Laser processing method, laser processing device, laser processing apparatus, and readable storage medium

Abstract

This application relates to a beveling method, apparatus, processing equipment, and readable storage medium. The method includes: a follow-up control mechanism moves a processing head along a processing trajectory at a desired processing position on a thick plate; collecting surface position data of the thick plate; and determining relative position change data based on the surface position data. The follow-up control adjusts the positions of the processing head in the X and Y directions to maintain target distances in the X and Y directions between the processing head and the processing surface of the thick plate. Based on the relative position change data, interpolation follow-up control adjusts the position of the processing head in the Z direction to ensure that the processing head processes the thick plate along the processing trajectory. This method, based on the follow-up control of the processing head's X and Y direction positions and its initial Z direction position, uses interpolation follow-up control to ensure that the control trend of the processing head in the Z direction is consistent with the surface undulation trend of the thick plate, ensuring that the processing trajectory accurately matches the preset processing requirements.

Description

Technical Field

[0001] This application relates to the field of laser processing, and in particular to a beveling method, apparatus, processing equipment, and readable storage medium. Background Technology

[0002] With the continuous development of laser processing technology and the increasing demand for lasers, the requirements for laser processing are becoming more and more stringent. In the process of laser planar beveling, there is often a need to bevel the side of a thick plate. When processing the side of a thick plate, the control of the laser head servo can be affected by signal fluctuations or flying debris, causing fluctuations in the control distance between the nozzle and the thick plate. This directly leads to deviations in the control of the servo in the Z direction, resulting in a processing trajectory that is inconsistent with the processing requirements. Summary of the Invention

[0003] Therefore, it is necessary to provide a beveling method, apparatus, processing equipment, and readable storage medium to address the aforementioned technical problems.

[0004] A beveling process, comprising:

[0005] The follow-up control machining head moves relative to the machining trajectory at the machining position of the machining plate, collects the plate surface position data, and determines the relative position change data based on the plate surface position data; The position of the machining head in the X and Y directions is adjusted by servo control to maintain the target distance in the X and Y directions between the machining head and the machining surface of the plate to be machined. Based on the relative position change data, the position of the machining head in the Z direction is adjusted by interpolation servo control so that the machining head processes the plate to be machined along the machining trajectory.

[0006] In one embodiment, the servo control quantity of the interpolation servo control The process of determining Z includes: Obtain the first point plate position data D1 and the last point plate position data D2 within the current unit sampling length, and determine the change in plate position within that unit sampling length. ; Let the current segment be the T-th segment of the contour, according to the formula Determine the proportion Ki of the processed path within the current cycle to the length of the current segment's endpoint trajectory, where S represents the total length of the trajectory from the start of processing to the completion of the current cycle, and S represents the trajectory length of the end point of the current segment. Determine the proportional change within a unit operating cycle Ki 1 represents the ratio value of the previous period; according to K and the change in plate position Z determine the follow-up control quantity. .

[0007] In one embodiment, when collecting the board position data, the board position of the first sampling point is near the target height.

[0008] In one embodiment, when collecting the board position data, the board position data of the first sampling point is recorded as the origin, and the board position data of the remaining sampling points are recorded as relative position change data relative to the origin.

[0009] In one embodiment, the processing start point of the processing head is located in the same plane as the first sampling point, and the plane is perpendicular to the surface of the plate to be processed, so that the interpolation follow-up control performs follow-up control in the Z direction based on the relative position change data.

[0010] In one embodiment, the plate position data includes: The discrete point set of height field on the upper surface of the thick plate to be processed, wherein each data point contains the X coordinate, Y coordinate and corresponding Z-axis height value of the point in the machine tool coordinate system; The relative position change data is a sequence of Z-axis height differences between all points in the discrete point set of the height field and the first sampling point, excluding the first sampling point.

[0011] In one embodiment, when the follow-up control adjusts the position of the processing head in the X and Y directions, it includes: The actual gap between the nozzle of the processing head and the processing surface of the thick plate to be processed is detected in real time by a capacitive displacement sensor or an inductive displacement sensor. The actual gap value is compared with the preset target gap value to determine the deviation in the X direction and the deviation in the Y direction. Based on the X-direction deviation and the Y-direction deviation, the X-axis drive motor and the Y-axis drive motor are controlled to perform micro-displacement compensation so that the actual gap value converges to the target gap value.

[0012] A beveling apparatus, comprising: The data acquisition module is used to control the machining head to move relative to the machining thick plate along the machining trajectory at the machining position of the machining thick plate, collect the plate surface position data of the machining thick plate, and determine the relative position change data based on the plate surface position data; The processing control module, connected to the data module, is used to adjust the position of the processing head in the X and Y directions through follow-up control, so that the processing head maintains the target distance in the X and Y directions from the processing surface of the plate to be processed. Based on the relative position change data, the position of the processing head in the Z direction is adjusted through interpolation follow-up control, so that the processing head processes the plate to be processed along the processing trajectory.

[0013] A processing apparatus includes a memory and a processor, wherein the memory stores a computer program, and when the computer program is executed by the processor, the processor performs the method described above.

[0014] A computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the method described above.

[0015] A computer program product that, when run on a terminal device, causes the terminal device to perform any of the methods described above.

[0016] The beneficial effects of the embodiments provided in this application include: This beveling method employs simultaneous follow-up control and interpolation follow-up control. Based on precise positioning of the machining head in the X and Y directions and its initial Z direction using follow-up control, interpolation follow-up control ensures that the control trend of the machining head in the Z direction aligns with the surface undulation trend of the thick plate to be processed. This effectively counteracts interference from signal fluctuations, fly debris, and other factors affecting the distance between the machining head and the thick plate, significantly improving the accuracy of follow-up control in the Z direction. It avoids machining trajectory deviations caused by height and distance fluctuations, ensuring precise matching of the machining trajectory with preset machining requirements, thereby improving the stability and forming quality of the beveling process on the side of the thick plate. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a flowchart illustrating a beveling method in one embodiment; Figure 2 This is a flowchart illustrating a portion of step 102 in one embodiment. Figure 3 This is a schematic block diagram of the beveling device in one embodiment; Figure 4This is a schematic block diagram of the beveling equipment in one embodiment. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0020] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0021] Figure 1 This is a flowchart illustrating a beveling method in one embodiment.

[0022] In this embodiment, as Figure 1 As shown, the beveling method includes steps 101 to 102.

[0023] Step 101: The follow-up control head moves relative to the plate to be processed along the processing trajectory at the processing position of the plate to be processed, collects the plate surface position data of the plate to be processed, and determines the relative position change data based on the plate surface position data.

[0024] When collecting the board surface position data, the board surface position of the first sampling point is near the target height.

[0025] It should be noted that the board position data collected in this scheme is recorded in relative coordinate form. That is, the board position data of the first sampling point is recorded as the origin, and the board position data of the remaining sampling points are recorded as the relative position change data relative to the origin. This relative recording method can eliminate the influence of factors such as board clamping tilt and machine tool coordinate system zero drift on the follow-up control, making this method more adaptable to the field.

[0026] In this configuration, the processing start point of the processing head and the first sampling point are located in the same plane, and this plane is perpendicular to the surface of the plate to be processed. This allows the interpolation follow-up control to perform Z-axis following control based on the relative position change data. It should be noted that setting the processing start point and the first sampling point in the same plane perpendicular to the plate surface ensures that the interpolation follow-up can accurately map the collected plate surface undulation data onto the Z-axis control of the off-plate processing. If the two are not in the same reference plane, the collected plate surface height change cannot accurately reflect the required Z-axis compensation at the processing point.

[0027] In this solution, the plate position data includes: The discrete point set of height field on the upper surface of the thick plate to be processed, wherein each data point contains the X coordinate, Y coordinate and corresponding Z-axis height value of the point in the machine tool coordinate system; The relative position change data is a sequence of Z-axis height differences between all points in the discrete point set of the height field and the first sampling point, excluding the first sampling point.

[0028] Step 102: Adjust the position of the processing head in the X and Y directions by servo control so that the processing head and the processing surface of the plate to be processed maintain the target distance in the X and Y directions. Based on the relative position change data, adjust the position of the processing head in the Z direction by interpolation servo control so that the processing head processes the plate to be processed along the processing trajectory.

[0029] like Figure 2 As shown, in this solution, when the follow-up control adjusts the position of the processing head in the X and Y directions, it includes: Step 1021: Detect the actual gap between the nozzle of the processing head and the processing surface of the plate to be processed in real time using a capacitive displacement sensor or an inductive displacement sensor. Step 1022: Compare the actual gap value with the preset target gap value to determine the deviation in the X direction and the deviation in the Y direction; Step 1023: Based on the X-direction deviation and the Y-direction deviation, control the X-axis drive motor and the Y-axis drive motor to perform micro-displacement compensation so that the actual gap value converges to the target gap value.

[0030] It is understood that in other implementations, laser displacement sensors or vision measurement systems may also be used, and these are not limited here.

[0031] It should be noted that the follow-up control adjusts the position of the processing head in the X and Y directions to maintain the target distance between the processing head and the plate to be processed in the X and Y directions, while the interpolation follow-up control adjusts the position of the processing head in the Z direction to make the control trend of the processing head in the Z direction consistent with the undulation trend of the plate surface to be processed, so as to control the target distance between the processing head and the plate to be processed in the Z direction during the processing.

[0032] In this scheme, the interpolation follow-up control calculates the follow-up control quantity ΔZ for the current cycle based on the collected relative position information of the plate surface and the proportional relationship between the total displacement of the tool tip trajectory in the current cycle and the total length S of the current sampling segment trajectory, thus completing the control of the Z-axis position in a single cycle. The follow-up control quantity of the interpolation follow-up control... The calculation process for Z includes: Obtain the first point plate position data D1 and the last point plate position data D2 within the current unit sampling length, and calculate the change in plate position within this unit sampling length. ; Let the current segment be the T-th segment of the contour, according to the formula Calculate Ki, the proportion Ki of the processed path within the current cycle to the length of the current segment's endpoint trajectory. S represents the total length of the trajectory from the start of processing to the completion of the current cycle, and S represents the trajectory length of the end point of the current segment. Calculate the change in proportion within a unit operating cycle Ki 1 represents the ratio value of the previous period; according to The follow-up control quantity is calculated based on K and the change in plate position Z. .

[0033] In this solution, the processing head can be a cutting head, a welding head, or a cladding head, etc., and is not limited to any particular type. This embodiment uses a cutting head as an example.

[0034] It should be noted that this method is particularly suitable for processing thick plates with a thickness of 20mm to 40mm. It has good adaptability to slight deformation of the plate surface (such as wavy plates) and is compatible with most processing heads on the market, making it highly versatile.

[0035] Specifically, this solution decouples the Z-axis control from the real-time sensor signal and instead adopts interpolation servo control based on pre-stored board surface data. This allows the Z-axis to stably follow the board surface undulations based on the pre-stored data, even if the sensor is blocked by splashes or the signal fluctuates instantaneously during the processing. This effectively avoids the jitter or malfunction of traditional real-time servo control under such interference.

[0036] The beveling method provided in this embodiment synchronously executes follow-up control and interpolation follow-up control. Based on the precise positioning of the processing head in the X and Y directions and the initial position in the Z direction using follow-up control, the interpolation follow-up control ensures that the control trend of the processing head in the Z direction is consistent with the undulation trend of the plate surface to be processed. This effectively counteracts the interference of signal fluctuations, flying slag, and other factors on the distance between the processing head and the plate, significantly improves the follow-up control accuracy in the Z direction, avoids processing trajectory deviations caused by height and distance fluctuations, ensures that the processing trajectory accurately matches the preset processing requirements, and thus improves the stability and forming quality of the beveling of the side of the plate.

[0037] It should be understood that although the steps in the flowchart above are shown sequentially as indicated by the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least one sub-step described above may include multiple sub-steps or multiple stages. These sub-steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these sub-steps or stages is not necessarily sequential, but can be performed alternately or in turn with other steps or at least a portion of the sub-steps or stages of other steps. It should be noted that the different embodiments described above can be combined with each other.

[0038] Figure 3 This is a schematic block diagram of the beveling device in one embodiment.

[0039] In this embodiment, as Figure 3 As shown, the beveling device includes a data acquisition module and a processing control module.

[0040] The data acquisition module is used to control the machining head to move relative to the machining thick plate along the machining trajectory at the machining position of the machining thick plate, collect the plate surface position data of the machining thick plate, and determine the relative position change data based on the plate surface position data.

[0041] The processing control module, connected to the data module, is used to adjust the position of the processing head in the X and Y directions through follow-up control, so that the processing head maintains the target distance in the X and Y directions from the processing surface of the plate to be processed. Based on the relative position change data, the position of the processing head in the Z direction is adjusted through interpolation follow-up control, so that the processing head processes the plate to be processed along the processing trajectory.

[0042] In this embodiment, each module is used to execute Figure 1 For details of each step in the corresponding embodiment, please refer to the documentation. Figure 1 as well as Figure 1 The relevant descriptions in the corresponding embodiments will not be repeated here.

[0043] The beveling device provided in this embodiment synchronously executes follow-up control and interpolation follow-up control. Based on the precise positioning of the processing head's X and Y directions and initial Z direction position using follow-up control, the interpolation follow-up control ensures that the control trend of the processing head in the Z direction is consistent with the surface undulation trend of the thick plate to be processed. This effectively counteracts the interference of signal fluctuations, flying slag, and other factors on the distance between the processing head and the thick plate, significantly improves the follow-up control accuracy in the Z direction, avoids processing trajectory deviations caused by height and distance fluctuations, ensures that the processing trajectory accurately matches the preset processing requirements, and thus improves the stability and forming quality of the beveling of the thick plate side.

[0044] The division of the various modules in the above-described beveling device is only for illustrative purposes. In other embodiments, the beveling device can be divided into different modules as needed to complete all or part of the functions of the above-described beveling device.

[0045] Specific limitations regarding the beveling apparatus can be found in the limitations of the beveling method described above, and will not be repeated here. Each module in the aforementioned beveling apparatus can be implemented entirely or partially through software, hardware, or a combination thereof. These modules can be embedded in hardware or independently of the processor in the processing equipment, or stored in software in the memory of the processing equipment, so that the processor can call and execute the operations corresponding to each module.

[0046] Figure 4 This is a schematic block diagram of the beveling equipment in one embodiment.

[0047] In this embodiment, as Figure 4 As shown, the processing equipment includes a memory A1 and a processor A2; it may also include a display screen A3, a communication interface, and a bus. Optionally, the processing equipment may be a laser processing equipment.

[0048] The memory A1, processor A2, display screen A3, and communication interface can communicate with each other via a bus; the display screen A3 is configured to display the user operation interface preset in the initial setting mode, and the display screen A3 can also display the process control window; the communication interface can transmit information; the memory A1 stores computer programs, and the processor A2 can call the logical instructions in the memory A1 to execute the methods in the above embodiments.

[0049] Furthermore, the logic instructions in the aforementioned memory A1 can be implemented as software functional units and, when sold or used as independent workpieces, can be stored in a computer-readable storage medium.

[0050] Memory A1, as a computer-readable storage medium, can be configured to store software programs, computer-executable programs, such as program instructions or modules corresponding to the methods in the embodiments of this application. Processor A2 executes functional applications and data processing by running the software programs, instructions, or modules stored in memory A1, thereby implementing the methods in the above embodiments.

[0051] Memory A1 includes a program storage area and a data storage area. The program storage area may store the operating system and application programs required for at least one function; the data storage area may store data created based on the use of the terminal device. Furthermore, memory A1 may include high-speed random access memory and may also include non-volatile memory.

[0052] Processor A2 can be a Central Processing Unit (CPU), or other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), or field-programmable gate arrays (FPGAs). Programmable Gate Array (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc.

[0053] This application also provides a computer-readable storage medium. One or more non-volatile computer-readable storage media containing computer-executable instructions, which, when executed by one or more processors, cause the processors to perform the methods described above.

[0054] This application also provides a computer program product that, when run on a terminal device, causes the terminal device to execute the methods described in the above embodiments.

[0055] The beveling method, apparatus, processing equipment, and readable storage medium provided in the above embodiments, through synchronous execution of follow-up control and interpolation follow-up control, based on the precise positioning of the processing head in the X and Y directions and the initial position in the Z direction using follow-up control, and through interpolation follow-up control, ensure that the control trend of the processing head in the Z direction is consistent with the undulation trend of the plate surface to be processed. This effectively counteracts the interference of signal fluctuations, flying slag, and other factors on the distance between the processing head and the plate, significantly improves the follow-up control accuracy in the Z direction, avoids processing trajectory deviations caused by height and distance fluctuations, ensures that the processing trajectory is precisely matched with the preset processing requirements, and thus improves the stability and forming quality of the beveling of the side of the plate.

[0056] Any references to memory, storage, databases, or other media used in this application may include non-volatile and / or volatile memory. Non-volatile memory may include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), or flash memory. Volatile memory may include random access memory (RAM), which is used as external cache memory. By way of illustration and not limitation, RAM is available in a variety of forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), dual data rate SDRAM (DDR SDRAM), enhanced SDRAM (ESDRAM), synchronous link DRAM (SLDRAM), RAMbus direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and RAMbus dynamic RAM (RDRAM).

[0057] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0058] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A beveling method, characterized in that, include: The follow-up control machining head moves relative to the machining trajectory at the machining position of the machining plate, collects the plate surface position data, and determines the relative position change data based on the plate surface position data; The position of the machining head in the X and Y directions is adjusted by servo control to maintain the target distance in the X and Y directions between the machining head and the machining surface of the plate to be machined. Based on the relative position change data, the position of the machining head in the Z direction is adjusted by interpolation servo control so that the machining head processes the plate to be machined along the machining trajectory.

2. The beveling method according to claim 1, characterized in that, The servo control quantity of the interpolation servo control The process of determining Z includes: Obtain the first point plate position data D1 and the last point plate position data D2 within the current unit sampling length, and determine the change in plate position within that unit sampling length. ; Let the current segment be the T-th segment of the contour, according to the formula Determine the proportion Ki of the processed path within the current cycle to the length of the current segment's endpoint trajectory, where S represents the total length of the trajectory from the start of processing to the completion of the current cycle, and S represents the trajectory length of the end point of the current segment. Determine the proportional change within a unit operating cycle Ki 1 represents the ratio value of the previous period; according to K and the change in plate position Z determine the follow-up control quantity. .

3. The beveling method according to claim 1, characterized in that, When collecting the board surface position data, the board surface position of the first sampling point is near the target height.

4. The beveling method according to claim 1, characterized in that, When collecting the board surface position data, the board surface position data of the first sampling point is recorded as the origin, and the board surface position data of the remaining sampling points are recorded as the relative position change data relative to the origin.

5. The beveling method according to claim 1, characterized in that, The processing start point of the processing head is located in the same plane as the first sampling point, and the plane is perpendicular to the surface of the plate to be processed, so that the interpolation follow-up control can perform follow-up control in the Z direction based on the relative position change data.

6. The beveling method according to claim 1, characterized in that, The plate position data includes: The discrete point set of height field on the upper surface of the thick plate to be processed, wherein each data point contains the X coordinate, Y coordinate and corresponding Z-axis height value of the point in the machine tool coordinate system; The relative position change data is a sequence of Z-axis height differences between all points in the discrete point set of the height field and the first sampling point, excluding the first sampling point.

7. The beveling method according to claim 1, characterized in that, When the follow-up control adjusts the position of the processing head in the X and Y directions, it includes: The actual gap between the nozzle of the processing head and the processing surface of the thick plate to be processed is detected in real time by a capacitive displacement sensor or an inductive displacement sensor. The actual gap value is compared with the preset target gap value to determine the deviation in the X direction and the deviation in the Y direction. Based on the X-direction deviation and the Y-direction deviation, the X-axis drive motor and the Y-axis drive motor are controlled to perform micro-displacement compensation so that the actual gap value converges to the target gap value.

8. A beveling device, characterized in that, include: The data acquisition module is used to control the machining head to move relative to the machining thick plate along the machining trajectory at the machining position of the machining thick plate, collect the plate surface position data of the machining thick plate, and determine the relative position change data based on the plate surface position data; The processing control module, connected to the data module, is used to adjust the position of the processing head in the X and Y directions through follow-up control, so that the processing head maintains the target distance in the X and Y directions from the processing surface of the plate to be processed. Based on the relative position change data, the position of the processing head in the Z direction is adjusted through interpolation follow-up control, so that the processing head processes the plate to be processed along the processing trajectory.

9. A processing equipment, characterized in that, The device includes a memory and a processor, wherein the memory stores a computer program that, when executed by the processor, causes the processor to perform the method as described in any one of claims 1 to 7.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by a processor, it implements the method as described in any one of claims 1 to 7.

Images