Omnidirectional gravity attitude multi-mechanism cooperative chip cooling strategy test platform and method

Abstract

This invention discloses a test platform and method for chip cooling strategies based on omnidirectional gravity attitude and multi-mechanism coordination, belonging to the field of electronic device thermal management. This invention achieves testing and research on the cooling process of chip cooling test pieces under all spatial angles through a combination of a dual-axis tilting clamping platform and a multi-dimensional moving working fluid nozzle. The needle-fin support platform cleverly solves the physical spatial conflict between the heating surface and the temperature measuring surface under high heat flux density, significantly improving thermal measurement accuracy. The integrated fully enclosed negative pressure protective cover and tilted bottom liquid recovery system enable the platform to be safely applied to the testing and research of various special working fluids, broadening the testing scope. This invention provides a comprehensive test platform capable of simulating omnidirectional gravity attitude, compatible with multiple cooling mechanisms, and possessing high-precision thermal measurement and safety protection functions. This invention can be applied to aerospace, high-altitude equipment, and wearable electronics applications where cooling systems need to undergo complex and variable gravity environments.

Description

Technical Field

[0001] This invention relates to thermal management of electronic devices, specifically to a test platform and implementation method for a chip cooling strategy based on omnidirectional gravity attitude multi-mechanism coordination. Background Technology

[0002] As semiconductor devices evolve towards higher integration and higher power density, chip heat flux density is increasing dramatically. Efficient thermal management technology has become a key bottleneck restricting the performance and reliability of electronic devices. Currently, next-generation cooling strategies such as microchannel liquid cooling, microjet impingement cooling, and liquid-gas phase change cooling are considered effective means to address localized hot spots and high heat flux density.

[0003] Existing experimental studies on the aforementioned cooling technologies are typically conducted under a single cooling mode and in a fixed gravity field environment. However, in applications such as aerospace, high-altitude equipment, and wearable electronics, cooling systems may experience complex and variable gravity environments. Changes in the direction of gravity can affect the flow patterns of gas-liquid two-phase flows, the bubble dynamics of boiling heat transfer, and natural convection effects, leading to the failure of existing heat transfer correlations obtained based on constant gravity environments at ground level.

[0004] Furthermore, current testing equipment often requires the construction of different testing platforms when simulating various cooling strategies, making it difficult to conduct comparative studies or explore the synergistic effects of multiple mechanisms under the same benchmark. In thermal testing methods, the inability to place heating elements and temperature sensors on the same surface commonly leads to measurement problems, resulting in measured temperatures that do not accurately reflect the actual temperature of the chip surface. Summary of the Invention

[0005] To address the problems existing in the prior art, this invention proposes a chip cooling strategy test platform and its implementation method based on omnidirectional gravity attitude multi-mechanism collaboration. This comprehensive test platform can simulate omnidirectional gravity attitude, is compatible with multiple cooling mechanisms, and has high-precision thermal measurement and safety protection functions.

[0006] One objective of this invention is to propose a chip cooling strategy test platform that utilizes omnidirectional gravity attitude multi-mechanism coordination.

[0007] The omnidirectional gravity attitude multi-mechanism coordinated chip cooling strategy test platform of the present invention includes: a pin-wing support platform, an attitude adjustment module, a cooling execution module, a data acquisition module, a suction and safety module, and a computer; wherein, the pin-wing support platform is mounted on the attitude adjustment module; the attitude adjustment module, the cooling execution module, the data acquisition module, and the suction and safety module are respectively connected to the computer; the chip cooling test piece with heating elements attached to its surface is loaded on the surface of the pin-wing support platform; the attitude adjustment module applies a freely tilting load to the chip cooling test piece around the horizontal axis from 0° to 180°, simulating the gravity vector direction of the chip cooling test piece in all directions in three-dimensional space; the cooling execution module applies a liquid or gaseous working fluid with an arbitrary set angle and flow state to the surface of the chip cooling test piece to cool it; the pin-wing support platform, the attitude adjustment module, and the cooling execution module are fully enclosed within the suction and safety module, which provides the test negative pressure and collects the working fluid; the heat source application surface and the temperature measurement surface are coplanar, and the data acquisition module measures the temperature of the chip cooling test piece surface and transmits the data to the computer.

[0008] It also includes a test bench base, which comprises upper and lower platform surfaces fixedly connected by a frame. The upper platform surface has at least one opening for a liquid working fluid recovery tank and at least one perforated channel, the purpose of which is to allow wires and pipes connecting the equipment on the upper and lower platform surfaces to pass through. It also includes a power supply, with the data acquisition module and heating element respectively connected to the power supply. The pin-fin support platform, attitude adjustment module, and cooling execution module are mounted on the upper platform surface of the test bench base, while the data acquisition module, power supply, and computer are mounted on the lower platform surface of the test bench base.

[0009] The pin-fin support platform comprises: an overhead cable tray, a pin-fin array, and guide holes. The upper surface of the overhead cable tray features a pin-fin array formed by multiple two-dimensionally arranged micro-pins. The multi-point support plane formed by the tips of the pin-fin array supports a chip cooling test piece with a mounting heating element. The chip cooling test piece is fixed to the top of the pin-fin array using adhesive or mechanical connectors. The gaps between the pins are used to insert thermoelectric sensor probes. Precision guide holes are provided on the surface of the overhead cable tray at locations where pins are not present, i.e., at the gaps between the pins. The pin-fin support platform uses materials with low thermal conductivity and high temperature resistance, including but not limited to polyetheretherketone (PEEK), polyimide, zirconia ceramic, or microcrystalline glass. The height of the pins is 2–5 times the side length of the pin, the side length of the pins is 0.3–1.5 mm, and the distance between two adjacent pins, i.e., the pin gap, is 0.5 mm–2.5 mm.

[0010] The data acquisition module includes a thermoelectric sensor temperature measurement array and a temperature acquisition module. Multiple thermoelectric sensor probes are inserted into the gaps between the pins of the pin-fin support platform to form the thermoelectric sensor temperature measurement array. Each thermoelectric sensor probe contacts the back of the chip cooling test piece, and a heating element is attached to the back of the chip cooling test piece. The heat source application surface and the temperature measurement surface are coplanar. Wires connecting the thermoelectric sensor probes pass through guide holes in the pin-fin support platform and converge into an overhead cable tray, connecting to the temperature acquisition module. The temperature acquisition module is connected to a computer, and the thermoelectric sensor probes are connected to a power source via wires through guide holes in the pin-fin support platform. The wires connecting the thermoelectric sensor probe are led out through the guide holes. The guide holes of the pin-fin support platform enable the heat generated by the heating element to be efficiently conducted to the chip cooling test piece. The low thermal conductivity of the pins will not dissipate too much heat. The thermoelectric sensor probe arranged between the pins directly contacts the back of the chip cooling test piece through the gap between the heating elements to measure the temperature. This realizes the combination of the heat source application surface and the temperature measurement surface, which solves the problem that traditional test platforms cannot arrange the heating element and the temperature measuring element on the same plane, and eliminates the measurement error caused by non-coplanar temperature measurement.

[0011] The attitude adjustment module includes a tilting clamping platform and a displacement stage. The tilting clamping platform is mounted on the displacement stage and is moved by the displacement stage. The tilting clamping platform includes an upper platform plate, a platform shaft, and a lower platform plate. The upper and lower platform plates are connected by the platform shaft, which is horizontal. The upper platform plate has the freedom to rotate around the platform shaft. The platform shaft integrates fasteners to fix the tilt angle at a set angle. The fasteners integrated into the platform shaft include, but are not limited to: a worm gear self-locking mechanism, a fan-shaped scale plate with locking bolts, a precision indexing plate with pin positioning, a pneumatic or hydraulic brake to hold the shaft, a double nut locking mechanism to clamp both sides of the shaft, or an angle positioning pin with a multi-hole indexing plate. The system further includes two sets of tilting clamping platforms and displacement stages: a horizontal tilting clamping platform and a horizontal displacement stage, and a vertical tilting clamping platform and a vertical displacement stage. The horizontal tilting clamping platform is mounted on the horizontal displacement stage, and the vertical tilting clamping platform is mounted on the vertical displacement stage. The lower plate of the horizontal tilting clamping platform is located in the horizontal plane, and the upper plate rotates freely around the platform's axis from 0° to 90°, simulating the direction of the gravity vector at 0° to 90°. The lower plate of the vertical tilting clamping platform is located in the vertical plane, and the upper plate rotates freely around the platform's axis from 90° to 180°, simulating the direction of the gravity vector at 90° to 180°. The horizontal displacement stage is a platform that moves two-dimensionally along the horizontal plane, including a horizontal X-axis guide rail and a horizontal Y-axis guide rail. The horizontal displacement stage drives the horizontal tilting clamping platform to move along the horizontal plane. The vertical displacement stage is a platform that moves two-dimensionally along the vertical plane, including a vertical Y-axis guide rail and a vertical Z-axis guide rail. The vertical displacement stage drives the vertical tilting clamping platform to move along the vertical plane. The guide rail includes at least one track, each track mounting at least one slider with a limit and fixing function. Pin-wing support platforms are mounted on the upper platforms of the horizontal and vertical inclined clamping platforms, respectively. High-precision angle gauges are mounted on the horizontal and vertical inclined clamping platforms and connected to a computer. The displacement stage of the attitude adjustment module is located on the upper platform of the test bench base.

[0012] As a further improvement of the present invention, the lower plate of the platform is placed on a rotating device, which can rotate about an axis perpendicular to the plane of the lower plate of the platform. The tilting clamping of the platform can rotate the device to achieve more precise gravity simulation.

[0013] The cooling execution module includes: at least one set of working fluid nozzles, an injection pump, and a multi-dimensional moving support. The working fluid nozzles are mounted on the end of the multi-dimensional moving support via a universal rotary joint, allowing them to rotate freely 360° around their own axis (Y-axis). The inlet of the working fluid nozzle is connected to the injection pump via a flexible pipeline, and the outlet of the working fluid nozzle can be replaced with a micro-jet orifice plate, a microchannel coupling joint, or a gas rectifying nozzle, depending on the testing requirements. This allows for the application of liquid or gaseous working fluids at different angles and with different flow states (e.g., impingement flow, parallel flow) to the surface of the chip cooling test piece, thereby achieving various advanced cooling methods such as micro-jet impact, microchannel cooling, solid particle impact, and airflow convection. The injection pump is connected to an external working fluid storage tank via a pipeline, and the form and type of the working fluid storage tank are determined according to the properties of the working fluid itself. The multi-dimensional moving support is arranged in a gantry-like configuration, including an X-axis gantry rail, a Z-axis gantry rail, a Y-axis optical axis linear guide, and an adjusting arm. The Z-axis gantry rail is mounted on the X-axis gantry rail, the Y-axis optical axis linear guide is mounted on the Z-axis gantry rail, and the adjusting arm is mounted on the Y-axis optical axis linear guide. The adjusting arm can rotate around the Y-axis optical axis linear guide. The working fluid nozzle is mounted on the adjusting arm via a universal joint. The X-axis and Z-axis gantry rails are used to adjust the position of the working fluid nozzle in the XZ plane, the Y-axis optical axis linear guide is used to adjust the position and pitch angle of the working fluid nozzle along the Y-axis, and the adjusting arm finely adjusts and fixes the attitude and angle of the working fluid nozzle, so that the working fluid nozzle faces the front of the chip cooling test piece at any set angle and attitude. The multi-dimensional moving support is mounted on the upper platform of the test bench base and has precise translational functions in the X, Y, and Z directions. The injection pump and temperature acquisition module are placed on the lower platform of the test bench base.

[0014] Heating elements mounted on the surface of the chip cooling test piece include, but are not limited to, carbon fiber heating elements, ceramic heating elements, or mica heating elements.

[0015] The suction and safety module includes: a protective cover, a gas suction pump, a liquid working fluid recovery tank, and a liquid working fluid suction pump. The pin-fin support platform, attitude adjustment module, and cooling execution module, located on the upper platform of the test bench base, are housed within the protective cover, which is made of transparent plexiglass. The top of the protective cover has a suction port connected to the gas suction pump located outside the cover. The gas suction pump is equipped with a gas flow meter to promptly extract any potentially leaked, asphyxiating, or toxic working fluid vapors and to quantitatively monitor the vaporization / sublimation of the working fluid. The liquid working fluid recovery tank is installed on the lower surface of the upper platform of the test bench base and connected to its opening. It is a metal tank inclined towards the center or one side. The liquid working fluid recovery tank slopes downwards from its opening to a collection port at its lowest point, which is connected to the liquid working fluid suction pump. The liquid working fluid suction pump is connected to an external waste liquid recovery container to collect any residual liquid working fluid dripping during the test, preventing environmental pollution.

[0016] As a further improvement of the present invention, a macro high-speed camera and an infrared thermal imager can be added to visualize the flow field and temperature field distribution on the working surface of the chip cooling test piece.

[0017] Another objective of this invention is to propose a method for implementing a chip cooling strategy test platform based on omnidirectional gravity attitude multi-mechanism coordination.

[0018] The implementation method of the chip cooling strategy test platform based on omnidirectional gravity attitude multi-mechanism coordination of the present invention includes the following steps:

[0019] 1) Install the chip cooling test piece:

[0020] Open the protective cover of the suction and safety module, prepare the chip cooling test piece to be tested, and clean and blow it.

[0021] Select the horizontal or vertical tilting clamping platform for the attitude adjustment module according to the test requirements; install a thermoelectric sensor array on the pin-wing support platform, insert the thermoelectric sensor probe into the pin-wing gap of the pin-wing support platform, and the wires flow into the overhead wire trough through the guide hole of the pin-wing support platform, and then lead out from the overhead wire trough, pass through the hollow channel opened on the upper platform of the test bench base, and connect to the signal input terminal of the temperature acquisition module on the lower platform of the test bench base. The signal output terminal of the temperature acquisition module is connected to a computer with software installed to monitor the temperature field test data.

[0022] A heating element is installed at the top of the pin array of the pin-fin support platform. The wires of the heating element are led out from the periphery of the pin array and connected to the power supply. The chip cooling test piece to be tested is installed above the heating element and fixedly installed at the top of the pin array.

[0023] 2) Adjust the working fluid nozzle:

[0024] Adjust the displacement stage of the attitude adjustment module to the set position according to the required test parameters, and then adjust the tilt angle of the tilt clamping platform of the attitude adjustment module to complete the attitude adjustment of the chip cooling test piece, simulating the gravity vector direction of the chip cooling test piece in any orientation in three-dimensional space.

[0025] The position and pitch angle of the working fluid nozzle on the cooling execution module are adjusted by a multi-dimensional moving bracket, and the attitude and angle of the working fluid nozzle are finely adjusted by an adjusting arm.

[0026] 3) Cooling test:

[0027] Close the protective cover, turn on the gas suction pump and liquid working fluid suction pump as needed; turn on the heating element and temperature acquisition module, and turn on the injection pump to conduct the test when the test platform is stable;

[0028] The working fluid nozzle applies liquid or gaseous working fluid with an arbitrary set angle and flow state to the surface of the chip cooling test piece to cool the chip cooling test piece;

[0029] Thermoelectric sensor arrays measure the temperature of the chip-cooled test piece surface, which is then acquired by a temperature acquisition module and transmitted to a computer.

[0030] 4) Test ends:

[0031] At the end of the test, first turn off the heating element and the injection pump; the remaining liquid working fluid flows into the liquid working fluid recovery tank; the generated gaseous working fluid is isolated inside the protective cover; after the injection pump is turned off, keep the gas suction pump and the liquid working fluid suction pump running for a period of time, and discharge or recover the liquid working fluid flowing out of the liquid working fluid suction pump according to the test requirements; the gaseous working fluid is discharged from the protective cover through the gas suction pump equipped with a gas flow meter; then turn off the gas suction pump and the liquid working fluid suction pump, and finally open the protective cover for adjustment, disassembly and cleaning.

[0032] In step 1), the chip cooling test piece is fixed to the top of the pin array using polyimide heat-resistant adhesive or mechanical connectors.

[0033] In step 3), the gaseous working fluid suction pump continuously and slowly pumps air, and the suction flow rate Q1 that maintains negative pressure during the test satisfies: Q1 = (0.01~0.05) × Q, where Q is the suction flow rate of the suction pump, so that the protective cover is sealed under negative pressure during the test.

[0034] In step 4), the working time of the suction pump (in seconds) is t = N × QV, where N is the number of safe air changes, which is 1 to 2 times for non-toxic and harmless working fluids, 3 to 5 times for asphyxiating working fluids, and 5 to 10 times for toxic working fluids; V is the total volume of the protective cover or liquid working fluid recovery tank (in cubic meters). When calculating the working time of the gas suction pump, V is the total volume of the protective cover, and when calculating the working time of the liquid working fluid suction pump, V is the total volume of the liquid working fluid recovery tank of the protective cover; Q is the suction flow rate of the suction pump (in cubic meters per second).

[0035] Advantages of this invention:

[0036] (1) Omnidirectional gravity simulation: By combining a dual-axis tilting clamping platform with a multi-dimensional moving working fluid nozzle, the cooling process of the chip cooling test piece can be tested and studied in all spatial angles, providing key equipment for revealing the coupling influence mechanism of gravity on boiling, condensation and convective heat transfer.

[0037] (2) Multi-mechanism synergistic research: It can integrate a variety of advanced cooling methods such as micro-jet impact, microchannel cooling, solid particle impact and airflow convection, and can conduct single mechanism comparison or multi-mechanism synergistic effect test on the same test platform, which greatly improves test efficiency and data comparability;

[0038] (3) High-precision thermal measurement: The innovative needle-fin support platform design cleverly solves the physical space conflict between the heating surface and the temperature measuring surface under high heat flux density, significantly improving the accuracy of wall temperature measurement, which is of great significance for verifying the precision heat transfer model;

[0039] (4) High safety: When using engineering fluids such as HFE series, liquid carbon dioxide, liquid nitrogen or specific toxic phase change working fluids, the lack of effective gas isolation and liquid recovery devices poses a threat to the safety of test personnel and the environment; the fully enclosed negative pressure protective cover and inclined bottom liquid recovery system integrated in this invention enable the platform to be safely applied to the testing and research of various special working fluids, thus broadening the testing scope. Attached Figure Description

[0040] Figure 1 This is a perspective view of an embodiment of the chip cooling strategy test platform with omnidirectional gravity attitude multi-mechanism coordination of the present invention, wherein 1-vertical Y-axis guide rail, 2-vertical tilting clamping platform, 3-Y-axis optical axis linear guide rail, 4-X-axis gantry guide rail, 5-horizontal tilting clamping platform, and 6-horizontal X-axis guide rail.

[0041] Figure 2 This is a side view of an embodiment of the chip cooling strategy test platform with omnidirectional gravity attitude multi-mechanism coordination of the present invention, wherein 7-adjusting arm, 8-working fluid nozzle, 9-liquid working fluid suction pump, 10-liquid working fluid recovery tank, 11-injection pump, 12-computer, 13-temperature acquisition module, 14-power supply.

[0042] Figure 3 This is a top view of an embodiment of the chip cooling strategy test platform with omnidirectional gravity attitude multi-mechanism coordination of the present invention, wherein 15-horizontal Y-guide rail, 16-gantry Z-guide rail, 17-first hollow channel, 18-second hollow channel, 19-vertical Z-guide rail.

[0043] Figure 4 This is a perspective view of an embodiment of the omnidirectional gravity attitude multi-mechanism collaborative chip cooling strategy test platform of the present invention with a protective cover added, wherein 20-gas suction pump, 21-protective cover, 22-universal wheel, 23-upper platform, 24-lower platform;

[0044] Figure 5This is a schematic diagram of a pin-wing support platform and attitude adjustment module, which is an embodiment of the chip cooling strategy test platform for omnidirectional gravity attitude multi-mechanism coordination of the present invention. In the diagram, 5a is a guide hole, 5b is a pin-wing array, 5c is an overhead wire groove, 5d is the upper plate of the platform, 5e is the platform shaft, and 5f is the lower plate of the platform.

[0045] Figure 6 This is a schematic diagram of the piping and electrical connections of an embodiment of the omnidirectional gravity attitude multi-mechanism collaborative chip cooling strategy test platform of the present invention. Detailed Implementation

[0046] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0047] like Figures 1-4 As shown, the omnidirectional gravity attitude multi-mechanism collaborative chip cooling strategy test platform of this embodiment includes: test platform base, pin fin support platform, attitude adjustment module, cooling execution module, data acquisition module, suction and safety module and computer 12;

[0048] The test bench base includes upper and lower platforms fixedly connected by a frame. The upper platform 23 has at least one opening for a liquid working fluid recovery tank 10 and first and second hollow channels 17 and 18. The hollow channels are for wires and pipes connecting the equipment on the upper and lower platforms 24 to pass through. The lower platform 24 is equipped with locking casters 22. The pin-wing support platform, attitude adjustment module and cooling execution module are placed on the upper platform 23 of the test bench base. The injection pump 11, temperature acquisition module 13, power supply 14 and computer 12 are placed on the lower platform 24 of the test bench base.

[0049] The attitude adjustment module includes a horizontal tilting clamping platform 5 and a horizontal displacement stage, as well as a vertical tilting clamping platform 2 and a vertical displacement stage; wherein, the horizontal tilting clamping platform 5 is mounted on the horizontal displacement stage, and the vertical tilting clamping platform is mounted on the vertical displacement stage; for example... Figure 5As shown, the tilting clamping platform includes: an upper platform plate 5d, a platform pivot 5e, and a lower platform plate 5f; the upper platform plate 5d and the lower platform plate 5f are connected by the platform pivot 5e, which is along a horizontal plane. The upper platform plate 5d has a degree of freedom to rotate around the platform pivot 5e, with a rotation angle range of 0° to 90°; the lower platform plate of the horizontal tilting clamping platform 5 is located in the XY plane, and the platform pivot 5e is arranged along the X-axis or Y-axis direction, allowing the upper platform plate 5d to rotate freely around the X-axis or Y-axis from 0° to 90°. The rotation simulates the direction of the gravity vector in the 0°~90° orientation. The lower plate of the vertical inclined clamping platform 2 is located in the YZ plane, and the platform rotation axis 5e is arranged along the Y-axis. The upper plate 5d of the platform can rotate freely around the Y-axis from 90° to 180° to simulate the direction of the gravity vector in the 90°~180° orientation. The horizontal displacement stage includes a horizontal X-axis guide rail 6 and a horizontal Y-axis guide rail 15. The horizontal X-axis guide rail 6 is set on the upper platform 23, and the horizontal Y-axis guide rail 15 is set on the slider of the horizontal X-axis guide rail 6. The lower plate of the horizontal inclined clamping platform 5 is mounted on the slider of the horizontal Y-guide rail 15. The horizontal displacement stage drives the horizontal inclined clamping platform 5 to move along the horizontal plane. The vertical displacement stage includes a vertical Y-guide rail 1 and a vertical Z-guide rail 19. The vertical Y-guide rail 1 is set on the upper platform 23, and the vertical Z-guide rail 19 is set on the slider of the vertical Y-guide rail 1. The lower plate of the vertical inclined clamping platform 2 is mounted on the slider of the vertical Z-guide rail 19. The vertical displacement stage drives the vertical inclined clamping platform 2 to move along the vertical plane. The guide rail includes two tracks, each of which is equipped with a slider with a limit fixing function. The pin-wing support platform is mounted on the upper plate of the horizontal inclined clamping platform 5 and the vertical inclined clamping platform 2 respectively. The horizontal and vertical inclined clamping platforms 2 are equipped with high-precision angle gauges, which are connected to the computer 12 respectively. The angle gauges serve as the reference for angle positioning, assisting in manual or automatic adjustment to the target angle, and monitoring whether the angle drifts during the experiment to ensure constant boundary conditions.

[0050] The cooling execution module includes: a working fluid nozzle 8, an injection pump 11, and a multi-dimensional moving support. The working fluid nozzle 8 is mounted at the end of the multi-dimensional moving support via a universal joint, allowing it to rotate 360° freely around its own axis (Y-axis) to adjust the nozzle's orientation towards the front of the chip cooling test piece. The inlet of the working fluid nozzle 8 is connected to the injection pump 11 via a flexible conduit. The injection pump 11 is connected to an external working fluid storage tank via a pipe. The outlet of the working fluid nozzle can be replaced with a micro-jet orifice plate, a microchannel coupling connector, or a gas rectifying nozzle, depending on the testing requirements. The multi-dimensional moving support is arranged in a gantry configuration, including an X-axis gantry rail 4, a Z-axis gantry rail 16, a Y-axis optical axis linear guide rail 3, and an adjusting arm 7. The gantry guide rail 4 is mounted on the upper platform 23. The gantry Z-axis guide rail 16 is mounted on the slider of the X-axis gantry guide rail 4. The Y-axis optical axis linear guide rail 3 is mounted on the slider of the gantry Z-axis guide rail 16. The adjusting arm 7 is mounted on the slider of the Y-axis optical axis linear guide rail 3 and can rotate around the Y-axis optical axis linear guide rail 3. The working fluid nozzle 8 is mounted on the adjusting arm 7 through a universal joint. The X-axis gantry guide rail 4 and the gantry Z-axis guide rail 16 are used to adjust the position of the working fluid nozzle 8 in the XZ plane. The Y-axis optical axis linear guide rail 3 is used to adjust the position and pitch angle of the working fluid nozzle 8 along the Y-axis. The cooling execution module is located on the upper platform 23 of the test bench base. The working fluid nozzle 8 is connected to the computer 12.

[0051] like Figure 5 As shown, the pin-wing support platform includes: an overhead wire channel 5c, a pin-wing array 5b, and a guide hole 5a; the pin-wing array 5b, formed by multiple two-dimensionally arranged micro pins, is arranged on the upper surface of the overhead wire channel 5c. The material is zirconia ceramic. A heating element is mounted on the back of the chip cooling test piece. The multi-point support plane formed by the tips of the pin-wing array 5b is used to support the chip cooling test piece with the heating element mounted. The chip cooling test piece is fixed to the top of the pin-wing array 5b by adhesive or mechanical connectors. The gaps between the pins are used to insert thermoelectric sensor probes; a precision guide hole 5a is opened on the surface of the overhead wire channel 5c at a position where there are no pins, i.e., at the gaps between the pins. The wires connecting the inserted thermoelectric sensor probes are led out through the guide hole 5a; the overhead wire channel 5c is mounted on the upper plate 5d of the inclined clamping platform.

[0052] The data acquisition module includes a thermoelectric sensor temperature measurement array and a temperature acquisition module 13. Multiple thermoelectric sensor probes are inserted into the gaps between the pins of the pin-fin support platform to form the thermoelectric sensor temperature measurement array. Each thermoelectric sensor probe contacts the back of the chip cooling test piece without any heating element attached. Wires connecting the thermoelectric sensor probes converge through guide holes 5a into an overhead cable tray 5c and connect to the temperature acquisition module 13. The thermoelectric sensor probes are connected to a power supply 14 via wires through guide holes 5a. The temperature acquisition module 13 is connected to a computer 12.

[0053] The suction and safety module includes: a protective cover 21, a gas suction pump 20, a liquid working fluid recovery tank 10, and a liquid working fluid suction pump 9; wherein, the upper platform 23 of the test bench base is set inside the protective cover 21, and the protective cover 21 is made of transparent plexiglass; the top of the protective cover 21 has a suction port, which is connected to the gas suction pump 20 located outside the protective cover 21, and the gas suction pump 20 is equipped with a gas flow meter; the liquid working fluid recovery tank 10 is installed on the lower surface of the upper platform 23 of the test bench base and is connected to the opening of the liquid working fluid recovery tank 10; the lowest point of the liquid working fluid recovery tank 10 opposite to the opening of the liquid working fluid recovery tank has a liquid collection port, and there is a downward sloping bottom surface from the opening of the liquid working fluid recovery tank to the liquid collection port, and the liquid collection port is connected to the liquid working fluid suction pump 9 through a pipe; the liquid working fluid suction pump 9 is connected to an external waste liquid recovery container; the gas suction pump 20 and the liquid working fluid suction pump 9 are connected to the computer 12.

[0054] A macro high-speed camera and an infrared thermal imager are installed outside the protective cover 21 to visualize the flow field and temperature field distribution on the working surface of the chip cooling test piece.

[0055] Piping and electrical connections are as follows Figure 6 As shown, the working fluid nozzle is connected to the working fluid storage tank via a pipeline and an injection pump. The air extraction port on the top of the protective cover is connected to a gas suction pump with a gas flow meter via a pipeline. The liquid collection port of the liquid working fluid recovery tank is connected to the liquid working fluid suction pump via a pipeline. The heating element, thermoelectric sensor, and temperature acquisition module are connected to the power supply via power lines. The thermoelectric sensor is connected to the temperature acquisition module via a signal line. The temperature acquisition module is connected to the computer via a signal line. Figure 6 In the diagram, solid black lines represent pipe connections, and dashed blue lines represent electrical connections.

[0056] The implementation method of the chip cooling strategy test platform based on omnidirectional gravity attitude multi-mechanism coordination in this embodiment includes the following steps:

[0057] 1) Install the chip cooling test piece:

[0058] Open the protective cover 21 of the suction and safety module, prepare the chip cooling test piece to be tested, and clean and blow it.

[0059] Select the horizontal or vertical tilting clamping platform of the attitude adjustment module according to the test requirements. Install the thermoelectric sensor array on the pin wing support platform of the horizontal or vertical tilting clamping platform. Insert the thermoelectric sensor probe into the pin wing gap of the pin wing support platform. The wires flow into the overhead wire trough 5c through the guide hole 5a of the pin wing support platform, and then lead out from the overhead wire trough 5c. They pass through the hollow channel opened on the upper platform 23 of the test bench base and connect to the signal input terminal of the temperature acquisition module 13 on the lower platform 24 of the test bench base. The signal output terminal of the temperature acquisition module 13 is connected to the computer 12.

[0060] A heating element is installed at the top of the pin array 5b of the pin-fin support platform. A carbon fiber heating element is used. The wires of the heating element are led out from the periphery of the pin array 5b and connected to the power supply 14. The chip cooling test piece to be tested is installed on the heating element, and the back of the chip cooling test piece is fixed to the top of the pin array 5b with adhesive or mechanical fasteners. The thermoelectric sensor probe contacts the back of the chip cooling test piece and is not attached to the heating element.

[0061] 2) Adjust the working fluid nozzle 8:

[0062] Adjust the attitude adjustment module according to the required test parameters:

[0063] Horizontal tilting clamping platform 5: First, adjust the horizontal X-axis guide rail 6 to the desired position, then lock the slider on the horizontal X-axis guide rail 6; after fixing the X-axis coordinate, adjust the horizontal Y-axis guide rail 15 to the desired position, then lock the slider on the horizontal Y-axis guide rail 15; after fixing the Y-axis coordinate, adjust the tilt angle of the upper plate of the horizontal tilting clamping platform 5. After the tilt angle is adjusted, the attitude adjustment of the chip cooling test piece is complete; or...

[0064] Vertical tilting clamping platform 2: First, adjust the vertical Y-axis guide rail 1 to the desired position and then lock the slider on the vertical Y-axis guide rail 1; after fixing the Y-axis coordinate, adjust the vertical Z-axis guide rail 19 to the desired position and then lock the slider on the vertical Z-axis guide rail 19; after fixing the Z-axis coordinate, adjust the tilt angle of the upper plate of the vertical tilting clamping platform 2. After the tilt angle is adjusted, the attitude adjustment of the chip cooling test piece is completed.

[0065] Use the X-axis gantry rail 4 to adjust the X-axis position of the cooling execution module. After adjustment, lock the position of the slider on the X-axis gantry rail 4. After fixing the X-axis coordinate, adjust the Z-axis guide rail 16 of the gantry. After adjusting to the required position, lock the slider on the Z-axis guide rail 16 of the gantry. After fixing the Z-axis coordinate, adjust the position of the slider and the pitch angle on the Y-axis optical axis linear guide rail 3. After adjustment, lock the position of the slider on the Y-axis optical axis linear guide rail 3. Finally, use the adjusting arm 7 to fine-tune the attitude and angle of the working fluid nozzle 8 and fix it so that the working fluid nozzle faces the front of the chip cooling test piece according to the set attitude and angle.

[0066] 3) Cooling test:

[0067] Close the protective cover 21, and turn on the gas suction pump 20 and the liquid working fluid suction pump 9 as needed; turn on the heating element and temperature acquisition module 13, and turn on the injection pump 11 to conduct the test when the test platform is stable; during the test, the gas working fluid suction pump continuously and slowly pumps air, and the suction flow rate Q1 that maintains the negative pressure satisfies: Q1=0.03×Q, where Q is the suction flow rate of the suction pump, so that the protective cover is sealed with negative pressure during the test;

[0068] The working fluid nozzle 8 applies a liquid or gaseous working fluid with a set angle and a set flow state to the surface of the chip cooling test piece to cool the chip cooling test piece;

[0069] The thermoelectric sensor array measures the temperature of the chip cooling test piece surface, which is acquired by the temperature acquisition module 13 and transmitted to the computer 12.

[0070] 4) Test ends:

[0071] At the end of the test, the heating element and injection pump 11 are turned off first; the remaining liquid working fluid flows into the liquid working fluid recovery tank 10; the generated gaseous working fluid is isolated inside the protective cover 21; after the injection pump 11 is turned off, the gas suction pump 20 and the liquid working fluid suction pump 9 are kept running for a period of time, and the liquid working fluid flowing out of the liquid working fluid suction pump 9 is discharged or recovered according to the test requirements; the gaseous working fluid is discharged from the protective cover 21 through the gas suction pump 20 with a gas flow meter; then the gas suction pump 20 and the liquid working fluid suction pump 9 are turned off, and finally the protective cover 21 is opened for adjustment, disassembly and cleaning.

[0072] Finally, it should be noted that the purpose of disclosing the embodiments is to help further understand the present invention. However, those skilled in the art will understand that various substitutions and modifications are possible without departing from the spirit and scope of the present invention and the appended claims. Therefore, the present invention should not be limited to the content disclosed in the embodiments, and the scope of protection of the present invention is defined by the claims.

Claims

1. A omnidirectional gravity attitude multi-mechanism cooperative chip cooling strategy test platform, characterized in that, The testing platform includes: a pin-fin support platform, an attitude adjustment module, a cooling execution module, a data acquisition module, a suction and safety module, and a computer. The pin-fin support platform is mounted on the attitude adjustment module. The attitude adjustment module, cooling execution module, data acquisition module, and suction and safety module are each connected to the computer. A chip cooling test piece with heating elements attached to its surface is loaded onto the surface of the pin-fin support platform. The attitude adjustment module allows the chip cooling test piece to tilt freely around its horizontal axis from 0° to 180°, simulating the gravity vector direction of the chip cooling test piece in all three-dimensional spaces. The cooling execution module applies a liquid or gaseous working fluid with an arbitrary set angle and flow state to the surface of the chip cooling test piece to cool it. The pin-fin support platform, attitude adjustment module, and cooling execution module are fully enclosed within the suction and safety module, which provides the test negative pressure and collects the working fluid. The heat source application surface and the temperature measurement surface are coplanar. The data acquisition module measures the temperature of the chip cooling test piece surface and transmits the data to the computer.

2. The test platform of claim 1, wherein, It also includes a test bench base, which includes an upper platform and a lower platform fixedly connected by a frame. The upper platform has at least one opening for a liquid working fluid recovery tank and at least one hollow channel. The needle-fin support platform, attitude adjustment module, cooling execution module, data acquisition module and computer are mounted on the test bench base.

3. The test platform of claim 1, wherein, The pin-wing support platform includes: an overhead wire trough, a pin-wing array, and guide holes; wherein, a pin-wing array formed by multiple two-dimensionally arranged pins is arranged on the upper surface of the overhead wire trough, and the multi-point support plane formed by the tips of the pin-wing array supports the chip cooling test piece on which the heating element is attached; and guide holes are provided on the surface of the overhead wire trough where there are no pins.

4. The test platform of claim 3, wherein, The data acquisition module includes a thermoelectric sensor temperature measurement array and a temperature acquisition module. Multiple thermoelectric sensor probes are inserted into the gaps between the pins of the pin-fin support platform to form the thermoelectric sensor temperature measurement array. Each thermoelectric sensor probe contacts the back of the chip cooling test piece, and a heating element is attached to the back of the chip cooling test piece, making the heat source application surface and the temperature measurement surface coplanar. Wires connecting the thermoelectric sensor probes converge through guide holes into an overhead cable tray and connect to the temperature acquisition module. The temperature acquisition module is connected to a computer.

5. The test platform of claim 1, wherein, The attitude adjustment module includes a tilting clamping platform and a displacement stage. The tilting clamping platform is mounted on the displacement stage and is moved by the displacement stage. The tilting clamping platform includes an upper platform plate, a platform pivot, and a lower platform plate. The upper platform plate and the lower platform plate are connected by the platform pivot, which is horizontal. The upper platform plate can rotate around the platform pivot, which is equipped with fasteners.

6. The test platform of claim 5, wherein, The attitude adjustment module includes two sets of tilting clamping platforms and displacement stages, namely a horizontal tilting clamping platform and a horizontal displacement stage, and a vertical tilting clamping platform and a vertical displacement stage; wherein, the horizontal tilting clamping platform is mounted on the horizontal displacement stage, and the vertical tilting clamping platform is mounted on the vertical displacement stage; the lower plate of the horizontal tilting clamping platform is located on the horizontal plane, and the upper plate of the platform can rotate freely around the platform axis from 0° to 90°; the lower plate of the vertical tilting clamping platform is located on the vertical plane, and the upper plate of the platform can rotate freely around the platform axis from 90° to 180°.

7. The test platform of claim 1, wherein, The cooling execution module includes: at least one set of working fluid nozzles, an injection pump, and a multi-dimensional moving support; wherein, the working fluid nozzles are installed at the end of the multi-dimensional moving support; the inlet of the working fluid nozzles is connected to the injection pump through a flexible pipeline, and the outlet of the working fluid nozzles is installed with a nozzle form according to the test requirements; the injection pump is connected to an external working fluid storage tank through a pipeline.

8. The test platform of claim 7, wherein, The multidimensional mobile support is arranged in a gantry frame manner, including an X-axis gantry guide rail, a Z-axis gantry guide rail, a Y-axis optical axis linear guide rail, and an adjusting arm; wherein, the Z-axis gantry guide rail is installed on the X-axis gantry guide rail, the Y-axis optical axis linear guide rail is installed on the Z-axis gantry guide rail, the adjusting arm is installed on the Y-axis optical axis linear guide rail, the adjusting arm can rotate around the Y-axis optical axis linear guide rail, and the working fluid nozzle is installed on the adjusting arm through a universal rotary joint.

9. The test platform of claim 2, wherein, The suction and safety module includes: a protective cover, a gas suction pump, a liquid working fluid recovery tank, and a liquid working fluid suction pump; wherein, the needle-fin support platform, attitude adjustment module, and cooling execution module are housed inside the protective cover; the top of the protective cover has a suction port connected to the gas suction pump located outside the protective cover; the liquid working fluid recovery tank is installed on the lower surface of the upper platform of the test bench base and connected to the opening of the liquid working fluid recovery tank; the liquid working fluid recovery tank slopes downward from the opening to the lowest point and has a collection port, which is connected to the liquid working fluid suction pump; the liquid working fluid suction pump is connected to an external waste liquid recovery container.

10. The implementation method of the omnidirectional gravity attitude multi-mechanism coordinated chip cooling strategy test platform according to any one of claims 1-9, characterized in that, The implementation method includes the following steps: 1) Install the chip cooling test piece: Open the protective cover and prepare the chip cooling test piece to be tested; Select the horizontal or vertical tilting clamping platform for the attitude adjustment module; install the thermoelectric sensor array on the pin-wing support platform, insert the thermoelectric sensor probes into the gaps between the pin wings, and the wires are channeled into the overhead cable tray through the guide holes. A heating element is installed at the top of the needle-fin array; a cooling test piece for the chip under test is installed on the heating element; 2) Adjust the working fluid nozzle: The attitude adjustment module is adjusted to the set position by using a displacement stage, and then the tilt angle of the tilt clamping platform is adjusted to complete the attitude adjustment of the chip cooling test piece, simulating the direction of the gravity vector of the chip cooling test piece in any orientation in three-dimensional space. The position and pitch angle of the working fluid nozzle on the cooling execution module are adjusted by a multi-dimensional moving bracket, and the attitude and angle of the working fluid nozzle are finely adjusted by an adjusting arm. 3) Cooling test: Close the protective cover; turn on the heating element and temperature acquisition module, and start the injection pump to perform the test when the test platform is stable. The working medium nozzle applies liquid or gaseous working medium with any set angle and flow state to the surface of the chip cooling test piece to cool the chip cooling test piece; The thermoelectric sensor array measures the temperature of the surface of the chip cooling test piece, which is collected by the temperature collection module and transmitted to the computer; 4) Test end: First, turn off the heating element and the injection pump at the end of the test; keep the gas suction pump and the liquid working medium suction pump working, discharge or recycle the liquid working medium, and discharge the gaseous working medium from the protective cover; then turn off the gas suction pump and the liquid working medium suction pump.

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