to a layer depth of the ion-modified layer and including sodium ions of a second concentration; a core region extending from the second region and including lithium ions; and a display located below the cover member.

[0129] Preferably, the surface of the cover member is the outer surface of the cover member, the ion-modified layer is a first ion-modified layer, the layer depth is a first layer depth; and the implantation depth is a first implantation depth, the first ion-modified layer defining a first maximum concentration of the alkali metal ions; and the cover member further includes a second ion-modified layer, the second ion-modified layer extending from an inner surface opposite the outer surface to a second layer depth, the second ion-modified layer defining a second implantation depth and a second maximum concentration of the alkali metal ions.

[0130] Preferably, each of the first implantation depth and the second implantation depth of the alkali metal ion is greater than zero and less than or equal to 10 micrometers, and the second maximum concentration of the alkali metal ion differs from the first maximum concentration of the alkali metal ion by no more than 10%.

[0131] Preferably, the depth of the first layer is greater than or equal to 30% of the thickness of the cover member and less than or equal to 60% of the thickness of the cover member.

[0132] Preferably, the second ion-modified layer includes a third region extending from the surface of the cap member to the second injection depth, the third region including the second maximum concentration of the alkali metal ions and the third concentration of the sodium ions; and a fourth region extending from the third region to the second layer depth, the fourth region including the fourth concentration of the sodium ions.

[0133] Preferably, it further includes a third ion-modified layer that extends from the side surface of the cover member to a third layer depth, the third ion-modified layer comprising a fifth concentration of sodium ions.

[0134] Preferably, the surface is a first surface located within a peripheral portion of the cover member, and the cover member further defines an ion exchange layer extending from a second surface located within a central portion of the cover member, the ion exchange layer comprising sodium ions and substantially free of alkali metal ions.

[0135] Preferably, the ion-exchangeable silicate material is an aluminosilicate glass material, and the ion-modified layer defines a compressive stress greater than or equal to 1 GPa at the surface of the cover member.

[0136] An electronic device is provided, comprising: a display; a housing; a cover coupled to the housing, located above the display, and including a cover member formed of an ion-exchangeable silicate material, the cover member including: a first compressive stress layer extending from an outer surface of the cover member to a first compression depth, the first compressive stress layer defining a first compressive stress at the outer surface and including: a first set of alkali metal ions greater than potassium ions, the first set of alkali metal ions defining a first injection depth less than the first compression depth within the cover member; and a first set of sodium ions; a second compressive stress layer extending from an inner surface of the cover member to a second compression depth, the inner surface opposite the outer surface, the second compressive stress layer defining a second compressive stress at the inner surface, and including: a second set of alkali metal ions, the second set of alkali metal ions defining a second injection depth less than the second compression depth within the cover member; and a second set of sodium ions; and a tensile stress region located between the first compressive stress layer and the second compressive stress layer and including lithium ions.

[0137] Preferably, the cover member is a contoured cover member, the outer surface is a convex outer surface, and the inner surface is a concave inner surface.

[0138] Preferably, each of the first compression depth and the second compression depth is in the range of 15% to 30% of the thickness of the cover member.

[0139] Preferably, the second compressive stress at the inner surface is greater than the first compressive stress at the outer surface.

[0140] Preferably, the first compressive stress layer defines a first compressive stress distribution, the first compressive stress distribution comprising: a first region extending from the outer surface and defining a first maximum slope; and a second region extending from the first region to the first compression depth and defining a second maximum slope less than the first maximum slope; and the second compressive stress layer defines a second compressive stress distribution, the second compressive stress distribution comprising: a third region extending from the inner surface and defining a third maximum slope; and a fourth region extending from the third region to the second compression depth and defining a fourth maximum slope less than the third maximum slope.

[0141] Preferably, the ion-exchangeable silicate material is an aluminosilicate glass material, and each of the first compressive stress at the outer surface and the second compressive stress at the inner surface is greater than or equal to 1 GPa.

Claims

1. An electronic device, the electronic device comprising: monitor; A cover, located above the display and comprising a cover member formed of an ion-exchangeable silicate material including lithium ions, the cover member comprising: A first compressive stress region extends from the outer surface of the cover member to a first depth, and the first compressive stress region includes: The first concentration of sodium ions; and A first concentration of alkali metal ions, said alkali metal ions being greater than potassium ions and embedded in the capping member; and A second compressive stress region extends inward from the first compressive stress region to a second depth, the second compressive stress region comprising a second concentration of the sodium ions and substantially free of the alkali metal ions.

2. The electronic device according to claim 1, wherein the cover member further comprises: A third compressive stress region, extending from the inner surface of the cover member to a third depth, includes: The third concentration of sodium ions; and The second concentration of the alkali metal ions, which are greater than potassium ions, is embedded in the cover member; A fourth compressive stress region, extending inward from the second compressive stress region to a fourth depth, comprising a fourth concentration of sodium ions and substantially free of the alkali metal ions; and A tensile stress region, which is located between the second compressive stress region and the fourth compressive stress region and includes the lithium ions.

3. The electronic device according to claim 2, wherein: The third depth differs from the first depth by no more than 10%; and The fourth depth differs from the second depth by no more than 10%.

4. The electronic device according to claim 2, wherein: The ion-exchangeable silicate material including the lithium ions is a glass-ceramic material; The first compressive stress region defines a first compressive stress at the outer surface; The third compressive stress region defines the second compressive stress at the inner surface; and Each of the first compressive stress and the second compressive stress is greater than 500 MPa.

5. The electronic device according to claim 2, wherein: The cover member defines a first compressive stress distribution extending from the outer surface of the cover member to the second depth and a second compressive stress distribution extending from the inner surface of the cover member to the fourth depth; The first compressive stress distribution defines a first maximum slope in the first compressive stress region and a second maximum slope in the second compressive stress region, wherein the second maximum slope is less than the first maximum slope; and The second compressive stress distribution defines a third maximum slope in the third compressive stress region and a fourth maximum slope in the fourth compressive stress region, wherein the fourth maximum slope is less than the third maximum slope.

6. The electronic device according to claim 5, wherein the difference between the first maximum slope and the third maximum slope does not exceed 10%.

7. The electronic device according to claim 1, wherein: The second depth of the second compressive stress region defines a first compression depth from the outer surface; The cover member further includes: a third compressive stress region extending from the inner surface of the cover member to a second compression depth less than the first compression depth, the third compressive stress region comprising a second concentration of the alkali metal ions, the alkali metal ions being greater than potassium ions and embedded within the cover member; and A tensile stress region, which is located between the second compressive stress region and the third compressive stress region and includes the lithium ions.

8. An electronic device, the electronic device comprising: case; A cover, coupled to the housing and comprising a cover member formed of an alkaline aluminosilicate material, the cover member comprising: An ion-modified layer, the ion-modified layer comprising: A first region, extending from the surface of the capping member to an alkali metal ion implantation depth greater than that of potassium ions, includes: The alkali metal ions; and The first concentration of sodium ions; and A second region, extending from the first region to the depth of the ion-modified layer and comprising a second concentration of the sodium ions; and A core region, extending from the second region and including lithium ions; and A display, located below the cover member.

9. The electronic device according to claim 8, wherein: The surface of the cover member is the outer surface of the cover member; The ion-modified layer is a first ion-modified layer, the layer depth is a first layer depth, and the implantation depth is a first implantation depth; The first ion-modified layer defines a first maximum concentration of the alkali metal ions; and The cap member further includes a second ion-modified layer extending from an inner surface opposite the outer surface to a second layer depth, the second ion-modified layer defining a second injection depth and a second maximum concentration of the alkali metal ions.

10. The electronic device according to claim 9, wherein: Each of the first and second implantation depths of the alkali metal ions is greater than zero and less than or equal to 10 micrometers; and The second maximum concentration of the alkali metal ion differs from the first maximum concentration of the alkali metal ion by no more than 10%.

11. The electronic device according to claim 9, wherein: The depth of the first layer is greater than or equal to 30% of the thickness of the cover member and less than or equal to 60% of the thickness of the cover member; and The depth of the second layer is less than the depth of the first layer.

12. The electronic device of claim 9, wherein the second ion-modified layer comprises: A third region, extending from the surface of the cap member to the second injection depth, the third region comprising: The second maximum concentration of the alkali metal ions; and The third concentration of sodium ions; and A fourth region, which extends from the third region to the depth of the second layer, includes sodium ions of a fourth concentration.

13. The electronic device of claim 12, further comprising a third ion-modified layer extending from a side surface of the cover member to a third layer depth, the third ion-modified layer comprising sodium ions at a fifth concentration.

14. The electronic device according to claim 8, wherein: The surface is a first surface located within the peripheral portion of the cover member; and The cover member further defines an ion exchange layer extending from a second surface located within a central portion of the cover member, the ion exchange layer comprising the sodium ions and substantially free of the alkali metal ions.

15. An electronic device, the electronic device comprising: monitor; case; A cover, coupled to the housing, located above the display and comprising a cover member formed of an ion-exchangeable silicate material, the cover member comprising: A first compressive stress layer, extending from the outer surface of the cover member to a first compression depth, the first compressive stress layer defining a first compressive stress at the outer surface and comprising: A first set of alkali metal ions greater than potassium ions, the first set of alkali metal ions defining a first injection depth within the cap member less than the first compression depth; and The first set of sodium ions; and A second compressive stress layer extends from the inner surface of the cover member to a second compression depth, the inner surface being opposite the outer surface, and the second compressive stress layer defines a second compressive stress at the inner surface and includes: The second set of alkali metal ions, wherein the second set of alkali metal ions defines a second injection depth within the cap member that is less than the second compression depth; and The second set of sodium ions; and A tensile stress region, located between the first compressive stress layer and the second compressive stress layer, and comprising lithium ions.

16. The electronic device according to claim 15, wherein: The cover member is a cover member with a profile; The outer surface is a convex outer surface; and The inner surface is a concave inner surface.

17. The electronic device of claim 16, wherein each of the first compression depth and the second compression depth is in the range of 15% to 30% of the thickness of the cover member.

18. The electronic device of claim 16, wherein the second compressive stress at the inner surface is greater than the first compressive stress at the outer surface.

19. The electronic device according to claim 15, wherein: The first compressive stress layer defines a first compressive stress distribution, the first compressive stress distribution including: A first region, the first region extending from the outer surface and defining a first maximum slope; and A second region extends from the first region to the first compression depth and defines a second maximum slope that is less than the first maximum slope; and The second compressive stress layer defines a second compressive stress distribution, the second compressive stress distribution comprising: A third region, extending from the inner surface and defining a third maximum slope; and A fourth region extends from the third region to the second compression depth and defines a fourth maximum slope that is less than the third maximum slope.

20. The electronic device according to claim 15, wherein The ion-exchangeable silicate material is aluminosilicate glass; and Each of the first compressive stress at the outer surface and the second compressive stress at the inner surface is greater than or equal to 1 GPa.

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