Substrate film tearing structure and method
By setting a lifting section on the carrier film as the starting point for tearing off the carrier film, the problem of damage to the insulating adhesive layer during the tearing process of the carrier film is solved, and the integrity of the insulation function is achieved.
CN122294366APending Publication Date: 2026-06-26GRP UP IND CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- GRP UP IND CO LTD
- Filing Date
- 2024-12-24
- Publication Date
- 2026-06-26
AI Technical Summary
Technical Problem
Existing technologies can easily damage the insulating adhesive layer when peeling off the carrier film, leading to the failure of the insulation function.
Method used
The carrier film is peeled off by using the lifting part as the starting point, and the lifting part is connected to the film body through the closed edge to avoid damage to the insulating adhesive layer.
Benefits of technology
Maintain the integrity of the insulating adhesive layer's insulation function and avoid damaging the insulating functional area during the film removal process.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN122294366A_ABST
Abstract
A substrate peel-off structure is used to adhere to a substrate and includes a carrier film and an insulating adhesive layer. The insulating adhesive layer is attached to the bottom surface of the carrier film. The carrier film includes a film body and a lifting portion. The film body has an edge around its perimeter, and the edge is closed in shape. The lifting portion is connected to one side of the edge and is used to lift the film, serving as the starting point for peeling the carrier film from the insulating adhesive layer. Therefore, when the substrate peel-off structure is adhered to the substrate and the insulating adhesive layer is cured, the carrier film can be peeled off from the cured insulating adhesive layer by using the lifting portion as the starting point for peeling the carrier film from the insulating adhesive layer. This avoids damage to the portion of the insulating adhesive layer corresponding to the film body during the peeling process, thus maintaining the integrity of the insulating portion of the insulating adhesive layer.
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