Laser processing methods, equipment, systems, computer equipment, storage media, program products, and workpieces.

Abstract

This application relates to a laser processing method, equipment, system, computer equipment, computer-readable storage medium, computer program product, and workpiece. The method is applied to a laser processing equipment, which includes a laser, a rotating mirror, and a focusing system. The focusing system includes a first cylindrical mirror group and a second cylindrical mirror group. The laser is configured to emit a laser beam. The rotating mirror is disposed in the optical path of the laser beam and configured to rotate in a single direction to adjust the displacement component of the laser spot in the first direction. The first cylindrical mirror group is disposed in the optical path of the laser beam for focusing the laser beam along the first direction. The second cylindrical mirror group is disposed in the optical path of the laser beam for focusing the laser beam along a second direction, which is not collinear with the first direction. The focusing magnification of the second cylindrical mirror group is greater than that of the first cylindrical mirror group. This method can improve processing efficiency.

Description

Technical Field

[0001] This application relates to the field of laser processing technology, and in particular to a laser processing method, equipment, system, computer equipment, computer-readable storage medium, computer program product, and workpiece. Background Technology

[0002] In PCB (Printed Circuit Board) manufacturing processes, it is often necessary to process the surface or interior of the substrate, such as circuit pattern processing and surface roughening treatment.

[0003] Traditional technologies generate large amounts of wastewater from chemical etching, which contains various pollutants, including heavy metal ions, organic matter, and other chemicals. The wastewater is energy-intensive to treat and has a low recycling rate, which hinders the green development of the industry and increases the operating costs of enterprises. Some companies have begun to consider using galvanometers to deflect the laser to achieve laser direct writing.

[0004] However, laser direct writing is performed point by point, using a galvanometer to complete the processing of the entire processing range point by point, which is inefficient. Summary of the Invention

[0005] Therefore, it is necessary to provide a laser processing method, equipment, system, computer equipment, computer-readable storage medium, computer program product, and workpiece that can improve processing efficiency in response to the above-mentioned technical problems.

[0006] In a first aspect, this application provides a laser processing apparatus, which includes a laser, a rotating mirror, and a focusing system. The focusing system includes a first cylindrical mirror group and a second cylindrical mirror group, wherein:

[0007] A laser, configured to emit a laser beam;

[0008] A rotating mirror, positioned in the optical path of the laser beam, is configured to rotate in a single direction to adjust the displacement component of the laser beam spot in the first direction.

[0009] The first cylindrical mirror group is disposed in the optical path of the laser beam and is used to focus the laser beam along the first direction;

[0010] The second cylindrical lens group is disposed in the optical path of the laser beam and is used to focus the laser beam along the second direction. The second direction is not collinear with the first direction. The focusing magnification of the second cylindrical lens group is greater than that of the first cylindrical lens group.

[0011] In one embodiment, the laser processing equipment further includes:

[0012] The processing position control device is configured to change its working state to adjust the displacement component of the light spot in a third direction, which is not collinear with the first direction.

[0013] In one embodiment, the machining position control device includes at least one of an optical deflection device and a displacement platform, wherein:

[0014] The displacement platform is configured to place the substrate and move the substrate in the opposite direction of a third direction;

[0015] An optical deflection device, located in the optical path of the laser beam, is configured to change its operating state in a single direction to adjust the displacement component of the light spot in a third direction.

[0016] In one embodiment, the displacement platform is further configured to:

[0017] When the processing area of ​​the substrate is larger than the processing area of ​​the rotating mirror, the substrate is moved along the first direction.

[0018] In one embodiment, the laser is an ultrafast laser.

[0019] In one embodiment, the ratio of the focusing magnification of the second cylindrical lens group to that of the first cylindrical lens group is greater than or equal to 3.5.

[0020] Secondly, this application also provides a laser processing method, applied to the laser processing equipment described above, the method comprising:

[0021] The laser emits a laser beam and the rotating mirror rotates in a single direction so that the laser beam passes through the deflection of the rotating mirror, the focusing of the first cylindrical mirror group, and the focusing of the second cylindrical mirror group in sequence, and then processes the processing area of ​​the substrate.

[0022] The deflection of the rotating mirror is used to adjust the displacement component of the laser spot in the first direction. The first cylindrical mirror group is used to focus the laser beam along the first direction, and the second cylindrical mirror group is used to focus the laser beam along the second direction. The second direction is not collinear with the first direction, and the focusing magnification of the second cylindrical mirror group is greater than that of the first cylindrical mirror group.

[0023] Thirdly, this application also provides a laser processing system, including a controller and the aforementioned laser processing equipment, wherein the controller is used for:

[0024] The laser emits a laser beam and the rotating mirror rotates in a single direction so that the laser beam passes through the deflection of the rotating mirror, the focusing of the first cylindrical mirror group, and the focusing of the second cylindrical mirror group in sequence, and then processes the processing area of ​​the substrate.

[0025] The deflection of the rotating mirror is used to adjust the displacement component of the laser spot in the first direction. The first cylindrical mirror group is used to focus the laser beam along the first direction, and the second cylindrical mirror group is used to focus the laser beam along the second direction. The second direction is not collinear with the first direction, and the focusing magnification of the second cylindrical mirror group is greater than that of the first cylindrical mirror group.

[0026] Fourthly, this application also provides a computer device, including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to perform the following steps:

[0027] The laser emits a laser beam and the rotating mirror rotates in a single direction so that the laser beam passes through the deflection of the rotating mirror, the focusing of the first cylindrical mirror group, and the focusing of the second cylindrical mirror group in sequence, and then processes the processing area of ​​the substrate.

[0028] The deflection of the rotating mirror is used to adjust the displacement component of the laser spot in the first direction. The first cylindrical mirror group is used to focus the laser beam along the first direction, and the second cylindrical mirror group is used to focus the laser beam along the second direction. The second direction is not collinear with the first direction, and the focusing magnification of the second cylindrical mirror group is greater than that of the first cylindrical mirror group.

[0029] Fifthly, this application also provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, performs the following steps:

[0030] The laser emits a laser beam and the rotating mirror rotates in a single direction so that the laser beam passes through the deflection of the rotating mirror, the focusing of the first cylindrical mirror group, and the focusing of the second cylindrical mirror group in sequence, and then processes the processing area of ​​the substrate.

[0031] The deflection of the rotating mirror is used to adjust the displacement component of the laser spot in the first direction. The first cylindrical mirror group is used to focus the laser beam along the first direction, and the second cylindrical mirror group is used to focus the laser beam along the second direction. The second direction is not collinear with the first direction, and the focusing magnification of the second cylindrical mirror group is greater than that of the first cylindrical mirror group.

[0032] Sixthly, this application also provides a computer program product, including a computer program that, when executed by a processor, performs the following steps:

[0033] The laser emits a laser beam and the rotating mirror rotates in a single direction so that the laser beam passes through the deflection of the rotating mirror, the focusing of the first cylindrical mirror group, and the focusing of the second cylindrical mirror group in sequence, and then processes the processing area of ​​the substrate.

[0034] The deflection of the rotating mirror is used to adjust the displacement component of the laser spot in the first direction. The first cylindrical mirror group is used to focus the laser beam along the first direction, and the second cylindrical mirror group is used to focus the laser beam along the second direction. The second direction is not collinear with the first direction, and the focusing magnification of the second cylindrical mirror group is greater than that of the first cylindrical mirror group.

[0035] The aforementioned laser processing methods, equipment, systems, computer equipment, computer-readable storage media, computer program products, and workpieces, on the one hand, utilize a rotating mirror with a high scanning speed, reaching hundreds of meters per second. Therefore, using a rotating mirror to deflect the laser beam can effectively improve the processing efficiency of laser direct writing. On the other hand, by setting up the focusing system, the laser spot can be compressed to different degrees in the first and second directions. By reducing the focusing magnification in the first direction and increasing the focusing magnification in the second direction, an elliptical laser spot is formed. The first direction is the scanning direction of the rotating mirror. Therefore, by reducing the focusing magnification in the first direction, the spot spacing in the scanning direction of the rotating mirror can be reduced, thereby increasing the distribution density of the laser among the various microstructures processed on the substrate. This avoids the situation where, at a low laser repetition frequency, the excessively fast scanning speed of the rotating mirror results in a scattered distribution of microstructures on the substrate, failing to meet the actual processing requirements. Simultaneously, by increasing the focusing magnification in the second direction, the situation where the energy distribution is too dispersed and the energy density is insufficient due to an excessively large spot diameter in the first direction can be avoided, thus ensuring the effective execution of laser processing. Thus, the laser processing equipment provided in this application can effectively improve processing efficiency while ensuring superior processing results. Attached Figure Description

[0036] To more clearly illustrate the technical solutions in the embodiments of this application or related technologies, the drawings used in the description of the embodiments of this application or related technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0037] Figure 1 This is a schematic diagram of the structure of a laser processing device in one embodiment;

[0038] Figure 2 This is a schematic diagram illustrating a scenario in which the focusing system focuses a laser beam in different directions, as shown in one embodiment.

[0039] Figure 3 This is a schematic diagram of the structure of a laser processing system in one embodiment;

[0040] Figure 4 This is an internal structural diagram of a computer device in one embodiment. Detailed Implementation

[0041] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0042] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0043] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0044] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0045] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0046] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0047] In PCB (Printed Circuit Board) manufacturing processes, the surface or interior of the substrate often requires processing, such as circuit pattern processing and surface roughening. Traditionally, conductive lines are created using an exposure method, requiring steps such as film lamination, exposure, development, etching, and film removal, along with subsequent processing steps, to transfer the desired circuitry onto the PCB. Due to factors such as film quality and lamination effect, exposure quality can be affected, resulting in inconsistent line thickness, open circuits, short circuits, vias, and poor interlayer alignment. Furthermore, the cumbersome process steps and the need for additional processing or treatment materials not only increase costs but also reduce processing efficiency. Additionally, if the copper plating in the PCB is very smooth, the adhesion between the copper and adjacent material layers will be weak, necessitating surface roughening to improve the adhesion between the copper and adjacent material layers. Traditional copper surface roughening is achieved through browning and blackening. This involves using chemical reagents to create a uniform organic metal or oxide layer on the copper surface, increasing its roughness and thus increasing the contact area between the copper and other coatings such as resins and inks. This improves the bonding and adhesion between them, preventing the coating from peeling or delaminating. However, the browning and blackening processes require special solutions, generating large amounts of wastewater containing various pollutants, including heavy metal ions, organic matter, and other chemicals. Treatment of this wastewater is energy-intensive and has low recycling rates, hindering the industry's green development and increasing operating costs for businesses.

[0048] Laser direct writing technology is a technique that directly processes patterns onto a material by focusing a laser beam onto a small area of ​​the material and utilizing the interaction between the laser and the material. Currently, this is mainly achieved by using a galvanometer to deflect the laser beam. Although this method is environmentally friendly, the rotation speed of the galvanometer is relatively slow. In the process of processing multi-row microstructures, the time required to switch rows is long, resulting in extremely low roughening efficiency when using the galvanometer to complete the processing of the entire area point by point.

[0049] In one exemplary embodiment, a laser processing apparatus is provided, such as... Figure 1 As shown, the laser processing equipment includes a laser 102, a rotating mirror 104, and a focusing system 106. The focusing system includes a first cylindrical mirror group and a second cylindrical mirror group. The laser 102 is configured to emit a laser beam. The rotating mirror 104 and the focusing system 106 are both disposed on the optical path of the laser beam. The laser beam emitted by the laser 102 passes through the deflection of the rotating mirror 104, the focusing of the first cylindrical mirror group, and the focusing of the second cylindrical mirror group in sequence, and then processes the processing area of ​​the substrate 108.

[0050] The substrate can refer to materials that can be processed using lasers, including single-layer or multi-layer substrate structures formed from metal substrates, organic substrates, or composite materials. In some feasible embodiments, the substrate can refer to a PCB (Printed Circuit Board), which is a multi-layered structure containing metal layers, such as copper plates. Laser processing is not limited to processing copper plates or single layers; it can also process organic material layers, or simultaneously process metal and organic material layers.

[0051] Laser processing can include at least one of surface roughening, circuit processing, and material thinning. Specifically, at least one of drilling, etching, and patterning can be used to process microstructures, such as blind holes and grooves, on the surface or inside of a substrate. Non-interconnected microstructures can make the substrate surface have an uneven morphology, thereby achieving surface roughening. Interconnected microstructures can also make the substrate surface have an uneven morphology, thereby achieving surface roughening. The substrate thickness can also be reduced, thus achieving material thinning.

[0052] A laser is used to emit a laser beam, which is then incident on the surface or interior of a substrate to concentrate laser energy onto the surface or interior of the substrate, forming a spot on the surface or interior of the substrate. The laser energy at the spot is then used to form microstructures on the surface or interior of the substrate.

[0053] A rotating mirror refers to a polyhedral rotating scanning mirror. It utilizes mirrors uniformly distributed on the outer surface of the polyhedron to deflect a laser beam, thereby controlling the position of the laser beam spot on the substrate surface or interior, thus enabling processing at different locations on the substrate surface or interior. The laser spot refers to the area where the laser beam interacts with the substrate surface or interior. Without other factors affecting the laser beam deflection, as the rotating mirror rotates, the holes punched by the laser beam on the substrate surface or interior are linearly aligned. The specific direction of this linear alignment can be adjusted according to the actual situation.

[0054] For example, the rotating mirror can be a regular decagonal prism, a regular octagonal prism, or a regular dodecagonal prism, etc. Each facet of the rotating mirror has the same size and is coated with a high-reflectivity film. The more faces the rotating mirror has, the more scans can be performed in the same amount of time, but the smaller the deflection angle, the smaller the processing range. The faster the rotation speed of the rotating mirror, the higher the processing efficiency, but the greater the spacing between the light spots, resulting in a poorer coarsening or thinning effect. The specific method can be determined based on actual conditions and test results, etc., and this embodiment does not impose any limitations on this.

[0055] In some feasible implementations, the laser processing equipment may also include a detector emitter and a detector receiver for real-time detection of the angle of the rotating mirror and feedback information so that the rotating mirror maintains a stable rotation speed.

[0056] Compared to drilling using a galvanometer, the rotating mirror has two advantages: firstly, it rotates at a higher speed, achieving a higher scanning speed and thus significantly reducing processing time; secondly, the rotating mirror can automatically return the light spot to its initial position during rotation. This, combined with the displacement of the light spot in another direction, allows for switching from processing one row of holes to another during continuous movement. This effectively reduces the time spent on acceleration and deceleration each time switching to the next row, further improving processing efficiency.

[0057] A focusing system can refer to a combination of optical elements and mechanical structures used to concentrate a laser beam into a smaller area or focal point. The focusing system in this embodiment includes at least a first cylindrical lens group and a second cylindrical lens group. A cylindrical lens group can refer to an optical system composed of one or more cylindrical lenses. The focusing direction of the cylindrical lens is the same as the curvature direction of the cylindrical lens; therefore, by simply rotating the cylindrical lens to align its curvature direction with the desired focusing direction, the laser beam can be focused along the desired focusing direction. For example, as... Figure 2As shown, a laser beam with a circular cross-section is first focused by a cylindrical mirror with its curvature direction along the x-axis. After focusing, the cross-section of the laser beam is compressed along the x-axis while remaining unchanged in the y-axis. Then, it is focused by a cylindrical mirror with its curvature direction along the y-axis. After focusing, the cross-section of the laser beam is compressed along the y-axis while remaining unchanged in the x-axis. Moreover, the focusing magnification of the cylindrical mirror with its curvature direction along the y-axis is higher than that of the cylindrical mirror with its curvature direction along the x-axis. Therefore, the light spot after being focused by this focusing system is elliptical, and the major axis of this elliptical light spot coincides with the x-axis, while the minor axis coincides with the y-axis.

[0058] The first cylindrical lens group can refer to a cylindrical lens group used to focus a laser beam along a first direction. The second cylindrical lens group can refer to a cylindrical lens group used to focus a laser beam along a second direction. The second direction is not collinear with the first direction, and the focusing magnification of the second cylindrical lens group is greater than that of the first cylindrical lens group.

[0059] In some feasible embodiments, the focusing magnification of the first cylindrical lens group can be determined based on the preset first spot overlap rate of the light spot in the first direction and the rotation speed of the rotating mirror. The preset first spot overlap rate can be determined in advance according to actual needs. The preset first spot overlap rate is negatively correlated with the rotation speed of the rotating mirror and negatively correlated with the focusing magnification of the first cylindrical lens group. By adjusting the focusing magnification of the first cylindrical lens group and the rotation speed of the rotating mirror, the actual spot overlap rate of the light spot in the first direction can reach the preset first spot overlap rate.

[0060] In some feasible implementations, the focusing magnification of the second cylindrical lens group can be determined based on the focusing magnification of the first cylindrical lens group and a preset laser energy density. The laser energy density should ensure effective processing of the substrate. Once the substrate material and structure are determined, the laser energy density required for effective processing of the substrate can be determined. Since the spot diameter in the first direction needs to be coordinated with the rotation speed of the rotating mirror to meet the actual requirements of the preset second spot overlap rate, the spot diameter in the second direction is mainly used to adjust the laser energy density to achieve effective processing of the substrate. After determining the focusing magnification of the second cylindrical lens group, the actual spot overlap rate in the second direction can be adjusted to meet the actual requirements of the preset second spot overlap rate by adjusting the movement speed of the spot in the second direction.

[0061] In some feasible embodiments, the laser processing equipment may also include a deflector. By deploying the deflector, the optical path can be controlled so that the laser beam emitted by the laser can pass through the deflector, the first cylindrical mirror group, and the second cylindrical mirror group in sequence and be incident on the processing area of ​​the substrate.

[0062] In some feasible implementations, the second direction can be perpendicular to the first direction. For example, assuming the first direction is the X-axis direction, the second direction can be the Y-axis direction. Under the deflection of the rotating mirror, the laser beam is distributed along the X-axis direction on the microstructure processed on the substrate. Under the action of the focusing system, the focusing magnification along the X-axis direction is less than the focusing magnification along the Y-axis direction, thus presenting an elliptical spot. The diameter of the elliptical spot in the X-axis direction is larger than its diameter in the Y-axis direction.

[0063] As an example, before laser processing the substrate, the laser parameters, the rotation speed of the rotating mirror, and the position of the focusing system can be set and adjusted in advance based on actual needs and the actual conditions of the laser processing equipment. During laser processing, the substrate can first be picked up manually, by a robot, or by a robotic arm and placed on the processing platform; then, the deflection angle of the rotating mirror is adjusted to the initial deflection angle; then, the laser is turned on and the rotating mirror is controlled to rotate uniformly at a preset speed, so that the laser beam emitted by the laser passes through the deflection of the rotating mirror, the focusing of the first cylindrical mirror group, and the focusing of the second cylindrical mirror group in sequence, before processing the processing area of ​​the substrate.

[0064] In some feasible embodiments, the laser processing equipment may also include a beam expander, which may be disposed in the incident light path of the rotating mirror. The laser beam expands the spot size and compresses the beam divergence angle before being incident on the rotating mirror for deflection.

[0065] In some feasible embodiments, when the processing platform on which the substrate is placed is a displacement platform, the laser processing equipment may also include an angle compensation optical deflection device. The angle compensation optical deflection device may be a galvanometer, a rotating mirror, or an acousto-optic deflector, etc. The angle compensation optical deflection device may be set in the incident light path or the outgoing light path of the rotating mirror to correct and compensate for the displacement deviation of the displacement platform.

[0066] In this embodiment, on the one hand, the scanning speed of the rotating mirror is relatively fast, reaching several hundred meters per second. Therefore, using the rotating mirror to deflect the laser beam can effectively improve the processing efficiency of laser direct writing. On the other hand, by setting the focusing system, the light spot can be compressed to different degrees in the first and second directions. By reducing the focusing magnification in the first direction and increasing the focusing magnification in the second direction, an elliptical light spot is formed. The first direction is the scanning direction of the rotating mirror. Therefore, by reducing the focusing magnification in the first direction, the light spot spacing in the scanning direction of the rotating mirror can be reduced, thereby increasing the distribution density of the laser among the various microstructures processed on the substrate. This avoids the situation where, when the repetition frequency of the laser is low, the scanning speed of the rotating mirror is too fast, resulting in a scattered distribution of microstructures on the substrate, which is difficult to meet the actual processing requirements. At the same time, by increasing the focusing magnification in the second direction, the situation where the energy distribution is too dispersed and the energy density is insufficient due to the excessively large light spot diameter in the first direction can be avoided, thereby ensuring the effective execution of laser processing. In this way, the laser processing equipment provided in this application can effectively improve processing efficiency while ensuring better processing results.

[0067] In some feasible embodiments, the laser processing equipment further includes:

[0068] The processing position control device is configured to change its working state to adjust the displacement component of the light spot in a third direction, which is not collinear with the first direction.

[0069] The processing position control device refers to a device capable of moving the position of the laser beam spot formed on or inside a substrate by changing its operating state. This includes at least one of optical deflection devices and displacement controllers. A displacement controller is a device that can control the movement of any one or more modules in a laser processing equipment. Changing the operating state of the displacement controller can refer to its movement. For example, a displacement controller can control the movement of a processing platform, thereby moving the substrate on the platform. This allows for movement of the laser spot by changing the relative position of the substrate with the entire optical path system. Alternatively, a displacement controller can control the movement of other modules besides the processing platform, also changing the relative position of the substrate with the entire optical path system, thus achieving movement of the laser spot. An optical deflection device can refer to an optical element or system capable of changing the propagation direction of a laser beam by changing its operating state. This includes galvanometers, acousto-optic deflectors, or rotating mirrors. Changing the operating state of a galvanometer can refer to its rotation, as can changing the operating state of a rotating mirror. Changing the operating state of an acousto-optic deflector can refer to changes in its acoustic mode, diffraction efficiency, etc.

[0070] The third direction is not collinear with the first direction, and the third direction may be the same as or different from the second direction. In some feasible embodiments, the third direction is the same as the second direction and is perpendicular to the first direction.

[0071] As an example, simultaneously with activating the laser, the processing position control device can also be controlled to change its working state according to a preset change speed. The processing position control device works in conjunction with a rotating mirror. The deflection of the laser beam by each mirror of the rotating mirror is one scanning cycle. Each scanning cycle can process a row of holes on the processing area of ​​the substrate. After one scanning cycle, the laser beam is incident on the next mirror, and the deflection angle of the laser beam on the rotating mirror will immediately return to the initial deflection angle. With the displacement of the light spot in the third direction by the processing position control device, the processing process of switching from one row of holes to another row of holes can be realized during continuous movement. This can effectively reduce the time spent on acceleration and deceleration processes when switching to the next row, further improving processing efficiency and processing multiple rows of holes on the processing area of ​​the substrate, thereby achieving roughening treatment of the substrate surface.

[0072] The speed at which the light spot moves in the first direction is determined by the rotation speed of the rotating mirror, while the speed at which the light spot moves in the third direction is determined by the speed at which the processing position control device changes its operating state. By adjusting the rotation speed of the rotating mirror, the speed at which the processing position control device changes its operating state, and the duration of the rotating mirror's scanning cycle, it is possible to continuously process multiple rows of holes while maintaining a constant speed. This not only improves the efficiency of roughening the substrate surface but also allows for flexible control over the uniformity of the substrate surface roughness as needed. Specifically, the faster rotation speed of the rotating mirror can be used to quickly drill a row of holes within one scanning cycle. Then, by using the rotating mirror to deflect back to its initial deflection angle during scanning cycle switching, and by using the processing position control device to deflect the light spot in the third direction, the processing process can be switched from processing one row of holes to processing another row of holes. The spacing between different rows can be adjusted by using the slower speed at which the processing position control device changes its operating state. If a smaller spacing is required, the speed at which the processing position control device changes its operating state can be reduced; if a larger spacing is required, the speed at which the processing position control device changes its operating state can be increased.

[0073] In some feasible implementations, the operating state transition speed of the processing position control device can be flexibly set according to actual conditions. For example, within each scanning cycle, the operating state transition speed of the processing position control device can be small, such as 0. Then, when switching scanning cycles, the operating state transition speed of the processing position control device can be larger to achieve rapid deflection of the light spot in the third direction. Alternatively, the operating state transition speed of the processing position control device can be 0 for multiple scanning cycles to achieve repeated processing of the same row of microstructures, deepening the depth of each row of microstructures. After a preset number of scanning cycles, the operating state transition speed of the processing position control device is increased to achieve rapid deflection of the light spot in the third direction.

[0074] In this embodiment, the rotating mirror can automatically move the light spot back to its initial position during rotation. In this way, in conjunction with the processing position control device to displace the light spot in another direction, the processing process of one row of holes can be switched to another row of holes during continuous movement. This can effectively reduce the time spent on acceleration and deceleration processes each time switching to the next row, and further improve processing efficiency.

[0075] In one exemplary embodiment, the machining position control device includes at least one of an optical deflection device and a displacement platform, wherein:

[0076] The displacement platform is configured to place the substrate and move the substrate in the opposite direction of a third direction;

[0077] An optical deflection device, located in the optical path of the laser beam, is configured to change its operating state in a single direction to adjust the displacement component of the light spot in a third direction.

[0078] Among them, optical deflection devices can refer to optical elements or systems that can change the propagation direction of a laser beam by changing their working state, including galvanometers, acousto-optic deflectors, or rotating mirrors. The working state change of a galvanometer can refer to the rotation of the galvanometer, the working state change of a rotating mirror can refer to the rotation of the rotating mirror, and the working state change of an acousto-optic deflector can refer to the change of the acoustic wave mode, diffraction efficiency, etc. of the acousto-optic deflector.

[0079] As an example, when the processing position control device is a galvanometer, the working state of the galvanometer changes by rotation. By controlling the rotation of the galvanometer, the displacement component of the light spot in the third direction can be adjusted.

[0080] As another example, in the case of a displacement platform in a processing position control device, the working state of the displacement platform changes to movement. In this case, the displacement platform can drive the substrate to move in the opposite direction of the third direction, so that the light spot moves in the third direction.

[0081] In this embodiment, because the movement speed of the light spot in the third direction can be relatively slow, the displacement of the light spot in the third direction at the end of one scanning cycle and the beginning of the next scanning cycle is exactly equal to the spacing between the two rows of holes. The movement speed of both the optical deflection device and the displacement platform is sufficient to achieve the above process, and the cost is low.

[0082] In some feasible implementations, the displacement platform is also configured as follows:

[0083] When the processing area of ​​the substrate is larger than the processing area of ​​the rotating mirror, the substrate is moved along the first direction.

[0084] It should be noted that, since the processing area of ​​the rotating mirror is usually limited, if the processing area of ​​the substrate is large and exceeds the processing area of ​​the rotating mirror, it may not be possible to process the entire processing area.

[0085] As an example, the displacement platform can be controlled to move in the opposite direction of the third direction first, and cooperate with the rotating mirror to complete the processing of part of the processing area. Then, the displacement platform can be controlled to move in the first direction to position the processing range of the rotating mirror to the area of ​​the processing area that has not yet been processed, so as to realize the partition splicing processing.

[0086] In this embodiment, a displacement platform can be used to achieve splicing processing of a larger area than the processing area of ​​the rotating mirror.

[0087] In some feasible implementations, the laser is an ultrafast laser.

[0088] Ultrafast lasers are devices capable of generating lasers with extremely short pulse widths, typically in the picosecond, femtosecond, or even attosecond range. Examples include green picosecond lasers, green femtosecond lasers, infrared picosecond lasers, infrared femtosecond lasers, ultraviolet picosecond lasers, and ultraviolet femtosecond lasers. Ultrafast lasers can release enormous energy densities in a very short time, enabling efficient and effective processing of metallic materials while minimizing the heat-affected zone.

[0089] In PCB manufacturing, high-precision processing of copper surfaces is often required, such as copper thinning and roughening. Ultrafast lasers are well-suited for this purpose. However, due to frequency doubling efficiency limitations, ultrafast lasers have relatively low repetition rates, typically below 4MHz. Meanwhile, the rotating mirror speed ranges from 15r / s to 80r / s, and the scanning speed can reach 150 lines / s to 800 lines / s, with maximum scanning line speeds exceeding 200m / s. At high speeds, the low repetition rate of ultrafast lasers prevents the incident light spots on the substrate from overlapping, resulting in only point-like spots. Consequently, the microstructures processed on the substrate cannot be connected into linear structures, hindering thinning and achieving insufficient roughening effects.

[0090] By setting up a first cylindrical mirror group and a second cylindrical mirror group with different focusing magnifications, the laser beam can be focused in different directions. This can lengthen the processing range of the light spot in the direction of the rotating mirror deflection and compress the light spot in other directions, thus concentrating energy. In this way, even if the repetition frequency of the ultrafast laser is low, it can be combined with the high-speed scanning of the rotating mirror to compress the light spot in one direction while ensuring a large scanning area, meeting the requirements of the light spot overlap rate under high-speed conditions, and efficiently processing microstructures that are connected to each other in a linear shape.

[0091] In some feasible implementations, the ratio of the focusing magnification of the second cylindrical lens group to that of the first cylindrical lens group is greater than or equal to 3.5.

[0092] In this embodiment, when the ratio of the focusing magnification of the second cylindrical lens group to the focusing magnification of the first cylindrical lens group is greater than or equal to 3.5, the ultrafast laser and the rotating mirror can make adjacent light spots overlap, thereby processing microstructures that are connected to each other in a linear shape, and the effective scanning area can reach 300mm.

[0093] Based on the same inventive concept, this application also provides a laser processing method, which is applied to the laser processing equipment described above. The solution provided by this method is similar to the solution described in the above-described equipment; therefore, the specific limitations in one or more laser processing method embodiments provided below can be found in the limitations of the laser processing equipment described above, and will not be repeated here.

[0094] This embodiment illustrates the method using the terminal as the executing entity. The terminal can be a laser processing device or other terminals capable of controlling the laser processing device, such as various personal computers, laptops, smartphones, tablets, IoT devices, and portable wearable devices. The laser processing device can be one that uses a high-energy-density laser beam to roughen the surface of a material. Roughening refers to creating an uneven structure on the surface of the material by applying a laser beam to it. This can be achieved using at least one of the following processing techniques: laser drilling, engraving, or patterning. IoT devices can be smart speakers, smart TVs, smart air conditioners, smart in-vehicle devices, projection devices, etc. Portable wearable devices can be smartwatches, smart bracelets, head-mounted devices, etc. Head-mounted devices can be virtual reality (VR) devices, augmented reality (AR) devices, smart glasses, etc. It is understood that the executing entity of this method can also be a server, or a system including both a terminal and a server, and can be implemented through interaction between the terminal and the server.

[0095] In this embodiment, the method includes the following steps:

[0096] The laser emits a laser beam, and the rotating mirror rotates in a single direction, so that the laser beam passes through the deflection of the rotating mirror, the focusing of the first cylindrical mirror group, and the focusing of the second cylindrical mirror group in sequence, and then processes the processing area of ​​the substrate. The deflection of the rotating mirror is used to adjust the displacement component of the laser spot in the first direction. The first cylindrical mirror group is used to focus the laser beam in the first direction, and the second cylindrical mirror group is used to focus the laser beam in the second direction. The second direction is not collinear with the first direction, and the focusing magnification of the second cylindrical mirror group is greater than that of the first cylindrical mirror group.

[0097] In some feasible implementations, controlling the laser to emit a laser beam and controlling the rotating mirror to rotate in a single direction includes:

[0098] The system controls a laser to emit a laser beam, controls a rotating mirror to rotate in a single direction, and controls a processing position control device to change its operating state. This allows the laser beam to process the substrate's processing area after passing through the rotating mirror and the processing position control device, being focused by the first cylindrical lens group, and then by the second cylindrical lens group. The rotating mirror deflects the laser beam to adjust the displacement component of the laser beam spot in a first direction. The processing position control device changes its operating state to adjust the displacement component of the laser beam spot in a third direction. The first cylindrical lens group focuses the laser beam along the first direction, and the second cylindrical lens group focuses the laser beam along a second direction. The second direction is not collinear with the first direction, and the focusing magnification of the second cylindrical lens group is greater than that of the first cylindrical lens group.

[0099] Understandably, the position of the machining position control device can be set according to the actual situation. For example, if the machining position control device is a galvanometer, it can be set on the incident light path or the outgoing light path of the rotating mirror. If the machining position control device is a displacement platform, it can be set on the outgoing light path of the focusing system. The change of the working state of the machining position control device can be synchronized with the rotation of the rotating mirror, thereby cooperating with the rotating mirror to realize the machining of multiple rows of microstructures.

[0100] In some feasible embodiments, the machining position control device includes at least one of an optical deflection device and a displacement platform; controlling the machining position control device to change its operating state includes at least one of the following:

[0101] The control displacement platform drives the substrate placed on the displacement platform to move in the opposite direction of the third direction;

[0102] The working state is changed along a single direction of the optical deflection device to adjust the displacement component of the light spot in a third direction.

[0103] In some feasible implementations, the method further includes:

[0104] The control displacement platform drives the substrate placed on the displacement platform to move along the first direction.

[0105] It should be understood that although the steps in the flowcharts of the above embodiments are shown sequentially according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowcharts of the above embodiments may include multiple steps or multiple stages. These steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these steps or stages is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the steps or stages in other steps.

[0106] In one exemplary embodiment, such as Figure 3 As shown, a laser processing system is provided. The system includes a controller 312 and the aforementioned laser processing equipment. The laser processing equipment includes a laser 302, a rotating mirror 304, and a focusing system 306. The focusing system 306 includes a first cylindrical mirror group and a second cylindrical mirror group. The controller 312 is used to control the aforementioned laser processing equipment to implement the laser processing method and process the processing area of ​​the substrate 308 placed on the processing platform 310. Specifically, it is used for:

[0107] The laser 302 is controlled to emit a laser beam, and the rotating mirror 304 is controlled to rotate in a single direction, so that the laser beam passes through the deflection of the rotating mirror 304, the focusing of the first cylindrical mirror group, and the focusing of the second cylindrical mirror group in sequence, and then processes the processing area of ​​the substrate 308.

[0108] The deflection of the rotating mirror 304 is used to adjust the displacement component of the light spot in the first direction. The first cylindrical mirror group is used to focus the laser beam along the first direction, and the second cylindrical mirror group is used to focus the laser beam along the second direction. The second direction is not collinear with the first direction, and the focusing magnification of the second cylindrical mirror group is greater than that of the first cylindrical mirror group.

[0109] In one exemplary embodiment, the controller may also implement the steps in the above-described method embodiments.

[0110] In one exemplary embodiment, a computer device is provided, which may be a terminal, and its internal structure diagram may be as follows: Figure 4As shown, the computer device includes a processor, memory, input / output interface, communication interface, display unit, and input device. The processor, memory, and input / output interface are connected via a system bus, and the communication interface, display unit, and input device are also connected to the system bus via the input / output interface. The processor provides computing and control capabilities. The memory includes non-volatile storage media and internal memory. The non-volatile storage media stores the operating system and computer programs. The internal memory provides an environment for the operation of the operating system and computer programs stored in the non-volatile storage media. The input / output interface is used for exchanging information between the processor and external devices. The communication interface is used for wired or wireless communication with external terminals; wireless communication can be achieved through Wi-Fi, mobile cellular networks, Near Field Communication (NFC), or other technologies. When the computer program is executed by the processor, it implements a laser processing method. The display unit is used to form a visually visible image and can be a display screen, projection device, or virtual reality imaging device. The display screen can be an LCD screen or an e-ink screen. The input device of the computer device can be a touch layer covering the display screen, or buttons, trackballs, or touchpads set on the casing of the computer device, or external keyboards, touchpads, or mice, etc.

[0111] Those skilled in the art will understand that Figure 4 The structure shown is merely a block diagram of a portion of the structure related to the present application and does not constitute a limitation on the computer device to which the present application is applied. Specific computer devices may include more or fewer components than those shown in the figure, or combine certain components, or have different component arrangements.

[0112] In one embodiment, a computer device is also provided, including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to implement the steps in the above method embodiments.

[0113] In one embodiment, a computer-readable storage medium is provided having a computer program stored thereon that, when executed by a processor, implements the steps in the above method embodiments.

[0114] In one embodiment, a computer program product is provided, including a computer program that, when executed by a processor, implements the steps in the above method embodiments.

[0115] It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data used for analysis, data stored, data displayed, etc.) involved in this application are all information and data authorized by the user or fully authorized by all parties, and the collection, use and processing of the relevant data must comply with relevant regulations.

[0116] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium, and when executed, it can include the processes of the embodiments of the above methods. Any references to memory, database, or other media used in the embodiments provided in this application can include at least one of non-volatile memory and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM can take many forms, such as Static Random Access Memory (SRAM) or Dynamic Random Access Memory (DRAM). The databases involved in the embodiments provided in this application may include at least one type of relational database and non-relational database. Non-relational databases may include, but are not limited to, blockchain-based distributed databases. The processors involved in the embodiments provided in this application may be general-purpose processors, central processing units, graphics processing units, digital signal processors, programmable logic devices, quantum computing-based data processing logic devices, artificial intelligence (AI) processors, etc., and are not limited to these.

[0117] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this application.

[0118] The above embodiments are merely illustrative of several implementation methods of this application, and their descriptions are relatively specific and detailed. However, they should not be construed as limiting the scope of this application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.

Claims

1. A laser processing device, characterized in that, The laser processing equipment includes a laser, a rotating mirror, and a focusing system. The focusing system includes a first cylindrical lens group and a second cylindrical lens group, wherein: The laser is configured to emit a laser beam; The rotating mirror is disposed in the optical path of the laser beam and is configured to rotate in a single direction to adjust the displacement component of the laser beam spot in the first direction. The first cylindrical mirror group is disposed in the optical path of the laser beam and is used to focus the laser beam along the first direction; The second cylindrical lens group is disposed in the optical path of the laser beam and is used to focus the laser beam along a second direction, which is not collinear with the first direction. The focusing magnification of the second cylindrical lens group is greater than that of the first cylindrical lens group.

2. The device according to claim 1, characterized in that, The laser processing equipment also includes: The processing position control device is configured to change its working state to adjust the displacement component of the light spot in a third direction, which is not collinear with the first direction.

3. The device according to claim 2, characterized in that, The processing position control device includes at least one of an optical deflection device and a displacement platform, wherein: The displacement platform is configured to place the substrate and drive the substrate to move in the opposite direction of the third direction; The optical deflection device is disposed in the optical path of the laser beam and is configured to change its working state in a single direction to adjust the displacement component of the light spot in a third direction.

4. The device according to claim 3, characterized in that, The displacement platform is also configured to: When the processing area of ​​the substrate is larger than the processing area of ​​the rotating mirror, the substrate is moved along the first direction.

5. The device according to any one of claims 1 to 4, characterized in that, The laser is an ultrafast laser.

6. The device according to claim 5, characterized in that, The ratio of the focusing magnification of the second cylindrical lens group to the focusing magnification of the first cylindrical lens group is greater than or equal to 3.

5.

7. A laser processing method, characterized in that, The method is applied to the laser processing equipment as described in any one of claims 1 to 6, and the method includes: The laser is controlled to emit a laser beam, and the rotating mirror is controlled to rotate in a single direction, so that the laser beam passes through the deflection of the rotating mirror, the focusing of the first cylindrical mirror group, and the focusing of the second cylindrical mirror group in sequence, and then processes the processing area of ​​the substrate. Wherein, the deflection of the rotating mirror is used to adjust the displacement component of the light spot in a first direction, the first cylindrical lens group is used to focus the laser beam along the first direction, the second cylindrical lens group is used to focus the laser beam along a second direction, the second direction is not collinear with the first direction, and the focusing magnification of the second cylindrical lens group is greater than that of the first cylindrical lens group.

8. A laser processing system, characterized in that, The system includes a controller and a laser processing apparatus as described in any one of claims 1 to 6, wherein the controller is configured to: The laser is controlled to emit a laser beam, and the rotating mirror is controlled to rotate in a single direction, so that the laser beam passes through the deflection of the rotating mirror, the focusing of the first cylindrical mirror group, and the focusing of the second cylindrical mirror group in sequence, and then processes the processing area of ​​the substrate. Wherein, the deflection of the rotating mirror is used to adjust the displacement component of the light spot in a first direction, the first cylindrical lens group is used to focus the laser beam along the first direction, the second cylindrical lens group is used to focus the laser beam along a second direction, the second direction is not collinear with the first direction, and the focusing magnification of the second cylindrical lens group is greater than that of the first cylindrical lens group.

9. A computer device comprising a memory and a processor, wherein the memory stores a computer program, characterized in that, When the processor executes the computer program, it implements the steps of the method of claim 7.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by the processor, it implements the steps of the method of claim 7.

11. A computer program product, comprising a computer program, characterized in that, When the computer program is executed by the processor, it implements the steps of the method of claim 7.

12. A workpiece, characterized in that, The workpiece is processed using the method described in claim 7.

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