A heat dissipation system and electronic device

Abstract

This invention discloses a heat dissipation system and an electronic device, applied in the field of electronic device heat dissipation technology. The heat dissipation system includes: a phase change assembly, comprising a phase change housing, a baffle, and an adsorption-evaporation component. The adsorption-evaporation component is disposed on the baffle and is used to fit closely to a heating element. The baffle is disposed in the middle of the phase change housing to divide the inner cavity of the phase change housing into a dry air convection zone and a coolant convection zone. The heating element is located in the coolant convection zone, and the adsorption-evaporation component extends from the coolant convection zone to the dry air convection zone; a coolant supply assembly for supplying coolant to the coolant convection zone; and a condensation recovery assembly, connected to the dry air convection zone via a gas circuit, for condensing vapor from the dry air convection zone. The heat dissipation system provided by this invention can maintain a low vapor partial pressure in the dry air convection zone for a long time, improve the cooling or heat dissipation effect of the adsorption-evaporation component, thereby improving the heat dissipation efficiency of the heating element.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation technology for electronic devices, and in particular to a heat dissipation system and an electronic device. Background Technology

[0002] Against the backdrop of surging demand for data centers and data processing, immersion cooling systems are gradually becoming the primary cooling system for data centers. In this technology, electronic devices such as servers are typically immersed in a low-boiling-point fluorinated liquid. Heat generated by components like the CPU (Central Processing Unit) causes the fluorinated liquid in contact with it to boil, producing steam bubbles. These steam bubbles rise to the top of the electronic device's chassis and come into contact with condenser coils installed inside the chassis top cover. The steam condenses back into liquid on the low-temperature walls of the condenser coils and drips back into the liquid pool under gravity, completing a passive phase change cycle.

[0003] However, in related technologies, the condenser coil is located on the inner top of the chassis. Its limited surface area and heat exchange capacity mean that the vapor cannot be condensed in a timely and complete manner. This causes a large amount of vapor to accumulate in the space above the CPU, increasing the partial pressure of the fluorinated liquid vapor in that area, severely weakening the driving force of liquid evaporation, and thus reducing the final boiling heat exchange efficiency. Under high heat flux density, if the vapor cannot dissipate quickly and the liquid cannot be replenished in time, the CPU surface may still dry out locally, causing a sharp rise in temperature. The expensive fluorinated liquid working fluid will inevitably evaporate and be lost, requiring regular replenishment, which increases maintenance costs and environmental burden. The heat dissipation limit of the entire system depends on the capacity of the top condenser coil, making upgrades or modifications relatively complex.

[0004] Therefore, how to improve the efficiency of the heat dissipation system is a technical problem that needs to be solved by those skilled in the art. Summary of the Invention

[0005] The purpose of this invention is to provide a heat dissipation system and electronic device that can maintain a low vapor partial pressure in the dry air convection zone for a long time and improve the efficiency of boiling heat exchange.

[0006] To achieve the above objectives, the present invention provides the following technical solution.

[0007] A heat dissipation system includes: a phase change assembly comprising a phase change housing, a baffle, and an adsorption-evaporation component, the adsorption-evaporation component being disposed on the baffle and used to fit against a heating element; the baffle being disposed in the middle of the phase change housing to divide the inner cavity of the phase change housing into a dry air convection zone and a coolant convection zone; the heating element being located in the coolant convection zone; and the adsorption-evaporation component extending from the coolant convection zone to the dry air convection zone; a liquid supply assembly connected to the coolant convection zone via a liquid circuit for supplying coolant to the coolant convection zone; and a condensation recovery assembly connected to the dry air convection zone via a gas circuit for condensing vapor from the dry air convection zone.

[0008] The present invention also provides an electronic device comprising a heat dissipation system according to any one of the above claims.

[0009] The heat dissipation system provided by this invention has the following advantages: First, through the arrangement of the phase change shell and baffle, the interior of the phase change shell is a hollow structure. The baffle is located inside the phase change shell, dividing the hollow structure into two parts: a dry air convection zone and a coolant convection zone. The dry air convection zone is located in the upper part of the hollow structure of the phase change shell, and the coolant convection zone is located in the lower part of the hollow structure of the phase change shell. The coolant convection zone is filled with coolant. The baffle isolates the dry air convection zone from the coolant convection zone. The dry air convection zone and the coolant convection zone are connected only through an adsorption and evaporation component. The adsorption and evaporation component adsorbs the coolant in the coolant convection zone. Due to the cold... The coolant convection zone is designed to be in close contact with the heating element. Therefore, after the heating element generates heat, the coolant in the adsorption and evaporation component undergoes a phase change and evaporates into the dry air convection zone. Due to the obstruction effect of the baffle, all coolant evaporation occurs within the adsorption and evaporation component, and no coolant evaporation occurs elsewhere. This greatly reduces coolant evaporation loss and ensures a lower coolant vapor pressure in the dry air convection zone. In other words, the coolant vapor pressure in the air convection zone is relatively low, which increases the driving force for coolant evaporation within the adsorption and evaporation component. This effectively increases the vapor pressure difference for coolant evaporation and cooling within the adsorption and evaporation component, thereby enhancing the cooling or heat dissipation effect of the adsorption and evaporation component.

[0010] The heat dissipation system provided by this invention can maintain a low vapor partial pressure in the dry air convection zone for a long time, improve the cooling or heat dissipation effect of the adsorption and volatilization components, and thus improve the heat dissipation efficiency of the heating element.

[0011] In one embodiment, the adsorption and volatilization component is a porous metal material component, and a number of mounting holes are provided on the baffle. The adsorption and volatilization component is fixed in the mounting holes, and the number of mounting holes is the same as the number of adsorption and volatilization components and they correspond one-to-one. The above setup, through the opening of mounting holes, allows for the selection of the size and shape of the mounting holes according to the size and shape of the heating element. The mounting holes facilitate the arrangement of the adsorption and evaporation components. Furthermore, using porous metal components as adsorption and evaporation components provides stable cavitation compared to direct evaporation and boiling on the surface of the heating element. The tiny cavities inside the porous metal components can trap small amounts of gas or vapor, becoming nucleation points for boiling. This makes the boiling process very stable and easy to initiate. In addition, the porous metal components possess excellent capillary force. When bubbles detach and carry away coolant, the capillary force of the porous metal components quickly draws the surrounding coolant into the vacated area, continuously "wetting" the heating surface and fundamentally preventing localized drying. This setup increases the number of effective nucleation points and optimizes bubble dynamics, thereby significantly improving the efficiency and limit of boiling heat transfer.

[0012] In one embodiment, the system further includes: a pneumatic power component for providing power to the steam in the dry air convection zone, the pneumatic power component being disposed on the gas circuit; and a controller, to which both the pneumatic power component and the liquid supply component are connected, the controller controlling the operation of the pneumatic power component and the liquid supply component according to the temperature of the heating element. This configuration allows the power of the pneumatic power component to be set as needed, thereby changing the flow rate of the steam in the dry air convection zone. This ensures that the steam in the dry air convection zone is quickly condensed and recovered by the condensation recovery component, preventing excessively high coolant vapor pressure in the air convection zone, which could affect the phase change efficiency of the coolant in the adsorption and volatilization component. Simultaneously, the controller is also connected to the liquid supply component, enabling it to control the operation of both the pneumatic power component and the liquid supply component based on the temperature of the heating element. By adjusting the rate at which the liquid supply component supplies coolant to the coolant convection zone, the temperature of the coolant in the coolant convection zone can be changed.

[0013] In one embodiment, there are multiple phase change components, with the dry air convection zone and coolant convection zone of each phase change component connected in series; or, the dry air convection zone and coolant convection zone of each phase change component connected in parallel; or, the dry air convection zone and coolant convection zone of at least two phase change components are connected in series, and then connected in parallel with the dry air convection zone and coolant convection zone of other phase change components. The above setup, by setting up multiple phase change components, can correspond to heating elements in different locations within the electronic device. Of course, each phase change component can also correspond to multiple heating elements. Connecting multiple phase change components in series in the system piping structure simplifies operation and facilitates management. Connecting multiple phase change components in parallel in the system piping structure allows for personalized temperature control of the heating elements, primarily achieved by controlling the flow rate of coolant in a single liquid branch or the flow rate of air in a single gas branch. Alternatively, a series-parallel hybrid approach can be adopted, allowing for the selection of the series-parallel relationships between different phase change components. This ensures personalized management of the heating element clusters within the electronic device while minimizing system piping complexity and management / maintenance costs.

[0014] The electronic device provided by the present invention is equipped with the above-mentioned heat dissipation system. Since the heat dissipation system has the above-mentioned technical effects, the electronic device equipped with the heat dissipation system should also have the corresponding technical effects. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of the present invention or related technologies, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of a specific embodiment of the heat dissipation system provided by the present invention.

[0017] Figure 2 for Figure 1 The diagram shows the structure of the phase change component in the heat dissipation system.

[0018] Figure 3 for Figure 1 The main sectional view of the phase change component in the heat dissipation system shown.

[0019] Figure 4 for Figure 1 A side sectional view of the phase change component in the heat dissipation system shown.

[0020] Figure 5 for Figure 1 Top view of the phase change component in the heat dissipation system shown.

[0021] Figure 6 for Figure 1 The main sectional view of the condensation recovery component in the heat dissipation system shown.

[0022] Figure 7 for Figure 1 A side sectional view of the condensation recovery component in the heat dissipation system shown.

[0023] Figure 8 for Figure 1 Top view of the condensation recovery component in the heat dissipation system shown.

[0024] Figure 9 This is a schematic diagram of another specific embodiment of the heat dissipation system provided by the present invention.

[0025] Reference numerals: 100-Heating element; 1-Phase change assembly; 11-Phase change housing; 111-Dry air convection zone; 112-Coolant convection zone; 12-Baffle; 121-Mounting hole; 13-Adsorption and evaporation component; 2-Liquid supply assembly; 21-Liquid circuit; 22-Liquid supply power component; 23-Liquid supply heat exchanger; 231-Heat exchanger housing; 3-Condensation recovery assembly; 31-Gas circuit; 32-Condensation housing; 321-Condensation space; 322-Cooling space; 33-Condensation baffle; 34-Return branch; 4-Air compression component; 5-Adsorption and dehumidification component; 6-Airflow power component; 7-Chiller unit. Detailed Implementation

[0026] The core of this invention is to provide a heat dissipation system and electronic device that can significantly improve the efficiency and limit of boiling heat exchange.

[0027] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present invention.

[0028] It should be noted that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing the invention and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting the invention. The terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal connection of two elements. The terms "parallel," "perpendicular," and "equal" include the described situation and situations similar to the described situation, where the range of similarity is within an acceptable deviation range, which is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity, i.e., the limitations of the measurement system. For example, "parallel" includes absolute parallelism and approximate parallelism, where the acceptable deviation range for approximate parallelism can be, for example, within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, where the acceptable deviation range for approximate perpendicularity can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, where the acceptable deviation range for approximate equality can be, for example, the difference between the two equal items being less than or equal to 5% of either one. Those skilled in the art will understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0029] To enable those skilled in the art to better understand the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0030] In this implementation, please refer to Figure 1 and Figure 2 The heat dissipation system includes a phase change component 1, a liquid supply component 2, and a condensation recovery component 3.

[0031] The phase change assembly 1 includes a phase change housing 11, a baffle 12, and an adsorption-evaporation component 13. The adsorption-evaporation component 13 is disposed on the baffle 12 and is used to fit against the heating element 100. The baffle 12 is disposed in the middle of the phase change housing 11 to divide the inner cavity of the phase change housing 11 into a dry air convection zone 111 and a coolant convection zone 112. The heating element 100 is located in the coolant convection zone 112. The adsorption-evaporation component 13 extends from the coolant convection zone 112 to the dry air convection zone 111.

[0032] The liquid supply component 2 is connected to the coolant convection zone 112 via a liquid circuit 21 and is used to supply coolant to the coolant convection zone 112.

[0033] The condensation recovery component 3 is connected to the dry air convection zone 111 via a gas circuit 31 and is used to condense the steam from the dry air convection zone 111.

[0034] Specifically, the coolant can be a fluorinated liquid with a boiling point between 35 and 50°C. Fluorinated liquids possess high insulation, chemical inertness, and wide temperature range stability, enabling them to safely cool the high-power heating element 100, preventing short circuits and corrosion, and are environmentally friendly and pollution-free. Furthermore, the phase change assembly 1's phase change housing 11 forms a double-layer evaporation-convection heat exchange channel. Both the phase change housing 11 and the baffle 12 can be made of metal plates, such as copper plates. The heating element 100 can be a CPU or other components requiring heat dissipation.

[0035] Furthermore, the phase change shell 11 is made of a metal with high thermal conductivity, such as copper or aluminum plates, and is connected by welding to form a double-layer channel shell structure with a plate thickness of 0.2 to 0.5 cm. The heights of the dry air convection zone 111 and the coolant convection zone 112 can be set as needed. The height of the dry air convection zone 111 should not be too high, as this would weaken the bottom convection heat transfer effect.

[0036] Furthermore, the adsorption and evaporation component 13 is made of the same material as the phase change shell 11, ensuring that their coefficients of thermal expansion are consistent. Since the adsorption and evaporation component 13 directly contacts the heating element 100, its temperature differs from other locations. If different materials are used, large stresses can easily be generated at the connection points, leading to structural fracture. The consistent material of the adsorption and evaporation component 13 and the phase change shell 11 ensures a strong weld, preventing the porous layer from detaching or shifting, thus guaranteeing stable cooling performance. Both the adsorption and evaporation component 13 and the phase change shell 11 can be made of copper. The surface bonding between the adsorption and evaporation component 13 and the heating element 100 can be achieved using spot welding, or, without affecting the performance of the heating element 100 itself, using methods such as slot connection, ensuring surface area matching between the adsorption and evaporation component 13 and the heating element 100.

[0037] The heat dissipation system provided by this invention, firstly, through the arrangement of a phase change shell 11 and a baffle 12, the interior of the phase change shell 11 is a hollow structure. The baffle 12 is disposed inside the phase change shell 11, dividing the hollow structure of the phase change shell 11 into two parts: a dry air convection zone 111 and a coolant convection zone 112. The dry air convection zone 111 is located in the upper part of the hollow structure of the phase change shell 11, and the coolant convection zone 112 is located in the lower part of the hollow structure of the phase change shell 11. The coolant convection zone 112 is filled with coolant and is used for storing and transporting coolant. The baffle 12 isolates the dry air convection zone 111 and the coolant convection zone 112. The dry air convection zone 111 and the coolant convection zone 112 are connected only through an adsorption and evaporation component 13, which adsorbs the coolant in the coolant convection zone 112. The coolant convection zone 112 is fitted to the heating element 100. Therefore, after the heating element 100 generates heat, the coolant in the adsorption and evaporation component 13 undergoes a phase change and evaporates into the dry air convection zone 111. Due to the obstruction effect of the baffle 12, all the coolant evaporation occurs within the adsorption and evaporation component 13, and no coolant evaporation occurs elsewhere. This greatly reduces coolant evaporation loss and ensures a lower coolant vapor pressure in the dry air convection zone 111. The lower coolant vapor pressure in the air convection zone increases the driving force for coolant evaporation in the adsorption and evaporation component 13, thereby effectively increasing the vapor pressure difference for coolant evaporation and cooling in the adsorption and evaporation component 13, thus enhancing the cooling or heat dissipation effect of the adsorption and evaporation component 13. The low partial pressure of coolant vapor in the air convection zone is due to strong convection, which is generated based on Bernoulli's principle. Without the baffle 12, the coolant in other locations besides the adsorption and evaporation component 13 would also evaporate naturally. This would result in a higher vapor pressure in the upper dry air convection zone 111, reducing the vapor pressure difference used to drive the evaporation and cooling of the coolant on the surface of the heating element 100, thus weakening the cooling or heat dissipation effect.

[0038] The heat dissipation system provided by the present invention can maintain a low vapor partial pressure in the dry air convection zone 111 for a long time, improve the cooling or heat dissipation effect of the adsorption and evaporation component 13, and thus improve the heat dissipation efficiency of the heating element 100.

[0039] In some implementation methods, please refer to Figures 3 to 5The adsorption and volatilization component 13 is a porous metal component. The baffle 12 has several mounting holes 121. The adsorption and volatilization component 13 is fixed in the mounting holes 121, and the number of mounting holes 121 is the same as the number of adsorption and volatilization components 13 and they correspond one-to-one. The above-mentioned setup, through the opening of the mounting hole 121, allows for the selection of the size and shape of the mounting hole 121 according to the size and shape of the heating element 100. The mounting hole 121 facilitates the arrangement of the adsorption and evaporation component 13. On the other hand, using a porous metal material component as the adsorption and evaporation component 13 provides stable cavitation compared to direct evaporation and boiling on the surface of the heating element 100. The tiny cavities inside the porous metal material component can trap a small amount of gas or vapor, becoming nucleation points for boiling. This makes the boiling process very stable and easy to start. In addition, the porous metal material component has good capillary force. When bubbles detach and carry away coolant, the capillary force of the porous metal material component will quickly draw the surrounding coolant to the vacated area, continuously "wetting" the heating surface and fundamentally preventing local drying. The above-mentioned setup can increase the number of effective nucleation points and optimize bubble dynamics, thereby significantly improving the efficiency and limit of boiling heat transfer.

[0040] Furthermore, the specific manufacturing steps of the phase change component 1 are as follows: First, determine the size of the adsorption and evaporation component 13 according to the size of the heating element 100. Without affecting the performance of the heating element 100, the adsorption and evaporation component 13 can be connected to the heating element 100 by welding or by adhesive bonding. Second, determine the installation position of the baffle 12 according to actual needs, thereby determining the geometric dimensions of the dry air convection zone 111 and the coolant convection zone 112. For example, the baffle 12 can be set in the middle of the phase change housing 11, so that the dry air convection zone 111 and the coolant convection zone 112 have the same height. According to the geometric dimensions of the heating element 100 and the adsorption and evaporation component 13, a mounting hole 121 is opened on the middle baffle 12. The height of the base determines the height of the lower coolant convection zone 112. The height of both the lower coolant convection zone 112 and the upper dry air convection zone 111 can be 5.0 cm. The heating element 100, the adsorption and volatilization component 13, and the base of the heating element 100 are placed in the lower coolant convection zone 112. The intermediate baffle 12 with the pre-drilled mounting hole 121 is fitted into the adsorption and volatilization component 13 and assembled with other plates to form the entire phase change assembly 1. The connection is made by welding. Next, the inlet and outlet of the upper dry air convection zone 111 and the lower coolant convection zone 112 are reserved. According to actual needs, holes are made on the upper and lower sides of the phase change housing 11 and connected to cylindrical metal tubes. The gas circuit 31 and liquid circuit 21 of the upper and lower layers are connected to the outside. The assembly of the phase change assembly 1 is thus completed, which is convenient.

[0041] In some embodiments, the height of the adsorption-evaporation component 13 extending into the coolant convection zone 112 is 1.0~2.5mm, or the height of the adsorption-evaporation component 13 extending into the coolant convection zone 112 is 0.2-0.4 times its own height. Specifically, for thinner heating element 100 and adsorption-evaporation component 13, the height of the adsorption-evaporation component 13 extending into the coolant convection zone 112 should be greater. For example, when the thickness of heating element 100 is 1cm, the height of the adsorption-evaporation component 13 used is 1.2cm, and the immersion height of the adsorption-evaporation component 13 in the coolant convection zone 112 can be 2.4mm, that is, 0.2 times its own height; when the thickness of heating element 100 is 4cm, the height of the adsorption-evaporation component 13 used is 5cm, and the immersion height of the adsorption-evaporation component 13 in the coolant convection zone 112 can be 2cm, that is, 0.4 times its own height.

[0042] In some embodiments, the liquid supply assembly 2 includes a liquid supply power component 22 and a liquid supply heat exchanger 23, both of which are disposed on the liquid circuit 21. The liquid supply power component 22 provides power for the flow of coolant. The liquid supply heat exchanger 23 includes a heat exchanger housing 231, through which the liquid circuit 21 passes, and a heat exchange medium is disposed within the heat exchanger housing 231. The liquid circuit 21 is immersed in the heat exchange medium to cool the coolant within the liquid circuit 21. The liquid supply power component 22 can be a water pump. Specifically, the liquid supply heat exchanger 23 can be a shell-and-tube heat exchanger, with the liquid circuit 21 spirally extending and placed within the heat exchanger housing 231. The interior of the liquid circuit 21 contains the coolant to be cooled, and the exterior of the liquid circuit 21 contains the heat exchange medium, which can be chilled water from the chiller unit 7 to ensure timely supply of chilled water.

[0043] In some implementation methods, please refer to Figures 6 to 8The condensation recovery assembly 3 includes a condensation shell 32 and a condensation baffle 33. The condensation baffle 33 is located inside the condensation shell 32 and divides the condensation shell 32 into a condensation space 321 and a cooling space 322. The condensation space 321 is connected to the dry air convection zone 111, and the cooling space 322 is filled with a heat exchange medium. The bottom of the condensation space 321 is connected to the liquid supply heat exchanger 23 to transport the condensed coolant to the liquid supply heat exchanger 23. Specifically, a return branch 34 is provided between the condensation shell 32 and the liquid supply heat exchanger 23. A valve can be installed on the return branch 34. When the coolant in the condensation shell 32 reaches a certain volume, it can flow into the liquid circuit 21 through the return branch 34. Furthermore, the condensation baffle 33 extends vertically, and in order to facilitate the gathering of coolant, the bottom of the condensation baffle 33 is inclined towards the side of the condensation space 321. Specifically, both the condenser shell 32 and the condenser baffle 33 of the condensation recovery assembly 3 can be made of copper plates. First, the copper plates are cut according to the drawings and the condenser shell 32 of the condensation recovery assembly 3 is assembled. At this point, the condenser shell 32 is divided into two spaces: a condensation space 321 and a cooling space 322. The cooling space 322 and the condensation space 321 are further divided according to the inclination direction of the condenser baffle 33. An opening is made at the bottom of the condensation space 321 to collect the condensed coolant. An opening is made at the top of the condensation space 321 to recover air from the air compression component 4. The cooling space 322 is connected to the chiller unit 7 to provide low-temperature chilled water to maintain the low temperature of the surface of the condenser baffle 33, ensuring a stable condensation process. Furthermore, the condenser shell 32 and the condenser baffle 33 are made of the same material, such as aluminum or copper plates, and are welded firmly using the same material, preventing structural cracks due to temperature changes.

[0044] In some embodiments, a chiller unit 7 is also included. The liquid supply heat exchanger 23 and the condenser housing 32 are both connected to the chiller unit 7. The chiller unit 7 supplies heat exchange medium to the heat exchanger housing 231 of the liquid supply heat exchanger 23 and the cooling space 322. The chiller unit 7 can also regulate the temperature of the heat exchange medium. Specifically, the chiller unit 7 is mainly responsible for supplying the heat exchange medium to the condensation recovery assembly 3 and the liquid supply heat exchanger 23. The heat exchange medium can be water, and its temperature can be controlled between 4-6°C. The heat dissipation method of the chiller unit 7 itself needs to be determined based on the actual cooling demand and water resource availability. An air conditioning system or other cooling methods can be used, such as air cooling or other condensers to dissipate heat.

[0045] In some embodiments, an air compression component 4 and an adsorption dehumidification component 5 are also included. Both the air compression component 4 and the adsorption dehumidification component 5 are disposed on the gas circuit 31, with the air compression component 4 located between the outlet of the dry air convection zone 111 and the condensation recovery component 3, and the adsorption dehumidification component 5 located between the condensation recovery component 3 and the inlet of the dry air convection zone 111. Specifically, the air compression component 4 is used to compress the humid air exiting from the phase change shell 11, and after compressing the vapor-rich humid air, it is delivered to the condensation recovery component 3, achieving efficient separation and recovery of coolant and dry air. The separated dry air is pressurized and recycled, while the liquid coolant is reinjected into the liquid supply heat exchanger 23, ultimately achieving zero liquid replenishment circulation of the working fluid within the system, greatly reducing operation and maintenance costs and eliminating environmental hazards. Furthermore, the adsorption dehumidification component 5 includes a quicklime filter layer for adsorbing and separating residual coolant vapor in the air.

[0046] In some embodiments, a pneumatic power component 6 and a controller are also included. The pneumatic power component 6 is used to provide power for the steam in the dry air convection zone 111. The pneumatic power component 6 is disposed on the gas circuit 31. The pneumatic power component can be a fan. Both the pneumatic power component 6 and the liquid supply component 2 are connected to the controller, which is used to control the operation of the pneumatic power component 6 and the liquid supply component 2 according to the temperature of the heating element 100. The above configuration, through the setting of the airflow power component 6, allows the power of the airflow power component 6 to be set as needed, thereby changing the flow speed of steam in the dry air convection zone 111. This ensures that the steam in the dry air convection zone 111 is condensed and recovered by the condensation recovery component 3 as quickly as possible, preventing excessively high coolant vapor pressure in the air convection zone, which would affect the phase change efficiency of the coolant in the adsorption and volatilization component 13. Simultaneously, the controller is also connected to the liquid supply component 2. The controller can control the operation of the airflow power component 6 based on the temperature of the heating element 100, and also control the operation of the liquid supply component 2 based on the temperature of the heating element 100. By adjusting the speed at which the liquid supply component 2 supplies coolant to the coolant convection zone 112, the temperature of the coolant in the coolant convection zone 112 can be changed. Different speed settings can also be set, allowing for quick switching between the speeds of the airflow power component 6 and the liquid supply component 2 based on changes in the temperature of the heating element 100, making operation convenient. Specifically, the controller controls the coolant supply component 2 mainly by controlling the power of the coolant supply power component 22 to change the flow rate of the coolant; of course, dynamic adjustment can also be used. The actual temperature of the heating element 100 is jointly controlled by the cold water temperature and the coolant flow rate, and the two together determine the cooling rate of the heating element 100 to maintain the temperature of the heating element 100; the cold water is generated by the chiller unit 7, and the temperature can be adjusted by the user.

[0047] Furthermore, the controller adjusts the cooling rate of the system by controlling the circulation rate of the airflow power component 6 and the liquid supply power component 22, as well as the temperature of the chilled water provided by the chiller unit 7. Before adjustment, the user first needs to set the target temperature T0 of the heating element 100. The control modes are divided into manual mode and automatic mode.

[0048] In manual mode, users can manually control the flow rate of air and coolant by adjusting the power of the airflow power unit 6 and the liquid supply power unit 22, and adjust the chilled water temperature by manually controlling the chiller unit 7.

[0049] In automatic mode, the power of the airflow power component 6, the power of the liquid supply power component 22, and the chilled water temperature are synchronously controlled based on the difference between the measured temperature Tc of the heating element 100 and the target temperature T0 of the heating element 100. For example, when the actual temperature of the heating element 100 exceeds the target temperature by 10°C, the airflow power component 6 and the liquid supply power component 22 are turned on to the highest level, such as level three, and the chilled water temperature in the chiller unit 7 is set to 5°C; when the actual temperature of the heating element 100 exceeds the target temperature by 5°C, the airflow power component 6 and the liquid supply power component 22 are turned on to level two, and the chilled water temperature in the chiller unit 7 is set to 4°C; when the actual temperature of the heating element 100 exceeds the target temperature by 5°C, the airflow power component 6 and the liquid supply power component 22 are turned on to the lowest level, such as level one, and the chilled water temperature in the chiller unit 7 is set to 9°C. The above settings enable rapid adjustment of the airflow power component 6, the liquid supply power component 22, and the chilled water temperature.

[0050] In some implementations, the controller can selectively activate either the airflow power component 6 or the liquid supply power component 22 based on the temperature of the heating element 100, or activate either the airflow power component 6 or the liquid supply power component 22 sequentially based on the temperature of the heating element 100. Specifically, when the actual temperature of the heating element 100 exceeds the first preset value of the target temperature T0, the airflow power component 6 can be controlled to increase the flow rate. If the temperature of the heating element 100 is not cooled to the target temperature within a first preset time, then the liquid supply power component 22 is controlled to increase the speed of the coolant. Alternatively, when the actual temperature of the heating element 100 exceeds the first preset value of the target temperature T0, only the airflow power component 6 is controlled to increase the flow rate, and when the actual temperature of the heating element 100 exceeds the second preset value of the target temperature T0, only the liquid supply power component 22 is controlled to increase the speed of the coolant. In both operation modes of controlling the airflow power component 6 to increase the flow rate and the liquid supply power component 22 to increase the speed of the coolant, the temperature of the chilled water in the chiller unit 7 can be adjusted.

[0051] When the actual temperature of the heating element 100 fluctuates drastically within a second preset time period, the liquid supply power component 22 is controlled to increase the speed of the coolant and simultaneously reduce the temperature of the chilled water in the chiller unit 7. During this process, the power of the airflow power component 6 can also be increased. The aforementioned drastic fluctuation is defined as the difference between the highest and lowest temperatures within the second preset time period, which can be set according to actual needs. In other words, by adding the airflow power component 6, when the temperature adjustment range of the heating element 100 is small, the requirements can be met simply by changing the power of the airflow power component 6, without the need to control the liquid supply power component 22 and the chiller unit 7, effectively reducing costs and improving flexibility and control accuracy.

[0052] In some implementation methods, please refer to Figure 9 There are multiple phase change components 1, and the dry air convection zone 111 and the coolant convection zone 112 of each phase change component 1 are connected in series. Specifically, the dry air convection zones 111 of each phase change component 1 are connected in series with each other, and the coolant convection zones 112 of each phase change component 1 are connected in series with each other. That is, the dry air convection zones 111 of each phase change component 1 pair are connected in series in the same gas circuit 31, and the coolant convection zones 112 of each phase change component 1 pair are connected in series in the same liquid circuit 21.

[0053] In some embodiments, the dry air convection zone 111 and the coolant convection zone 112 of each phase change component 1 are connected in parallel. Specifically, the dry air convection zones 111 of each phase change component 1 are connected in parallel with each other, and the coolant convection zones 112 of each phase change component 1 are connected in parallel with each other. That is, the dry air convection zones 111 of each phase change component 1 are connected through a gas circuit 31, and then the gas circuits 31 are connected in parallel. The coolant convection zones 112 of each phase change component 1 are connected through a liquid circuit 21, and then the liquid circuits 21 are connected in parallel.

[0054] In some embodiments, the dry air convection zone 111 and coolant convection zone 112 of at least two phase change components 1 are connected in series, and then connected in parallel with the dry air convection zone 111 and coolant convection zone 112 of other phase change components 1; such as Figure 9 As shown, two phase change components 1 can be connected in series and then in parallel with other phase change components 1. Through series and parallel connection, each phase change component 1 can share the same liquid supply component 2, condensation recovery component 3, air compression component 4, adsorption dehumidification component 5, airflow power component 6, and chiller unit 7, which can facilitate the layout of the cooling system and save costs. Of course, in order to achieve individual control of different phase change components 1, solenoid valves can be installed on the liquid circuit 21 and gas circuit 31 of each phase change component 1. By controlling the flow of the solenoid valves, different degrees of adjustment can be made.

[0055] The above configuration, by setting multiple phase change components 1, can correspond to heating elements 100 at different locations in the electronic device. Of course, each phase change component 1 can also correspond to multiple heating elements 100. By connecting multiple phase change components 1 in series in the system piping structure, operation is simpler and management is more convenient. Connecting multiple phase change components 1 in parallel in the system piping structure can achieve personalized temperature control of the heating elements 100, which is mainly achieved by controlling the flow rate of coolant in a single liquid branch or the flow rate of air in a single gas branch. Of course, a series-parallel combination scheme can also be adopted, which can independently select the series-parallel relationship between different phase change components 1, and can minimize the complexity of the system piping and management and maintenance costs while ensuring personalized management of the cluster of heating elements 100 in the electronic device.

[0056] The heat dissipation system provided in this application differs from the coolant boiling heat exchange scheme. It is divided into a dry air convection zone 111 and a coolant convection zone 112 by a baffle 12. The lower coolant convection zone 112 is an immersion evaporation zone, which can form a capillary adsorption coolant film. The upper dry air convection zone 111 is a forced convection zone, where high-speed dry air can pass through quickly. This heat dissipation system is a fully closed system and does not require coolant replenishment. This system greatly reduces the annual coolant replenishment by condensing and recovering the coolant, achieving system-level replenishment-free operation and effectively reducing costs. This heat dissipation system can be directly applied to the CPU heating element 100 for CPU cooling. It is also feasible for fixed-line and mobile networks without structural adjustments. The porous medium of the adsorption and evaporation component 13 provides a large number of stable cavitation nucleation points. Its strong capillary force can act like a pump to continuously draw the coolant at high speed to the surface of the heating element 100, completely avoiding local drying and significantly improving the efficiency and safety limit of boiling heat exchange. Driven by the airflow propulsion component 6, dry air is forced to flow in the dry air convection zone 111, which can continuously and efficiently carry the evaporated coolant vapor away from the surface of the heating element 100, thereby maintaining a low vapor partial pressure environment in the evaporation zone for a long time and forming a strong evaporation driving force, fundamentally solving the problem of performance degradation caused by vapor accumulation.

[0057] In addition to the heat dissipation system described above, the present invention also provides an electronic device including the heat dissipation system described above. For the structure of other parts of the electronic device, please refer to the relevant technology, which will not be described in detail here.

[0058] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0059] The heat dissipation system and electronic device provided by the present invention have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of the present invention. The descriptions of the embodiments above are only for the purpose of helping to understand the method and core ideas of the present invention. It should be noted that those skilled in the art can make several improvements and modifications to the present invention without departing from the principles of the present invention, and these improvements and modifications also fall within the protection scope of the present invention.

Claims

1. A heat dissipation system, characterized in that, include: The phase change assembly (1) includes a phase change housing (11), a baffle (12), and an adsorption-evaporation component (13). The adsorption-evaporation component (13) is disposed on the baffle (12) and is used to fit against the heating element (100). The baffle (12) is disposed in the middle of the phase change housing (11) to divide the inner cavity of the phase change housing (11) into a dry air convection zone (111) and a coolant convection zone (112). The heating element (100) is located in the coolant convection zone (112). The adsorption-evaporation component (13) extends from the coolant convection zone (112) to the dry air convection zone (111). The liquid supply assembly (2) is connected to the coolant convection zone (112) via a liquid circuit (21) and is used to supply coolant to the coolant convection zone (112); The condensation recovery component (3) is connected to the dry air convection zone (111) via a gas circuit (31) and is used to condense the steam from the dry air convection zone (111).

2. The heat dissipation system according to claim 1, characterized in that, The adsorption and volatilization component (13) is a porous metal material component; and / or, the baffle (12) is provided with a plurality of mounting holes (121), the adsorption and volatilization component (13) is fixed in the mounting holes (121), and the number of mounting holes (121) is the same as that of the adsorption and volatilization component (13) and they correspond one to one.

3. The heat dissipation system according to claim 1, characterized in that, The height of the adsorption and volatilization component (13) extending into the coolant convection zone (112) is 1.0~2.5mm, or the height of the adsorption and volatilization component (13) extending into the coolant convection zone (112) is 0.2-0.4 times the height of the adsorption and volatilization component (13).

4. The heat dissipation system according to claim 1, characterized in that, The liquid supply assembly (2) includes a liquid supply power component (22) and a liquid supply heat exchanger (23). Both the liquid supply power component (22) and the liquid supply heat exchanger (23) are disposed on the liquid circuit (21). The liquid supply power component (22) is used to provide power for the flow of the coolant. The liquid supply heat exchanger (23) includes a heat exchanger housing (231). The liquid circuit (21) passes through the heat exchanger housing (231), and a heat exchange medium is provided inside the heat exchanger housing (231). The liquid circuit (21) is immersed in the heat exchange medium to cool the coolant in the liquid circuit (21).

5. The heat dissipation system of claim 4, wherein, The condensation recovery assembly (3) includes a condensation shell (32) and a condensation baffle (33). The condensation baffle (33) is located inside the condensation shell (32) and divides the condensation shell (32) into a condensation space (321) and a cooling space (322). The condensation space (321) is connected to the dry air convection zone (111), and the cooling space (322) is filled with a heat exchange medium. The bottom of the condensation space (321) is connected to the liquid supply heat exchanger (23) to deliver the condensed coolant to the liquid supply heat exchanger (23).

6. The heat dissipation system according to claim 5, characterized in that, It also includes a chiller unit (7), the liquid supply heat exchanger (23) and the condenser shell (32) are both connected to the chiller unit (7), the chiller unit (7) is used to supply the heat exchange medium to the heat exchanger shell (231) of the liquid supply heat exchanger (23) and the cooling space (322); and the chiller unit (7) can adjust the temperature of the heat exchange medium.

7. The heat dissipation system of claim 1, wherein, It also includes an air compression component (4) and an adsorption dehumidification component (5), both of which are disposed on the gas circuit (31). The air compression component (4) is located between the outlet of the dry air convection zone (111) and the condensation recovery component (3), and the adsorption dehumidification component (5) is located between the condensation recovery component (3) and the inlet of the dry air convection zone (111).

8. The heat dissipation system according to any one of claims 1 to 7, characterized in that, Also includes: A pneumatic power component (6) is used to provide power for the steam in the dry air convection zone (111), and the pneumatic power component (6) is disposed on the gas circuit (31); The controller is connected to both the airflow power component (6) and the liquid supply component (2). The controller is used to control the operation of the airflow power component (6) and the liquid supply component (2) according to the temperature of the heating element (100).

9. The heat dissipation system according to any one of claims 1 to 7, characterized in that, The number of phase change components (1) is multiple, and the dry air convection zone (111) and the coolant convection zone (112) of each phase change component (1) are connected in series; or, the dry air convection zone (111) and the coolant convection zone (112) of each phase change component (1) are connected in parallel; or, the dry air convection zone (111) and the coolant convection zone (112) of at least two phase change components (1) are connected in series, and then connected in parallel with the dry air convection zone (111) and the coolant convection zone (112) of other phase change components (1).

10. An electronic device, comprising a heat dissipation system, characterized in that, The heat dissipation system is the heat dissipation system according to any one of claims 1 to 9.

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