Chip transloading device and SMT supply transloading method

Abstract

This invention discloses a chip transfer device, including a machine base, a feeding module, a tape and reel module, and a transport module. The feeding module and the tape and reel module are respectively arranged on both sides of the machine base. The transport module is mounted above the two modules and is equipped with a picking mechanism. The tape and reel module carries a carrier reel, a take-up reel, and a hot-pressing and laminating mechanism. Empty carrier tape is fed from the carrier reel, passed through the hot-pressing and laminating mechanism, and then wound onto the take-up reel. During operation, the picking mechanism transfers the chip in the feeding module to the carrier tape groove. The take-up reel pulls the carrier tape forward, and the hot-pressing and laminating mechanism simultaneously completes the hot-pressing and encapsulation of the carrier tape, finally completing the chip winding. This device can automatically transfer chips of different packaging forms into reel packaging, is compatible with standardized feeders, effectively optimizes the SMT placement process, significantly improves chip transfer efficiency and packaging quality, and ensures the overall production efficiency and processing quality of SMT placement.

Description

Technical Field

[0001] This invention relates to the field of SMT (Surface Mount Technology) technology, specifically to a chip transfer device and an SMT feeding and transfer method. Background Technology

[0002] In the surface mount technology (SMT) production process, chip placement preparation and loading are crucial for ensuring production continuity and product yield. Chip packaging is one of the core prerequisites for this process. Currently, different chip manufacturers use different chip packaging methods based on their own production processes and transportation needs. The mainstream packaging methods are mainly divided into two categories: tubular packaging and reel packaging. In actual production, since the feeder of the placement machine can only load reel-packaged chips, when the purchased chips are in tubular or reel packaging, the chips in the tubular packaging must first be transferred to the reel, and then the reel containing the chips is installed onto the feeder of the placement machine to complete the subsequent placement operation.

[0003] In the existing technology, the above chip transfer process is all completed manually. The specific operation process is as follows: the operator manually takes out the chip from the tubular or tray packaging, places the chip one by one into the material slot of the reel, ensures that the chip orientation is compatible with the material slot, and after the transfer is completed, the reel is manually loaded into the corresponding feeder of the pick and place machine.

[0004] However, manual chip mounting is not only inefficient, but also prone to problems such as reverse mounting or misalignment, which can lead to defects in the chip mounting process, such as reversed parts or poor soldering. In some cases, improper operation can even cause chip damage, such as deformation of chip pins. Summary of the Invention

[0005] To address the shortcomings of existing technologies, this invention provides a chip transfer device, comprising: Machine tool; The feeding module, located on one side of the machine, is used to accommodate and output non-reel packaged chips to be transferred. The tape and reel module is located on the other side of the machine and includes a carrier tape reel, a take-up reel, and a hot-pressing and coating mechanism. The unloaded carrier tape is wound in the carrier tape reel, and its free end is wound on the take-up reel after passing through the hot-pressing and coating mechanism. And a transport module, spanning above the feeding module and the tape module, which has a material picking mechanism that moves above the feeding module and the tape module and moves toward or away from the feeding module and the tape module in the vertical direction.

[0006] According to one embodiment of the present invention, the feeding module includes at least one set of tubular material feeding mechanisms. The tubular material feeding mechanism includes a flipping part and an inserting part. The flipping part is disposed on the machine base. The inserting part includes an inserting plate with multiple inserting slots. The multiple inserting slots are arranged on the upper surface of the inserting plate along the length direction of the inserting plate. Each inserting slot is disposed through the inserting plate along the width direction. A baffle is provided on one side of the inserting plate along its length direction. The baffle closes one end of the multiple inserting slots.

[0007] According to one embodiment of the present invention, the insert part further includes a locking assembly, which includes a locking plate, a connecting plate, a plurality of connecting rods and a plurality of elastic elements. The insert plate is also provided with a plurality of through holes, which are spaced apart from the insert groove along the length direction of the insert plate. The connecting plate is located below the insert plate, the locking plate is located above the insert plate, the connecting rods are located in the through holes and are respectively connected to the connecting plate and the locking plate at both ends, and the elastic elements are sleeved on the outside of the connecting rods, with their two ends abutting against the connecting rods and the insert plate respectively. There is a material picking interval between the locking plate and the baffle.

[0008] According to one embodiment of the present invention, the insert part further includes a plurality of limiting components. The limiting components include a mounting frame and a plurality of limiting pieces. The two ends of the mounting frame are fixed to the two ends of the insert plate in the length direction and are mounted above the locking component. The plurality of limiting pieces are arranged on the mounting frame along the length direction of the mounting frame and correspond one-to-one with the insert groove. One end of each limiting piece is fixed on the mounting frame, and the other end extends toward the material picking interval and is inclined toward the bottom of the insert groove.

[0009] According to one embodiment of the present invention, the limiting piece includes a fixed end fixed to the mounting frame, an elastic arm extending from the fixed end, and an abutment portion disposed at the end of the elastic arm. The abutment portion has a feed surface facing away from the material picking interval and a blocking surface facing the material picking interval. The feed surface is an inclined surface, and the blocking surface is a vertical surface or a barbed surface.

[0010] According to one embodiment of the present invention, the feeding module includes at least one set of disc material feeding mechanisms. The disc material feeding mechanism includes a transverse drive mechanism and a bearing plate. One end of the transverse drive mechanism is disposed on the machine base, and the other end extends out of the machine base along the width direction of the machine base. The bearing plate is driven on the transverse drive mechanism.

[0011] According to one embodiment of the present invention, it further includes a vision inspection module, which includes multiple cameras, which are respectively disposed above the feeding module and the tape-and-reel module.

[0012] A method for SMT (Surface Mount Technology) component transfer, characterized by including chip transfer equipment and the following steps: S1, Solder paste printing: Solder paste is printed onto the pads of the printed circuit board through a stencil; S2, Chip Transfer: Non-reel packaged chips are packaged onto carrier tape using chip transfer equipment and then wound into reels to form a standard feeding unit compatible with the feeder of the pick-and-place machine; S3, Component mounting: Load the standard feeding unit formed in step S2 onto the pick-and-place machine feeder, and use the pick-and-place machine to pick up the chip and mount it onto the PCB that has been printed with solder paste in step S1; S4, Reflow Soldering: The PCB with the chip mounted is sent into the reflow oven, where the solder paste is melted and electrical connections are formed by a preset temperature profile. S5, Quality Inspection: Defect detection is performed on the soldered PCB using automated optical inspection equipment.

[0013] According to one embodiment of the present invention, step S2 further includes the following sub-steps: S21, Material preparation: Select the corresponding feeding mode according to the chip packaging type, and transport the chip to be converted to the picking station through the feeding module; S22, Chip Detection: The vision inspection module detects whether there are chips to be transferred at the material handling station. If a chip is detected, proceed to step S23; if no chip is detected, issue a material shortage alarm and pause the equipment. After replenishing the material, re-inspect. S23, Chip Pickup and Placement: The pickup mechanism of the carrier module moves above the pickup station, picks up the chip, and places the chip into the carrier groove of the tape module; S24, Chip Placement Detection: The vision inspection module detects whether the chip is placed in the carrier tape groove and is in the correct orientation. If the detection is qualified, proceed to step S25; if the placement is abnormal, an alarm is issued and the equipment is paused. After the abnormality is corrected, the detection is repeated. S25, Tape sealing and winding: The tape module seals the carrier tape with a heat-pressing film coating mechanism, and the take-up reel continuously winds it into a finished reel.

[0014] According to one embodiment of the present invention, step S21, material preparation, specifically includes: S211, Feeding mode configuration: Configure the feeding module to either tubular or tray feeding mode according to the packaging form of the chip to be converted, and confirm that the mode matches the packaging type. S212, If the chip packaging is tubular, a tubular feeding mechanism is used for feeding; S213, if the chip packaging is in a disc shape, then a disc-shaped feeding mechanism is used for feeding.

[0015] The beneficial effects of this invention are as follows: In this application, by setting up chip transfer equipment, chips in different packages are automatically transferred into reel packaging to adapt to standardized feeders, which greatly improves the efficiency and quality of chip transfer in SMT assembly process, and thus greatly improves the production efficiency and production quality of SMT assembly process. Attached Figure Description

[0016] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings: Figure 1 This is a schematic diagram of the chip transfer equipment in Example 1; Figure 2 This is one of the structural schematic diagrams of the tubular material feeding mechanism in Embodiment 1; Figure 3 This is the second schematic diagram of the tubular material feeding mechanism in Embodiment 1; Figure 4 This is a schematic diagram of the limiting piece structure in Example 1; Figure 5 This is a schematic diagram of the tape and reel module structure in Example 1; Figure 6 for Figure 5 Enlarged view of section A in the middle; Figure 7 This is a schematic diagram of the material handling mechanism in Example 1; Figure 8 This is a flowchart of the SMT material feeding and conversion method in Example 2. Detailed Implementation

[0017] The following drawings disclose several embodiments of the present invention. For clarity, many practical details will be described in the following description. However, it should be understood that these practical details are not intended to limit the invention. That is, in some embodiments of the invention, these practical details are not essential. Furthermore, for the sake of simplicity, some conventional structures and components will be shown in the drawings in a simple schematic manner.

[0018] Furthermore, in this invention, the use of terms such as "first" and "second" is for descriptive purposes only and does not specifically refer to any order or sequence, nor is it intended to limit the invention. They are merely used to distinguish components or operations described using the same technical terms, and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of various embodiments can be combined with each other, but only if they are feasible for those skilled in the art. If a combination of technical solutions is contradictory or impossible to implement, such a combination should be considered nonexistent and not within the scope of protection claimed by this invention.

[0019] Example 1: See Figure 1-7 , Figure 1 This is a schematic diagram of the chip transfer equipment in the embodiment. Figure 2 This is one of the structural schematic diagrams of the tubular material feeding mechanism in the embodiments. Figure 3 This is the second schematic diagram of the tubular material feeding mechanism in the embodiment. Figure 4 This is a schematic diagram of the limiting piece structure in the embodiment. Figure 5 This is a schematic diagram of the tape and reel module structure in the embodiment. Figure 6 for Figure 5 Enlarged view of part A in the middle. Figure 7 This is a schematic diagram of the material handling mechanism in the embodiment. A chip transfer device in this example includes a machine base 1, a feeding module 2, a tape and reel module 3, and a transport module 4. The feeding module 2 and the tape and reel module 3 are respectively located on opposite sides of the machine base 1. The transport module 4 spans above the feeding module 2 and the tape and reel module 3 and has a material handling mechanism 42. The tape and reel module 3 includes a carrier reel 31, a take-up reel 32, and a hot-pressing coating mechanism 33. The unloaded carrier tape is wound inside the carrier reel 31, and its free end passes through the hot-pressing coating mechanism 33 before being wound onto the take-up reel 32. During operation, the feeding mechanism 42 picks up the chips from the feeding module 2 and transports them to the slots of the empty carrier tape in the tape-reeling module 3. During the receiving process, the receiving reel 32 pulls the carrier tape towards the receiving reel 32. During this process, the carrier tape is coated and sealed by the hot-pressing coating mechanism 33. Finally, it is wound back onto the receiving reel 32 to complete the chip transfer. In this example, through the cooperation of the feeding module 2, the tape-reeling module 3, and the transport module 4, chips in different packages are transferred into reel packaging.

[0020] Furthermore, the feeding module 2 includes at least one set of tubular material feeding mechanisms 21. Each tubular material feeding mechanism 21 includes a flipping part 211 and an inserting part 212. The flipping part 211 is mounted on the machine base 1. The inserting part 212 includes an inserting plate 2121. The inserting plate 2121 has multiple inserting slots 21211, which are arranged along the length of the inserting plate 2121 on its upper surface. Each inserting slot 21211 extends through the inserting plate 2121 along its width. A baffle 21212 is provided on one side of the inserting plate 2121 along its length, and the baffle 21212 closes one end of each inserting slot 21211. In use, the inserting slots 21211 are used to insert tubular materials. Before inserting the tubular material, the flipping part 211 drives the insertion part 212 to flip so that the end of the insertion slot 21211 away from the baffle 21212 tilts downward. Understandably, at this time, the opening of the tubular material is tilted upward and inserted into the insertion slot 21211, which can effectively prevent the chip from falling out during the insertion process. After the insertion slot 21211 is inserted, the flipping part 211 drives the insertion part 212 to rotate so that the end of the insertion slot 21211 with the baffle 21212 tilts downward. At this time, the opening end of the tubular material is also tilted downward, and the chip slides down the insertion slot 21211 to the baffle 21212 and is blocked by the baffle 21212. Finally, the flipping part 211 drives the insertion part 212 to rotate again so that the insertion slot 21211 is in a horizontal state, and then waits for the picking mechanism 42 to pick up the chip from the insertion slot 21211.

[0021] Specifically, the insert portion 212 further includes a locking assembly 2122, which includes a locking plate 21221, a connecting plate 21222, multiple connecting rods 21223, and multiple elastic elements 21224. The insert plate 212 also has multiple through holes 21213, which are spaced apart from the insert groove 21211 along the length of the insert plate 212. The connecting plate 21222 is located below the insert plate 212, and the locking plate 21221 is located above the insert plate 212. The connecting rods 21223 are located in the through holes 21213, and their two ends are respectively connected to the connecting plate 21222 and the locking plate 21221. The elastic elements 21224 are sleeved on the outside of the connecting rods 21223, and their two ends are respectively... The connecting rod 21222 and the insert plate 212 abut against each other. There is a material-receiving gap between the locking plate 21221 and the baffle 21212. The depth of the insert groove 21211 is less than the thickness of the tubular package. Thus, when the tubular package is inserted into the insert groove 21211, it presses against the locking plate 21221, causing the pressing plate 21221 to drive the connecting plate 21222 to press against the elastic element 21224. The potential energy conversion after compression of the elastic element 21224 further presses the locking plate 21221 firmly into the insert groove, preventing the tubular material from falling out. It is also understood that because there is a material-receiving gap between the locking plate 21221 and the baffle 21212, when the chip slides along the insert groove to the baffle 21212, it is precisely within the material-receiving gap, facilitating the material-receiving mechanism 42 to pick it up. In this example, the elastic element 21224 is a spring.

[0022] Preferably, the inserting part 212 further includes a plurality of limiting components 2123. The limiting components 2123 include a mounting frame 21231 and a plurality of limiting pieces 21232. The mounting frame 21231 is fixed at both ends in the length direction of the inserting plate 212 and is mounted above the locking component 2122. The plurality of limiting pieces 21232 are arranged on the mounting frame 21231 along the length direction of the mounting frame 21231 and correspond one-to-one with the inserting groove 21211. One end of each limiting piece 21232 is fixed on the mounting frame 21231, and the other end extends toward the material picking interval and is inclined toward the bottom of the inserting groove 21211. Specifically, the limiting piece 21232 includes a fixed end 212311 fixed to the mounting bracket 21231, an elastic arm 212312 extending from the fixed end 212311, and an abutment portion 212313 disposed at the end of the elastic arm 212312. The abutment portion 212313 has a feed surface 2123131 facing away from the material picking interval and a blocking surface 2123132 facing the material picking interval. The feed surface 2123131 is an inclined surface, and the blocking surface 2123132 is a vertical surface or a barbed surface. In a specific implementation, the distance between the abutment portion 212313 and the baffle 21212 is greater than the length of one chip and less than the total length of two chips. Thus, it can be understood that when the flipping part 211 drives the insert plate 2121 to flip, so that the open end of the tubular material is tilted downward, the chip inside the tubular package slides downward along the insert groove 21211 under the action of gravity, and first abuts against the feed surface 2123131 of the abutment part 212313. Since the feed surface 2123131 is an inclined surface, the downward thrust of the chip forces the elastic arm 212312 to undergo elastic deformation and bend upward, causing the abutment part 212313 to move upward, so that the chip can smoothly pass over the abutment part 212313 and enter the picking interval. When the flipping part 211 drives the insert plate 2121 to flip in the opposite direction, so that the open end of the tubular material is tilted upward, the chip located in the picking interval tends to flow back into the tubular package under the action of gravity. At this time, the chip end will abut against the blocking surface 2123132 of the abutment part 212313. Since the blocking surface 2123132 is a vertical or hooked surface, the squeezing force of the chip on the blocking surface 2123132 is mainly perpendicular to the bottom of the insertion slot 21211, and cannot generate an effective component force to bend the elastic arm 212312 upward. Therefore, the abutment part 212313 remains locked, preventing the chip from flowing back. Through this unidirectional conduction and reverse locking mechanism, it is ensured that after each flip feeding, only one chip remains in the picking interval, waiting for the precise picking mechanism 42 to pick it up. In specific implementation, the flipping part 211 can adopt a servo pulley module.

[0023] Furthermore, the feeding module 2 also includes at least one set of disc-shaped material feeding mechanisms 22. Each disc-shaped material feeding mechanism 22 includes a transverse drive mechanism 221 and a carrier plate 222. One end of the transverse drive mechanism 221 is located on the machine base 1, and the other end extends outwards along the width of the machine base 1. The carrier plate 222 is driven onto the transverse drive mechanism 221. In this example, the disc-shaped material feeding mechanism 22 is located between the tubular material feeding mechanism 21 and the tape and reel module 3. When the raw material is in disc packaging, the disc packaging is placed on the carrier plate 222. At this time, the transverse drive mechanism 221 transports the carrier plate to the movement path of the picking mechanism 42, where the picking mechanism 42 picks up the material. Thus, by setting the tubular material feeding mechanism 21 and the disc-shaped material feeding mechanism 22, the chip transfer equipment of this application can adaptably transfer different types of chip packaging, thereby improving the applicability of the chip transfer equipment. In this example, the transverse drive mechanism 221 uses a servo screw module.

[0024] Furthermore, it also includes a vision inspection module 5, which includes multiple cameras 51. It is understood that the feeding module 2, tape and reel module 3, transport module 4, and vision inspection module 5 are connected to an external control system. The multiple cameras are respectively positioned above the feeding module 2 and the tape and reel module 3. During operation, the cameras 51 located above the feeding module 2 are used to monitor in real time whether there are chips to be transferred at the picking position of the tubular material feeding mechanism 21 or the disc material feeding mechanism 22. When a chip arrival signal is detected, the external control system controls the transport module 4 to drive the picking mechanism 42 to perform a picking action. If no chip is detected, the system automatically triggers a material shortage alarm to prevent the picking mechanism 42 from picking up empty chips. Similarly, the camera 51 located above the tape and reel module 3 is used to detect whether the chip has been correctly placed in the carrier groove after the chip is placed. Only when the chip is detected to be present and in the correct orientation will the tape and reel module 3 perform the hot-press sealing process. Otherwise, an abnormal alarm will be triggered. Through the above dual visual detection mechanism, the invalid operation and idle running of the equipment are effectively avoided, and the working efficiency and production safety of the equipment are significantly improved.

[0025] Furthermore, the hot-pressing laminating mechanism 33 includes a support platform 331 and a hot-pressing mechanism 332. One end of the support platform 331 is placed on the machine base 1, and the other end extends outside the machine base 1. A carrier tape groove 3311 is provided on its upper surface along its length. The carrier tape reel 31 and the take-up reel 32 are both located at the end of the support platform 331 away from the machine base 1, and the take-up reel 32 is located above the carrier tape reel 31. The hot-pressing mechanism 332 includes a support frame 3321, a die head assembly 3322, and a heat-sealing film tray 3323. The support frame 3321 is located on one side of the support platform 331, and the hot-pressing mechanism 332 is located directly above the carrier tape groove 3311 and installed on... The support frame 3321 has a side wall on which the heat-sealing film tray 3323 is located above the hot pressing mechanism 332 and is also mounted on the side wall of the mounting frame 3321. The free end of the unloaded carrier tape is wound around the upper surface of the support platform 331 located at one end of the machine base 1, and passes through the carrier tape groove 3311 to the other end of the support platform 331 and is wound onto the take-up tray 32. The heat-sealing film is wound onto the heat-sealing film tray 3323, and passes around the die head assembly 3322 near the machine base 1 and enters the carrier tape groove 3311. The die head assembly 3322 heat-seales the free end of the heat-sealing film onto the carrier tape and wound it together with the carrier tape onto the take-up tray 32. In this example, both the carrier tape tray 31 and the heat-sealing die tray 3323 are unpowered trays, and the take-up tray 32 is connected to a drive motor 321.

[0026] Specifically, the die head assembly 3322 includes a die head frame 33221, a die head 33222, and a buffer assembly 33223. The die head frame 33221 is movably mounted on the support frame 3321 via a slide rail assembly. The die head 33222 is detachably mounted on the bottom of the die head frame 33221 and directly opposite the carrier tape groove 3311. The buffer assembly 33223 includes a guide post 33231 and a buffer element 33232. The mounting frame 3321 has one side... A stop block 33211 is also provided, with one end extending above the buffer assembly 33223. A guide post 33231 is installed at one end of the stop block 33211, and a buffer member 33232 is sleeved on the outer wall of the guide post 33231. The die head frame 33221 has a through hole corresponding to the guide post 33231, and the guide post 33231 passes through the through hole. Both ends of the buffer member 33232 abut against the die head frame 33221 and the stop block 33211. In this example, the buffer member 33232 is also a spring, and the die head 33222 is a thermoforming die head in the prior art. Understandably, by movably mounting the die head holder 33221 onto the support frame 3321, and in conjunction with the buffer assembly 33223, flexible floating buffering of the die head 33222 during hot pressing is achieved, while providing a constant preload force to the die head 33222, thereby effectively preventing chip damage due to excessive pressure, and ensuring the sealing and yield of the carrier tape package.

[0027] Furthermore, the transport module 4 also includes a horizontal drive mechanism 41, which is mounted above the feeding module 2 and the tape-making module 3 along the length of the machine base 1. The material picking mechanism 42 is installed on the horizontal drive mechanism 41. In specific implementation, the horizontal drive mechanism 42 can be a servo pulley module.

[0028] Furthermore, the material handling mechanism 42 includes a lifting part 421 and a material handling part 422. The lifting part 421 is driven by the horizontal drive mechanism 42 and also adopts a servo pulley module. The material handling part 422 includes an L-shaped mounting plate 4221, which is driven by the lifting part 421. A rotary joint 4222 and a rotary motor 4223 are installed on the upper surface of the L-shaped mounting plate 4221 and are installed from top to bottom. A suction nozzle assembly 4224 is installed on the lower surface of the L-shaped plate 4221 and is driven by the rotary motor 4223. In this example, the rotary motor 4223 is a hollow rotary motor. The upper end of the rotary joint 4222 is connected to an external negative pressure system to provide negative pressure suction force for the suction nozzle assembly 4224. Understandably, by using a rotary joint 4222 in conjunction with a rotary motor 4223, the chip can be dynamically rotated and adjusted according to the position of its long and wide sides after being picked up, so that the chip's orientation matches the length and width of the carrier groove, significantly improving the applicability and compatibility of the equipment with different packaging specifications.

[0029] In this example, the feeding module 2, the tape and reel module 3, and the transport module 4 work together to efficiently transfer chips in different packages into the reel packaging, while avoiding defects such as reversed chip mounting and pin damage, effectively improving production efficiency and quality.

[0030] Example 2: See Figure 8 Review Figures 1-7 , Figure 8 This is a flowchart of the SMT material feeding and transfer method in this embodiment. The SMT material feeding and transfer method in this example is based on the chip transfer equipment in Embodiment 1, and includes the following steps: S1, solder paste printing: solder paste is printed onto the pads of the printed circuit board using a stencil; S2, Chip Transfer: Non-reel packaged chips are packaged into reels using automated equipment to form standard feeding units; S3, Component mounting: Load the standard feeding unit formed in step S2 onto the pick-and-place machine feeder, and use the pick-and-place machine to pick up the chip and mount it onto the PCB that has been printed with solder paste in step S1; S4, Reflow Soldering: The PCB with the chip mounted is sent into the reflow oven, where the solder paste is melted and electrical connections are formed by a preset temperature profile. S5, Quality Inspection: The soldered PCB is inspected for defects using automated optical inspection equipment, such as chip soldering defects, false soldering defects, and pin misalignment defects. If the inspection is qualified, it proceeds to the next process; if it is unqualified, it is marked and reworked.

[0031] Step S2 further includes the following sub-steps: S21, Material preparation: Output the chip to be transferred to the material picking station through the material supply module 2; S22, Chip Detection: The vision detection module 5 detects whether the material handling station has chips to be transferred. If a chip is detected, step S23 is executed; if no chip is detected, a material shortage alarm is issued first and the equipment is paused. After manual replenishment, the process returns to S22 for re-detection. S23, Chip Pickup and Placement: The picking mechanism 42 of the transport module 4 moves above the picking station, picks up the chip, and places the chip into the carrier groove of the tape module 3. S24, Chip Placement Detection: The vision detection module 5 detects whether the chip has been correctly placed in the carrier tape groove. If it has been placed, proceed to step S25. After manually checking for abnormalities (such as chip misalignment or carrier tape damage) and correcting them, return to S24 for re-detection. S25, Tape sealing and winding: The tape module 3 performs hot-press sealing on the carrier tape through the hot-press coating mechanism 33, and then winds it up through the take-up tray 32.

[0032] Furthermore, step S21 also includes the following sub-steps: S211, Feeding mode configuration: Configure the working mode of feeding module 2 according to the packaging type of the chip to be converted; S212, if the chip packaging is tubular, the tubular feeding mechanism 21 is used for feeding; S213, if the chip packaging is a disc-shaped package, then the disc-shaped material feeding mechanism 22 is used for feeding.

[0033] Specifically, S212 also includes the following sub-steps: S2121: The flipping part 211 causes one end of the insert groove 21211 to tilt downward, and the open end of the tubular material is inserted into the insert groove 21211 at an angle upward. S2122: The flipping part 211 causes the insertion slot 21211 to flip in the opposite direction, so that the opening end of the tubular material tilts downwards and the chip slides into the picking interval; S2123: The flipping part 211 flips the insert groove 21211 to a horizontal state, and the picking mechanism picks up the material at the picking interval.

[0034] Furthermore, step S213 also includes the following sub-steps: S2131, Place the disc-shaped package on the carrier tray 222.

[0035] S2132, the lateral drive mechanism 221 drives the carrier disk 222 to move below the motion path of the picking mechanism 42, and the picking mechanism 42 picks up the chip in the disk-shaped package.

[0036] Specifically, in step S23, after the material handling mechanism 42 picks up the chip, the rotary motor 4223 drives the nozzle assembly 4224 to rotate, adjusting the orientation of the chip so that the long side or wide side of the chip matches the long side or wide side of the carrier tape groove.

[0037] In summary, this application utilizes chip transfer equipment to replace manual chip transfer, which greatly improves the efficiency and quality of chip transfer in the SMT (Surface Mount Technology) process, thereby significantly enhancing the production efficiency and quality of the SMT process.

[0038] The above description is merely an embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principle of the present invention should be included within the scope of the claims of the present invention.

Claims

1. A chip transfer device, characterized in that, include: Machine (1); The feeding module (2) is located on one side of the machine (1) and is used to accommodate and output non-reel packaged chips to be transferred; The tape feeding module (3) is located on the other side of the machine (1) and includes a carrier tape reel (31), a take-up reel (32) and a hot-pressing coating mechanism (33). The unloaded carrier tape is wound in the carrier tape reel (31), and its free end is wound on the take-up reel (32) after passing through the hot-pressing coating mechanism (33). And a transport module (4) spans above the feeding module (2) and the tape module (3), having a material picking mechanism (42) that moves above the feeding module (2) and the tape module (3) and moves toward or away from the feeding module (2) and the tape module (3) in the vertical direction.

2. The chip transplanted device according to claim 1, characterized in that, The feeding module (2) includes at least one set of tubular material feeding mechanism (21). The tubular material feeding mechanism (21) includes a flipping part (211) and an inserting part (212). The flipping part (211) is provided on the machine base (1). The inserting part (212) includes an inserting plate (2121). The inserting plate (2121) has multiple inserting slots (21211). The multiple inserting slots (21211) are arranged along the length direction of the inserting plate (2121) on the upper surface of the inserting plate (2121). Each inserting slot (21211) is provided through the inserting plate (2121) along the width direction. A baffle (21212) is provided on one side of the inserting plate (2121) along its length direction. The baffle (21212) is closed at one end of the multiple inserting slots (21211).

3. The chip transloading apparatus of claim 2, wherein, The insert part (212) further includes a locking assembly (2122), which includes a locking plate (21221), a connecting plate (21222), multiple connecting rods (21223), and multiple elastic elements (21224). The insert plate (212) is also provided with multiple through holes (21213), which are spaced apart from the insert groove (21211) along the length of the insert plate (212). The connecting plate (21222) is located on the insert plate (21221). 12) Below, the locking plate (21221) is located above the insert plate (212), the connecting rod (21223) is located in the through hole (21213), and its two ends are respectively connected to the connecting plate (21222) and the locking plate (21221). The elastic element (21224) is sleeved on the outside of the connecting rod (21223), and its two ends abut against the connecting rod (21222) and the insert plate (212) respectively. There is a material picking interval between the locking plate (21221) and the baffle (21212).

4. The chip transplanted device according to claim 3, characterized in that, The insert part (212) also includes multiple limiting components (2123). The limiting components (2123) include a mounting frame (21231) and multiple limiting pieces (21232). The mounting frame (21231) is fixed at both ends of the insert plate (212) along its length and is mounted above the locking component (2122). Multiple limiting pieces (21232) are arranged on the mounting frame (21231) along its length and correspond one-to-one with the insert groove (21211). One end of each limiting piece (21232) is fixed on the mounting frame (21231), and the other end extends toward the material picking interval and is inclined toward the bottom of the insert groove (21211).

5. The chip transloading apparatus of claim 4, wherein, The limiting piece (21232) includes a fixed end (212311) fixed to the mounting bracket (21231), an elastic arm (212312) extending from the fixed end (212311), and an abutment portion (212313) disposed at the end of the elastic arm (212312). The abutment portion (212313) has a feed surface (2123131) facing away from the material picking interval and a blocking surface (2123132) facing the material picking interval. The feed surface (2123131) is an inclined surface, and the blocking surface (2123132) is a vertical surface or a barbed surface.

6. The chip transpod device of claim 1, wherein, The feeding module (2) includes at least one set of disc material feeding mechanism (22). The disc material feeding mechanism (22) includes a transverse drive mechanism (221) and a bearing plate (222). One end of the transverse drive mechanism (221) is located on the machine base (1), and the other end extends out of the machine base (1) along the width direction. The bearing plate (222) is driven on the transverse drive mechanism (221).

7. The chip transpod device of claim 1, wherein, It also includes a vision inspection module (5), which includes multiple cameras (51), which are respectively located above the feeding module (2) and the tape-and-reel module (3).

8. A method of SMT feed conversion, characterized in that The chip transfer apparatus, including any one of claims 1-7, further includes the following steps: S1, Solder paste printing: Solder paste is printed onto the pads of the printed circuit board through a stencil; S2, Chip Transfer: Non-reel packaged chips are packaged onto carrier tape and wound into reels using the chip transfer equipment to form a standard feeding unit compatible with the feeder of the pick-and-place machine; S3, Component mounting: Load the standard feeding unit formed in step S2 onto the pick-and-place machine feeder, and use the pick-and-place machine to pick up the chip and mount it onto the PCB that has been printed with solder paste in step S1; S4, Reflow Soldering: The PCB with the chip mounted is sent into the reflow oven, where the solder paste is melted and electrical connections are formed by a preset temperature profile. S5, Quality Inspection: Defect detection is performed on the soldered PCB using automated optical inspection equipment.

9. The SMT feed conversion method of claim 8, wherein, Step S2 also includes the following sub-steps: S21, Material preparation: Select the corresponding feeding mode according to the chip packaging type, and transport the chip to be converted to the picking station through the feeding module (2); S22, chip detection: The visual detection module (5) detects whether the material handling station has a chip to be transferred. If a chip is detected, step S23 is executed; if no chip is detected, a material shortage alarm is issued and the equipment is paused. After replenishment, the detection is repeated. S23, chip picking and placement: the picking mechanism (42) of the transport module (4) moves to the top of the picking station, picks up the chip, and places the chip into the carrier groove of the tape module (3); S24, Chip Placement Detection: The vision inspection module (5) detects whether the chip in the carrier groove is placed in place and in the correct posture. If the detection is qualified, step S25 is executed; if the placement is abnormal, an alarm is issued and the equipment is paused. After the abnormality is corrected, the detection is repeated. S25, Tape sealing and winding: The tape module (3) seals the carrier tape with heat-pressing film through the heat-pressing film coating mechanism (33), and the take-up tray (32) continuously winds it to form a finished roll.

10. The SMT feed conversion method of claim 9, wherein, Step S21, material preparation, specifically includes: S211, Material feeding mode configuration: According to the packaging form of the chip to be converted, configure the feeding module (2) as tubular material feeding mode or tray material feeding mode, and confirm that the mode matches the packaging type; S212, if the chip packaging is tubular, the tubular feeding mechanism (21) is used for feeding; S213, if the chip packaging is a disc-shaped package, then the disc-shaped material feeding mechanism (22) is used for feeding.

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