An etching cleaning device for LED chip processing

Abstract

This invention belongs to the field of chip processing technology, specifically an etching and cleaning device for LED chip processing. It includes a platform; a cleaning tank mounted on the platform; a rotary flow equalization device on the cleaning tank; the rotary flow equalization device includes double-layer pulleys mounted on the outer wall of the cleaning tank; a rotating shaft; two rotating shafts symmetrically mounted on a pair of opposing inner walls of the cleaning tank; the double-layer pulleys connected to one of the rotating shafts; U-shaped bases mounted on the ends of the rotating shafts; the two U-shaped bases arranged with their openings facing each other; rotating bevel gears connected to the outer wall of the cleaning tank; the two rotating bevel gears symmetrically arranged with the center of the double-layer pulleys as the axis of symmetry; a positioning shaft connected to the opposing surfaces of the two rotating bevel gears; the end of the positioning shaft away from the rotating bevel gears extends into the cleaning tank. This invention solves the problem of cleaning dead zones caused by uneven liquid flow, avoids dead zones during cleaning, improves the cleaning effect, ensures the production quality of the chips, and enhances the overall performance of the device.

Description

Technical Field

[0001] This invention belongs to the field of chip processing technology, specifically an etching and cleaning device for LED chip processing. Background Technology

[0002] The entire chip manufacturing process is based on a whole wafer as the carrier. All core processes such as etching and deposition are also completed on the wafer surface. Etching is a technology that removes materials through chemical reactions or physical impacts. Wet etching uses the principle of chemical reaction. However, after the wafer is etched, the surface of the wafer will have residual chemical solutions used in the etching process. Therefore, the processed wafer needs to be cleaned. However, when cleaning wafers in batches, existing devices have difficulty solving the problem of cleaning dead zones caused by uneven liquid flow. This not only reduces the cleaning effect but also affects the production quality of the chips. Summary of the Invention

[0003] In view of the above situation and to overcome the defects of the prior art, the present invention provides an etching and cleaning device for LED chip processing, which effectively solves the problems in the background art.

[0004] To achieve the above objectives, the present invention provides the following technical solution: an etching and cleaning apparatus for LED chip processing, comprising a device stage; a cleaning tank is installed on the device stage; a rotary current equalization device is provided on the cleaning tank to avoid cleaning dead zones on the chip surface of the wafer during the cleaning process; the rotary current equalization device includes a double-layer pulley and is installed on the outer wall of the cleaning tank; Rotating shafts; two rotating shafts are symmetrically installed on a pair of opposing inner walls of the cleaning tank; double-layer pulleys are connected to one of the rotating shafts; U-shaped bases are installed on the end points of the rotating shaft; the two U-shaped bases are arranged with their openings facing each other. Rotating umbrella teeth are connected to the outer wall of the cleaning tank; two rotating umbrella teeth are symmetrically arranged with the center of the double-layer pulley as the axis of symmetry; a positioning shaft is connected to the opposite face of the two rotating umbrella teeth; the end of the positioning shaft away from the rotating umbrella teeth extends into the cleaning tank; A positioning chute is located at one end of the positioning shaft within the cleaning tank. A positioning slide column is fitted into a positioning slide groove; the positioning slide column and the positioning slide groove are slidably engaged; an agitator is provided on the positioning slide column. A self-locking braking unit is disposed on a positioning shaft; the self-locking braking unit is used to realize the disassembly, assembly and locking of the agitator on the positioning shaft; the self-locking braking unit includes a braking base connected to the outer wall of the positioning shaft; A fixed locking assembly is disposed on a U-shaped base; the fixed locking assembly is used to clamp and fix the wafer to be cleaned inside the cleaning tank; the fixed locking assembly includes a fixing base connected to the side of the U-shaped base.

[0005] Preferably, it includes a rotating base connected to the outer wall of the cleaning tank; the two rotating bases are symmetrically arranged about the center of the double-layer pulley as the axis of symmetry; A drive shaft is mounted on a rotating base; one end of the drive shaft is connected to a drive pulley, and the other end is connected to a drive bevel gear; the drive bevel gear meshes with a rotating bevel gear. Transmission belts; one end of two transmission belts is connected to a double-layer pulley; one end of two transmission belts is connected to two transmission pulleys respectively.

[0006] Preferably, it includes a rotating slot, which is located on the side of the double-layer pulley away from the cleaning pool; A positioning bracket is connected to the outer wall of the cleaning tank; the positioning bracket is installed on the same side as the double-layer pulley. The drive source is installed in the fixed bracket; the output end of the drive source is fitted into the rotating slot.

[0007] Preferably, it includes a retaining cylinder mounted on a retaining base; The retaining slider is connected to the retaining cylinder through the side near the U-shaped base; the retaining slider and the retaining cylinder slide in fit. A retaining limit plate is connected to the end of the retaining cylinder away from the retaining base; A positioning spring is sleeved on a positioning cylinder; one end of the positioning spring is fixedly connected to a positioning limit plate, and the other end is fixedly connected to a positioning slider.

[0008] Preferably, it includes a retaining square tube, which is installed on the side of the U-shaped base away from the rotating shaft; the number of retaining square tubes is several, and the several retaining square tubes are arranged at equal intervals; The retaining column is fitted into the retaining tube; the retaining column and the retaining tube are in sliding fit. A compression spring is installed inside the fixed-position square tube; one end of the compression spring is fixedly connected to the bottom surface inside the fixed-position square tube, and the other end is fixedly connected to the fixed-position square column. A retaining arc block is installed at the end of the retaining square post away from the retaining square tube; the inner wall of the retaining arc block is provided with an embedded arc groove; the embedded arc groove extends to the two sides of the edge of the retaining arc block; the outer wall of the wafer is located on the moving path of the inner wall of the embedded arc groove.

[0009] Preferably, it includes a rotating trough disposed on the inner wall of the cleaning tank; the rotating trough is disposed on the same side as the U-shaped base; The rotating block is installed on the side of the U-shaped base near the rotating groove; the rotating block is fitted into the rotating groove, and the two slide together.

[0010] Preferably, it includes an extension plate body, which is installed on the fixed slider; the extension plate body is provided with a plurality of locking plates on the side near the fixed square tube; the number and position of the locking plates correspond to the fixed square tube. A locking slot is installed through the fixed square post on the side near the extension plate; several locking slots are arranged at equal intervals; when the locking insert plate passes through the fixed square tube, it connects with one of the locking slots.

[0011] Preferably, it includes a brake cylinder connected to a brake base; a brake slider is connected through the brake cylinder, and the two are slidably engaged. Brake limiting plate, connected to the end of brake cylinder away from brake base; A brake spring is sleeved on a brake cylinder; one end of the brake spring is fixedly connected to the brake limiting plate, and the other end is fixedly connected to the brake slider. A brake ramp is installed on the side of the brake slider near the outer wall of the positioning shaft; the ramp of the brake ramp faces the agitator; part of the ramp of the brake ramp is located in the positioning groove, and the ramp is on the moving path of the positioning slide column.

[0012] Preferably, the positioning slide post is provided with a braking groove on the side near the braking slider; the braking groove fits into the braking block, and the inclined surfaces of the two are arranged opposite each other; a positioning spring is provided in the positioning groove; one end of the positioning spring is fixedly connected to the bottom surface of the positioning groove, and the other end is located at the moving path of the positioning slide post.

[0013] Preferably, the agitator includes a forked plate connected to the end of the positioning slide away from the positioning shaft; each branch of the forked plate is connected to a stirring rod.

[0014] Compared with the prior art, the beneficial effects of the present invention are: (1) The wafer rotates continuously in the cleaning solution in the cleaning tank, ensuring that all corners of the wafer come into contact with the cleaning solution. Simultaneously, the cleaning solution forms a directional circulation, breaking the static liquid boundary layer on the wafer surface, eliminating cleaning dead zones, and ensuring uniform cleanliness on both sides of the wafer and on several wafers within the tank. This assists in the removal and rapid removal of impurities, preventing secondary adhesion. Furthermore, the gentle rotational shearing force does not damage the delicate chip structure on the wafer surface, improving the cleaning effect of the device on the chips on the wafer, while ensuring the production quality of the chips. It is worth mentioning that when the double-layer pulleys rotate, the two transmission belts simultaneously drive the two transmission pulleys to rotate, causing the transmission bevel gears to rotate under the action of the transmission shaft. This meshes with the rotating bevel gears, causing the positioning shaft on them to drive the positioning slide column to rotate within the cleaning tank, thus driving... Several agitators on the bifurcated plate rotate continuously in the cleaning tank, forming a multi-directional composite liquid flow. This enhances the scouring force on the wafer surface, further breaks down the liquid boundary layer, and eliminates cleaning dead zones. This allows fresh, clean cleaning fluid to more fully contact both sides of the wafer and the edge gaps. Combined with the wafer's own rotation, it can quickly remove impurities stripped from its surface, further preventing impurities from re-adhering to the wafer surface. At the same time, the agitators continuously apply the cleaning fluid to the surface of several chips on the wafer, actively scouring the wafer. This solves the problem of cleaning dead zones caused by uneven liquid flow when cleaning multiple wafers in batches in the cleaning tank, avoiding dead zones during wafer cleaning. This not only improves the cleaning effect but also ensures the production quality of the chips, thereby improving the effectiveness of the device. (2) When the agitator is installed, the positioning slide column moves within the positioning groove to a limited position. After passing the brake block used for limiting, it will contact the positioning spring located in the positioning groove, putting it in a buffer state. The resulting damping is used to control the moving speed of the agitator during installation, avoiding damage caused by excessive speed, such as the agitator hitting the inner wall of the cleaning tank or colliding with other parts. This improves the safety of the device and ensures its service life. When the positioning spring fails to return to its original position, the resulting elastic force will act on the positioning slide column, thereby increasing the contact strength and friction between the brake groove and the brake block. The friction force is equivalent to keeping the positioning slide column in its current position, preventing instability of the agitator during use, and further improving the cleaning effect on the wafer. At the same time, due to the number of braking grooves, the agitator can be installed at different distances from the wafer to achieve precise control of the flow field intensity and range of action. This adapts to different wafer specifications and different cleaning requirements, and can also adapt to wafer cleaning operations of different sizes, avoiding problems such as insufficient cleaning or over-rinsing in some areas. This improves the equipment's adaptability to multiple wafer specifications and further reduces the limitations of the device's use. (3) After placing the wafer between two retaining arc blocks at the same height, the force applied to the retaining arc blocks is released, so that the compression spring is no longer under force and resets, driving the retaining square column to reset and move, causing the retaining arc blocks to reset and move, thereby causing the two retaining arc blocks to move relative to each other, so that the two relatively moving blocks contact the two sides of the wafer and embed their sidewalls into the embedding arc grooves on the retaining arc blocks, thus completing the initial fixation of the wafer. At this time, the wafer has been initially fixed between the two retaining arc blocks. By repeating the above steps, several wafers can be gradually fixed and confined in the cleaning tank. By releasing the retaining slider that is pulled outward, the reset of the retaining spring can drive several locking plates on the extension plate to reset and move, so that the locking plates pass through the retaining square tube and at the same time... Connecting to one of the locking slots, the retaining column is fixed in its current position, preventing the retaining arc block on it from moving due to non-human factors. This avoids the wafers installed in the cleaning tank from becoming dislodged during cleaning, improving the wafer installation effect. Simultaneously, several locking plates are integrated onto the extension plate, meaning that the positions of several fixed wafers can be further limited simultaneously. This allows for the simultaneous installation of multiple wafers in the cleaning tank, preventing wafer dislodgment due to non-human factors during cleaning and further improving the wafer installation effect. Furthermore, the multiple locking slots allow the device to fix wafers of different sizes in the cleaning tank, further enhancing the device's usability and improving its effectiveness in wafer cleaning. (4) The installation and disassembly of the agitator can be completed quickly and easily without the aid of any tools. The installation can even be completed with one hand, which reduces the difficulty of installing and disassembling the agitator and avoids the inability to continue the operation due to the lack of matching tools. This improves the efficiency of the agitator installation and disassembly, so that the device can easily select different types, models, functions, sizes and quantities of agitators, i.e., agitators, according to different cleaning and usage requirements. At the same time, it is also easy for operators to maintain it, reducing the limitations of the device. In addition, different agitators can produce different effects. The type and shape of the agitator will directly affect the flow field of the cleaning fluid, further improving the effect of the device and improving the cleaning effect of several chips on the wafer. This allows for precise matching of different wafer cleaning requirements, which can optimize the liquid flow pattern, improve the uniformity and efficiency of cleaning, avoid damage to the fine structure of the wafer, and reduce the dead zone phenomenon during cleaning. Attached Figure Description

[0015] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used together with the embodiments of the invention to explain the invention and do not constitute a limitation thereof.

[0016] In the attached diagram: Figure 1 This is one of the schematic diagrams of the overall structure of the present invention; Figure 2 This is a cross-sectional view of the rotating groove of the present invention; Figure 3 This is a top view of the cleaning tank of the present invention; Figure 4 This is a schematic diagram of the retaining arc block structure of the present invention; Figure 5 This is the second schematic diagram of the overall structure of the present invention; Figure 6 This is a cross-sectional view of the positioning shaft of the present invention; Figure 7 This is a side view of the U-shaped base of the present invention; Figure 8 This is a cross-sectional view of the rotating block of the present invention; Figure 9 This is a side sectional view of the retaining square tube of the present invention; Figure 10 This is an exploded view of the positioning sliding column of the present invention; Figure 11 This is a cross-sectional view of the compression spring of the present invention; Figure 12 This is a side view of the brake groove of the present invention; Figure 13 This is a schematic diagram of the locking plate structure of the present invention; In the diagram: 1. Device platform; 2. Cleaning tank; 3. Double-layer pulley; 4. Rotating shaft; 5. U-shaped base; 6. Rotating bevel gear; 7. Positioning shaft; 8. Positioning groove; 9. Positioning slide column; 10. Braking base; 11. Fixing base; 12. Rotating base; 13. Transmission shaft; 14. Transmission pulley; 15. Transmission bevel gear; 16. Transmission belt; 17. Rotating slot; 18. Fixing bracket; 19. Drive source; 20. Fixing cylinder; 21. Fixing slider; 22. Fixing... 23. Position limiting plate; 24. Positioning spring; 25. Positioning square tube; 26. Positioning square column; 27. Compression spring; 28. Positioning arc block; 29. ​​Embedded arc groove; 30. Rotating slot; 31. Extended plate; 32. Locking insert plate; 33. Locking slot; 34. Braking cylinder; 35. Braking slider; 36. Braking limiting plate; 37. Braking spring; 38. Braking inclined block; 39. Braking inclined groove; 40. Positioning spring; 41. Forked plate; 42. Stirring rod. Detailed Implementation

[0017] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0018] Implementation examples, by Figures 1 to 13 The present invention includes a device platform 1; a cleaning tank 2 is mounted on the device platform 1; a rotary flow equalization device is provided on the cleaning tank 2 to avoid cleaning dead zones on the wafer surface during the cleaning process; the rotary flow equalization device includes a double-layer pulley 3, mounted on the outer wall of the cleaning tank 2; a rotating shaft 4; two rotating shafts 4 are symmetrically mounted on a pair of opposing inner walls of the cleaning tank 2; the double-layer pulley 3 is connected to one of the rotating shafts 4; a U-shaped base 5 is mounted on the end point of the rotating shaft 4; the two U-shaped bases 5 are arranged with their openings facing each other; and a rotating bevel gear 6, connected to... The two rotating bevel gears 6 are symmetrically arranged about the center of the double-layer pulley 3; the two rotating bevel gears 6 are connected to the opposite face of the positioning shaft 7; the end of the positioning shaft 7 away from the rotating bevel gears 6 extends into the cleaning tank 2; the positioning groove 8 is set at the end of the positioning shaft 7 located in the cleaning tank 2; the positioning column 9 is fitted into the positioning groove 8; the positioning column 9 and the positioning groove 8 are slidably engaged; the positioning column 9 is provided with an agitator; the agitator includes a bifurcated plate 41 connected to the end of the positioning column 9 away from the positioning shaft 7; the bifurcated plate 41... Each branch of the 1 is connected to a stirring rod 42; a rotating base 12 is connected to the outer wall of the cleaning tank 2; the two rotating bases 12 are symmetrically arranged about the center of the double-layer pulley 3; a transmission shaft 13 is installed on the rotating base 12; one end of the transmission shaft 13 is connected to a transmission pulley 14, and the other end is connected to a transmission bevel gear 15; the transmission bevel gear 15 meshes with the rotating bevel gear 6; a transmission belt 16; one end of the two transmission belts 16 is connected to the double-layer pulley 3; one end of the two transmission belts 16 is respectively connected to the two transmission pulleys 14; the rotating base 12 is connected to the outer wall of the cleaning tank 2; the two rotating bases 12 are symmetrically arranged about the center of the double-layer pulley 3; the two rotating bases 12 are symmetrically arranged about the center of the double-layer pulley 3; the two rotating bases 12 are symmetrically arranged about the center of the double-layer pulley 3; the two rotating bases 12 are symmetrically arranged about the outer wall of the cleaning tank 2 ... A movable slot 17 is located on the side of the double-layer pulley 3 away from the cleaning tank 2; a fixed support 18 is connected to the outer wall of the cleaning tank 2; the fixed support 18 is located on the same side as the double-layer pulley 3; a drive source 19 is installed inside the fixed support 18; the output end of the drive source 19 is fitted into the movable slot 17; a rotating groove 29 is located on the inner wall of the cleaning tank 2; the rotating groove 29 is located on the same side as the U-shaped base 5; a rotating block 30 is installed on the side of the U-shaped base 5 near the rotating groove 29; the rotating block 30 is fitted into the rotating groove 29, and the two slide in cooperation. After the wafers to be cleaned are clamped and fixed to the U-shaped base 5 by operating the fixed locking components, several wafers are located in the cleaning tank 2. By pouring cleaning fluid or other liquids into the tank, several chips on the wafers can be immersed and cleaned. At the same time, the drive source 19 can be activated, so that its output end drives the double-layer pulley 3 to rotate through the rotating slot 17. This drives one of the rotating shafts 4 to rotate in the cleaning tank 2, which in turn causes the U-shaped base 5 on the rotating shaft 4 to rotate in the cleaning tank 2. Since the fixed locking components on the U-shaped base 5 on both sides of the wafer are fixed, the other U-shaped base 5 is thus fixed in place. The rotating shaft 4 on the base 5 rotates within the cleaning tank 2, causing the wafer to rotate continuously in the cleaning solution within the tank 2. This ensures that every corner of the wafer comes into contact with the cleaning solution, while simultaneously creating a directional circulation of the cleaning solution. This breaks up the static liquid boundary layer on the wafer surface, eliminates cleaning dead zones, and guarantees uniform cleanliness on both sides of the wafer and among multiple wafers within the tank. It also assists in the removal and rapid removal of impurities, preventing secondary adhesion. Furthermore, the gentle rotational shearing force does not damage the delicate chip structure on the wafer surface, improving the cleaning effect of the device on the chips on the wafer and ensuring the smooth operation of chip production. Quality; it is worth mentioning that when the double-layer pulley 3 rotates, it simultaneously drives the two transmission pulleys 14 to rotate under the action of the two transmission belts 16. This, in turn, drives the transmission bevel gear 15 to rotate under the action of the transmission shaft 13. This causes the meshing rotating bevel gear 6 to rotate, which in turn causes the positioning shaft 7 to drive the positioning slide column 9 to rotate within the cleaning tank 2. This, in turn, causes several agitator rods 42 on the forked plate 41 to rotate continuously within the cleaning tank 2, thereby forming a multi-directional composite liquid flow. This strengthens the scouring force on the wafer surface, further breaks down the liquid boundary layer, further eliminates cleaning dead zones, and allows the fresh and clean cleaning fluid to more thoroughly clean the wafer. By contacting both sides of the wafer and the edge gaps, and in conjunction with the wafer's own rotation, impurities stripped from its surface can be quickly removed, further preventing impurities from re-adhering to the wafer surface. At the same time, under the action of the stirring rod 42, the cleaning solution is continuously applied to the surface of several chips on the wafer, actively rinsing the wafer. Thus, when performing batch cleaning of several wafers in the cleaning tank 2, the problem of cleaning dead corners caused by uneven liquid flow is solved, avoiding dead corners during wafer cleaning. This not only improves the cleaning effect but also ensures the production quality of the chips, thereby improving the effectiveness of the device.

[0019] The self-locking braking unit of this embodiment is disposed on the positioning shaft 7. The self-locking braking unit is used to realize the disassembly, assembly, and locking of the agitator on the positioning shaft 7. The self-locking braking unit includes a braking base 10 connected to the outer wall of the positioning shaft 7; a braking cylinder 34 connected to the braking base 10; a braking slider 35 passing through the braking cylinder 34, and the two slidingly engaging; a braking limit plate 36 connected to the end of the braking cylinder 34 away from the braking base 10; and a braking spring 37 sleeved on the braking cylinder 34. One end of the braking spring 37 is fixedly connected to the braking limit plate 36, and the other end is connected to the braking slider. 35 fixed connection; brake inclined block 38, installed on the side of brake slider 35 near the outer wall of positioning shaft 7; the inclined surface of brake inclined block 38 faces the agitator; part of the inclined surface of brake inclined block 38 is located in positioning groove 8, and the inclined surface is on the moving path of positioning slide column 9; a brake inclined groove 39 is provided on the side of positioning slide column 9 near brake slider 35; the brake inclined groove 39 fits with brake inclined block 38, and the inclined surfaces of the two are arranged opposite each other; a positioning spring 40 is provided in positioning groove 8; one end of positioning spring 40 is fixedly connected to the bottom surface of positioning groove 8, and the other end is located on the moving path of positioning slide column 9; Pulling the brake slider 35 outward causes it to move to its upper limit on the brake cylinder 34, putting the brake spring 37 in a buffered state. This causes the brake wedge 38 on the brake slider 35 to disengage from the brake groove 39 and the positioning shaft 7, while also moving away from the positioning shaft 7. This releases the limiting setting on the positioning slide 9, allowing the positioning spring 40, which was originally in a buffered state, to return to its original setting. This allows the agitator installed on the positioning shaft 7 to be removed, thus completing the disassembly operation. When it is necessary to install the agitator, aligning the positioning slide 9 with the positioning groove 8 and moving it causes the positioning slide 9 to move within the positioning groove 8, thereby contacting the positioning spring 38 located on the brake wedge 34. The inclined surface within the groove 8 exerts pressure on the brake block 38, causing it to move outwards and reach its upper limit on the brake cylinder 34, thus placing the brake spring 37 in a buffered state. When the agitator moves to the installation position, the brake groove 39 on the positioning slide 9 moves to the brake block 38, preventing it from contacting the outer wall of the positioning slide 9. Under the action of the buffered brake spring 37, the brake block 38 returns to its original position and moves back into the brake groove 39, thus limiting the positioning slide 9 to its current position. When it wants to disengage and move away from the positioning shaft 7, the straight surface on the brake groove 39 contacts the right-angled surface of the brake block 38 on the positioning shaft 7. The right-angle contact between the brake inclined block 38 and the brake inclined groove 39 prevents displacement of the brake inclined block 38. In other words, the brake inclined block 38 fixes the positioning slide 9 at this point, preventing it from moving away from the positioning shaft 7, thus completing the installation of the agitator. This allows the device to be positioned within the cleaning tank 2 for simultaneous cleaning of multiple wafers. The device enables convenient and quick installation and removal of the agitator, without the need for any tools. Installation can even be done with one hand, reducing the difficulty of loading and unloading the agitator and preventing situations where the lack of suitable tools prevents further operation. This improves the ease of disassembling the agitator. This improves efficiency, allowing the device to easily select different types, models, functions, sizes, and quantities of agitators (i.e., stirring rods 42) according to different cleaning and usage requirements. It also facilitates maintenance by operators, reducing the limitations of the device's use. Furthermore, changing different stirring rods 42 can produce different effects. The type and shape of the stirring rods 42 directly affect the flow field pattern of the cleaning fluid, further improving the device's performance. This also enhances the cleaning effect of several chips on the wafer, enabling precise matching of different wafer cleaning needs. It can optimize the liquid flow pattern, improve cleaning uniformity and efficiency, avoid damage to the wafer's fine structure, and reduce dead zones during cleaning. It is worth mentioning that when the agitator is installed, the positioning slide 9 moves within the positioning groove 8 and is limited in its movement. After passing the braking block 38 used for limiting, it contacts the positioning spring 40 located in the positioning groove 8, putting it in a buffer state. The resulting damping is used to control the moving speed of the agitator during installation, preventing damage caused by excessive speed, such as the agitator hitting the inner wall of the cleaning tank 2 or colliding with other components. This improves the safety of the device and ensures its service life. Furthermore, when the positioning spring 40 fails to return to its original position, the resulting elastic force acts on the positioning slide 9, thereby increasing the contact area between the braking groove 39 and the braking block 38. The contact strength and friction force are equivalent to keeping the positioning slide 9 in its current position, preventing the agitator on it from becoming unstable during use, and further improving its cleaning effect on the wafer; at the same time, due to the number of braking grooves 39, the agitator can be installed at different distances from the wafer to achieve precise control of the flow field intensity and range of action, thereby adapting to different wafer specifications and different cleaning requirements. It can also adapt to wafer cleaning operations of different sizes, avoiding problems such as insufficient cleaning or over-rinsing in some areas, improving the equipment's adaptability to multi-specification wafers, and further reducing the limitations of the device's use.

[0020] The fixed locking assembly of this embodiment is disposed on the U-shaped base 5; the fixed locking assembly is used to clamp and fix the wafer to be cleaned inside the cleaning tank 2; the fixed locking assembly includes a fixing base 11 connected to the side of the U-shaped base 5; a fixing cylinder 20 installed on the fixing base 11; a fixing slider 21 connected through to the fixing cylinder 20 near the side of the U-shaped base 5; the fixing slider 21 and the fixing cylinder 20 are in sliding engagement; a fixing limiting plate 22 is connected to... A retaining cylinder 20 is attached to the end away from the retaining base 11; a retaining spring 23 is sleeved on the retaining cylinder 20; one end of the retaining spring 23 is fixedly connected to the retaining limiting plate 22, and the other end is fixedly connected to the retaining slider 21; a retaining square tube 24 is installed on the side of the U-shaped base 5 away from the rotating shaft 4; there are several retaining square tubes 24, and the several retaining square tubes 24 are arranged at equal intervals; a retaining square column 25 is fitted inside the retaining square tube 24; the retaining square column 25... A sliding fit is made with the retaining tube 24; a compression spring 26 is disposed inside the retaining tube 24; one end of the compression spring 26 is fixedly connected to the inner bottom surface of the retaining tube 24, and the other end is fixedly connected to the retaining column 25; a retaining arc block 27 is installed at the end of the retaining column 25 away from the retaining tube 24; the inner wall of the retaining arc block 27 is provided with an embedded arc groove 28; the embedded arc groove 28 extends to the edges of the retaining arc block 27 on both sides; the outer wall of the wafer is located within the embedded arc groove 28. On the moving path of the wall; the extension plate 31 is installed on the fixed slider 21; the extension plate 31 is provided with a number of locking plates 32 on the side near the fixed square tube 24; the number and position of the locking plates 32 correspond to the fixed square tube 24; the locking slot 33 is provided through the fixed square column 25 on the side near the extension plate 31; the number of locking slots 33 are arranged at equal intervals; when the locking plate 32 passes through the fixed square tube 24, it connects with one of the locking slots 33; When the wafer to be cleaned needs to be installed in the cleaning tank 2, pull the retaining slider 21 outward to move it to the upper limit of the retaining cylinder 20, so that the retaining spring 23 is in a buffer state. Then, it drives the extension plate 31 on the retaining slider 21 to move away from the retaining square tube 24. This causes the locking plate 32 on the extension plate 31 to move away from the retaining square tube 24 and no longer connect to the locking slot 33, thereby releasing the limiting setting on the retaining square tube 25. By pulling the retaining arc block 27 outward, the retaining square tube 25 on it moves within the retaining square tube 24, causing the compression spring to... With spring 26 in a buffer state, the two retaining arc blocks 27 move in opposite directions. Then, by placing the wafer between the two retaining arc blocks 27 at the same height and releasing the force applied to the retaining arc blocks 27, the compression spring 26 is no longer under force, causing it to reset and simultaneously moving the retaining square post 25 back to its original position. This causes the retaining arc blocks 27 to move relative to each other, contacting both sides of the wafer and embedding their sidewalls into the embedding grooves 28 on the retaining arc blocks 27. This completes the initial fixation of the wafer. At this point, the wafer has been initially... The wafers are fixed between two retaining arc blocks 27. By repeating the above steps, several wafers can be gradually fixed and confined within the cleaning tank 2. By releasing the outwardly pulled retaining slider 21, the retaining spring 23 resets and moves several locking plates 32 on the extension plate 31. The locking plates 32 pass through the retaining square tube 24 and connect with one of the locking slots 33, thereby confining the retaining square post 25 to its current position. This prevents the retaining arc blocks 27 on it from moving due to non-human factors, thus avoiding the wafers installed in the cleaning tank 2 from detaching during cleaning. The device addresses the misalignment issue, improving wafer mounting efficiency. Simultaneously, several locking plates 32 are integrated onto the extension plate 31, allowing for further positioning of several fixed wafers. This enables the simultaneous mounting of multiple wafers within the cleaning tank 2, preventing wafer displacement due to non-human factors during cleaning and enhancing wafer mounting performance. Furthermore, the numerous locking slots 33 allow for the secure mounting of wafers of varying sizes within the cleaning tank 2, further improving the device's effectiveness and enhancing its wafer cleaning performance.

[0021] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0022] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An etching and cleaning apparatus for LED chip processing, comprising a stage; characterized in that: A cleaning tank is installed on the device platform; a rotary current equalization device is provided on the cleaning tank to avoid cleaning dead zones on the wafer surface during the cleaning process; the rotary current equalization device includes a double-layer pulley and is installed on the outer wall of the cleaning tank. Rotating shafts; two rotating shafts are symmetrically installed on a pair of opposing inner walls of the cleaning tank; double-layer pulleys are connected to one of the rotating shafts; U-shaped bases are installed on the end points of the rotating shaft; the two U-shaped bases are arranged with their openings facing each other. Rotating umbrella teeth are connected to the outer wall of the cleaning tank; two rotating umbrella teeth are symmetrically arranged with the center of the double-layer pulley as the axis of symmetry; a positioning shaft is connected to the opposite face of the two rotating umbrella teeth; the end of the positioning shaft away from the rotating umbrella teeth extends into the cleaning tank; A positioning chute is located at one end of the positioning shaft within the cleaning tank. A positioning slide column is fitted into a positioning slide groove; the positioning slide column and the positioning slide groove are slidably engaged; an agitator is provided on the positioning slide column. A self-locking braking unit is disposed on a positioning shaft; the self-locking braking unit is used to realize the disassembly, assembly, and locking of the agitator on the positioning shaft; the self-locking braking unit includes a braking base connected to the outer wall of the positioning shaft; A fixed locking assembly is disposed on a U-shaped base; the fixed locking assembly is used to clamp and fix the wafer to be cleaned inside the cleaning tank; the fixed locking assembly includes a fixing base connected to the side of the U-shaped base.

2. The etching and cleaning apparatus for LED chip processing according to claim 1, characterized in that: Includes a rotating base connected to the outer wall of the cleaning tank; the two rotating bases are symmetrically arranged about the center of the double-layer pulley as the axis of symmetry; A drive shaft is mounted on a rotating base; one end of the drive shaft is connected to a drive pulley, and the other end is connected to a drive bevel gear; the drive bevel gear meshes with a rotating bevel gear. Transmission belts; one end of two transmission belts is connected to a double-layer pulley; one end of two transmission belts is connected to two transmission pulleys respectively.

3. The etching and cleaning apparatus for LED chip processing according to claim 1, characterized in that: Includes a rotating slot, located on the side of the double-layer pulley away from the cleaning pool; A positioning bracket is connected to the outer wall of the cleaning tank; the positioning bracket is installed on the same side as the double-layer pulley. The drive source is installed in the fixed bracket; the output end of the drive source is fitted into the rotating slot.

4. The etching and cleaning apparatus for LED chip processing according to claim 1, characterized in that: Includes a retaining cylinder, mounted on a retaining base; The retaining slider is connected to the retaining cylinder through the side near the U-shaped base; the retaining slider and the retaining cylinder slide in fit. A retaining limit plate is connected to the end of the retaining cylinder away from the retaining base; A positioning spring is sleeved on a positioning cylinder; one end of the positioning spring is fixedly connected to a positioning limit plate, and the other end is fixedly connected to a positioning slider.

5. The etching and cleaning apparatus for LED chip processing according to claim 4, characterized in that: It includes a retaining square tube, which is installed on the side of the U-shaped base away from the rotating axis; the number of the retaining square tubes is several, and the several retaining square tubes are arranged at equal intervals; The retaining column is fitted into the retaining tube; the retaining column and the retaining tube are in sliding fit. A compression spring is installed inside the retaining square tube; One end of the compression spring is fixedly connected to the bottom surface of the inner side of the fixed square tube, and the other end is fixedly connected to the fixed square column. A retaining arc block is installed at the end of the retaining square column away from the retaining square tube; the inner wall of the retaining arc block is provided with an embedded arc groove. The embedded arc groove extends to the edges of the retaining arc block on both sides; the outer wall of the wafer is located on the moving path of the inner wall of the embedded arc groove.

6. The etching and cleaning apparatus for LED chip processing according to claim 1, characterized in that: It includes a rotating trough, which is disposed on the inner wall of the cleaning tank; the rotating trough is disposed on the same side as the U-shaped base; The rotating block is installed on the side of the U-shaped base near the rotating groove; the rotating block is fitted into the rotating groove, and the two slide together.

7. The etching and cleaning apparatus for LED chip processing according to claim 5, characterized in that: It includes an extension plate body, which is installed on the fixed slider; the extension plate body is provided with a number of locking plates on the side near the fixed square tube; the number and position of the locking plates correspond to the fixed square tube. A locking slot is installed through the fixed square post on the side near the extension plate; several locking slots are arranged at equal intervals; when the locking insert plate passes through the fixed square tube, it connects with one of the locking slots.

8. The etching and cleaning apparatus for LED chip processing according to claim 1, characterized in that: It includes a brake cylinder connected to a brake base; a brake slider is connected through the brake cylinder, and the two are in sliding engagement. Brake limiting plate, connected to the end of brake cylinder away from brake base; A brake spring is sleeved on a brake cylinder; one end of the brake spring is fixedly connected to the brake limiting plate, and the other end is fixedly connected to the brake slider. A brake ramp is installed on the side of the brake slider near the outer wall of the positioning shaft; the ramp of the brake ramp faces the agitator; part of the ramp of the brake ramp is located in the positioning groove, and the ramp is on the moving path of the positioning slide column.

9. The etching and cleaning apparatus for LED chip processing according to claim 8, characterized in that: The positioning slide is provided with a braking groove on the side near the brake slider; the braking groove fits into the brake block and the inclined surfaces of the two are opposite each other; a positioning spring is provided in the positioning groove; one end of the positioning spring is fixedly connected to the bottom surface of the positioning groove, and the other end is located at the moving path of the positioning slide.

10. The etching and cleaning apparatus for LED chip processing according to claim 1, characterized in that: The agitator includes a forked plate connected to the end of the positioning slide away from the positioning shaft; each branch of the forked plate is connected to a stirring rod.

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