A totally-enclosed quiet phase-change temperature control power distribution cabinet

Abstract

A fully enclosed, silent phase-change temperature-controlled power distribution cabinet includes a cabinet, heat dissipation plates, and radiators. Each heat dissipation plate includes a frame and heat dissipation pipes fixed inside the frame. The heat dissipation pipes are connected to the radiator via connecting pipes. Both the radiator and the heat dissipation pipes are filled with a phase-change medium. The phase-change medium circulates between each heat dissipation pipe and the radiator, forming a closed loop and transferring heat from the cabinet to the radiator. This invention eliminates the operating noise and dust / moisture intrusion problems caused by existing fan cooling by setting a fully enclosed cabinet structure and a built-in phase-change temperature control system. It achieves efficient heat dissipation of the power distribution cabinet under silent, dustproof, and moisture-proof conditions. The heat dissipation plates and radiators achieve rapid heat collection and transfer through a parallel phase-change medium loop. Combined with phase-change material filling and external water cooling assistance, the heat dissipation efficiency and temperature uniformity are improved.

Description

Technical Field

[0001] This invention belongs to the field of power distribution cabinet technology, specifically referring to a fully enclosed silent phase change temperature control power distribution cabinet. Background Technology

[0002] Distribution cabinets are key equipment in power systems used to distribute, control, and protect electrical energy. Their internal components generate heat during operation. If heat dissipation is insufficient, the temperature inside the cabinet will continue to rise, accelerating the aging of components, causing a decline in insulation performance, malfunctions, or even fires. Therefore, effective heat dissipation is crucial to ensuring system stability and safety.

[0003] Currently, the mainstream heat dissipation method is to actively exhaust air by installing fans to ensure that the cabinet is within a suitable operating temperature range. However, installing cooling fans will generate operating noise, and the open cabinet is prone to dust and moisture entering, reducing the protection level and the lifespan of components. Therefore, how to isolate external pollution and achieve silent operation can not only provide stable and reliable temperature control, but also improve the long-term reliability of the system in harsh environments. Summary of the Invention

[0004] In view of the above situation and to overcome the defects of the prior art, the purpose of the present invention is to provide a fully enclosed silent phase change temperature control distribution cabinet, so as to at least partially solve the problems mentioned in the background art.

[0005] The technical solution adopted in this invention is as follows: A fully enclosed, silent phase-change temperature control distribution cabinet is proposed, comprising: The cabinet, including the rectangular frame structure; Multiple heat dissipation plates are spliced ​​together and installed on the frame body; A heat sink is installed on top of the frame. Each heat sink includes a frame and a heat sink pipe fixed inside the frame. Each heat sink pipe has an inlet port and an outlet port at both ends, which are connected to the radiator via connecting pipes. This allows multiple heat sink pipes and the radiator to form a parallel structure. Both the radiator and the heat sink pipes are filled with a phase change medium. The phase change medium circulates between each heat sink pipe and the radiator to form a closed loop, transferring heat from the cabinet to the radiator.

[0006] Furthermore, the heat sink includes a first heat sink, a second heat sink disposed inside the frame body, and a third heat sink disposed outside the frame body. The first heat sink is arranged horizontally, the second heat sink is arranged vertically, and the first heat sink and the second heat sink are separated to form a plurality of mounting compartments for accommodating electrical components. The electrical components in each mounting compartment are at least partially in contact with the first heat sink or the second heat sink.

[0007] Furthermore, the heat sink is constructed as a rectangular plate with mounting holes at its corners. These mounting holes are used to install positioning components to fix the heat sink onto the frame. The surface of the heat sink has multiple mounting holes arranged in a matrix. The electrical components are fixed to the heat sink by the cooperation of the positioning components with the mounting holes.

[0008] Furthermore, the plate frame includes a hollow metal plate, the heat dissipation pipe includes a copper pipe, the heat dissipation pipe is filled in the interior of the plate frame in a serpentine bend, and the phase change medium filled inside the heat dissipation pipe and the heat sink includes deionized water.

[0009] Furthermore, the interior of the plate frame is provided with a plurality of mounting columns arranged in a matrix, the interior of the mounting columns having mounting holes that penetrate the plate frame, and the interior of the plate frame is filled with thermally conductive filler.

[0010] Furthermore, the thermally conductive filler includes a composite filler of paraffin wax and expanded graphite, and the phase transition temperature of the composite filler of paraffin wax and expanded graphite is set at 40~80℃.

[0011] Furthermore, the radiator includes a heat sink, and the interior of the heat sink is provided with a medium cavity for containing the phase change medium. The volume of the medium cavity is greater than the sum of the liquid volume of the heat sink pipe and the liquid volume of the phase change medium in the heat sink.

[0012] Furthermore, the heat sink is provided with heat-conducting fins on both the upper and lower sides, and the heat-conducting fins are fixed to the outer surface of the heat sink.

[0013] Furthermore, it also includes a water tank, which is fitted outside the radiator so that the radiator is inside the water tank. The water tank is provided with an inlet and an outlet. The water tank is connected to an external water pumping device to circulate water into the water tank.

[0014] Furthermore, the water tank is provided with multiple sets of water inlets and drain outlets, each set of water inlets and drain outlets is arranged along the guiding direction of the heat-conducting fins, and multiple sets of water inlets and drain outlets are arranged in parallel. Beneficial effects: This invention eliminates the operating noise and dust / moisture intrusion problems caused by existing fan cooling by setting up a fully enclosed cabinet structure and a built-in phase change temperature control system, achieving efficient heat dissipation of the power distribution cabinet under quiet, dustproof, and moisture-proof conditions. The heat dissipation plate and radiator achieve rapid heat collection and transfer through a parallel phase change medium circuit. Combined with phase change material filling and external water cooling assistance, the heat dissipation efficiency and temperature uniformity are improved, and the service life of the electrical components inside the power distribution cabinet is extended. It is suitable for places with high noise sensitivity or high environmental cleanliness requirements. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural diagram of a fully enclosed silent phase change temperature control distribution cabinet proposed in an embodiment of the present invention; Figure 2 This is a schematic diagram of the internal structure of a fully enclosed silent phase change temperature control distribution cabinet according to an embodiment of the present invention; Figure 3 A schematic diagram of the heat sink structure is provided for an embodiment of the present invention; Figure 4 A three-dimensional structural diagram of the internal structure of the heat sink is provided for an embodiment of the present invention; Figure 5 A schematic diagram of the internal structure of the heat sink is provided for an embodiment of the present invention.

[0016] Among them, 10 is the cabinet; 100 is the installation compartment; 11 is the frame; 20 is the heat sink; 200 is the mounting hole; 201 is the first heat sink; 202 is the second heat sink; 203 is the third heat sink; 21 is the plate frame; 210 is the assembly hole; 22 is the heat pipe; 221 is the inlet port; 222 is the outlet port; 23 is the mounting column; 24 is the thermally conductive filler; 30 is the radiator; 300 is the medium cavity; 31 is the heat dissipation box; 32 is the thermally conductive fins; and 40 is the water tank.

[0017] The accompanying drawings are provided to further understand the embodiments and form part of the specification. They are used together with the embodiments for explanation and do not constitute a limitation on the embodiments. Detailed Implementation

[0018] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection.

[0019] In the description of the embodiments, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing the embodiments and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments.

[0020] This invention provides a fully enclosed, silent phase-change temperature control power distribution cabinet, which aims to achieve heat dissipation of the power distribution cabinet under fully enclosed and silent conditions, and ensure that the operating temperature of the power distribution cabinet is within a reasonable range. The power distribution cabinet mainly includes a cabinet body 10, a heat dissipation plate 20 and a heat sink 30.

[0021] The cabinet 10 includes a rectangular frame 11, which is formed by welding or bolting profiles to form the supporting skeleton of the distribution cabinet. Multiple heat dissipation plates 20 are spliced ​​together and installed on the frame 11, and the heat sink 30 is installed on the top of the frame 11.

[0022] In some embodiments, the heat sink 20 is constructed as a rectangular plate with mounting holes 210 at its corners. The mounting holes 210 are used to install positioning components to fix the heat sink 20 to the frame 11. The rectangular plate structure facilitates standardized production and assembly. The mounting holes 210 at the corners correspond to the threaded holes or profile slots on the frame 11. Fast and secure installation and disassembly are achieved by bolts. Multiple heat sinks 20 are aligned with the corresponding mounting points on the frame 11 through their mounting holes 210 at their corners, and are spliced ​​together and fixed to the frame 11 by bolts and other positioning components to form the main load-bearing and heat dissipation structure inside the cabinet 10.

[0023] The radiator 30 is installed on the top of the frame 11 by means of a bracket or direct bolt connection, and is located at the highest position of the cabinet 10, which facilitates the upward gathering of heat and its dissipation into the surrounding air or external cooling system through its outer surface.

[0024] Thus, the fully enclosed design of the cabinet 10 completely prevents the intrusion of dust and moisture, while the integration of the heat dissipation plate 20 and the radiator 30 forms a silent heat dissipation core, realizing a silent thermal management system from internal heat generation to external heat dissipation.

[0025] Furthermore, each heat sink 20 includes a frame 21 and a heat sink 22 fixed inside the frame 21. Each heat sink 22 has an inlet port 221 and an outlet port 222 at both ends, which pass through the frame 21. Both the inlet port 221 and the outlet port 222 can be connected to the radiator 30 through connecting pipes, so that multiple heat sinks 22 and the radiator 30 form a parallel structure. Both the radiator 30 and the heat sink 22 are filled with a phase change medium. The phase change medium circulates between each heat sink 22 and the radiator 30 to form a closed loop and transfers the heat in the cabinet 10 to the radiator 30.

[0026] In some embodiments, the heat sink 22 is embedded inside the plate frame 21, so that it is in close contact with the plate to increase the heat conduction area. When the electrical component heats up, the heat is first conducted to the plate frame 21, and then heats the heat sink 22 inside it and the phase change medium inside the pipe (e.g., deionized water in this embodiment). After being heated, the medium undergoes natural convection or slight phase change (e.g., local vaporization) inside the pipe. The density change drives the phase change medium to flow from the inlet port 221 to the outlet port 222.

[0027] Furthermore, the heat dissipation pipes 22 of all heat dissipation plates 20 are connected to the top heat sink 30 through parallel pipes to form multiple independent circulation branches. Connecting the heat sink 30 in parallel can reduce the flow resistance of the phase change medium. Even if the flow rate of individual branches changes, it will not affect the overall circulation, and make the temperature of each heat dissipation plate 20 more uniform.

[0028] like Figure 1 and Figure 2 As shown, the heat sink 20 includes a first heat sink 201 and a second heat sink 202 disposed inside the frame 11 and a third heat sink 203 disposed outside the frame 11. The first heat sink 201 is arranged horizontally and the second heat sink 202 is arranged vertically. The first heat sink 201 and the second heat sink 202 are separated to form a plurality of mounting compartments 100 for accommodating electrical components, and the electrical components in each mounting compartment 100 are at least partially in contact with the first heat sink 201 or the second heat sink 202.

[0029] The first heat sink 201 serves as a horizontal partition, which can divide the internal space of the cabinet into layers. The second heat sink 202 serves as a vertical partition, which can divide each layer into independent installation compartments. This not only optimizes the space utilization and facilitates the modular installation and maintenance of components, but also allows each electrical component to be in close contact with the surface of the heat sink 20 or through a thermal pad, so that heat can be directly conducted from the component to the heat sink 20, avoiding the formation of local hot spots in the enclosed space.

[0030] Furthermore, the third heat dissipation plate 203 located on the outside of the frame 11 can further dissipate some of the heat generated inside the cabinet 10 directly to the outside through the cabinet wall, forming an auxiliary heat dissipation surface and enhancing the overall heat dissipation capacity. All the frame bodies 21 are connected in parallel through the internal heat dissipation pipes 22, forming a distributed heat collection module.

[0031] like Figure 3 , Figure 4 and Figure 5As shown, the surface of the heat sink 20 is provided with a plurality of mounting holes 200 arranged in a matrix. Electrical components are fixed to the heat sink 20 by the cooperation of the positioning parts with the mounting holes 200. The matrix-arranged mounting holes 200 on the surface provide flexible mounting points for electrical components of various sizes and shapes (such as circuit breakers, contactors, PLCs, etc.). Users can select appropriate hole positions for fixing as needed to ensure that the component base plate is in close contact with the surface of the heat sink 20 to improve heat conduction efficiency.

[0032] like Figure 4 and Figure 5 As shown, the plate frame 21 includes a hollow metal plate, the heat dissipation pipe 22 includes a copper pipe, the heat dissipation pipe 22 is filled in the interior of the plate frame 21 in a serpentine bend, and the phase change medium filled inside the heat dissipation pipe 22 and the heat sink 30 includes deionized water.

[0033] In some embodiments, the hollow metal plate may be made of aluminum or steel, so that the plate frame 21 itself has good structural strength and a certain thermal conductivity. The copper heat dissipation pipe 22 embedded therein is bent into a serpentine shape due to its excellent thermal conductivity, so as to increase its pipe length and coverage area inside the plate frame 21, thereby capturing the heat conducted by the plate more efficiently.

[0034] In this embodiment, deionized water is used as the phase change medium, which has the advantages of high specific heat capacity, non-toxicity, low cost and high latent heat of phase change. Within the normal operating temperature range, it mainly relies on liquid convection for heat transfer. When a local overheated area may vaporize, the latent heat of vaporization is used to remove a large amount of heat, further enhancing the heat dissipation capacity. In addition, deionized water can also prevent scaling and corrosion inside the pipeline, ensuring the long-term stable operation of the circulation system.

[0035] Furthermore, the interior of the plate frame 21 is provided with a plurality of mounting posts 23 arranged in a matrix, the interior of the mounting posts 23 having mounting holes 200 that penetrate the plate frame 21, and the interior of the plate frame 21 is filled with thermally conductive filler 24.

[0036] In some embodiments, the mounting post 23 is a protruding structure integrally formed or welded inside the plate frame 21. Its interior has mounting holes 200 on the plate surface, which can be used to fix electrical components. Bolts can pass through the entire thickness of the plate and provide stronger support through the mounting post 23 to prevent the plate from deforming due to component weight or vibration.

[0037] Furthermore, the cavity inside the frame 21, except for the heat dissipation pipe 22, is filled with thermally conductive filler 24. This filler tightly wraps around the heat dissipation pipe 22 and the mounting post 23, which can transfer the heat absorbed by the plate to the heat dissipation pipe 22 more evenly and quickly, thereby reducing thermal resistance and strengthening the structure.

[0038] In some embodiments, the thermally conductive filler 24 includes a paraffin and expanded graphite composite filler, and the phase transition temperature of the paraffin and expanded graphite composite filler is set at 40~80°C.

[0039] Thus, using paraffin wax and expanded graphite composite filler as phase change material, a solid / liquid phase change will occur within the set temperature range of 40~80℃. During this process, a large amount of latent heat is absorbed and stored, effectively buffering temperature fluctuations. Expanded graphite, as a porous support skeleton and thermal conductivity enhancer, on the one hand, prevents paraffin wax from flowing after melting and maintains shape stability, and on the other hand, its high thermal conductivity network significantly improves the overall thermal conductivity of the composite material, accelerating the transfer of heat from the plate to the heat dissipation pipe 22.

[0040] The composite filler enables the heat sink 20 to not only have active heat transfer function, but also passive heat storage and temperature equalization performance. When the heat inside the cabinet increases suddenly, it can absorb excess heat and slow down the temperature rise. When the heat load decreases, the stored heat can be released slowly, which helps to maintain the temperature inside the cabinet.

[0041] like Figure 1 and Figure 2 As shown, the radiator 30 includes a heat sink 31, and the interior of the heat sink 31 is provided with a medium cavity 300 for containing the phase change medium. The volume of the medium cavity 300 is greater than the sum of the liquid volume of the heat sink 22 and the phase change medium in the heat sink 31.

[0042] In some embodiments, the heat sink 31 may adopt a flat box structure, with an internal cavity forming a medium cavity 300. The volume of this cavity is configured to ensure that even if some liquid medium vaporizes at the system's highest operating temperature, the gaseous medium has sufficient expansion space to prevent excessive system pressure and ensure safety. The larger cavity volume also serves to separate the gas and liquid phases, facilitating the reflux of condensed liquid. Furthermore, as the final heat release node in the entire circulation loop, the heat sink 31 is located at the top of the cabinet, conforming to the principle of hot air rising and promoting natural convection heat dissipation.

[0043] Furthermore, heat dissipation box 31 is provided with heat-conducting fins 32 on both the upper and lower sides, and the heat-conducting fins 32 are fixed to the outer surface of heat dissipation box 31.

[0044] In some embodiments, the heat-conducting fins 32 are welded or embedded on the upper and lower surfaces of the heat sink 31, which can increase the contact area between the heat sink 31 and the air. The upper and lower heat-conducting fins 32 mainly dissipate heat into the air above through convection and radiation.

[0045] In other embodiments, a water tank 40 is also included. The water tank 40 is fitted outside the radiator 30, so that the radiator 30 is inside the water tank 40. The water tank 40 is provided with an inlet and an outlet. The water tank 40 is connected to an external water pumping device to circulate water into the water tank 40.

[0046] Furthermore, the water tank 40 is provided with multiple sets of water inlets and drain outlets. Each set of water inlets and drain outlets is arranged along the guiding direction of the heat-conducting fins 32, and multiple sets of water inlets and drain outlets are arranged in parallel. In this way, the heat exchange rate between the cooling water and the radiator 30 can be accelerated.

[0047] When the distribution cabinet is used in a high heat load environment or requires more precise temperature control, a water tank 40 can be added. The water tank 40 covers the radiator 30 and flows cooling water (usually pure water) into it. The cooling water enters through the water inlet and surrounds the heat dissipation box 31 with heat-conducting fins 32. Through efficient heat exchange, the heat carried by the phase change medium in the medium cavity 300 is quickly removed and then flows out from the water outlet. After being cooled by an external cooling device (such as a cooling tower or chiller unit), it is pumped back in.

[0048] In this way, the external cooling device provides stronger heat dissipation capacity, enabling the power distribution cabinet to adapt to a wide range of applications from low-power, quiet environments to high-power, dense scenarios. Moreover, the operating noise of the external water pump is isolated outside the room, and the power distribution cabinet can still maintain a quiet or low noise level during operation.

[0049] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0050] The above description of the embodiments is not restrictive, and the accompanying drawings are only one embodiment; the actual structure is not limited to this. In short, if a person skilled in the art, inspired by this description, designs a similar structure and embodiment without departing from the inventive spirit, such design should fall within the scope of protection.

Claims

1. A fully enclosed, silent phase-change temperature control distribution cabinet, characterized in that, include: The cabinet (10) includes a rectangular frame (11). Multiple heat sinks (20) are spliced ​​together and installed on the frame (11); A radiator (30) is installed on top of the frame body (11); Each heat sink (20) includes a frame (21) and a heat sink pipe (22) fixed inside the frame (21). Each heat sink pipe (22) has an inlet port (221) and an outlet port (222) through the frame (21) at both ends. The inlet port (221) and the outlet port (222) can be connected to the radiator (30) through connecting pipes, so that multiple heat sink pipes (22) and the radiator (30) form a parallel structure. The radiator (30) and the heat sink pipe (22) are filled with a phase change medium. The phase change medium circulates between each heat sink pipe (22) and the radiator (30) to form a closed loop and transfers the heat in the cabinet (10) to the radiator (30).

2. The fully enclosed silent phase change temperature control distribution cabinet according to claim 1, characterized in that: The heat sink (20) includes a first heat sink (201) and a second heat sink (202) disposed inside the frame (11) and a third heat sink (203) disposed outside the frame (11). The first heat sink (201) is arranged horizontally and the second heat sink (202) is arranged vertically. The first heat sink (201) and the second heat sink (202) are separated to form a plurality of mounting compartments (100) for accommodating electrical components. The electrical components in each mounting compartment (100) are at least partially in contact with the first heat sink (201) or the second heat sink (202).

3. The fully enclosed silent phase change temperature control distribution cabinet according to claim 2, characterized in that: The heat sink (20) is constructed as a rectangular plate. The heat sink (20) has mounting holes (210) at its corners. The mounting holes (210) are used to install positioning parts to fix the heat sink (20) on the frame (11). The surface of the heat sink (20) has multiple mounting holes (200) arranged in a matrix. The electrical components are fixed to the heat sink (20) by the cooperation of the positioning parts with the mounting holes (200).

4. The fully enclosed silent phase change temperature control distribution cabinet according to claim 1, characterized in that: The plate frame (21) includes a hollow metal plate, the heat dissipation pipe (22) includes a copper pipe, the heat dissipation pipe (22) is filled in the interior of the plate frame (21) in a serpentine bend, and the phase change medium filled inside the heat dissipation pipe (22) and the radiator (30) includes deionized water.

5. The fully enclosed silent phase change temperature control distribution cabinet according to claim 3, characterized in that: The interior of the plate frame (21) is provided with a plurality of mounting posts (23) arranged in a matrix. The interior of the mounting posts (23) has mounting holes (200) that penetrate the plate frame (21). The interior of the plate frame (21) is filled with thermally conductive filler (24).

6. The fully enclosed silent phase change temperature control distribution cabinet according to claim 5, characterized in that: The thermally conductive filler (24) includes a paraffin wax and expanded graphite composite filler, and the phase transition temperature of the paraffin wax and expanded graphite composite filler is set at 40~80℃.

7. The fully enclosed silent phase change temperature control distribution cabinet according to claim 1, characterized in that: The radiator (30) includes a heat sink (31), and the interior of the heat sink (31) is provided with a medium cavity (300) for containing the phase change medium. The volume of the medium cavity (300) is greater than the sum of the liquid volume of the phase change medium in the heat sink (22) and the heat sink (31).

8. The fully enclosed silent phase change temperature control distribution cabinet according to claim 7, characterized in that: The heat sink (31) is provided with heat-conducting fins (32) on both the upper and lower sides, and the heat-conducting fins (32) are fixed to the outer surface of the heat sink (31).

9. The fully enclosed silent phase change temperature control distribution cabinet according to claim 8, characterized in that: It also includes a water tank (40), which is fitted outside the radiator (30) so that the radiator (30) is inside the water tank (40). The water tank (40) is provided with an inlet and an outlet. The water tank (40) is connected to an external water pumping device to circulate water into the water tank (40).

10. The fully enclosed silent phase change temperature control distribution cabinet according to claim 9, characterized in that: The water tank (40) is provided with multiple sets of water inlets and drain outlets. Each set of water inlets and drain outlets is arranged along the guiding direction of the heat-conducting fins (32), and multiple sets of water inlets and drain outlets are arranged in parallel.

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