Ssd burn-in test method, apparatus, storage medium, and electronic device

Abstract

This application provides an SSD aging test method, apparatus, storage medium, and electronic device. The method includes: determining target test parameters and target test standard parameters based on target requirement parameters. The target test parameters include: *a* target test processes and *a* sets of test environment configuration parameters corresponding to the *a* target test processes, where *a* is a positive integer; counting the number of SSD modules to be tested in the SSD aging apparatus to obtain *k* SSD modules to be tested; determining *x* aging boards corresponding to the *k* SSD modules to be tested; determining the electrical configuration parameters and program configuration parameters of the *x* aging boards based on the target test parameters to obtain *x* electrical configuration parameters and *x* program configuration parameters; configuring the parameters, testing the *k* SSD modules to be tested to obtain *k* test results; and determining *b* target SSD modules based on the *k* test results and the target test standard parameters, which can realize personalized SSD module recommendation services.

Description

Technical Field

[0001] This application relates to the field of chip testing technology, specifically to an SSD aging test method, apparatus, storage medium, and electronic device. Background Technology

[0002] In existing technologies, SSD aging tests can be understood as an industrial-grade testing method to accelerate the verification of SSD long-term stability. Typically, SSD aging tests involve simulating the actual usage stress of an SSD over several months or even years under set conditions (e.g., high temperature, high load, or long-term power-on environment) to expose potential problems (such as data retention failure, bad block surge, controller malfunction, etc.) in advance, thereby screening out unstable products and ensuring the reliability of SSDs after they leave the factory.

[0003] However, existing SSD aging tests are rather mechanical, especially in that they cannot recommend the most suitable SSD module for the personalized needs of the application (e.g., scenario requirements, environmental requirements, etc.).

[0004] Therefore, the problem of how to implement corresponding SSD aging tests for users' personalized needs and recommend personalized SSD modules urgently needs to be solved. Summary of the Invention

[0005] This application provides an SSD aging test method, apparatus, storage medium, and electronic device, which can perform corresponding SSD aging tests according to users' personalized needs and recommend personalized SSD modules.

[0006] In a first aspect, embodiments of this application provide an SSD aging test method applied to an SSD aging device, the SSD aging device comprising m aging boards, each aging board being used to perform aging tests on up to n SSD modules, where m and n are positive integers, the method comprising: Obtain the target requirement parameters, which include the expected operating environment requirements of the SSD module; Based on the target requirement parameters, target test parameters and target test standard parameters are determined. The target test parameters include: a target test processes and a sets of test environment configuration parameters corresponding to the a target test processes, where a is a positive integer. The number of SSD modules to be tested in the SSD aging device is counted to obtain k SSD modules to be tested, where k is a positive integer. Determine the aging boards corresponding to the k SSD modules to be tested, and obtain x aging boards, where x is a positive integer; Based on the target test parameters, determine the electrical configuration parameters and program configuration parameters of the x aging boards to obtain x electrical configuration parameters and x program configuration parameters; The x aging boards are configured according to the x electrical configuration parameters and the x program configuration parameters respectively. After the parameter configuration is completed, the k SSD modules to be tested are tested to obtain k test results. Based on the k test results and the target test standard parameters, b target SSD modules are determined.

[0007] Secondly, embodiments of this application provide an SSD aging test apparatus, applied to an SSD aging device. The SSD aging device includes m aging boards, each aging board being used to perform aging tests on up to n SSD modules, where m and n are positive integers. The SSD aging test apparatus includes: an acquisition unit and a processing unit, wherein... The acquisition unit is used to acquire target requirement parameters, which include the expected operating environment requirements parameters of the SSD module; The processing unit is configured to perform the following operations: Obtain the target requirement parameters, which include the expected operating environment requirements of the SSD module; Based on the target requirement parameters, target test parameters and target test standard parameters are determined. The target test parameters include: a target test processes and a sets of test environment configuration parameters corresponding to the a target test processes, where a is a positive integer. Test procedure, test duration, test temperature; The number of SSD modules to be tested in the SSD aging device is counted to obtain k SSD modules to be tested, where k is a positive integer. Determine the aging boards corresponding to the k SSD modules to be tested, and obtain x aging boards, where x is a positive integer; Based on the target test parameters, determine the electrical configuration parameters and program configuration parameters of the x aging boards to obtain x electrical configuration parameters and x program configuration parameters; The x aging boards are configured according to the x electrical configuration parameters and x program configuration parameters respectively. After the parameter configuration is completed, the k SSD modules to be tested are tested to obtain k test results. Based on the k test results and the target test standard parameters, b target SSD modules are determined.

[0008] Thirdly, embodiments of this application provide a computer-readable storage medium storing a computer program, wherein the computer program causes a computer to execute instructions for the steps of the method described in the first aspect.

[0009] Fourthly, embodiments of this application provide an electronic device, the electronic device including a processor and a memory, the memory being used to store one or more programs and configured to be executed by the processor, the programs including instructions for performing the steps of the method as described in the first aspect.

[0010] The embodiments of this application have the following beneficial effects: By implementing the SSD aging test method, apparatus, storage medium, and electronic device of this application, firstly, the corresponding test parameters and test standards are determined based on the expected operating environment requirements of the SSD modules. Then, the number of SSD modules to be tested and their corresponding aging boards are counted. Secondly, the aging boards and programs are configured in a personalized manner (by process and task level) based on the test parameters. Finally, SSD modules that meet the requirements are recommended based on the test results and test standards. The state of the aging board is adjusted to the optimal level, and the aging environment is guaranteed at the program level. This not only weakens the impact of the aging board itself, but also makes the aging environment more in line with the application scenario, ensuring the accuracy and authenticity of the test results. In this way, corresponding SSD aging tests can be implemented for users' personalized needs, and personalized SSD modules can be recommended. Attached Figure Description

[0011] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0012] Figure 1 This is a schematic diagram of the structure of an SSD aging device provided in an embodiment of this application; Figure 2 This is another structural schematic diagram of an SSD aging device provided in an embodiment of this application; Figure 3 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application; Figure 4 This is a flowchart illustrating an SSD aging test method provided in an embodiment of this application; Figure 5 This is a functional unit block diagram of an SSD aging test device provided in an embodiment of this application. Detailed Implementation

[0013] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present application.

[0014] The terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or apparatuses.

[0015] It should be understood that the term "and / or" in this document is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this document indicates that the preceding and following related objects are in an "or" relationship. In the embodiments of this application, "multiple" refers to two or more.

[0016] In the embodiments of this application, "at least one item" or its similar expression refers to any combination of these items, including any combination of a single item or a plurality of items. "One or more" means one or more, while "multiple" means two or more. For example, "at least one item" of a, b, or c can represent the following seven cases: a, b, c; a and b; a and c; b and c; a, b, and c. Each of a, b, and c can be an element or a set containing one or more elements.

[0017] Please see Figure 1 , Figure 1 This is a schematic diagram of an SSD aging device provided in an embodiment of this application. The SSD aging device includes m aging boards, a control module and a temperature control module. Each aging board is used to perform aging tests on up to n SSD modules, where m and n are positive integers.

[0018] The SSD aging device can include m aging boards, each aging board can include n aging stages, each aging stage can correspond to one SSD module, and each aging board can be used to perform aging tests on up to n SSD modules, where m and n are positive integers. The m aging boards, the control module, and the temperature control module are interconnected.

[0019] Among them, the SSD aging device may include an SSD solid-state drive aging cabinet.

[0020] The control module is essentially the "brain" of the SSD aging device, capable of sending test commands, controlling other modules, analyzing and pushing test results, and so on.

[0021] The temperature control module can be used to control the temperature to ensure accurate simulation of the test environment.

[0022] Among them, such as Figure 2 As shown, the SSD aging device can include m temperature control modules, with one temperature control module corresponding to each aging board. The temperature control modules can be integrated onto the aging board, or they can exist independently of the aging board, meaning each aging board can correspond to an independent aging test environment. The m aging boards, m control modules, and temperature control modules are interconnected.

[0023] Based on this SSD aging device, the following functions can be achieved: An SSD aging test apparatus, comprising m aging boards, each aging board being used to perform aging tests on up to n SSD modules, where m and n are positive integers, is described in the method comprising: Obtain the target requirement parameters, which include the expected operating environment requirements of the SSD module; Based on the target requirement parameters, target test parameters and target test standard parameters are determined. The target test parameters include: a target test processes and a sets of test environment configuration parameters corresponding to the a target test processes, where a is a positive integer. The number of SSD modules to be tested in the SSD aging device is counted to obtain k SSD modules to be tested, where k is a positive integer. Determine the aging boards corresponding to the k SSD modules to be tested, and obtain x aging boards, where x is a positive integer; Based on the target test parameters, determine the electrical configuration parameters and program configuration parameters of the x aging boards to obtain x electrical configuration parameters and x program configuration parameters; The x aging boards are configured according to the x electrical configuration parameters and the x program configuration parameters respectively. After the parameter configuration is completed, the k SSD modules to be tested are tested to obtain k test results. Based on the k test results and the target test standard parameters, b target SSD modules are determined.

[0024] By implementing the SSD aging device of this application embodiment, firstly, the corresponding test parameters and test standards are determined based on the expected working environment requirements of the SSD modules. Then, the number of SSD modules to be tested and their corresponding aging boards are counted. Secondly, the aging boards and programs are configured in a personalized manner (by process and task level) based on the test parameters. Finally, SSD modules that meet the requirements are recommended based on the test results and test standards. The state of the aging board is adjusted to the optimal level, and the aging environment is guaranteed at the program level. This not only weakens the impact of the "aging board" itself, but also makes the aging environment more in line with the application scenario, ensuring the accuracy and authenticity of the test results. In this way, corresponding SSD aging tests can be implemented for users' personalized needs, and personalized SSD modules can be recommended.

[0025] The following is combined Figure 3 The electronic device described in the embodiments of this application may include an SSD aging device. Figure 3 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. The electronic device includes one or more processors, a memory, a communication interface, and one or more programs. The processor is connected to the memory and the communication interface through an internal communication bus. The electronic device also includes m aging boards, each of which is used to perform aging tests on up to n SSD modules, where m and n are positive integers.

[0026] It is understood that the electronic device may include more or fewer structural elements than those shown in the above block diagram. For example, the electronic device may also include at least one of the following modules, such as a Bluetooth module, a sensor, a Wi-Fi module, a power module, physical buttons, a speaker, a display module, etc., without limitation.

[0027] The processor can be used for: Obtain the target requirement parameters, which include the expected operating environment requirements of the SSD module; Based on the target requirement parameters, target test parameters and target test standard parameters are determined. The target test parameters include: a target test processes and a sets of test environment configuration parameters corresponding to the a target test processes, where a is a positive integer. The number of SSD modules to be tested in the SSD aging device is counted to obtain k SSD modules to be tested, where k is a positive integer. Determine the aging boards corresponding to the k SSD modules to be tested, and obtain x aging boards, where x is a positive integer; Based on the target test parameters, determine the electrical configuration parameters and program configuration parameters of the x aging boards to obtain x electrical configuration parameters and x program configuration parameters; The x aging boards are configured according to the x electrical configuration parameters and the x program configuration parameters respectively. After the parameter configuration is completed, the k SSD modules to be tested are tested to obtain k test results. Based on the k test results and the target test standard parameters, b target SSD modules are determined.

[0028] The processor can be a central processing unit (CPU), an application-specific integrated circuit (ASIC), a general-purpose processor, a digital signal processor (DSP), a field-programmable gate array (FPGA), or other programmable logic devices, transistor logic devices, hardware components, or any combination thereof.

[0029] Furthermore, the processor can also implement or execute various exemplary logic blocks, units, and circuits described in conjunction with the disclosure of this application. Additionally, the processor can also be a combination of components implementing computational functions, such as a combination of one or more microprocessors, a combination of a DSP and a microprocessor, etc. Communication units can be communication interfaces, transceivers, transceiver circuits, etc., and storage units can be memory.

[0030] The one or more programs are stored in the aforementioned memory and configured to be executed by the aforementioned processor, and the one or more programs include instructions for performing any step in the above method embodiments.

[0031] The memory can be volatile or non-volatile, or may include both. The non-volatile memory can be a programmable read-only memory (PROM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM), an electrically erasable programmable read-only memory (EEPROM), or flash memory.

[0032] The volatile memory can be random access memory (RAM), which serves as an external cache. The above description is by way of example and not limitation; many forms of random access memory (RAM) are available, such as double data rate synchronous dynamic random access memory (DDR SDRAM), enhanced synchronous dynamic random access memory (ESDRAM), static RAM (SRAM), synchronous dynamic random access memory (SDRAM), dynamic random access memory (DRAM), synchronous linked dynamic random access memory (SLDRAM), and direct rambus RAM (DR RAM).

[0033] The following is combined Figure 4 This application describes an SSD aging test method as described in its embodiments. Figure 4 This is a flowchart illustrating an SSD aging test method provided in an embodiment of this application. The method is applied to an SSD aging device, which includes m aging boards. Each aging board is used to perform aging tests on up to n SSD modules, where m and n are positive integers. The SSD aging test method specifically includes the following steps: S401: Obtain target requirement parameters, including the expected operating environment requirements of the SSD module.

[0034] The expected operating environment requirements for the SSD module can include parameters such as application scenario, task planning parameters, and temperature parameters. Application scenarios can include any of the following: embedded applications, military applications, automotive applications, industrial control applications, etc. Application scenarios can also be defined by the user. Task planning parameters can include task level, number of task executions, task duration, and task program. The task level can correspond to the task difficulty (e.g., algorithm complexity, computational load, etc.). Temperature parameters can include temperature ranges.

[0035] For example, a user can state their desired SSD module requirements. Based on these requirements, target requirement parameters can be obtained. For instance, the system can receive a voice signal specifying the desired SSD module requirements, perform speech recognition on the voice signal, and obtain the target requirement parameters. Alternatively, the system can analyze the historical operation records of a reference chip to obtain relevant target requirement parameters. For example, it can extract corresponding tasks from the historical operation records of the reference chip, categorize these tasks into multiple categories, each with a task level, and statistically analyze the execution frequency, temperature range, task duration, task procedure, etc., for each task category. The target requirement parameters can be determined based on the statistical results. For example, the statistical results can be directly used as target requirement parameters, or, if the reference chip does not meet the user's expectations, the statistical results can be optimized, and the target requirement parameters can be determined based on the optimized statistical results. Furthermore, target requirement parameters can also be obtained by analyzing project requirements.

[0036] S402: Determine the target test parameters and target test standard parameters based on the target requirement parameters. The target test parameters include: a target test processes and a sets of test environment configuration parameters corresponding to the a target test processes, where a is a positive integer.

[0037] Here, 'a' target test processes can be understood as 'a' test phases or 'a' test program cases. Different test phases can correspond to different test environment configuration parameters. Test environment configuration parameters can include: hardware environment configuration parameters (such as processor size, memory size, number of cores, number of threads, number of processes, etc.), software environment configuration parameters (operating system, system version, bandwidth resources, cache resources, etc.), and physical environment configuration parameters (such as temperature, etc.).

[0038] The target test standard parameters may include the test index type and the corresponding rule conditions for the test index type (for example, a certain index needs to be greater than a threshold to be compliant, and if it is less than or equal to the threshold, the test is unqualified). Different test stages (test processes) will use different test indexes, and the corresponding rule conditions may also be different. Of course, different test stages (test processes) will use different test indexes, and the corresponding rule conditions are related to the temperature range and test stage.

[0039] S403: Count the number of SSD modules to be tested in the SSD aging device to obtain k SSD modules to be tested, where k is a positive integer.

[0040] In an SSD aging device, some aging boards can be used to house the SSD module under test, while other aging boards can be used to house other SSD modules. A single aging board can have some aging bays used to house the SSD module under test, or all aging bays can be used to house the SSD module under test.

[0041] The SSD modules under test can be of the same model and batch, thus enabling batch SSD aging tests. The identification information of the SSD modules under test can be used to uniquely identify the SSD modules.

[0042] In practice, the identification information (e.g., model, batch, etc.) of the SSD module to be tested can be obtained. Based on this identification information, the number of SSD modules to be tested in the SSD aging device can be counted to obtain k SSD modules to be tested, where k is a positive integer.

[0043] S404: Determine the aging boards corresponding to the k SSD modules to be tested, and obtain x aging boards, where x is a positive integer.

[0044] By tracing the k SSD modules under test using their identification or location information, we can obtain their corresponding aging boards, i.e., x aging boards, where x is a positive integer. Since one aging board may test multiple SSD modules under test, x and k can be the same or different, but x is less than or equal to k.

[0045] S405: Determine the electrical configuration parameters and program configuration parameters of the x aging boards based on the target test parameters to obtain x electrical configuration parameters and x program configuration parameters.

[0046] Among them, the aging board can be configured based on the target test parameters to adjust its state to the optimal level from the aging board level (the electrical configuration parameters of the aging board) and ensure the aging environment from the program level (the program configuration parameters of the aging board). This can not only reduce the impact of the "aging board" itself, but also make the aging environment more in line with the application scenario.

[0047] S406: Configure the parameters of the x aging boards according to the x electrical configuration parameters and the x program configuration parameters respectively. After the parameter configuration is completed, test the k SSD modules to be tested and obtain k test results.

[0048] First, x aging boards can be configured with x electrical configuration parameters and x program configuration parameters respectively. After the parameter configuration is completed, the k SSD modules to be tested are tested to obtain k test results. The state of the aging board is adjusted to the optimal level from the aging board level, and the aging environment is guaranteed from the program level. This not only reduces the impact of the "aging board" itself, but also makes the aging environment more in line with the application scenario, ensuring the accuracy and authenticity of the test results.

[0049] S407: Determine b target SSD modules based on the k test results and the target test standard parameters.

[0050] Where b is a positive integer less than or equal to k.

[0051] Specifically, k test results can be compared with target test standard parameters to identify whether the corresponding SSD module test meets the standard. The test results can also be sorted to achieve SSD module performance ranking, and then b target SSD modules that meet the requirements can be selected. In this way, corresponding SSD aging tests can be carried out according to the user's personalized needs, and personalized SSD modules can be recommended.

[0052] For example, in this embodiment of the application, an SSD aging device can be used to test 100 identical SSD modules. First, the corresponding test parameters and test standards are configured based on the requirements. Then, based on the structure and characteristics of the SSD aging device, the aging board and program are configured in a personalized manner (by process and task level) according to the test parameters to reduce the impact of the "aging board" itself and to make the aging environment more in line with the application scenario. While ensuring the fairness, impartiality and authenticity of the test, the SSD modules are ranked based on the test results and test standards, and SSD modules that meet the personalized requirements are recommended.

[0053] By implementing the SSD aging test method of this application embodiment, firstly, the corresponding test parameters and test standards are determined based on the expected working environment requirements of the SSD module. Then, the number of SSD modules to be tested and their corresponding aging boards are counted. Secondly, the aging boards and programs are configured in a personalized manner (by process and task level) based on the test parameters. Finally, based on the test results and test standards, SSD modules that meet the requirements are recommended. The state of the aging board is adjusted to the optimal level, and the aging environment is guaranteed at the program level. This not only weakens the impact of the "aging board" itself, but also makes the aging environment more in line with the application scenario, ensuring the accuracy and authenticity of the test results. In this way, corresponding SSD aging tests can be implemented for users' personalized needs, and personalized SSD modules can be recommended.

[0054] Optionally, the working environment requirement parameters include: a first application scenario, a first task planning parameter, and a first temperature parameter; the first task planning parameter includes *a* task levels and *a* task execution counts; the first temperature parameter includes *a* temperature ranges; the *a* task levels and the *a* task execution counts correspond to the *a* temperature ranges; the above steps, determining the target test parameters and target test standard parameters based on the target requirement parameters, can be implemented as follows: Determine the a target test processes based on the first application scenario; The target test standard parameters are determined based on the first application scenario, the a task levels, and the a temperature range; The configuration parameters of the test environment group a are determined based on the a task levels, the a target test processes, and the a task execution counts.

[0055] The working environment requirements parameters may include: a first application scenario, a first task planning parameter, and a first temperature parameter. The first task planning parameter may include a task levels and a task execution counts. The first temperature parameter may include a temperature ranges. The a task levels correspond to the a task execution counts, and the a task levels correspond to the a temperature ranges. That is, one task level corresponds to one task execution count and one temperature range. Different task levels can correspond to different tasks, i.e., program test cases (also known as test programs).

[0056] In practice, a mapping relationship between preset application scenarios and test processes can be stored in advance. Based on this mapping relationship, a target test processes corresponding to the first application scenario can be determined. These a target test processes can simulate the periodicity or working pattern of the SSD module in the first application scenario.

[0057] Then, the target test standard parameters are determined based on the first application scenario, a task level, and a temperature range. This allows for the configuration of corresponding test standards based on the application scenario, task level, and temperature range, making the subsequent test result analysis more consistent with the application scenario. This helps to select SSD modules that are highly compatible with the first application scenario, thus enabling "customized" SSD module services.

[0058] Correspondingly, a set of test environment configuration parameters can be determined based on a task level, a target test process, and a number of task executions. That is, the corresponding test environment configuration can be achieved based on the task level, test process, and corresponding number of executions, making the test environment closer to the actual environment faced by each test process. In turn, it helps to select SSD modules that are highly compatible with the first application scenario, so as to realize the "customized" service of SSD modules.

[0059] Optionally, the above steps, determining the target test standard parameters based on the first application scenario, the a task levels, and the a temperature ranges, can be implemented in the following manner: Based on the aforementioned a task levels, a mapping tables are obtained. Each mapping table is a mapping table between temperature range and test standard parameters, and each task level corresponds to one mapping table. Based on the a mapping tables, determine the a reference test standard parameters corresponding to the a temperature ranges; A first weight set is determined based on the first application scenario; the first weight set includes a weights, and the sum of the a weights is 1; The target test standard parameters are determined based on the first weight set and the a reference test standard parameters.

[0060] Among them, the task levels in the 'a' task levels can be the same or different, and the task level can be determined based on complexity or computational cost.

[0061] Different task levels correspond to different mapping tables. Each mapping table represents a temperature range and a test standard parameter. One mapping table is assigned to each task level, thus obtaining *a* mapping tables for *a* task levels. Then, based on these *a* mapping tables, *a* reference test standard parameters are determined for each *a* temperature range.

[0062] Correspondingly, a mapping relationship between preset application scenarios and weight sets can be stored in advance. Based on this mapping relationship, the first weight set corresponding to the first application scenario can be determined. The first weight set includes a weights, and the sum of the a weights is 1. Finally, the target test standard parameters can be determined based on the first weight set and a reference test standard parameters. That is, the corresponding test standards can be configured based on the application scenario, task level and temperature range, so that the subsequent test result analysis is more in line with the application scenario. This helps to screen out SSD modules that are deeply in line with the first application scenario, so as to realize the "customized" service of SSD modules.

[0063] The determination of the first weight set according to the first application scenario can also be implemented in the following way: For example, a mapping relationship between preset task levels and reference weights can be stored in advance. Based on the mapping relationship, a reference weights corresponding to a task levels can be determined. For example, the higher the task level, the larger the reference weight, and vice versa. Then, the sum of a reference weights is determined to obtain the total. The ratio between each of the a reference weights and the total is determined to obtain a weights. These a weights can be used as the first weight set.

[0064] Optionally, the above steps, determining the electrical configuration parameters and program configuration parameters of the x aging boards based on the target test parameters to obtain x electrical configuration parameters and x program configuration parameters, can be implemented in the following manner: Obtain the historical electrical configuration parameter set and historical operating status parameter set of the first aging board. The historical electrical configuration parameter set includes p groups of historical electrical configuration parameters, each group of historical electrical configuration parameters corresponding to a task level and a temperature range. The historical operating status parameter set includes p groups of historical operating status parameters. The first aging board is any one of the x aging boards. Determine the historical operating status parameters that match the first task level and the temperature range corresponding to the first task level to obtain q sets of historical operating status parameters; the first task level is any one of the a task levels. Obtain the q groups of historical electrical configuration parameters corresponding to the q groups of historical operating status parameters; Based on the q sets of historical operating status parameters, q evaluation values ​​are obtained; Select the maximum value among the q evaluation values, and obtain a set of target historical electrical configuration parameters corresponding to the maximum value from the q sets of historical electrical configuration parameters; The target historical electrical configuration parameters are used as the electrical configuration parameters corresponding to the first task level and the temperature range corresponding to the first task level. The corresponding program configuration parameters are determined based on the first task level and the number of times the first task is executed.

[0065] Where p and q are both positive integers.

[0066] Taking the first aging board as an example, which is any one of x aging boards, its historical electrical configuration parameter set and historical operating status parameter set can be obtained. The historical electrical configuration parameter set can include p groups of historical electrical configuration parameters, each group corresponding to a task level and a temperature range. The historical operating status parameter set includes p groups of historical operating status parameters, each corresponding to a task level and a temperature range. Each of the p groups of historical electrical configuration parameters can include at least one historical electrical configuration parameter, and each of the p groups of historical operating status parameters can include at least one historical operating status parameter. The historical electrical configuration parameter set and the historical operating status parameter set can correspond to each other.

[0067] Historical electrical configuration parameters may include at least one of the following: voltage, current, pin function configuration, power, mode, etc., without limitation. Historical operating status parameters may include at least one of the following: operating voltage / current stability, temperature control accuracy, operating frequency / load stability, aging process data recording integrity, etc., without limitation.

[0068] Among them, the stability of operating voltage / current can be understood as the continuous and stable voltage and current provided by the aging board. Its fluctuation range directly affects the consistency of aging stress. For example, if the voltage / current is unstable, it may lead to uneven aging and make it impossible to accurately assess the long-term reliability of the SSD.

[0069] Temperature control accuracy can be understood as the temperature control module of the aging board needing to maintain the set temperature (such as a high-temperature environment). Specifically, this can be the deviation between the actual temperature and the target temperature or the uniformity of the temperature field (to avoid local overheating or undercooling).

[0070] Among them, the operating frequency / load stability can be understood as follows: the aging test may involve continuous read and write operations, and the load mode (such as random read and write, sequential read and write ratio, etc.) and frequency stability provided by the aging board must meet the test standards.

[0071] The integrity of data recording during the aging process can be understood as the aging board's data acquisition module needing to record changes in key SSD performance indicators in real time, such as read / write speed degradation rate, error rate, power consumption changes, and the reliability of the test control logic. For example, the read / write speed degradation rate can be understood as the downward trend in SSD read / write performance over time, and its consistency can be analyzed through the data collected from the aging board. Similarly, the error rate can be specifically reflected by changes in the data transmission error rate during the aging process, indicating the degree of degradation of the storage medium. Power consumption changes can be seen as fluctuations in SSD power consumption during the aging process; abnormal power consumption may indicate an early failure risk. Furthermore, the reliability of the test control logic means that the aging board's test control module must ensure that the aging process (such as the number of cycles and duration) is executed according to preset parameters without interruption or abnormal termination; the accuracy and response speed of its control commands affect the effectiveness of the test.

[0072] Next, taking the first task level as an example, which is any one of the *a* task levels, since each set of historical electrical configuration parameters corresponds to a task level and a temperature range, we can determine the historical operating status parameters that match the first task level and the temperature range corresponding to it, obtaining *q* sets of historical operating status parameters. Then, we obtain the *q* sets of historical electrical configuration parameters corresponding to these *q* sets of historical operating status parameters. These operating status parameters can be used to evaluate the aging effect of the aging board, such as its performance. We can pre-store the mapping relationship between preset operating status parameters and evaluation values. For example, the larger the evaluation value, the better the aging effect of the aging board. Based on this mapping relationship, we can determine the evaluation values ​​corresponding to the *q* sets of historical operating status parameters, obtaining *q* evaluation values. Then, we select the maximum value among the *q* evaluation values ​​and obtain a set of target historical electrical configuration parameters corresponding to the maximum value from the *q* sets of historical electrical configuration parameters. Finally, we use these target historical electrical configuration parameters as the electrical configuration parameters corresponding to the first task level and the temperature range corresponding to it.

[0073] Correspondingly, the corresponding program configuration parameters can be determined based on the number of times the first task is executed according to the first task level. For each aging board, the optimal electrical and program configuration parameters can be dynamically determined by combining its historical working conditions, any test process (test phase), and temperature range. This means that the state of the aging board can be adjusted to the optimal level from the aging board level, and the aging environment can be guaranteed from the program level. This not only reduces the impact of the "aging board" itself, but also makes the aging environment more in line with the application scenario.

[0074] Optionally, the above steps, which determine the corresponding program configuration parameters based on the first task level and its corresponding number of first task executions, can be implemented in the following manner: The first program use case is determined based on the first task level and the first application scenario; Determine the target test environment configuration parameters corresponding to the first task level; Based on the first program test case, the target test environment configuration parameters, and the corresponding program configuration parameters for the number of times the first task is executed.

[0075] Specifically, corresponding program test cases can be configured based on task level and application scenario, and then the target test environment configuration parameters corresponding to the first task level can be obtained. Based on the first program test case, the target test environment configuration parameters, and the corresponding program configuration parameters for the first task execution count, the test program can be burned and the corresponding test environment can be configured. In this way, the aging environment can be guaranteed from the program level, and the aging environment can be made as consistent as possible with the application scenario.

[0076] Optionally, the above steps, determining b target SSD modules based on the k test results and the target test standard parameters, include: Based on the k test results and the target test standard parameters, determine k scoring values; Select the k rating values ​​that are greater than a preset threshold to obtain b rating values; Obtain the SSD modules corresponding to the b rating values ​​to obtain the b target SSD modules.

[0077] The preset threshold can be set in advance or set by system default.

[0078] Specifically, the target test standard parameters can include the test indicator types and corresponding rule conditions for each test process. Then, the indicator values ​​corresponding to the corresponding test indicator types can be selected from k test results. Based on the indicator values ​​and the corresponding rule conditions, k score values ​​can be determined. Then, the score values ​​greater than a preset threshold are selected from the k score values ​​to obtain b score values. Finally, the SSD modules corresponding to the b score values ​​can be obtained to obtain b target SSD modules. In this way, SSD modules that meet the requirements can be recommended based on the test results and test standards.

[0079] Optionally, the first test result includes *a* reference test results, each corresponding to a target test process; the first test result is any one of the *k* test results; the above steps, determining *k* scoring values ​​based on the *k* test results and the target test standard parameters, can be implemented as follows: Based on the a reference test results and the a reference test standard parameters, determine a reference score values; The score corresponding to the first test result is determined based on the first weight set and the a reference score values.

[0080] Specifically, a reference score can be determined based on a reference test results and a reference test standard parameters. For example, the degree of deviation between each reference test result and the reference test standard parameter can be determined, and a preset mapping relationship between the degree of deviation and the score can be stored in advance. Based on this mapping relationship, the reference score corresponding to each degree of deviation can be determined. For example, the corresponding test index type and rule conditions can be determined according to each of the a reference test standard parameters. Based on the test index type, the corresponding index value is selected from the corresponding reference test result. Based on the index value and rule conditions, the corresponding reference score is determined. For example, the index value can be at least one index value. Based on the rule conditions, the threshold corresponding to each index value can be determined. The at least one index value is compared with the corresponding threshold. Based on the comparison result, the corresponding degree of deviation is determined. Based on the degree of deviation, the corresponding score is determined. Then, these score values ​​are weighted and calculated to obtain the corresponding reference score.

[0081] Next, the score corresponding to the first test result is determined based on the first set of weights and a reference score values. That is, the a weights and a reference score values ​​are weighted and calculated to obtain the score corresponding to the first test result. In this way, SSD modules that meet the requirements can be recommended based on the test results and test standards.

[0082] Figure 5 This is a functional unit block diagram of an SSD aging test device 500 involved in the embodiments of this application. The SSD aging test device 500 is applied to an SSD aging device, which includes m aging boards, each aging board being used to perform aging tests on up to n SSD modules, where m and n are positive integers. The SSD aging test device 500 includes: an acquisition unit 510 and a processing unit 520, wherein... The acquisition unit 510 is used to acquire target requirement parameters, which include the expected operating environment requirements of the SSD module. The processing unit 520 is configured to perform the following operations: Based on the target requirement parameters, target test parameters and target test standard parameters are determined. The target test parameters include: a target test processes and a sets of test environment configuration parameters corresponding to the a target test processes, where a is a positive integer. Test procedure, test duration, test temperature; The number of SSD modules to be tested in the SSD aging device is counted to obtain k SSD modules to be tested, where k is a positive integer. Determine the aging boards corresponding to the k SSD modules to be tested, and obtain x aging boards, where x is a positive integer; Based on the target test parameters, determine the electrical configuration parameters and program configuration parameters of the x aging boards to obtain x electrical configuration parameters and x program configuration parameters; The x aging boards are configured according to the x electrical configuration parameters and the x program configuration parameters respectively. After the parameter configuration is completed, the k SSD modules to be tested are tested to obtain k test results. Based on the k test results and the target test standard parameters, b target SSD modules are determined.

[0083] It is understood that the functions of each program module of the SSD aging test device in this embodiment can be specifically implemented according to the methods in the above method embodiments. The specific implementation process can be referred to the relevant descriptions in the above method embodiments, which will not be repeated here.

[0084] This application also provides a computer-readable storage medium storing a computer program for electronic data interchange, which causes a computer to perform some or all of the steps of any of the methods described in the above method embodiments, wherein the computer includes an electronic device.

[0085] This application also provides a computer program product, which includes a non-transitory computer-readable storage medium storing a computer program operable to cause a computer to perform some or all of the steps of any of the methods described in the above method embodiments. The computer program product may be a software installation package, and the computer may include an electronic device.

[0086] It should be noted that, for the sake of simplicity, the above embodiments are all described as a series of actions. Those skilled in the art should understand that this application is not limited to the described order of actions, as some steps in the embodiments of this application can be performed in other orders or simultaneously. Furthermore, those skilled in the art should also understand that the embodiments described in the specification are preferred embodiments, and the actions, steps, modules, or units involved are not necessarily essential to the embodiments of this application.

[0087] In the above embodiments, the descriptions of each embodiment in this application have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0088] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. This program can be stored in a computer-readable storage medium, and when executed, it can include the processes described in the above method embodiments. The aforementioned storage medium includes various media capable of storing program code, such as ROM or random access memory (RAM), magnetic disks, or optical disks.

[0089] The steps of the methods or algorithms described in the embodiments of this application can be implemented in hardware or by a processor executing software instructions. The software instructions can consist of corresponding software modules, which can be stored in RAM, flash memory, ROM, EPROM, electrically erasable programmable read-only memory (EEPROM), registers, hard disk, portable hard disk, read-only optical disk (CD-ROM), or any other form of storage medium well known in the art. An exemplary storage medium is coupled to a processor, enabling the processor to read information from and write information to the storage medium. Of course, the storage medium can also be a component of the processor. The processor and storage medium can reside in an ASIC. Furthermore, the ASIC can reside in a terminal device or management device. Alternatively, the processor and storage medium can exist as discrete components in the terminal device or management device.

[0090] Those skilled in the art will recognize that, in one or more of the examples above, the functions described in the embodiments of this application can be implemented, in whole or in part, by software, hardware, firmware, or any combination thereof. When implemented in software, it can be implemented, in whole or in part, as a computer program product. This computer program product includes one or more computer instructions. When these computer program instructions are loaded and executed on a computer, all or part of the processes or functions described in the embodiments of this application are generated. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions can be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another. For example, the computer instructions can be transmitted from one website, computer, server, or data center to another via wired (e.g., coaxial cable, fiber optic, digital subscriber line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) means. The computer-readable storage medium can be any available medium accessible to a computer or a data storage device such as a server or data center that integrates one or more available media. The available media can be magnetic media (e.g., floppy disks, hard disks, magnetic tapes), optical media (e.g., digital video discs (DVDs)), or semiconductor media (e.g., solid-state disks (SSDs)).

[0091] The modules / units included in the various devices and products described in the above embodiments can be software modules / units, hardware modules / units, or a combination of both. For example, for devices and products applied to or integrated into a chip, all modules / units can be implemented using hardware methods such as circuits, or at least some modules / units can be implemented using software programs that run on a processor integrated within the chip, while the remaining (if any) modules / units can be implemented using hardware methods such as circuits. For devices and products applied to or integrated into a chip module, all modules / units can be implemented using hardware methods such as circuits. Different modules / units can be located in the same component (e.g., chip, circuit module, etc.) or different components of the chip module, or at least some modules / units can be implemented using hardware methods such as circuits. The implementation is achieved through a software program that runs on the processor integrated within the chip module. The remaining modules / units (if any) can be implemented using hardware methods such as circuits. For various devices and products applied to or integrated into terminal equipment, each of their modules / units can be implemented using hardware methods such as circuits. Different modules / units can be located in the same component (e.g., chip, circuit module, etc.) or different components within the terminal equipment. Alternatively, at least some modules / units can be implemented through a software program that runs on the processor integrated within the terminal equipment, while the remaining modules / units (if any) can be implemented using hardware methods such as circuits.

[0092] The specific embodiments described above further illustrate the purpose, technical solution, and beneficial effects of the embodiments of this application. It should be understood that the above descriptions are merely specific embodiments of the embodiments of this application and are not intended to limit the protection scope of the embodiments of this application. Any modifications, equivalent substitutions, improvements, etc., made on the basis of the technical solutions of the embodiments of this application should be included within the protection scope of the embodiments of this application.

Claims

1. An SSD aging test method, characterized in that, An SSD aging test apparatus, comprising m aging boards, each aging board being used to perform aging tests on up to n SSD modules, where m and n are positive integers, is described in the method comprising: Obtain the target requirement parameters, which include the expected operating environment requirements of the SSD module; Based on the target requirement parameters, target test parameters and target test standard parameters are determined. The target test parameters include: a target test processes and a sets of test environment configuration parameters corresponding to the a target test processes, where a is a positive integer. The number of SSD modules to be tested in the SSD aging device is counted to obtain k SSD modules to be tested, where k is a positive integer. Determine the aging boards corresponding to the k SSD modules to be tested, and obtain x aging boards, where x is a positive integer; Based on the target test parameters, determine the electrical configuration parameters and program configuration parameters of the x aging boards to obtain x electrical configuration parameters and x program configuration parameters; The x aging boards are configured according to the x electrical configuration parameters and the x program configuration parameters respectively. After the parameter configuration is completed, the k SSD modules to be tested are tested to obtain k test results. Based on the k test results and the target test standard parameters, b target SSD modules are determined.

2. The method as described in claim 1, characterized in that, The working environment requirements parameters include: a first application scenario, a first task planning parameter, and a first temperature parameter; the first task planning parameter includes a task levels and a task execution counts; the first temperature parameter includes a temperature ranges; the a task levels and the a task execution counts correspond to the a temperature ranges. The step of determining the target test parameters and target test standard parameters based on the target requirement parameters includes: Determine the a target test processes based on the first application scenario; The target test standard parameters are determined based on the first application scenario, the a task levels, and the a temperature range; The configuration parameters of the test environment group a are determined based on the a task levels, the a target test processes, and the a task execution counts.

3. The method as described in claim 2, characterized in that, The step of determining the target test standard parameters based on the first application scenario, the a task levels, and the a temperature ranges includes: Based on the aforementioned a task levels, a mapping tables are obtained. Each mapping table is a mapping table between temperature range and test standard parameters, and each task level corresponds to one mapping table. Based on the a mapping tables, determine the a reference test standard parameters corresponding to the a temperature ranges; A first weight set is determined based on the first application scenario; the first weight set includes a weights, and the sum of the a weights is 1; The target test standard parameters are determined based on the first weight set and the a reference test standard parameters.

4. The method as described in claim 2 or 3, characterized in that, The step of determining the electrical configuration parameters and program configuration parameters of the x aging boards based on the target test parameters, to obtain x electrical configuration parameters and x program configuration parameters, includes: Obtain the historical electrical configuration parameter set and historical operating status parameter set of the first aging board. The historical electrical configuration parameter set includes p groups of historical electrical configuration parameters, each group of historical electrical configuration parameters corresponding to a task level and a temperature range. The historical operating status parameter set includes p groups of historical operating status parameters. The first aging board is any one of the x aging boards. Determine the historical operating status parameters that match the first task level and the temperature range corresponding to the first task level to obtain q sets of historical operating status parameters; the first task level is any one of the a task levels. Obtain the q groups of historical electrical configuration parameters corresponding to the q groups of historical operating status parameters; Based on the q sets of historical operating status parameters, q evaluation values ​​are obtained; Select the maximum value among the q evaluation values, and obtain a set of target historical electrical configuration parameters corresponding to the maximum value from the q sets of historical electrical configuration parameters; The target historical electrical configuration parameters are used as the electrical configuration parameters corresponding to the first task level and the temperature range corresponding to the first task level. The corresponding program configuration parameters are determined based on the first task level and the number of times the first task is executed.

5. The method as described in claim 4, characterized in that, The step of determining the corresponding program configuration parameters based on the first task level and its corresponding number of first task executions includes: The first program use case is determined based on the first task level and the first application scenario; Determine the target test environment configuration parameters corresponding to the first task level; Based on the first program test case, the target test environment configuration parameters, and the corresponding program configuration parameters for the number of times the first task is executed.

6. The method as described in claim 3, characterized in that, The step of determining b target SSD modules based on the k test results and the target test standard parameters includes: Based on the k test results and the target test standard parameters, determine k scoring values; Select the k rating values ​​that are greater than a preset threshold to obtain b rating values; Obtain the SSD modules corresponding to the b rating values ​​to obtain the b target SSD modules.

7. The method as described in claim 6, characterized in that, The first test result includes a reference test results, each reference test result corresponding to a target test process; the first test result is any one of the k test results. The process of determining k scoring values ​​based on the k test results and the target test standard parameters includes: Based on the a reference test results and the a reference test standard parameters, determine the a reference score values ​​corresponding to the first test result; The score corresponding to the first test result is determined based on the first weight set and the a reference score values.

8. An SSD aging test device, characterized in that, This invention relates to an SSD aging test apparatus, comprising m aging boards, each used to perform aging tests on up to n SSD modules, where m and n are positive integers. The apparatus includes an acquisition unit and a processing unit. The acquisition unit is used to acquire target requirement parameters, which include the expected operating environment requirements parameters of the SSD module; The processing unit is configured to perform the following operations: Obtain the target requirement parameters, which include the expected operating environment requirements of the SSD module; Based on the target requirement parameters, target test parameters and target test standard parameters are determined. The target test parameters include: a target test processes and a sets of test environment configuration parameters corresponding to the a target test processes, where a is a positive integer. Test procedure, test duration, test temperature; The number of SSD modules to be tested in the SSD aging device is counted to obtain k SSD modules to be tested, where k is a positive integer. Determine the aging boards corresponding to the k SSD modules to be tested, and obtain x aging boards, where x is a positive integer; Based on the target test parameters, determine the electrical configuration parameters and program configuration parameters of the x aging boards to obtain x electrical configuration parameters and x program configuration parameters; The x aging boards are configured according to the x electrical configuration parameters and x program configuration parameters respectively. After the parameter configuration is completed, the k SSD modules to be tested are tested to obtain k test results. Based on the k test results and the target test standard parameters, b target SSD modules are determined.

9. A computer-readable storage medium, characterized in that, A computer program is stored, wherein the computer program causes the computer to perform the method as described in any one of claims 1-7.

10. An electronic device, characterized in that, The electronic device includes a processor and a memory for storing one or more programs and configured to be executed by the processor, the programs including instructions for performing the steps of the method as described in any one of claims 1-7.

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