communication module

Abstract

This invention provides a communication module suitable for charging piles, comprising a circuit board, a wireless module, an antenna, electronic components, a shielding component, and an adhesive. The circuit board has a surface. The wireless module is disposed on this surface. The antenna is electrically connected to the wireless module. The electronic components are disposed on the surface and electrically connected to the wireless module. The shielding component is disposed on the surface and has a receiving space. The electronic components are disposed within the receiving space, and the wireless module is located outside the receiving space. The adhesive covers the periphery of the shielding component. Thus, the receiving space within the shielding component forms a space with excellent isolation, making it difficult for noise generated by the electronic components within the receiving space to interfere with the wireless module located outside the receiving space of the shielding component, thereby improving the efficiency and stability of wireless transmission and enhancing the user experience.

Description

Technical Field

[0001] This invention relates to a communication module, and more particularly to a communication module suitable for charging piles. Background Technology

[0002] With the rapid growth of the electric vehicle (EV) market, the number of charging stations (EVSE) is also constantly increasing. Data transmission for charging station systems in terms of charging efficiency, user experience, and operation management is no longer limited to traditional wired transmission; the demand for wireless transmission via methods such as 4G LTE, Wi-Fi, and Bluetooth is also growing.

[0003] However, typical charging stations contain many electronic components with different functions, and the noise generated by these components can easily interfere with components used for wireless transmission, such as antennas and wireless modules. Therefore, there is an urgent need for a method to effectively reduce the impact of electronic component noise on wireless transmission. Summary of the Invention

[0004] This invention relates to a communication module that can reduce noise interference to wireless transmission, thereby improving the efficiency of wireless transmission.

[0005] According to an embodiment of the present invention, a communication module suitable for a charging pile includes a circuit board, a wireless module, an antenna, electronic components, a shielding member, and an adhesive. The circuit board has a surface. The wireless module is disposed on this surface. The antenna is electrically connected to the wireless module. Electronic components are disposed on the surface, and one of the electronic components is electrically connected to the wireless module. The shielding member is disposed on the surface and has a receiving space. The electronic components are disposed within the receiving space, while the wireless module is located outside the receiving space. The adhesive member covers the periphery of the shielding member.

[0006] According to an embodiment of the present invention, the colloid comprises at least 3% or more metal particles.

[0007] According to an embodiment of the present invention, the colloid fills the gap between the shielding component and the circuit board.

[0008] According to an embodiment of the present invention, the shielding member includes a top plate and a plurality of sidewalls, which are respectively connected to a plurality of edges of the top plate.

[0009] According to an embodiment of the present invention, the communication module further includes a fixing clamp. The fixing clamp is disposed on the surface of the circuit board and clamps one of the sidewalls.

[0010] According to an embodiment of the present invention, the circuit board has a ground terminal. A fixing clamp is disposed at the ground terminal.

[0011] According to an embodiment of the present invention, the fixing clamp is soldered to the surface of the circuit board.

[0012] According to an embodiment of the present invention, the shielding member has an opening.

[0013] According to embodiments of the present invention, the electronic components further include a controller, a microprocessor, a microcontroller, a DDR memory, an embedded multimedia card (eMMC), a NAND flash memory, a NOR flash memory, an Ethernet chip, a Trusted Platform Module (TPM) chip, or a power converter chip.

[0014] Based on the above, in the communication module of the present invention, the shielding component is disposed on the circuit board and covers the electronic components on the circuit board, which can appropriately shield the noise emitted by the electronic components. Furthermore, the gap between the shielding component and the circuit board is filled with colloid, that is, the accommodating space within the shielding component forms a space with excellent isolation, making it difficult for the noise generated by the electronic components in the accommodating space to interfere with the wireless module located outside the accommodating space of the shielding component, thereby improving the efficiency and stability of wireless transmission and enhancing the user experience. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of a communication module before the application of colloid according to an embodiment of the present invention;

[0016] Figure 2 yes Figure 1 A schematic diagram of the communication module after applying the colloid;

[0017] Figure 3 yes Figure 1 A schematic diagram showing the removal of the shielding from the communication module;

[0018] Figure 4 yes Figure 1 Another perspective schematic diagram of the shielding component.

[0019] Explanation of reference numerals in the attached figures

[0020] 100: Communication module;

[0021] 110: Circuit board;

[0022] 112: Grounding terminal;

[0023] 114: Positioning hole;

[0024] 120: Wireless module;

[0025] 130: Antenna;

[0026] 140: Electronic components;

[0027] 150: Shielding component;

[0028] 152: Top plate;

[0029] 154: Sidewall;

[0030] 156: Opening;

[0031] 158: Positioning section;

[0032] 160: Colloid;

[0033] 170: Fixing clamp;

[0034] 172a, 172b: Clamping parts;

[0035] 1721a: Fixed section;

[0036] 1722a: Flexible section;

[0037] E: Edge;

[0038] F: Surface;

[0039] G: Gap;

[0040] P: Peripheral side. Detailed Implementation

[0041] Figure 1 This is a schematic diagram of a communication module before the application of colloid according to an embodiment of the present invention. Figure 2 yes Figure 1 A schematic diagram of the communication module after applying the colloid. Figure 3 yes Figure 1 A diagram showing the removal of the shielding from the communication module. Figure 4 yes Figure 1 Another perspective schematic diagram of the shielding component.

[0042] Please refer to Figures 1 to 4 The communication module 100 of this embodiment is applicable to electric vehicle (EV) charging stations (EVSEs) and enables wireless transmission between the charging station and the outside world. Data from the charging station, such as charging efficiency, user experience, or operational management data, can be wirelessly transmitted to the outside world via the communication module 100 within the charging station; however, the type of data transmitted is not limited thereto. The communication module 100 can perform wireless transmission, for example, in the form of 4G LTE, Wi-Fi, or Bluetooth; however, the wireless transmission mode of the communication module 100 is not limited thereto.

[0043] In this embodiment, the communication module 100 includes a circuit board 110, a wireless module 120, an antenna 130, and electronic components 140. Figure 3 ), shielding component 150 and colloid 160 ( Figure 2 Circuit board 110 has surface F. Wireless module 120 and antenna 130 are disposed on surface F, and antenna 130 is electrically connected to wireless module 120. Wireless module 120 has wireless transmission function, and antenna 130 can receive or transmit signals. Communication module 100 can wirelessly transmit with the outside world through the cooperation of wireless module 120 and antenna 130.

[0044] Electronic component 140 is disposed on surface F of circuit board 110 and is electrically connected to wireless module 120, for example, controlling wireless module 120 to perform wireless transmission. In this embodiment, the number of electronic components 140 is not limited thereto. For example, electronic component 140 may be a single electronic component. Electronic component 140 may also be multiple electronic components.

[0045] Electronic component 140 may include a processor, microprocessor unit (MPU), microcontroller unit (MCU), DDR memory (DDR RAM), embedded MultiMedia Card (eMMC), NAND flash memory, NOR flash memory, Ethernet IC, Trusted Platform Module (TPM) chip, or power converter IC, but the type of electronic component 140 is not limited thereto.

[0046] It should be noted that, Figures 1 to 3 The wireless module 120, antenna 130, and electronic component 140 are shown schematically, but are not intended to limit the shape, size, and position of the wireless module 120, antenna 130, and electronic component 140.

[0047] like Figure 3 As shown, the communication module 100 further includes a fixing clamp 170 disposed on the surface F of the circuit board 110. In some embodiments, the fixing clamp 170 is soldered to the surface F of the circuit board 110 to securely fix the fixing clamp 170 to the circuit board 110. In other embodiments, the fixing clamp 170 may be glued or fixed to the circuit board 110 by other suitable bonding methods. In some embodiments, the circuit board 110 has a ground terminal 112, and the fixing clamp 170 is disposed on the ground terminal 112. The communication module 100 may include fixing one fixing clamp 170 or multiple fixing clamps 170.

[0048] Each fixing clamp 170 includes two clamping portions 172a and 172b arranged side by side to increase the clamping force, but the number of clamping portions 172a and 172b is not limited thereto. Taking clamping portion 172a as an example, clamping portion 172a includes a connected fixing section 1721a and a resilient section 1722a. The fixing section 1721a contacts and is fixed to the surface F of the circuit board 110. At least a portion of the resilient section 1722a is close to each other and can clamp an object by elastic force.

[0049] exist Figure 3 In the embodiments shown, there are seven fixing clamps 170, but the number of fixing clamps 170 is not limited thereto.

[0050] Please also refer to Figure 4 and Figure 3 The shield 150 is disposed on the surface F of the circuit board 110 and has a receiving space. Specifically, the shield 150 has a positioning portion 158 extending toward the circuit board 110, which can be inserted into a positioning hole 114 located on the surface F of the circuit board 110.

[0051] The shielding component 150 is made of metal and has the effect of shielding signals. The shielding component 150 includes a top plate 152 and a plurality of side walls 154, which are respectively connected to a plurality of edges E of the top plate 152 to form the aforementioned receiving space.

[0052] The shield 150 may be a box-shaped body, but its shape is not limited thereto. In some embodiments, the shield 150 has an opening 156 through which the wiring of the electronic component 140 can be connected to other electronic components on the circuit board 110 or other electronic devices in the charging station.

[0053] Please refer to Figure 1 and Figure 3 When the shielding member 150 is disposed on the surface F of the circuit board 110, the shielding member 150 can be clamped by the fixing clamping member 170. Specifically, the side wall 154 of the shielding member 150 can be clamped by the elastic section 1722a of the clamping parts 172a and 172b to securely fix the shielding member 150 to the circuit board 110.

[0054] When the shielding member 150 is disposed on the surface F of the circuit board 110, the electronic component 140 is disposed within the receiving space, while the wireless module 120 and the antenna 130 are located outside the receiving space. Since the shielding member 150 covers the electronic component 140 on the circuit board 110, the noise emitted by the electronic component 140 can be appropriately shielded, reducing the interference experienced by the wireless module 120.

[0055] It should be noted that the electronic components 140 covered by the shield 150 may be those that significantly interfere with the wireless module 120, while other electronic components with low noise can still be disposed outside the receiving space of the shield 150. In some embodiments, the communication module 100 may include multiple shields 150, each covering different electronic components 140 on the circuit board 110.

[0056] Please refer to Figure 1 and Figure 2 In this embodiment, the colloid 160 covers the periphery P of the shield 150. In some embodiments, the colloid 160 fills the gap G between the shield 150 and the circuit board 110. Generally, when the shield 150 is disposed on the circuit board 110, the shield 150 and the circuit board 110 are not completely sealed; there is still a gap G, such as a hole or a slit, between the sidewall 154 of the shield 150 and the surface F of the circuit board 110. In other words, the accommodating space of the shield 150 is not a completely sealed space, and the isolation is poor. Noise generated by the electronic components 140 within the accommodating space can still escape outside the shield 150, thereby interfering with the wireless module 120 and reducing the effectiveness of wireless transmission.

[0057] In contrast, the communication module 100 of this embodiment fills these gaps G with colloid 160, forming a space with excellent isolation inside the shield 150, making it difficult for the electronic components 140 inside the shield 150 to interfere with the wireless module 120, thereby improving the efficiency and stability of wireless transmission and enhancing user experience and satisfaction.

[0058] In this embodiment, colloid 160 includes at least 3% metal particles, such as iron, cobalt, or nickel particles, but the type of metal particles is not limited thereto. Actual testing has shown that when the proportion of metal particles in colloid 160 reaches 3%, it provides a good signal shielding effect. Furthermore, colloid 160 can function stably under various environmental conditions, thus making it suitable for different working environments.

[0059] In this embodiment, after the shielding member 150 is disposed on the surface F of the circuit board 110, the adhesive 160 fills the gap G between the shielding member 150 and the circuit board 110. Specifically, the adhesive 160 fills these gaps G, for example, by dispensing, but the method of application of the adhesive 160 is not limited thereto. The height or thickness of the adhesive 160 can be adjusted according to the size of the gap G.

[0060] In a preferred embodiment, the colloid 160 is applied to the periphery P of the shield 150 to ensure that the interior of the shield 150 is isolated from the outside world, thereby preventing noise generated by the electronic components 140 inside the shield 150 from escaping to the outside and interfering with the wireless transmission of the wireless module 120. In other embodiments, the colloid 160 may be applied only to the visually perceptible gap G to save costs.

[0061] Furthermore, in some embodiments, the colloid 160 may cover a portion of the retaining member 170 exposed from the gap G. In other embodiments, the colloid 160 does not cover the retaining member 170.

[0062] In summary, in the communication module of this invention, the shielding component is disposed on the circuit board and covers the electronic components on the circuit board, which can appropriately shield the noise emitted by the electronic components. Furthermore, the gap between the shielding component and the circuit board is filled with colloid, that is, the accommodating space within the shielding component forms a space with excellent isolation, making it difficult for the noise generated by the electronic components within the accommodating space to interfere with the wireless module located outside the accommodating space of the shielding component, thereby improving the efficiency and stability of wireless transmission and enhancing the user experience.

[0063] Furthermore, the colloid contains at least 3% metal particles, which provides excellent signal shielding. At the same time, the colloid functions stably under various environmental conditions, making it suitable for diverse working environments.

[0064] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A communication module suitable for charging piles, characterized in that, include: Circuit board, having a surface; A wireless module is disposed on the surface; The antenna is electrically connected to the wireless module; An electronic component is disposed on the surface, and the electronic component is electrically connected to the wireless module; A shielding element is disposed on the surface and has a receiving space, wherein the electronic components are disposed within the receiving space, and the wireless module is located outside the receiving space; as well as A colloid that covers the periphery of the shielding component.

2. The communication module according to claim 1, characterized in that, The colloid contains at least 3% metal particles.

3. The communication module according to claim 1, characterized in that, The colloid fills the gap between the shielding component and the circuit board.

4. The communication module according to claim 1, characterized in that, The shielding component includes a top plate and multiple side walls, which are respectively connected to multiple edges of the top plate.

5. The communication module according to claim 4 further includes a fixing clamp, wherein the fixing clamp is disposed on the surface of the circuit board and clamps one of the plurality of sidewalls.

6. The communication module according to claim 5, characterized in that, The circuit board has a ground terminal, and the fixing clamp is disposed on the ground terminal.

7. The communication module according to claim 5, characterized in that, The fixing clamp is soldered to the surface of the circuit board.

8. The communication module according to claim 1, characterized in that, The shielding element has an opening.

9. The communication module according to claim 1, characterized in that, Electronic components include controllers, microprocessors, microcontrollers, DDR memory, embedded multimedia cards, NAND flash memory, NOR flash memory, Ethernet chips, trusted platform module chips, or power converter chips.

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