Microwave micro-system thermal, force and fluid measurement system under complex service environment

Abstract

This disclosure provides a thermal, mechanical, and fluid measurement system and testing method for microwave microsystems under complex service environments. The system includes: an environmental simulation subsystem, comprising an internal thermal excitation module and an external environmental simulation module. The internal thermal excitation module generates and outputs target thermal power to simulate the operating heat generation of a power-consuming chip in the microwave microsystem under test. The external environmental simulation module controls the external boundary conditions applied to the microwave microsystem under test, including at least two of thermal conduction boundary conditions, thermal convection boundary conditions, thermal radiation boundary conditions, and random vibrational dynamic loads. A comprehensive measurement subsystem is used to obtain temperature field information, stress-strain information, and liquid cooling fluid parameters of the microwave microsystem under test in the state of coordinated operation of the internal thermal excitation module and the external environmental simulation module. The environmental simulation subsystem and the comprehensive measurement subsystem are integrated in a test platform, and the microwave microsystem under test is placed in the test platform for testing.

Description

Technical Field

[0001] This disclosure relates to the field of microwave microsystem testing technology, specifically to a microwave microsystem thermal, mechanical, and fluid measurement system and testing method for microwave microsystems under complex service environments. Background Technology

[0002] Microwave microsystems, especially those used in high-power scenarios such as phased array radar, rely heavily on thermal, mechanical, and fluid management under complex service environments for performance and reliability. However, existing testing technologies and devices have significant limitations in simulating their actual operating conditions and conducting comprehensive evaluations.

[0003] First, regarding environmental simulation, current thermal and mechanical testing devices for microwave microsystems cannot simulate real-world service environments and cannot simultaneously control random vibration, heat conduction, heat convection, and heat radiation conditions. Second, in terms of measurement methods, current circuit thermal testing devices mainly employ single measurement methods, such as infrared thermal imagers (detecting temperature distribution on the circuit surface), thermal test chips (used only for chip heating and temperature measurement), and thermocouples (single-point temperature measurement), making it difficult to comprehensively and accurately obtain key system state parameters. Regarding the integrity of the testing system, most current circuit tests do not consider heat loss, resulting in inaccurate temperature measurements. Furthermore, they do not consider the impact of high-frequency, high-power electromagnetic waves on surrounding electronic devices and the human body. In addition, current circuit testing platforms do not integrate microfluidic monitoring functions and are unsuitable for microsystems with built-in microchannels. Summary of the Invention

[0004] (a) Technical problems to be solved

[0005] In view of the above problems, this disclosure provides a microwave microsystem thermal, mechanical and fluid measurement system and testing method under complex service environment, so as to at least partially solve the technical problems existing in the prior art, such as the inability to truly simulate complex multi-physics coupled service environment, the single and incomplete measurement methods, the lack of effective thermal and electromagnetic shielding, and the lack of integrated monitoring capabilities for liquid cooling systems.

[0006] (II) Technical Solution

[0007] This disclosure provides a thermal, mechanical, and fluid measurement system for a microwave microsystem under complex service environments, comprising: an environmental simulation subsystem, including an internal thermal excitation module and an external environmental simulation module. The internal thermal excitation module generates and outputs a target thermal power to simulate the operating heat generation of a power-consuming chip in the microwave microsystem under test. The external environmental simulation module regulates the external boundary conditions applied to the microwave microsystem under test, including at least two of thermal conduction boundary conditions, thermal convection boundary conditions, thermal radiation boundary conditions, and random vibrational dynamic loads; and a comprehensive measurement subsystem, used to obtain temperature field information, stress-strain information, and liquid-cooled fluid parameters of the microwave microsystem under test in a state of coordinated operation of the internal thermal excitation module and the external environmental simulation module. The environmental simulation subsystem and the comprehensive measurement subsystem are integrated into a test platform, and the microwave microsystem under test is placed within the test platform for testing.

[0008] According to embodiments of this disclosure, the external environment simulation module includes: a heat conduction simulation submodule, including a heat conduction temperature control plate disposed below the microwave microsystem under test, for simulating and regulating the heat conduction boundary conditions at the bottom of the microwave microsystem under test; a heat convection simulation submodule, including a convection heat exchanger disposed above the microwave microsystem under test, for simulating and regulating the heat convection boundary conditions flowing through the surface of the microwave microsystem under test; a heat radiation simulation submodule, including a heat radiation heat panel disposed around the microwave microsystem under test, for simulating and regulating the heat radiation boundary conditions at which the microwave microsystem under test is located; and a random vibration simulation submodule, including a random vibration table disposed below the microwave microsystem under test, for applying a random vibration load with a preset power spectral density to the microwave microsystem under test.

[0009] According to embodiments of this disclosure, the integrated measurement subsystem includes: a temperature measurement module for obtaining multi-dimensional temperature field information, the temperature measurement module including an infrared thermal imager for measuring the surface temperature distribution of the microwave microsystem under test, a thermal test chip for measuring the junction temperature of the internal thermal excitation module, and at least two of thermocouples or thermistors for measuring the local temperature of the substrate of the microwave microsystem under test; a stress-strain measurement module for obtaining stress-strain information of the microwave microsystem under test, the stress-strain measurement module including a stress sensor for measuring the strain of the internal thermal excitation module, and / or a strain gauge plated on the substrate of the microwave microsystem under test; and a fluid measurement module for obtaining the liquid cooling fluid parameters of the coolant when the microwave microsystem under test has its own liquid cooling channel, the fluid measurement module including a thermometer for measuring the inlet and outlet temperatures of the coolant, a pressure gauge for measuring the inlet and outlet pressures, and a flow meter for measuring the flow rate.

[0010] According to embodiments of this disclosure, it further includes: a fluid operation subsystem connected to the liquid-cooled flow channel of the microwave microsystem under test via a pipeline, for supplying and circulating coolant to the liquid-cooled flow channel, and for regulating the inlet temperature and flow rate of the coolant; the fluid operation subsystem includes a storage tank, a circulation pump for driving the circulation of the coolant, and a condenser for cooling the returning coolant.

[0011] According to embodiments of this disclosure, it further includes: a structural support box, and the devices of the environmental simulation subsystem and the integrated measurement subsystem are arranged inside the structural support box.

[0012] According to embodiments of this disclosure, it further includes: a heat insulation layer disposed on the inner wall of the structural support box, used to reduce heat exchange between the inside of the microwave microsystem under test and the external environment; and an electromagnetic shielding layer coated on the heat insulation layer, used to shield the electromagnetic radiation generated by the microwave microsystem under test during operation.

[0013] According to embodiments of this disclosure, it further includes: an antireflective coating and quartz glass, coated on an electromagnetic shielding layer, used to reduce the impact of hot airflow disturbance on the accuracy of infrared thermal imaging while ensuring electromagnetic shielding.

[0014] According to an embodiment of this disclosure, the internal thermal excitation module is a thermal test chip, which is connected to a data acquisition instrument via external leads and is used to replace the actual power consumption chip in the microwave microsystem under test; the thermocouple or thermistor in the temperature measurement module and the strain gauge in the stress and strain measurement module are respectively connected to the data acquisition instrument; the data acquisition instrument is used to record and process electrical signals from the thermal test chip, the thermocouple or thermistor and the strain gauge.

[0015] Another aspect of this disclosure provides a method for testing a microwave microsystem under test using a measurement system, comprising: installing the microwave microsystem under test within the test platform of the measurement system, and connecting a temperature measurement module and a stress-strain measurement module according to the test target; in the case where the microwave microsystem under test has a built-in liquid cooling channel, connecting the liquid cooling channel to the fluid measurement module of the measurement system, and adjusting the liquid cooling fluid parameters of the coolant in the liquid cooling channel to a preset operating condition through a fluid operation subsystem; setting and activating at least two of the following boundary conditions: thermal conduction boundary conditions, thermal convection boundary conditions, thermal radiation boundary conditions, and random vibration dynamic loads, through an external environment simulation module; activating an internal thermal excitation module to simulate the heating of an actual power consumption chip, and simultaneously acquiring the temperature field information, stress-strain information, and liquid cooling fluid parameters of the microwave microsystem under test through a comprehensive measurement subsystem.

[0016] According to embodiments of this disclosure, a comprehensive measurement subsystem synchronously acquires temperature field information, stress-strain information, and liquid cooling fluid parameters of the microwave microsystem under test. This includes: obtaining a temperature distribution cloud map of the surface of the microwave microsystem under test using an infrared thermal imager; obtaining junction temperature data of a thermal test chip located in an internal thermal excitation module; obtaining substrate temperature data at at least one location using thermocouples or thermistors arranged on the substrate of the microwave microsystem under test; the temperature field information includes a temperature distribution cloud map, junction temperature data, and substrate temperature data; acquiring chip-level and / or substrate-level stress-strain information using stress sensors arranged in the internal thermal excitation module and / or strain gauges arranged on the substrate; and, in the case where the microwave microsystem under test has its own liquid cooling channel, acquiring liquid cooling fluid parameters of the coolant using a flow meter, pressure gauge, and thermometer in a fluid measurement module.

[0017] (III) Beneficial Effects

[0018] The microwave microsystem thermal, mechanical, and fluid measurement system and testing method disclosed herein, operating under complex service environments, can simulate the state of microwave microsystems in complex environments, such as automotive and aerospace applications, through an external environment simulation module. Multi-directional temperature measurement of the microsystem using an infrared thermal imager, thermal testing chip, thermocouples, or thermistors provides comprehensive temperature information, simultaneously yielding the chip's internal temperature, the microsystem's surface temperature, and temperature distribution cloud maps. Strain gauges measure the stress and strain of the microsystem, enabling real-time analysis of its thermal expansion under complex thermal conditions. An insulation layer reduces heat loss during measurement, allowing for adjustable chamber temperatures from -10°C to 80°C, resulting in more accurate environmental simulation. An electromagnetic shielding layer isolates electromagnetic radiation from surrounding devices and the human body, achieving an electromagnetic shielding effectiveness of over 100 dB at medium and high frequencies, ensuring experimental safety. A fluid flow subsystem supplies coolant to the microsystem and can detect coolant flow resistance, temperature difference, and other information. Attached Figure Description

[0019] To gain a more complete understanding of this disclosure and its advantages, reference will now be made to the following description taken in conjunction with the accompanying drawings, wherein:

[0020] Figure 1 The schematic diagram illustrates a cross-sectional structure, top view, and bottom view of a microwave microsystem thermal, mechanical, and fluid measurement system under complex service environments provided in embodiments of this disclosure.

[0021] Figure 2 The schematic diagram illustrates a power supply for a measurement system provided in an embodiment of this disclosure;

[0022] Figure 3This schematically illustrates a flowchart of a measurement system used to test a microwave microsystem under test, as provided in an embodiment of this disclosure.

[0023] Figure 4 This schematic diagram illustrates the location markings of temperature measurement points provided in an embodiment of this disclosure;

[0024] Figure 5 The diagram illustrates a temperature rise profile of a microwave microsystem measured without using the measurement system provided in the embodiments of this disclosure.

[0025] Figure 6 The diagram illustrates a temperature rise curve of a microwave microsystem measured using the measurement system provided in the embodiments of this disclosure. Detailed Implementation

[0026] The embodiments of the present disclosure will now be described with reference to the accompanying drawings. However, it should be understood that these descriptions are exemplary only and are not intended to limit the scope of the disclosure. In the following detailed description, numerous specific details are set forth to provide a thorough understanding of the embodiments of the present disclosure for ease of explanation. However, it will be apparent that one or more embodiments may be practiced without these specific details. Furthermore, descriptions of well-known structures and techniques are omitted in the following description to avoid unnecessarily obscuring the concepts of the present disclosure.

[0027] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit this disclosure. The terms “comprising,” “including,” etc., as used herein indicate the presence of features, steps, operations, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, or components.

[0028] All terms used herein (including technical and scientific terms) have the meanings commonly understood by those skilled in the art, unless otherwise defined. It should be noted that the terms used herein are to be interpreted in a manner consistent with the context of this specification, and not in an idealized or overly rigid way.

[0029] The accompanying drawings show some block diagrams and / or flowcharts. It should be understood that some blocks or combinations thereof in the block diagrams and / or flowcharts can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, so that when executed by the processor, these instructions can create means for implementing the functions / operations described in these block diagrams and / or flowcharts.

[0030] Microwave microsystems differ from other common circuits in several key aspects: First, microwave circuits generate significant heat, with high-frequency microwave circuits accounting for 80% to 90% or more of their rated power. Generally, the higher the frequency, the greater the proportion of heat dissipation in the total input power. In certain fields, such as phased array radar, higher requirements are placed on the electromagnetic wave output power of microwave microsystems to meet long-range reconnaissance needs, leading to severe thermal stability pressures. Excessive temperatures can cause thermal stress deformation in the internal microstructures of microwave microsystems. When the thermal expansion stress exceeds the constraint stress, it will lead to thermal mismatch in the internal components or microstructures, resulting in device failure. Therefore, monitoring the thermal and mechanical stability of microwave microsystems is crucial. Second, microwave microsystems pose a risk of electromagnetic wave leakage, especially those with built-in antennas. During operation, they can severely interfere with other surrounding electronic equipment, and at high microwave energy levels, surrounding communication systems may completely fail. Electromagnetic waves can also cause direct harm to the human body. High-frequency electromagnetic waves can directly burn the skin, and when the frequency is between 1-3 Hz, the electromagnetic waves may even penetrate deep into the body, causing more severe burns. Furthermore, the non-thermal effects of high-frequency, high-power electromagnetic waves on the human nervous and reproductive systems are increasingly being recognized. Long-term exposure to high-power, high-frequency electromagnetic radiation may pose a potential threat to human health. Therefore, electromagnetic shielding needs to be considered during measurement. Secondly, some microwave microsystems operate in complex environments, such as as front-ends of phased arrays, mounted on certain motor vehicles or aerospace platforms. Mechanically, whether based on vehicle or aerospace platforms, microwave microsystem components are subject to continuous mechanical effects from random vibrations. Thermally, in addition to their own heat generation, the operating environment temperature on some aerospace platforms is extremely complex and variable. On vehicle or aerospace platforms, heat conduction and convection are the main heat dissipation methods for microwave microsystems. However, on aerospace platforms, due to the lack of an atmospheric environment, heat convection is impossible, making heat conduction and radiation the primary heat dissipation methods. Therefore, it is necessary to consider the complex thermal and mechanical service environment, meet the requirements of random vibration load application, and control the heat conduction, heat convection, and heat transfer environment. Furthermore, some novel high-power microwave microsystems often embed microchannels within the system to assist in heat dissipation of the high-power chip through liquid cooling. Information such as the temperature difference between the fluid inlet and outlet and the flow resistance also significantly impacts the stable operation of the microwave microsystem. Therefore, in addition to conventional thermal and mechanical performance measurements, fluid information measurement is also required to ensure accuracy.

[0031] Currently, testing devices for the thermal, mechanical, and fluid properties of microwave microsystems still face two significant limitations. Firstly, there is a gap in environmental simulation capabilities: there is no integrated testing device capable of simultaneously and independently controlling multiple physical field service environments such as random vibration, heat conduction, heat convection, and heat radiation, making it impossible to realistically reproduce the actual operating conditions of microwave microsystems under complex conditions such as automotive, airborne, and aerospace applications. Secondly, there are deficiencies in measurement methods and their comprehensiveness. Current circuit thermal testing largely relies on single measurement methods, each with its limitations: for example, while infrared thermal imagers can acquire temperature distribution cloud maps of circuit surfaces, they cannot detect the core temperature (junction temperature) of the power chip inside the microwave microsystem; thermocouples can perform localized fixed-point temperature monitoring and record temporal changes, but because they cannot be implanted inside the chip, they can only measure the temperature of the chip casing or substrate; while thermal testing chips can simulate the heating of real chips and integrate temperature measurement and even stress sensing functions, directly monitoring the junction temperature, they struggle to simultaneously acquire the chip casing temperature and the temperature distribution of the system substrate. However, to comprehensively evaluate the overall heat dissipation capability and thermal stability of microwave microsystems, it is essential to simultaneously obtain multi-dimensional information such as chip junction temperature, case temperature, substrate temperature distribution, and microfluidic temperature, in order to accurately calculate key parameters such as junction-case thermal resistance. Clearly, a single temperature testing method cannot meet this comprehensive evaluation requirement. Therefore, a solution that integrates multiple measurement methods and achieves simultaneous and accurate acquisition of multiple parameters is urgently needed.

[0032] In view of this, embodiments of this disclosure provide a microwave microsystem thermal, mechanical, and fluid measurement system for complex service environments. This system includes an environmental simulation subsystem and a comprehensive measurement subsystem, both integrated within a test platform. The microwave microsystem under test is placed within this test platform to undergo controlled service environment simulation and comprehensive parameter measurements.

[0033] The environmental simulation subsystem constitutes a device for actively creating and precisely controlling the working environment of the microwave microsystem under test, including an internal thermal excitation module and an external environmental simulation module.

[0034] The internal thermal excitation module, serving as the system's internal heat source, has the core function of actively generating and outputting controllable and quantifiable target thermal power. This module simulates the operating heat generation of the high-power chips in the microwave microsystem under test by replacing or simulating them, thus accurately reproducing the core internal heating state during operation and providing a stable and traceable internal thermal load for the entire test.

[0035] The external environment simulation module is responsible for constructing and manipulating the external physical field boundary conditions of the microwave microsystem under test. This module can independently or collaboratively control various external boundary conditions applied to the microwave microsystem, including but not limited to: thermal conduction boundary conditions (simulating heat exchange with the mounting substrate or heat sink), thermal convection boundary conditions (simulating forced or natural convection with surrounding fluids), thermal radiation boundary conditions (simulating radiative heat exchange with adjacent high-temperature or low-temperature surfaces), and random vibration loads (simulating vibration environment caused by carrier motion or external excitation). This disclosure, by simultaneously and independently controlling four boundary conditions—thermal conduction, thermal convection, thermal radiation, and random vibration—and working in conjunction with a multi-dimensional measurement system, can highly reproduce complex and variable real-world service scenarios such as vehicle-mounted, airborne, and even aerospace applications, achieving realistic simulation of microwave microsystems under complex service environments.

[0036] The integrated measurement subsystem and the environmental simulation subsystem work together to synchronously and multidimensionally acquire key state parameters of the microwave microsystem under test, namely temperature field information, stress-strain information, and liquid cooling fluid parameters, under simulated real-world conditions involving internal thermal excitation and external boundary conditions. The temperature field information can include not only surface temperature distribution but also multi-level, multi-point temperature data from the chip junction temperature to the casing and system substrate. Stress-strain information is obtained by monitoring the stress and strain induced within the chip package and system substrate by thermal mismatch and external mechanical loads (such as vibration). Liquid cooling fluid parameters, for microwave microsystems employing liquid cooling, involve real-time monitoring of key operating parameters of the cooling circuit, such as flow rate, pressure (flow resistance), and inlet / outlet temperature difference.

[0037] It is understood that the thermal, mechanical, and fluid measurement system provided in this disclosure constitutes a highly integrated testing platform. The core of this platform lies in the collaborative design of environmental simulation and multi-physics field measurement: on the one hand, the environmental simulation subsystem actively and independently regulates various environmental physical fields (thermal and mechanical), enabling accurate simulation of the working state of microwave microsystems in real, complex service environments; on the other hand, the comprehensive measurement subsystem utilizes multiple sensing methods to simultaneously acquire temperature field information, stress-strain information, and liquid-cooled fluid parameters within and on the surface of the microwave microsystem, thereby achieving comprehensive and accurate measurement of key thermal, mechanical, and fluid parameters.

[0038] Based on the above embodiments, in this embodiment, the internal thermal excitation module is a thermal test chip, which is connected to the data acquisition instrument through external leads and is used to replace the actual power consumption chip in the microwave microsystem under test.

[0039] In some exemplary embodiments, the internal thermal excitation module may consist of one or more programmable thermal test chips (TTCs). In specific implementations, this thermal test chip can be used to directly replace the actual power consumption chip in the microwave microsystem under test. It can be connected to an external data acquisition instrument or system controller via dedicated external pins or flexible circuitry (external leads), thereby forming a controllable thermal excitation and signal feedback loop. The thermal test chip can programmably control its thermal power through external circuitry, achieving a temperature control accuracy of ±0.5%.

[0040] The TTC chip can receive commands and power inputs from a data acquisition instrument or external power supply, and quantitatively and controllably simulate the heat dissipation behavior of a real-world chip under operating conditions. Through preset programs or real-time adjustments, its output thermal power (target thermal power) can be precisely controlled to match the power consumption level of the real chip under different operating conditions. Therefore, this TTC chip can not only serve as a simple heat source, but also as a programmable, traceable internal thermal load generator, thus providing stable and repeatable core thermal excitation conditions for the entire test system.

[0041] It should be noted that the thermal test chip integrates both a heating zone and a temperature measurement zone, enabling it to simulate chip heating and measure temperature in real time, thus obtaining relatively accurate junction temperature data. Specifically, the junction temperature data of the chip's heating zone can be obtained through the temperature measurement zone of the thermal test chip located in the internal thermal excitation module. Based on the above embodiment, in this embodiment, the external environment simulation module includes: a thermal conduction simulation submodule, including a thermal conduction temperature control plate located below the microwave microsystem under test, used to simulate and control the thermal conduction boundary conditions at the bottom of the microwave microsystem under test; a thermal convection simulation submodule, including a convection heat exchanger located above the microwave microsystem under test, used to simulate and control the thermal convection boundary conditions flowing through the surface of the microwave microsystem under test; a thermal radiation simulation submodule, including a thermal radiation heat plate located around the microwave microsystem under test, used to simulate and control the thermal radiation boundary conditions of the microwave microsystem under test; and a random vibration simulation submodule, including a random vibration table located below the microwave microsystem under test, used to apply a random vibration load with a preset power spectral density to the microwave microsystem under test.

[0042] In some exemplary embodiments, the external environment simulation module can construct a complex service environment through multiple functionally independent but collaboratively controlled sub-modules.

[0043] Figure 1 The illustration shows a cross-sectional structural diagram, as well as a top view and a bottom view, of a microwave microsystem thermal, mechanical, and fluid measurement system provided in an embodiment of the present disclosure under complex service environments.

[0044] The core component of the heat conduction simulation submodule is a heat conduction temperature control board (or temperature control platform). For example... Figure 1 As shown in the cross-sectional diagram, it can be positioned below the microwave microsystem under test, forming a tight thermal interface with the bottom of the microwave microsystem (i.e., the mounting substrate or housing). The microwave microsystem under test and the thermally conductive temperature control board can be directly overlapped, or thermal grease can be applied and a thermal pad added at the interface; the specific configuration can be determined according to actual needs. This temperature control board possesses precise temperature rise, fall, and constant temperature control capabilities. Its set temperature can be used to simulate and actively regulate the thermal conduction boundary conditions at the bottom of the microwave microsystem, such as simulating conduction heat dissipation or heating conditions with the carrier platform (heat sink), thereby controlling the inflow or outflow of heat through this path.

[0045] In other embodiments, the heat conduction temperature control plate can be replaced with a water-cooled plate whose temperature is controlled by liquid cooling.

[0046] The core component of the thermal convection simulation submodule is a convection heat exchanger (which can be understood as a miniaturized, airflow-controlled environmental simulation device). For example... Figure 1 As shown, it can be positioned above or to the side of the microwave microsystem under test at a specific location. This heat exchanger can generate airflow with controllable temperature, velocity, and direction, and guide it through the surface of the microwave microsystem and the surrounding space, thereby simulating and actively controlling the thermal convection boundary conditions (such as forced convection) flowing through the surface of the microwave microsystem to simulate actual convection heat transfer scenarios such as fan cooling inside the equipment cabin and airflow cooling outside the aircraft.

[0047] For example, the heating power of the convection heat exchanger is 6kW, the cooling power is 5.6kW, and the convection air volume is 2000m3 / h.

[0048] The core component of the thermal radiation simulation submodule is one or more thermal radiation panels (e.g., flat plates with a heating film on their surface or radiators of a specific shape, i.e., "heating sleeves") arranged around the microwave microsystem under test. Figure 1 As shown in the top view, these panels can be arranged around the microwave microsystem. By controlling the surface temperature of the radiating panels, the thermal radiation boundary conditions of the microwave microsystem can be simulated and actively controlled, that is, the radiative heat transfer environment between the microwave microsystem and the surrounding high- or low-temperature chamber walls, equipment shells, etc.

[0049] For example, the surface material of the thermal radiation panel is zirconium ceramic micropowder, with an infrared emissivity greater than 0.93 across the entire 1~22μm wavelength band. The panel has a heat flux density of 40W / cm², a maximum temperature of 150℃, and a power of 2kW (single panel). Individual temperature control can be achieved via PID control.

[0050] The core component of the random vibration simulation submodule is a random vibration table. For example... Figure 1The cross-sectional and bottom views show that it can be integrated below the heat conduction temperature control plate (or removed separately) or used as an overall support platform. This vibration table can apply random vibration loads simulating real-world operating conditions to the entire microwave microsystem under test mounted on it, based on preset parameters such as power spectral density (PSD), to reproduce the broadband random vibration environment generated by vehicles, aircraft, or spacecraft during operation.

[0051] It is understandable that, through the independent control and coordinated operation of the aforementioned heat conduction simulation submodule, heat convection simulation submodule, heat radiation simulation submodule, and random vibration simulation submodule, the external environment simulation module of this embodiment achieves the maximum simulation of complex thermo-mechanical coupling service environments. It can precisely control the heat conduction (simulating the bottom heat sink via a temperature control plate), heat convection (simulating the airflow environment via a micro heat exchanger), heat radiation (simulating the surrounding thermal environment via a radiation panel), and random vibration (simulating the mechanical environment via a vibration table) processes of the microwave microsystem, thereby providing the test device with a testing environment that closely approximates the complex and variable operating conditions of real automotive, aviation, or aerospace applications, solving the problem of the limited environmental simulation capabilities of existing devices.

[0052] Based on the above embodiments, in this embodiment, the integrated measurement subsystem includes: a temperature measurement module for obtaining multi-dimensional temperature field information, comprising an infrared thermal imager for measuring the surface temperature distribution of the microwave microsystem under test, a thermal test chip for measuring the junction temperature of the internal thermal excitation module, and at least two of thermocouples or thermistors for measuring the local temperature of the substrate of the microwave microsystem under test; a stress-strain measurement module for obtaining stress-strain information of the microwave microsystem under test, comprising a stress sensor for measuring the strain of the internal thermal excitation module, and / or a strain gauge plated on the substrate of the microwave microsystem under test; and a fluid measurement module for obtaining the liquid cooling fluid parameters of the coolant when the microwave microsystem under test has its own liquid cooling channel, comprising a thermometer for measuring the inlet and outlet temperatures of the coolant, a pressure gauge for measuring the inlet and outlet pressures, and a flow meter for measuring the flow rate.

[0053] The integrated measurement subsystem is configured to collect response data of the tested object in a complex environment synchronously and from multiple dimensions through multiple specialized measurement modules.

[0054] The temperature measurement module can acquire full-dimensional temperature field information of the microwave microsystem under test, from the chip junction temperature to the system surface. Specifically, this module integrates at least two complementary temperature measurement methods: non-contact surface temperature measurement, i.e., using an infrared thermal imager, such as... Figure 1As shown, it can be installed behind the observation window on the upper layer of the test chamber, enabling non-contact, real-time acquisition of the temperature distribution cloud map of the entire surface of the microwave microsystem under test, intuitively reflecting surface hot spots and temperature gradients. Direct chip junction temperature measurement involves integrating high-precision thermal test chips (such as diodes, thermistors, and temperature-measuring TTC chips) within the internal thermal excitation module (such as a TTC chip). This sensing unit is connected to a data acquisition instrument via external leads, enabling direct, in-situ measurement of the core junction temperature of the simulated chip during operation, serving as a key parameter for evaluating chip thermal reliability. Localized point temperature contact measurement involves depositing one or more contact thermal test chips, such as thermocouples or thermistors, onto the package housing, substrate, or other critical locations of the microwave microsystem under test. These sensors can be used to accurately measure local temperatures at specified locations, such as chip case temperature or substrate temperature in specific functional areas, to obtain information on the internal heat flow path. By combining at least two of the above methods, this module achieves three-dimensional temperature measurement from "point" (junction temperature, specified point temperature) to "surface" (surface temperature field), making the measurement more comprehensive and accurate, thus providing a complete data foundation for calculating key thermal parameters such as junction-shell thermal resistance.

[0055] The stress-strain measurement module is used to monitor and acquire structural deformation information caused by thermal mismatch and external mechanical loads. This can be achieved through two main methods: chip-level strain monitoring, where miniature stress / strain sensing units (i.e., stress sensors, such as strain-measuring TTC chips) are integrated or attached inside or to the surface of the internal thermal excitation module (TTC chip) package. This unit can sensitively detect micro-strains generated by temperature changes or external vibrations within the chip package itself, directly reflecting the thermal and mechanical stress state at the chip location. Substrate-level strain monitoring involves depositing one or more resistance strain gauges at critical locations (such as around the chip or near fixing points) on the printed circuit board (PCB) substrate or other structural components of the microwave microsystem under test. This allows for the measurement of strain distribution on the substrate under different loads, thereby assessing the structural reliability of the substrate and the stress conditions at solder joints. This module achieves comprehensive monitoring of the stress-strain state at critical locations within the microwave microsystem through the simultaneous acquisition of chip-level and substrate-level strain information.

[0056] When the microwave microsystem under test is designed for liquid cooling and has its own microchannels (i.e., liquid cooling channels), the fluid measurement module is activated to monitor the operating efficiency of its cooling system online. (Reference) Figure 1The diagram illustrates the piping connections. This module may include: a flow monitoring unit, which connects a high-precision flow meter in series on the coolant circulation pipe to measure the volumetric flow rate of the coolant flowing through the liquid-cooled channel of the microwave microsystem in real time; a pressure monitoring unit, which connects pressure gauges (pressure gauge 1 and pressure gauge 2 as shown in the diagram) to the inlet and outlet pipes of the liquid-cooled channel of the microwave microsystem to simultaneously measure the inlet and outlet pressures of the coolant. The pressure difference between the two is the flow resistance through the liquid-cooled channel of the microwave microsystem, a key indicator for evaluating the quality of the channel design and whether it is blocked; and a temperature monitoring unit, which connects fluid thermometers (fluid thermometer 1 and thermometer 2 as shown in the diagram) to the inlet and outlet pipes to accurately measure the inlet and outlet temperatures of the coolant. By combining the measured flow rate, coolant density, specific heat capacity, and other physical properties, the real-time heat dissipation power dissipated by the microwave microsystem through liquid cooling can be accurately calculated.

[0057] Understandably, through the collaborative work of the three specialized modules, the integrated measurement subsystem has achieved multi-path temperature measurement, overcoming the limitations of a single measurement method, and providing data support for a comprehensive and accurate evaluation of the thermal management performance, structural reliability, and fluid heat dissipation efficiency of microwave microsystems in complex service environments.

[0058] In the embodiments of this disclosure, the thermocouple or thermistor in the temperature measurement module and the strain gauge in the stress-strain measurement module are respectively connected to a data acquisition instrument; the data acquisition instrument is used to record and process electrical signals from the thermal test chip, the thermocouple or thermistor and the strain gauge.

[0059] like Figure 1 As shown, the contact thermal testing chips (such as thermocouples or thermistors) deployed on the substrate in the temperature measurement module, and the strain gauges deployed on the substrate in the stress-strain measurement module, both have their signal output terminals connected to a multi-channel data acquisition instrument via shielded cables. Simultaneously, the internal thermal excitation module (i.e., the thermal testing chip, such as a TTC chip) also outputs its real-time generated electrical signals reflecting its junction temperature and strain to the same data acquisition instrument via its external leads.

[0060] Understandably, the data acquisition instrument enables the centralized and synchronous acquisition and preliminary processing of sensor signals of different types and locations distributed in the microwave microsystem under test. This provides a unified and reliable data source for subsequent comprehensive data analysis, real-time display, and historical tracing, ensuring the temporal synchronization and comparability of multi-physics field measurement data.

[0061] In embodiments of this disclosure, the system further includes: a fluid operation subsystem connected to the liquid-cooled flow channel of the microwave microsystem under test via a pipeline, for supplying and circulating coolant to the liquid-cooled flow channel, and for regulating the inlet temperature and flow rate of the coolant; the fluid operation subsystem includes a storage tank, a circulation pump for driving the circulation of the coolant, and a condenser for cooling the returning coolant.

[0062] The fluid transport subsystem, via flexible or rigid insulated pipes, can be connected to the inlet and outlet of the liquid-cooled channel of the microwave microsystem under test, thus forming a complete, closed-loop forced liquid-cooled circulation circuit. This subsystem can provide a stable and controllable coolant supply and circulation driving force for the liquid-cooled channel of the microwave microsystem under test, and precisely adjust the temperature and flow rate of the coolant at the channel inlet to simulate its heat dissipation conditions in actual equipment or to conduct extreme condition tests.

[0063] To achieve the above functions, the subsystem may include a liquid storage tank, a condenser, and a circulation pump.

[0064] like Figure 1 As shown, the storage tank is connected to the liquid cooling pipeline to store and provide sufficient coolant (such as deionized water, special fluorinated liquid, etc.). It serves as the working fluid source for the entire circulation loop and is typically equipped with a liquid level observation and filling port. The condenser's heat exchanger is connected in series in the circulation loop and can be located before the storage tank or form an independent cooling branch. This condenser can actively cool the heated return coolant flowing out of the microwave microsystem under test, reducing its temperature to a set value, thereby precisely controlling the coolant inlet temperature re-entering the microwave microsystem and maintaining the stability of the test conditions. The circulation pump, as the system's power source, is connected in series in the liquid cooling pipeline to provide stable and adjustable drive pressure to overcome the flow resistance of the entire loop (including the microwave microsystem flow channel), ensuring that the coolant continuously circulates at a preset flow rate. The pump's speed or power is adjustable to achieve precise control of the flow rate (velocity).

[0065] Understandably, by integrating the fluid operation subsystem, the measurement system disclosed herein can not only passively monitor the liquid cooling circuit of the microwave microsystem (obtaining parameters such as flow rate, temperature, and pressure through the fluid measurement module), but also achieve active supply and control.

[0066] In embodiments of this disclosure, the system further includes: a structural support box, and the devices of the environmental simulation subsystem and the integrated measurement subsystem are arranged inside the structural support box.

[0067] The structural support box can form the physical framework and outer shell of the entire measurement system. For example... Figure 1As shown, the main equipment and components of the environmental simulation subsystem (such as the heat conduction temperature control board, convection heat exchanger, heat radiation panel, and base of the random vibration table) and the integrated measurement subsystem (such as internal sensor wiring channels and some data acquisition equipment) can be arranged, fixed, or integrated within or on this enclosure structure in an orderly manner. This enclosure provides precise positioning references, robust mechanical supports, and necessary installation interfaces for each functional module, ensuring the structural rigidity and stability of the entire system during operation (especially when random vibration loads are applied).

[0068] For example, the structural support enclosure features a 5cm thick insulation layer and external dimensions of 120cm (length) × 120cm (width) × 100cm (height). Under ambient temperature of 25℃, with a cooling power of 5.6kW, the internal cavity temperature can be maintained below -10℃; with a heating power of 6.0kW, the internal cavity temperature can be maintained above 80℃. This means the convection heat exchanger can control the ambient temperature of the test chamber from -10℃ to 80℃. For example, the structural support enclosure can be constructed from high-strength aluminum alloy profiles and plates. The enclosure surface can be anodized, which not only enhances the surface hardness and corrosion resistance of the material but also provides excellent appearance and electrical insulation properties. The enclosure can be designed with operable doors and windows, observation windows (such as quartz glass windows for infrared thermal imaging), cable interfaces, and ventilation holes, depending on the internal equipment layout and operational requirements.

[0069] In embodiments of this disclosure, the system further includes: a heat insulation layer disposed on the inner wall of the structural support box to reduce heat exchange between the inside of the microwave microsystem under test and the external environment; and an electromagnetic shielding layer coated on the heat insulation layer to shield against electromagnetic radiation generated by the microwave microsystem under test during operation. Figure 1As shown, the thermal insulation layer is the first functional material layer closely attached to or adjacent to the inner wall of the structural support box. It reduces uncontrolled heat exchange between the internal test area of ​​the microwave microsystem under test and the external environment of the box, thereby ensuring the effectiveness of the thermal boundary conditions created by the environmental simulation subsystem and the accuracy of the measured temperature. This thermal insulation layer is typically designed as a double-layer composite structure: a heat radiation reflective film facing the test cavity (inner layer) and a porous silica thermal insulation material layer attached to the inner wall of the box or serving as an intermediate layer (outer layer). The heat radiation reflective film uses a high-temperature resistant flexible material such as polyimide as a substrate, and a highly reflective metallic silver layer is coated on its cavity-facing side using physical or chemical methods. This silver layer has extremely high reflectivity (e.g., over 95%) for visible and near-infrared thermal radiation, efficiently reflecting the thermal radiation generated by the devices inside the test cavity back, thus greatly reducing heat loss through radiation. This reflective film layer is relatively thin, for example, about 0.5 mm. The porous silica insulation material layer has an extremely low theoretical thermal conductivity (e.g., approximately 0.02 W / m·K). Its main function is to inhibit solid-state heat conduction and limit internal air convection through its porous structure, thereby effectively blocking heat loss to the outside through conduction and convection. This insulation layer has a certain thickness to provide sufficient insulation effect, for example, approximately 20 mm.

[0070] Continue to refer to Figure 1 The electromagnetic shielding layer, located outside the insulation layer, effectively shields the high-frequency electromagnetic radiation generated by the microwave microsystem under test during operation, preventing leakage to the outside of the enclosure. Such leakage would not only severely interfere with the normal operation of other precision electronic equipment in the vicinity but could also pose potential electromagnetic safety hazards to experimental personnel. The electromagnetic shielding layer preferably uses a flexible composite conductive fabric material, primarily polyester fiber cloth as the flexible base. Through processes such as vacuum coating and chemical plating, nickel and copper layers are deposited sequentially on its surface, forming a metallized fabric with both good conductivity and flexibility, allowing it to adhere to the inner wall of the enclosure with the insulation layer. The electromagnetic shielding layer can have a certain thickness (e.g., approximately 10 mm) to ensure structural integrity and shielding effectiveness, and to withstand the high temperatures that may occur inside the test chamber (e.g., long-term resistance to 120°C). Its key performance indicator is electromagnetic shielding effectiveness; the average shielding effect within the target frequency band (such as the microwave band) can reach, for example, above 90 dB, effectively confining most electromagnetic radiation inside the enclosure.

[0071] For example, the thickness of the electromagnetic shielding layer can be 1 cm, and when the electromagnetic frequency is above 1 MHz, the electromagnetic shielding effectiveness is higher than 100 dB.

[0072] It is understandable that by setting up an insulation layer and an electromagnetic shielding layer, the measurement system in this embodiment constructs a test environment that combines thermal isolation and electromagnetic enclosure. This not only improves the reliability of measurement results such as temperature and stress (reducing environmental interference), but also ensures the electromagnetic safety of the surrounding environment and personnel during the test process.

[0073] In embodiments of this disclosure, the method further includes: an antireflection film and quartz glass coated on an electromagnetic shielding layer, used to reduce the impact of hot airflow disturbance on the accuracy of infrared thermal imaging while ensuring electromagnetic shielding.

[0074] like Figure 1 As shown, quartz glass and an anti-reflective coating can be installed on the top of the enclosure, which is closely attached to the electromagnetic shielding layer. The quartz glass serves as the core light-transmitting substrate for the window, and both sides can be coated with an anti-reflective coating made of magnesium difluoride (MgF2). The optical anti-reflective coating is specially designed to reduce the reflectivity of the quartz glass surface to specific infrared bands. That is, after the anti-reflective coating is coated on both sides, the reflectivity of the quartz glass to specific infrared bands can be reduced to below 1%, thereby maximizing the transmittance of infrared thermal radiation, reducing signal loss, and ensuring that the thermal radiation signal received by the infrared thermal imager is more realistic and clear.

[0075] It should be noted that the quartz glass with an anti-reflective coating is installed on the heat radiation panel.

[0076] Understandably, antireflective coatings and quartz glass can reduce the negative impact of hot airflow disturbances on the infrared thermal imager itself and its final imaging accuracy.

[0077] Figure 2 A schematic diagram illustrating the power supply for a measurement system provided in an embodiment of this disclosure is shown.

[0078] like Figure 2 As illustrated, exemplarily, a power supply system comprised of one or more DC regulated power supplies with multiple independently adjustable and highly stable outputs can provide a 0-24V adjustable DC input to the microwave microsystem under test, a 5V DC input to the infrared thermal imager, a 24V DC input to the data acquisition unit, and a 12V DC input to the circulating pump in the fluid operation subsystem. Simultaneously, it allows for unified power distribution management of AC power supply equipment, with the condenser and random vibration table connected to a 220V AC input, while the convection heat exchanger is connected to a 380V AC input. This power supply configuration ensures the reliability of high-precision data acquisition and environmental simulation by providing a clean and stable operating voltage, meets the needs of diverse testing conditions through independently adjustable parameters, and achieves safe and integrated control of system power consumption.

[0079] The data that can be obtained through this testing platform is shown in the table below:

[0080]

[0081] To reduce the number of devices and prevent excessive wiring, a customized integrated fluid circulation and measurement component can be installed. This component can incorporate inlet and outlet thermometers, inlet and outlet pressure gauges, flow meters, condensers, circulation pumps, and storage tanks. Furthermore, the device can achieve temperature control from -10°C to 55°C (when using AF65 aviation coolant).

[0082] Another aspect of this disclosure provides a method for testing a microwave microsystem under test using a measurement system, specifically including operations S1-S4.

[0083] In operation S1, the microwave microsystem under test is installed in the test platform of the measurement system, and the temperature measurement module and the stress-strain measurement module are connected according to the test target.

[0084] In operation S2, when the microwave microsystem under test has its own liquid cooling channel, the liquid cooling channel is connected to the fluid measurement module of the measurement system, and the liquid cooling fluid parameters in the liquid cooling channel are adjusted to the preset operating conditions through the fluid operation subsystem.

[0085] In operation S3, at least two of the following are set and activated through the external environment simulation module: thermal conduction boundary conditions, thermal convection boundary conditions, thermal radiation boundary conditions, and random vibration loads.

[0086] In operation S4, the internal thermal excitation module is activated to simulate the actual power consumption chip heating, and the temperature field information, stress and strain information, and liquid cooling fluid parameters of the microwave microsystem under test are collected synchronously through the integrated measurement subsystem.

[0087] Based on the above embodiments, in this embodiment, a comprehensive measurement subsystem is used to simultaneously collect temperature field information, stress-strain information, and liquid cooling fluid parameters of the microwave microsystem under test. This includes: obtaining a temperature distribution cloud map of the surface of the microwave microsystem under test using an infrared thermal imager; obtaining junction temperature data of a thermal test chip located in an internal thermal excitation module; obtaining substrate temperature data at at least one location using thermocouples or thermistors arranged on the substrate of the microwave microsystem under test; the temperature field information includes a temperature distribution cloud map, junction temperature data, and substrate temperature data; acquiring chip-level and / or substrate-level stress-strain information using stress sensors arranged in the internal thermal excitation module and / or strain gauges arranged on the substrate; and, in the case where the microwave microsystem under test has its own liquid cooling channel, acquiring the liquid cooling fluid parameters of the coolant using a flow meter, pressure gauge, and thermometer in a fluid measurement module.

[0088] Figure 3 The flowchart illustrating the use of a measurement system to test a microwave microsystem under test, as provided in an embodiment of this disclosure, is shown in the illustration.

[0089] like Figure 3 As shown, specifically, the actual power consumption chip in the microwave microsystem under test is first replaced with a thermal testing chip that can quantify heat generation and integrate sensing functions, and then connected to the data acquisition instrument via its external leads. Simultaneously, according to the test objectives (i.e., test requirements), thermocouples, thermistors, and strain gauges are plated onto key locations on the microwave microsystem substrate or package housing and connected to the data acquisition instrument. Next, the microwave microsystem with deployed sensors can be mounted on a heat conduction temperature control board, and the addition of thermal interface materials is determined based on actual service conditions; for example, thermal grease can be added between the microwave microsystem and the heat conduction temperature control board, with the grease thickness controlled between 0.1mm and 0.2mm. Then, the infrared thermal imager, data acquisition instrument, circulating pump, condenser, and random vibration table can be powered by a DC power supply or a 220V AC power supply. If the microwave microsystem under test has its own liquid cooling channel and its fluid flow properties and heat dissipation performance need to be tested, the microwave microsystem can be connected to the fluid testing devices on this platform via a liquid cooling connector and liquid cooling piping. Then, add the appropriate type of coolant required for the actual operation of the microwave microsystem to the storage tank. After filling the tank, turn on the circulation pump and condenser sequentially, adjusting the circulation pump power until the inlet and outlet pressure difference and pipeline flow rate of the coolant are consistent with those during actual operation of the microwave microsystem. Also, adjust the condenser power until the fluid inlet temperature is consistent with those during actual operation. If vibration testing is required, the microwave microsystem and temperature control board can be fixed with screws or clips, and the actual power spectral density can be imported into a random vibration table.

[0090] Based on the simulated service environment, the required environmental conditions are set and activated through the external environment simulation module: Heat conduction conditions are set, i.e., the temperature of the heat conduction temperature control board (temperature control plate) is set according to the heat conduction environment of the microwave microsystem; heat convection conditions are set, i.e., the outlet temperature and flow velocity of the convection heat exchanger are set according to the heat convection environment of the microwave microsystem; heat radiation conditions are set, i.e., the temperature of the heat radiation panel is set according to the heat radiation environment of the microwave microsystem. After the thermal environment, fluid environment, and vibration environment have stabilized, the data acquisition instrument is zeroed and recording is started. Simultaneously, the thermal imager is turned on, focused, and begins capturing images.

[0091] Based on the actual operating voltage, a DC regulated power supply powers the internal thermal excitation module, initiating its heating to simulate the actual operating state of the power consumption chip. Under the combined effect of this internal thermal excitation and the external complex environment, multi-physics field data are simultaneously acquired through the integrated measurement subsystem: an infrared thermal imager acquires the temperature field distribution cloud map of the microwave microsystem surface; a data acquisition unit continuously records signals from the thermal test chip, various contact thermal test chips, and various strain gauges; and a fluid measurement module records the coolant flow rate, inlet and outlet pressure, and temperature data in real time.

[0092] After the predetermined test conditions are met, the power supplies of each system are turned off in sequence. Finally, temperature field information, stress-strain information, and stable liquid cooling fluid parameters are exported from the infrared thermal imager, data acquisition instrument, and fluid measurement module, respectively. Key indicators such as junction thermal resistance and liquid cooling power can then be calculated to complete a comprehensive evaluation of the thermal, mechanical, and fluid performance of the microwave microsystem under complex simulation conditions.

[0093] Temperature measurement experiments were conducted on an antenna integrated microsystem using the measurement system provided in this embodiment. Figure 4 The experiment showcased the actual chip layout. A thermal testing chip replaced the actual heat-generating chip in the system, with 13 temperature measurement points deployed, each corresponding to a heat-generating location of the actual power consumption chip. The heat generation power of each thermal testing chip was as follows: A1-A2 15W, A3-A4 7W, B1 30W, C1-C2 20W, D1-D2 25W, E1-E2 10W, and F1-F2 20W. Two different thermal environment conditions were set up under vibration-free conditions: the first group had a heat convection temperature of 20℃, a closed heat radiation panel, and a heat conduction temperature control board temperature of 30℃; the second group had a heat convection temperature of 80℃, a heat radiation panel temperature of 35℃, and a heat conduction temperature control board temperature of 50℃.

[0094] By adjusting the heat convection temperature, heat radiation temperature, and heat conduction temperature control plate temperature, two significantly different thermal environments can be simulated. The temperature measurement results are as follows: Figure 5 and Figure 6 As shown, the temperature rise curves at each measurement point exhibit significant differences under different thermal environments. Among them, Figure 5 The corresponding temperature rise curve measured by the measurement system not using the embodiments of this disclosure is as follows: heat convection 20°C, heat radiation panel closed, heat conduction temperature control plate 30°C. Figure 6The corresponding temperature rise curve is obtained using the measurement system of this disclosure embodiment, with operating conditions of 80°C for heat convection, 35°C for the heat radiation panel, and 50°C for the heat conduction temperature control plate. The results show that the measurement system provided by this disclosure embodiment can effectively reflect the thermal response characteristics under different thermal environments. Those skilled in the art will understand that the features described in the various embodiments and / or claims of this disclosure can be combined or combined in various ways, even if such combinations or combinations are not explicitly described in this disclosure. In particular, the features described in the various embodiments and / or claims of this disclosure can be combined and / or combined in various ways without departing from the spirit and teachings of this disclosure. All such combinations and / or combinations fall within the scope of this disclosure.

[0095] Although this disclosure has been shown and described with reference to specific exemplary embodiments thereof, those skilled in the art will understand that various changes in form and detail may be made to this disclosure without departing from the spirit and scope of the disclosure as defined by the appended claims and their equivalents. Therefore, the scope of this disclosure should not be limited to the above embodiments, but should be defined not only by the appended claims, but also by their equivalents.

Claims

1. A microwave microsystem thermal, mechanical, and fluid measurement system for complex service environments, characterized in that, include: The environmental simulation subsystem includes an internal thermal excitation module and an external environment simulation module. The internal thermal excitation module is used to generate and output target thermal power to simulate the working heat generation of the power consumption chip in the microwave microsystem under test. The external environment simulation module is used to regulate the external boundary conditions applied to the microwave microsystem under test. The external boundary conditions include at least two of the following: thermal conduction boundary conditions, thermal convection boundary conditions, thermal radiation boundary conditions, and random vibration loads. The integrated measurement subsystem is used to obtain the temperature field information, stress and strain information, and liquid cooling fluid parameters of the microwave microsystem under test when the internal thermal excitation module and the external environment simulation module work together. The environmental simulation subsystem and the integrated measurement subsystem are integrated in the test platform, and the microwave microsystem under test is placed in the test platform for testing.

2. The measurement system according to claim 1, characterized in that, The external environment simulation module includes: The heat conduction simulation submodule includes a heat conduction temperature control plate disposed below the microwave microsystem under test, used to simulate and regulate the heat conduction boundary conditions at the bottom of the microwave microsystem under test; The thermal convection simulation submodule includes a convection heat exchanger disposed above the microwave microsystem under test, used to simulate and control the thermal convection boundary conditions flowing through the surface of the microwave microsystem under test; The thermal radiation simulation submodule includes a thermal radiation heat panel disposed around the microwave microsystem under test, used to simulate and control the thermal radiation boundary conditions of the microwave microsystem under test. The random vibration simulation submodule includes a random vibration table disposed below the microwave microsystem under test, used to apply a random vibration load with a preset power spectral density to the microwave microsystem under test.

3. The measurement system according to claim 1 or 2, characterized in that, The integrated measurement subsystem includes: A temperature measurement module is used to obtain multi-dimensional temperature field information. The temperature measurement module includes an infrared thermal imager for measuring the surface temperature distribution of the microwave microsystem under test, a thermal test chip for measuring the junction temperature of the internal thermal excitation module, and at least two of thermocouples or thermistors for measuring the local temperature of the substrate of the microwave microsystem under test. A stress-strain measurement module is used to obtain stress-strain information of the microwave microsystem under test. The stress-strain measurement module includes a stress sensor for measuring the strain of the internal thermal excitation module and / or a strain gauge plated on the substrate of the microwave microsystem under test. A fluid measurement module is used to obtain the liquid cooling fluid parameters of the coolant when the microwave microsystem under test has its own liquid cooling channel. The fluid measurement module includes a thermometer for measuring the inlet and outlet temperatures of the coolant, a pressure gauge for measuring the inlet and outlet pressures, and a flow meter for measuring the flow rate.

4. The measurement system according to claim 3, characterized in that, Also includes: The fluid operation subsystem is connected to the liquid-cooled flow channel of the microwave microsystem under test via a pipeline. It is used to supply and circulate coolant to the liquid-cooled flow channel and to regulate the inlet temperature and flow rate of the coolant. The fluid operation subsystem includes a storage tank, a circulation pump for driving the circulation of the coolant, and a condenser for cooling the returning coolant.

5. The measurement system according to claim 1, characterized in that, Also includes: The structural support box contains the equipment of the environmental simulation subsystem and the integrated measurement subsystem.

6. The measurement system according to claim 5, characterized in that, Also includes: An insulation layer is provided on the inner wall of the structural support box to reduce heat exchange between the inside of the microwave microsystem under test and the external environment. An electromagnetic shielding layer, coated on the heat insulation layer, is used to shield the electromagnetic radiation generated by the microwave microsystem under test during operation.

7. The measurement system according to claim 6, characterized in that, Also includes: An antireflective coating and quartz glass are coated on the electromagnetic shielding layer to reduce the impact of hot airflow disturbance on the accuracy of infrared thermal imaging while ensuring electromagnetic shielding.

8. The measurement system according to claim 3, characterized in that, The internal thermal excitation module is a thermal test chip, which is connected to the data acquisition instrument via external leads and is used to replace the actual power consumption chip in the microwave microsystem under test. The thermocouples or thermistors in the temperature measurement module and the strain gauges in the stress and strain measurement module are respectively connected to the data acquisition instrument. The data acquisition instrument is used to record and process electrical signals from the thermal test chip, thermocouple or thermistor and strain gauge.

9. A method for testing a microwave microsystem under test using the measurement system as described in any one of claims 1-8, characterized in that, include: The microwave microsystem under test is installed in the test platform of the measurement system, and the temperature measurement module and the stress-strain measurement module are connected according to the test target. When the microwave microsystem under test has its own liquid cooling channel, the liquid cooling channel is connected to the fluid measurement module of the measurement system, and the liquid cooling fluid parameters of the coolant in the liquid cooling channel are adjusted to the preset operating conditions through the fluid operation subsystem. The external environment simulation module allows setting and activating at least two of the following boundary conditions: thermal conduction boundary conditions, thermal convection boundary conditions, thermal radiation boundary conditions, and random vibration loads. The internal thermal excitation module is activated to simulate the heating of a chip with actual power consumption, and the temperature field information, stress and strain information, and liquid cooling fluid parameters of the microwave microsystem under test are collected synchronously through the integrated measurement subsystem.

10. The method according to claim 9, characterized in that, The integrated measurement subsystem synchronously collects temperature field information, stress-strain information, and liquid cooling fluid parameters of the microwave microsystem under test, including: The temperature distribution cloud map of the surface of the microwave microsystem under test is obtained by an infrared thermal imager, the junction temperature data of the thermal test chip is obtained by a thermal test chip set in the internal thermal excitation module, and the substrate temperature data at at least one location is obtained by a thermocouple or thermistor arranged on the substrate of the microwave microsystem under test. The temperature field information includes the temperature distribution cloud map, junction temperature data and substrate temperature data. Stress and strain information at the chip level and / or substrate level is obtained by stress sensors arranged in the internal thermal excitation module and / or strain gauges arranged on the substrate. When the microwave microsystem under test has its own liquid cooling channel, the liquid cooling fluid parameters of the coolant are obtained through the flow meter, pressure gauge and thermometer of the fluid measurement module.

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