Spray device for thin film deposition apparatus and thin film deposition apparatus

By designing a spray plate and temperature control components in the thin film deposition equipment, the residual film in the reaction chamber can be effectively removed, solving the problems of coating thickness uniformity and equipment maintenance cycle, and improving coating quality and work efficiency.

CN122279538APending Publication Date: 2026-06-26JIANGSU MICROVIA NANO EQUIP TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
JIANGSU MICROVIA NANO EQUIP TECH CO LTD
Filing Date
2024-12-26
Publication Date
2026-06-26

AI Technical Summary

Technical Problem

In existing thin film deposition equipment, the cleaning effect of the purging gas is limited, resulting in the incomplete removal of residues, which affects the uniformity of the coating thickness and the equipment maintenance cycle, and reduces work efficiency.

Method used

Design a spraying device including a spray plate and a temperature regulation component. The spray plate is provided with spray holes and air extraction holes. By coordinating air pressure changes and temperature regulation, the dust film is promoted to peel off and be discharged. The distance between the spray holes and the substrate is smaller than the distance between the air extraction holes and the substrate to avoid affecting the uniformity of process gas flow.

Benefits of technology

It effectively removes residual film in the reaction chamber, improves coating quality, extends equipment maintenance cycle, and increases work efficiency.

✦ Generated by Eureka AI based on patent content.

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    Figure CN122279538A_ABST
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Abstract

This application relates to the field of semiconductor fabrication technology, and discloses a spraying device for a thin film deposition equipment, including a spray plate and a temperature regulating component. The spray plate has multiple spray holes connected to an air inlet channel and multiple exhaust holes connected to an exhaust channel; wherein the distance between the spray holes and the substrate is smaller than the distance between the exhaust holes and the substrate; the temperature regulating component is disposed on the spray plate to heat or cool the spray plate; wherein blowing or evacuating air into the reaction chamber through the spray plate causes a change in the internal air pressure of the reaction chamber, and the temperature regulating component changes the temperature of the spray plate, forcing the dust film to peel off the spray plate, and the peeled dust film is discharged through the exhaust holes. This effectively removes residual film in the reaction chamber, reducing the impact on the coating quality. Simultaneously, it extends the maintenance cycle of the equipment and improves work efficiency. This application also discloses a thin film deposition equipment.
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