An electroplating solution mixing and adjusting device for precise control of bump height
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- ZHEJIANG XINZHI MICROELECTRONICS TECH CO LTD
- Filing Date
- 2026-04-28
- Publication Date
- 2026-06-30
Smart Images

Figure CN122298258A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of electroplating solution ratio adjustment technology, specifically to an electroplating solution ratio adjustment device for precisely controlling the height of bumps. Background Technology
[0002] In advanced semiconductor packaging processes, the consistency of bump height is a key indicator of packaging quality. To achieve precise control of bump height, the ratio and physical state of the plating solutions (such as copper sulfate plating solution, additives, leveling agents, etc.) are crucial.
[0003] Currently, the main technical challenges in the preparation of electroplating solutions are as follows: Bubble interference problem: Traditional methods of adding chemicals, such as dripping or pouring from above, can easily generate macroscopic bubbles or trap micro-bubbles when the liquid impacts the surface. During electroplating, bubbles adhering to the wafer surface can form plating voids or cause uneven current distribution, directly leading to inaccurate bump height or the production of defective products.
[0004] Insufficient mixing uniformity: The additive content in electroplating solutions is usually extremely low (ppm level), and the density and viscosity of different components vary. If mixing is insufficient or there are dead zones in the flow field, it will cause local fluctuations in the composition of the solution, which in turn will affect the electroplating rate and the uniformity of bump growth.
[0005] Low integration of equipment: Existing mixing equipment usually separates the functions of stirring, degassing and liquid injection, which not only increases the size of the equipment, but also makes it difficult to achieve real-time physical defoaming and uniform mixing while dynamically injecting liquid.
[0006] Therefore, developing a drug ratio adjustment device that integrates precision liquid injection, synchronous stirring, and mechanical degassing, and effectively avoids air entrapment, is an urgent need to improve the accuracy of bump height control. Summary of the Invention
[0007] In order to overcome the above-mentioned technical problems, the purpose of this invention is to provide an electroplating solution ratio adjustment device for accurately controlling the height of bumps, so as to solve the problems mentioned in the background art.
[0008] To achieve the above objectives, the present invention provides the following technical solution: An electroplating solution mixing ratio adjustment device for precisely controlling bump height includes: an upper vibration mechanism for containing the main solution and generating a mixing driving force and an antifoaming vibration force, the upper vibration mechanism including an upper liquid box, and a rotating component, a guiding control component, and a vibration triggering component disposed within the upper liquid box; a lower housing mechanism for supporting the upper vibration mechanism and discharging the solution, including a lower housing component, with a vibration isolation component between the lower housing component and the upper vibration mechanism; and a nozzle mechanism for controlled axial movement to enter the upper liquid box and inject a secondary solution, and for mechanical transmission cooperation with the upper vibration mechanism; the nozzle mechanism contacts the rotating component during downward movement to drive it to perform axial displacement, the guiding control component cooperates with the rotating component to convert the axial displacement into rotational motion, and the rotating component drives the vibration triggering component to generate mechanical impact through a transmission structure.
[0009] Preferably, the rotating assembly includes a rotating cylinder, the top end of which is provided with a stirring blade, and the top end of which is also rotatably connected with a contact head for contacting the injection nozzle mechanism, and the bottom end of the rotating cylinder is connected with an end ring.
[0010] Preferably, the guiding control component is located outside the rotating component. The guiding control component includes a guiding cylinder, which is connected to the bottom of the upper liquid box via a hanger. The bottom of the guiding cylinder is connected to a lower ring via a bracket.
[0011] Preferably, the inner wall of the guide cylinder is provided with a spiral groove corresponding to the end ring, and the end ring is fitted in the spiral groove. The end ring can move along the axis and rotate synchronously along the spiral groove of the inner wall of the guide cylinder.
[0012] Preferably, the vibration triggering assembly includes a triggering rod that passes through the rotating cylinder and is rotatably connected to the bottom of the guide cylinder.
[0013] Preferably, the transmission structure between the rotating component and the vibration triggering component is a spline transmission structure, the triggering rod is provided with spline teeth corresponding to the rotating cylinder, and the rotating cylinder is provided with spline grooves corresponding to the triggering rod.
[0014] Preferably, the bottom end of the trigger rod is connected to a toothed component, and the toothed component is externally engaged with two toothed claws, which are rotatably connected to the lower ring.
[0015] Preferably, a curved spring is provided between the toothed claw and the lower ring, and the toothed claw maintains contact and engagement with the toothed component through the elastic force of the curved spring.
[0016] Preferably, a return spring is provided between the bottom of the rotating cylinder and the guide cylinder; the vibration isolation component in the lower housing mechanism consists of four vibration isolation springs, which are connected between the hanger and the lower housing component.
[0017] Preferably, the lower housing is connected to a liquid outlet valve, which is connected to the bottom of the upper liquid box via a liquid pipe.
[0018] Preferably, the injection nozzle mechanism includes an injection nozzle body, a central shaft, an end plug, and an injection end; the central shaft is slidably connected to the injection nozzle body, and one end of the central shaft is connected to the end plug, which is fitted at the liquid outlet of the injection end.
[0019] Preferably, the top end of the trigger rod is used to contact and push the end plug upward when the injection nozzle mechanism moves down to a predetermined position, so as to open the liquid outlet of the injection end; the upper liquid box is made of transparent material and the surface of the upper liquid box is provided with liquid level scale lines.
[0020] Compared with the prior art, the beneficial effects of the present invention are: This device, through the cooperation of the injection nozzle mechanism and the vibration triggering component, ensures that the injection end is opened only after entering below the surface of the main solution. This submerged injection method eliminates macroscopic bubbles caused by chemical splashing and air entrainment from the physical source, ensuring the purity of the electroplating solution components and thus improving the consistency of bump height. By utilizing the mechanical energy of the downward movement of the injection nozzle mechanism, a rotating component is driven by a spiral groove to generate rotational stirring. At the same time, high-frequency vibration is generated by the impact of the toothed and clawed components. This design ensures that the drug solution is in a coupled state of strong stirring and high-frequency defoaming at the moment of injection of the auxiliary solution: stirring ensures rapid homogenization of the components at the molecular level, while vibration quickly eliminates the micro bubbles generated during the injection process and the residual bubbles attached to the surface of the mechanism, significantly improving the quality of drug solution preparation. By setting four vibration isolation springs in the lower housing, the adjustment vibration generated by the upper mechanism is effectively limited to the inside of the device. This not only ensures efficient defoaming in the upper liquid box, but also avoids mechanical vibration from interfering with the external support structure and precision measuring instruments, thus ensuring the stability of the entire production environment. The plug-in injection design places the injection nozzle mechanism at the top when not in operation, preventing it from prolonged contact with the solution. This not only facilitates cleaning and calibration of the injection tip but also avoids the problem of crystallization and blockage of electroplating salts at the nozzle, effectively extending the service life of the precision injection components and ensuring high control stability during long-term operation. Attached Figure Description
[0021] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the overall three-dimensional cross-section of the present invention; Figure 3 This is a schematic diagram of the overall two-dimensional cross-section of the present invention; Figure 4 This is a cross-sectional structural schematic diagram of the rotating component, the guiding control component, and the vibration triggering component of the present invention; Figure 5 This is a schematic diagram of the structure of the liquid inlet box, the guide control component, and the vibration triggering component of the present invention. Figure 6 This is a cross-sectional structural diagram of the initial state of the present invention.
[0022] In the diagram: 01, Upper vibration mechanism; 11, Upper liquid box; 12, Rotation assembly; 121, Rotation cylinder; 122, Stirring blade; 123, End ring; 124, Contact head; 13, Guide control assembly; 131, Guide cylinder; 132, Hanger; 133, Lower ring; 14, Vibration trigger assembly; 141, Trigger rod; 142, Gear; 143, Gear claw; 02, Lower housing mechanism; 21, Lower housing component; 22, Vibration isolation spring; 23, Liquid outlet valve; 03, Liquid injection nozzle mechanism; 31, Liquid injection nozzle body; 32, Central shaft; 33, End plug; 34, Liquid injection end. Detailed Implementation
[0023] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0024] One embodiment provided by the present invention: An electroplating solution mixing and adjusting device for precise control of bump height, comprising: Upper vibration mechanism 01, lower housing mechanism 02 and injection nozzle mechanism 03.
[0025] The upper vibration mechanism 01 includes an upper liquid box 11, a rotating component 12, a guide control component 13, and a vibration triggering component 14.
[0026] The rotating assembly 12 includes a rotating cylinder 121, with four stirring blades 122 connected in a ring at the top end of the rotating cylinder 121, a contact head 124 rotatably connected to the top end of the rotating cylinder 121, and an end ring 123 connected to the bottom end of the rotating cylinder 121.
[0027] The guide control component 13 is located outside the rotating component 12. The guide control component 13 includes a guide cylinder 131. A hanger 132 is connected to the guide cylinder 131. The guide cylinder 131 is connected to the bottom of the upper liquid box 11 through the hanger 132. A lower ring 133 is connected to the bottom of the guide cylinder 131 through a bracket.
[0028] The upper liquid box 11 is made of transparent material, and the surface of the upper liquid box 11 is provided with liquid level scale lines.
[0029] The inner wall of the guide cylinder 131 is provided with a spiral groove corresponding to the end ring 123, and the end ring 123 can move along the axis along the spiral groove on the inner wall of the guide cylinder 131. When moving, it will rotate due to the guidance of the spiral groove. When the end ring 123 rotates and moves, it will drive the rotating cylinder 121, the stirring blade 122 and the contact head 124 to move together.
[0030] The vibration triggering assembly 14 includes a triggering rod 141 that passes through the rotating cylinder 121. The triggering rod 141 is rotatably connected to the bottom of the guide cylinder 131. The triggering rod 141 is provided with spline teeth corresponding to the rotating cylinder 121, and the rotating cylinder 121 is provided with spline grooves corresponding to the triggering rod 141. When the rotating cylinder 121 rotates and moves axially, the rotating cylinder 121 drives the triggering rod 141 to rotate through the spline grooves and spline teeth, but the triggering rod 141 does not move axially.
[0031] The bottom end of the trigger rod 141 is connected to a toothed member 142. The toothed member 142 rotates with the trigger rod 141. Two toothed claws 143 mesh with the outside of the toothed member 142. The toothed claws 143 are rotatably connected to the lower ring 133. A curved spring is provided between the toothed claws 143 and the lower ring 133. The curved spring causes the toothed claws 143 to continuously mesh with the toothed member 142.
[0032] A spring is provided between the bottom of the rotating cylinder 121 and the guide cylinder 131 for resetting the rotating cylinder 121.
[0033] The lower housing mechanism 02 includes a lower housing component 21, which is provided with four vibration isolation springs 22. The vibration isolation springs 22 are connected between the hanger 132 and the lower housing component 21. A liquid outlet valve 23 is connected to the lower housing component 21.
[0034] The liquid outlet valve 23 is connected to the bottom of the upper liquid box 11 via a liquid pipe and is used to discharge the prepared electroplating solution.
[0035] The injection nozzle mechanism 03 includes an injection nozzle body 31, with a liquid supply pipe connected to the side of the injection nozzle body 31. An external bracket is provided on the surface of the injection nozzle body 31, and an external control device is connected to the injection nozzle body 31 through the external bracket. The axial height of the injection nozzle mechanism 03 is adjusted by the control device. It should be noted that this control device includes, but is not limited to, electric telescopic rods, hydraulic telescopic rods, pneumatic telescopic rods, etc. Any device that can control the raising or lowering of the injection nozzle mechanism 03 can be considered a control device for the injection nozzle mechanism 03.
[0036] The bottom end of the injection nozzle body 31 is connected to an injection end 34. A central shaft 32 is slidably connected inside the injection nozzle body 31. One end of the central shaft 32 is connected to an end plug 33. The injection end 34 is provided with a liquid outlet, and the end plug 33 is used to block the liquid outlet of the injection end 34.
[0037] Working principle: 1. Initial state and preparation of main solution: In the initial state (e.g.) Figure 6 As shown, the injection nozzle mechanism 03 is at its maximum stroke position under the drive of the external control device, remaining separated from the rotating assembly 12. The rotating assembly 12 is in its initial position at the top of the guide cylinder 131 under the return force of the spring. At this time, a predetermined amount of electroplating main solution is injected into the upper liquid box 11 according to the liquid level scale line on its surface.
[0038] 2. The process of simultaneous downward movement and rotary stirring: Subsequently, the injection nozzle mechanism 03, loaded with the secondary solution, begins to descend smoothly under the drive of the control device. When the bottom of the injection end 34 contacts the contact head 124 at the top of the rotating assembly 12, the injection nozzle mechanism 03 continues to move downwards, pushing the entire rotating assembly 12 synchronously downwards along the axis. During this process, the end ring 123 is limited and guided by the spiral groove on the inner wall of the guide cylinder 131, forcibly driving the rotating cylinder 121, stirring blade 122, and contact head 124 to rotate while moving downwards. The rotating stirring blade 122 fully agitates the main solution in the upper liquid box 11, enhancing the fluidity of the liquid and laying the foundation for subsequent uniform mixing of the main and secondary solutions.
[0039] 3. Mechanically triggered vibration and defoaming process: While the rotating cylinder 121 rotates, the spline groove and spline teeth mesh and drive the trigger rod 141 and the bottom toothed member 142 to rotate simultaneously (at this time, the trigger rod 141 maintains a fixed axial position). The rotating toothed member 142 continuously engages and disengages with the two toothed claws 143. Under the action of the spring's rebound force, the toothed claws 143 continuously impact the toothed member 142, thereby causing the entire upper vibration mechanism 01 to generate continuous high-frequency vibration. This vibration energy is transmitted to the main solution in the upper liquid box 11, causing the bubbles in the solution to rise rapidly and burst, achieving active defoaming treatment.
[0040] 4. Submersible injection and valve opening: As the injection nozzle mechanism 03 continues to descend, the injection tip 34 gradually submerges below the surface of the main solution. At this time, the tip of the trigger rod 141 in the vibration trigger assembly 14 touches the bottom of the end plug 33 inside the injection nozzle mechanism 03, generating an upward thrust. This thrust overcomes friction or pre-tightening force, pushing the central shaft 32 and the end plug 33 upward along the axial direction of the injection nozzle body 31, thereby releasing the blockage of the liquid outlet of the injection tip 34. At this time, the secondary solution is smoothly discharged below the liquid surface, effectively preventing the formation of new bubbles due to air being drawn in by the spillage or splashing of the medicine. Simultaneously, any tiny air bubbles that may be attached to the surface of the injection nozzle mechanism 03 are peeled off and removed under the transmission action of the continuous vibration of the upper vibration mechanism 01.
[0041] 5. Static stabilization injection and adjustment completed: When the injection nozzle mechanism 03 moves down to the bottom of its stroke position (such as...) Figures 1-3 As shown, when the end ring 123 disengages from the spiral guide or reaches the end of its stroke, the upper vibration mechanism 01 stops vibrating, and the rotating component 12 stops rotating. At this time, the auxiliary solution is continuously and stably injected into the main solution through the opened injection nozzle 34. The operator controls the injection volume of the auxiliary solution by observing the liquid level scale line or liquid level sensor on the upper liquid box 11, thereby achieving precise adjustment of the electroplating solution ratio. After preparation, the uniformly mixed and bubble-free electroplating solution is discharged through the outlet valve 23.
[0042] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.
Claims
1. A device for precisely controlling the height of bumps by adjusting the ratio of electroplating chemicals. Includes, characterized in that: The upper vibration mechanism is used to contain the main solution and generate mixing driving force and defoaming vibration force. The upper vibration mechanism includes an upper liquid box, and a rotating component, a guiding control component and a vibration triggering component disposed in the upper liquid box. The lower housing mechanism is used to support the upper vibration mechanism and realize the discharge of medicine. It includes a lower housing component, and a vibration isolation component is provided between the lower housing component and the upper vibration mechanism. The injection nozzle mechanism is used for controlled axial movement to enter the upper liquid box to inject the auxiliary solution, and it generates a mechanical transmission cooperation with the upper vibration mechanism. During the downward movement, the injection nozzle mechanism contacts the rotating component to drive it to perform axial displacement. The guiding control component cooperates with the rotating component to convert the axial displacement into rotational motion. The rotating component drives the vibration triggering component to generate mechanical impact through a transmission structure.
2. The electroplating solution mixing and adjusting device for precisely controlling bump height according to claim 1, characterized in that: The rotating assembly includes a rotating cylinder, with a stirring blade at the top of the rotating cylinder and a contact head rotatably connected to the top of the rotating cylinder for contacting the injection nozzle mechanism. An end ring is connected to the bottom of the rotating cylinder.
3. The electroplating solution mixing and adjusting device for precisely controlling bump height according to claim 2, characterized in that: The guiding control component is located outside the rotating component. The guiding control component includes a guiding cylinder, which is connected to the bottom of the upper liquid box via a hanger. The bottom of the guiding cylinder is connected to a lower ring via a bracket.
4. The electroplating solution mixing and adjusting device for precisely controlling bump height according to claim 3, characterized in that: The inner wall of the guide cylinder is provided with a spiral groove at the corresponding end ring, and the end ring fits in the spiral groove. The end ring can move along the axis and rotate synchronously along the spiral groove on the inner wall of the guide cylinder.
5. The electroplating solution mixing and adjusting device for precisely controlling bump height according to claim 3, characterized in that: The vibration triggering assembly includes a triggering rod that passes through the rotating cylinder and is rotatably connected to the bottom of the guide cylinder.
6. The electroplating solution mixing and adjusting device for precisely controlling bump height according to claim 5, characterized in that: The transmission structure between the rotating component and the vibration triggering component is a spline transmission structure. The triggering rod is provided with spline teeth corresponding to the rotating cylinder, and the rotating cylinder is provided with spline grooves corresponding to the triggering rod.
7. The electroplating solution mixing and adjusting device for precisely controlling bump height according to claim 5, characterized in that: The trigger rod is connected to a toothed component at its bottom end. Two toothed claws engage with the outside of the toothed component, and the toothed claws are rotatably connected to the lower ring.
8. The electroplating solution mixing and adjusting device for precisely controlling bump height according to claim 7, characterized in that: A curved spring is provided between the toothed claw and the lower ring, and the toothed claw maintains contact and engagement with the toothed component through the elastic force of the curved spring.
9. The electroplating solution mixing and adjusting device for precisely controlling bump height according to claim 3, characterized in that: A return spring is provided between the bottom of the rotating cylinder and the guide cylinder; the vibration isolation components in the lower housing mechanism are four vibration isolation springs, which are connected between the hanger and the lower housing component.
10. The electroplating solution mixing and adjusting device for precisely controlling bump height according to claim 1, characterized in that: The lower housing is connected to a liquid outlet valve, which is connected to the bottom of the upper liquid box via a liquid pipe.
11. The electroplating solution mixing and adjusting device for precisely controlling bump height according to claim 5, characterized in that: The injection nozzle mechanism includes an injection nozzle body, a central shaft, an end plug, and an injection end; the central shaft is slidably connected to the injection nozzle body, and one end of the central shaft is connected to the end plug, which is fitted at the liquid outlet of the injection end.
12. The electroplating solution mixing and adjusting device for precisely controlling bump height according to claim 11, characterized in that: The top of the trigger rod is used to contact and push the end plug upward when the injection nozzle mechanism moves down to a predetermined position, so as to open the liquid outlet of the injection end; the upper liquid box is made of transparent material and the surface of the upper liquid box is provided with liquid level scale lines.