Resin molding system and resin molding method

Abstract

This invention provides a resin molding system and a resin molding method that can reduce material usage and waste. The resin molding system includes: a conveying device for conveying a soft resin sheet to a lower mold, and having a plate capable of switching between a support position and a release position, wherein the support position is a position where the movable plate supports the resin sheet below the edge of the resin sheet, and the release position is a position where the movable plate moves away from the position below the edge to allow the resin sheet to descend onto the lower mold and be transferred.

Description

Technical Field

[0001] This invention relates to a resin molding system and a resin molding method. Background Technology

[0002] In recent years, efforts to significantly reduce waste generation through waste prevention, reduction, recycling, and reuse have become increasingly active. To achieve this goal, research and development are underway on reducing material usage and cutting waste volume.

[0003] In the prior art, prior art document 1 discloses a resin sheet forming apparatus, in which the resin sheet needs to be clamped by a jig around its periphery during the heating and shaping processes. On the other hand, in existing hot pressing, vacuum forming, or pressure forming processes, such as... Figure 5 As shown, a certain area RS needs to be reserved on the resin board to fix or seal the resin board. As a result, the amount of resin board material used increases. After molding, the area RS outside the pattern D' becomes unnecessary, which will generate a lot of waste.

[0004] This case aims to solve the aforementioned problem by reducing the amount of materials used and decreasing the amount of waste generated.

[0005] [Existing technical documents]

[0006] [Patent Literature]

[0007] [Patent Document 1] Japanese Patent Publication No. 2002-59477 Summary of the Invention

[0008] The present invention provides a resin molding system and a resin molding method that can reduce material usage and reduce waste.

[0009] This invention provides a resin molding system. The resin molding system includes: a conveying device for conveying a resin sheet in a soft state to a lower mold, and having a movable plate capable of switching between a supporting position and a releasing position, wherein the supporting position is a position where the movable plate supports the resin sheet below the edge of the resin sheet, and the releasing position is a position where the movable plate moves away from the position below the edge to allow the resin sheet to descend onto the lower mold and be transferred.

[0010] In one embodiment of the invention, the movable plate described above is rotatable to switch its position between a supported position and a released position.

[0011] In one embodiment of the present invention, when the movable plate is in the supporting position, the movable plate abuts against the resin plate in parallel and one end of the movable plate abuts against the resin plate. When the movable plate is switched to the release position, the movable plate rotates downward about the other end that is not abutting against the resin plate as the axis and releases the resin plate.

[0012] In one embodiment of the present invention, the resin molding system further includes a heating adsorption device, which adsorbs the resin plate in a horizontal position above the conveying device and heats the resin plate to a soft state.

[0013] In one embodiment of the present invention, an elongated hole extending toward the center of the resin plate is formed at the center of the edge portion of the resin plate, and a protrusion inserted into the elongated hole is provided on the upper surface of the movable plate.

[0014] In one embodiment of the present invention, the above-mentioned conveying device further includes a support frame, a recess extending toward the center of the support frame is formed at the center of the edge portion of the support frame, and a positioning member that engages with the recess is provided on the lower mold.

[0015] In one embodiment of the present invention, the time point at which the heating adsorption device stops adsorption is related to the time point at which the movable plate rotates to the release position.

[0016] This invention provides a resin molding method. The resin molding method includes: a supporting step, in which a movable plate is used to support a resin plate in a soft state below an edge portion of the resin plate above a lower mold; and a releasing step, in which the resin plate is transferred by moving the movable plate from the position below the edge portion, causing the resin plate to descend onto the lower mold.

[0017] In one embodiment of the present invention, the release step described above involves rotating the movable plate downward from a horizontal position, thereby causing the resin plate to descend.

[0018] In one embodiment of the present invention, the above-described resin molding method further includes a heating and adsorption step, wherein the resin plate is adsorbed in a horizontal manner while the resin plate is heated to a soft state.

[0019] In one embodiment of the present invention, an elongated hole extending toward the center of the resin plate is formed at the center of the edge portion of the resin plate, and the resin plate is heated in the heating and adsorption step while the protrusion provided on the upper surface of the movable plate is inserted into the elongated hole.

[0020] In one embodiment of the present invention, the above-described resin molding method further includes: an elongated hole forming step, which is performed before the heating and suction step, wherein the outline of the elongated hole is printed on the resin plate and the elongated hole is formed at the printed position.

[0021] In one embodiment of the present invention, in the above-mentioned heating and adsorption step, one end of the movable plate is fixed to the support frame, and a recess extending toward the center of the support frame is formed in the center of the edge portion of the support frame. The heating and adsorption step heats the resin plate in the state where the positioning member provided on the lower mold is engaged with the recess.

[0022] In one embodiment of the present invention, the time point at which the adsorption process is stopped in the heating adsorption step is related to the time point in the release step.

[0023] Based on the above, in the embodiments of the present invention, by providing a movable plate in the conveying device, the resin molding system and resin molding method can smoothly heat the resin plate to a soft state without considering reserving an area for fixing or sealing the resin plate, and then convey the soft resin plate to the lower mold for molding. In this way, the size of the resin plate can be kept to the necessary minimum, and the amount of waste resin plate can be significantly reduced.

[0024] To make the above features and advantages of the present invention more apparent and understandable, specific embodiments are described below in conjunction with the accompanying drawings. Attached Figure Description

[0025] Figure 1A This is a schematic diagram of a resin molding system according to an embodiment of the present invention;

[0026] Figure 1B yes Figure 1A A bottom view of the conveying device of the resin molding system shown;

[0027] Figure 1C This is a schematic diagram of a resin board according to an embodiment of the present invention;

[0028] Figure 2 yes Figure 1C The resin board shown is placed on Figure 1A A schematic diagram of the resin molding system shown.

[0029] Figures 3A to 3D This is a schematic diagram of the steps of a resin molding method according to an embodiment of the present invention;

[0030] Figure 4A and Figure 4B This is a schematic diagram of a resin molded article according to an embodiment of the present invention;

[0031] Figure 5 This is a schematic diagram of a resin molded article from the prior art.

[0032] Explanation of reference numerals in the attached figures:

[0033] 1: Install the mold;

[0034] 2: Lower mold;

[0035] 2P: Positioning component;

[0036] 10: Conveying device;

[0037] 11: Supporting framework;

[0038] 12: Movable plate;

[0039] 12P: convex part;

[0040] 13: Emphasize the positioning part;

[0041] 13R: concave part;

[0042] 20: Heating and adsorption device;

[0043] 100: Resin molding system;

[0044] 200, 200': Resin molded articles;

[0045] RB: Resin board;

[0046] EG: Edge;

[0047] LH: Long hole;

[0048] SP: Support position;

[0049] RP: Release location;

[0050] R: Machining reference point;

[0051] C11, C2: Center point;

[0052] D: Pattern. Detailed Implementation

[0053] Figure 1A This is a schematic diagram of a resin molding system according to an embodiment of the present invention; Figure 1B yes Figure 1A A bottom view of the conveying device of the resin molding system shown; Figure 1C This is a schematic diagram of a resin board according to an embodiment of the present invention; Figure 2 yes Figure 1C The resin board shown is placed on Figure 1A A schematic diagram of the resin molding system shown. Figures 3A to 3D This is a schematic diagram of the steps of a resin molding method according to an embodiment of the present invention; Figure 4A and Figure 4B This is a schematic diagram of a resin molded article according to an embodiment of the present invention. The following will use... Figures 1A to 2 Explain the specific structure of the resin molding system 100 and its application. Figures 3A to 3D Explain each step of the resin molding method.

[0054] Please refer to Figures 1A to 3D In this embodiment, the resin molding system 100 includes an upper mold 1, a lower mold 2, a conveying device 10, and a heating and adsorption device 20. Specifically, as Figure 1A As shown, in this embodiment, the conveying device 10 includes a support frame 11, a movable plate 12, and a protruding positioning part 13. The support frame 11 is a rectangular frame, one end of the movable plate 12 is fixed to the inner side of the support frame 11, and the protruding positioning part 13 protrudes outward from the center of the edges of the four sides of the support frame 11. On the other hand, positioning members 2P for alignment are provided on the four sides of the lower mold 2 for matching and positioning with the protruding positioning part 13. Figure 1B As shown, the protruding positioning portion 13 of the conveying device 10 may have a recess 13R on its surface facing the positioning member 2P of the lower mold 2, so that it can be fitted with the positioning member 2P of the lower mold 2 for positioning. In addition, the recess 13R is, for example, an elongated hole extending toward the center point C11 of the support frame 11.

[0055] On the other hand, such as Figure 1C As shown, an elongated hole LH extending toward the center of the resin plate RB is formed at the center of the edge portion EG of the resin plate RB. For example, in this embodiment, the elongated hole formation step of the resin plate RB can be completed in advance; that is, before heating the resin plate RB, the outline of the elongated hole LH can be printed simultaneously with the pattern D (as designed) on the resin plate RB, and the elongated hole LH can be formed at the printed position, thus forming... Figure 1C The resin board RB is shown. Next, as... Figure 1A As shown, a protrusion 12P is provided on the upper surface of the movable plate 12, which inserts into the elongated hole LH of the resin plate RB. This protrusion 12P serves as a positioning pin for insertion into the elongated hole LH of the resin plate RB, allowing the resin plate RB to be relatively fixed to the movable plate 12 when the protrusion 12P on the upper surface of the movable plate 12 is inserted into the elongated hole LH. Thus, as... Figure 2 As shown, the resin plate RB can be held below the support frame 11 of the conveying device 10 by the movable plate 12. On the other hand, the heating adsorption device 20 is located above the conveying device 10 and is used to adsorb the resin plate RB, which is in a horizontal state, and heat the resin plate RB to a soft state when the movable plate 12 supports the resin plate RB.

[0056] In addition, such as Figures 2 to 3DAs shown, in this embodiment, the movable plate 12 can switch between a support position SP and a release position RP. The support position SP is where the movable plate 12 supports the resin plate RB below the edge portion EG, and the release position RP is where the movable plate 12 moves away from the position below the edge portion EG, allowing the resin plate RB to descend onto the lower mold 2. For example, in this embodiment, the movable plate 12 can rotate to switch between the support position SP and the release position RP. Figures 2 to 3D As shown, when the movable plate 12 is in the support position SP, it abuts against the resin plate RB in parallel, with one end of the movable plate 12 abutting against the resin plate RB. When the movable plate 12 switches to the release position RP, it rotates downward about the other end not abutting against the resin plate RB, causing the heating adsorption device 20 to stop adsorption, thereby releasing the resin plate RB. In this embodiment, the downward rotation angle of the movable plate 12 is, for example, about 90 degrees or greater. However, the present invention is not limited thereto. In another embodiment not shown, the movable plate 12 can also slide to switch its position between the support position SP and the release position RP. For example, when the movable plate 12 is in the support position SP, the movable plate 12 is parallel to the resin plate RB and one end of the movable plate 12 is in contact with the resin plate RB. When the movable plate 12 is switched to the release position RP, the movable plate 12 can slide relative to the resin plate RB to the outside of the support frame 11 until it is no longer in contact with the resin plate RB, and the heating adsorption device 20 stops adsorption, thereby releasing the resin plate RB.

[0057] Thus, as Figures 2 to 3D As shown, the conveying device 10 can be used to convey the resin board RB in a soft state to the lower mold 2.

[0058] The following will be paired Figures 3A to 3D The process of how the resin molding method is performed by the resin molding system 100 will be further explained.

[0059] The resin molding method includes a support step, a heating and adsorption step, a release step, and a molding step.

[0060] Specifically, such as Figure 3AAs shown, the resin molding system 100 can be used to perform a supporting step and a heating and adsorption step. In the supporting step, the resin molding system 100 supports the resin plate RB above the lower mold 2 at a position below the edge portion EG of the resin plate RB in a soft state via a movable plate 12. Next, in the heating and adsorption step, the resin molding system 100 adsorbs the resin plate RB in a horizontal state by means of a heating and adsorption device 20 positioned above the conveying device 10, and simultaneously heats the resin plate RB to a soft state. The heating and adsorption step involves heating the resin plate RB with the protrusion 12P provided on the upper surface of the movable plate 12 inserted into the elongated hole LH. Furthermore, although this embodiment illustrates heating the resin plate RB from above by the heating and adsorption device 20, the present invention is not limited thereto. In another embodiment not shown, during the heating and adsorption step, the resin molding system 100 may also move the heating and adsorption device 20 upward, temporarily separating the conveying device 10 from the lower mold 2, and allowing another heating device to heat the resin plate RB placed below the conveying device 10, so that all parts of the resin plate RB can be uniformly heated.

[0061] Next, as Figure 3B As shown, the resin molding system 100 can be used to perform the release step. In the release step, the resin molding system 100 transfers the resin plate RB by moving the movable plate 12 from a position below the edge portion EG, causing the resin plate RB to descend onto the lower mold 2. The release step involves rotating the movable plate 12 downward from a horizontal position, thereby lowering the resin plate RB. However, the invention is not limited thereto. In another embodiment not shown, the release step may also involve sliding the movable plate 12 relative to the resin plate RB outward from the support frame 11 until it no longer contacts the resin plate RB, thereby lowering the resin plate RB. Furthermore, in this embodiment, the time point at which the heating adsorption device 20 stops adsorption in the heating adsorption step is related to the time point at which the movable plate 12 is switched to the release position RP in the release step. Further, in this embodiment, the time point at which the heating adsorption device 20 stops adsorption and the time point at which the movable plate 12 is switched to the release position RP are simultaneous to ensure smooth release of the resin plate RB, but the invention is not limited thereto. In other embodiments, the movable plate 12 may be switched to the release position RP slightly earlier or slightly later than the time when the heating and adsorption device 20 stops adsorption. When the movable plate 12 is switched to the release position RP slightly earlier than the time when the heating and adsorption device 20 stops adsorption, the resin plate RB will descend in a relatively flat state due to its own weight. When the movable plate 12 is switched to the release position RP slightly later than the time when the heating and adsorption device 20 stops adsorption, the central portion of the resin plate RB will fall before its edge portion EG.

[0062] Furthermore, in this embodiment, the intersection point formed by the reference lines connecting the elongated holes LH on opposite sides of the edge portion EG of the resin plate RB can be used as the processing reference point R. This processing reference point R is aligned vertically with the center point C2 of the lower mold 2 and the center point C11 of the support frame 11, forming a common stationary reference point. Therefore, even if the degree of expansion or contraction of different parts of the support frame 11 or the resin plate RB varies during the heating and adsorption step, or if the degree of expansion or contraction differs due to differences in their materials, the expansion or contraction of the support frame 11 or the resin plate RB will generally be centered on this common stationary reference point. In this case, due to the design of the elongated holes LH of the resin plate RB extending towards the center of the resin plate RB, the protrusion 12P used for positioning can also move within the elongated holes LH while maintaining the resin plate RB, without hindering the expansion or contraction of the resin plate RB. Similarly, by extending the elongated hole, i.e., the recess 13R, of the protruding positioning portion 13 toward the center point C11 of the support frame 11, the positioning member 2P provided on the lower mold 2 can also move within the recess 13R without hindering the expansion or contraction of the support frame 11. In this way, when heating the resin plate with the pattern D printed on it in its pre-molding flat state, the printed pattern D can remain symmetrical with respect to a common stationary reference point. Thus, during the heating and absorption steps and the release step, by placing the resin plate RB aligned on the lower mold with the common stationary reference point as a reference, misalignment of the predetermined pattern D printed on the resin plate RB with respect to the molded shape can be suppressed, thereby maintaining good product quality.

[0063] Next, as Figure 3C As shown, after the resin molding system 100 performs the release step, when the resin plate RB is transferred to the lower mold 2, the resin molding system 100 can remove the heating adsorption device 20, and then, as... Figure 3D As shown, the resin molding system 100 can perform molding steps, allowing the upper mold 1 and the lower mold 2 to close together, forming a shape as shown. Figure 4A The resin molded article 200' shown. And, as... Figure 4B As shown, the edges of the resin molded article 200' can be further trimmed, and it can be cut along the predetermined pattern D printed on the resin plate RB, thereby removing the elongated hole LH. In this way, a shape like... Figure 4B The resin molded article 200 is shown. Furthermore, in this embodiment, since the edge portion EG of the resin plate RB only needs to reserve an area for setting the elongated hole LH, and there is no need to consider reserving an area for fixing or sealing the resin plate RB, the size of the resin plate RB can be kept to the necessary minimum, and the amount of waste material of the resin plate RB can be greatly reduced.

[0064] In summary, in the embodiments of the present invention, by providing a movable plate in the conveying device, the resin molding system and resin molding method can smoothly heat the resin plate to a soft state without considering reserving an area for fixing or sealing the resin plate, and then convey the soft resin plate to the lower mold for molding. This allows the size of the resin plate to be kept to a necessary minimum, and significantly reduces the amount of waste resin plate.

[0065] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A resin forming system characterized by comprising: include: A conveying device for conveying a resin sheet in a soft state onto a lower mold, and having a movable plate capable of switching between a support position and a release position, wherein the support position is a position in which the movable plate supports the resin sheet at a position below the edge of the resin sheet, and the release position is a position in which the movable plate moves away from the position below the edge to allow the resin sheet to descend onto the lower mold and be transferred.

2. The resin forming system according to claim 1, wherein The movable plate can rotate to switch its position between the supported position and the released position.

3. The resin molding system according to claim 1, characterized in that, When the movable plate is in the supported position, the movable plate abuts against the resin plate in parallel, and one end of the movable plate abuts against the resin plate. When the movable plate switches to the released position, the movable plate rotates downward about the other end that is not abutting against the resin plate as the axis, and releases the resin plate.

4. The resin molding system according to claim 2, characterized in that, It also includes a heating adsorption device, which adsorbs the resin plate in a horizontal position above the conveying device and heats the resin plate to a soft state.

5. The resin molding system according to claim 4, characterized in that, An elongated hole extending toward the center of the resin plate is formed at the center of the edge portion of the resin plate, and a protrusion inserted into the elongated hole is provided on the upper surface of the movable plate.

6. The resin molding system according to claim 4, characterized in that, The conveying device also has a support frame, a recess extending toward the center of the support frame is formed at the center of the edge portion of the support frame, and a positioning member that engages with the recess is provided on the lower mold.

7. The resin molding system according to claim 4, characterized in that, The time at which the heating adsorption device stops adsorption is related to the time at which the movable plate switches to the release position.

8. A resin molding method, characterized in that, include: In the support step, a movable plate is used above the lower mold to support the resin plate below the edge of the resin plate in its flexible state. as well as The release step involves moving the movable plate from below the edge, causing the resin plate to descend onto the lower mold and be transferred.

9. The resin molding method according to claim 8, characterized in that, The release step involves rotating the movable plate downwards from a horizontal position, thereby causing the resin plate to descend.

10. The resin molding method according to claim 9, characterized in that, It also includes a heating adsorption step, in which the resin board is adsorbed in a horizontal manner while the resin board is heated to a soft state.

11. The resin molding method according to claim 10, characterized in that, An elongated hole extending toward the center of the resin plate is formed at the center of the edge portion of the resin plate, and the resin plate is heated in the state where the protrusion provided on the upper surface of the movable plate is inserted into the elongated hole during the heating and adsorption step.

12. The resin molding method according to claim 11, characterized in that, Also includes: The elongated hole forming step, which is performed before the heating and aspiration step, involves printing the outline of the elongated hole on the resin plate and forming the elongated hole at the printed position.

13. The resin molding method according to claim 10, characterized in that, In the heating and adsorption step, one end of the movable plate is fixed to the support frame, and a recess extending toward the center of the support frame is formed in the center of the edge portion of the support frame. The heating and adsorption step heats the resin plate in a state where the positioning member provided on the lower mold is engaged with the recess.

14. The resin molding method according to claim 10, characterized in that, The time point at which adsorption stops in the heating adsorption step is related to the time point in the release step.

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