A wafer wireless charging device, system and control method

Abstract

This invention provides a wireless charging device, system, and control method for wafers. The device includes: a carrier disk 10 for carrying at least one wafer W; at least one receiving coil 20 disposed within the carrier disk 10 and corresponding to the position of the wafer W, for receiving electromagnetic energy and outputting alternating current; a rectifier circuit 30 connected to the receiving coil 20 for converting the alternating current into direct current to charge energy storage elements on the wafer W; and a position detection unit 40 for detecting the relative position of the wafer W and the receiving coil 20, and initiating charging when the wafer W and the receiving coil 20 are aligned. This invention also provides a wireless charging system including a transmitter and a receiver, and its control method. Through this invention, non-contact wireless charging of wafers can be achieved during wafer manufacturing and testing, avoiding contamination and damage caused by physical contact, and improving the yield and efficiency of wafer manufacturing and testing.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing and testing technology, and specifically to a device, system, and control method for wirelessly charging wafers during wafer manufacturing and testing. Background Technology

[0002] In semiconductor manufacturing, wafers undergo multiple process steps, such as deposition, photolithography, etching, and ion implantation, typically performed within a sealed process chamber. Simultaneously, during or after manufacturing, wafers require electrical testing and functional verification within the process chamber or on dedicated testing equipment. With the advancement of semiconductor technology, the functions integrated on wafers are becoming increasingly complex. Some wafers or on-wafer test structures need to remain active during manufacturing or testing, for example, for in-circuit testing, parameter monitoring, or data storage. This necessitates a continuous power supply to the circuitry on the wafer.

[0003] Traditional power supply methods typically employ physical contact connections, such as probes and connectors, to transfer electrical energy to the wafer through mechanical contact. However, this contact-based power supply method presents numerous problems in manufacturing and testing scenarios: First, physical contact can generate particulate contaminants, polluting the wafer surface and affecting the yield of subsequent processes or the accuracy of test results; second, contact connections are prone to wear during frequent insertion and removal, leading to poor contact or failure; third, in special process or testing environments such as vacuum or high temperature, the reliability of contact connections is difficult to guarantee.

[0004] Wireless charging technology has been widely used in consumer electronics, such as charging mobile phones and watches through electromagnetic induction. However, existing wireless charging technologies are mainly designed for packaged finished electronic devices, and there is no suitable solution for wirelessly charging bare wafers during wafer manufacturing and testing. Especially under the high precision and cleanliness requirements of wafer manufacturing and testing, how to achieve contactless wireless charging of wafers while ensuring charging efficiency, alignment accuracy, and compatibility with existing processes and testing equipment has become a pressing technical problem to be solved. Summary of the Invention

[0005] In view of the above-mentioned technical problems existing in the prior art, the purpose of the present invention is to provide a wafer wireless charging device, system and control method, which can realize non-contact wireless charging of wafers during wafer manufacturing and testing, avoid pollution and damage caused by physical contact, and improve the yield and efficiency of wafer manufacturing and testing.

[0006] According to one aspect of the present invention, a wafer wireless charging device is provided, applied in the wafer manufacturing and testing process, comprising: A carrier disk for carrying at least one wafer, on which energy storage elements are disposed; At least one receiving coil is disposed within the carrier disk and corresponds to the position of the wafer, for receiving electromagnetic energy and outputting alternating current; A rectifier circuit, electrically connected to the receiving coil, is used to rectify the alternating current output from the receiving coil into direct current, which is used to charge the energy storage elements on the wafer; and A position detection unit is used to detect the relative position of the wafer and the receiving coil, and to start charging when the wafer and the receiving coil are aligned.

[0007] Preferably, there are multiple receiving coils, which are arranged in an array within the carrier disk, with each receiving coil corresponding to a wafer carrier position.

[0008] Preferably, the rectifier circuit includes at least two controllable switches and a controller; the controller is used to phase-lock the fundamental current component of the AC output from the receiving coil to obtain a periodic signal with the same frequency as the fundamental current component; the controller is also used to generate a synchronization reference signal based on the periodic signal, generate a drive signal for the controllable switches based on the synchronization reference signal, and control the controllable switches to convert AC to DC based on the drive signal.

[0009] Preferably, the device further includes a charging management unit connected to the rectifier circuit, which monitors the charging status of the energy storage element and disconnects the charging circuit when charging is complete.

[0010] Preferably, the position detection unit includes: at least one position sensor disposed on the carrier disk for detecting whether the wafer is located at a predetermined charging position; and an alignment mechanism for adjusting the position of the carrier disk or the wafer when the wafer is not aligned.

[0011] Preferably, the position sensor is an optical sensor or a capacitive sensor.

[0012] Preferably, the carrier disk is made of a non-metallic material to avoid shielding electromagnetic energy.

[0013] According to another aspect of the present invention, a wafer wireless charging system is provided, comprising: The transmitting end includes a transmitting coil and a transmitting circuit, wherein the transmitting circuit converts the power input into high-frequency alternating current and applies it to the transmitting coil to generate an alternating electromagnetic field; and The receiving end includes any of the wafer wireless charging devices described above.

[0014] Preferably, the transmitting coil is disposed on the inner wall of the process chamber or the inner wall of the transfer chamber of the wafer manufacturing equipment.

[0015] Preferably, the transmitting circuit includes: a pulse width modulation device for outputting a drive signal; an inverter connected to the pulse width modulation device for converting DC power into high-frequency AC power according to the drive signal; and a resonant network connected to the inverter and the transmitting coil for achieving resonant coupling.

[0016] Preferably, the system further includes a communication unit for transmitting charging status information between the transmitter and the receiver.

[0017] According to another aspect of the present invention, a charging control method based on the above-described wafer wireless charging device or wafer wireless charging system is provided, comprising the following steps: S1, The position detection unit detects the relative position of the wafer and the receiving coil; S2. When the alignment of the wafer with the receiving coil is detected, charging is started; S3, the receiving coil receives electromagnetic energy and outputs alternating current; S4. The rectifier circuit rectifies the alternating current into direct current. S5. Direct current charges the energy storage components on the wafer.

[0018] Preferably, step S4 includes: S41. Phase-locking is performed on the fundamental current component of the AC output from the receiving coil to obtain a periodic signal with the same frequency as the fundamental current component. S42. Generate a synchronization reference signal based on the periodic signal; S43. Generate a drive signal for the controllable switch based on the synchronization reference signal; S44. Based on the drive signal, controllable switch is controlled to convert AC power to DC power.

[0019] Preferably, the method further includes step S6: the charging management unit monitors the charging status of the energy storage element and cuts off the charging circuit when charging is complete.

[0020] Preferably, step S1 includes: detecting whether the wafer is located at a predetermined charging position using a position sensor; if the wafer is not aligned, adjusting the position of the carrier disk or the wafer using an alignment mechanism until the wafer is aligned with the receiving coil.

[0021] According to another aspect of the present invention, a computer-readable storage medium is provided having a computer program stored thereon that, when executed by a processor, implements the method described in any of the preceding claims.

[0022] The technical solution provided by this invention enables contactless wireless charging of wafers during wafer manufacturing, avoiding contamination and damage caused by physical contact and improving wafer manufacturing yield and efficiency. Simultaneously, a position detection unit ensures precise alignment between the wafer and the receiving coil, improving charging efficiency; phase-locked loop (PLL) control technology achieves efficient rectification; and a charging management unit enables intelligent charging control. This invention is simple, low-cost, and easily applicable to actual production lines, bringing considerable economic benefits. Attached Figure Description

[0023] Other features, objects, and advantages of the invention will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings: Figure 1 A schematic diagram of the structure of a wafer wireless charging device according to a first embodiment of the present invention is shown; Figure 2 A schematic diagram showing the layout of the carrier disk and the receiving coil according to a first embodiment of the present invention is provided; Figure 3 A circuit schematic diagram of a rectifier circuit according to a first embodiment of the present invention is shown; Figure 4 A schematic flowchart of a phase-locked control method according to a first embodiment of the present invention is shown; Figure 5 A schematic diagram of a wafer wireless charging system according to a second embodiment of the present invention is shown; Figure 6 A circuit schematic diagram of a transmitting circuit according to a second embodiment of the present invention is shown; Figure 7 A schematic flowchart of a charging control method according to a third embodiment of the present invention is shown; Figure 8 A schematic flowchart of the position detection and alignment process according to a third embodiment of the present invention is shown. Detailed Implementation

[0024] To better illustrate the technical solution of the present invention, the present invention will be further described below with reference to the accompanying drawings.

[0025] Those skilled in the art will understand that, in order to solve the technical problems of contamination, wear, and low reliability associated with physical contact power supply in wafer manufacturing, the present invention provides a contactless power supply solution based on wireless charging technology. The technical solution provided by this invention allows for the charging of energy storage components on the wafer without physical contact, maintaining the continuous operation of active circuits on the wafer, while avoiding particulate contamination and mechanical wear, thereby improving the yield and efficiency of wafer manufacturing and testing. First Embodiment

[0026] Figure 1 A schematic diagram of a wafer wireless charging device according to a first embodiment of the present invention is shown. (Reference) Figure 1 The wafer wireless charging device provided in this embodiment includes: a carrier disk 10, a receiving coil 20, a rectifier circuit 30, and a position detection unit 40.

[0027] The carrier disk 10 is used to carry at least one wafer W. The wafer W is provided with energy storage elements (not shown in the figure), such as thin-film batteries or supercapacitors, to provide power to active circuits on the wafer (such as test circuits, storage circuits, monitoring sensors, etc.). In a preferred embodiment, the carrier disk 10 is made of a non-metallic material, such as ceramic or polytetrafluoroethylene (PTFE), to avoid shielding electromagnetic energy and ensure that electromagnetic energy can be effectively transferred to the wafer.

[0028] The receiving coil 20 is disposed within the carrier disk 10 and corresponds to the position of the wafer W. The receiving coil 20 is used to receive electromagnetic energy from the transmitting end and output alternating current. In a preferred embodiment, as... Figure 2 As shown, there are multiple receiving coils 20, which are arranged in an array within the carrier disk 10, with each receiving coil 20 corresponding to a wafer carrier position. This layout can support simultaneous wireless charging of multiple wafers, improving production efficiency.

[0029] The rectifier circuit 30 is electrically connected to the receiving coil 20 and is used to rectify the alternating current output by the receiving coil 20 into direct current. The direct current is used to charge the energy storage elements on the wafer W. In a preferred embodiment, as... Figure 3 As shown, the rectifier circuit 30 includes at least two controllable switches 31 and a controller 32. The controller 32 is used to phase-lock the fundamental current component of the AC power output from the receiving coil 20 to obtain a periodic signal with the same frequency as the fundamental current component; the controller 32 is also used to generate a synchronization reference signal based on the periodic signal, generate a drive signal for the controllable switches 31 based on the synchronization reference signal, and control the controllable switches 31 to convert AC power to DC power based on the drive signal.

[0030] Figure 4 A flowchart illustrating the phase-locked loop (PLL) control method is shown. (Reference) Figure 4 Through phase-locked loop (PLL) technology, the rectifier circuit can precisely track the phase of the output current from the receiving coil, achieving synchronous rectification and thus improving rectification and charging efficiency. Compared to traditional diode rectification, this controllable switching rectification method can significantly reduce conduction losses, especially in high-frequency wireless charging systems.

[0031] The position detection unit 40 is used to detect the relative position of the wafer W and the receiving coil 20, and to initiate charging when the wafer W and the receiving coil 20 are aligned. In a preferred embodiment, the position detection unit 40 includes at least one position sensor 41 and an alignment mechanism 42. The position sensor 41 is disposed on the carrier disk 10 and is used to detect whether the wafer W is located at a predetermined charging position. The position sensor 41 can be an optical sensor (such as a laser sensor or an infrared sensor) or a capacitive sensor, and those skilled in the art can select a suitable sensor type according to actual needs. When misalignment of the wafer W is detected, the alignment mechanism 42 is used to adjust the position of the carrier disk 10 or the wafer W. For example, the alignment mechanism 42 may include a fine-tuning motor and a transmission mechanism, which automatically adjusts the position of the carrier disk by receiving feedback signals from the position sensor until the wafer and the receiving coil are precisely aligned.

[0032] In a preferred embodiment, the wafer wireless charging device further includes a charging management unit 50. The charging management unit 50 is connected to the rectifier circuit 30 and is used to monitor the charging status of the energy storage element, such as charging voltage, charging current, and battery temperature, and to disconnect the charging circuit when charging is complete to prevent overcharging. The charging management unit 50 can also communicate with a host computer to report charging status information for process control and data recording. Second Embodiment

[0033] Figure 5 A schematic diagram of a wafer wireless charging system according to a second embodiment of the present invention is shown. (Reference) Figure 5 The wafer wireless charging system provided in this embodiment includes a transmitter 100 and a receiver 200.

[0034] The transmitting end 100 includes a transmitting coil 110 and a transmitting circuit 120. The transmitting circuit 120 converts the power input into high-frequency alternating current and applies it to the transmitting coil 110 to generate an alternating electromagnetic field. In a preferred embodiment, the transmitting coil 110 is disposed on the inner wall of the process chamber of the wafer manufacturing equipment, the inner wall of the transfer chamber, or at the test station within the process chamber. Thus, when the carrier tray 10 carries the wafer into the chamber, the receiving coil 20 can couple with the transmitting coil 110 to achieve wireless charging.

[0035] Figure 6 The circuit schematic of the transmitting circuit is shown. (Reference) Figure 6The transmitting circuit 120 includes a pulse width modulation (PWM) device 121, an inverter 122, and a resonant network 123. The PWM device 121 outputs a drive signal. The inverter 122 is connected to the PWM device 121 and converts direct current (DC) into high-frequency alternating current (AC) according to the drive signal. The inverter 122 can be a full-bridge inverter, a half-bridge inverter, or a push-pull inverter; those skilled in the art can select a suitable topology based on power rating and application scenario. The resonant network 123 is connected to the inverter 122 and the transmitting coil 110 to achieve resonant coupling. By adjusting the parameters of the resonant network, the transmitting and receiving ends can operate at the same resonant frequency, thereby improving energy transmission efficiency.

[0036] The receiver 200 includes the wafer wireless charging device described in any one of the first embodiments, comprising a carrier disk 10, a receiving coil 20, a rectifier circuit 30, a position detection unit 40, and a charging management unit 50. The specific structure and function of the receiver have been described in detail in the first embodiment and will not be repeated here.

[0037] In a preferred embodiment, the system further includes a communication unit 300. The communication unit 300 is used to transmit charging status information between the transmitter 100 and the receiver 200. The communication method can be wireless communication, such as Bluetooth, Wi-Fi, or Near Field Communication (NFC), or isolated communication via optical coupling, capacitive coupling, etc. Through the communication unit, the receiver can provide real-time feedback on the charging status (such as battery level, temperature, fault information, etc.) to the transmitter, which then adjusts its transmission power or frequency accordingly to achieve closed-loop control, ensuring charging safety and efficiency.

[0038] Figure 7 A schematic flowchart of a charging control method according to a third embodiment of the present invention is shown. The charging control method provided in this embodiment is implemented based on the wafer wireless charging device of the first embodiment or the wafer wireless charging system of the second embodiment.

[0039] refer to Figure 7 The method includes the following steps: Step S1: The position detection unit detects the relative position of the wafer and the receiving coil. Figure 8 The detailed process for this step is shown. (Reference) Figure 8 Step S1 specifically includes: - Sub-step S11: Detect whether the wafer is located at the predetermined charging position using a position sensor. The position sensor can be an optical sensor or a capacitive sensor. When the wafer reaches the predetermined position, the sensor outputs a trigger signal.

[0040] - Sub-step S12: Determine if the wafer is aligned. If the positional deviation between the wafer and the receiving coil is within the allowable range (e.g., ±0.1mm), it is considered aligned and proceeds to step S2; otherwise, proceed to sub-step S13.

[0041] - Sub-step S13: If the wafer is not aligned, adjust the position of the carrier disk or the wafer using the alignment mechanism until the wafer is aligned with the receiving coil. The alignment mechanism can be fine-tuned based on the feedback signal from the position sensor, for example, by moving the carrier disk in the XY plane or adjusting the rotation angle of the wafer.

[0042] Step S2: When the alignment of the wafer with the receiving coil is detected, charging is initiated. Charging can be initiated by the position detection unit sending an enable signal to the rectifier circuit, or by sending a start command to the transmitter to start the transmitting coil.

[0043] Step S3: The receiving coil receives electromagnetic energy and outputs alternating current. When the transmitting coil generates a high-frequency alternating electromagnetic field, the receiving coil generates an induced electromotive force through electromagnetic induction coupling and outputs high-frequency alternating current.

[0044] Step S4: The rectifier circuit rectifies the AC power into DC power. In a preferred embodiment, this step includes: - Sub-step S41: Phase-lock the fundamental current component of the AC output from the receiving coil to obtain a periodic signal with the same frequency as the fundamental current component. - Sub-step S42: Generate a synchronization reference signal based on the periodic signal; - Sub-step S43: Generate a drive signal for the controllable switch based on the synchronization reference signal; - Sub-step S44: Based on the drive signal, control the controllable switch to convert AC power to DC power.

[0045] Through phase-locked loop control, the rectifier circuit can achieve synchronous rectification, thereby improving rectification efficiency.

[0046] Step S5: Charge the energy storage element on the wafer with direct current. The energy storage element can be a thin-film lithium battery, a supercapacitor, or other rechargeable energy storage device.

[0047] Step S6: The charging management unit monitors the charging status of the energy storage element and disconnects the charging circuit when charging is complete. The charging management unit can monitor parameters such as charging voltage, charging current, and battery temperature. When the preset charging completion conditions are met (such as the voltage reaching the full charge voltage and the current dropping to the cutoff current), the charging circuit is disconnected to avoid overcharging. At the same time, the charging management unit can send charging completion information back to the transmitter through the communication unit so that the transmitter can stop transmitting or enter standby mode.

[0048] The above method enables contactless wireless charging of wafers during wafer manufacturing and testing, ensuring continuous power supply to active circuits on the wafer while avoiding the risks of contamination and damage associated with physical contact. This method can be seamlessly integrated with existing wafer manufacturing and testing processes, demonstrating high practical value.

[0049] To better understand the technical solution of this invention, the basic principles and key algorithms of wireless charging are explained below.

[0050] Wireless charging systems operate based on the principle of electromagnetic induction. When a high-frequency alternating current is passed through the transmitting coil, an alternating electromagnetic field is generated around it. The receiving coil is placed in this electromagnetic field, and an induced electromotive force is generated through electromagnetic induction, thereby realizing the wireless transfer of energy.

[0051] To improve energy transmission efficiency, both the transmitting and receiving circuits of this invention employ a resonant topology. The transmitting and receiving resonant networks have the same resonant frequency, allowing the system to operate in a resonant state, where energy transmission efficiency is highest. The resonant frequency f is determined by the inductance and capacitance: f = 1 / (2π√(LC)).

[0052] In the rectifier circuit, this invention employs synchronous rectification technology. Traditional diode rectification has a fixed forward voltage drop, resulting in significant conduction losses. The rectifier circuit of this invention uses a controllable switch (such as a MOSFET) instead of a diode and precisely tracks the phase of the input current through phase-locked loop (PLL) technology, causing the switch to operate near the current zero-crossing point, thereby significantly reducing conduction losses. The basic principle of the PLL is to synchronize the frequency and phase of the local oscillator with the input signal through feedback control. Let the input current be i(t) = I_m sin(ωt + φ), and the synchronization signal output by the PLL be v(t) = V_m sin(ωt + φ'). Locking is achieved when φ' = φ, and the drive signal generated at this time allows the switch to turn on and off at the optimal time.

[0053] For position detection, optical triangulation or capacitive sensing can be used. Optical triangulation involves emitting a laser beam and receiving the reflected light, calculating the distance and offset based on the position of the light spot. Capacitive sensing detects distance and position by measuring the change in capacitance between electrodes, offering the advantages of being non-contact and highly accurate.

Claims

1. A wafer wireless charging device, characterized in that, Applications in wafer manufacturing and testing processes, including: A carrier disk for carrying at least one wafer, on which energy storage elements are disposed; At least one receiving coil is disposed within the carrier disk and corresponds to the position of the wafer, for receiving electromagnetic energy and outputting alternating current; A rectifier circuit, electrically connected to the receiving coil, is used to rectify the alternating current output from the receiving coil into direct current, which is used to charge the energy storage elements on the wafer; and A position detection unit is used to detect the relative position of the wafer and the receiving coil, and to start charging when the wafer and the receiving coil are aligned.

2. The wafer wireless charging device according to claim 1, characterized in that, There are multiple receiving coils, which are arranged in an array within the carrier disk, with each receiving coil corresponding to a wafer carrier position.

3. The wafer wireless charging device according to claim 1, characterized in that, The rectifier circuit includes at least two controllable switches and a controller; The controller is used to phase-lock the fundamental current component of the AC current output by the receiving coil to obtain a periodic signal with the same frequency as the fundamental current component. The controller is also configured to generate a synchronization reference signal based on the periodic signal, generate a drive signal for the controllable switch based on the synchronization reference signal, and control the controllable switch to convert AC power to DC power based on the drive signal.

4. The wafer wireless charging device according to claim 1, characterized in that, It also includes a charging management unit, which is connected to the rectifier circuit and is used to monitor the charging status of the energy storage element and disconnect the charging circuit when charging is complete.

5. The wafer wireless charging device according to claim 1, characterized in that, The position detection unit includes: At least one position sensor, disposed on the carrier disk, is used to detect whether the wafer is located at a predetermined charging position; and An alignment mechanism for adjusting the position of the carrier disk or the wafer when the wafer is misaligned.

6. The wafer wireless charging device according to claim 5, characterized in that, The position sensor is an optical sensor or a capacitive sensor.

7. The wafer wireless charging device according to claim 1, characterized in that, The carrier disk is made of a non-metallic material selected from ceramic, polytetrafluoroethylene (PTFE) or polyether ether ketone (PEEK), and has an outgassing rate lower than 1x10⁻ 6 Torr·L / (s·cm²) when the wafer wireless charging device is applied to a vacuum process chamber, to avoid a shielding effect on electromagnetic energy generation.

8. A wafer wireless charging system, characterized in that, include: The transmitting end includes a transmitting coil and a transmitting circuit, wherein the transmitting circuit is used to convert the power input into high-frequency alternating current and apply it to the transmitting coil to generate an alternating electromagnetic field; as well as The receiving end includes the wafer wireless charging device according to any one of claims 1 to 7.

9. The wafer wireless charging system according to claim 8, characterized in that, The transmitting coil is disposed on the inner wall of the process chamber, the inner wall of the transfer chamber of the wafer manufacturing equipment, or at the test station within the process chamber.

10. The wafer wireless charging system according to claim 8, characterized in that, The transmitting circuit includes: A pulse width modulation device is used to output a drive signal; An inverter, connected to the pulse width modulation device, is used to convert direct current into high-frequency alternating current according to the drive signal; and A resonant network, connected to the inverter and the transmitting coil, is used to achieve resonant coupling.

11. The wafer wireless charging system according to claim 8, characterized in that, It also includes a communication unit, which is used to transmit charging status information between the transmitter and the receiver.

12. A charging control method for a wafer wireless charging device based on any one of claims 1 to 7 or a wafer wireless charging system based on any one of claims 8 to 11, characterized in that, Includes the following steps: S1, The position detection unit detects the relative position of the wafer and the receiving coil; S2. When the alignment of the wafer with the receiving coil is detected, charging is started; S3, the receiving coil receives electromagnetic energy and outputs alternating current; S4. The rectifier circuit rectifies the alternating current into direct current. S5. Direct current charges the energy storage components on the wafer.

13. The charging control method according to claim 12, characterized in that, Step S4 includes: S41. Phase-locking is performed on the fundamental current component of the AC output from the receiving coil to obtain a periodic signal with the same frequency as the fundamental current component. S42. Generate a synchronization reference signal based on the periodic signal; S43. Generate a drive signal for the controllable switch based on the synchronization reference signal; S44. Based on the drive signal, controllable switch is controlled to convert AC power to DC power.

14. The charging control method according to claim 12, characterized in that, It also includes step S6: the charging management unit monitors the charging status of the energy storage element and cuts off the charging circuit when charging is complete.

15. The charging control method according to claim 12, characterized in that, Step S1 includes: The position sensor detects whether the wafer is in the predetermined charging position; If the wafer is not aligned, the position of the carrier disk or the wafer is adjusted by the alignment mechanism until the wafer is aligned with the receiving coil.

16. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the program is executed by the processor, it implements the method of any one of claims 12 to 15.

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